Laser temperature control assembly and circuit
By integrating the laser chip, temperature measurement resistor and heating wire in the laser temperature control component, and using sapphire substrate and gold-plated heating wire, the problem of large size of the laser temperature control circuit in the prior art is solved, achieving a more compact design and more High layout density.
Patent Information
- Application Number
- CN202411236891.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-04
- Publication Date
- 2024-12-13
AI Technical Summary
The existing laser temperature control circuit products are large in size, and the complex structure leads to an increase in space occupation.
It uses sapphire substrate integrated laser chip, temperature measurement resistor and heating wire, and connects through line layers and pad pairs, and uses platinum resistor and gold-plated heating wire to achieve a compact layout and reduce volume.
Through integrated design, the volume of the laser temperature control components is significantly reduced, the compact layout of functional devices is improved, the structure is simplified, and the space occupancy of the product is reduced.
Smart Images
Figure CN119134033A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of laser technology, and in particular to a laser temperature control component and circuit. Background Art
[0002] Magnetometer is a basic instrument for magnetic detection and ground magnetic field observation. Its performance directly determines the accuracy of magnetic field measurement. OPM (Optical-Pumping Magnetometer) refers to a type of magnetometer that uses the optical pumping effect to polarize atoms and destroys the polarization state by applying an external radio frequency field to achieve magnetic field measurement. The polarized atoms can be cesium atoms.
[0003] When designing an optically pumped magnetometer, a single-mode VCSEL (Vertical-Cavity Surface-Emitting Laser) with a small beam divergence angle and low power consumption can be used as the magnetometer pump light source. The single-mode characteristics of VCSEL are stable for a long time, polarization is stable, and there will be no mode hopping and power fluctuation. It can achieve stable output of single-mode narrow linewidth laser under high temperature conditions. In practical applications, a VCSEL laser with an output power of less than 2W, a spot diameter of 3mm, and an emission wavelength that can resonate with cesium atoms can be selected.
[0004] The VCSEL laser frequency is sensitive to temperature, and the temperature of the VCSEL needs to be kept highly stable. In the related art, the circuit structure for controlling the laser temperature is relatively complex, which makes the product using the laser temperature control circuit larger in size. Summary of the invention
[0005] In view of this, the embodiments of the present disclosure provide a laser temperature control component and circuit to solve the technical problem of large volume of products using laser temperature control circuits in the prior art.
[0006] To achieve the above objectives, the technical solution adopted by the present disclosure is:
[0007] According to a first aspect of an embodiment of the present disclosure, a laser temperature control component is provided, which includes a sapphire substrate, a circuit layer arranged above the sapphire substrate, and a temperature measuring resistor and a laser chip arranged above the circuit layer and connected to the circuit layer, wherein the circuit layer includes: a first pair of pads and a first wire connected between the first pair of pads, the middle part of the first wire is connected to the temperature measuring resistor; a second pair of pads and a second wire connected between the second pair of pads, the middle part of the second wire is connected to the laser chip, and the second wire is parallel to the first wire; a third pair of pads and a heating wire connected between the third pair of pads, the heating wire includes a transverse portion and a longitudinal portion arranged at intervals, and the transverse portion is parallel to the second wire.
[0008] In one embodiment, the temperature measuring resistor is a platinum resistor.
[0009] In one embodiment, the laser chip is a vertical cavity surface emitting laser chip.
[0010] In one embodiment, the heating wire is a gold-plated heating wire.
[0011] In one embodiment, the heating line is arranged in a bow shape with the ends connected; and / or, the heating line includes a first part located on the first side of the laser chip and a second part located on the second side of the laser chip, and a third part connecting the first part and the second part, wherein the second side is the opposite side of the first side, and the temperature measuring resistor is located between the first part and the second part.
[0012] In one embodiment, the first pad pair, the second pad pair, and the third pad pair are located on the sides of the third side of the laser temperature control assembly.
[0013] In one embodiment, a solder resist layer is provided over the portion of the circuit layer other than the external solder pads and the device connection, the external solder pads include a first solder pad pair, a second solder pad pair and a third solder pad pair, the device connection includes a connection between the circuit layer and the temperature measuring resistor, and a connection between the circuit layer and the laser chip.
[0014] In one embodiment, the circuit layer includes an aluminum foil layer or a copper foil layer formed by deposition technology and etching technology.
[0015] According to a second aspect of the embodiments of the present disclosure, a laser temperature control circuit is provided. The laser temperature control circuit includes a controller and the laser temperature control component in the above technical solution. The controller and the laser temperature control component are connected through a first pad pair, a second pad pair and a third pad pair, and are used to control the operation of the laser chip, receive measurement data of the temperature measuring resistor and control the heating line for heating according to the measurement data.
[0016] In one embodiment, the first pad pair, the second pad pair, and the third pad pair are respectively connected to the controller through bonding wires.
[0017] Compared with the prior art, the embodiments of the present disclosure have the following beneficial effects: by integrating the laser chip, the temperature measuring resistor and the heating wire onto the same sapphire substrate, the functional devices can be arranged compactly, thereby reducing the volume of the product using the laser temperature control component. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0019] Figure 1 is a structural schematic diagram of a laser temperature control assembly provided by an embodiment of the present disclosure;
[0020] Figure 2 is a schematic structural diagram of another laser temperature control assembly provided by an embodiment of the present disclosure;
[0021] Figure 3 is a cross-sectional view of a laser temperature control assembly provided by an embodiment of the present disclosure;
[0022] Figure 4 It is a structural schematic diagram of a laser temperature control circuit provided in an embodiment of the present disclosure. DETAILED DESCRIPTION
[0023] The disclosed embodiments will now be described more fully with reference to the accompanying drawings in which the embodiments are shown. However, the disclosed embodiments may be implemented in many different forms and should not be construed as being limited to the embodiments specifically set forth herein; rather, the purpose of providing these embodiments is to make the disclosure exhaustive and complete and to fully convey the concepts of the embodiments to those skilled in the art so that they can implement the invention. The same reference numerals in the drawings represent the same elements, and therefore their descriptions will be omitted.
[0024] It should be understood that when an element is referred to as being connected to another element or being connected with another element, the element can be directly connected to another element, or there may be intervening elements between them. On the contrary, when an element is referred to as being directly connected to another element, there are no intervening elements.
[0025] Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the disclosed embodiments belong. It should also be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and unless explicitly defined as such in this article, will not be interpreted in an idealized or overly rigid sense.
[0026] The term "device" used in the embodiments may be a software component or a hardware component configured to perform a specific function. The hardware component may include a field programmable gate array (FPGA) or an application specific integrated circuit (ASIC). A software component may refer to data used by an executable code and / or data stored in an addressable storage medium and used by the executable code. Therefore, a software component may be, for example, an object-oriented software component, a class component, and a working component, and may include a process, a function, a property, a procedure, a subroutine, a program code segment, a driver, firmware, microcode, a circuit, data, a database, a data structure, a table, an array, or a variable.
[0027] The words used herein are for the purpose of describing specific embodiments and are not intended to be limiting of the present disclosure. It should be understood that the terms "include", "comprises", "comprising", "having", etc., when used in this specification, indicate the presence of the features, quantities, steps, operations, elements and / or components mentioned, but do not exclude the presence or addition of one or more other features, quantities, steps, operations, elements, components and / or groups thereof.
[0028] The laser temperature control assembly and circuit according to the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.
[0029] Figure 1 is a structural schematic diagram of a laser temperature control assembly provided by an embodiment of the present disclosure; Figure 2 is a schematic structural diagram of another laser temperature control assembly provided by an embodiment of the present disclosure; Figure 3 is a cross-sectional view of a laser temperature control assembly provided by an embodiment of the present disclosure; Figure 4 Schematic diagram of the structure of the laser temperature control circuit provided by the embodiment of the present disclosure. Figures 1 to 4 The laser temperature control component and circuit provided by the embodiments of the present disclosure are described together.
[0030] like Figure 1As shown, the embodiment of the present disclosure provides a laser temperature control component 100, which includes a sapphire substrate 110, a circuit layer disposed above the sapphire substrate, and a temperature measuring resistor 131 and a laser chip 121 connected to the circuit layer, wherein the circuit layer includes: a first pad pair and a first wire connected between the first pad pair, the middle of the first wire is connected to the temperature measuring resistor; a second pad pair and a second wire connected between the second pad pair, the middle of the second wire is connected to the laser chip, and the second wire is parallel to the first wire; a third pad pair and a heating wire 141 connected between the third pad pair, the heating wire includes a transverse portion and a longitudinal portion arranged at intervals, and the transverse portion is parallel to the second wire. Among them, the first pad pair includes pads 132 and pads 133, the second pad pair includes pads 122 and pads 123, and the third pad pair includes pads 142 and pads 143. The transverse portions of the first wire, the second wire and the heating wire are parallel to each other, which can reduce the occupied space of the wires and the heating wire, thereby reducing the volume of the laser temperature control component.
[0031] Sapphire substrates have the advantages of good chemical stability, no absorption of visible light, moderate price, and relatively mature manufacturing technology, which can improve the performance of laser temperature control components.
[0032] In the disclosed embodiment, the temperature measuring resistor may be a platinum resistor, but is not limited thereto. A platinum resistor is a platinum thermal resistor, and its resistance changes with temperature and presents a certain functional relationship. Utilizing this characteristic of the platinum resistor, it can be used as a temperature sensor for temperature measurement, and is suitable for high-precision temperature equipment such as medical, motor, industry, temperature calculation, satellite, meteorology, and resistance calculation, and has a very wide range of applications. In the laser temperature control component in the disclosed embodiment, a platinum resistor is used as a temperature sensor and integrated into the same component with the laser chip and the heating wire, which can reduce the volume of the laser temperature control component.
[0033] In the embodiment of the present disclosure, the laser chip may be a vertical cavity surface emitting laser chip. The VCSEL chip has the advantage of being small in size. When VCSEL is used in a magnetometer, the size of the magnetometer can be reduced.
[0034] In the embodiment of the present disclosure, when the ambient temperature is low, a heating wire can be used to heat the environment around the laser. The heating wire generates heat in the resistor by passing current through it, providing a heat source for the heating operation. There are many types of heating wires. The heating wire in the embodiment of the present disclosure is a metal or alloy heating wire. The heating wire has many advantages such as fast heating, small thermal inertia, high temperature resistance, corrosion resistance, good thermochemical performance, long service life and high insulation strength. Therefore, it is widely used in various fields.
[0035] In the disclosed embodiment, the heating wire may be a gold-plated heating wire. A gold-plated heating wire refers to a heating wire with a layer of gold plated on the surface. The gold-plated layer of the gold-plated heat-conducting wire can improve the electrical conductivity of the gold-plated heating wire, reduce resistance, and make the current transmission smoother, thereby improving the heating efficiency. In addition, the gold-plated heat-conducting wire has higher thermal conductivity and higher stability. The use of a gold-plated heating wire can improve the heating effect of the heating function of the laser temperature control component.
[0036] like Figure 1 As shown, the heating line includes a first portion located on the first side of the laser chip, a second portion located on the second side of the laser chip, and a third portion connecting the first portion and the second portion. The second side is the opposite side of the first side, and the temperature measuring resistor is located between the first portion and the second portion. The first side of the laser chip is as shown in FIG. Figure 1 The upper side shown, the second side of the laser chip is as shown Figure 1 As shown in the lower side, the third part is located on the left side of the laser chip, and the heating lines are arranged on the left side, the upper side and the lower side of the laser chip, which can evenly heat and raise the temperature of the environment where the laser chip is located.
[0037] like Figure 1 As shown in FIG. 1 , the first pad pair, the second pad pair and the third pad pair are located on the side of the third side of the laser temperature control component. The third side of the laser chip is as shown in FIG. Figure 1 The first pad pair, the second pad pair and the third pad pair are all located on the same side of the laser control component, which can facilitate the connection of the laser control component with other circuit structures.
[0038] like Figure 2 The laser temperature control assembly 200 shown includes a sapphire substrate 210, a circuit layer disposed above the sapphire substrate, and a temperature measuring resistor 231 and a laser chip 221 connected to the circuit layer, wherein the circuit layer includes: a first pad pair and a first wire connected between the first pad pair, the middle of the first wire connected to the temperature measuring resistor 231; a second pad pair and a second wire connected between the second pad pair, the middle of the second wire connected to the laser chip 221, and the second wire is parallel to the first wire; a third pad pair and a heating wire 241 connected between the third pad pair, the heating wire includes a transverse portion and a longitudinal portion arranged at intervals, and the transverse portion is parallel to the second wire. The first pad pair includes pads 232 and pads 233, the second pad pair includes pads 222 and pads 223, and the third pad pair includes pads 242 and pads 243. The transverse portions of the first wire, the second wire and the heating wire are parallel to each other, which can reduce the occupied space of the wires and the heating wire, thereby reducing the volume of the laser temperature control assembly.
[0039] like Figure 2As shown, the heating line includes a first part located on the first side of the laser chip, a second part located on the second side of the laser chip, and a third part connecting the first part and the second part. The first part and the second part of the heating line are arranged in a bow shape with the first and the second side connected. The second side is the opposite side of the first side, and the temperature measuring resistor is located between the first part and the second part. The bow shape arrangement of the heating line with the first and the second side connected can make the heating line evenly dissipate heat. The first side of the laser chip is as shown in FIG. Figure 2 The upper side shown, the second side of the laser chip is as shown Figure 2 As shown in the lower side, the third part is located on the left side of the laser chip, and the heating wires are arranged on the left side, the upper side and the lower side of the laser chip, which can evenly heat the environment where the laser chip is located.
[0040] like Figure 2 As shown in FIG. 1 , the first pad pair, the second pad pair and the third pad pair are located on the side of the third side of the laser temperature control component. The third side of the laser chip is as shown in FIG. Figure 2 The first pad pair, the second pad pair and the third pad pair are all located on the same side of the laser control component, which can facilitate the connection of the laser control component with other circuit structures.
[0041] like Figure 3 As shown, the laser temperature control assembly includes a sapphire substrate 310, a circuit layer 350 and a solder resist layer 360 from bottom to top. The solder resist layer is arranged above the portion other than the external pads and the device connection of the circuit layer, the external pads include a first pad pair, a second pad pair and a third pad pair, and the device connection includes the connection between the circuit layer and the temperature measuring resistor 331, and the connection between the circuit layer and the laser chip 321. It can be seen that the position of the temperature measuring resistor 331 is not covered with the solder resist layer, and the position of the laser chip 321 is not covered with the solder resist layer. The solder resist layer is a thin coating that covers the circuit layer that does not need to be welded to prevent these areas from contacting with the solder during the welding process. The presence of the solder resist layer can ensure the accuracy and reliability of welding, prevent potential short circuits and electrical faults, and thus ensure the safety of the circuit when the wire spacing of the circuit layer of the laser temperature control assembly is small, so that the circuit safety can be ensured under the premise that the volume of the laser temperature control assembly is small.
[0042] In the disclosed embodiment, the circuit layer may be an aluminum foil layer or a copper foil layer formed by deposition technology and etching technology. Specifically, a metal conductor film may be formed on the upper surface of the sapphire substrate by chemical deposition, and then the unnecessary metal conductor may be removed by etching with chemical solution, leaving the metal conductor to form the circuit pattern of the circuit layer. This solution may increase the layout density of the circuit, thereby reducing the volume of the laser temperature control component.
[0043] like Figure 4 As shown, the embodiment of the present disclosure provides a laser temperature control circuit, including a controller 420 and a laser temperature control component 410, the controller and the laser temperature control component are connected through a first pad pair, a second pad pair and a third pad pair, and are used to control the operation of the laser chip, receive the measurement data of the temperature measuring resistor, and control the heating line to heat according to the measurement data. Among them, the controller includes a controller main chip and peripheral circuits such as a digital-to-analog conversion circuit, an analog-to-digital conversion circuit and a driving circuit. Among them, the types of peripheral circuits are not limited to digital-to-analog conversion circuits, analog-to-digital conversion circuits and driving circuits in practical applications.
[0044] The laser temperature control component 410 is the laser temperature control component 100 or the laser temperature control component 200 in the above technical solution. The controller is connected to the laser chip through the wire and the second pad pair, and can control the laser chip to generate laser. The controller is connected to the temperature measuring resistor through the wire and the first pad pair, and can obtain the temperature signal measured by the temperature measuring resistor. According to the temperature signal and the preset temperature threshold, the controller can determine whether the current temperature is the normal temperature required for the normal operation of the laser chip.
[0045] The controller is connected to the heating wire through a wire and a third pad pair. When the current temperature is lower than the normal temperature, a temperature control signal can be generated according to the difference between the current temperature and the normal temperature to control the heating wire to heat the environment where the laser chip is located.
[0046] The laser temperature control assembly 410 includes a sapphire substrate, a circuit layer disposed above the sapphire substrate, and a temperature measuring resistor and a laser chip connected to the circuit layer, wherein the circuit layer includes: a first pad pair and a first wire connected between the first pad pair, the middle of the first wire connected to the temperature measuring resistor; a second pad pair and a second wire connected between the second pad pair, the middle of the second wire connected to the laser chip, and the second wire is parallel to the first wire; a third pad pair and a heating wire connected between the third pad pair, the heating wire includes a transverse portion and a longitudinal portion disposed at intervals, and the transverse portion is parallel to the second wire. The transverse portions of the first wire, the second wire, and the heating wire are parallel to each other, which can reduce the occupied space of the wire and the heating wire, thereby reducing the volume of the laser temperature control assembly.
[0047] The first pad pair, the second pad pair, and the third pad pair of the laser temperature control assembly 410 are located on the side of the third side of the laser temperature control assembly. The first pad pair, the second pad pair, and the third pad pair are all located on the same side of the laser control assembly, which can facilitate the connection of the laser control assembly with other circuit structures.
[0048] The heating line of the laser temperature control component 410 includes a first part located on the first side of the laser chip, a second part located on the second side of the laser chip, and a third part connecting the first part and the second part, and the first part and the second part of the heating line are respectively arranged in a bow shape with the head and tail connected. Among them, the second side is the opposite side of the first side, and the temperature measuring resistor is located between the first part and the second part. The heating line is arranged in a bow shape with the head and tail connected, so that the heating line can evenly dissipate heat. The heating line is arranged on opposite sides of the laser chip, and the environment in which the laser chip is located can be evenly heated.
[0049] The laser temperature control component 410 includes a sapphire substrate, a circuit layer and a solder resist layer from bottom to top. The solder resist layer is arranged above the portion other than the external pads and the device connection of the circuit layer, and the external pads include a first pad pair, a second pad pair and a third pad pair. The device connection includes the connection between the circuit layer and the temperature measuring resistor, and the connection between the circuit layer and the laser chip. It can be seen that the position of the temperature measuring resistor is not covered with the solder resist layer, and the position of the laser chip is not covered with the solder resist layer. The presence of the solder resist layer can ensure the accuracy and reliability of welding, prevent potential short circuits and electrical failures, and thus ensure the safety of the circuit when the wire spacing of the circuit layer of the laser temperature control component is small, and thus ensure the safety of the circuit under the premise that the volume of the laser temperature control component is small.
[0050] In the disclosed embodiment, the circuit layer of the laser temperature control component 410 can be an aluminum foil layer or a copper foil layer formed by deposition technology and etching technology. Specifically, a metal conductor film can be formed on the upper surface of the sapphire substrate by chemical deposition, and then the unnecessary metal conductor can be etched away by chemical solution, leaving the metal conductor to form the circuit pattern of the circuit layer. This solution can increase the layout density of the circuit, thereby reducing the volume of the laser temperature control component.
[0051] In the embodiment of the present disclosure, the first pad pair, the second pad pair, and the third pad pair may be connected to the controller via bonding wires, respectively. The bonding wires may be gold bonding wires, but are not limited thereto.
[0052] Bonding is wire bonding (WB), which refers to the use of gold wire, copper wire or aluminum wire to connect the electrode lead on the surface of the semiconductor device chip to the base or the outer lead of the lead frame. The purpose of bonding is to connect the electrode on the surface of the semiconductor device chip to the outer lead of the lead frame. The bonding wire is the gold wire, aluminum wire, copper wire or alloy wire used in bonding technology.
[0053] Bonding technology uses the diffusion properties of metal particles under high temperature and high pressure to form a metal bonding layer at the interface between the chip and the packaging substrate. Compared with traditional welding methods, bonding technology does not require high-temperature treatment, so it can avoid the problem of thermal expansion mismatch between the chip and the packaging substrate, thereby improving the reliability and stability of bonding. Under appropriate process conditions, metal particles can diffuse evenly on the interface to form a dense metal bonding layer. The bonding wire has the characteristics of low resistance and high reliability, which can achieve high-density connection between chips.
[0054] According to the laser temperature control component and circuit provided by the embodiments of the present disclosure, by integrating the laser chip, temperature measuring resistor and heating wire on the same sapphire substrate, the functional devices can be arranged compactly, thereby reducing the volume of the product using the laser temperature control component.
[0055] The above are only preferred embodiments of the present disclosure and are not intended to limit the present disclosure. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present disclosure should be included in the protection scope of the present disclosure.
Claims
1. A laser temperature control component, characterized in that: The laser temperature control assembly includes a sapphire substrate, a circuit layer disposed above the sapphire substrate, and a temperature measuring resistor and a laser chip disposed above and connected to the circuit layer, wherein the circuit layer includes: A first pad pair and a first wire connected between the first pad pair, wherein the middle portion of the first wire is connected to the temperature measuring resistor; A second pad pair and a second wire connected between the second pad pair, wherein the middle of the second wire is connected to the laser chip, and the second wire is parallel to the first wire; A third pad pair and a heating line connected between the third pad pair, wherein the heating line comprises a transverse portion and a longitudinal portion that are spaced apart, and the transverse portion is parallel to the second conductive line.
2. The laser temperature control assembly according to claim 1, characterized in that: The temperature measuring resistor is a platinum resistor.
3. The laser temperature control assembly according to claim 1, characterized in that: The laser chip is a vertical cavity surface emitting laser chip.
4. The laser temperature control assembly according to claim 1, characterized in that: The heating wire is a gold-plated heating wire.
5. The laser temperature control assembly according to claim 1, characterized in that: The heating line is arranged in a bow shape with the ends connected; and / or, the heating line includes a first part located on the first side of the laser chip and a second part located on the second side of the laser chip, and a third part connecting the first part and the second part, wherein the second side is the opposite side of the first side, and the temperature measuring resistor is located between the first part and the second part.
6. The laser temperature control assembly according to claim 1, characterized in that: The first pad pair, the second pad pair, and the third pad pair are located on the sides of a third side of the laser temperature control assembly.
7. The laser temperature control assembly according to claim 1, characterized in that: A solder resist layer is provided above the portion of the circuit layer other than the external solder pads and the device connection, the external solder pads include the first solder pad pair, the second solder pad pair and the third solder pad pair, the device connection includes the connection between the circuit layer and the temperature measuring resistor, and the connection between the circuit layer and the laser chip.
8. The laser temperature control assembly according to claim 1, characterized in that: The circuit layer includes an aluminum foil layer or a copper foil layer formed by deposition technology and etching technology.
9. A laser temperature control circuit, characterized in that: The laser temperature control circuit includes a controller and a laser temperature control component according to any one of claims 1 to 8, wherein the controller is connected to the laser temperature control component through the first pad pair, the second pad pair and the third pad pair, and is used to control the operation of the laser chip, receive measurement data of the temperature measuring resistor and control the heating wire to heat according to the measurement data.
10. The laser temperature control circuit according to claim 9, characterized in that: The first pad pair, the second pad pair and the third pad pair are connected to the controller through bonding wires respectively.