Batch traceless conveying equipment and conveying method for silicon wafers

Abstract

The invention belongs to the field of traceless conveying of silicon wafers, and particularly provides a batch traceless conveying device and method for the silicon wafers, and the batch traceless conveying device for the silicon wafers comprises a feeding frame, a single-wafer traceless conveying mechanism, a feeding mechanism and a batch traceless conveying mechanism. By arranging the single-wafer traceless conveying mechanism, the feeding mechanism and the batch traceless conveying mechanism, traceless material taking, single-wafer conveying, batch material taking and batch conveying in the silicon wafer conveying process are achieved, meanwhile, batch conveying is adopted, during machining, a carrier plate is conveyed into the machining mechanism, batch machining is conducted on the silicon wafers on the carrier plate, and the machining efficiency is improved. After the processing is finished, the carrier plate is taken out from the processing mechanism, and the next carrier plate is conveyed to the processing mechanism, so that the silicon wafer feeding time is shortened, the processing efficiency of the processing mechanism is improved, meanwhile, the circulation of the carrier plates is completed when the empty carrier plates are put into the batch traceless conveying mechanism, the use number of the carrier plates is reduced, and the production cost is reduced. And the cost of the whole production line is reduced.

Description

Technical Field

[0001] The invention relates to the field of traceless conveying of silicon wafers, and in particular to batch traceless conveying equipment and a conveying method for silicon wafers. Background Art

[0002] Silicon wafers are basic materials in the semiconductor industry and the solar photovoltaic industry, and are mainly used to manufacture electronic devices and solar cells.

[0003] In the related art, when silicon wafers are processed in batches, they are generally transported by conveyor belts. The silicon wafers are placed on the conveyor belts and are transported by the friction of the conveyor belts. Belt conveyance marks are easily found on the lower ends of the silicon wafers, causing scratches and contamination of the silicon wafers. Severe scratches may reduce the photoelectric conversion efficiency of the subsequently prepared battery cells, resulting in the scrapping or rework of the battery cells, increasing production costs, affecting the reliability and stability of the later operation of the photovoltaic modules, and increasing the failure rate.

[0004] At the same time, they are all transported to external processing mechanisms for processing in a single-wafer transport mode. When the silicon wafers in the processing mechanism reach a preset number, the transport is stopped and the next transport is carried out after the processing mechanism has completed the processing. This results in a long loading time and reduces the working efficiency of the processing mechanism.

[0005] How to reduce scratches while ensuring silicon wafer loading efficiency is an urgent issue to be solved. Summary of the invention

[0006] The purpose of the present invention is to provide a batch traceless conveying device and a conveying method for silicon wafers.

[0007] In order to solve the above technical problems, the present invention provides a batch traceless conveying device for silicon wafers, comprising: Loading rack, single piece seamless conveying mechanism, loading mechanism and batch seamless conveying mechanism; The loading rack is arranged at the feeding port of the single-piece traceless conveying mechanism; The single wafer traceless conveying mechanism is suitable for taking the silicon wafers from the loading rack and then conveying them tracelessly; The batch seamless conveying mechanism is arranged on the side of the discharge section of the single piece seamless conveying mechanism; The loading mechanism is arranged above the single-wafer seamless conveying mechanism and the batch seamless conveying mechanism, and is suitable for grabbing the silicon wafers conveyed by the single-wafer seamless conveying mechanism in batches onto the carrier conveyed by the batch seamless conveying mechanism; The batch seamless conveying mechanism is suitable for conveying carrier plates.

[0008] Furthermore, the single-piece traceless conveying mechanism comprises: a traceless material taking component, a conveying frame, a driving component and at least one conveying component; The conveying assembly is rotatably arranged on the conveying frame; The driving component is suitable for driving the conveying component to convey the silicon wafer; The conveying assembly includes at least two conveyor belts; Each of the conveyor belts is provided with a plurality of traceless conveying stations; Each of the seamless conveying stations includes two seamless supporting platforms; The two traceless support platforms are spaced apart and fixedly arranged on the conveyor belt; The traceless material taking component is arranged on the side of the feeding end of the conveying rack, and is suitable for taking silicon wafers from the loading rack and placing them on the conveying component for conveying.

[0009] Furthermore, the traceless material taking component comprises: a horizontal moving part, a grabbing driving part and a traceless film taking tray; The grabbing driving part is slidably arranged on the horizontal moving part; The traceless film taking tray is slidably arranged on the grabbing driving part; The horizontal moving part is suitable for driving the grab driving part to reciprocate in the horizontal direction; The grabbing driving part is suitable for driving the connecting seat to move back and forth in a vertical direction.

[0010] Furthermore, the traceless film-taking tray comprises: a connecting seat and a tray body; The tray body is fixedly connected to the connecting seat; The tray body is provided with a plurality of traceless support platforms; A plurality of the traceless support platforms are fixedly arranged on the tray body and enclose a supporting area.

[0011] Furthermore, the traceless support platform includes: a top surface, a bottom surface, a support surface and three side surfaces; The top surface is arranged opposite to the bottom surface; The three side surfaces and the support surface enclose a side wall of a seamless support platform; The supporting surface is arranged opposite to the side wall of the silicon wafer to be supported.

[0012] Furthermore, the traceless supporting platform is provided with an inclined supporting surface; The two supporting surfaces of the two traceless supporting platforms in each traceless conveying station are arranged opposite to each other and respectively abut against the two opposite side walls of the silicon wafer to complete the initial positioning of the silicon wafer.

[0013] Furthermore, the traceless conveying station further includes at least one supporting platform; The support platform is fixedly arranged on the conveyor belt and is arranged between two seamless supporting platforms in the seamless conveying station.

[0014] Furthermore, the batch seamless conveying mechanism comprises: a first conveying line, a second conveying line and a lifting assembly; The first conveying line and the second conveying line are arranged in a stacked manner; The first conveying line is arranged above the second conveying line; The lifting assembly is suitable for conveying the empty carrier plates conveyed in the second conveying line to the first conveying line.

[0015] Furthermore, the carrier plate is provided with a plurality of supporting stations; The plurality of supporting stations are spaced apart and distributed along the length and width direction of the carrier plate; The side wall of the supporting station is provided with a limited prism; At least one supporting ramp is arranged on the top surface of the limiting prism.

[0016] The present invention also provides a method for conveying silicon wafers using the batch traceless conveying device as described above, the method comprising: Control the single wafer seamless conveying mechanism to take the silicon wafers from the loading rack and then convey them seamlessly; The loading mechanism is driven to grab the silicon wafers transported by the single-wafer seamless conveying mechanism in batches onto the carrier plate transported by the batch seamless conveying mechanism; The seamless conveying mechanism transports the carrier filled with silicon wafers out.

[0017] The beneficial effect of the present invention is that the present invention provides a batch seamless conveying equipment and a conveying method for silicon wafers, wherein the batch seamless conveying equipment for silicon wafers comprises: a loading rack, a single-wafer seamless conveying mechanism, a loading mechanism and a batch seamless conveying mechanism; the loading rack is arranged at the feeding port of the single-wafer seamless conveying mechanism; the single-wafer seamless conveying mechanism is suitable for taking the silicon wafers on the loading rack and then conveying them seamlessly; the batch seamless conveying mechanism is arranged on the side of the discharge section of the single-wafer seamless conveying mechanism; the loading mechanism is arranged above the single-wafer seamless conveying mechanism and the batch seamless conveying mechanism, and is suitable for grabbing the silicon wafers conveyed by the single-wafer seamless conveying mechanism in batches onto the carrier conveyed by the batch seamless conveying mechanism; the batch seamless conveying mechanism is suitable for conveying the carrier. By setting up a single-wafer seamless conveying mechanism, a loading mechanism and a batch seamless conveying mechanism, the material taking, single-wafer conveying, batch taking and batch conveying in silicon wafer conveying are all achieved without traces. At the same time, batch conveying is adopted. During processing, the carrier is conveyed to the processing mechanism, and the silicon wafers on the carrier are processed in batches. After the processing is completed, the carrier is taken out of the processing mechanism, and the next carrier is conveyed to the processing mechanism, thereby reducing the time for loading silicon wafers and improving the processing efficiency of the processing mechanism. At the same time, the empty carrier is placed in the batch seamless conveying mechanism to complete the circulation of the carrier, reducing the number of carriers used, thereby reducing the cost of the overall production line. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0019] Figure 1 It is a schematic diagram of the structure of a batch traceless conveying device for silicon wafers provided in an embodiment of the present invention.

[0020] Figure 2 It is a structural schematic diagram of a single-piece seamless conveying mechanism provided in an embodiment of the present invention.

[0021] Figure 3 It is a partial structural schematic diagram of a single-sheet traceless conveying mechanism provided in an embodiment of the present invention.

[0022] Figure 4 It is a structural schematic diagram of a positioning block provided in an embodiment of the present invention.

[0023] Figure 5 It is a structural schematic diagram of another part of the single-sheet traceless conveying mechanism provided in an embodiment of the present invention.

[0024] Figure 6 It is a schematic structural diagram of a traceless material taking assembly provided in an embodiment of the present invention.

[0025] Figure 7 It is a schematic structural diagram of a traceless film removal tray provided in an embodiment of the present invention.

[0026] Figure 8 It is a side view of the traceless film extraction tray provided by an embodiment of the present invention.

[0027] Fig. 9 It is a partial structural schematic diagram of a batch traceless conveying device for silicon wafers provided in an embodiment of the present invention.

[0028] Fig.10 It is a side view of a partial structure of a batch seamless conveying device for silicon wafers provided in an embodiment of the present invention.

[0029] Fig.11 It is a schematic diagram of the structure of a carrier board provided in an embodiment of the present invention.

[0030] In the figure: 100, loading rack; 200, single-piece traceless conveying mechanism; 210, traceless material taking assembly; 211, horizontal moving part; 212, grab driving part; 2121, sliding plate; 2122, rotating motor; 2123, eccentric wheel; 2124, connecting plate; 2125, sliding block; 213, traceless sheet taking tray; 2131, connecting seat; 2132, tray body; 2132a, first material taking plate; 2132b, second material taking plate; 2133, traceless support platform; 2133a, guide section; 2133b, support section; 2134, support block; 220, conveying rack; 230 , driving assembly; 240, conveying assembly; 241, conveyor belt; 242, seamless supporting platform; 2421, supporting surface; 2422, guide block; 243, supporting platform; 250, lifting and positioning assembly; 251, lifting cylinder; 252, lifting plate; 253, positioning block; 260, buffer assembly; 300, feeding mechanism; 400, batch seamless conveying mechanism; 410, first conveyor line; 420, second conveyor line; 430, lifting assembly; 431, lifting frame; 432, transfer and conveying part; 500, carrier plate; 510, supporting station; 520, limiting prism; 530, supporting inclined platform. DETAILED DESCRIPTION

[0031] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0032] See also Figure 1At least one embodiment provides a batch seamless conveying device for silicon wafers, comprising: a loading rack 100, a single-wafer seamless conveying mechanism 200, a loading mechanism 300 and a batch seamless conveying mechanism 400; the loading rack 100 is arranged at the feeding port of the single-wafer seamless conveying mechanism 200; the single-wafer seamless conveying mechanism 200 is suitable for taking the silicon wafers on the loading rack 100 and then seamlessly conveying them; the batch seamless conveying mechanism 400 is arranged on the side of the discharge section of the single-wafer seamless conveying mechanism 200; the loading mechanism 300 is arranged above the single-wafer seamless conveying mechanism 200 and the batch seamless conveying mechanism 400, and is suitable for grabbing the silicon wafers conveyed by the single-wafer seamless conveying mechanism 200 in batches onto the carrier 500 conveyed by the batch seamless conveying mechanism 400; the batch seamless conveying mechanism 400 is suitable for conveying the carrier 500. By setting up a single-wafer seamless conveying mechanism 200, a loading mechanism 300 and a batch seamless conveying mechanism 400, the material taking, single-wafer conveying, batch taking and batch conveying in silicon wafer conveying are all achieved without traces. At the same time, batch conveying is adopted. During processing, the carrier 500 is conveyed to the processing mechanism, and the silicon wafers on the carrier 500 are processed in batches. After the processing is completed, the carrier 500 is taken out of the processing mechanism, and the next carrier 500 is conveyed to the processing mechanism, thereby reducing the time for loading silicon wafers and improving the processing efficiency of the processing mechanism. At the same time, the empty carrier 500 is placed in the batch seamless conveying mechanism 400 to complete the circulation of the carrier 500, thereby reducing the number of carriers 500 used, thereby reducing the cost of the overall production line.

[0033] See also Figure 2 and Figure 3 The structure of the single-wafer seamless conveying mechanism 200 is described below. The single-wafer seamless conveying mechanism 200 includes: a seamless material collection component 210, a conveying frame 220, a driving component 230 and at least one conveying component 240; the conveying component 240 is rotatably arranged on the conveying frame 220; the driving component 230 is suitable for driving the conveying component 240 to convey silicon wafers; the conveying component 240 includes at least two conveyor belts 241; each of the conveyor belts 241 is provided with a plurality of seamless conveying stations; each of the seamless conveying stations includes two seamless supporting platforms 242; the two seamless supporting platforms 242 are arranged at intervals and fixedly arranged on the conveyor belt 241; the seamless material collection component 210 is arranged on the side of the feeding end of the conveying frame 220, and is suitable for taking silicon wafers from the loading rack 100 and placing them on the conveying component 240 for conveying. By arranging a traceless support platform 242 on the conveyor belt 241, direct contact between the silicon wafer and the conveyor belt 241 is avoided, thereby preventing the conveyor belt 241 from scratching the silicon wafer, thereby achieving traceless transportation.

[0034] See also Figure 3Specifically, in some embodiments, the traceless support platform 242 is provided with an inclined support surface 2421; the two support surfaces 2421 of the two traceless support platforms 242 in each traceless conveying station are arranged opposite to each other and respectively abut against the two opposite side walls of the silicon wafer to complete the initial positioning of the silicon wafer. By setting the support surface 2421 to be inclined, when the silicon wafer falls into the traceless conveying station, it can slide down along the support surface 2421, thereby ensuring that the silicon wafer falls into the preset position of the traceless conveying station and completes the initial positioning.

[0035] In at least one embodiment, in order to further ensure that the silicon wafer falls into the seamless conveying station, a guide block 2422 is fixedly provided on the top surface of the seamless support platform 242 to guide the falling position of the silicon wafer, thereby reducing the precision requirement for the placement of the silicon wafer.

[0036] The adjacent sides of two adjacent traceless conveying stations share the same traceless supporting platform 242 , that is, the two adjacent traceless conveying stations include three traceless supporting platforms 242 .

[0037] Please continue reading Figure 3 In order to prevent the middle of the silicon wafer from bending, in some embodiments, the seamless conveying station further includes at least one support platform 243; the support platform 243 is fixedly disposed on the conveyor belt 241 and disposed between the two seamless support platforms 242 in the seamless conveying station. The support platform 243 supports the middle of the silicon wafer to prevent the silicon wafer from bending and reduce the probability of damage to the silicon wafer.

[0038] Please continue reading Figure 3 In order to ensure the accuracy of subsequent material retrieval, in the present embodiment, the discharge section of the conveyor rack 220 is provided with at least one lifting and positioning assembly 250; the lifting and positioning assembly 250 is fixedly arranged on the side wall of the conveyor rack 220, and the lifting and positioning assembly 250 is arranged below the conveyor belt 241; the lifting and positioning assembly 250 is suitable for lifting and positioning the silicon wafer on the seamless conveying station after the seamless conveying station moves to above the lifting and positioning assembly 250.

[0039] Specifically, the lifting and positioning assembly 250 includes: a lifting cylinder 251, a lifting plate 252 and at least one group of positioning blocks 253; one group of the positioning blocks 253 includes two positioning blocks 253; the lifting cylinder 251 is fixedly arranged on the side of the conveying rack 220; the lifting plate 252 is arranged under the conveying assembly 240 and is fixedly connected to the lifting cylinder 251; the lifting cylinder 251 is suitable for driving the lifting plate 252 to rise or fall; the two positioning blocks 253 in each group of the positioning blocks 253 are respectively arranged on both sides of the conveying assembly 240, and are suitable for abutting against the other two opposite side walls of the silicon wafer when the lifting plate 252 rises, thereby completing the secondary positioning of the silicon wafer.

[0040] See also Figure 4 , wherein the positioning block 253 is provided with a first guiding surface to guide the offset silicon wafer.

[0041] See also Figure 2 and Figure 5 In order to ensure that the traceless conveying device will not be interrupted when conveying silicon wafers, in this embodiment, the traceless conveying device also includes a cache component 260; the cache component 260 is arranged in the middle section of the conveying component 240 and above the conveyor belt 241, and is suitable for caching the silicon wafers conveyed on the conveying component 240.

[0042] See also Figure 6 , the structure of the traceless material collection component 210 is described below, and the traceless material collection component 210 includes: a horizontal moving part 211, a grabbing driving part 212 and a traceless film collection tray 213; the grabbing driving part 212 is slidably arranged on the horizontal moving part 211; the traceless film collection tray 213 is slidably arranged on the grabbing driving part 212; the horizontal moving part 211 is suitable for driving the grabbing driving part 212 to reciprocate in the horizontal direction; the grabbing driving part 212 is suitable for driving the connecting seat 2131 to reciprocate in the vertical direction.

[0043] Please continue reading Figure 6, wherein the grab driving part 212 comprises a sliding plate 2121, a rotating motor 2122, an eccentric wheel 2123, a connecting plate 2124 and a sliding block 2125; the sliding plate 2121 is slidably arranged on the horizontal moving part 211, and is suitable for reciprocating in the horizontal direction under the drive of the horizontal moving part 211. The rotating motor 2122 is fixedly arranged on the sliding plate 2121, the eccentric wheel 2123 is fixedly connected to the rotor of the rotating motor 2122, the sliding block 2125 is slidably arranged on the sliding plate 2121, and slides in the vertical direction, one end of the connecting plate 2124 is rotationally connected to the eccentric wheel 2123, and the other end is rotationally connected to the sliding block 2125, and when the rotating motor 2122 rotates, it drives the sliding block 2125 to reciprocate in the vertical direction at a variable speed.

[0044] Since the connecting seat 2131 is fixed on the sliding block 2125, when the horizontal moving part 211 reciprocates in the horizontal direction at a uniform speed and the sliding block 2125 reciprocates in the vertical direction at a variable speed, the connecting seat 2131 is driven to make an elliptical motion, thereby completing the material taking and discharging.

[0045] See also Figure 7 In at least one embodiment, the traceless wafer taking tray 213 includes: a connection seat 2131 and a tray body 2132; the tray body 2132 is fixedly connected to the connection seat 2131; a plurality of traceless support platforms 2133 are arranged on the tray body 2132; a plurality of traceless support platforms 2133 are fixedly arranged on the tray body 2132 and enclose a supporting area. By planning the movement trajectory of the traceless wafer taking tray 213, when taking the material, the supporting area of ​​the traceless wafer taking tray 213 is just located below the silicon wafer, and the traceless wafer taking tray 213 takes out the silicon wafer when moving upward, realizing traceless wafer taking, without applying pressure on the silicon wafer, and avoiding scratches on the silicon wafer.

[0046] Among them, the seamless support platform 2133 includes: a top surface, a bottom surface, a support surface and three side surfaces; the top surface is arranged opposite to the bottom surface; the three side surfaces and the support surface enclose the side wall of the seamless support platform 2133; the support surface is arranged opposite to the side wall of the silicon wafer to be supported.

[0047] When taking the wafer, the side wall of the silicon wafer overlaps with the supporting surface, which not only fixes the silicon wafer but also reduces the probability of scratching the silicon wafer.

[0048] In order to facilitate the removal of the silicon wafer, in this embodiment, the support surface is arranged to be inclined. When the wafer is removed, the silicon wafer is guided by the support surface to ensure that the silicon wafer falls into the support area.

[0049] At the same time, in order to prevent the silicon wafer from being scratched when it slides down on the support surface, in this embodiment, a flexible buffer layer is provided on the support surface. By providing the flexible buffer layer, the silicon wafer is buffered and supported when it slides down, thereby preventing the silicon wafer from being scratched when it contacts the support surface.

[0050] See also Figure 7 as well as Figure 8 In a preferred embodiment, the support surface includes a guide section 2133a and a support section 2133b; the slope of the guide section 2133a is greater than the slope of the support section 2133b. Since the slope of the guide section 2133a is greater than the slope of the support section 2133b, when taking out the wafer, the guide section 2133a can be used to quickly guide the silicon wafer, and when support is needed, the slope is reduced, thereby reducing the impact force on the silicon wafer, thereby completing the seamless wafer taking.

[0051] See also Figure 7 , the structure of the connection seat 2131 is described below. In some embodiments, the connection seat 2131 is U-shaped; the tray body 2132 includes a first material picking plate 2132a and a second material picking plate 2132b; the first material picking plate 2132a and the second material picking plate 2132b are arranged in parallel and are fixedly connected to the two top surfaces of the connection seat 2131; the traceless support platform 2133 is divided into two groups, which are respectively fixed on the first material picking plate 2132a and the second material picking plate 2132b. The connection seat 2131 is designed to be U-shaped to avoid interference with material picking and placing.

[0052] In this embodiment, each group of the non-marking support platforms 2133 includes two non-marking support platforms 2133 that are arranged opposite to each other; the minimum distance between the two non-marking support platforms 2133 that are arranged opposite to each other is less than the length of the silicon wafer to be supported; and the maximum distance between the two non-marking support platforms 2133 that are arranged opposite to each other is greater than the length of the silicon wafer to be supported. By controlling the distance between the two non-marking support platforms 2133 that are arranged opposite to each other, the silicon wafer can fall into the two non-marking support platforms 2133 that are arranged opposite to each other. At the same time, the support surface can reduce the demand for material picking accuracy, and the support surface can adaptively adjust the position of the silicon wafer so that it can be fixed at a fixed position in the support area.

[0053] See also Figure 8 Since the silicon wafer is relatively long, in order to prevent the silicon wafer from bending, in this embodiment, at least one support block 2134 is respectively provided on the first pick-up plate 2132a and the second pick-up plate 2132b; the support platform 243 is provided between two corresponding, relatively arranged, non-marking support platforms 2133. The support platform 243 supports the middle part of the silicon wafer, thereby reducing the bending degree of the silicon wafer and avoiding damage to the silicon wafer.

[0054] At the same time, in order to prevent the silicon wafer from being damaged by hard contact with the top surface of the support platform 243 when the silicon wafer falls into the support area, in this embodiment, a rubber layer is provided on the top of the support platform 243. The rubber layer cushions the silicon wafer and reduces the probability of damage to the silicon wafer.

[0055] See also Fig. 9 as well as Fig.10 The structure of the batch seamless conveying mechanism 400 is described below. In some embodiments, the batch seamless conveying mechanism 400 includes: a first conveying line 410, a second conveying line 420, and a lifting assembly 430; the first conveying line 410 and the second conveying line 420 are stacked; the first conveying line 410 is arranged above the second conveying line 420, and the lifting assembly 430 is suitable for conveying the empty carrier 500 conveyed in the second conveying line 420 to the first conveying line 410. By dividing the batch seamless conveying mechanism 400 into the first conveying line 410 and the second conveying line 420, it is avoided that when the empty carrier 500 is placed in the batch seamless conveying mechanism 400, it interferes with the carrier 500 being loaded with silicon wafers. At the same time, the first conveying line 410 and the second conveying line 420 are stacked to reduce the occupied space of the batch seamless conveying mechanism 400, making the batch seamless conveying mechanism 400 more compact. By providing a lifting assembly 430, the empty carrier plate 500 conveyed in the second conveying line 420 is conveyed to the first conveying line 410, and the loading of the carrier plate 500 is completed, so as to facilitate the subsequent loading of silicon wafers.

[0056] The specific structure of the lifting assembly 430 is described below. In a preferred embodiment, the lifting assembly 430 includes: a lifting frame 431 and a transfer conveying part 432; the transfer conveying part 432 is arranged on the lifting frame 431; the lifting frame 431 is suitable for driving the transfer conveying part 432 to be lifted and lowered, so as to convey the empty carrier 500 conveyed by the second conveying line 420 to the first conveying line 410. Specifically, the lifting frame 431 is arranged below the silicon wafer conveying mechanism. By lifting and lowering the entire transfer conveying part 432 and controlling the conveying direction of the transfer conveying part 432, the circulation of the carrier 500 is realized.

[0057] See also Fig.11 In some embodiments, the carrier 500 is provided with a plurality of supporting stations 510; the plurality of supporting stations 510 are spaced apart along the length and width of the carrier 500. The supporting stations 510 are hollowed out, and the side walls of the supporting stations 510 are provided with a limiting prism 520; at least one supporting ramp 530 is provided on the top surface of the limiting prism 520. The side walls of the silicon wafer are supported by the supporting ramp 530, thereby reducing the contact between the bottom surface of the silicon wafer and the carrier 500 and reducing scratches on the silicon wafer.

[0058] At least one embodiment also provides a conveying method for the batch seamless conveying equipment for silicon wafers as described above, the method comprising: controlling the single-wafer seamless conveying mechanism 200 to take the silicon wafers from the loading rack 100 and then convey them seamlessly; driving the loading mechanism 300 to grab the silicon wafers conveyed by the single-wafer seamless conveying mechanism 200 in batches to the carrier 500 conveyed by the batch seamless conveying mechanism 400; and the seamless conveying mechanism transports the carrier 500 filled with silicon wafers out.

[0059] By setting up a single-wafer seamless conveying mechanism 200, a loading mechanism 300 and a batch seamless conveying mechanism 400, the material taking, single-wafer conveying, batch taking and batch conveying in silicon wafer conveying are all achieved without traces. At the same time, batch conveying is adopted. During processing, the carrier 500 is conveyed to the processing mechanism, and the silicon wafers on the carrier 500 are processed in batches. After the processing is completed, the carrier 500 is taken out of the processing mechanism, and the next carrier 500 is conveyed to the processing mechanism, thereby reducing the time for loading silicon wafers and improving the processing efficiency of the processing mechanism. At the same time, the empty carrier 500 is placed in the batch seamless conveying mechanism 400 to complete the circulation of the carrier 500, thereby reducing the number of carriers 500 used, thereby reducing the cost of the overall production line.

[0060] In summary, the present invention provides a batch seamless conveying equipment and a conveying method for silicon wafers, wherein the batch seamless conveying equipment for silicon wafers comprises: a loading rack 100, a single-wafer seamless conveying mechanism 200, a loading mechanism 300 and a batch seamless conveying mechanism 400; the loading rack 100 is arranged at the feeding port of the single-wafer seamless conveying mechanism 200; the single-wafer seamless conveying mechanism 200 is suitable for seamlessly conveying the silicon wafers after taking them from the loading rack 100; the batch seamless conveying mechanism 400 is arranged on the side of the discharge section of the single-wafer seamless conveying mechanism 200; the loading mechanism 300 is arranged above the single-wafer seamless conveying mechanism 200 and the batch seamless conveying mechanism 400, and is suitable for grabbing the silicon wafers conveyed by the single-wafer seamless conveying mechanism 200 in batches onto the carrier 500 conveyed by the batch seamless conveying mechanism 400; the batch seamless conveying mechanism 400 is suitable for conveying the carrier 500. By setting up a single-wafer seamless conveying mechanism 200, a loading mechanism 300 and a batch seamless conveying mechanism 400, the material taking, single-wafer conveying, batch taking and batch conveying in silicon wafer conveying are all achieved without traces. At the same time, batch conveying is adopted. During processing, the carrier 500 is conveyed to the processing mechanism, and the silicon wafers on the carrier 500 are processed in batches. After the processing is completed, the carrier 500 is taken out of the processing mechanism, and the next carrier 500 is conveyed to the processing mechanism, thereby reducing the time for loading silicon wafers and improving the processing efficiency of the processing mechanism. At the same time, the empty carrier 500 is placed in the batch seamless conveying mechanism 400 to complete the circulation of the carrier 500, thereby reducing the number of carriers 500 used, thereby reducing the cost of the overall production line. In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0061] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0062] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A batch traceless conveying device for silicon wafers, It is characterized in that include: Loading rack, single piece seamless conveying mechanism, loading mechanism and batch seamless conveying mechanism; The loading rack is arranged at the feeding port of the single-piece traceless conveying mechanism; The single wafer traceless conveying mechanism is suitable for taking the silicon wafers from the loading rack and then conveying them tracelessly; The batch seamless conveying mechanism is arranged on the side of the discharge section of the single piece seamless conveying mechanism; The loading mechanism is arranged above the single-wafer seamless conveying mechanism and the batch seamless conveying mechanism, and is suitable for grabbing the silicon wafers conveyed by the single-wafer seamless conveying mechanism in batches onto the carrier conveyed by the batch seamless conveying mechanism; The batch seamless conveying mechanism is suitable for conveying carrier plates.

2. The silicon wafer batch seamless conveying device according to claim 1, It is characterized in that The single-piece traceless conveying mechanism comprises: a traceless material taking component, a conveying frame, a driving component and at least one conveying component; The conveying assembly is rotatably arranged on the conveying frame; The driving component is suitable for driving the conveying component to convey the silicon wafer; The conveying assembly includes at least two conveyor belts; Each of the conveyor belts is provided with a plurality of traceless conveying stations; Each of the seamless conveying stations includes two seamless supporting platforms; The two traceless support platforms are spaced apart and fixedly arranged on the conveyor belt; The traceless material taking component is arranged on the side of the feeding end of the conveying rack, and is suitable for taking silicon wafers from the loading rack and placing them on the conveying component for conveying.

3. The silicon wafer batch seamless conveying device according to claim 2, It is characterized in that The traceless material taking component comprises: a horizontal moving part, a grabbing driving part and a traceless film taking tray; The grabbing driving part is slidably arranged on the horizontal moving part; The traceless film-taking tray is slidably arranged on the grabbing driving part; The horizontal moving part is suitable for driving the grab driving part to reciprocate in the horizontal direction; The grabbing driving part is suitable for driving the connecting seat to move back and forth in a vertical direction.

4. The silicon wafer batch seamless conveying device according to claim 3, It is characterized in that The traceless film-taking tray comprises: a connecting seat and a tray body; The tray body is fixedly connected to the connecting seat; The tray body is provided with a plurality of traceless support platforms; A plurality of the traceless support platforms are fixedly arranged on the tray body and enclose a supporting area.

5. The silicon wafer batch seamless conveying device according to claim 4, It is characterized in that The traceless support platform comprises: a top surface, a bottom surface, a support surface and three side surfaces; The top surface is arranged opposite to the bottom surface; The three side surfaces and the support surface enclose a side wall of a seamless support platform; The supporting surface is arranged opposite to the side wall of the silicon wafer to be supported.

6. The silicon wafer batch seamless conveying device according to claim 2, It is characterized in that The traceless supporting platform is provided with an inclined supporting surface; The two supporting surfaces of the two traceless supporting platforms in each traceless conveying station are arranged opposite to each other and respectively abut against the two opposite side walls of the silicon wafer to complete the initial positioning of the silicon wafer.

7. The silicon wafer batch seamless conveying device according to claim 6, It is characterized in that The traceless conveying station also includes at least one support platform; The support platform is fixedly arranged on the conveyor belt and is arranged between two seamless supporting platforms in the seamless conveying station.

8. The silicon wafer batch seamless conveying device according to claim 1, It is characterized in that The batch seamless conveying mechanism comprises: a first conveying line, a second conveying line and a lifting assembly; The first conveying line and the second conveying line are arranged in a stacked manner; The first conveying line is arranged above the second conveying line; The lifting assembly is suitable for conveying the empty carrier plates conveyed in the second conveying line to the first conveying line.

9. The silicon wafer batch seamless conveying device according to claim 8, It is characterized in that The carrier plate is provided with a plurality of supporting stations; The plurality of supporting stations are spaced apart and distributed along the length and width direction of the carrier plate; The side wall of the supporting station is provided with a limited prism; At least one supporting ramp is arranged on the top surface of the limiting prism.

10. A method for conveying silicon wafers using a batch seamless conveying device as claimed in any one of claims 1 to 9, It is characterized in that The method comprises: Control the single wafer seamless conveying mechanism to take the silicon wafers from the loading rack and then convey them seamlessly; The loading mechanism is driven to grab the silicon wafers transported by the single-wafer seamless conveying mechanism in batches onto the carrier plate transported by the batch seamless conveying mechanism; The seamless conveying mechanism transports the carrier filled with silicon wafers out.

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