Integrated circuit package, package substrate and manufacturing steps thereof

Abstract

The invention relates to the technical field of integrated circuit packaging, in particular to an integrated circuit packaging piece, a packaging substrate and a manufacturing step thereof, comprising a limiting rod, the packaging substrate is arranged on the surface of the limiting rod; a first spring is arranged on the surface of the lifting rod, an extension plate is fixed to the surface of the lifting rod, a first through hole is formed in the surface of the extension plate, a fixing block is inserted into the first through hole, an elastic plate is fixed to the surface of the extension plate, and a supporting rod is fixed to the surface of the packaging substrate; the second through hole is formed in the surface of the elastic plate; the packaging device has the beneficial effects that a lead screw is arranged in the packaging substrate, the lead screw rotates to drive the packaging substrate to move on the surface of a limiting rod, when the packaging substrate stops on the surface of the limiting rod, a sliding block can move in a sliding groove, so that an inserting block moves into a clamping groove, a deformation block is arranged in the clamping groove, the inserting block abuts against the surface of the deformation block, and therefore the packaging substrate can be conveniently and rapidly assembled. And the inserting blocks are inserted into the clamping grooves, so that the lifting plate moves upwards.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit packaging, and in particular to an integrated circuit package, a packaging substrate and manufacturing steps thereof. Background Art

[0002] Integrated circuit packaging is both the pinnacle and the base of the electronics pyramid. There are good reasons to say that it is both. From the perspective of the density of electronic components (such as transistors), ICs represent the cutting edge of electronics. But ICs are also a starting point, a basic building block, and the basis of most electronic systems in our lives. Similarly, ICs are not just single chips or basic electronic structures. There are many different types of ICs (analog circuits, digital circuits, radio frequency circuits, sensors, etc.), and therefore the needs and requirements for packaging are also different;

[0003] Existing packages for integrated circuits require stable mobile clamping when welding electronic components. The package needs to be stabilized on the surface of the package substrate so that the package moves with the package substrate. However, the fixing and loosening of the package substrate package need to be performed through clamping and releasing steps, which results in time required for clamping and releasing operations, affecting work efficiency. Summary of the invention

[0004] The object of the present invention is to provide an integrated circuit package, a package substrate and manufacturing steps thereof to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solution: an integrated circuit package and a package substrate, comprising:

[0006] A limiting rod, a surface of which is provided with a packaging substrate;

[0007] A lifting rod, a first spring is arranged on the surface of the lifting rod, an extension plate is fixed on the surface of the lifting rod, a first through hole is opened on the surface of the extension plate, a fixing block is inserted in the first through hole, an elastic plate is fixed on the surface of the extension plate, and a support rod is fixed on the surface of the packaging substrate; and

[0008] The second through hole is arranged on the surface of the elastic plate.

[0009] Preferably, two sets of limit rods are inserted inside the packaging substrate, a screw rod is arranged inside the packaging substrate, driving components are arranged at both ends of the screw rod, the driving component drives the screw rod to rotate, the packaging substrate can move on the surface of the limit rod, and the packaging component is placed on the surface of the packaging substrate.

[0010] Preferably, a through groove is provided on the surface of the limit rod, and a card slot is provided on the bottom of the limit rod. There are multiple groups of card slots, and a deformation block is fixed in the card slot. The deformation block is flexible and can be deformed when squeezed, and can return to its original shape when the deformation block is not subjected to force.

[0011] Preferably, a lifting plate is provided at the bottom of the limiting rod, a U-shaped rod is fixed to the bottom of the lifting plate, the end of the U-shaped rod is inserted into the interior of the packaging substrate, the end of the U-shaped rod is connected to the end of the lifting rod, the U-shaped rod moves with the lifting rod, and a sliding groove is provided on the surface of the lifting plate.

[0012] Preferably, a plug-in block is provided in the slide groove, the slider can move in the slide groove, and the plug-in block is fixed on the surface of the slider. The plug-in block moves with the slider, and the plug-in block can be plugged into the slot. When the plug-in block is plugged in the slot, the surface of the plug-in block is supported on the surface of the deformation block.

[0013] Preferably, a first spring is provided on the surface of the lifting rod, one end of the first spring is connected to the surface of the packaging substrate, and the other end of the first spring is connected to the surface of the lifting rod. Two groups of extension plates are fixed on the surface of the lifting rod, and the extension plates are lifted and lowered along with the lifting rod.

[0014] Preferably, a first through hole is provided on the surface of the extension plate, a second through hole is provided on the surface of the elastic plate, a fixing block is inserted into the first through hole and the second through hole, the fixing block can move in the first through hole and the second through hole, a protrusion is fixed to the bottom of the fixing block, the protrusion moves with the fixing block, and the protrusion can move into the first through hole and the second through hole.

[0015] Preferably, a support rod is provided at the end of the fixed block, the end of the support rod is fixed with the surface of the packaging substrate, the end of the support rod is inserted into the interior of the fixed block, the fixed block can move outside the support rod, and a second spring is provided on the surface of the support rod, one end of the second spring is connected to the surface of the fixed block, and the other end is connected to the surface of the support rod.

[0016] Preferably, the elastic plate is clamped on the surface of the package, and after the fixing block moves, the fixing block is located on the top of the package.

[0017] A manufacturing process for an integrated circuit package and a package substrate assembly process, comprising the following steps:

[0018] Step 1: Stabilization. A screw rod is provided inside the packaging substrate. The screw rod rotates to drive the packaging substrate to move on the surface of the limit rod. When the packaging substrate stops on the surface of the limit rod, the slider moves in the slide groove, so that the plug-in block moves into the card slot. A deformation block is provided in the card slot. The plug-in block is held on the surface of the deformation block, so that the deformation block is deformed. The plug-in block is inserted into the card slot, so that the lifting plate moves up. The lifting plate drives the extension plate to move up through the U-shaped rod and the lifting rod. After the extension plate moves up, the extension plate is held on the surface of the protrusion. The fixed block moves in the first through hole and the second through hole. The fixed block is received in the second through hole and the first through hole. The package can be directly placed on the surface of the packaging substrate, and the package is stabilized by holding it on the surface of the package through the elastic plate.

[0019] Step 2: Fixing. When the package substrate moves, the plug-in block moves on the surface of the limit rod, causing the U-shaped rod to move downward, driving the extension plate to move downward, so that the fixing block moves to the top of the package under the push of the second spring to fix the package.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The packaging substrate proposed in the present invention is provided with a screw rod inside, and the screw rod rotates to drive the packaging substrate to move on the surface of the limit rod. When the packaging substrate stops on the surface of the limit rod, the slider moves in the slide groove, so that the plug-in block moves into the card slot, and a deformation block is provided in the card slot, and the plug-in block is supported on the surface of the deformation block, so that the deformation block is deformed, and the plug-in block is inserted into the card slot, so that the lifting plate moves up, and the lifting plate drives the extension plate to move up through the U-shaped rod and the lifting rod. After the extension plate moves up, the extension plate is supported on the surface of the protrusion, and the fixing block moves in the first through hole and the second through hole. The fixing block is received in the second through hole and the first through hole, and the packaging can be directly placed on the surface of the packaging substrate, and the packaging is stabilized by supporting the surface of the packaging through the elastic plate. When the packaging substrate moves, the plug-in block moves on the surface of the limit rod, so that the U-shaped rod moves downward, driving the extension plate to move downward, so that the fixed block moves to the top of the packaging under the push of the second spring, and fixes the packaging, and the packaging can be quickly fixed and released. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0023] Figure 2 This is a structural schematic diagram from another viewing angle of the present invention.

[0024] Figure 3 It is a schematic diagram of the lifting plate structure of the present invention.

[0025] Figure 4 for Figure 2 A schematic diagram of the enlarged structure in the middle.

[0026] Figure 5 It is a schematic diagram of the lifting rod structure of the present invention.

[0027] Figure 6 This is a schematic structural diagram of the lifting rod of the present invention from another viewing angle.

[0028] In the figure: a limit rod 1, a screw rod 2, a packaging substrate 3, a U-shaped rod 4, a slider 5, a plug-in block 6, a slide groove 7, a lifting plate 8, a slot 9, a through slot 10, a deformation block 11, an extension plate 12, a lifting rod 13, a first spring 14, a first through hole 15, a fixing block 16, a protrusion 17, a second spring 18, a support rod 19, a second through hole 20, and an elastic plate 21. DETAILED DESCRIPTION

[0029] In order to make the purpose and technical solution of the present invention clearly and completely described, and the advantages more clearly understood, the embodiments of the present invention are further described in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present invention, rather than all of the embodiments, and are only used to explain the embodiments of the present invention, and are not used to limit the embodiments of the present invention. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] See also Figures 1 to 6 The present invention provides a technical solution: an integrated circuit package and a package substrate, comprising:

[0031] A packaging substrate 3 is provided on the surface of the limit rod 1, and two groups of limit rods 1 are inserted inside the packaging substrate 3. A screw rod 2 is provided inside the packaging substrate 3, and driving components are provided at both ends of the screw rod 2. The driving component drives the screw rod 2 to rotate, and the packaging substrate 3 can move on the surface of the limit rod 1. A packaging component is placed on the surface of the packaging substrate 3. A through groove 10 is provided on the surface of the limit rod 1, and a card slot 9 is provided at the bottom of the limit rod 1. The card slot 9 is provided with multiple groups, and a deformation block 11 is fixed in the card slot 9. The deformation block 11 is flexible, and the deformation block 11 can be deformed when squeezed, and can return to its original shape when the deformation block 11 is not subjected to force. A lifting plate 8 is provided at the bottom of the limit rod 1, and a U-shaped rod 4 is fixed at the bottom of the lifting plate 8. The end of the U-shaped rod 4 is inserted in the sealing Inside the mounting base plate 3, the end of the U-shaped rod 4 is connected to the end of the lifting rod 13, the U-shaped rod 4 moves with the lifting rod 13, a slide groove 7 is provided on the surface of the lifting plate 8, a plug-in block 6 is provided in the slide groove 7, the slider 5 can move in the slide groove 7, and the plug-in block 6 is fixed on the surface of the slider 5, the plug-in block 6 moves with the slider 5, the plug-in block 6 can be inserted into the card slot 9, and when the plug-in block 6 is inserted into the card slot 9, the surface of the plug-in block 6 is supported on the surface of the deformation block 11, the deformation block 11 is provided in the card slot 9, the plug-in block 6 is supported on the surface of the deformation block 11, so that the deformation block 11 is deformed, the plug-in block 6 is inserted into the card slot 9, so that the lifting plate 8 moves up, and the lifting plate 8 drives the extension plate 12 to move up through the U-shaped rod 4 and the lifting rod 13;

[0032] A first spring 14 is provided on the surface of the lifting rod 13, an extension plate 12 is fixed on the surface of the lifting rod 13, a first through hole 15 is provided on the surface of the extension plate 12, a fixing block 16 is inserted in the first through hole 15, an elastic plate 21 is fixed on the surface of the extension plate 12, a support rod 19 is fixed on the surface of the packaging substrate 3, a first spring 14 is provided on the surface of the lifting rod 13, one end of the first spring 14 is connected to the surface of the packaging substrate 3, the other end of the first spring 14 is connected to the surface of the lifting rod 13, two groups of extension plates 12 are fixed on the surface of the lifting rod 13, the extension plate 12 is lifted and lowered with the lifting rod 13, a first through hole 15 is provided on the surface of the extension plate 12, a second through hole 20 is provided on the surface of the elastic plate 21, fixing blocks 16 are inserted in the first through hole 15 and the second through hole 20, the fixing block 16 can move in the first through hole 15 and the second through hole 20, a protrusion 17 is fixed on the bottom of the fixing block 16, The protrusion 17 moves with the fixing block 16, and the protrusion 17 can move into the first through hole 15 and the second through hole 20. A support rod 19 is provided at the end of the fixing block 16. The end of the support rod 19 is fixed to the surface of the packaging substrate 3. The end of the support rod 19 is inserted into the inside of the fixing block 16. The fixing block 16 can move outside the support rod 19. A second spring 18 is provided on the surface of the support rod 19. One end of the second spring 18 is connected to the surface of the fixing block 16, and the other end is connected to the surface of the support rod 19; the second through hole 20 is provided on the surface of the elastic plate 21, and the elastic plate 21 is clamped on the surface of the package. After the fixing block 16 moves, the fixing block 16 is located at the top of the package. When the packaging substrate 3 moves, the plug-in block 6 moves on the surface of the limit rod 1, so that the U-shaped rod 4 moves downward, driving the extension plate 12 to move downward, so that the fixing block 16 moves to the top of the package under the push of the second spring 18.

[0033] The package substrate 3 is provided with a screw rod 2 inside, and the screw rod 2 rotates to drive the package substrate 3 to move on the surface of the limit rod 1. When the package substrate 3 stops on the surface of the limit rod 1, the slider 5 moves in the slide groove 7, so that the plug-in block 6 moves to the card slot 9, and the card slot 9 is provided with a deformation block 11. The plug-in block 6 is supported on the surface of the deformation block 11, so that the deformation block 11 is deformed. The plug-in block 6 is inserted into the card slot 9, so that the lifting plate 8 moves up, and the lifting plate 8 drives the extension plate 12 to move up through the U-shaped rod 4 and the lifting rod 13. After the extension plate 12 moves up, the extension plate 12 is supported on the protrusion 1 7, the fixing block 16 moves in the first through hole 15 and the second through hole 20, and the fixing block 16 is received in the second through hole 20 and the first through hole 15, so that the package can be directly placed on the surface of the packaging substrate 3, and the elastic plate 21 is used to support the surface of the package to stabilize the package. When the packaging substrate 3 moves, the plug-in block 6 moves on the surface of the limit rod 1, so that the U-shaped rod 4 moves downward, driving the extension plate 12 to move downward, so that the fixing block 16 moves to the top of the package under the push of the second spring 18, and the package is fixed, so that the package can be quickly fixed and released.

[0034] Although the above describes the illustrative specific implementation methods of the present application so that technicians in this technical field can understand the present application, the present application is not limited to the scope of the specific implementation methods. For ordinary technicians in this technical field, as long as various changes are within the spirit and scope of the present application defined and determined by the attached claims, all application creations using the concept of the present application are protected.

Claims

1. An integrated circuit package and a package substrate, characterized in that: include: A limiting rod (1), wherein a packaging substrate (3) is arranged on the surface of the limiting rod (1); A lifting rod (13), a first spring (14) is arranged on the surface of the lifting rod (13), an extension plate (12) is fixed on the surface of the lifting rod (13), a first through hole (15) is opened on the surface of the extension plate (12), a fixing block (16) is inserted in the first through hole (15), an elastic plate (21) is fixed on the surface of the extension plate (12), and a support rod (19) is fixed on the surface of the packaging substrate (3); and The second through hole (20) is arranged on the surface of the elastic plate (21).

2. The integrated circuit package and the package substrate according to claim 1, characterized in that: Two groups of limit rods (1) are inserted into the interior of the packaging substrate (3), a screw rod (2) is arranged inside the packaging substrate (3), and driving components are arranged at both ends of the screw rod (2). The driving component drives the screw rod (2) to rotate, and the packaging substrate (3) can move on the surface of the limit rod (1), and a packaging component is placed on the surface of the packaging substrate (3).

3. The integrated circuit package and the package substrate according to claim 2, characterized in that: The surface of the limiting rod (1) is provided with a through groove (10), the bottom of the limiting rod (1) is provided with a clamping groove (9), the clamping groove (9) is provided with a plurality of groups, a deformation block (11) is fixed in the clamping groove (9), the deformation block (11) is flexible, the deformation block (11) can be deformed when being squeezed, and the deformation block (11) can return to its original shape when no force is applied.

4. The integrated circuit package and the package substrate according to claim 3, characterized in that: A lifting plate (8) is provided at the bottom of the limiting rod (1), a U-shaped rod (4) is fixed at the bottom of the lifting plate (8), the end of the U-shaped rod (4) is inserted into the interior of the packaging substrate (3), the end of the U-shaped rod (4) is connected to the end of the lifting rod (13), the U-shaped rod (4) moves along with the lifting rod (13), and a sliding groove (7) is provided on the surface of the lifting plate (8).

5. The integrated circuit package and the package substrate according to claim 4, characterized in that: The slide groove (7) is provided with a plug-in block (6), the slider (5) can move in the slide groove (7), and the plug-in block (6) is fixed on the surface of the slider (5). The plug-in block (6) moves with the slider (5), and the plug-in block (6) can be plugged into the card slot (9). When the plug-in block (6) is plugged into the card slot (9), the surface of the plug-in block (6) is supported on the surface of the deformation block (11).

6. The integrated circuit package and the package substrate according to claim 5, characterized in that: A first spring (14) is arranged on the surface of the lifting rod (13), one end of the first spring (14) is connected to the surface of the packaging substrate (3), and the other end of the first spring (14) is connected to the surface of the lifting rod (13). Two groups of extension plates (12) are fixed on the surface of the lifting rod (13), and the extension plates (12) are lifted and lowered along with the lifting rod (13).

7. The integrated circuit package and the package substrate according to claim 6, characterized in that: A first through hole (15) is formed on the surface of the extension plate (12), a second through hole (20) is formed on the surface of the elastic plate (21), a fixing block (16) is inserted into the first through hole (15) and the second through hole (20), the fixing block (16) can move in the first through hole (15) and the second through hole (20), a protrusion (17) is fixed at the bottom of the fixing block (16), the protrusion (17) moves with the fixing block (16), and the protrusion (17) can move into the first through hole (15) and the second through hole (20).

8. The integrated circuit package and the package substrate according to claim 7, characterized in that: A support rod (19) is provided at the end of the fixed block (16), the end of the support rod (19) is fixed with the surface of the packaging substrate (3), the end of the support rod (19) is inserted into the interior of the fixed block (16), the fixed block (16) can move outside the support rod (19), and a second spring (18) is provided on the surface of the support rod (19), one end of the second spring (18) is connected to the surface of the fixed block (16), and the other end is connected to the surface of the support rod (19).

9. The integrated circuit package and the package substrate according to claim 8, characterized in that: The elastic plate (21) is clamped on the surface of the package, and after the fixing block (16) moves, the fixing block (16) is located on the top of the package.

10. A manufacturing step for an integrated circuit package and a package substrate matching process as claimed in any one of claims 1 to 9, characterized in that: The following steps are involved: Step 1: Stabilization. A screw rod (2) is provided inside the packaging substrate (3). The screw rod (2) rotates to drive the packaging substrate (3) to move on the surface of the limit rod (1). When the packaging substrate (3) stops on the surface of the limit rod (1), the slider (5) moves in the slide groove (7), so that the plug-in block (6) moves into the card slot (9). A deformation block (11) is provided in the card slot (9). The plug-in block (6) is supported on the surface of the deformation block (11), so that the deformation block (11) is deformed. The plug-in block (6) is inserted into the card slot (9). The lifting plate (8) is moved upward, and the lifting plate (8) drives the extension plate (12) to move upward through the U-shaped rod (4) and the lifting rod (13). After the extension plate (12) moves upward, the extension plate (12) is supported on the surface of the protrusion (17). The fixing block (16) moves in the first through hole (15) and the second through hole (20). The fixing block (16) is received in the second through hole (20) and the first through hole (15). The package can be directly placed on the surface of the package substrate (3), and the package is stabilized by supporting the surface of the package through the elastic plate (21). Step 2: Fixing. When the packaging substrate (3) moves, the plug-in block (6) moves on the surface of the limiting rod (1), causing the U-shaped rod (4) to move downward, driving the extension plate (12) to move downward, so that the fixing block (16) moves to the top of the packaging under the push of the second spring (18), thereby fixing the packaging.

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