The invention belongs to the field of traceless conveying of
silicon wafers, and particularly provides a batch traceless conveying device and method for the
silicon wafers, and the batch traceless conveying device for the
silicon wafers comprises a feeding frame, a single-
wafer traceless conveying mechanism, a feeding mechanism and a batch traceless conveying mechanism. By arranging the single-
wafer traceless conveying mechanism, the feeding mechanism and the batch traceless conveying mechanism, traceless material taking, single-
wafer conveying, batch material taking and batch conveying in the silicon wafer conveying process are achieved, meanwhile, batch conveying is adopted, during
machining, a carrier plate is conveyed into the
machining mechanism, batch
machining is conducted on the silicon wafers on the carrier plate, and the machining efficiency is improved. After the
processing is finished, the carrier plate is taken out from the
processing mechanism, and the next carrier plate is conveyed to the
processing mechanism, so that the silicon wafer feeding time is shortened, the processing efficiency of the processing mechanism is improved, meanwhile, the circulation of the carrier plates is completed when the empty carrier plates are put into the batch traceless conveying mechanism, the use number of the carrier plates is reduced, and the production cost is reduced. And the cost of the whole
production line is reduced.