Silicon wafer telescopic transmission device

Abstract

The invention provides a silicon wafer telescopic transmission device. The device comprises a device main body; the transmission mechanism is arranged on the device body, the transmission mechanism comprises at least two transmission belts, a driving motor and a synchronous transmission assembly, the output end of the driving motor is connected with the synchronous transmission assembly, the two transmission belts are both connected with the synchronous transmission assembly, and the synchronous transmission assembly is connected with the driving motor. The driving motor drives the two transmission belts to move at the same time through the synchronous transmission assembly. The telescopic mechanism is arranged on the device body, the telescopic mechanism is connected with one ends of the two transmission belts, and the telescopic mechanism drives one ends of the two transmission belts to move in the length direction of the device body. According to the embodiment of the invention, the driving motor can drive the at least two transmission belts to move at the same time, and the silicon wafers are transmitted at the same time, so that the transmission efficiency is improved, and the cost of the transmission device is reduced.

Description

Technical Field

[0001] The present application relates to the field of photovoltaic manufacturing technology, and in particular to a silicon wafer telescopic transmission device. Background Art

[0002] Half-wafer technology has significant advantages in the field of solar photovoltaics. Compared with traditional whole-wafer silicon wafers, by cutting a single crystalline silicon wafer into half, the production efficiency and environmental performance of photovoltaic cell modules can be improved. In addition, due to its smaller size, half-wafer silicon wafers can better adapt to space constraints.

[0003] Since the size of a half-wafer is small, the volume of the transmission track for transmitting it is also reduced accordingly, which may limit the transmission efficiency. Therefore, two transmission tracks are usually set up to transmit the half-wafer. Two transmission tracks require two motors to drive two belts for transmission, which increases the cost. Summary of the invention

[0004] The embodiment of the present application provides a silicon wafer telescopic transmission device to solve the problems existing in the related art. The technical solution is as follows:

[0005] The embodiment of the present application provides a silicon wafer telescopic transmission device, comprising:

[0006] Device body;

[0007] A transmission mechanism is arranged on the device body, the transmission mechanism comprises at least two transmission belts, a driving motor and a synchronous transmission assembly, the output end of the driving motor is connected to the synchronous transmission assembly, the two transmission belts are connected to the synchronous transmission assembly, and the driving motor drives the two transmission belts to move simultaneously through the synchronous transmission assembly;

[0008] The telescopic mechanism is arranged on the device body, and the telescopic mechanism is connected to one end of the two transmission belts, and the telescopic mechanism drives one end of the two transmission belts to move along the length direction of the device body.

[0009] In one embodiment, the synchronous transmission assembly includes a synchronous belt, a synchronous driving wheel, a synchronous transmission shaft and a first synchronous driven wheel. The synchronous driving wheel is connected to the output end of the drive motor, and the synchronous driving wheel is connected to the first synchronous driven wheel through a synchronous belt. The first synchronous driven wheel is sleeved on the synchronous transmission shaft, and the other ends of the two transmission belts are connected to the synchronous transmission shaft.

[0010] In one embodiment, the synchronous transmission assembly also includes at least two second synchronous driven wheels, which are respectively mounted on both ends of the synchronous transmission shaft, the first synchronous driven wheel is located between the two second synchronous driven wheels, and one end of the two transmission belts is respectively connected to the two second synchronous driven wheels.

[0011] In one embodiment, the synchronous transmission assembly also includes at least two driven transmission shafts, and the two driven transmission shafts are respectively rotatably connected to the device body, the driven transmission shaft and the synchronous transmission shaft are respectively located at opposite ends of the device body, and one end of the two transmission belts is respectively connected to the two driven transmission shafts.

[0012] In one embodiment, two transmission fixing seats are fixed on the device body, and two ends of the synchronous transmission shaft are rotatably connected to the two transmission fixing seats respectively.

[0013] In one embodiment, the telescopic mechanism includes a telescopic drive assembly, two telescopic guide rails and two moving seats, the two telescopic guide rails are arranged along the length direction of the device body, the two telescopic guide rails are arranged opposite to each other on the device body, the telescopic drive assembly is connected to the two moving seats, and the two moving seats are slidably connected to the two telescopic guide rails through sliders respectively.

[0014] In one embodiment, the telescopic mechanism further includes two movable plates, the two movable plates are respectively connected to the two movable seats, and the two driven transmission shafts are respectively rotationally connected to the two movable plates.

[0015] In one embodiment, the telescopic drive assembly includes a telescopic cylinder, a drive plate and a drive connecting plate, the bottom of the drive plate is connected to the slide on the telescopic cylinder, the top of the drive plate is connected to the drive connecting plate, and the two moving seats are respectively connected to the drive connecting plates.

[0016] In one embodiment, the transmission mechanism also includes a tensioning assembly, which includes a plurality of tensioning wheels, each of which is connected to the two transmission belts respectively, a tensioning seat is fixed at one end of the movable seat, and the plurality of tensioning wheels are respectively movably arranged on the tensioning seat, the movable seat and the transmission fixed seat, and the movable seat is located on the tensioning seat and the transmission fixed seat.

[0017] In one embodiment, a plurality of sensors are further provided on the device body, and the plurality of sensors are respectively located on the sides of the transmission belt, and the plurality of sensors are respectively located at both ends of the transmission belt.

[0018] The advantages or beneficial effects of the above technical solution include at least:

[0019] The silicon wafer telescopic transmission device of the embodiment of the present application includes a device body, a transmission mechanism and a telescopic mechanism, wherein the transmission mechanism includes at least two transmission belts, a driving motor and a synchronous transmission assembly, the driving motor can drive the two transmission belts to move at the same time through the synchronous transmission assembly, the telescopic mechanism is connected to one end of the two transmission belts, and the telescopic mechanism drives one end of the two transmission belts to move along the length direction of the device body. Since the telescopic mechanism is provided on the device body, when transmitting half a silicon wafer, the transmission belt can be driven to extend into the flower basket through the telescopic mechanism, so that the silicon wafer inside the flower basket is placed on the transmission belt, and then the transmission belt is driven to move by the driving motor, so that the silicon wafer is transmitted out. In the embodiment of the present application, since the driving motor can drive at least two transmission belts to move at the same time, the transmission of silicon wafers is realized at the same time, the transmission efficiency is improved and the cost of the transmission device is reduced.

[0020] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0022] Figure 1 It is a first structural schematic diagram of a silicon wafer telescopic transmission device;

[0023] Figure 2 is a second structural schematic diagram of the silicon wafer telescopic transmission device;

[0024] Figure 3 It is a third structural schematic diagram of the silicon wafer telescopic transmission device;

[0025] Description of reference numerals:

[0026] 1. Device body; 2. Transmission mechanism; 3. Telescopic mechanism; 21. Transmission belt; 22. Driving motor; 23. Synchronous transmission assembly; 4. Half silicon wafer; 231. Synchronous belt; 232. Synchronous driving wheel; 233. Synchronous transmission shaft; 234. First synchronous driven wheel; 235. Second synchronous driven wheel; 5. Transmission fixed seat; 236. Driven transmission shaft; 31. Telescopic driving assembly; 32. Telescopic guide rail; 33. Moving seat; 34. Moving plate; 311. Telescopic cylinder; 312. Driving plate; 313. Driving connecting plate; 6. Tensioning wheel; 7. Sensor; 8. Tensioning seat. DETAILED DESCRIPTION

[0027] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0028] like Figures 1 to 3 As shown, the embodiment of the present application provides a silicon wafer telescopic transmission device, including a device body 1, a transmission mechanism 2 and a telescopic mechanism 3. The transmission mechanism 2 is arranged on the device body 1, and the transmission mechanism 2 includes at least two transmission belts 21, a drive motor 22 and a synchronous transmission assembly 23. The output end of the drive motor 22 is connected to the synchronous transmission assembly 23, and the two transmission belts 21 are both connected to the synchronous transmission assembly 23. The drive motor 22 drives the two transmission belts 21 to move at the same time through the synchronous transmission assembly 23. The telescopic mechanism 3 is also arranged on the device body 1, and the telescopic mechanism 3 is connected to one end of the two transmission belts 21. The telescopic mechanism 3 drives one end of the two transmission belts 21 to move along the length direction of the device body 1.

[0029] In this embodiment, since a telescopic mechanism 3 is provided on the device body 1, when transmitting a half-sheet silicon wafer 4, the transmission belt 21 can be driven to extend into the basket by the telescopic mechanism 3, so that the silicon wafer in the basket is placed on the transmission belt 21, and then the transmission belt 21 is driven to move by the driving motor 22, so that the silicon wafer is transmitted out. In this embodiment of the application, since the driving motor 22 can drive at least two transmission belts 21 to move at the same time, the transmission of silicon wafers is realized at the same time, the transmission efficiency is improved, and the cost of the transmission device is reduced.

[0030] It should be noted that: a half-chip silicon wafer 4 is placed in the flower basket, and after the transmission belt 21 moves to below the silicon wafer inside the flower basket, the silicon wafer in the flower basket can directly fall onto the transmission belt 21. As for how the half-chip silicon wafer 4 on the flower basket falls onto the transmission belt 21, it is not the technical solution protected by this embodiment. The structure used for the half-chip silicon wafer 4 on the flower basket to fall onto the transmission belt 21 can be the existing technology.

[0031] In one embodiment, in order to drive the transmission belt 21 to move, the synchronous transmission assembly 23 includes a synchronous belt 231, a synchronous driving wheel 232, a synchronous transmission shaft 233 and a first synchronous driven wheel 234. The synchronous driving wheel 232 is connected to the output end of the driving motor 22, the synchronous driving wheel 232 is connected to the first synchronous driven wheel 234 through the synchronous belt 231, the first synchronous driven wheel 234 is sleeved on the synchronous transmission shaft 233, and the other ends of the two transmission belts 21 are connected to the synchronous transmission shaft 233.

[0032] After the driving motor 22 is started, it drives the synchronous driving wheel 232 connected thereto to rotate. The synchronous driving wheel 232 drives the first synchronous driven wheel 234 to rotate through the synchronous belt 231. The first synchronous driven wheel 234 drives the synchronous transmission shaft 233 to rotate. During the rotation process, the synchronous transmission shaft 233 drives the two synchronous transmission shafts 233 connected thereto to rotate. The two transmission belts 21 are respectively located on both sides of the first synchronous driven wheel 234. Preferably, in order to better convey the half-wafer 4, the number of the transmission belts 21 can be four, and two transmission belts 21 are respectively provided on both sides of the first synchronous driven wheel 234, and the two transmission belts 21 on the same side are arranged at intervals. When conveying the half-wafer 4, the half-wafer 4 is placed on the two transmission belts 21 on the same side, and the two transmission belts 21 are used to jointly convey the half-wafer 4.

[0033] In one embodiment, the synchronous transmission assembly 23 further includes four second synchronous driven wheels 235, which are respectively sleeved on both ends of the synchronous transmission shaft 233, that is, two second synchronous driven wheels 235 are sleeved on one end of the synchronous transmission shaft 233, and two second synchronous driven wheels 235 are also sleeved on the other end of the synchronous transmission shaft 233. The two transmission belts 21 located on the same side of the first synchronous driven wheel 234 pass through the two second synchronous driven wheels 235 located on the same end of the synchronous transmission shaft 233. When the synchronous transmission shaft 233 rotates, the synchronous belt 231 drives the four second synchronous driven wheels 235 to rotate, and the four second synchronous driven wheels 235 drive the four transmission belts 21 to move respectively.

[0034] Two transmission fixing seats 5 are also fixed on the device body 1 , and the two ends of the synchronous transmission shaft 233 are rotatably connected to the two transmission fixing seats 5 , respectively. The two second synchronous driven wheels 235 located at the same end of the synchronous transmission shaft 233 are located on both sides of the same transmission fixing seat 5 .

[0035] In order to ensure the transmission of the transmission belt 21, the synchronous transmission assembly 23 also includes four driven transmission shafts 236, and the four driven transmission shafts 236 are respectively connected to the device body 1. The driven transmission shaft 236 and the synchronous transmission shaft 233 are respectively located at opposite ends of the device body 1, and one end of the four transmission belts 21 is respectively connected to the four driven transmission shafts 236. Since the driven transmission shaft 236 and the synchronous transmission shaft 233 are respectively located at the two ends of the device body 1, the transmission belt 21 passes through the driven transmission shaft 236 and the synchronous transmission shaft 233, so that the transmission belt 21 moves between the synchronous transmission shaft 233 and the driven transmission shaft 236.

[0036] In order to drive the transmission belt 21 to move, the telescopic mechanism 3 includes a telescopic driving assembly 31, two telescopic guide rails 32 and two moving seats 33. The two telescopic guide rails 32 are arranged along the length direction of the device body 1, and the two telescopic guide rails 32 are arranged opposite to each other on the device body 1. The telescopic driving assembly 31 is connected to the two moving seats 33, and the two moving seats 33 are slidably connected to the two telescopic guide rails 32 through sliders.

[0037] Further, the telescopic mechanism 3 also includes two moving plates 34, the two moving plates 34 are respectively connected to the two moving seats 33, and the four driven transmission shafts 236 are respectively rotatably connected to the two moving plates 34. The telescopic drive assembly 31 includes a telescopic cylinder 311, a drive plate 312 and a drive connecting plate 313, the bottom of the drive plate 312 is connected to the slide on the telescopic cylinder 311, the top of the drive plate 312 is connected to the drive connecting plate 313, and the two moving seats 33 are respectively connected to the drive connecting plate 313. Preferably, the telescopic cylinder 311 is an existing rodless cylinder.

[0038] When it is necessary to drive the transmission belt 21 to move, the telescopic cylinder 311 is started, the telescopic cylinder 311 drives the driving plate 312 to move, the driving plate 312 drives the driving connecting plate 313 connected thereto to move, the driving connecting plate 313 drives the moving seat 33 to move on the telescopic guide rail 32, and then drives the driven transmission shaft 236 and one end of the transmission belt 21 to move.

[0039] In order to tension the transmission belt 21 , the transmission mechanism 2 further includes a tensioning assembly, which includes a plurality of tensioning wheels 6 . The plurality of tensioning wheels 6 are respectively connected to the four transmission belts 21 , and the transmission belt 21 can be tensioned by the tensioning wheels 6 .

[0040] In one embodiment, a tensioning seat 8 is fixed to one end of the movable seat 33, and the tensioning seat 8 and the transmission fixed seat 5 are respectively located at opposite ends of the telescopic guide rail 32. A plurality of tensioning wheels 6 are respectively movably disposed on the tensioning seat 8, the movable seat 33 and the transmission fixed seat 5, and the movable seat 33 is located on the tensioning seat 8 and the transmission fixed seat 5.

[0041] There are two tensioning seats 8, and each tensioning seat 8 is provided with a tensioning wheel 6 on both sides, and the tensioning wheel 6 is rotatably connected to the tensioning seat 8. Each movable seat 33 is also provided with a rotatably connected tensioning wheel 6 on both sides, and each side of the transmission fixed seat 5 can be provided with three tensioning wheels 6.

[0042] In order to determine whether there is a half silicon wafer 4 on the transmission belt, a plurality of sensors 7 are provided on the device body 1 . The plurality of sensors 7 are respectively located between the two transmission belts, and the plurality of sensors 7 are respectively provided at both ends of the transmission belt 21 .

[0043] In one embodiment, the sensor 7 may be a photoelectric sensor 7, and the receiver of the photoelectric sensor 7 may be located below between the two transmission belts 21, and the receiver of the photoelectric sensor 7 may be located above the transmission belt 21. When there is a half silicon wafer 4 on the transmission belt 21, the half silicon wafer 4 blocks the optical axis between the transmitter and the receiver, thereby detecting whether the half silicon wafer 4 on the transmission belt 21 is in place. The sensor 7 may be arranged on the movable seat 33 and the transmission fixed seat 5.

[0044] When the silicon wafer telescopic transmission device of the present application is in use, the telescopic cylinder 311 first drives the transmission belt 21 to move, and one end of the transmission belt 21 is extended into the interior of the flower basket. After the half silicon wafer 4 on the flower basket falls onto the transmission belt 21, the drive motor 22 is started to drive the transmission belt 21 to move, and the half silicon wafer 4 is transmitted out. During the transmission process of the half silicon wafer 4, the sensor 7 is used to detect whether the half silicon wafer 4 is transmitted in place. After all the half silicon wafers 4 in the flower basket are transmitted, the telescopic cylinder 311 drives the transmission belt 21 to retract, which is convenient for the replacement of the flower basket. The silicon wafer telescopic transmission device of the present application can realize the synchronous extension and movement of multiple transmission belts 21 through a telescopic cylinder 311 and a drive motor 22, which can save costs, and is also convenient for the replacement of the transmission belt 21, the maintenance of the device, and the degree of automation is high.

[0045] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.

[0046] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0047] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A silicon wafer telescopic transmission device, characterized in that: include: Device body; A transmission mechanism is arranged on the device body, the transmission mechanism comprises at least two transmission belts, a driving motor and a synchronous transmission assembly, the output end of the driving motor is connected to the synchronous transmission assembly, the two transmission belts are connected to the synchronous transmission assembly, and the driving motor drives the two transmission belts to move simultaneously through the synchronous transmission assembly; The telescopic mechanism is arranged on the device body, and the telescopic mechanism is connected to one end of the two transmission belts, and the telescopic mechanism drives one end of the two transmission belts to move along the length direction of the device body.

2. The silicon wafer telescopic transmission device according to claim 1, characterized in that: The synchronous transmission assembly includes a synchronous belt, a synchronous driving wheel, a synchronous transmission shaft and a first synchronous driven wheel. The synchronous driving wheel is connected to the output end of the drive motor, the synchronous driving wheel is connected to the first synchronous driven wheel through a synchronous belt, the first synchronous driven wheel is sleeved on the synchronous transmission shaft, and the other ends of the two transmission belts are connected to the synchronous transmission shaft.

3. The silicon wafer telescopic transmission device according to claim 2, characterized in that: The synchronous transmission assembly also includes at least two second synchronous driven wheels, which are respectively mounted on both ends of the synchronous transmission shaft, the first synchronous driven wheel is located between the two second synchronous driven wheels, and one end of the two transmission belts is respectively connected to the two second synchronous driven wheels.

4. The silicon wafer telescopic transmission device according to claim 2, characterized in that: The synchronous transmission assembly also includes at least two driven transmission shafts, which are respectively rotatably connected to the device body, and the driven transmission shaft and the synchronous transmission shaft are respectively located at opposite ends of the device body, and one end of the two transmission belts is respectively connected to the two driven transmission shafts.

5. The silicon wafer telescopic transmission device according to claim 3, characterized in that: Two transmission fixing seats are fixed on the device body, and two ends of the synchronous transmission shaft are rotatably connected to the two transmission fixing seats respectively.

6. The silicon wafer telescopic transmission device according to claim 4, characterized in that: The telescopic mechanism includes a telescopic drive component, two telescopic guide rails and two moving seats. The two telescopic guide rails are arranged along the length direction of the device body. The two telescopic guide rails are arranged opposite to each other on the device body. The telescopic drive component is connected to the two moving seats. The two moving seats are slidably connected to the two telescopic guide rails through sliders.

7. The silicon wafer telescopic transmission device according to claim 6, characterized in that: The telescopic mechanism further comprises two moving plates, the two moving plates are respectively connected to the two moving seats, and the two driven transmission shafts are respectively rotationally connected to the two moving plates.

8. The silicon wafer telescopic transmission device according to claim 6, characterized in that: The telescopic driving assembly includes a telescopic cylinder, a driving plate and a driving connecting plate. The bottom of the driving plate is connected to the slide on the telescopic cylinder, the top of the driving plate is connected to the driving connecting plate, and the two moving seats are respectively connected to the driving connecting plates.

9. The silicon wafer telescopic transmission device according to any one of claims 6 to 8, characterized in that: The transmission mechanism also includes a tensioning assembly, which includes a plurality of tensioning wheels, which are respectively connected to the two transmission belts. A tensioning seat is fixed to one end of the movable seat, and the plurality of tensioning wheels are respectively movably arranged on the tensioning seat, the movable seat and the transmission fixed seat. The movable seat is located on the tensioning seat and the transmission fixed seat.

10. The silicon wafer telescopic transmission device according to claim 1, characterized in that: The device body is also provided with a plurality of sensors, wherein the plurality of sensors are respectively located on the sides of the transmission belt, and the plurality of sensors are respectively located at the two ends of the transmission belt.

Images