Halogen-free flame-retardant light composite board

Abstract

The halogen-free flame-retardant light composite board comprises a cellulose paper curing sheet, and glass fiber cloth curing sheets are arranged on the two sides of the cellulose paper curing sheet; the cellulose paper cured sheet is prepared by coating cellulose paper with a first coating glue solution and then curing; the glass fiber cloth curing sheet is prepared by coating glass fiber cloth with a second coating glue solution and then curing the glass fiber cloth; the first coating glue solution comprises the following raw materials: a phenolic resin solution, aluminum hydroxide, triphenyl phosphate and hollow microspheres; the second coating glue solution is prepared from the following raw materials: an epoxy resin solution, titanium dioxide, aluminum hydroxide, triphenyl phosphate and hollow microspheres. The flame-retardant grade of the prepared composite board reaches UL94V-0 grade, the density is 1.35-1.45 g / cm < 3 >, and the composite board is flame-retardant and light in weight.

Description

Technical Field

[0001] The invention relates to the technical field of lightweight composite boards, in particular to a halogen-free flame-retardant lightweight composite board. Background Art

[0002] Existing composite boards, such as cellulose paper solidified sheets, are provided with glass fiber cloth solidified sheets on both sides of the cellulose paper solidified sheets, and their density is generally 1.6 g / cm 3 The density is relatively high, and when used for fixing support boards of electronic components, there is a problem of heavy weight. In addition, in order to improve the flame retardancy of composite boards, bromination agents are usually used, which contain halogens and are harmful to human body and environment. Summary of the invention

[0003] The present invention proposes a halogen-free flame-retardant lightweight composite board, the flame retardancy grade of which reaches UL94 V-0 and the density is 1.35-1.45g / cm 3 , flame retardant and lightweight.

[0004] The technical solution of the present invention is achieved as follows: a halogen-free flame-retardant lightweight composite board comprises a cellulose paper cured sheet, and glass fiber cloth cured sheets are arranged on both sides of the cellulose paper cured sheet;

[0005] The cellulose paper cured sheet is prepared by coating the cellulose paper with a first coating glue solution and then curing it;

[0006] The glass fiber cloth cured sheet is prepared by coating the glass fiber cloth with a second coating glue solution and then curing it;

[0007] The first coating glue solution comprises the following raw materials in parts by weight: 35-45 parts of phenolic resin solution, 1-3 parts of aluminum hydroxide, 1-3 parts of triphenyl phosphate and 2-3 parts of hollow microspheres;

[0008] The second coating glue solution comprises the following raw materials in parts by weight: 30-40 parts of epoxy resin solution, 5-15 parts of titanium dioxide, 1-2 parts of aluminum hydroxide, 1-2 parts of triphenyl phosphate and 2-5 parts of hollow microspheres. The hollow microspheres are hollow glass microspheres or other types of hollow microspheres.

[0009] Furthermore, the phenolic resin solution comprises 50-55 wt % of phenolic resin and 45-50 wt % of methanol.

[0010] Furthermore, the epoxy resin solution comprises 70 wt % of epoxy resin and 30 wt % of solvent, and the solvent is acetone or butanone.

[0011] Furthermore, the preparation method of the first coating glue solution is as follows: aluminum hydroxide, triphenyl phosphate and hollow microspheres are vacuum pumped into a phenolic resin solution, and stirred in a closed state at room temperature and pressure for 25-35 minutes.

[0012] Furthermore, the preparation method of the second coating glue solution is as follows: titanium dioxide, aluminum hydroxide, triphenyl phosphate and hollow microspheres are vacuum pumped into the epoxy resin solution, and stirred in a closed state at room temperature and pressure for 25-35 minutes.

[0013] Furthermore, the curing temperature of the cellulose paper cured sheet is 150-190° C. and the curing time is 60-100 seconds.

[0014] Furthermore, the curing temperature of the glass fiber cloth curing sheet is 160-200° C. and the curing time is 60-100 seconds.

[0015] Beneficial effects of the present invention:

[0016] The halogen-free flame-retardant lightweight composite board prepared by the present invention has a flame retardant grade of UL94 V-0 and a density of 1.35-1.45 g / cm 3 , flame retardant and lightweight, can be used as a support plate for fixing electronic components, such as as a keyboard cover or an inner lining plate for an iPad leather case. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] Example 1

[0019] A halogen-free flame-retardant lightweight composite board comprises a cellulose paper cured sheet, and glass fiber cloth cured sheets are arranged on both sides of the cellulose paper cured sheet.

[0020] The cellulose paper is coated with the first coating glue solution and then dried at 160° C. for 80 seconds to obtain a cellulose paper cured sheet;

[0021] The glass fiber cloth is coated with the second coating glue solution, and then dried at 160° C. for 80 seconds to obtain a glass fiber cloth cured sheet;

[0022] The glass fiber cloth solidified sheet, the cellulose paper solidified sheet and the glass fiber cloth solidified sheet are laminated and hot pressed to obtain a halogen-free flame-retardant lightweight composite board;

[0023] The first coating glue solution comprises the following raw materials in parts by weight: 40 parts of phenolic resin solution, 2 parts of aluminum hydroxide, 2 parts of triphenyl phosphate and 3 parts of hollow microspheres; the phenolic resin solution comprises 50 wt% of phenolic resin and 50 wt% of methanol.

[0024] The preparation method of the first coating glue solution is as follows: aluminum hydroxide, triphenyl phosphate and hollow microspheres are vacuum pumped into a phenolic resin solution, and stirred in a closed state at room temperature and pressure for 30 minutes.

[0025] The second coating glue solution comprises the following raw materials in parts by weight: 30 parts of epoxy resin solution, 6 parts of titanium dioxide, 1 part of aluminum hydroxide, 1 part of triphenyl phosphate and 3 parts of hollow microspheres. The epoxy resin solution comprises 70 wt% of epoxy resin and 30 wt% of acetone.

[0026] The preparation method of the second coating glue solution is as follows: titanium dioxide, aluminum hydroxide, triphenyl phosphate and hollow microspheres are vacuum pumped into the epoxy resin solution, and stirred in a closed state at room temperature and pressure for 30 minutes.

[0027] Example 2

[0028] A halogen-free flame-retardant lightweight composite board is prepared by the following method:

[0029] The cellulose paper is coated with the first coating glue solution and then dried at 150° C. for 100 seconds to obtain a cellulose paper cured sheet;

[0030] The glass fiber cloth is coated with the second coating glue solution, and then dried at 190° C. for 60 seconds to obtain a glass fiber cloth cured sheet;

[0031] The glass fiber cloth solidified sheet, the cellulose paper solidified sheet and the glass fiber cloth solidified sheet are laminated and hot pressed to obtain a halogen-free flame-retardant lightweight composite board;

[0032] The first coating glue solution comprises the following raw materials in parts by weight: 35 parts of phenolic resin solution, 1 part of aluminum hydroxide, 1.5 parts of triphenyl phosphate and 2.2 parts of hollow microspheres; the phenolic resin solution comprises 53 wt % of phenolic resin and 47 wt % of methanol.

[0033] The preparation method of the first coating glue solution is as follows: aluminum hydroxide, triphenyl phosphate and hollow microspheres are vacuum pumped into a phenolic resin solution, and stirred in a closed state at room temperature and pressure for 30 minutes.

[0034] The second coating glue solution comprises the following raw materials in parts by weight: 35 parts of epoxy resin solution, 10 parts of titanium dioxide, 1.5 parts of aluminum hydroxide, 1.5 parts of triphenyl phosphate and 4 parts of hollow microspheres. The epoxy resin solution comprises 70 wt% of epoxy resin and 30 wt% of acetone.

[0035] The preparation method of the second coating glue solution is as follows: titanium dioxide, aluminum hydroxide, triphenyl phosphate and hollow microspheres are vacuum pumped into the epoxy resin solution, and stirred in a closed state at room temperature and pressure for 30 minutes.

[0036] Example 3

[0037] A halogen-free flame-retardant lightweight composite board is prepared by the following method:

[0038] The cellulose paper is coated with the first coating glue solution and then dried at 190° C. for 60 seconds to obtain a cellulose paper cured sheet;

[0039] The glass fiber cloth is coated with the second coating glue solution, and then dried at 180°C for 70s to obtain a glass fiber cloth cured sheet;

[0040] The glass fiber cloth solidified sheet, the cellulose paper solidified sheet and the glass fiber cloth solidified sheet are laminated and hot pressed to obtain a halogen-free flame-retardant lightweight composite board;

[0041] The first coating glue solution comprises the following raw materials in parts by weight: 45 parts of phenolic resin solution, 3 parts of aluminum hydroxide, 3 parts of triphenyl phosphate and 3 parts of hollow microspheres; the phenolic resin solution comprises 55 wt% of phenolic resin and 45 wt% of methanol.

[0042] The preparation method of the first coating glue solution is as follows: aluminum hydroxide, triphenyl phosphate and hollow microspheres are vacuum pumped into a phenolic resin solution, and stirred in a closed state at room temperature and pressure for 30 minutes.

[0043] The second coating glue solution comprises the following raw materials in parts by weight: 40 parts of epoxy resin solution, 15 parts of titanium dioxide, 2 parts of aluminum hydroxide, 2 parts of triphenyl phosphate and 5 parts of hollow microspheres. The epoxy resin solution comprises 70 wt% of epoxy resin and 30 wt% of acetone.

[0044] The preparation method of the second coating glue solution is as follows: titanium dioxide, aluminum hydroxide, triphenyl phosphate and hollow microspheres are vacuum pumped into the epoxy resin solution, and stirred in a closed state at room temperature and pressure for 30 minutes.

[0045] Example 4

[0046] A halogen-free flame-retardant lightweight composite board is prepared by the following method:

[0047] The cellulose paper is coated with the first coating glue solution and then dried at 160° C. for 80 seconds to obtain a cellulose paper cured sheet;

[0048] The glass fiber cloth is coated with the second coating glue solution, and then dried at 160° C. for 80 seconds to obtain a glass fiber cloth cured sheet;

[0049] The glass fiber cloth solidified sheet, the cellulose paper solidified sheet and the glass fiber cloth solidified sheet are laminated and hot pressed to obtain a halogen-free flame-retardant lightweight composite board;

[0050] The first coating glue solution comprises the following raw materials in parts by weight: 38 parts of phenolic resin solution, 1.5 parts of aluminum hydroxide, 1.5 parts of triphenyl phosphate and 2 parts of hollow microspheres; the phenolic resin solution comprises 50 wt% of phenolic resin and 50 wt% of methanol.

[0051] The preparation method of the first coating glue solution is as follows: aluminum hydroxide, triphenyl phosphate and hollow microspheres are vacuum pumped into a phenolic resin solution, and stirred in a closed state at room temperature and pressure for 30 minutes.

[0052] The second coating glue solution comprises the following raw materials in parts by weight: 30 parts of epoxy resin solution, 10 parts of titanium dioxide, 1.5 parts of aluminum hydroxide, 2 parts of triphenyl phosphate and 4 parts of hollow microspheres. The epoxy resin solution comprises 70 wt% of epoxy resin and 30 wt% of acetone.

[0053] The preparation method of the second coating glue solution is as follows: titanium dioxide, aluminum hydroxide, triphenyl phosphate and hollow microspheres are vacuum pumped into the epoxy resin solution, and stirred in a closed state at room temperature and pressure for 30 minutes.

[0054] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A halogen-free flame-retardant lightweight composite board, comprising a cellulose paper cured sheet, and glass fiber cloth cured sheets are arranged on both sides of the cellulose paper cured sheet; It is characterized in that The cellulose paper solidified sheet is prepared by coating the cellulose paper with a first coating glue solution and then solidifying it; the glass fiber cloth solidified sheet is prepared by coating the glass fiber cloth with a second coating glue solution and then solidifying it; The first coating glue solution comprises the following raw materials in parts by weight: 35-45 parts of phenolic resin solution, 1-3 parts of aluminum hydroxide, 1-3 parts of triphenyl phosphate and 2-3 parts of hollow microspheres; The second coating glue solution comprises the following raw materials in parts by weight: 30-40 parts of epoxy resin solution, 5-15 parts of titanium dioxide, 1-2 parts of aluminum hydroxide, 1-2 parts of triphenyl phosphate and 2-5 parts of hollow microspheres.

2. A halogen-free flame-retardant lightweight composite board according to claim 1, It is characterized in that The phenolic resin solution comprises 50-55 wt % of phenolic resin and 45-50 wt % of methanol.

3. The halogen-free flame-retardant lightweight composite board according to claim 1, It is characterized in that The epoxy resin solution comprises 70 wt % of epoxy resin and 30 wt % of solvent, and the solvent is acetone or butanone.

4. A halogen-free flame-retardant lightweight composite board according to claim 1 or 2, It is characterized in that The preparation method of the first coating glue solution is as follows: aluminum hydroxide, triphenyl phosphate and hollow microspheres are vacuum pumped into a phenolic resin solution, and stirred in a closed state at room temperature and pressure for 25-35 minutes.

5. A halogen-free flame-retardant lightweight composite board according to claim 1 or 3, It is characterized in that The preparation method of the second coating glue solution is as follows: titanium dioxide, aluminum hydroxide, triphenyl phosphate and hollow microspheres are vacuum pumped into the epoxy resin solution, and stirred in a closed state at room temperature and pressure for 25-35 minutes.

6. The halogen-free flame-retardant lightweight composite board according to claim 1, It is characterized in that The curing temperature of the cellulose paper cured sheet is 150-190°C and the curing time is 60-100s.

7. The halogen-free flame-retardant lightweight composite board according to claim 1, It is characterized in that The curing temperature of the glass fiber cloth curing sheet is 160-200°C and the curing time is 60-100s.