Blade structure and wafer monitoring method

Abstract

The invention provides a blade structure and a wafer monitoring method, and relates to the technical field of semiconductors, the blade structure comprises a blade body, and the blade body comprises a connecting end and a bearing end which are connected; the connecting end is connected with a wafer transfer device, and the wafer transfer device is used for transferring wafers; a supporting structure and a monitoring device are arranged on the bearing end; the supporting structure protrudes relative to the upper surface of the bearing end, and the supporting structure is used for bearing a wafer; the monitoring device is used for obtaining uploading information of the wafer borne by the supporting structure and determining whether the wafer is located on the supporting structure or not according to the uploading information. According to the uploading information, whether the wafer falls off in the wafer transfer process can be determined, so that the wafer abnormity (such as wafer falling) in the transfer process can be identified in time, and the wafer waste problem and the no-load problem of wafer processing equipment are avoided.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a blade structure and a wafer monitoring method. Background Art

[0002] In the semiconductor wafer processing industry, wafers need to be continuously transported during wafer processing or wafer epitaxial growth manufacturing. In order to prevent particulate matter and metal contamination, robots are often used to transfer wafers, especially sorter equipment.

[0003] When using a robot to transfer wafers, the robot can only scan information through the loading port (port) on the device where the wafer to be transferred is currently located, identify the wafer and determine the wafer position based on the scanned information, and then receive the wafer and transfer it.

[0004] However, during the transmission process, the wafer may fall due to incorrect wafer position or other disturbances, and since the existing robot cannot monitor whether the wafer falls during the wafer transfer process, the transmission will fail, resulting in serious waste and idleness of the wafer processing equipment in the next process. Summary of the invention

[0005] The embodiments of the present invention provide a blade structure, a robot arm and a wafer monitoring method, so as to solve the problem in the prior art that it is impossible to monitor whether a wafer has fallen during wafer transportation.

[0006] To solve the above technical problems, the embodiments of the present invention provide the following technical solutions:

[0007] An embodiment of the present invention provides a blade structure, including:

[0008] A blade body, the blade body comprising a connected connection end and a load-bearing end;

[0009] The connection end is connected to a wafer transfer device, and the wafer transfer device is used to transfer wafers;

[0010] A support structure and a monitoring device are arranged on the load-bearing end;

[0011] Wherein, the support structure protrudes relative to the upper surface of the carrying end, and the support structure is used to carry one of the wafers;

[0012] The monitoring device is used to obtain the upload information of the wafer carried by the support structure, and determine whether the wafer is located on the support structure according to the upload information.

[0013] In some embodiments, the monitoring device includes an image monitoring structure and / or a pressure sensing structure;

[0014] The image monitoring structure is used to obtain an image of the wafer carried by the support structure, and determine whether the wafer is located on the support structure according to the image;

[0015] The pressure sensing structure is connected to the supporting structure, and is used to obtain the supporting force of the supporting structure on the wafer, and determine whether the wafer is located on the supporting structure according to the supporting force.

[0016] In some embodiments, the monitoring device is disposed on a movable track on the carrying end;

[0017] The image monitoring structure is arranged on the moving track, and the image monitoring structure can move on the moving track.

[0018] Some embodiments further include an external control device;

[0019] The image monitoring structure is wirelessly connected to the control device;

[0020] and / or,

[0021] The pressure sensing structure is wirelessly connected to the control device.

[0022] In some embodiments, the carrying end is formed in a circular shape, and the image monitoring structure and the pressure sensing structure are symmetrically arranged along the radial direction of the carrying end.

[0023] In some embodiments, a through hole is opened in the center of the load-bearing end.

[0024] In some embodiments, an area of ​​the load-bearing end is greater than half an area of ​​the blade body.

[0025] In some embodiments, the load-bearing end is formed into a circular shape;

[0026] The supporting structure is arranged on the outer periphery of the bearing end.

[0027] In some embodiments, a pushing structure is further disposed on the carrying end, and the pushing structure is used to push the wafer to a preset position.

[0028] In some embodiments, the blade body is made by an integral molding process.

[0029] An embodiment of the present invention further provides a wafer monitoring method, which is applied to the blade structure as described above, and the method includes:

[0030] Obtaining upload information of a wafer carried by a support structure;

[0031] It is determined whether the wafer is located on the support structure according to the uploaded information.

[0032] In some embodiments, obtaining the upload information of the wafer supported by the support structure includes at least one of the following:

[0033] Acquiring an image of the wafer carried by the support structure through an image monitoring structure;

[0034] Acquiring the supporting force of the supporting structure on the wafer through a pressure sensing structure;

[0035] Determining whether the wafer is located on the support structure according to the uploaded information includes at least one of the following:

[0036] determining whether the wafer is located on the support structure according to the image;

[0037] Whether the wafer is located on the support structure is determined according to the support force.

[0038] The embodiments of the present invention have the following beneficial effects:

[0039] The blade structure provided by the embodiment of the present invention includes a blade body, which includes a connecting end and a carrying end. The wafer is carried by a supporting structure on the carrying end, and the rotating shaft of the robot arm is connected through the connecting end to realize wafer transportation. After the supporting structure carries the wafer, the upload information of the wafer is obtained by the monitoring device on the carrying end. According to the uploaded information, it can be determined whether the wafer falls during the wafer transportation process, thereby realizing timely identification of wafer abnormalities (such as wafer falling) during the transportation process, avoiding the problem of wafer waste and the problem of idleness of wafer processing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 A schematic diagram showing a blade structure provided by an embodiment of the present invention;

[0041] Figure 2 A flowchart showing a wafer monitoring method provided by an embodiment of the present invention.

[0042] Description of reference numerals:

[0043] 1-blade body; 11-connecting end; 12-bearing end; 121-through hole; 2-wafer transfer device; 3-support structure; 4-monitoring device. DETAILED DESCRIPTION

[0044] In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention more clear, a detailed description will be given below with reference to the accompanying drawings and specific embodiments.

[0045] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0046] In order to solve the problem in the prior art that it is impossible to monitor whether a wafer has fallen during wafer transportation, an embodiment of the present invention provides a blade structure, a robotic arm and a wafer monitoring method.

[0047] like Figure 1 As shown, an embodiment of the present invention provides a blade structure, including:

[0048] The blade body 1 is connected to a wafer transfer device 2, and the wafer transfer device is used to transfer the wafer to a wafer processing device for processing, that is, the wafer is carried by the blade body, and the blade body is driven to move by the wafer transfer device (that is, the wafer transfer device is used to provide power conditions), thereby transferring the wafer.

[0049] The wafer transfer device may be a robot, that is, it can be understood that the robot transfers the wafer through the blade body, or the wafer transfer device and the blade body constitute a robot.

[0050] It should be noted that Figure 1 The structure of the wafer transfer device 2 shown is for illustration only.

[0051] The blade body 1 comprises a connecting end 11 and a bearing end 12 .

[0052] Optionally, the blade body 1 may be manufactured by an integral molding process, that is, the connecting end 11 and the bearing end 12 are an integral body manufactured by an integral molding process, one part of which serves as the connecting end and the other part as the bearing end.

[0053] The one-piece molding process includes but is not limited to stamping process, injection molding process, die-casting process, etc.

[0054] The connecting end 11 and the carrying end 12 may also be manufactured separately and then fixedly connected to each other. The fixed connection method includes but is not limited to welding, hinged connection, etc.

[0055] A support structure 3 and a monitoring device 4 are disposed on the carrying end 12 . The support structure 3 protrudes relative to the upper surface of the carrying end 12 . The support structure 3 is used to carry a wafer.

[0056] The support structure 3 and the monitoring device 4 are both arranged on the upper surface of the carrier end 12. The upper surface of the carrier end 12 refers to the surface in the vertical direction, which can also be understood as the surface of the carrier end 12 close to the wafer. The upper surface of the carrier end 12 can also be called the front surface of the carrier end 12.

[0057] The number of support structures 3 can be one or more. In order to reduce contact with the wafer and reduce particle contamination of the wafer, the support structure 3 can be a support point. When the support structure 3 is a support point, the number of the support points is multiple, thereby ensuring effective support for the wafer and preventing the wafer from falling or flipping during transportation. Preferably, the number of support points is greater than or equal to 3.

[0058] It should also be noted that the contact position between the support structure and the wafer, as well as the position of the support structure on the carrier end can be adjusted to ensure stable support for the wafer while ensuring a small amount of particle contamination.

[0059] The distance that the support structure protrudes relative to the upper surface can be set according to the size of the support structure and the size of the wafer, which is not limited in this embodiment.

[0060] The monitoring device 4 is used to obtain the upload information of the wafer carried by the support structure 3 and determine whether the wafer is located on the support structure 3 according to the upload information.

[0061] Among them, the uploaded information can be understood as the indication information used to indicate that the wafer is located on the supporting structure after the support structure 3 supports the wafer. According to the uploaded information, it can be determined whether the wafer is always located on the supporting structure 3 during the transportation process, thereby realizing timely identification of wafer abnormalities (such as wafer falling) during the transportation process, avoiding the problem of wafer waste and the problem of no-load of wafer processing equipment.

[0062] In an optional embodiment, the monitoring device includes an image monitoring structure and / or a pressure sensing structure, wherein the image monitoring structure may be a camera sensor, and the pressure sensing structure may be a pressure sensing element (senor). In order to enable both the image monitoring structure and the pressure sensing structure to be disposed on the carrier end 12 without affecting the wafer transport, the image monitoring structure may be a miniature camera sensor, and the pressure sensing structure may be a miniature pressure sensing element.

[0063] The image monitoring structure is used to obtain an image of the wafer carried by the support structure, and determine whether the wafer is located on the support structure based on the image.

[0064] Optionally, when the image monitoring structure acquires the image of the wafer carried by the support structure 3, it may take an image once at a preset time interval, or it may continuously take images of the wafer after the wafer starts to be transported, thereby being able to monitor whether the wafer is always on the support structure 3 during the process of carrying the wafer by the support structure 3 and during the process of transporting the wafer, that is, whether the wafer falls or flips over. Specifically, when monitoring through the image of the wafer, the image of the carried wafer may be pre-saved as a standard image, and the standard image may be compared with the acquired image. If they are consistent, it indicates whether the wafer is always on the support structure 3. If they are inconsistent, it indicates that the wafer has fallen or flipped over.

[0065] The pressure sensing structure is connected to the supporting structure 3 , and is used to obtain the supporting force of the supporting structure 3 on the wafer, and determine whether the wafer is located on the supporting structure 3 according to the supporting force.

[0066] Specifically, when the support structure 3 does not support the wafer, the support force obtained by the pressure sensing structure is 0 or a minimum value. After the support structure 3 supports the wafer, the support force is greater than 0 or a preset value. By monitoring whether the support force is greater than 0 or remains at the preset value, it is possible to monitor whether the wafer is always located on the support structure 3 during the process of supporting the wafer by the support structure 3 and during the process of transporting the wafer, that is, whether the wafer falls or flips.

[0067] It can be understood that the monitoring device can determine whether the wafer is located on the support structure 3 based on the image of the wafer and the support force of the support structure on the wafer at the same time, and the monitoring effect is more effective and accurate.

[0068] In some embodiments, an external control device (or controller) is further provided, and the image monitoring structure is wirelessly connected to the control device, and / or the pressure sensing structure is wirelessly connected to the control device, the control device is used to obtain an image of the wafer and determine whether the wafer is always on the support structure by monitoring whether the image is an image of the wafer, and / or the control device is used to obtain the supporting force of the support structure on the wafer, and determine whether the supporting force is always greater than 0 or equal to a preset value, thereby determining whether the wafer is always on the support structure.

[0069] In some embodiments, the monitoring device is disposed on a moving track on the carrying end 12;

[0070] The image monitoring structure is arranged on the moving track, and the image monitoring structure can move on the moving track.

[0071] It should be noted that when the wafer is transported through the blade body 1 or the blade body 1 just receives the wafer, there may be a problem that the wafer is located on the bearing end of the blade body 1, but the wafer position is not correct (ie, not in the center).

[0072] By setting a movable track, the position of the image monitoring structure on the carrier end 12 can be adjusted. By taking images of the wafer at different positions, multiple images of different positions can be obtained (one position of the image monitoring structure corresponds to one or more images). If the multiple images all show that the wafer is located on the support structure, it is determined that the wafer position is correct (i.e., located in the center); otherwise, it is considered that the wafer position is incorrect.

[0073] In some embodiments, the carrying end 12 is formed in a circular shape, and the image monitoring structure and the pressure sensing structure are symmetrically arranged along the radial direction of the carrying end.

[0074] It should also be noted that the carrying end 12 may also be formed into a rectangle. In this case, the image monitoring structure and the pressure sensing structure are symmetrically arranged along any symmetry axis of the rectangle.

[0075] Through the symmetrical setting, image monitoring structure and pressure sensing structure, the wafer can be monitored more comprehensively at different positions, and the monitoring results are more accurate and timely.

[0076] In some embodiments, the load-bearing end 12 may further include an edge area and a center area, wherein the support structure 3 is located in the edge area.

[0077] The central area is recessed downward relative to the edge area. When the blade structure is used to transfer wafers grown in an epitaxial furnace, the temperature will change from a hot state to a cold state. Alternatively, when the blade structure is used to transfer wafers from outside a process chamber to inside a process chamber, the temperature will change from a cold state to a hot state. Therefore, by setting the central area, the distance between the back of the wafer and the blade body is increased. When the temperature changes during wafer transportation, more gas with temperature changes can be accommodated between the wafer and the carrier end 12, thereby ensuring the temperature uniformity of the front and back of the wafer as much as possible and reducing the deformation of the wafer.

[0078] The back side of the wafer is the side of the wafer in contact with the support structure 3 , and the front side of the wafer is the side opposite to the back side of the wafer.

[0079] It should be noted that the areas of the edge area and the central area can be set according to needs. Preferably, the area of ​​the central area designed in the load-bearing end 12 is as large as possible, for example, the area of ​​the central area occupies more than three quarters of the total area of ​​the load-bearing end.

[0080] In some embodiments, a through hole 121 is provided at the center of the carrier end 12. The through hole 121 is provided to dissipate heat. If the blade structure is used to transport wafers grown in an epitaxial furnace, the temperature will change from a hot state to a cold state, or if the blade structure is used to transport wafers from outside a process chamber to inside a process chamber, the temperature will change from a cold state to a hot state. Therefore, by providing the through hole 121, the contact area between the back side of the wafer and the temperature environment can be increased, so that the gas can flow faster, thereby ensuring the consistency of the temperature of the front and back sides of the wafer.

[0081] The back side of the wafer is the side of the wafer in contact with the support structure 3 , and the front side of the wafer is the side opposite to the back side of the wafer.

[0082] The shape and size of the through hole 121 are determined according to the shape and size of the load-bearing end 12 , and are not limited in this embodiment.

[0083] In some embodiments, the load-bearing end is formed into a rectangle, and the number of the supporting structures is multiple.

[0084] Preferably, the number of the support structures is an even number. The even number of support structures is evenly divided into two groups, and the two groups of support structures are respectively arranged on two opposite sides of the support structure, wherein one group of support mechanisms is arranged on each side.

[0085] By symmetrically distributing two groups of support structures, it is possible to ensure that the support structures stably support the wafers, thereby preventing the wafers from falling or flipping when transferring the wafers through the blade structure.

[0086] When the bearing end is rectangular, the shape of the central area can be designed as a rectangle, and the edge area can be a strip arranged outside the central area. When the bearing end is circular, the central area can also be set as a circle, and the edge area can be set as a ring arranged outside the central area.

[0087] When the load-bearing end is rectangular, the shape of the through hole can be designed to be rectangular. When the load-bearing end is circular, the shape of the through hole can be designed to be circular.

[0088] In some embodiments, the load-bearing end 12 is formed in a circular shape;

[0089] In order to ensure stable support for the wafer, the support structure 3 is disposed on the periphery of the carrying end 12 .

[0090] Preferably, the shortest distance between the edges of the load-bearing end 12 of the support structure 3 is a preset distance, and the preset distance may be a relatively small value, that is, the support structure 3 is designed to be as close to the outer edge of the load-bearing end 12 as possible.

[0091] There are multiple support structures 3, and the multiple support structures 3 are evenly arranged on the periphery of the bearing end, that is, the multiple support structures are evenly distributed along the circumference of the bearing end.

[0092] By arranging multiple support structures evenly distributed along the circumference of the carrier end, the stability of the wafer support can be ensured. Specifically, the angle formed between every two adjacent support structures and the center of the carrier end can be determined according to the number of support structures.

[0093] Exemplarily, four support structures are set, and the four support structures are evenly distributed in the circumference of the load-bearing end, and the angle formed between two adjacent support structures and the center of the load-bearing end is 90°. Another exemplary embodiment is that six support structures are set, and the six support structures are evenly distributed in the circumference of the load-bearing end, and the angle formed between two adjacent support structures and the center of the load-bearing end is 60°.

[0094] It should also be noted that the blade body can be designed to be circular, a small part of the circular blade body can be designed as a connecting end, and the remaining majority can be designed as a bearing end.

[0095] Preferably, the plurality of support structures are evenly distributed on the blade body, and a portion of the blade body between two adjacent support structures is selected as a connecting end, and the rest of the portions are all load-bearing ends.

[0096] In some embodiments, the area of ​​the bearing end 12 is greater than half of the area of ​​the blade body 1. That is, compared with the connecting end 11, the area of ​​the bearing end 12 is greater than that of the connecting end 11. This design can ensure stable bearing of the wafer.

[0097] It should also be noted that in order to adapt to changes in temperature environment and increase the contact area between the wafer surface and the environment, the area of ​​the supporting end 12 should be smaller than the area of ​​the wafer. However, in order to ensure stable support for the wafer, the area of ​​the supporting end 12 cannot be too small.

[0098] Preferably, the area of ​​the load-bearing end 12 is greater than three quarters of the area of ​​the blade body 1 .

[0099] It should be noted that since the support structure is in contact with the wafer, when the ambient temperature changes, the contact position will deform and rub against the support structure, resulting in particle contamination on the back of the wafer. Therefore, in order to reduce the generation of particle contamination, the number of support structures should be reduced. However, it is also necessary to ensure stable support for the wafer. Therefore, in some embodiments, the number of support structures 3 is three, and the three support structures 3 are evenly distributed on the supporting end 12.

[0100] Moreover, there is a risk of the contamination spreading to the front side of the wafer. Therefore, in order to avoid the risk of wafer particle contamination on the front side of the wafer, it should be ensured that the shortest distance between the support structure 3 and the edge of the wafer is not too short. Also, in order to ensure stable support for the wafer, the shortest distance between the support structure 3 and the edge of the wafer is not too long.

[0101] Preferably, the shortest distance between each of the supporting structures 3 and the edge of the wafer is 5 mm-15 mm.

[0102] In some embodiments, a pusher is further disposed on the carrying end 12 , and the pusher is used to push the wafer to a preset position.

[0103] When the wafer is carried by the blade structure, the wafer may be inappropriately positioned, causing the risk of the wafer falling or flipping. Therefore, a pushing structure is provided to push the wafer to a preset position to make the wafer as stable as possible.

[0104] It should be noted that a slot can be provided on the carrier end 12 for engaging with the edge of the wafer. When the pushing structure pushes the wafer until the slot engages with the edge of the wafer, it is determined that the wafer has reached the preset position.

[0105] Optionally, the pushing structure and the monitoring device 4 may be designed as an integrated structure, or an image monitoring structure and / or a pressure sensing structure may be provided on the pushing structure.

[0106] In some embodiments, a plurality of connection holes are provided on the connection end 11, through which the connection end 11 is movably connected to the wafer transfer device, or, through the connection holes, the connection end 11 is detachably connected to the wafer transfer device.

[0107] Exemplarily, the connection end is connected to the wafer transfer device by passing a bolt through the connection end.

[0108] In some embodiments, the blade body can be made of stainless steel. The connecting end and the bearing end made of stainless steel have a long service life, high strength, strong heat resistance, and are not easy to damage.

[0109] Specifically, the grade of the stainless steel material can be selected according to demand and is not limited in this embodiment.

[0110] In summary, the blade structure provided in the embodiment of the present invention reduces the contact area between the support structure and the wafer, reduces the contact position between the support structure and the wafer, reduces the particle contamination generated during the wafer transportation process, and improves the wafer quality by reducing the contact area between the support structure and the wafer, while satisfying the conditions of stable support and normal transportation of the wafer. And by adding an image monitoring structure and / or a pressure sensing structure, the uploaded information of the wafer is obtained, and the uploaded information is used to monitor whether the wafer is always on the support structure during the transportation process, thereby preventing the wafer from falling without being monitored, timely discovering the risk of wafer falling, and reducing losses.

[0111] like Figure 2 As shown, an embodiment of the present invention provides a wafer monitoring method, which is applied to the blade structure as described above, and the method includes:

[0112] Step 201: Obtaining the loading information of the wafer supported by the support structure.

[0113] The uploaded information may be understood as indication information used to indicate that the wafer is located on the supporting structure after the supporting structure 3 supports the wafer.

[0114] Step 201: Determine whether the wafer is located on the support structure according to the uploaded information.

[0115] In this step, based on the uploaded information, it can be determined whether the wafer has been located on the support structure 3 during the transportation process, thereby realizing timely identification of wafer abnormalities (such as wafer falling) during the transportation process, avoiding wafer waste and idle problems of wafer processing equipment.

[0116] It should be noted that the wafer monitoring method provided in the embodiment of the present invention is applied to the blade structure as described in any of the above items, and all embodiments of the above blade structure are applicable to the wafer monitoring method and can achieve the same or similar technical effects.

[0117] In some embodiments, obtaining the upload information of the wafer supported by the support structure includes at least one of the following:

[0118] Acquire an image of the wafer carried by the support structure through an image monitoring structure, wherein the image monitoring structure may be a camera sensor, and when acquiring the image of the wafer carried by the support structure, the image may be captured once at a preset time interval, or the image of the wafer may be continuously captured after the wafer starts to be transported;

[0119] Acquiring the supporting force of the supporting structure on the wafer through a pressure sensing structure, wherein the pressure sensing structure may be a pressure sensing element (senor);

[0120] Determining whether the wafer is located on the support structure according to the uploaded information includes at least one of the following:

[0121] Determine whether the wafer is located on the support structure according to the image. Specifically, an image of the supported wafer may be pre-saved as a standard image, and the standard image is compared with the acquired image. If they are consistent, it indicates whether the wafer is always located on the support structure. If they are inconsistent, it indicates that the wafer has fallen or flipped.

[0122] Whether the wafer is located on the supporting structure is determined based on the supporting force. Specifically, when the supporting structure does not support the wafer, the supporting force obtained by the pressure sensing structure is 0 or a minimum value. After the supporting structure supports the wafer, the supporting force is greater than 0 or a preset value. By monitoring whether the supporting force is greater than 0 or remains at the preset value, it is possible to monitor whether the wafer is always located on the supporting structure during the process of carrying the wafer by the supporting structure and during the transportation of the wafer, that is, whether the wafer falls or flips.

[0123] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A blade structure, It is characterized in that include: A blade body, the blade body comprising a connected connection end and a load-bearing end; The connection end is connected to a wafer transfer device, and the wafer transfer device is used to transfer wafers; A support structure and a monitoring device are arranged on the load-bearing end; Wherein, the support structure protrudes relative to the upper surface of the carrying end, and the support structure is used to carry one of the wafers; The monitoring device is used to obtain the upload information of the wafer carried by the support structure, and determine whether the wafer is located on the support structure according to the upload information.

2. The blade structure according to claim 1, It is characterized in that The monitoring device includes an image monitoring structure and / or a pressure sensing structure; The image monitoring structure is used to obtain an image of the wafer carried by the support structure, and determine whether the wafer is located on the support structure according to the image; The pressure sensing structure is connected to the supporting structure, and is used to obtain the supporting force of the supporting structure on the wafer, and determine whether the wafer is located on the supporting structure according to the supporting force.

3. The blade structure according to claim 2, It is characterized in that The monitoring device is arranged on a movable track on the carrying end; The image monitoring structure is arranged on the moving track, and the image monitoring structure can move on the moving track.

4. The blade structure according to claim 2, It is characterized in that It also includes external control equipment; The image monitoring structure is wirelessly connected to the control device; and / or, The pressure sensing structure is wirelessly connected to the control device.

5. The blade structure according to claim 2, It is characterized in that The bearing end is formed in a circular shape, and the image monitoring structure and the pressure sensing structure are symmetrically arranged along the radial direction of the bearing end.

6. The blade structure according to claim 1, It is characterized in that A through hole is provided at the center of the bearing end.

7. The blade structure according to claim 1, It is characterized in that The area of ​​the load-bearing end is greater than half of the area of ​​the blade body.

8. The blade structure according to claim 1, It is characterized in that The load-bearing end is formed into a circular shape; The supporting structure is arranged on the outer periphery of the bearing end.

9. The blade structure according to claim 1, It is characterized in that A pushing structure is also provided on the carrying end, and the pushing structure is used to push the wafer to a preset position.

10. The blade structure according to claim 1, It is characterized in that The blade body is made by an integrated molding process.

11. A wafer monitoring method, It is characterized in that Applied to the blade structure according to any one of claims 1 to 10, the method comprises: Obtaining upload information of a wafer carried by a support structure; It is determined whether the wafer is located on the support structure according to the uploaded information.

12. The method according to claim 11, It is characterized in that Obtaining the loading information of the wafer carried by the support structure, including at least one of the following: Acquiring an image of the wafer carried by the support structure through an image monitoring structure; Acquiring the supporting force of the supporting structure on the wafer through a pressure sensing structure; Determining whether the wafer is located on the support structure according to the uploaded information includes at least one of the following: determining whether the wafer is located on the support structure according to the image; Whether the wafer is located on the support structure is determined according to the support force.

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