The invention discloses a machining process for local electroplating of blind buried holes, which comprises the following steps: S2, for two times of blind buried hole forming in the same layer, basematerials are stacked and pressed, and then blind buried hole drilling treatment, copper deposition treatment, full-board copper plating treatment, inner-layer circuit manufacturing, full-board thickened copper plating treatment, base material outer surface film stripping treatment, inner-layer circuit manufacturing, inner-layer etching treatment and browning treatment are sequentially carried out; and S3, for three times of blind buried hole forming in the same layer, the base materials are stacked and pressed, and then blind buried hole drilling treatment, copper deposition treatment, full-board copper plating treatment, inner-layer circuit manufacturing, full-board thickened copper plating treatment, base material outer surface film stripping treatment, inner-layer circuit manufacturing, inner-layer etching treatment and browning treatment are conducted in sequence. The method has the beneficial effects that when the process is applied to the forming of blind buried holes twice in the same layer, copper plating of the holes can be effectively guaranteed, and meanwhile, the problem of machining precision of small line width and small spacing is solved, and the yield is increased.