Relay module detection device and method, electronic equipment and vehicle
By designing the drive signal sampling module, adhesion detection module and fault judgment module in the relay module, the problem that the cause of the relay adhesion fault in the prior art is solved, and accurate detection and reliable driving of the relay and the driving circuit are achieved.
Patent Information
- Application Number
- CN202411606351.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-12
- Publication Date
- 2025-02-21
- Estimated Expiration
- 2044-11-12
Smart Images
Figure CN119125867B_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of relay driving and detection, and specifically relates to a detection device for a relay module, a detection method for a relay module based on the detection device for the relay module, and electronic equipment and a vehicle having the detection device for the relay module, and more particularly to a relay drive and a sticking detection circuit thereof, electronic equipment and a vehicle having the relay drive and a sticking detection circuit thereof, and a detection method for a relay module based on the relay drive and a sticking detection circuit thereof. Background Art
[0002] Relays are important switching devices in high-voltage systems. Relay drive and disconnection detection are important indicators to ensure the safe operation of high-voltage systems. High-voltage systems usually refer to high-voltage power systems used in power transmission and distribution, as well as various equipment and applications that require high-voltage power supplies, such as power transmission and trams. In related solutions, the disconnection detection of relays can only detect the adhesion failure of the relay, but it is impossible to determine whether the cause of the relay adhesion failure is a problem with the relay drive circuit or the relay itself.
[0003] The above contents are only used to assist in understanding the technical solution of the present invention and do not constitute an admission that the above contents are prior art. Summary of the invention
[0004] The object of the present invention is to provide a detection device and method for a relay module, an electronic device and a vehicle, so as to solve the problem in related schemes that the disconnection detection of the relay can only detect the adhesion fault of the relay, but cannot determine the location of the adhesion fault of the relay, so as to achieve the effect of accurately detecting the relay and its drive circuit by setting the relay drive circuit and the adhesion detection circuit to determine whether the drive circuit and the relay are faulty and determine the fault location.
[0005] The present invention provides a detection device for a relay module, wherein the relay module comprises: a relay, and a driving module of the relay; the relay has a coil and a contact, the driving module is arranged between an input end of a preset driving signal and the coil of the relay, and the contact of the relay is arranged between a positive pole of a preset power supply and a preset load; the detection device for the relay module comprises: a driving signal sampling module, an adhesion detection module and a fault judgment module; wherein the driving signal sampling module is arranged between an output end of the driving module and the coil of the relay, and is used to obtain a signal outputted from the driving module to the coil of the relay, which is recorded as a driving sampling signal of the driving module; the adhesion detection module is arranged between the contacts of the relay and the positive pole of the load The common end is used to obtain the signal of the common end of the contact of the relay and the load, which is recorded as the adhesion sampling signal of the contact of the relay; the fault judgment module is respectively connected to the drive signal sampling module and the adhesion detection module, and is used to determine whether the relay module is faulty based on a preset drive signal, according to the drive sampling signal of the drive module, and the adhesion sampling signal of the contact of the relay, and in the case of a relay module failure, determine that the fault point of the relay module is the drive module and / or the relay, so as to determine whether the drive module and the contacts of the relay are faulty and determine the fault location, realize the detection of the drive module of the contacts of the relay and the coil of the relay, and at the same time realize reliable driving of the coil of the relay.
[0006] In some embodiments, the driving module includes: a first current limiting resistor module, a first voltage-stabilizing voltage-dividing diode module, a first voltage-dividing resistor module, a second current limiting resistor module, a first transistor module, and a first MOS transistor module; wherein the input end of the preset driving signal is connected to the base of the first transistor module after passing through the first current limiting resistor module; the preset first power supply is connected to the cathode of the first voltage-stabilizing voltage-dividing diode module after passing through the first voltage-dividing resistor module, and the anode of the first voltage-stabilizing voltage-dividing diode module is connected to the collector of the first transistor module; the emitter of the first transistor module is grounded; the cathode of the first voltage-stabilizing voltage-dividing diode module is connected to the gate of the first MOS transistor module after passing through the second current limiting resistor module; the preset first power supply is also connected to the source of the first MOS transistor module; the drain of the first MOS transistor module, as the output end of the driving module, is connected to the first connection end of the coil of the relay, and the second connection end of the coil of the relay is grounded; the driving signal sampling module can perform voltage division sampling from the output end of the driving module to obtain the driving sampling signal.
[0007] In some embodiments, the driving module further includes: a first pull-down resistor module and / or a voltage stabilizing diode module; wherein the first pull-down resistor module is arranged between the input end of the preset driving signal and the ground, and is used to perform pull-down protection on the preset driving signal input from the input end of the preset driving signal; the voltage stabilizing diode module is arranged between the input end of the preset driving signal and the ground, and the cathode of the voltage stabilizing diode module is connected to the input end of the preset driving signal, and is used to perform voltage stabilizing protection on the preset driving signal input from the input end of the preset driving signal.
[0008] In some embodiments, the driving module further includes: at least one of a first voltage stabilizing filter module, a first pull-down discharge module and a freewheeling diode module; wherein the first voltage stabilizing filter module is arranged between the drain of the first MOS tube module and the ground, and is used to perform voltage stabilizing filtering protection on the signal at the output end of the driving module; the first pull-down discharge module is arranged between the drain of the first MOS tube module and the ground, and is used to perform pull-down discharge protection on the signal at the output end of the driving module; the freewheeling diode module is arranged between the drain of the first MOS tube module and the ground, and is used to provide a freewheeling path for the signal of the coil of the relay at the output end of the driving module to protect the signal at the output end of the driving module.
[0009] In some embodiments, the adhesion detection module includes: a second voltage-dividing resistor module, a third voltage-dividing resistor module, a third current-limiting resistor module, a second transistor module, a second voltage-stabilizing voltage-dividing diode module, a fourth voltage-dividing resistor module, a fourth current-limiting resistor module, a second MOS tube module, a fifth current-limiting resistor module, and an optocoupler module; wherein the positive pole of a preset power supply is connected to the first connection end of the contact of the relay; the second connection end of the contact of the relay is connected to the negative pole of a preset power supply via the second voltage-dividing resistor module and the third voltage-dividing resistor module; the common end of the second voltage-dividing resistor module and the third voltage-dividing resistor module is connected to the base of the second transistor module via the third current-limiting resistor module; the preset second power supply is connected to the second voltage-stabilizing voltage-dividing diode via the fourth voltage-dividing resistor module. The cathode of the second MOS tube module is connected to the cathode of the optical coupling module, the anode of the second voltage-stabilizing voltage-dividing diode module is connected to the collector of the second triode module, and the emitter of the second triode module is connected to the negative electrode of the preset power supply; the cathode of the second voltage-stabilizing voltage-dividing diode module is connected to the gate of the second MOS tube module after passing through the fourth current-limiting resistor module; the preset second power supply is also connected to the source of the second MOS tube module, the drain of the second MOS tube module is connected to the anode of the diode side of the optical coupling module after passing through the fifth current-limiting resistor module, and the cathode of the diode side of the optical coupling module is connected to the negative electrode of the preset power supply; the preset third power supply is connected to the collector of the transistor side of the optical coupling module, and the emitter of the transistor side of the optical coupling module, as the output end of the adhesion detection module, can output the adhesion sampling signal.
[0010] In some embodiments, the adhesion detection module further includes: a second voltage stabilizing filter module and / or a second pull-down discharge module; wherein the second voltage stabilizing filter module is arranged between the anode on the diode side of the optocoupler module and the negative electrode of the preset power supply, and is used to perform voltage stabilizing filtering protection on the input signal of the anode on the diode side of the optocoupler module; the second pull-down discharge module is arranged between the anode on the diode side of the optocoupler module and the negative electrode of the preset power supply, and is used to perform pull-down discharge protection on the input signal of the anode on the diode side of the optocoupler module; and / or, the adhesion detection module further includes: a third voltage stabilizing filter module and / or a pull-down module; wherein the third voltage stabilizing filter module is arranged between the emitter on the transistor side of the optocoupler module and the ground, and is used to perform voltage stabilizing filtering protection on the output signal of the emitter on the transistor side of the optocoupler module; the pull-down module is arranged between the emitter on the transistor side of the optocoupler module and the ground, and is used to perform pull-down discharge protection on the output signal of the emitter on the transistor side of the optocoupler module.
[0011] Matching the above device, the present invention further provides an electronic device, including: the detection device of the relay module mentioned above.
[0012] Matching the above-mentioned device, the present invention provides a vehicle on another aspect, comprising: the detection device of the relay module mentioned above, or the electronic device mentioned above.
[0013] Matching the above-mentioned device, on the other hand, the present invention provides a detection method for a relay module of a detection device based on a relay module, wherein the signal output by the drive module to the coil of the relay is obtained through the drive signal sampling module, which is recorded as the drive sampling signal of the drive module; the signal of the common end of the contact of the relay and the load is obtained through the adhesion detection module, which is recorded as the adhesion sampling signal of the contact of the relay; based on a preset drive signal, according to the drive sampling signal of the drive module and the adhesion sampling signal of the contact of the relay, it is determined whether the relay module is faulty, and in the case of a relay module failure, it is determined that the fault point of the relay module is the drive module and / or the relay, so as to determine whether the drive module and the contacts of the relay are faulty and determine the fault location, thereby realizing the detection of the drive module of the contacts of the relay and the coil of the relay, and at the same time, reliable driving of the coil of the relay can be realized.
[0014] In some embodiments, based on a preset driving signal, according to the driving sampling signal of the driving module and the adhesion sampling signal of the contact of the relay, it is determined whether the relay module is faulty, and in the case of a fault of the relay module, it is determined that the fault point of the relay module is the driving module and / or the relay, so as to determine whether the driving module and the contacts of the relay are faulty and determine the fault location, thereby detecting the contacts of the relay and the driving module of the coil of the relay, and at the same time realizing reliable driving of the coil of the relay, including: determining whether the level of the preset driving signal is a preset first level or a preset second level; if it is determined that the level of the preset driving signal is the preset first level, then : If it is determined that the level of the driving sampling signal of the driving module is a preset first level, and the level of the adhesion sampling signal of the contact of the relay is a preset first level, then it is determined that the relay module is fault-free; if it is determined that the level of the driving sampling signal of the driving module is a preset first level, and the level of the adhesion sampling signal of the contact of the relay is a preset second level, then it is determined that the relay module is faulty, and the fault point of the relay module is that the relay is damaged and cannot be closed; if it is determined that the level of the driving sampling signal of the driving module is a preset second level, and the level of the adhesion sampling signal of the contact of the relay is a preset first level, then it is determined that the relay module is faulty, and the fault point of the relay module is The driving module fails and the relay is stuck and cannot be disconnected; if it is determined that the level of the driving sampling signal of the driving module is the preset second level, and the level of the adhesion sampling signal of the contact of the relay is the preset second level, then it is determined that the relay module is faulty, and the fault point of the relay module is the driving module failure; if it is determined that the level of the preset driving signal is the preset second level, then: if it is determined that the level of the driving sampling signal of the driving module is the preset second level, and the level of the adhesion sampling signal of the contact of the relay is the preset second level, then it is determined that the relay module is not faulty; if it is determined that the level of the driving sampling signal of the driving module is the preset second level, and the adhesion sampling signal of the contact of the relay is the preset second level If the level of the sampling signal of the driving module is the preset first level, it is determined that the relay module is faulty, and the fault point of the relay module is that the relay is stuck and cannot be disconnected; if it is determined that the level of the driving sampling signal of the driving module is the preset first level, and the level of the adhesion sampling signal of the contact of the relay is the preset second level, it is determined that the relay module is faulty, and the fault point of the relay module is that the driving module is faulty and the relay is damaged and cannot be closed; if it is determined that the level of the driving sampling signal of the driving module is the preset first level, and the level of the adhesion sampling signal of the contact of the relay is the preset first level, it is determined that the relay module is faulty, and the fault point of the relay module is that the driving module is faulty.
[0015] Therefore, the scheme of the present invention is to set a driving circuit and a sticking detection circuit for a relay arranged between a high-voltage power supply and a load in a high-voltage system, wherein the driving circuit mainly includes a voltage-stabilizing diode, a triode and a MOS tube, and the sticking detection circuit mainly includes a voltage-dividing resistor, a voltage-stabilizing diode, a triode and a MOS tube. Based on the level of the driving signal sent by the MCU, according to the level of the driving sampling signal obtained from the output end of the self-driving circuit and the level of the sticking detection signal obtained from the output end of the self-sticking detection circuit, it is judged whether the driving circuit and the relay are faulty and the fault location is determined; thus, by setting the driving circuit and the sticking detection circuit of the relay, it is determined whether the driving circuit and the relay are faulty and the fault location is determined, thereby realizing accurate detection of the relay and its driving circuit, and at the same time, reliable driving of the relay can be realized.
[0016] Other features and advantages of the present invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the present invention.
[0017] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a structural schematic diagram of an embodiment of a detection device for a relay module of the present invention;
[0019] Figure 2 It is the structural block diagram of the relay drive and its adhesion detection circuit;
[0020] Figure 3 It is a structural schematic diagram of the relay drive and its adhesion detection circuit;
[0021] Figure 4 A schematic flow chart of an embodiment of a detection method for a relay module of the present invention;
[0022] Figure 5 The present invention is a flow chart of an embodiment of determining whether the relay module is faulty and the fault point when the relay module is faulty. DETAILED DESCRIPTION
[0023] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.
[0024] Considering that the disconnection detection of the relay in the related scheme can only detect the adhesion fault of the relay, but cannot determine the location of the adhesion fault of the relay, it is not conducive to the rapid processing of the adhesion fault of the relay, and affects the normal operation of the high-voltage system where the relay is located. In addition, the driving capability of the driving circuit of the relay in the related scheme is limited. For example, in the power supply (such as Figure 3 When the voltage of the power supply VCC1 in the example shown is too low, the switch tube in the driving circuit of the relay cannot be turned on and there is a risk of serious heat generation and burning, which makes it impossible to reliably drive the relay and affects the safety of the relay.
[0025] Therefore, the scheme of the present invention proposes a detection device for a relay module, specifically a relay drive and its adhesion detection circuit, which can not only determine the adhesion fault of the relay, but also determine the specific fault type of the relay adhesion fault. At the same time, it also has a good protection effect on the relay drive circuit, and can make the switch tube in the relay drive circuit fully turned on, thereby ensuring the driving ability of the relay drive circuit.
[0026] According to an embodiment of the present invention, a detection device for a relay module is provided. Figure 1 The schematic diagram of the structure of an embodiment of the device of the present invention is shown. The relay module comprises: a relay, and a driving module of the relay; the relay has a coil and a contact, the driving module is arranged between the input end of the preset driving signal and the coil of the relay, the contact of the relay is arranged between the positive pole of the preset power supply and the preset load, and the load is also connected to the negative pole of the preset power supply; the detection device of the relay module comprises: a driving signal sampling module, an adhesion detection module and a fault judgment module.
[0027] The driving signal sampling module is arranged between the output end of the driving module and the coil of the relay, and is used to obtain the signal output from the driving module to the coil of the relay, which is recorded as the driving sampling signal of the driving module.
[0028] The adhesion detection module is arranged at the common end of the contact of the relay and the load, and is used to obtain the signal of the common end of the contact of the relay and the load, which is recorded as the adhesion sampling signal of the contact of the relay.
[0029] The fault judgment module is respectively connected to the drive signal sampling module and the adhesion detection module, and is used to determine whether the relay module is faulty based on a preset drive signal, according to the drive sampling signal of the drive module, and the adhesion sampling signal of the contact of the relay, and to determine that the fault point of the relay module is the drive module and / or the relay when the relay module fails, so as to determine whether the drive module and the contacts of the relay are faulty and determine the fault location, thereby realizing the detection of the drive module of the contacts of the relay and the coil of the relay, and at the same time realizing reliable driving of the coil of the relay.
[0030] Figure 2 Figure 1 is a structural block diagram of the relay drive and its adhesion detection circuit. Figure 2 As shown, the relay drive and its adhesion detection circuit mainly include seven parts, namely, microcontroller unit (MCU), drive circuit, drive sampling circuit, adhesion detection circuit, relay, load, and high-voltage power supply. The drive circuit is used to drive the relay to close, that is, to energize the coil of the relay. The drive sampling circuit is used to determine whether there is a fault in the drive circuit and whether the device is damaged. The adhesion detection fault is used to determine whether the relay itself has a adhesion fault problem that it cannot be closed. Among them, the output end of the MCU is connected to the input end of the drive circuit; the output end of the drive circuit is connected to the coil of the relay; the positive pole of the high-voltage power supply is connected to the first connection end of the contact of the relay, and the second connection end of the contact of the relay is connected to the first connection end of the load. The second connection end of the load is connected to the negative pole of the high-voltage power supply. The output end of the drive circuit is connected to the first input end of the MCU after the drive sampling circuit. The load is also connected to the second input end of the MCU after the adhesion detection circuit. The high-voltage power supply refers to the voltage of 336V or 540V on the high-voltage battery of a vehicle (such as a new energy vehicle).
[0031] In the scheme of the present invention, three parts are provided, namely, a driving circuit, a driving sampling circuit and a sticking detection circuit of a relay. The driving circuit is used to generate a coil driving signal to drive the relay to work under the action of a driving signal output by an MCU. The driving sampling circuit is used to sample the coil driving signal output by the driving circuit and then feed it back to the MCU as a driving sampling signal. The sticking detection circuit is used to detect whether the contacts of the relay are stuck from the load side and then feed it back to the MCU as a sticking sampling signal. The MCU determines whether a sticking fault occurs in the relay and the fault type of the sticking fault of the relay. Not only the sticking fault of the relay can be determined, but also the specific fault type of the sticking fault of the relay can be determined. The source of the problem can be determined accurately and quickly, and the faulty device can be found quickly for easy maintenance. At the same time, it also has a good protective effect on the driving circuit of the relay, and can make the switch tube in the driving circuit of the relay fully turned on, thereby ensuring the driving capability of the driving circuit of the relay and protecting the safety of the driving device.
[0032] The scheme of the present invention proposes a relay drive and a sticking detection circuit thereof, which can determine the sticking fault of the relay and can also determine the specific fault type of the sticking fault of the relay. In this way, the fault type of the sticking fault of the relay can be clearly identified, which is convenient for accurate and rapid maintenance and helps to reduce the workload of after-sales maintenance.
[0033] In some embodiments, the driving module includes: a first current limiting resistor module (such as resistor R2), a first voltage-regulating diode module (such as voltage-regulating diode D2), a first voltage-regulating resistor module (such as resistor R3), a second current limiting resistor module (such as resistor R4), a first transistor module (such as transistor U1), and a first MOS transistor module (such as MOS transistor U2).
[0034] Wherein, the input end of the preset driving signal is connected to the base of the first triode module after passing through the first current limiting resistor module; the preset first power supply is connected to the cathode of the first voltage-stabilizing voltage-dividing diode module after passing through the first voltage-dividing resistor module, and the anode of the first voltage-stabilizing voltage-dividing diode module is connected to the collector of the first triode module; the emitter of the first triode module is grounded. The cathode of the first voltage-stabilizing voltage-dividing diode module is connected to the gate of the first MOS tube module after passing through the second current limiting resistor module; the preset first power supply is also connected to the source of the first MOS tube module; the drain of the first MOS tube module, as the output end of the driving module, is connected to the first connection end of the coil of the relay, and the second connection end of the coil of the relay is grounded; wherein, the preset first power supply is such as the power supply VCC1. The driving signal sampling module can perform voltage-dividing sampling from the output end of the driving module to obtain the driving sampling signal.
[0035] Figure 3 Figure 1 is a schematic diagram of the relay drive and its adhesion detection circuit. Figure 3 In the example shown, resistor R3 is a voltage-dividing resistor, and resistor R4 is a current-limiting resistor. The driving signal output by the MCU turns on transistor U1 after passing through the bias resistor (i.e., resistor R2), transistor U1 is turned on, voltage-stabilizing diode D2 is broken down, MOS tube U2 is turned on, the coil of relay K1 is energized and turned on, and the contacts of relay K1 are closed (i.e., the first connection end and the second connection end of the contacts of relay K1 are closed). The breakdown voltage of the Zener diode D2 must be greater than the maximum turn-on voltage of the gate (G) of the MOS tube U2 (i.e., the gate threshold voltage Vgsth of the MOS tube U2), and the Vgs voltage of the MOS tube U2 (i.e., the voltage between the gate and the source of the MOS tube U2) is equal to the breakdown voltage of the Zener diode D2. Because the breakdown voltage of the Zener diode D2 is greater than the Vgson full conduction voltage of the MOS tube U2, the MOS tube U2 is fully turned on, so that the MOS tube U2 can be ensured to work in the saturation region, and the Uds voltage of the MOS tube U2 (i.e., the voltage between the drain and the source of the MOS tube U2) is only 0.2V, and the heat generated by the MOS tube U2 is small, so that the MOS tube U2 will not be damaged due to the excessive Uds voltage of the MOS tube U2 working in the linear region, causing the MOS tube U2 to heat up seriously.
[0036] When the voltage of the power supply VCC1 is lower than the breakdown voltage of the voltage stabilizing diode D2, the MOS tube U2 cannot be turned on, and the MOS tube U2 only has two states: cut-off and fully turned on. If the scheme of the driving circuit of the relay in the related scheme is adopted, that is, the voltage stabilizing diode D2 is replaced with a resistor R, when the voltage of the power supply VCC1 is too low, through the voltage division of the resistor R, the voltage Ugs of the MOS tube U2 will be lower than the fully turned-on voltage of the MOS tube U2, so that the MOS tube U2 works in the linear region, and the Uds voltage of the MOS tube U2 may reach more than 1V, thereby causing the MOS tube U2 to heat up severely and burn out. Therefore, the voltage stabilizing diode D2 is provided in the scheme of the present invention, which can effectively ensure the safety of the driving circuit of the relay.
[0037] like Figure 2 As shown, in the scheme of the present invention, three parts are provided, namely, a relay driving circuit, a driving sampling circuit and a sticking detection circuit. Not only can the sticking fault of the relay be determined, but also the specific fault type of the sticking fault of the relay can be determined, the source of the problem can be determined accurately and quickly, and the faulty device can be found quickly, which is convenient for maintenance. At the same time, it also has a good protective effect on the driving circuit of the relay, and can make the switch tube in the driving circuit of the relay fully turned on, thereby ensuring the driving ability of the driving circuit of the relay and protecting the safety of the driving device.
[0038] The scheme of the present invention proposes a relay drive and its adhesion detection circuit, which can not only determine the adhesion fault of the relay, but also determine the specific fault type of the relay adhesion fault. In this way, the fault type of the relay adhesion fault can be clearly identified, which is convenient for accurate and rapid maintenance, and is beneficial to reducing the workload of after-sales maintenance; at the same time, it also has a good protective effect on the relay drive circuit, avoiding the relay drive circuit from overheating in the linear area and burning the switch tube in the relay drive circuit, and can make the switch tube in the relay drive circuit fully conductive, thereby ensuring the driving ability of the relay drive circuit.
[0039] In some implementations, the driving module further includes: a first pull-down resistor module and / or a Zener diode module, the first pull-down resistor module is such as the resistor R1, and the Zener diode module is such as the Zener diode D1.
[0040] The first pull-down resistor module is arranged between the input end of the preset driving signal and the ground, and is used for performing pull-down protection on the preset driving signal input from the input end of the preset driving signal.
[0041] The voltage stabilizing diode module is arranged between the input end of the preset driving signal and the ground, and the cathode of the voltage stabilizing diode module is connected to the input end of the preset driving signal, and is used to perform voltage stabilizing protection on the preset driving signal input from the input end of the preset driving signal.
[0042] exist Figure 3 In the example shown, the resistor R1 is a pull-down resistor, and the voltage-stabilizing diode D1 is used to prevent the driving signal fluctuation output by the MCU from causing excessive voltage and damaging the transistor U1, thereby protecting the driving circuit of the relay K1.
[0043] In some embodiments, the driving module further includes: at least one of a first voltage stabilizing and filtering module, a first pull-down discharge module and a freewheeling diode module, the first voltage stabilizing and filtering module such as capacitor C1, the first pull-down discharge module such as resistor R6, and the freewheeling diode module such as diode D3.
[0044] The first voltage stabilizing and filtering module is arranged between the drain of the first MOS tube module and the ground, and is used for performing voltage stabilizing and filtering protection on the signal at the output end of the driving module.
[0045] The first pull-down discharge module is arranged between the drain of the first MOS tube module and the ground, and is used for performing pull-down discharge protection on the signal at the output end of the driving module.
[0046] The freewheeling diode module is arranged between the drain of the first MOS tube module and the ground, and is used to provide a freewheeling path for the signal of the coil of the relay at the output end of the driving module, so as to protect the signal at the output end of the driving module.
[0047] exist Figure 3 In the example shown, capacitor C1 is used for voltage stabilization and filtering, resistor R6 is used for pull-down and discharge, and diode D3 is a freewheeling diode to protect the drive circuit of relay K1.
[0048] Specifically, Figure 3 As shown, the driving circuit of the relay includes: resistor R1, resistor R2, resistor R3, resistor R4, resistor R6, voltage regulator diode D1, voltage regulator diode D2, diode D3, capacitor C1, transistor U1, and MOS tube U2. Resistor R1 and voltage regulator diode D1 are located between the connection end of the driving signal output by the MCU and resistor R2, wherein the connection end of the driving signal output by the MCU is grounded after passing through resistor R1; the connection end of the driving signal output by the MCU is connected to the cathode of the voltage regulator diode D1, and the anode of the voltage regulator diode D1 is grounded; the connection end of the driving signal output by the MCU is also connected to the base of the transistor U1 after passing through resistor R2. The power supply VCC1 is connected to the cathode of the voltage regulator diode D2 after passing through resistor R3; the anode of the voltage regulator diode D2 is connected to the collector of the transistor U1, and the emitter of the transistor U1 is grounded. The resistor R4 is connected between the gate of the MOS tube U2 and the cathode of the voltage stabilizing diode D2, the power supply VCC1 is connected to the source (S) of the MOS tube U2, and the drain (D) of the MOS tube U2 is connected to the first connection end of the coil of the relay K1. The capacitor C1, the resistor R6 and the diode D3 are located between the MOS tube U2 and the coil of the relay K1, the capacitor C1, the resistor R6 and the diode D3 are connected in parallel between the first connection end of the coil of the relay K1 and the ground, and the cathode of the diode D3 is connected to the first connection end of the coil of the relay K1.
[0049] The relay driving and sticking detection circuit proposed in the solution of the present invention can effectively protect the switch tube (such as MOS tube U2) in the relay driving circuit from working in the saturation region, such as preventing the switch tube (such as MOS tube U2) in the relay driving circuit from working in the linear region, making the switch tube (such as MOS tube U2) fully turned on, and preventing the relay driving circuit from overheating in the linear region and burning the switch tube (such as MOS tube U2) in the relay driving circuit.
[0050] In some embodiments, the adhesion detection module includes: a second voltage-dividing resistor module (such as resistor R8, resistor R9 and resistor R10), a third voltage-dividing resistor module (such as resistor R11), a third current-limiting resistor module (such as resistor R12), a second transistor module (such as transistor U3), a second voltage-stabilizing diode module (such as voltage-stabilizing diode D4), a fourth voltage-dividing resistor module (such as resistor R13), a fourth current-limiting resistor module (such as resistor R14), a second MOS tube module (such as MOS tube U4), a fifth current-limiting resistor module (such as resistor R15), and an optocoupler module (such as optocoupler U5).
[0051] Among them, the positive pole of the preset power supply is connected to the first connection end of the contact of the relay; the second connection end of the contact of the relay is connected to the negative pole of the preset power supply via the second voltage-dividing resistor module and the third voltage-dividing resistor module; the common end of the second voltage-dividing resistor module and the third voltage-dividing resistor module is connected to the base of the second transistor module via the third current-limiting resistor module; wherein the preset power supply is such as a high-voltage power supply, the positive pole of the preset power supply is such as DC+ of the high-voltage power supply, and the negative pole of the preset power supply is such as DC- of the high-voltage power supply.
[0052] The preset second power supply is connected to the cathode of the second voltage-stabilizing voltage-dividing diode module after passing through the fourth voltage-dividing resistor module, the anode of the second voltage-stabilizing voltage-dividing diode module is connected to the collector of the second transistor module, and the emitter of the second transistor module is connected to the negative electrode of the preset power supply; wherein the preset second power supply is such as the power supply VCC2.
[0053] The cathode of the second voltage-stabilizing voltage-divider module is connected to the gate of the second MOS tube module after passing through the fourth current-limiting resistor module; the preset second power supply is also connected to the source of the second MOS tube module, the drain of the second MOS tube module is connected to the anode of the diode side of the optocoupler module after passing through the fifth current-limiting resistor module, and the cathode of the diode side of the optocoupler module is connected to the negative electrode of the preset power supply; the preset third power supply is connected to the collector of the transistor side of the optocoupler module, and the emitter of the transistor side of the optocoupler module, as the output end of the adhesion detection module, can output the adhesion sampling signal.
[0054] exist Figure 3In the example shown, the adhesion detection circuit: when the relay K1 is turned on (i.e., the contacts of the relay K1 are closed), the resistor R8, the resistor R9, the resistor R10, and the resistor R11 are used for resistor voltage division, and then the transistor U3 is turned on through the current limiting resistor (i.e., the resistor R12). When the transistor U3 is turned on, the voltage-stabilizing diode D4 is broken down, and the MOS tube U4 is turned on. Because the adhesion detection circuit also uses the voltage-stabilizing diode D4 for voltage division, the protection and opening principle of the adhesion detection circuit is similar to the driving circuit of the relay K1. After the MOS tube U4 is turned on, the light-emitting diode on the diode side of the optocoupler U5 is turned on, and the photoelectric effect of the light-emitting diode turns on the transistor on the transistor side of the optocoupler U5, and then sends out an adhesion detection signal, such as a high level, to prove that the optocoupler U5 has been turned on. Among them, the voltage division is carried out by connecting the resistor R8, the resistor R9, the resistor R10, and the resistor R11 in series, and the voltage division ratio is better controlled; of course, two resistors can also be used in series for voltage division.
[0055] In the scheme of the present invention, a drive circuit, a drive sampling circuit and a adhesion detection circuit are set, which can effectively determine the specific type of the adhesion failure of the relay. Specifically, it can be determined whether the cause of the adhesion failure of the relay is a low-voltage drive problem or a high-voltage adhesion problem. For example, through two detection signals (i.e., the drive sampling signal and the adhesion sampling signal), it can be determined whether the cause of the adhesion failure of the relay is a problem with the drive circuit of the relay or a problem with the relay itself, without the need for after-sales personnel to make a secondary judgment on the fault point.
[0056] In some embodiments, the adhesion detection module further includes: a second voltage stabilizing and filtering module and / or a second pull-down discharge module, the second voltage stabilizing and filtering module is such as a capacitor C2, and the second pull-down discharge module is such as a resistor R16.
[0057] Among them, the second voltage stabilizing and filtering module is arranged between the anode on the diode side of the optocoupler module and the negative electrode of the preset power supply, and is used to perform voltage stabilizing and filtering protection on the input signal of the anode on the diode side of the optocoupler module.
[0058] The second pull-down discharge module is arranged between the anode on the diode side of the optical coupling module and the negative electrode of the preset power supply, and is used for performing pull-down discharge protection on the input signal of the anode on the diode side of the optical coupling module;
[0059] exist Figure 3 In the example shown, capacitor C2 is used for voltage stabilization and filtering, and resistor R16 is used for pull-down and discharge to protect the adhesion detection circuit.
[0060] In some embodiments, the adhesion detection module further includes: a third voltage stabilizing and filtering module and / or a pull-down module, the third voltage stabilizing and filtering module is such as a capacitor C3, and the pull-down module is such as a resistor R17.
[0061] The third voltage stabilizing and filtering module is arranged between the emitter on the transistor side of the optocoupler module and the ground, and is used to perform voltage stabilizing and filtering protection on the output signal of the emitter on the transistor side of the optocoupler module.
[0062] The pull-down module is arranged between the emitter on the transistor side of the optocoupler module and the ground, and is used to perform pull-down discharge protection on the output signal of the emitter on the transistor side of the optocoupler module.
[0063] exist Figure 3 In the example shown, capacitor C3 is used for voltage stabilization and filtering, and resistor R17 is used for pull-down and discharge to protect the adhesion detection circuit.
[0064] Specifically, in Figure 3 In the example shown, R represents resistance, C represents capacitance, D represents diode, K1 represents relay, U1 and U3 represent transistors, U2 and U4 represent MOS tubes (i.e. metal-oxide semiconductor field effect transistors), U5 represents optocoupler, and VCC (such as VCC1, VCC2 and VCC3) represents power supply voltage. Figure 3 As shown, the adhesion detection circuit includes: resistor R8, resistor R9, resistor R10, resistor R11, resistor R12, resistor R13, resistor R14, resistor R15, resistor R16, resistor R17, voltage stabilizing diode D3, transistor U3, MOS tube U4, capacitor C2, capacitor C3, and optocoupler U3. The positive electrode DC+ of the high-voltage power supply is connected to the first connection end of the contact of the relay K1, and the load is connected between the second connection end of the contact of the relay K1 and the negative electrode DC- of the high-voltage power supply; the second connection end of the contact of the relay K1 is connected to the negative electrode DC- of the high-voltage power supply through the resistor R8, resistor R9, resistor R10 and resistor R11. The common end of resistor R10 and resistor R11 is connected to the base of transistor U3 through resistor R12; power supply VCC2 is connected to the cathode of voltage zener diode D4 through resistor R13, the anode of voltage zener diode D4 is connected to the collector of transistor U3, and the emitter of transistor U3 is connected to the negative electrode DC- of the high-voltage power supply; resistor R14 is connected between the gate of MOS tube U4 and the cathode of voltage zener diode D4, power supply VCC2 is connected to the source of MOS tube U4, the drain of MOS tube U4 is connected to the anode of the diode side of optocoupler U5 through resistor R15, capacitor C2 and resistor R16 are located between resistor R15 and optocoupler U5, and capacitor C2 and resistor R16 are connected in parallel between the anode of the diode side of optocoupler U5 and the negative electrode DC- of the high-voltage power supply. The cathode of the diode side of optocoupler U5 is connected to the negative electrode DC- of the high-voltage power supply. The power source VCC3 is connected to the collector of the transistor side of the optocoupler U5, and the emitter of the transistor side of the optocoupler U5 is grounded via a resistor R17 and a capacitor C3 connected in parallel.
[0065] like Figure 3 As shown, the drive sampling circuit is composed of resistors (such as resistors R5 and R7) for voltage division, and the adhesion detection circuit is mainly composed of resistors for voltage division (such as resistors R8, R9, R10, and R11 for voltage division) and optocouplers (such as optocouplers U5) for isolation. The drive sampling circuit includes: resistors R5 and R7. Resistors R7 and R5 are connected in series between the first connection end of the coil of relay K1 and the ground, wherein the first connection end of the coil of relay K1 is connected to the common end between the anode of the voltage stabilizing diode D1 and the emitter of the transistor U1 after passing through resistors R7 and R5. In the adhesion detection circuit, an adhesion sampling signal can be obtained from the emitter on the transistor side of the optocoupler U5 and the common end of the resistor R17. The MCU determines whether the relay K1 has an adhesion fault and the fault type when the relay K1 has an adhesion fault based on the drive sampling signal and the adhesion sampling signal.
[0066] The relay drive and adhesion detection circuit proposed in the solution of the present invention can effectively protect the switch tube (such as MOS tube U2) in the relay drive circuit from working in the saturation region, such as preventing the switch tube (such as MOS tube U2) in the relay drive circuit from working in the linear region, making the switch tube (such as MOS tube U2) fully turned on, and preventing the relay drive circuit from overheating in the linear region and burning the switch tube (such as MOS tube U2) in the relay drive circuit; at the same time, the specific type of the relay adhesion failure can also be effectively determined, and specifically, it can be determined whether the cause of the relay adhesion failure is a low-voltage drive problem or a high-voltage adhesion problem, such as through two detection signals (i.e., the drive sampling signal and the adhesion sampling signal), it can be determined whether the cause of the relay adhesion failure is a problem of the relay drive circuit or a problem of the relay itself, without the need for after-sales personnel to make a secondary determination of the fault point.
[0067] By adopting the technical solution of the present invention, a driving circuit and a sticking detection circuit are set for a relay arranged between a high-voltage power supply and a load in a high-voltage system. The driving circuit mainly includes a voltage-stabilizing diode, a triode and a MOS tube, and the sticking detection circuit mainly includes a voltage-dividing resistor, a voltage-stabilizing diode, a triode and a MOS tube. Based on the level of the driving signal sent by the MCU, according to the level of the driving sampling signal obtained from the output end of the self-driving circuit and the level of the sticking detection signal obtained from the output end of the self-sticking detection circuit, it is judged whether the driving circuit and the relay are faulty and the fault position is determined; thus, by setting the driving circuit and the sticking detection circuit of the relay, it is determined whether the driving circuit and the relay are faulty and the fault position is determined, so as to realize accurate detection of the relay and its driving circuit, and at the same time, reliable driving of the relay can be realized.
[0068] According to an embodiment of the present invention, an electronic device corresponding to the detection device of the relay module is also provided. The electronic device may include: the detection device of the relay module described above.
[0069] Since the processing and functions implemented by the electronic device of this embodiment basically correspond to the embodiments, principles and examples of the device, for the details not described in this embodiment, please refer to the relevant descriptions in the aforementioned embodiments and will not be repeated here.
[0070] According to an embodiment of the present invention, a vehicle corresponding to a detection device for a relay module is also provided. The vehicle may include: the detection device for the relay module described above, or the electronic device described above.
[0071] Since the processing and functions implemented by the vehicle of this embodiment basically correspond to the embodiments, principles and examples of the device, for the details not described in this embodiment, please refer to the relevant descriptions in the aforementioned embodiments and will not be repeated here.
[0072] According to an embodiment of the present invention, a detection method for a relay module based on the detection device for the relay module corresponding to the detection device for the relay module is also provided. Figure 4 The flowchart of an embodiment of the method of the present invention is shown in FIG. The relay module detection method based on the relay module detection device may include: steps S110 to S130.
[0073] In step S110 , the signal output by the driving module to the coil of the relay is obtained through the driving signal sampling module, which is recorded as the driving sampling signal of the driving module.
[0074] In step S120, a signal between the contact of the relay and the common end of the load is obtained through the adhesion detection module, and is recorded as an adhesion sampling signal of the contact of the relay.
[0075] At step S130, based on a preset drive signal, according to the drive sampling signal of the drive module and the adhesion sampling signal of the contacts of the relay, it is determined whether the relay module is faulty, and in the case of a relay module failure, it is determined that the fault point of the relay module is the drive module and / or the relay, so as to determine whether the drive module and the contacts of the relay are faulty and determine the fault location, thereby realizing the detection of the drive module of the contacts of the relay and the coil of the relay, and at the same time realizing reliable driving of the coil of the relay.
[0076] See also Figure 2 and Figure 3In the example shown, the MCU determines whether the relay K1 has a sticking fault and the fault type when the relay K1 has a sticking fault based on the drive sampling signal and the sticking sampling signal. In the solution of the present invention, a drive circuit, a drive sampling circuit and a sticking detection circuit are set to determine the specific fault problem point, that is, which part of the circuit has a problem, which is convenient for after-sales maintenance and does not require a secondary judgment by after-sales; it can also ensure that the switch tube (such as MOS tube U2) in the drive circuit works in the saturation zone, so that it is fully turned on to avoid device damage.
[0077] The relay drive and adhesion detection circuit proposed by the scheme of the present invention can effectively protect the switch tube (such as MOS tube U2) in the relay drive circuit from working in the saturation region, such as preventing the switch tube (such as MOS tube U2) in the relay drive circuit from working in the linear region, making the switch tube (such as MOS tube U2) fully turned on, and preventing the relay drive circuit from overheating in the linear region and burning the switch tube (such as MOS tube U2) in the relay drive circuit; at the same time, the specific type of the relay adhesion failure can also be effectively determined, and specifically, it can be determined whether the cause of the relay adhesion failure is a low-voltage drive problem or a high-voltage adhesion problem, such as through two detection signals (i.e., the drive sampling signal and the adhesion sampling signal), it can be determined whether the cause of the relay adhesion failure is a problem of the relay drive circuit or a problem of the relay itself, without the need for after-sales personnel to make a secondary determination of the fault point.
[0078] In some embodiments, in step S130, based on a preset drive signal, according to the drive sampling signal of the drive module and the adhesion sampling signal of the contacts of the relay, it is determined whether the relay module is faulty, and when the relay module fails, it is determined that the fault point of the relay module is the drive module and / or the relay, so as to determine whether the contacts of the drive module and the relay are faulty and determine the fault location, thereby realizing the detection of the drive module of the contacts of the relay and the coil of the relay, and at the same time realizing the specific process of reliable driving of the coil of the relay, see the following exemplary description.
[0079] Combine the following Figure 5 The flowchart of an embodiment of determining whether the relay module is faulty and the fault point when it fails in the method of the present invention further illustrates the specific process of determining whether the relay module is faulty and the fault point when it fails in step S130, including: steps S210 to S230.
[0080] Step S210, determining whether the level of the preset driving signal is a preset first level or a preset second level; wherein the preset first level is a high level, and the preset second level is a low level.
[0081] Step S220, if it is determined that the level of the preset driving signal is the preset first level, specifically includes: step S2210, step S2220, step S2230, step S2240.
[0082] Step S2210: If it is determined that the level of the driving sampling signal of the driving module is the preset first level and the level of the adhesion sampling signal of the contact of the relay is the preset first level, it is determined that the relay module has no fault.
[0083] Step S2220: If it is determined that the level of the driving sampling signal of the driving module is the preset first level, and the level of the adhesion sampling signal of the contact of the relay is the preset second level, it is determined that the relay module is faulty, and the fault point of the relay module is that the relay is damaged and cannot be closed.
[0084] Step S2230: If it is determined that the level of the driving sampling signal of the driving module is the preset second level, and the level of the adhesion sampling signal of the contact of the relay is the preset first level, it is determined that the relay module is faulty, and the fault point of the relay module is the driving module fault and the relay is stuck and cannot be disconnected.
[0085] Step S2240: If it is determined that the level of the driving sampling signal of the driving module is the preset second level and the level of the adhesion sampling signal of the contact of the relay is the preset second level, it is determined that the relay module is faulty and the fault point of the relay module is the driving module fault.
[0086] Step S230, if it is determined that the level of the preset driving signal is the preset second level, specifically includes: step S2310, step S2320, step S2330, step S2340.
[0087] Step S2310: If it is determined that the level of the driving sampling signal of the driving module is the preset second level and the level of the adhesion sampling signal of the contact of the relay is the preset second level, it is determined that the relay module has no fault.
[0088] Step S2320: If it is determined that the level of the driving sampling signal of the driving module is the preset second level, and the level of the adhesion sampling signal of the contact of the relay is the preset first level, it is determined that the relay module is faulty, and the fault point of the relay module is that the relay is stuck and cannot be disconnected.
[0089] Step S2330: If it is determined that the level of the driving sampling signal of the driving module is a preset first level, and the level of the adhesion sampling signal of the contact of the relay is a preset second level, it is determined that the relay module is faulty, and the fault point of the relay module is the driving module fault and the relay is damaged and cannot be closed.
[0090] Step S2340: If it is determined that the level of the driving sampling signal of the driving module is the preset first level and the level of the adhesion sampling signal of the contact of the relay is the preset first level, it is determined that the relay module is faulty and the fault point of the relay module is the driving module fault.
[0091] In the solution of the present invention, the MCU determines whether the relay K1 has a sticking fault and the fault type when the relay K1 has a sticking fault based on the driving sampling signal and the sticking sampling signal. The specific judgment method can refer to the exemplary description of the following two cases. Figure 2 and Figure 3 In the example shown, in the scheme of the present invention, the adhesion detection method of the relay drive and its adhesion detection circuit includes: determining whether the driving signal output by the MCU is a high level or a low level: if it is determined that the driving signal output by the MCU is a high level, executing step 2; if it is determined that the driving signal output by the MCU is a low level, executing step 3.
[0092] Step 2, first case: when the driving signal output by the MCU is at a high level, make a judgment based on the driving sampling signal output by the driving circuit and the adhesion sampling signal output by the adhesion detection circuit, see steps 21, 22, 23 and 24 for details.
[0093] Step 21, when the driving sampling signal output by the driving circuit is at a high level, and the adhesion sampling signal output by the adhesion detection circuit, ie, the adhesion detection signal, is also at a high level, the relay K1 and its driving circuit are both free of faults.
[0094] Step 22: When the driving sampling signal output by the driving circuit is at a high level and the adhesion sampling signal output by the adhesion detection circuit, i.e., the adhesion detection signal, is at a low level, it proves that the relay K1 is damaged and cannot be closed.
[0095] Step 23, when the driving sampling signal output by the driving circuit is at a low level and the adhesion sampling signal output by the adhesion detection circuit, i.e., the adhesion detection signal, is at a high level, it proves that the driving circuit is faulty and the relay K1 is stuck and cannot be disconnected.
[0096] Step 24: When the driving sampling signal output by the driving circuit is at a low level and the adhesion sampling signal output by the adhesion detection circuit, that is, the adhesion detection signal, is at a low level, it is proved that the driving circuit is faulty.
[0097] Step 3, second case: when the driving signal output by the MCU is at a low level, make a judgment based on the driving sampling signal output by the driving circuit and the adhesion sampling signal output by the adhesion detection circuit, see steps 31, 32, 33 and 34 for details.
[0098] Step 31: When the driving sampling signal output by the driving circuit is at a low level and the adhesion sampling signal output by the adhesion detection circuit, that is, the adhesion detection signal, is at a low level, the relay K1 has no fault.
[0099] Step 32: When the driving sampling signal output by the driving circuit is at a low level and the adhesion sampling signal output by the adhesion detection circuit, namely, the adhesion detection signal, is at a high level, the contacts of the relay K1 are stuck and cannot be disconnected.
[0100] Step 33: When the driving sampling signal output by the driving circuit is at a high level and the adhesion sampling signal output by the adhesion detection circuit, that is, the adhesion detection signal, is at a low level, the driving circuit fails and the relay K1 cannot be closed.
[0101] Step 34: When the driving sampling signal output by the driving circuit is at a high level and the adhesion sampling signal output by the adhesion detection circuit, that is, the adhesion detection signal, is at a high level, the relay K1 is normal and the driving circuit is faulty.
[0102] In the scheme of the present invention, by determining whether the driving signal output by the MCU is a high level or a low level: if it is determined that the driving signal output by the MCU is a high level, then judging based on the driving sampling signal output by the driving circuit and the adhesion sampling signal output by the adhesion detection circuit, the specific fault problem point can be judged, that is, which part of the circuit has a problem, which is convenient for after-sales maintenance and does not require secondary judgment by after-sales.
[0103] Since the processing and functions implemented by the method of this embodiment basically correspond to the embodiments, principles and examples of the detection device of the relay module described above, for the details not fully described in this embodiment, please refer to the relevant descriptions in the above embodiments, and no further elaboration will be made here.
[0104] In summary, it is easy for those skilled in the art to understand that, under the premise of no conflict, the above-mentioned advantageous methods can be freely combined and superimposed.
[0105] The above description is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention shall be included in the scope of the claims of the present invention.
Claims
1. A detection device for a relay module, characterized in that: The relay module comprises: a relay and a driving module of the relay; the relay has a coil and a contact, the driving module is arranged between the input end of a preset driving signal and the coil of the relay, and the contact of the relay is arranged between the positive pole of a preset power supply and a preset load; the detection device of the relay module comprises: a driving signal sampling module, an adhesion detection module and a fault judgment module; wherein, The driving signal sampling module is arranged between the output end of the driving module and the coil of the relay, and is used to obtain the signal output by the driving module to the coil of the relay, which is recorded as the driving sampling signal of the driving module; The adhesion detection module is arranged at the common end of the contact of the relay and the load, and is used to obtain the signal of the common end of the contact of the relay and the load, which is recorded as the adhesion sampling signal of the contact of the relay; The fault judgment module is connected to the drive signal sampling module and the adhesion detection module respectively, and is used to determine whether the relay module is faulty based on a preset drive signal, according to the drive sampling signal of the drive module, and the adhesion sampling signal of the contact of the relay, and to determine that the fault point of the relay module is the drive module and / or the relay when the relay module fails, so as to determine whether the drive module and the contacts of the relay are faulty and determine the fault location, realize the detection of the drive module of the contacts of the relay and the coil of the relay, and at the same time realize the reliable driving of the coil of the relay; The driving module includes: a first current limiting resistor module, a first voltage-stabilizing voltage-dividing diode module, a first voltage-dividing resistor module, a second current limiting resistor module, a first transistor module, and a first MOS tube module; The input end of the preset driving signal is connected to the base of the first triode module after passing through the first current limiting resistor module; the preset first power supply is connected to the cathode of the first voltage-stabilizing voltage-dividing diode module after passing through the first voltage-dividing resistor module, and the anode of the first voltage-stabilizing voltage-dividing diode module is connected to the collector of the first triode module; the emitter of the first triode module is grounded; The cathode of the first voltage-stabilizing voltage-dividing diode module is connected to the gate of the first MOS tube module after passing through the second current-limiting resistor module; the preset first power supply is also connected to the source of the first MOS tube module; the drain of the first MOS tube module, as the output end of the driving module, is connected to the first connection end of the coil of the relay, and the second connection end of the coil of the relay is grounded; The driving signal sampling module can perform voltage division sampling from the output end of the driving module to obtain the driving sampling signal.
2. The detection device of the relay module according to claim 1, characterized in that: The driving module further includes: a first pull-down resistor module and / or a voltage regulator diode module; wherein, The first pull-down resistor module is arranged between the input terminal of the preset driving signal and the ground, and is used for performing pull-down protection on the preset driving signal input from the input terminal of the preset driving signal; The voltage stabilizing diode module is arranged between the input end of the preset driving signal and the ground, and the cathode of the voltage stabilizing diode module is connected to the input end of the preset driving signal, and is used to perform voltage stabilizing protection on the preset driving signal input from the input end of the preset driving signal.
3. The detection device of the relay module according to claim 1, characterized in that: The driving module further includes: at least one of a first voltage stabilizing filter module, a first pull-down discharge module and a freewheeling diode module; wherein, The first voltage stabilizing and filtering module is arranged between the drain of the first MOS tube module and the ground, and is used to perform voltage stabilizing and filtering protection on the signal at the output end of the driving module; The first pull-down discharge module is arranged between the drain of the first MOS tube module and the ground, and is used to perform pull-down discharge protection on the signal at the output end of the driving module; The freewheeling diode module is arranged between the drain of the first MOS tube module and the ground, and is used to provide a freewheeling path for the signal of the coil of the relay at the output end of the driving module, so as to protect the signal at the output end of the driving module.
4. The detection device of the relay module according to any one of claims 1 to 3, characterized in that: The adhesion detection module includes: a second voltage-dividing resistor module, a third voltage-dividing resistor module, a third current-limiting resistor module, a second triode module, a second voltage-stabilizing voltage-dividing diode module, a fourth voltage-dividing resistor module, a fourth current-limiting resistor module, a second MOS tube module, a fifth current-limiting resistor module, and an optical coupling module; wherein, The positive electrode of the preset power supply is connected to the first connection end of the contact of the relay; the second connection end of the contact of the relay is connected to the negative electrode of the preset power supply via the second voltage-dividing resistor module and the third voltage-dividing resistor module; the common end of the second voltage-dividing resistor module and the third voltage-dividing resistor module is connected to the base of the second transistor module via the third current-limiting resistor module; The preset second power supply is connected to the cathode of the second voltage-stabilizing voltage-dividing diode module after passing through the fourth voltage-dividing resistor module, the anode of the second voltage-stabilizing voltage-dividing diode module is connected to the collector of the second triode module, and the emitter of the second triode module is connected to the negative electrode of the preset power supply; The cathode of the second voltage-stabilizing voltage-divider module is connected to the gate of the second MOS tube module after passing through the fourth current-limiting resistor module; the preset second power supply is also connected to the source of the second MOS tube module, the drain of the second MOS tube module is connected to the anode of the diode side of the optocoupler module after passing through the fifth current-limiting resistor module, and the cathode of the diode side of the optocoupler module is connected to the negative electrode of the preset power supply; the preset third power supply is connected to the collector of the transistor side of the optocoupler module, and the emitter of the transistor side of the optocoupler module, as the output end of the adhesion detection module, can output the adhesion sampling signal.
5. The detection device of the relay module according to claim 4, characterized in that: in, The adhesion detection module further includes: a second voltage stabilization filter module and / or a second pull-down discharge module; wherein, The second voltage stabilizing and filtering module is arranged between the anode of the diode side of the optical coupling module and the negative electrode of the preset power supply, and is used to perform voltage stabilizing and filtering protection on the input signal of the anode of the diode side of the optical coupling module; The second pull-down discharge module is arranged between the anode on the diode side of the optical coupling module and the negative electrode of the preset power supply, and is used for performing pull-down discharge protection on the input signal of the anode on the diode side of the optical coupling module; and / or, The adhesion detection module further includes: a third voltage stabilization and filtering module and / or a pull-down module; wherein, The third voltage stabilizing and filtering module is arranged between the emitter on the transistor side of the optical coupling module and the ground, and is used to perform voltage stabilizing and filtering protection on the output signal of the emitter on the transistor side of the optical coupling module; The pull-down module is arranged between the emitter on the transistor side of the optocoupler module and the ground, and is used to perform pull-down discharge protection on the output signal of the emitter on the transistor side of the optocoupler module.
6. An electronic device, characterized in that: include: A detection device for a relay module according to any one of claims 1 to 5.
7. A vehicle, characterized in that: include: A detection device for a relay module as claimed in any one of claims 1 to 5, or an electronic device as claimed in claim 6.
8. A method for detecting a relay module based on the relay module detection device according to any one of claims 1 to 5, characterized in that: include: Acquire, through the drive signal sampling module, a signal output by the drive module to the coil of the relay, which is recorded as a drive sampling signal of the drive module; Acquire a signal of a common end of the contact of the relay and the load through the adhesion detection module, and record it as an adhesion sampling signal of the contact of the relay; Based on a preset driving signal, according to the driving sampling signal of the driving module and the adhesion sampling signal of the contacts of the relay, it is determined whether the relay module is faulty, and in the case of a fault of the relay module, it is determined that the fault point of the relay module is the driving module and / or the relay, so as to determine whether the contacts of the driving module and the relay are faulty and determine the fault location, thereby realizing the detection of the driving module of the contacts of the relay and the coil of the relay, and at the same time realizing reliable driving of the coil of the relay.
9. The detection method of the relay module according to claim 8, characterized in that: Based on a preset driving signal, according to the driving sampling signal of the driving module and the adhesion sampling signal of the contact of the relay, it is determined whether the relay module is faulty, and when the relay module fails, it is determined that the fault point of the relay module is the driving module and / or the relay, so as to determine whether the driving module and the contacts of the relay are faulty and determine the fault location, realize the detection of the driving module of the contacts of the relay and the coil of the relay, and at the same time realize the reliable driving of the coil of the relay, including: Determining whether the level of the preset driving signal is a preset first level or a preset second level; If it is determined that the level of the preset driving signal is the preset first level, then: If it is determined that the level of the driving sampling signal of the driving module is the preset first level, and the level of the adhesion sampling signal of the contact of the relay is the preset first level, it is determined that the relay module has no fault; If it is determined that the level of the driving sampling signal of the driving module is a preset first level, and the level of the adhesion sampling signal of the contact of the relay is a preset second level, it is determined that the relay module is faulty, and the fault point of the relay module is that the relay is damaged and cannot be closed; If it is determined that the level of the driving sampling signal of the driving module is the preset second level, and the level of the adhesion sampling signal of the contact of the relay is the preset first level, it is determined that the relay module is faulty, and the fault point of the relay module is the driving module fault and the relay is adhered and cannot be disconnected; If it is determined that the level of the driving sampling signal of the driving module is the preset second level, and the level of the adhesion sampling signal of the contact of the relay is the preset second level, it is determined that the relay module is faulty, and the fault point of the relay module is the fault of the driving module; If it is determined that the level of the preset driving signal is the preset second level, then: If it is determined that the level of the driving sampling signal of the driving module is the preset second level, and the level of the adhesion sampling signal of the contact of the relay is the preset second level, it is determined that the relay module has no fault; If it is determined that the level of the driving sampling signal of the driving module is the preset second level, and the level of the adhesion sampling signal of the contact of the relay is the preset first level, it is determined that the relay module is faulty, and the fault point of the relay module is that the relay is adhered and cannot be disconnected; If it is determined that the level of the driving sampling signal of the driving module is a preset first level, and the level of the adhesion sampling signal of the contact of the relay is a preset second level, it is determined that the relay module is faulty, and the fault point of the relay module is the driving module fault and the relay is damaged and cannot be closed; If it is determined that the level of the driving sampling signal of the driving module is the preset first level and the level of the adhesion sampling signal of the contact of the relay is the preset first level, it is determined that the relay module is faulty and the fault point of the relay module is the driving module fault.
Citation Information
Patent Citations
Relay control state detection circuit of charging device and charging device
CN220933143U