Wafer taking device

Abstract

The invention provides a wafer taking device, and relates to the field of wafer taking. A sliding seat is arranged on the top side of the base in a sliding manner; a square cylinder is fixedly arranged at the top of the sliding seat, a square column is slidably arranged in the square cylinder, and a transverse plate is fixedly arranged at the top of the square column; a connecting mechanism is fixedly arranged at the top of the transverse plate, and a connecting device is fixedly arranged at the top of the sliding seat; a control device is fixedly arranged on the outer side of the connection mechanism, a wafer taking device is further fixedly arranged on the outer side of the connection mechanism, and through the arrangement of the connection mechanism and the wafer taking device, the effect of taking three wafers at a time can be achieved easily and conveniently, and the number of times of reciprocating movement of the wafer taking device is reduced; therefore, the wafer taking efficiency is improved, and the problem that only one wafer can be taken at a time, so that the wafer taking device needs to take the wafer repeatedly in a reciprocating mode in the wafer machining process is solved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer fetching, and in particular to a wafer fetcher. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor circuits. The raw material is silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into silicon wafer, which is also a wafer. Wafers are mainly 8 inches and 12 inches.

[0003] Existing wafers are usually loaded in a material box, which has multiple slots, each of which is loaded with a wafer; and the existing wafer picker can usually only take one wafer at a time, so during the wafer processing process, the wafer picker needs to reciprocate multiple times to take the wafer, resulting in low wafer taking efficiency; thereby reducing the processing efficiency of the wafer and reducing the practicality of the wafer picker. Summary of the invention

[0004] In view of this, the present invention provides a wafer picker, which has a connection mechanism and a wafer picker device, so that it can easily achieve the effect of picking up three wafers at a time, reducing the number of reciprocating movements of the wafer picker; thereby improving the wafer picking efficiency and enhancing the wafer processing efficiency.

[0005] The present invention provides a wafer fetcher, which specifically comprises: a base; A slide groove is provided inside the top side of the base, and a trapezoidal bar is slidably arranged inside the slide groove; the number of trapezoidal bars and slide grooves is set to two groups, and a sliding seat is fixedly arranged between the tops of the two groups of trapezoidal bars; two groups of racks are fixedly arranged on the top of the base, and the two groups of racks are symmetrically arranged; two groups of square cylinders are fixedly arranged on the top of the sliding seat, and square columns are slidably arranged inside the two groups of square cylinders, and a cross plate is fixedly arranged on the top of the square column; a connection mechanism is fixedly arranged on the top of the cross plate, and a connecting device is fixedly arranged on the top of the sliding seat; a control device is fixedly arranged on the outside of the connection mechanism, and a wafer fetching device is also fixedly arranged on the outside of the connection mechanism, and the wafer fetching device is arranged in three places; a bearing is installed in the square cylinder, and a drive shaft is installed in the bearing, and the drive shaft is located between the two groups of square cylinders; the top of the drive shaft is fixedly arranged on the shaft end of the motor device, and the motor device is fixedly arranged on the outside of the square cylinder; two groups of bevel gears A are fixedly arranged on the outside of the drive shaft, and a first small bevel gear is fixedly arranged on the top of the drive shaft.

[0006] Furthermore, a bearing is installed inside the sliding seat, and a horizontal axis is installed inside the bearing; the top end of the horizontal axis is fixedly arranged on the shaft end of the motor device, and the motor device is fixedly arranged on the outside of the sliding seat; two groups of fixed gears are fixedly arranged on the outside of the horizontal axis, and the two groups of fixed gears are respectively meshed with the two groups of racks.

[0007] Furthermore, a fixing plate is fixedly arranged inside the square tube, and a threaded rod is rotatably arranged inside the fixing plate, and the threaded rod is arranged inside the square column through a threaded connection; a bevel gear B is fixedly arranged at the bottom end of the threaded rod, and the bevel gear B is meshed with the bevel gear A.

[0008] Furthermore, the connection mechanism includes: a connection frame, a connection column, a connection cylinder, a second large bevel gear, a connection plate and a large gear; the connection frame is fixedly arranged on the top of the horizontal plate, and the interior of the connection frame is set as a hollow structure; the connection column is rotatably arranged inside the top side of the connection frame; the connection cylinder is rotatably arranged on the outside of the connection column, and the number of connection cylinders is set to two groups; the number of the second large bevel gear is set to two groups, and the two groups of second large bevel gears are respectively fixed on the outside of the connection cylinder, and the two groups of second large bevel gears are symmetrically arranged; the number of connection plates is set to three groups, and one group of connection plates is fixedly arranged on the top of the connection column, and the other two groups of connection plates are respectively fixedly arranged on the outside of the two groups of connection cylinders; the three groups of connection plates are arranged in a straight line; the large gear is fixedly arranged on the outside of the bottom end of the connection column, and the large gear is located inside the connection frame.

[0009] Furthermore, the connection mechanism also includes: a vertical shaft, a small gear and a connection groove; a bearing is installed on the outer side of the vertical shaft, and the bearing is installed inside the connection frame; the small gear is fixedly arranged on the outer side of the vertical shaft, and the small gear is meshed with the large gear, and the transmission ratio between the large gear and the small gear is set to 1:6; the connection groove is opened inside the vertical shaft, and the number of the connection grooves is set to two groups, and the two groups of connection grooves are opened symmetrically.

[0010] Furthermore, the connecting device includes: a connecting frame, a connecting cylinder, a connecting strip and a first large bevel gear; the connecting frame is fixedly arranged on the top of the sliding seat; the connecting cylinder is rotatably arranged inside the connecting frame, and a vertical axis is slidably arranged inside the connecting cylinder; the connecting strip is fixedly arranged on both sides inside the connecting cylinder, and the connecting strip is slidably arranged inside the connecting groove; the first large bevel gear is fixedly arranged at the bottom end of the connecting cylinder, and the first large bevel gear is meshed with the first small bevel gear, and the transmission ratio between the first large bevel gear and the first small bevel gear is set to 1:2.

[0011] Furthermore, the control device includes: a control frame, a control shaft and a second small bevel gear; the control frame is fixedly arranged on the outside of the connecting column, and the control frame is arranged as an L-shaped structure; a bearing is installed on the outside of the control shaft, and the bearing is installed inside the top side of the control frame; the control shaft is fixedly arranged on the shaft end of the motor device, and the motor device is fixedly arranged on the outside of the control frame; the second small bevel gear is fixedly arranged on the top of the control shaft, and the second small bevel gear is meshed with the second large bevel gear, and the transmission ratio between the second large bevel gear and the second small bevel gear is set to 1:3.

[0012] Furthermore, the wafer retrieval device includes: a wafer retrieval rack, a wafer retrieval seat, a vacuum suction cup and a worm gear; the wafer retrieval rack is fixedly arranged on the outside of the connecting plate; the wafer retrieval seat is slidably arranged inside the wafer retrieval rack through a dovetail groove, and the number of wafer retrieval seats is set in two groups, and the two groups of wafer retrieval seats are symmetrically arranged; the vacuum suction cup is fixedly arranged inside the top side of the wafer retrieval seat; the worm gear is rotatably arranged inside the wafer retrieval rack, and a knob is fixedly arranged on the top of the worm gear.

[0013] Furthermore, the wafer retrieval device also includes: a fixed seat, a rotating shaft, a worm gear, a driving gear and a tooth plate; the fixed seat is fixedly arranged inside the wafer retrieval frame; the rotating shaft is rotatably arranged inside the fixed seat; the worm gear is fixedly arranged at the top of the rotating shaft, and the worm gear is meshed with the worm; the driving gear is fixedly arranged at the bottom of the rotating shaft; the number of tooth plates is set to two groups, and the two groups of tooth plates are respectively fixedly arranged at the bottom of the two groups of wafer retrieval seats; the tooth plate is meshed with the driving gear, and the two groups of tooth plates are arranged in a central symmetric manner. Beneficial Effects

[0014] According to the various embodiments of the present invention, the wafer picker is provided with a connection mechanism and a wafer picking device, so that it is easy to achieve the effect of picking up three wafers at a time, reducing the number of reciprocating movements of the wafer picker; thereby improving the wafer picking efficiency and enhancing the wafer processing efficiency.

[0015] In addition, by providing a driving gear and a gear plate, the effect of making the two groups of wafer picking seats drive the two groups of vacuum suction cups to move in opposite directions at the same time is achieved; the purpose of adjusting the distance between the two groups of vacuum suction cups according to the specific radius size of the wafer is achieved; the role of adsorbing and picking up the wafer according to its actual size is played; and by providing three groups of wafer picking devices, the effect of picking up three groups of wafers at one time is achieved.

[0016] In addition, by providing a second small bevel gear and two sets of second large bevel gears, it is achieved that after the second small bevel gear rotates 360°, the two sets of second large bevel gears respectively drive the two sets of connecting tubes to rotate 120° in the opposite direction at the same time; the purpose of arranging the three sets of wafer retrieval devices in a circular array is achieved; and the role of facilitating the placement of the three sets of wafers on the processing stations is played.

[0017] In addition, by providing bevel gear A and bevel gear B, the effect of making the threaded rod drive the square column to move upward when the driving shaft rotates is achieved; by using the first small bevel gear and the first large bevel gear; when the driving shaft rotates one circle, the connecting cylinder rotates two circles; and by providing the small gear and the large gear, it is achieved that when the small gear rotates two circles, the large gear rotates 120°; thereby, when the threaded rod rotates four circles, the large gear drives the connecting column to rotate 120°; thereby, the connecting column can drive the wafer retrieval device to rise a certain distance and drive the wafer retrieval device to rotate 120° at the same time; thereby, three groups of wafers are placed in the processing station in sequence; compared with the existing wafer retrieval device, it is easier to bring three wafers into the processing station at one time and place them in sequence; the efficiency of wafer picking is improved; and the efficiency of wafer processing is enhanced. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings of the embodiment are briefly introduced below.

[0019] The drawings described below are only related to some embodiments of the present invention, but are not intended to limit the present invention.

[0020] In the attached picture: Figure 1 It is a schematic diagram of the overall structure of a wafer picker according to an embodiment of the present invention.

[0021] Figure 2 It is a schematic structural diagram of the upper surface of the sliding seat of the wafer picker according to an embodiment of the present invention.

[0022] Figure 3 It is a schematic diagram of the internal structure of the sliding seat of the wafer picker according to an embodiment of the present invention.

[0023] Figure 4 It is a schematic diagram of the cross-sectional structure of the square tube of the wafer picker according to an embodiment of the present invention.

[0024] Figure 5 It is a structural schematic diagram of the upper surface of the fixing plate of the wafer picker according to an embodiment of the present invention.

[0025] Figure 6 It is a schematic cross-sectional structural diagram of a connecting tube of a wafer picker according to an embodiment of the present invention.

[0026] Figure 7 It is a schematic diagram of the internal structure of the connecting frame of the wafer picker according to an embodiment of the present invention.

[0027] Figure 8 It is a schematic structural diagram of the upper surface of the large gear of the wafer picker according to an embodiment of the present invention.

[0028] Fig. 9 It is a structural schematic diagram of a wafer picker device of a wafer picker according to an embodiment of the present invention.

[0029] Fig.10 It is a schematic structural diagram of a driving gear and a gear plate of a wafer picker according to an embodiment of the present invention.

[0030] Reference numerals list 1. Base; 101. Slide; 102. Trapezoidal bar; 103. Sliding seat; 104. Horizontal axis; 105. Fixed gear; 106. Rack; 2. Square cylinder; 201. Square column; 202. Horizontal plate; 203. Driving shaft; 204. Bevel gear A; 205. First small bevel gear; 206. Fixed plate; 207. Threaded rod; 208. Bevel gear B; 3. Connecting mechanism; 301. Connecting frame; 302. Connecting column; 303. Connecting cylinder; 304. Second large bevel gear; 305. Connecting plate; 306. Large gear; 307. Vertical shaft; 308. Small gear; 309. Connecting groove; 4. Connecting device; 401. Connecting frame; 402. Connecting cylinder; 403. Connecting strip; 404. First large bevel gear; 5. Control device; 501. Control frame; 502. Control shaft; 503. Second small bevel gear; 6. Wafer retrieval device; 601. Wafer retrieval rack; 602. Wafer retrieval seat; 603. Vacuum suction cup; 604. Worm; 605. Fixed seat; 606. Rotating shaft; 607. Worm wheel; 608. Driving gear; 609. Tooth plate. DETAILED DESCRIPTION

[0031] In order to make the purpose, scheme and advantages of the technical solution of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described in conjunction with the drawings of the specific embodiments of the present invention. Unless otherwise specified, the terms used herein have the usual meanings in the art. The same reference numerals in the drawings represent the same components.

[0032] Example 1: Please refer to Figures 1 to 10 As shown: The present invention provides a wafer fetcher, comprising a base 1; A slide groove 101 is provided inside the top side of the base 1, and a trapezoidal bar 102 is slidably arranged inside the slide groove 101; the number of the trapezoidal bar 102 and the slide groove 101 is set to two groups, and a sliding seat 103 is fixedly arranged between the tops of the two groups of trapezoidal bars 102; two groups of racks 106 are fixedly arranged on the top of the base 1, and the two groups of racks 106 are symmetrically arranged; a bearing is installed inside the sliding seat 103, and a horizontal axis 104 is installed inside the bearing; the top of the horizontal axis 104 is fixedly arranged on the shaft end of the motor device, and the motor device is fixedly arranged on the outside of the sliding seat 103; two groups of fixed gears 105 are fixedly arranged on the outside of the horizontal axis 104, and the two groups of fixed gears 105 are respectively meshed with the two groups of racks 106; Two groups of square tubes 2, and square columns 201 are slidably arranged inside the two groups of square tubes 2, and a horizontal plate 202 is fixedly arranged on the top of the square column 201; a connection mechanism 3 is fixedly arranged on the top of the horizontal plate 202, and a connecting device 4 is fixedly arranged on the top of the sliding seat 103; a control device 5 is fixedly arranged on the outside of the connection mechanism 3, and a wafer fetching device 6 is also fixedly arranged on the outside of the connection mechanism 3, and the wafer fetching device 6 is arranged in three places; a bearing is installed inside the square tube 2, and a driving shaft 203 is installed inside the bearing, and the driving shaft 203 is located between the two groups of square tubes 2; the top of the driving shaft 203 is fixedly arranged on the shaft end of the motor device, and the motor device is fixedly arranged on the outside of the square tube 2; two groups of Bevel gear A204, and a first small bevel gear 205 is fixedly arranged at the top of the driving shaft 203; a fixing plate 206 is fixedly arranged inside the square cylinder 2, and a threaded rod 207 is rotatably arranged inside the fixing plate 206, and the threaded rod 207 is arranged inside the square column 201 through a threaded connection; a bevel gear B208 is fixedly arranged at the bottom end of the threaded rod 207, and the bevel gear B208 is meshed with the bevel gear A204; its specific function is: by arranging the bevel gear A204 and the bevel gear B208, the effect of the threaded rod 207 driving the square column 201 to move upward is achieved when the driving shaft 203 rotates; by using the first small bevel gear 205 and the first large bevel gear 404; the effect of the square column 201 moving upward when the driving shaft 203 rotates is achieved When the threaded rod 207 rotates four times, the large gear 306 drives the connecting column 302 to rotate 120°; thereby, the connecting column 302 drives the wafer taking device 6 to rise a certain distance and drives the wafer taking device 6 to rotate 120°; thereby, three groups of wafers are placed in the processing station in sequence; compared with the existing wafer taker, it is easier to bring three wafers into the processing station at one time and place them in sequence; the efficiency of taking wafers is improved; and the efficiency of processing wafers is enhanced.

[0033] Example 2: Please refer to Figure 4 and Figures 6 to 8 As shown: On the basis of the first embodiment, the connection mechanism 3 includes: a connection frame 301, a connection column 302, a connection cylinder 303, a second large bevel gear 304, a connection plate 305, a large gear 306, a vertical shaft 307, a small gear 308 and a connection groove 309; the connection frame 301 is fixedly arranged on the top of the horizontal plate 202, and the interior of the connection frame 301 is set as a hollow structure; the connection column 302 is rotatably arranged inside the top side of the connection frame 301; the connection cylinder 303 is rotatably arranged on the outside of the connection column 302, and the number of the connection cylinders 303 is set in two groups; the number of the second large bevel gears 304 is set in two groups, and the two groups of the second large bevel gears 304 are respectively fixedly arranged on the outside of the connection cylinder 303, and the two groups of the second large bevel gears 304 are symmetrical. The connecting plates 305 are arranged in a straight line; the large gear 306 is fixedly arranged on the outside of the bottom end of the connecting column 302, and the large gear 306 is located inside the connecting frame 301; the outer side of the vertical shaft 307 is equipped with a bearing, and the bearing is equipped inside the connecting frame 301; the small gear 308 is fixedly arranged on the outer side of the vertical shaft 307, and the small gear 308 is meshed with the large gear 306, and the transmission ratio between the large gear 306 and the small gear 308 is set to 1:6; the connecting groove 309 is opened inside the vertical shaft 307, and the engagement groove 309 is provided inside the vertical shaft 307. The number of connecting grooves 309 is set to two groups, and the two groups of connecting grooves 309 are symmetrically opened; the connecting device 4 includes: a connecting frame 401, a connecting cylinder 402, a connecting strip 403 and a first large bevel gear 404; the connecting frame 401 is fixedly arranged on the top of the sliding seat 103; the connecting cylinder 402 is rotatably arranged inside the connecting frame 401, and a vertical shaft 307 is slidably arranged inside the connecting cylinder 402; the connecting strip 403 is fixedly arranged on both sides inside the connecting cylinder 402, and the connecting strip 403 is slidably arranged inside the connecting groove 309; the first large bevel gear 404 is fixedly arranged at the bottom end of the connecting cylinder 402, and the first large bevel gear 404 is meshed with the first small bevel gear 205, and the first large bevel gear 404 is meshed with the first small bevel gear 205. The transmission ratio between the wheels 205 is set to 1:2; the control device 5 includes: a control frame 501, a control shaft 502 and a second small bevel gear 503; the control frame 501 is fixedly arranged on the outside of the connecting column 302, and the control frame 501 is set to an L-shaped structure; a bearing is installed on the outside of the control shaft 502, and the bearing is installed inside the top side of the control frame 501; the control shaft 502 is fixedly arranged on the shaft end of the motor device, and the motor device is fixedly arranged on the outside of the control frame 501; the second small bevel gear 503 is fixedly arranged on the top of the control shaft 502, and the second small bevel gear 503 is meshed with the second large bevel gear 304, and the transmission ratio between the second large bevel gear 304 and the second small bevel gear 503 is set to 1:3;Its specific function is: by providing the second small bevel gear 503 and the two sets of second large bevel gears 304, after the second small bevel gear 503 rotates 360°, the two sets of second large bevel gears 304 respectively drive the two sets of connecting cylinders 303 to rotate 120° in the opposite direction at the same time; the purpose of arranging the three sets of wafer fetching devices 6 in a circular array is achieved; and the three sets of wafers are conveniently placed on the processing stations respectively. ;

[0034] Example 3: Please refer to Figures 9 and 10 As shown: On the basis of the first and second embodiments, the wafer fetching device 6 comprises: a fetching frame 601, a fetching seat 602, a vacuum suction cup 603, a worm 604, a fixed seat 605, a rotating shaft 606, a worm gear 607, a driving gear 608 and a tooth plate 609; the fetching frame 601 is fixedly arranged on the outside of the connecting plate 305; the fetching seat 602 is slidably arranged inside the fetching frame 601 through a dovetail groove, and the number of the fetching seats 602 is set in two groups, and the two groups of fetching seats 602 are symmetrically arranged; the vacuum suction cup 603 is fixedly arranged inside the top side of the fetching seat 602; the worm 604 is rotatably arranged inside the fetching frame 601, and a knob is fixedly arranged on the top of the worm 604; the fixed seat 605 is fixedly arranged inside the fetching frame 601; the rotating shaft 606 is rotatably arranged inside the fixed seat 605; the worm gear 607 is fixedly arranged on the rotating shaft 606, and the worm wheel 607 is meshed with the worm 604; the driving gear 608 is fixedly set at the bottom of the rotating shaft 606; the number of tooth plates 609 is set to two groups, and the two groups of tooth plates 609 are respectively fixedly set at the bottom of the two groups of film pick-up seats 602; the tooth plates 609 are meshed with the driving gear 608, and the two groups of tooth plates 609 are centrally symmetrically arranged; its specific functions are: by providing the driving gear 608 and the tooth plate 609, the effect of making the two groups of film pick-up seats 602 drive the two groups of vacuum suction cups 603 to move in opposite directions at the same time is achieved; the purpose of adjusting the distance between the two groups of vacuum suction cups 603 according to the specific radius size of the wafer is achieved; the role of adsorbing and picking up the wafer according to its actual size is played; and by providing three groups of wafer picking devices 6, the effect of picking up three groups of wafers at one time is achieved.

[0035] Specific usage and function of this embodiment: In the present invention, when in use, the worm 604 is rotated by the knob, and the worm 604 drives the rotating shaft 606 to rotate through the worm wheel 607, and the rotating shaft 606 drives the two sets of film taking seats 602 to move in opposite directions at the same time through the driving gear 608 and the two sets of toothed plates 609, so that the distance between the two sets of vacuum suction cups 603 can be adjusted; the three sets of film taking racks 601 are inserted into the wafer material box, and the wafers are adsorbed and fixed by the vacuum suction cups 603; the motor device is started to drive the horizontal axis 104 to rotate, and the horizontal axis 104 is fixed by the gear 105 The rack 106 drives the sliding seat 103 to slide, so that the wafer is taken out of the material box and moved to the processing station; the motor device is started to drive the control shaft 502 to rotate 360°, and the control shaft 502 drives the second small bevel gear 503 to rotate 360°; the second small bevel gear 503 drives the two sets of second large bevel gears 304 to rotate 120° in the opposite direction at the same time; so that the three groups of wafers on the top of the vacuum suction cup 603 are unfolded in a circular array; first place the top wafer on the processing station; when the middle wafer needs to be placed; start the motor device to drive the drive The driving shaft 203 rotates four times; thereby, the driving shaft 203 drives the two sets of threaded rods 207 to rotate four times at the same time through the bevel gear A204 and the bevel gear B208, so that the middle wafer rises to a certain height, so that the middle wafer reaches the processing station height; at the same time, the driving shaft 203 drives the connecting cylinder 402 to rotate two times through the first small bevel gear 205 and the first large bevel gear 404, so that the connecting cylinder 402 drives the vertical shaft 307 to rotate through the connecting strip 403 and the connecting groove 309, and the vertical shaft 307 drives the small gear 308 and the large gear 304 to rotate. 06 drives the connecting column 302 to rotate 120°; thereby, the middle wafer reaches the processing station; through the above steps, the bottom wafer can be placed on the top of the processing station; thereby, the connecting column 302 can drive the wafer taking device 6 to rise a certain distance while driving the wafer taking device 6 to rotate 120°; thereby, three groups of wafers are placed in the processing station in turn; compared with the existing wafer taker, it is easier to bring three wafers into the processing station at one time and place them in turn; the efficiency of wafer picking is improved; and the efficiency of wafer processing is enhanced.

Claims

1. A wafer picker, characterized in that: include: Base (1); A slide groove (101) is provided inside the top side of the base (1), and a trapezoidal bar (102) is slidably arranged inside the slide groove (101); the number of the trapezoidal bar (102) and the slide groove (101) is set to two groups, and a sliding seat (103) is fixedly arranged between the tops of the two groups of trapezoidal bars (102); two groups of racks (106) are fixedly arranged on the top of the base (1), and the two groups of racks (106) are symmetrically arranged; two groups of square tubes (2) are fixedly arranged on the top of the sliding seat (103), and square columns (201) are slidably arranged inside the two groups of square tubes (2), and a cross plate (202) is fixedly arranged on the top of the square column (201); a connection mechanism (3) is fixedly arranged on the top of the cross plate (202), and the sliding seat (103) is fixedly provided with a connecting device (4) at the top; a control device (5) is fixedly provided on the outside of the connecting mechanism (3), and a wafer taking device (6) is also fixedly provided on the outside of the connecting mechanism (3), and the wafer taking device (6) is provided at three locations; a bearing is installed in the interior of the square cylinder (2), and a driving shaft (203) is installed in the interior of the bearing, and the driving shaft (203) is located between the two groups of square cylinders (2); the top end of the driving shaft (203) is fixedly provided on the shaft end of the motor device, and the motor device is fixedly provided on the outside of the square cylinder (2); two groups of bevel gears A (204) are fixedly provided on the outside of the driving shaft (203), and a first small bevel gear (205) is fixedly provided on the top end of the driving shaft (203); A bearing is installed in the sliding seat (103), and a transverse shaft (104) is installed in the bearing; the top end of the transverse shaft (104) is fixedly arranged on the shaft end of the motor device, and the motor device is fixedly arranged on the outside of the sliding seat (103); two groups of fixed gears (105) are fixedly arranged on the outside of the transverse shaft (104), and the two groups of fixed gears (105) are respectively meshed with two groups of racks (106); The connection mechanism (3) comprises: a connection frame (301), a connection column (302), a connection cylinder (303), a second large bevel gear (304), a connection plate (305) and a large gear (306); the connection frame (301) is fixedly arranged on the top of the horizontal plate (202), and the interior of the connection frame (301) is arranged as a hollow structure; the connection column (302) is rotatably arranged inside the top side of the connection frame (301); the connection cylinder (303) is rotatably arranged outside the connection column (302), and the number of the connection cylinders (303) is arranged as two groups; the number of the second large bevel gear (304) is arranged as two groups, and Two groups of second large bevel gears (304) are respectively fixedly arranged on the outside of the connection tube (303), and the two groups of second large bevel gears (304) are symmetrically arranged; the number of connection plates (305) is set to three groups, and one group of connection plates (305) is fixedly arranged on the top of the connection column (302), and the other two groups of connection plates (305) are respectively fixedly arranged on the outside of the two groups of connection tubes (303); the three groups of connection plates (305) are arranged in a straight line; the large gear (306) is fixedly arranged on the outside of the bottom end of the connection column (302), and the large gear (306) is located inside the connection frame (301).

2. A wafer picker according to claim 1, characterized in that: A fixing plate (206) is fixedly arranged inside the square cylinder (2), and a threaded rod (207) is rotatably arranged inside the fixing plate (206), and the threaded rod (207) is arranged inside the square column (201) through a threaded connection; a bevel gear B (208) is fixedly arranged at the bottom end of the threaded rod (207), and the bevel gear B (208) is meshed with the bevel gear A (204).

3. The wafer picker according to claim 1, characterized in that: The connection mechanism (3) further comprises: a vertical shaft (307), a small gear (308) and a connection groove (309); a bearing is mounted on the outside of the vertical shaft (307), and the bearing is mounted inside the connection frame (301); the small gear (308) is fixedly arranged on the outside of the vertical shaft (307), and the small gear (308) is meshed with the large gear (306), and the transmission ratio between the large gear (306) and the small gear (308) is set to 1:6; the connection groove (309) is opened inside the vertical shaft (307), and the number of the connection grooves (309) is set to two groups, and the two groups of connection grooves (309) are opened symmetrically.

4. A wafer picker according to claim 3, characterized in that: The connecting device (4) comprises: a connecting frame (401), a connecting tube (402), a connecting bar (403) and a first large bevel gear (404); the connecting frame (401) is fixedly arranged on the top of the sliding seat (103); the connecting tube (402) is rotatably arranged inside the connecting frame (401), and a vertical shaft (307) is slidably arranged inside the connecting tube (402); the connecting bar (403) is fixedly arranged on both sides inside the connecting tube (402), and the connecting bar (403) is slidably arranged inside the connecting groove (309); the first large bevel gear (404) is fixedly arranged at the bottom end of the connecting tube (402), and the first large bevel gear (404) is meshed with the first small bevel gear (205), and the transmission ratio between the first large bevel gear (404) and the first small bevel gear (205) is set to 1:

2.

5. The wafer picker according to claim 1, characterized in that: The control device (5) comprises: a control frame (501), a control shaft (502) and a second small bevel gear (503); the control frame (501) is fixedly arranged on the outside of the connecting column (302), and the control frame (501) is arranged in an L-shaped structure; a bearing is mounted on the outside of the control shaft (502), and the bearing is mounted on the inside of the top side of the control frame (501); the control shaft (502) is fixedly arranged on the shaft end of the motor device, and the motor device is fixedly arranged on the outside of the control frame (501); the second small bevel gear (503) is fixedly arranged on the top of the control shaft (502), and the second small bevel gear (503) is meshed with the second large bevel gear (304), and the transmission ratio between the second large bevel gear (304) and the second small bevel gear (503) is set to 1:

3.

6. The wafer picker according to claim 1, characterized in that: The wafer fetching device (6) comprises: a wafer fetching frame (601), a wafer fetching seat (602), a vacuum suction cup (603) and a worm (604); the wafer fetching frame (601) is fixedly arranged on the outside of the connecting plate (305); the wafer fetching seat (602) is slidably arranged inside the wafer fetching frame (601) through a dovetail groove, and the number of wafer fetching seats (602) is set in two groups, and the two groups of wafer fetching seats (602) are symmetrically arranged; the vacuum suction cup (603) is fixedly arranged inside the top side of the wafer fetching seat (602); the worm (604) is rotatably arranged inside the wafer fetching frame (601), and a knob is fixedly arranged on the top of the worm (604).

7. The wafer picker according to claim 6, characterized in that: The wafer fetching device (6) further comprises: a fixed seat (605), a rotating shaft (606), a worm gear (607), a driving gear (608) and a tooth plate (609); the fixed seat (605) is fixedly arranged inside the wafer fetching frame (601); the rotating shaft (606) is rotatably arranged inside the fixed seat (605); the worm gear (607) is fixedly arranged at the top of the rotating shaft (606), and the worm gear (607) is meshed with the worm (604); the driving gear (608) is fixedly arranged at the bottom of the rotating shaft (606); the tooth plates (609) are arranged in two groups, and the two groups of tooth plates (609) are respectively fixedly arranged at the bottom of the two groups of wafer fetching seats (602); the tooth plates (609) are meshed with the driving gear (608), and the two groups of tooth plates (609) are arranged symmetrically with respect to the center.

Images