Salt-mist-resistant packaging adhesive film, preparation method thereof and photovoltaic module

Abstract

The invention relates to the technical field of packaging adhesive films, in particular to a salt mist resistant packaging adhesive film, a preparation method thereof and a photovoltaic module. The salt mist-resistant packaging adhesive film comprises a light-transmitting adhesive film layer, a polyamide layer and an acid-resistant layer, the light-transmitting adhesive film layer comprises 92-98 parts of EAA resin, 2-8 parts of amino resin, 0.4-0.8 part of a first initiator, 0.6-1 part of a first acrylate monomer and 0.5-11 parts of a first auxiliary agent; the polyamide layer is mainly formed by reacting amino resin in the light-transmitting adhesive film layer with trimesoyl chloride; the anti-acid layer comprises the following components in parts by weight: 100 parts of EVA resin, 0.4-0.8 part of a second initiator, 0.6-1 part of a second acrylate monomer, 0.1-1 part of metal hydroxide, 0.1-1 part of metal phosphate and 0.5-11 parts of a second auxiliary agent. The salt mist resistant packaging adhesive film has excellent water permeation resistance and corrosion resistance, can improve the PID resistance of a component, and is especially suitable for offshore photovoltaic.

Description

Technical Field

[0001] The invention relates to the technical field of packaging adhesive films, in particular to a salt-fog resistant packaging adhesive film and a preparation method thereof and a photovoltaic module. Background Art

[0002] Offshore photovoltaics is a new type of photovoltaic power generation. The biggest difference from onshore photovoltaics is that offshore photovoltaics do not occupy agricultural land, but only use the existing sea surface to build power stations. Offshore photovoltaics have natural environmental advantages over onshore photovoltaics, such as open water surface, no obstructions, long sunshine, and can fully utilize the reflected light from the water surface, which can significantly increase power generation.

[0003] Although offshore photovoltaics have significant advantages, the marine environment is quite different from the land environment, so conventional land-based photovoltaic modules usually cannot meet the requirements for offshore photovoltaic modules. The main influencing factor of the marine environment is seawater, which is a highly corrosive medium. High salt and oxygen-rich conditions can cause corrosion of the encapsulation film. At the same time, the low-frequency reciprocating stress and impact force generated by waves, tides, and currents can also directly or indirectly accelerate the corrosion process, leading to delamination and blistering of the encapsulation film, and ultimately causing water vapor to enter the photovoltaic module, leading to PID problems in the photovoltaic module.

[0004] In order to improve the weather resistance of the film, there are existing methods such as introducing nano water-blocking fillers or grafting long-chain groups into the film. However, the addition of nanomaterials will lead to a decrease in the light transmittance of the film, and there may be agglomeration problems leading to poor performance; the method of grafting yield groups, due to the low grafting rate at present, the degree of improvement is insufficient.

[0005] In view of this, the present invention is proposed. Summary of the invention

[0006] An object of the present invention is to provide a salt spray resistant packaging adhesive film to solve the technical problems existing in the prior art such as insufficient salt spray corrosion resistance of the packaging adhesive film.

[0007] Another object of the present invention is to provide a method for preparing the salt spray resistant packaging film.

[0008] Another object of the present invention is to provide a photovoltaic module, comprising the above-mentioned salt spray resistant packaging film.

[0009] In order to achieve the above-mentioned object of the present invention, the present invention provides a salt spray resistant encapsulation film on one hand, comprising a light-transmitting film layer, a polyamide layer disposed on the surface of the light-transmitting film layer, and an acid-resistant layer disposed on the surface of the polyamide layer;

[0010] The light-transmitting adhesive film layer comprises the following components by weight: 92-98 parts of EAA resin, 2-8 parts of amino resin, 0.4-0.8 parts of first initiator, 0.6-1 parts of first acrylate monomer and 0.5-11 parts of first auxiliary agent;

[0011] The polyamide layer is mainly formed by the reaction of the amino resin in the light-transmitting adhesive film layer and trimesoyl chloride;

[0012] The acid-resistant layer comprises the following components in parts by weight: 100 parts of EVA resin, 0.4-0.8 parts of a second initiator, 0.6-1 parts of a second acrylate monomer, 0.1-1 parts of a metal hydroxide, 0.1-1 parts of a metal phosphate and 0.5-11 parts of a second auxiliary agent.

[0013] In a specific embodiment of the present invention, the polyamide layer is mainly formed by the reaction of the amino resin, trimesoyl chloride and the amino-containing anti-PID auxiliary agent in the light-transmitting adhesive film layer.

[0014] In a specific embodiment of the present invention, the amino-containing anti-PID auxiliary agent includes N-(3-aminopropyl)-imidazole.

[0015] In a specific embodiment of the present invention, the polyamide layer is formed on the surface of the light-transmitting adhesive film layer by interfacial polymerization.

[0016] In a specific embodiment of the present invention, the polyamide layer is mainly formed by interfacial polymerization of the amino resin in the light-transmitting adhesive film layer with trimesoyl chloride to form polyamide, and then interfacial polymerization with an amino-containing anti-PID additive.

[0017] In a specific embodiment of the present invention, the metal hydroxide includes magnesium hydroxide; the metal phosphate includes at least one of zirconium phosphate, titanium phosphate and zinc phosphate.

[0018] In a specific embodiment of the present invention, the amino content of the amino resin is 1.8 to 5.4 mmol / g.

[0019] In a specific embodiment of the present invention, the first auxiliary agent and the second auxiliary agent each independently include 0.3-0.7 parts of a co-crosslinking agent, 0.1-5 parts of a silane coupling agent, 0.1-5 parts of a silane oligomer, 0.1-0.15 parts of an antioxidant and 0.05-0.09 parts of a light stabilizer.

[0020] In a specific embodiment of the present invention, the thickness of the light-transmitting adhesive film layer is 150-250 μm, the thickness of the polyamide layer is 100-200 nm, the thickness of the acid-resistant layer is 150-250 μm. Furthermore, the thickness of the salt-fog-resistant packaging adhesive film is 300-500 μm.

[0021] Another aspect of the present invention is to provide a method for preparing any one of the above-mentioned salt spray resistant packaging films, comprising the following steps:

[0022] (a) mixing ingredients according to the proportion of the light-transmitting adhesive film layer, and extruding and casting to obtain the light-transmitting adhesive film layer;

[0023] (b) contacting at least one side of the light-transmitting adhesive film layer with a solution containing trimesoyl chloride to perform a first interfacial polymerization;

[0024] (c) preparing ingredients according to the proportion of the acid-resistant layer, extruding and casting to obtain the acid-resistant layer, and coating the layer on the surface of the polyamide layer.

[0025] In a specific embodiment of the present invention, step (b) further comprises: spraying a solution of an amino-containing anti-PID additive on the surface of the light-transmitting adhesive film layer after the interfacial polymerization, and then performing a second interfacial polymerization to form a polyamide layer.

[0026] In a specific embodiment of the present invention, the solution containing trimesoyl chloride is a n-hexane solution of trimesoyl chloride. Further, in the solution containing trimesoyl chloride, the mass fraction of trimesoyl chloride is 0.05% to 0.2%.

[0027] In a specific embodiment of the present invention, the solution of the amino-containing anti-PID additive is an ethanol solution of the amino-containing anti-PID additive. Further, in the solution of the amino-containing anti-PID additive, the mass fraction of the amino-containing anti-PID additive is 1% to 3%.

[0028] In a specific embodiment of the present invention, the first interfacial polymerization comprises: curing at 50-70° C. for 10-30 min; the second interfacial polymerization comprises: curing at 50-70° C. for 10-30 min.

[0029] Another aspect of the present invention provides a photovoltaic module, comprising any one of the above-mentioned salt-fog resistant packaging films.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] (1) The salt spray resistant encapsulation film of the present invention has a positively charged dense polyamide layer disposed on the light-transmitting film layer, and utilizes the Donnan effect to intercept positively charged sodium ions through the polyamide layer, thereby preventing sodium ions from migrating from the glass side to the surface of the battery cell, thereby alleviating the enrichment of sodium ions on the surface of the battery cell; at the same time, the introduction of nanoparticles into the light-transmitting film layer is avoided, thereby ensuring light transmittance; the acid-resistant layer improves the overall water permeability resistance and corrosion resistance of the encapsulation film by introducing hydroxides, metal phosphates, etc.

[0032] (2) The salt spray resistant encapsulation film of the present invention has excellent water penetration resistance and corrosion resistance. When used in photovoltaic modules, it can improve the anti-PID performance of the entire module, and is particularly suitable for offshore photovoltaics. DETAILED DESCRIPTION

[0033] The technical scheme of the present invention will be clearly and completely described below in conjunction with specific embodiments, but it will be appreciated by those skilled in the art that the following described embodiments are part of embodiments of the present invention, rather than all embodiments, and are only used to illustrate the present invention, and should not be considered as limiting the scope of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative work, all belong to the scope of protection of the present invention. If specific conditions are not indicated in the embodiments, they are carried out according to normal conditions or conditions recommended by the manufacturer. If the manufacturer is not indicated in the reagents or instruments used, they are all conventional products that can be purchased commercially.

[0034] In one aspect, the present invention provides a salt-fog resistant encapsulation film, comprising a light-transmitting film layer, a polyamide layer disposed on the surface of the light-transmitting film layer, and an acid-resistant layer disposed on the surface of the polyamide layer;

[0035] The light-transmitting adhesive film layer includes the following components by weight: 92-98 parts of EAA resin, 2-8 parts of amino resin, 0.4-0.8 parts of first initiator, 0.6-1 parts of first acrylate monomer and 0.5-11 parts of first auxiliary agent;

[0036] The polyamide layer is mainly formed by the reaction of the amino resin in the light-transmitting adhesive film layer and trimesoyl chloride;

[0037] The acid-resistant layer comprises the following components in parts by weight: 100 parts of EVA resin, 0.4-0.8 parts of a second initiator, 0.6-1 parts of a second acrylate monomer, 0.1-1 parts of a metal hydroxide, 0.1-1 parts of a metal phosphate and 0.5-11 parts of a second auxiliary agent.

[0038] The salt spray resistant packaging film of the present invention has a positively charged dense polyamide layer arranged on a light-transmitting film layer, and utilizes the Donan effect to intercept positively charged sodium ions through the polyamide layer, thereby preventing the sodium ions from migrating from the glass side to the surface of the battery cell, alleviating the enrichment of sodium ions on the surface of the battery cell, and improving the PID problem; at the same time, the introduction of nanoparticles is avoided in the light-transmitting film layer, thereby ensuring light transmittance and achieving full utilization of light by the component; the acid-resistant layer improves the overall water penetration resistance and corrosion resistance of the packaging film by introducing hydroxides, metal phosphates, etc.

[0039] Amino resin is introduced into the light-transmitting adhesive film layer to provide carriers and reaction raw materials for the polyamide layer. The polyamide layer can be formed on the surface of the light-transmitting adhesive film layer through interfacial polymerization, ensuring the bonding between the two layers. In addition, an appropriate amount of metal hydroxide and metal phosphate are added to the acid-resistant layer, which can further neutralize acetic acid and capture free sodium ions while ensuring the transmittance, thereby improving the weather resistance and anti-PID performance of the film.

[0040] For example, in different embodiments, in the light-transmitting adhesive film layer, the amounts of each component used can be as follows by weight:

[0041] The amount of EAA resin can be 92 parts, 93 parts, 94 parts, 95 parts, 96 parts, 97 parts, 98 parts or a range consisting of any two of them;

[0042] The amount of amino resin can be 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts or a range consisting of any two of them;

[0043] The amount of the first initiator can be 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts or a range consisting of any two of them;

[0044] The amount of the first acrylic ester monomer can be 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts, 1 part or a range consisting of any two of them;

[0045] The dosage of the first auxiliary agent can be 0.5 parts, 1 parts, 2 parts, 5 parts, 8 parts, 10 parts, 11 parts or a range consisting of any two of them.

[0046] For example, in different embodiments, in the acid-resistant layer, by weight, compared to 100 parts of EVA resin, the amounts of the remaining components may be as follows:

[0047] The amount of the second initiator can be 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts or a range consisting of any two of them;

[0048] The amount of the second acrylic acid ester monomer can be 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts, 1 part or a range consisting of any two of them;

[0049] The amount of the metal hydroxide can be 0.1 part, 0.2 part, 0.5 part, 0.8 part, 1 part or a range consisting of any two thereof;

[0050] The amount of the metal phosphate can be 0.1 part, 0.2 part, 0.5 part, 0.8 part, 1 part or a range consisting of any two thereof;

[0051] The dosage of the second auxiliary agent can be 0.5 parts, 1 parts, 2 parts, 5 parts, 8 parts, 10 parts, 11 parts or a range consisting of any two of them.

[0052] In a specific embodiment of the present invention, the polyamide layer is formed on the surface of the light-transmitting adhesive film layer by interfacial polymerization.

[0053] In a specific embodiment of the present invention, the polyamide layer is mainly formed by the reaction of the amino resin, trimesoyl chloride and the amino-containing anti-PID auxiliary agent in the light-transmitting adhesive film layer.

[0054] In a specific embodiment of the present invention, the polyamide layer is mainly formed by interfacial polymerization of the amino resin in the light-transmitting adhesive film layer with trimesoyl chloride to form polyamide, and then interfacial polymerization with an amino-containing anti-PID additive.

[0055] In a specific embodiment of the present invention, the preparation of the polyamide layer includes: contacting at least one side of the transparent adhesive film layer with a solution containing trimesoyl chloride to perform a first interfacial polymerization; spraying a solution of an amino-containing anti-PID additive on the surface of the transparent adhesive film layer after the interfacial polymerization to perform a second interfacial polymerization.

[0056] In a specific embodiment of the present invention, the first interface polymerization comprises: curing at 50-70° C. for 10-30 min; and the second interface polymerization comprises: curing at 50-70° C. for 10-30 min.

[0057] In a specific embodiment of the present invention, the contact time may be 1 to 5 minutes, but is not limited thereto.

[0058] In a specific embodiment of the present invention, the solution containing trimesoyl chloride is a n-hexane solution of trimesoyl chloride. Further, in the solution containing trimesoyl chloride, the mass fraction of trimesoyl chloride is 0.05% to 0.2%.

[0059] For example, in different embodiments, in the solution containing trimesoyl chloride, the mass fraction of trimesoyl chloride can be 0.05%, 0.08%, 0.1%, 0.12%, 0.15%, 0.18%, 0.2% or a range consisting of any two thereof.

[0060] In a specific embodiment of the present invention, the solution of the amino-containing anti-PID additive is an ethanol solution of the amino-containing anti-PID additive. Further, in the solution of the amino-containing anti-PID additive, the mass fraction of the amino-containing anti-PID additive is 1% to 3%.

[0061] For example, in different embodiments, in the solution of the amino-containing anti-PID additive, the mass fraction of the amino-containing anti-PID additive can be 1%, 1.2%, 1.5%, 1.8%, 2%, 2.2%, 2.5%, 2.8%, 3% or a range consisting of any two thereof.

[0062] In a specific embodiment of the present invention, the amino-containing anti-PID auxiliary agent includes N-(3-aminopropyl)-imidazole. N-(3-aminopropyl)-imidazole is easily protonated under acidic conditions, carries a positive charge, and can more efficiently intercept sodium ions.

[0063] In a specific embodiment of the present invention, the metal hydroxide includes magnesium hydroxide; and the metal phosphate includes at least one of zirconium phosphate, titanium phosphate and zinc phosphate.

[0064] Metal hydroxides can neutralize the acetate ions produced in EVA to prevent corrosion of the battery cells; metal phosphates can capture a small amount of free sodium ions in the film.

[0065] In a specific embodiment of the present invention, the amino content of the amino resin is 1.8 to 5.4 mmol / g.

[0066] For example, in different embodiments, the amino content of the amino resin can be 1.8 mmol / g, 2 mmol / g, 2.2 mmol / g, 2.5 mmol / g, 2.8 mmol / g, 3 mmol / g, 3.5 mmol / g, 4 mmol / g, 4.5 mmol / g, 5 mmol / g, 5.4 mmol / g. The use of amino resins with an amino content within the above range can further improve the anti-PID performance of the film.

[0067] In a specific embodiment of the present invention, the first initiator and the second initiator are each independently selected from at least one of disuccinic acid peroxide, tert-butyl peracetate, tert-butyl peroxyisopropyl carbonate, tert-butyl peroxybenzoate and tert-butyl peroxy-2-ethylhexyl carbonate.

[0068] In a specific embodiment of the present invention, the first acrylate monomer and the second acrylate monomer are each independently selected from at least one of polypropylene glycol (1000) EO (3) dimethacrylate, ethoxylated bisphenol A diacrylate, pentaerythritol diacrylate, tri(propoxy)glycerol triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, glycerolated triacrylate, dipentaerythritol diacrylate and dipentaerythritol triacrylate.

[0069] In a specific embodiment of the present invention, the first auxiliary agent and the second auxiliary agent each independently include 0.3-0.7 parts of a co-crosslinking agent, 0.1-5 parts of a silane coupling agent, 0.1-5 parts of a silane oligomer, 0.1-0.15 parts of an antioxidant and 0.05-0.09 parts of a light stabilizer.

[0070] By combining various additives, the weather resistance of the packaging film can be further improved.

[0071] The first auxiliary agent and the second auxiliary agent may each independently include the following amounts of components, calculated by weight:

[0072] The amount of the auxiliary cross-linking agent can be 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts or any two of them;

[0073] The amount of the silane coupling agent can be 0.1 parts, 0.5 parts, 1 parts, 2 parts, 3 parts, 4 parts, 5 parts or a range consisting of any two of them;

[0074] The amount of silane oligomer can be 0.1 parts, 0.5 parts, 1 parts, 2 parts, 3 parts, 4 parts, 5 parts or any two of them;

[0075] The amount of the antioxidant can be 0.1 part, 0.11 part, 0.12 part, 0.13 part, 0.14 part, 0.15 part or a range consisting of any two of them;

[0076] The amount of the light stabilizer can be 0.05 parts, 0.06 parts, 0.07 parts, 0.08 parts, 0.09 parts or a range consisting of any two of them.

[0077] In a specific embodiment of the present invention, the auxiliary cross-linking agent includes at least one of triallyl isocyanurate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, triallyl cyanurate and di(trimethylolpropane) tetraacrylate.

[0078] In a specific embodiment of the present invention, the silane coupling agent includes γ-methacryloxypropyltrimethoxysilane, vinyltriethoxysilane and vinyltrimethoxysilane.

[0079] In a specific embodiment of the present invention, the silane oligomer includes at least one of a methacryloxysilane oligomer, a vinyltriethoxysilane oligomer, a vinyltrimethoxysilane oligomer and an epoxysilane oligomer.

[0080] In a specific embodiment of the present invention, the antioxidant includes at least one of β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate, pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate and tris[2,4-di-tert-butylphenyl]phosphite.

[0081] In a specific embodiment of the present invention, the light stabilizer includes at least one of UV-328, UV-531, UV-1164 and UV-329.

[0082] In a specific embodiment of the present invention, the thickness of the light-transmitting film layer is 150-250 μm, the thickness of the polyamide layer is 100-200 nm, and the thickness of the acid-resistant layer is 150-250 μm. Furthermore, the thickness of the salt-fog-resistant packaging film is 300-500 μm.

[0083] For example, in different embodiments, the thickness of the light-transmitting film layer can be 150μm, 180μm, 190μm, 200μm, 220μm, 240μm, 250μm or a range consisting of any two thereof; the thickness of the polyamide layer can be 100nm, 120nm, 150nm, 180nm, 200nm or a range consisting of any two thereof; the thickness of the acid-resistant layer can be 150μm, 180μm, 200μm, 210μm, 220μm, 240μm, 250μm or a range consisting of any two thereof; the overall thickness of the salt spray-resistant encapsulation film can be 300μm, 320μm, 350μm, 380μm, 400μm, 420μm, 450μm, 480μm, 500μm or a range consisting of any two thereof.

[0084] Another aspect of the present invention is to provide a method for preparing any one of the above-mentioned salt spray resistant packaging films, comprising the following steps:

[0085] (a) mixing ingredients according to the proportion of the light-transmitting adhesive film layer, and extruding and casting to obtain the light-transmitting adhesive film layer;

[0086] (b) contacting at least one side of the light-transmitting adhesive film layer with a solution containing trimesoyl chloride to perform a first interfacial polymerization;

[0087] (c) preparing ingredients according to the proportion of the acid-resistant layer, extruding and casting to obtain the acid-resistant layer, and coating the layer on the surface of the polyamide layer.

[0088] In a specific embodiment of the present invention, step (b) further comprises: spraying a solution of an amino-containing anti-PID additive on the surface of the light-transmitting adhesive film layer that has completed the interfacial polymerization, and then performing a second interfacial polymerization to form a polyamide layer.

[0089] In a specific embodiment of the present invention, the solution containing trimesoyl chloride is a n-hexane solution of trimesoyl chloride. Further, in the solution containing trimesoyl chloride, the mass fraction of trimesoyl chloride is 0.05% to 0.2%.

[0090] In a specific embodiment of the present invention, the solution of the amino-containing anti-PID additive is an ethanol solution of the amino-containing anti-PID additive. Further, in the solution of the amino-containing anti-PID additive, the mass fraction of the amino-containing anti-PID additive is 1% to 3%.

[0091] In a specific embodiment of the present invention, the first interface polymerization comprises: curing at 50-70° C. for 10-30 min; and the second interface polymerization comprises: curing at 50-70° C. for 10-30 min.

[0092] In a specific embodiment of the present invention, the contact time may be 1 to 5 minutes, but is not limited thereto.

[0093] In a specific embodiment of the present invention, the spraying amount of the solution of the amino-containing anti-PID additive is 5 to 10 g / m 2 For example, in different embodiments, the spraying amount of the solution of the amino-containing anti-PID additive can be 5 g / m 2 , 6g / m 2 , 7g / m 2 , 8g / m 2 , 9g / m 2 , 10g / m 2 Or a range consisting of any two of them. In a specific embodiment of the present invention, in step (a), the extrusion casting comprises: the barrel 1-4 zones are 80-90°C, the connector is 75-85°C, and the die 1-3 zones are 85-95°C; in step (c), the extrusion casting comprises: the barrel 1-4 zones are 80-90°C, the connector is 85-95°C, and the die 1-3 zones are 85-95°C, and the coating comprises: the surface of the polyamide layer is attached to the acid-resistant layer, and the two are bonded by rubber roller pressing.

[0094] Another aspect of the present invention provides a photovoltaic module, comprising any one of the above-mentioned salt spray resistant packaging films.

[0095] In a specific embodiment of the present invention, the photovoltaic module comprises an offshore photovoltaic module.

[0096] In a specific embodiment of the present invention, the light-transmitting film layer of the salt-fog resistant encapsulating film is attached to the glass of the photovoltaic module, and the acid-resistant layer of the salt-fog resistant encapsulating film is attached to the cell sheet of the photovoltaic module.

[0097] The anti-salt spray packaging film of the present invention has excellent anti-salt spray performance, no bubble yellowing phenomenon after salt spray aging, and can have excellent bonding strength with the back glass, which can be ≥85N / cm, and the bonding strength with the battery sheet is ≥60N / cm. After DH aging, the photovoltaic module of the present invention has a power attenuation of <3%, and no shadow appears in the EL photo; after PID192 test, the power attenuation of the photovoltaic module is <5%.

[0098] In the following embodiments, the specific information of each resin material may be as follows, but is not limited thereto:

[0099] EAA resin: EA200 (Dow), PG700 (Dow), Escor TM 5100 (ExxonMobil, USA), EA200 is taken as an example below.

[0100] EVA resin: V2825 (Sailboat Chemical), 2825DV (Yangzi Petrochemical), 28025E (LG Chemical of South Korea), the following takes V2825 as an example.

[0101] Example 1

[0102] This embodiment provides a method for preparing a salt spray resistant packaging film, comprising the following steps:

[0103] (1) According to weight, 95 parts of EAA resin, 5 parts of amino resin (582-2A, Sanmu Chemical, amino content of 2.5 mmol / g), 0.6 parts of tert-butyl peroxy-2-ethylhexyl carbonate, 0.9 parts of acrylate monomer (OTA-480, Jiahua Chemical), 0.5 parts of triallyl isocyanurate, 0.4 parts of silane (570), 0.5 parts of silane oligomer (3130t, Kashida), 0.1 parts of antioxidant 1010, and 0.07 parts of light stabilizer UV-328 were weighed, mixed evenly with a high-speed stirrer, and then put into a casting extruder for extrusion and traction. The barrel 1-4 zones were all 85°C, the connector was 80°C, and the die 1-3 zones were all 90°C. The film was then rolled up to obtain a light-transmitting adhesive film layer.

[0104] (2) immersing one side of the light-transmitting adhesive film layer obtained in step (1) in a 0.1% by mass solution of trimesoyl chloride in n-hexane for 3 minutes, then taking it out and drying it naturally, and then curing it in a 60° C. oven for 10 minutes; then evenly spraying a 2% by mass solution of N-(3-aminopropyl)-imidazole in ethanol on the surface of the light-transmitting adhesive film layer on this side, with the liquid spraying amount being about 5 to 10 g / m 2 (e.g. about 8g / m 2 ), and then placed in a 60°C oven for curing for 10 minutes to form a polyamide layer.

[0105] (3) According to weight, 100 parts of EVA resin, 0.6 parts of tert-butyl peroxide-2-ethylhexyl carbonate, 0.7 parts of acrylic acid ester monomer (TA-480, Jiahua Chemical), 0.3 parts of magnesium hydroxide, 0.2 parts of zirconium phosphate, 0.5 parts of triallyl isocyanurate, 0.3 parts of silane (570), 0.5 parts of silane oligomer (3130t, Kashida), 0.1 parts of antioxidant 1010, and 0.07 parts of light stabilizer UV-328 were weighed, mixed in a high-speed mixer for 3-4 hours, put into a casting extruder for extrusion and traction to obtain an acid-resistant layer, and then coated on the surface of the polyamide layer through a rubber roller to obtain a salt spray resistant packaging film; the barrel 1-4 zones were all 85°C, the connector was 90°C, and the die 1-3 zones were all 90°C.

[0106] In the salt-fog resistant packaging film of this embodiment, the thickness of the light-transmitting film layer is 190 μm, the thickness of the polyamide layer is 150 nm, and the thickness of the acid-resistant layer is 210 μm.

[0107] Example 2

[0108] This embodiment refers to the method for preparing the salt spray resistant encapsulation film of Example 1, with the only difference being that in step (1), the amounts of EAA resin and amino resin used are different.

[0109] In this embodiment, the amounts of EAA resin and amino resin used are 92 parts and 8 parts respectively.

[0110] Example 3

[0111] This embodiment refers to the method for preparing the salt spray resistant encapsulation film of Example 1, with the only difference being that in step (1), the amounts of EAA resin and amino resin used are different.

[0112] In this embodiment, the amounts of EAA resin and amino resin used are 98 parts and 2 parts respectively.

[0113] Example 4

[0114] This embodiment refers to the method for preparing the salt spray resistant encapsulating film of Embodiment 1, with the only difference being that in step (1), the type of amino resin is different.

[0115] In this embodiment, the amino resin is LY211-1 (Xuri Fine Chemicals), and its amino content is 1.8 mmol / g.

[0116] Example 5

[0117] This embodiment refers to the method for preparing the salt spray resistant encapsulating film of Embodiment 1, with the only difference being that in step (1), the type of amino resin is different.

[0118] In this embodiment, the amino resin is LY211-4 (Xuri Fine Chemicals), and its amino content is 5.4 mmol / g.

[0119] Example 6

[0120] This embodiment refers to the method for preparing the salt spray resistant encapsulating film of Embodiment 1, with the only difference being that in step (1), the type of amino resin is different.

[0121] In this embodiment, the amino resin is 582 (Sanmu Chemical), and its amino content is 1.2 mmol / g.

[0122] Example 7

[0123] This embodiment refers to the method for preparing the salt spray resistant encapsulating film of Embodiment 1, with the only difference being that in step (1), the type of amino resin is different.

[0124] In this embodiment, the amino resin is 582-2 (Sanmu Chemical Industry), and its amino content is 7.2 mmol / g.

[0125] Example 8

[0126] This embodiment refers to the method for preparing the salt-fog resistant encapsulating film of Embodiment 1, with the only difference being that in step (2), the step of spraying the ethanol solution of N-(3-aminopropyl)-imidazole is not included.

[0127] Comparative Example 1

[0128] Comparative Example 1 refers to the method for preparing the salt spray resistant packaging film of Example 1, except that: step (2) is not included, and the acid-resistant layer prepared in step (3) is directly coated on the surface of the light-transmitting film layer prepared in step (1).

[0129] Comparative Example 2

[0130] Comparative Example 2 refers to the method for preparing the salt spray resistant encapsulation film of Example 1, except that in step (1), the amounts of EAA resin and amino resin used are different.

[0131] In Comparative Example 2, the amounts of EAA resin and amino resin used were 99 parts and 1 part, respectively.

[0132] Comparative Example 3

[0133] Comparative Example 3 refers to the method for preparing the salt spray resistant encapsulation film of Example 1, except that in step (1), the amounts of EAA resin and amino resin used are different.

[0134] In Comparative Example 3, the amounts of EAA resin and amino resin used were 90 parts and 10 parts, respectively.

[0135] Experimental example

[0136] In order to compare and illustrate the performance of the encapsulation films of different embodiments and comparative examples, each encapsulation film was used to prepare a component, and the initial power, adhesion and transmittance of the component, the component power and adhesion after DH2000h, the component power attenuation after PID192h, and the component power, yellowing value and adhesion after 5% NaCl salt spray aging for 1000h were tested according to GB / T 29848-2018. The test results are shown in Tables 1 and 2.

[0137] Among them, the preparation of the components includes: the battery component adopts P-type PERC battery (64 half-cell battery format), adopts double-glass packaging, and the front and back films both use the packaging films of each embodiment and comparative example; the lamination parameters are 140°C, the vacuum time is 6 minutes, the lamination time is 10 minutes, the lamination pressure is -70, -50, -30 KPa, and the pressure holding time is 30 seconds.

[0138] Table 1 Test results of different components

[0139]

[0140]

[0141] Table 2 Test results of different components II

[0142]

[0143] From the above test results, it can be seen that the encapsulation film of the present invention can improve the water resistance and corrosion resistance while ensuring light transmittance. When used in photovoltaic modules, it can improve the anti-PID performance of the entire module, and is particularly suitable for offshore photovoltaics.

[0144] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. Salt spray resistant packaging film, characterized in that: It comprises a light-transmitting adhesive film layer, a polyamide layer arranged on the surface of the light-transmitting adhesive film layer, and an acid-resistant layer arranged on the surface of the polyamide layer; The light-transmitting adhesive film layer comprises the following components by weight: 92-98 parts of EAA resin, 2-8 parts of amino resin, 0.4-0.8 parts of first initiator, 0.6-1 parts of first acrylate monomer and 0.5-11 parts of first auxiliary agent; The polyamide layer is mainly formed by the reaction of the amino resin in the light-transmitting adhesive film layer and trimesoyl chloride; The acid-resistant layer comprises the following components in parts by weight: 100 parts of EVA resin, 0.4-0.8 parts of a second initiator, 0.6-1 parts of a second acrylate monomer, 0.1-1 parts of a metal hydroxide, 0.1-1 parts of a metal phosphate and 0.5-11 parts of a second auxiliary agent.

2. The salt spray resistant packaging film according to claim 1, characterized in that: The polyamide layer is mainly formed by the reaction of the amino resin, trimesoyl chloride and the amino-containing anti-PID additive in the light-transmitting adhesive film layer; Preferably, the amino-containing anti-PID auxiliary agent includes N-(3-aminopropyl)-imidazole.

3. The salt spray resistant packaging film according to claim 1, characterized in that: The polyamide layer is formed on the surface of the light-transmitting adhesive film layer by interfacial polymerization; Preferably, the polyamide layer is mainly formed by interfacial polymerization of the amino resin in the light-transmitting adhesive film layer with trimesoyl chloride to form polyamide, and then interfacial polymerization with an amino-containing anti-PID additive.

4. The salt spray resistant packaging film according to claim 1, characterized in that: The metal hydroxide includes magnesium hydroxide; and the metal phosphate includes at least one of zirconium phosphate, titanium phosphate and zinc phosphate.

5. The salt spray resistant packaging film according to claim 1, characterized in that: The amino resin has an amino content of 1.8 to 5.4 mmol / g.

6. The salt spray resistant packaging film according to claim 1, characterized in that: The first auxiliary agent and the second auxiliary agent each independently include 0.3-0.7 parts of a co-crosslinking agent, 0.1-5 parts of a silane coupling agent, 0.1-5 parts of a silane oligomer, 0.1-0.15 parts of an antioxidant and 0.05-0.09 parts of a light stabilizer.

7. The salt spray resistant packaging film according to claim 1, characterized in that: The thickness of the light-transmitting adhesive film layer is 150-250 μm, the thickness of the polyamide layer is 100-200 nm, and the thickness of the acid-resistant layer is 150-250 μm; Preferably, the thickness of the salt spray resistant packaging film is 300-500 μm.

8. The method for preparing the salt spray resistant packaging film according to any one of claims 1 to 7, characterized in that: The steps include: (a) mixing ingredients according to the proportion of the light-transmitting adhesive film layer, and extruding and casting to obtain the light-transmitting adhesive film layer; (b) contacting at least one side of the light-transmitting adhesive film layer with a solution containing trimesoyl chloride to perform a first interfacial polymerization; (c) preparing ingredients according to the proportion of the acid-resistant layer, extruding and casting to obtain the acid-resistant layer, and coating the surface of the polyamide layer; Preferably, step (b) further comprises: spraying a solution of an amino-containing anti-PID additive on the surface of the light-transmitting adhesive film layer that has completed the interfacial polymerization, and then performing a second interfacial polymerization to form a polyamide layer.

9. The method for preparing the salt spray resistant packaging film according to claim 8, characterized in that: Having at least one of the following characteristics: (1) The solution containing trimesoyl chloride is a n-hexane solution of trimesoyl chloride; (2) In the solution containing trimesoyl chloride, the mass fraction of trimesoyl chloride is 0.05% to 0.2%; (3) The solution of the amino-containing anti-PID additive is an ethanol solution of the amino-containing anti-PID additive; (4) In the solution of the amino-containing anti-PID additive, the mass fraction of the amino-containing anti-PID additive is 1% to 3%; (5) the first interfacial polymerization comprises: curing at 50 to 70° C. for 10 to 30 minutes; (6) The second interfacial polymerization includes: curing at 50-70° C. for 10-30 minutes.

10. A photovoltaic module, characterized in that: The invention comprises the salt-fog resistant packaging adhesive film as claimed in any one of claims 1 to 7 or the salt-fog resistant packaging adhesive film prepared by the preparation method as claimed in any one of claims 8 to 9.

Images