Semiconductor material grinding and polishing equipment and method

Abstract

The invention relates to the technical field of semiconductor material production, in particular to semiconductor material grinding and polishing equipment and method.The semiconductor material grinding and polishing equipment comprises a rack, a top face grinding assembly and a bottom face grinding assembly; the bottom surface grinding assembly comprises a rotating seat, a mounting seat, an electric push rod, lifting seats, a clamping component, a first grinding motor and a bottom surface grinding disc, during use, a plurality of semiconductor materials to be machined are arranged on the inner sides of the lifting seats correspondingly, the semiconductor materials are clamped and fixed through the clamping component, and at the moment, the lifting seats are driven to descend through the electric push rod; then the clamping component and the semiconductor material are driven to descend, the bottom face of the semiconductor material abuts against a bottom face grinding disc, at the moment, the bottom face grinding disc is driven to rotate through a first grinding motor, then the bottom face of the semiconductor material is ground and polished, and meanwhile the top face of the semiconductor material is ground through a top face grinding assembly; therefore, the top surface and the bottom surface of the semiconductor material are ground and polished at the same time.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor material production, and in particular to a semiconductor material grinding and polishing device and method. Background Art

[0002] Semiconductor materials need to be polished during the processing process. Traditional polishing equipment is not convenient for fixing semiconductor materials, resulting in inconvenience in use.

[0003] Prior art CN219787888U discloses a semiconductor grinding and polishing machine, including a workbench, a grinding mechanism for grinding and polishing semiconductor materials, and a clamping mechanism for clamping semiconductor materials of different sizes and preventing the polishing machine parts from colliding with each other. The clamping mechanism is installed on the upper side of the workbench, and the grinding mechanism is arranged on the upper side of the clamping mechanism. Beneficial effect: by providing a plurality of clamping plates, when the semiconductor material is placed on the workbench, the fixed shaft is pulled out, the clamping plate is slid, and the number of clamping plates is adjusted according to the height of the semiconductor material so that the clamping plate is not higher than the semiconductor material, so as to prevent the grinding mechanism from contacting and colliding with the clamping plate during grinding and polishing, the fixed shaft is inserted back into the original position, the clamping plate is fixed through the through hole of the clamping plate, and the clamping plate is clamped by the rotation of the screw to complete the clamping.

[0004] The above device can clamp the semiconductor material, but after polishing one side of the semiconductor material, it needs to be manually removed and the semiconductor material needs to be turned over to polish the other side, which results in low polishing efficiency. Summary of the invention

[0005] The purpose of the present invention is to provide a semiconductor material grinding and polishing device and method to solve the problem.

[0006] To achieve the above-mentioned objectives, the present invention provides a semiconductor material grinding and polishing equipment and method, comprising a frame and a top surface grinding assembly, wherein the top surface grinding assembly is arranged on the frame and also comprises a bottom surface grinding assembly; the bottom surface grinding assembly comprises a rotating seat, a mounting seat, an electric push rod, a lifting seat, a clamping member, a first grinding motor and a bottom surface grinding disk, the rotating seat is rotatably connected to the frame and is located inside the frame, the mounting seat is fixedly connected to the rotating seat and is arranged on the rotating seat, the electric push rod is connected to the mounting seat and is located inside the mounting seat, the lifting seat is arranged on the electric push rod and is connected to the output end of the electric push rod, the clamping member is arranged on the lifting seat, the first grinding motor is connected to the mounting seat and is located inside the mounting seat, and the bottom surface grinding disk is arranged on the first grinding motor and is connected to the output end of the first grinding motor.

[0007] Wherein, the bottom surface grinding assembly also includes a guide rod, which is connected to the mounting seat and to the lifting seat and is arranged on the mounting seat.

[0008] Among them, the guide rod includes a rod body and a sleeve body, the sleeve body is fixedly connected to the mounting seat and is located inside the mounting seat; one end of the rod body is slidably connected to the sleeve body, and the other end of the rod body is connected to the lifting seat, and the rod body is located on a side of the lifting seat close to the mounting seat.

[0009] Wherein, the top surface grinding assembly includes a hydraulic cylinder, a second grinding motor and a top surface grinding disc, the hydraulic cylinder is connected to the frame and is arranged on the frame; the second grinding motor is arranged on the hydraulic cylinder and is connected to the output end of the hydraulic cylinder; the top surface grinding disc is arranged on the second grinding motor and is connected to the output end of the second grinding motor.

[0010] Wherein, the clamping member includes a clamping seat, a driving seat and a rotating component, the driving seat is rotatably connected to the lifting seat and is located inside the lifting seat; the clamping seat is slidably connected to the lifting seat and is slidably connected to the clamping seat and is arranged on the lifting seat; the rotating component is arranged on the lifting seat and drives the clamping seat to rotate.

[0011] Among them, the clamping seat includes a movable shaft, a bracket and a friction plate. The movable shaft is slidably connected to the lifting seat and the driving seat, and passes through the driving seat; the bracket is fixedly connected to the movable shaft and is arranged on the movable shaft; the friction plate is fixedly connected to the bracket and is located on one side of the bracket.

[0012] The present invention also includes a method for grinding and polishing a semiconductor material, comprising the following steps:

[0013] Placing the semiconductor material to be processed inside the lifting seat and clamping and fixing it by the clamping member;

[0014] The electric push rod drives the lifting seat to descend, thereby driving the semiconductor material to descend until it abuts against the bottom grinding disc;

[0015] The bottom grinding disc is driven to rotate by the first grinding motor to grind and polish the bottom surface of the semiconductor material;

[0016] The top surface of the semiconductor material is ground and polished by the top surface grinding assembly.

[0017] The semiconductor material grinding and polishing device and method of the present invention, when in use, a plurality of semiconductor materials to be processed are respectively placed inside a plurality of lifting seats, and the semiconductor materials are clamped and fixed by the clamping member, at this time, the lifting seat is driven down by the electric push rod, and then the clamping member and the semiconductor material are driven down, so that the bottom surface of the semiconductor material abuts against the bottom surface grinding disc, at this time, the bottom surface grinding disc is driven to rotate by the first grinding motor, and then the bottom surface of the semiconductor material is ground and polished, and at the same time, the top surface of the semiconductor material is ground by the top surface grinding assembly, so that the top and bottom surfaces of the semiconductor material are ground and polished at the same time; when a semi-finished product is used, the semiconductor material is ground and polished. After the conductor material is polished, the driving motor drives the rotating seat to rotate, thereby driving each of the mounting seats to rotate, so that the processed semiconductor material is moved away from under the top surface polishing component, and another semiconductor material to be processed is rotated to under the top surface polishing component for processing. At this time, the staff can remove the processed semiconductor material, and the processing of the semiconductor material is not affected while loading and unloading. The semiconductor material grinding and polishing equipment of the present invention can not only grind and polish the top and bottom surfaces of the semiconductor material at the same time, but also is provided with multiple workstations for processing, and the grinding and polishing is not affected while loading and unloading, thereby achieving the purpose of improving processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0019] Figure 1 It is a schematic diagram of the overall structure of the semiconductor material grinding and polishing equipment according to the first embodiment of the present invention.

[0020] Figure 2 It is a schematic diagram of the installation structure of the guide rod according to the first embodiment of the present invention.

[0021] Figure 3 2 is a schematic structural diagram of a clamping member according to a second embodiment of the present invention.

[0022] Figure 4 It is a schematic diagram of the installation structure of the moving shaft of the second embodiment of the present invention.

[0023] Figure 5 4 is a flow chart of a semiconductor material grinding and polishing method according to a third embodiment of the present invention.

[0024] In the figure: 101-frame, 102-top surface grinding assembly, 103-bottom surface grinding assembly, 104-rotating seat, 105-mounting seat, 106-electric push rod, 107-lifting seat, 108-clamping member, 109-first grinding motor, 110-bottom surface grinding disc, 111-guide rod, 112-rod body, 113-sleeve body, 114-hydraulic cylinder, 115-second grinding motor, 116-top surface grinding disc, 117-driving motor, 201-clamping seat, 202-driving seat, 203-rotating component, 204-moving shaft, 205-bracket, 206-friction plate, 207-driving groove, 208-limiting groove, 209-rotating motor, 210-worm wheel, 211-worm. DETAILED DESCRIPTION

[0025] Embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be construed as limiting the present invention.

[0026] First embodiment:

[0027] See also Figure 1 and Figure 2 ,in Figure 1 It is a schematic diagram of the overall structure of the semiconductor material grinding and polishing equipment. Figure 2 It is a schematic diagram of the installation structure of the guide rod.

[0028] The present invention provides a semiconductor material grinding and polishing device and method, comprising a frame 101, a top surface grinding component 102 and a bottom surface grinding component 103, wherein the bottom surface grinding component 103 comprises a rotating seat 104, a mounting seat 105, an electric push rod 106, a lifting seat 107, a clamping member 108, a first grinding motor 109, a bottom surface grinding disc 110 and a guide rod 111, wherein the guide rod 111 comprises a rod body 112 and a sleeve body 113, and the top surface grinding component 102 comprises a hydraulic cylinder 114, a second grinding motor 115 and a top surface grinding disc 116, wherein the semiconductor material to be processed is clamped and fixed by the clamping member 108, and the bottom surface grinding disc 110 is driven to rotate by the first grinding motor 109, thereby grinding and polishing the bottom surface of the semiconductor material to achieve the purpose of improving the processing efficiency. It can be understood that the above scheme can be used to improve the processing efficiency of the semiconductor material, and can also be used to clamp and fix the semiconductor material.

[0029] According to this specific embodiment, the top surface grinding assembly 102 is disposed on the frame 101 , and the top surface of the semiconductor material is ground and polished by the top surface grinding assembly 102 .

[0030] The rotating seat 104 is rotatably connected to the frame 101 and is located inside the frame 101. The mounting seat 105 is fixedly connected to the rotating seat 104 and is arranged on the rotating seat 104. The electric push rod 106 is connected to the mounting seat 105 and is located inside the mounting seat 105. The lifting seat 107 is arranged on the electric push rod 106 and is connected to the output end of the electric push rod 106. The clamping member 108 is arranged on the lifting seat 107. The first grinding motor 109 is connected to the mounting seat 105 and is located inside the mounting seat 105. The bottom grinding disc 110 is arranged on the first grinding motor 109 and connected to the first The output end of a grinding motor 109 is connected; a driving motor 117 is also installed inside the frame 101, and the output end of the driving motor 117 is connected to the rotating seat 104, and the rotating seat 104 is driven to rotate by the driving motor 117. The mounting seat 105, the lifting seat 107, the clamping member 108, the first grinding motor 109 and the bottom grinding disc 110 are each provided with four and are evenly arranged on the rotating seat 104. Two electric push rods 106 are arranged on one mounting seat 105, and the lifting seat 107 is driven to rise and fall by the electric push rod 106. The clamping member 108 can clamp and fix the semiconductor material to be polished When in use, a plurality of semiconductor materials to be processed are placed inside the plurality of lifting seats 107 respectively, and the semiconductor materials are clamped and fixed by the clamping member 108. At this time, the lifting seat 107 is driven to descend by the electric push rod 106, thereby driving the clamping member 108 and the semiconductor material to descend, so that the bottom surface of the semiconductor material abuts against the bottom surface grinding disc 110. At this time, the bottom surface grinding disc 110 is driven to rotate by the first grinding motor 109, thereby grinding and polishing the bottom surface of the semiconductor material. At the same time, the top surface grinding assembly 102 is used to grind the top surface of the semiconductor material, thereby grinding and polishing the top and bottom surfaces of the semiconductor material at the same time. When a semiconductor material After grinding is completed, the driving motor 117 drives the rotating seat 104 to rotate, and then drives each of the mounting seats 105 to rotate, so that the processed semiconductor material is moved away from under the top surface grinding component 102, and another semiconductor material to be processed is rotated to under the top surface grinding component 102 for processing. At this time, the staff can remove the processed semiconductor material, and the processing of the semiconductor material is not affected while loading and unloading. The semiconductor material grinding and polishing equipment of the present invention can not only grind and polish the top and bottom surfaces of the semiconductor material at the same time, but also is provided with multiple workstations for processing, and the grinding and polishing is not affected while loading and unloading, thereby achieving the purpose of improving processing efficiency.

[0031] Secondly, the guide rod 111 is connected to the mounting seat 105 and to the lifting seat 107 , and is disposed on the mounting seat 105 .

[0032] At the same time, the sleeve 113 is fixedly connected to the mounting seat 105 and is located inside the mounting seat 105; one end of the rod body 112 is slidably connected to the sleeve 113, and the other end of the rod body 112 is connected to the lifting seat 107, and the rod body 112 is located on the side of the lifting seat 107 close to the mounting seat 105.

[0033] The sleeve 113 guides the movement of the rod 112 , and further guides the lifting and lowering of the lifting seat 107 , so that the lifting seat 107 can only be lifted vertically, thereby improving the stability of the lifting seat 107 during lifting and lowering.

[0034] In addition, the hydraulic cylinder 114 is connected to the frame 101 and is arranged on the frame 101; the second grinding motor 115 is arranged on the hydraulic cylinder 114 and is connected to the output end of the hydraulic cylinder 114; the top surface grinding disc 116 is arranged on the second grinding motor 115 and is connected to the output end of the second grinding motor 115; the second grinding motor 115 is driven to descend by the hydraulic cylinder 114, and then the top surface grinding disc 116 is driven to descend, so that the top surface grinding disc 116 can abut the top of the semiconductor material, and the top surface grinding disc 116 is driven to rotate by the second grinding motor 115, so as to grind and polish the top surface of the semiconductor material.

[0035] When using the semiconductor material grinding and polishing equipment of this embodiment, the semiconductor material to be ground is placed on the inner side of the lifting seat 107, the semiconductor material is clamped and fixed by the clamping member 108, and the lifting seat 107 is driven to descend by the electric push rod 106, thereby driving the clamping member 108 and the semiconductor material to descend, so that the bottom surface of the semiconductor material abuts against the bottom surface grinding disc 110, and at this time, the bottom surface grinding disc 110 is driven to rotate by the first grinding motor 109, thereby grinding and polishing the bottom surface of the semiconductor material, and at the same time, the top surface of the semiconductor material is polished by the top surface grinding assembly 102; when the grinding is completed, the driving motor 117 drives the rotating seat 104 to rotate, thereby driving the mounting seat 105 and the ground semiconductor material to rotate, so that the next semiconductor material rotates to the bottom of the top surface grinding assembly 102, and the ground semiconductor material is moved away from the bottom of the top surface grinding assembly 102, so that the staff can take it out conveniently, and the grinding of the semiconductor material is not affected while loading and unloading, thereby achieving the purpose of improving the processing efficiency.

[0036] Second embodiment:

[0037] Based on the first embodiment, please refer to Figure 3 and Figure 4 , Figure 3 is a schematic structural diagram of a clamping member according to a second embodiment, Figure 4 It is a schematic diagram of the installation structure of the movable shaft of the second embodiment. The clamping member 108 of this embodiment includes a clamping seat 201, a driving seat 202 and a rotating component 203. The clamping seat 201 includes a movable shaft 204, a bracket 205 and a friction plate 206. The driving seat 202 has a driving groove 207. The lifting seat 107 has a limiting groove 208. The rotating component 203 includes a rotating motor 209, a worm gear 210 and a worm 211.

[0038] According to this specific embodiment, the driving seat 202 is rotatably connected to the lifting seat 107 and is located inside the lifting seat 107; the clamping seat 201 is slidably connected to the lifting seat 107 and is slidably connected to the clamping seat 201 and is arranged on the lifting seat 107; the rotating component 203 is arranged on the lifting seat 107 and drives the clamping seat 201 to rotate.

[0039] Among them, the movable shaft 204 is slidably connected to the lifting seat 107, and is slidably connected to the driving seat 202, and passes through the driving seat 202; the bracket 205 is fixedly connected to the movable shaft 204 and is arranged on the movable shaft 204; the friction plate 206 is fixedly connected to the bracket 205 and is located on one side of the bracket 205.

[0040] Secondly, the driving groove 207 passes through the driving seat 202 and cooperates with the moving shaft 204 ; the lifting seat 107 has a limiting groove 208 , and the limiting groove 208 is arranged on the inner side of the lifting seat 107 and cooperates with the moving shaft 204 .

[0041] The clamping seat 201 is provided with multiple driving grooves 207. When in use, the semiconductor material to be processed is placed between the multiple clamping seats 201, and the driving seat 202 is driven to rotate by the rotating component 203, so that the driving seat 202 drives the driving groove 207 thereon to rotate, thereby driving the moving shaft 204 to move along the limiting groove 208, and the moving shaft 204 drives the bracket 205 and the friction plate 206 to move, so that the friction plate 206 can abut the side of the semiconductor material, thereby achieving the purpose of clamping and fixing the semiconductor material.

[0042] At the same time, the rotating motor 209 is connected to the lifting seat 107 and is located on one side of the lifting seat 107; the worm wheel 210 is fixedly connected to the driving seat 202 and is arranged on the driving seat 202; the worm 211 is rotationally connected to the lifting seat 107, meshes with the worm wheel 210, and is connected to the output end of the rotating motor 209; the rotating motor 209 drives the worm 211 to rotate, and then the worm 211 drives the worm wheel 210 to rotate, and the worm wheel 210 drives the driving seat 202 to rotate, thereby achieving the purpose of driving the driving seat 202 to rotate, and at the same time, the self-locking property between the worm wheel 210 and the worm 211 is used to improve the stability of fixing the semiconductor material.

[0043] Third embodiment:

[0044] A method for grinding and polishing a semiconductor material comprises the following steps:

[0045] S101: placing the semiconductor material to be processed inside the lifting seat 107 and clamping and fixing it by the clamping member 108;

[0046] S102: The lifting seat 107 is driven downward by the electric push rod 106, thereby driving the semiconductor material downward until it contacts the bottom grinding disc 110;

[0047] S103: The bottom grinding disc 110 is driven to rotate by the first grinding motor 109 to grind and polish the bottom surface of the semiconductor material;

[0048] S104: Grinding and polishing the top surface of the semiconductor material by the top surface grinding assembly 102 .

[0049] What is disclosed above is only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A semiconductor material grinding and polishing device, comprising a frame and a top surface grinding assembly, wherein the top surface grinding assembly is arranged on the frame, characterized in that: Also includes bottom surface sanding components; The bottom surface grinding assembly includes a rotating seat, a mounting seat, an electric push rod, a lifting seat, a clamping member, a first grinding motor and a bottom surface grinding disc. The rotating seat is rotatably connected to the frame and is located inside the frame. The mounting seat is fixedly connected to the rotating seat and is arranged on the rotating seat. The electric push rod is connected to the mounting seat and is located inside the mounting seat. The lifting seat is arranged on the electric push rod and is connected to the output end of the electric push rod. The clamping member is arranged on the lifting seat. The first grinding motor is connected to the mounting seat and is located inside the mounting seat. The bottom surface grinding disc is arranged on the first grinding motor and is connected to the output end of the first grinding motor.

2. The semiconductor material grinding and polishing equipment according to claim 1, characterized in that: The bottom surface grinding assembly also includes a guide rod, which is connected to the mounting seat and the lifting seat and is arranged on the mounting seat.

3. The semiconductor material grinding and polishing equipment according to claim 2, characterized in that: The guide rod includes a rod body and a sleeve body, wherein the sleeve body is fixedly connected to the mounting seat and is located inside the mounting seat; one end of the rod body is slidably connected to the sleeve body, and the other end of the rod body is connected to the lifting seat, and the rod body is located on a side of the lifting seat close to the mounting seat.

4. The semiconductor material grinding and polishing equipment according to claim 1, characterized in that: The top surface grinding assembly includes a hydraulic cylinder, a second grinding motor and a top surface grinding disc, the hydraulic cylinder is connected to the frame and is arranged on the frame; the second grinding motor is arranged on the hydraulic cylinder and is connected to the output end of the hydraulic cylinder; the top surface grinding disc is arranged on the second grinding motor and is connected to the output end of the second grinding motor.

5. The semiconductor material grinding and polishing equipment according to claim 1, characterized in that: The clamping member includes a clamping seat, a driving seat and a rotating component. The driving seat is rotatably connected to the lifting seat and is located inside the lifting seat; the clamping seat is slidably connected to the lifting seat and is slidably connected to the clamping seat and is arranged on the lifting seat; the rotating component is arranged on the lifting seat and drives the clamping seat to rotate.

6. The semiconductor material grinding and polishing equipment according to claim 5, characterized in that: The clamping seat includes a moving shaft, a bracket and a friction plate. The moving shaft is slidably connected to the lifting seat and the driving seat, and passes through the driving seat; the bracket is fixedly connected to the moving shaft and is arranged on the moving shaft; the friction plate is fixedly connected to the bracket and is located on one side of the bracket.

7. A method for grinding and polishing a semiconductor material, using the semiconductor material grinding and polishing device according to any one of claims 1 to 6, characterized in that: The following steps are involved: Placing the semiconductor material to be processed inside the lifting seat and clamping and fixing it by the clamping member; The electric push rod drives the lifting seat to descend, thereby driving the semiconductor material to descend until it abuts against the bottom grinding disc; The bottom grinding disc is driven to rotate by the first grinding motor to grind and polish the bottom surface of the semiconductor material; The top surface of the semiconductor material is ground and polished by the top surface grinding assembly.

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