Camera module and electronic equipment

Abstract

The invention discloses a camera module and electronic equipment, and relates to the field of electronic equipment. A camera module comprises a support assembly and a camera. The support assembly comprises a fence and a heat-conducting medium, the fence defines an installation space, the camera is arranged in the installation space, and the heat-conducting medium is arranged on the fence and can be distributed in the surrounding direction of the fence; the enclosure is provided with a heat absorption area and a heat dissipation area, the camera is provided with a heat source part, the heat-conducting medium is used for being matched with the heat source part in the heat absorption area so as to be used for absorbing heat generated by the heat source part, and the heat-conducting medium is further used for conveying the heat to the heat dissipation area so as to be used for dissipating the heat. According to the embodiment of the invention, the problem of poor heat dissipation effect of the current camera module can be solved.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to a camera module and electronic equipment. Background Art

[0002] In electronic devices (such as mobile phones, etc.), due to limited space and to control the height of the convex bump of the whole device as much as possible, the camera module (such as a periscope camera) is fixed and limited by a separate bracket. However, due to the poor thermal conductivity of some brackets, the heat generated in the chip area of ​​the camera module cannot be quickly dissipated, which can easily cause junction temperature risks and even damage the camera module. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a camera module and an electronic device that can solve the problems of poor heat dissipation effect of the current camera module.

[0004] In order to solve the above technical problems, this application is implemented as follows:

[0005] The embodiment of the present application provides a camera module, including: a bracket assembly and a camera;

[0006] The bracket assembly includes an enclosure and a heat-conducting medium, the enclosure encloses an installation space, the camera is arranged in the installation space, and the heat-conducting medium is arranged in the enclosure and can be distributed along the surrounding direction of the enclosure;

[0007] The enclosure has a heat absorption area and a heat dissipation area, the camera has a heat source part, the heat conductive medium is used to cooperate with the heat source part in the heat absorption area to absorb the heat generated by the heat source part, and the heat conductive medium is also used to transport the heat to the heat dissipation area to dissipate the heat.

[0008] An embodiment of the present application also provides an electronic device, including: the above-mentioned camera module, wherein the camera module is a periscope camera module.

[0009] In an embodiment of the present application, the installation space enclosed by the enclosure can accommodate the camera; the heat-conducting medium is arranged on the enclosure and can be distributed along the surrounding direction of the enclosure. In this way, the heat absorbed by the heat-absorbing area of ​​the enclosure from the heat source part of the camera can be transferred through the heat-conducting medium, so that the heat is transferred to the heat dissipation area of ​​the enclosure, and finally the heat is dissipated outwardly through the heat dissipation area, thereby achieving the heat dissipation and cooling effect of the camera, so as to alleviate the problem of junction temperature risk caused by heat accumulation in the camera due to poor heat dissipation effect of the bracket assembly, and thus effectively prevent the camera from being damaged due to excessive temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1This is a first assembly schematic diagram of the camera module disclosed in the embodiment of the present application;

[0011] Figure 2 This is a second assembly schematic diagram of the camera module disclosed in the embodiment of the present application;

[0012] Figure 3 This is a disassembly diagram of the camera module disclosed in the embodiment of the present application;

[0013] Figure 4 A schematic diagram of the structure of the bracket assembly disclosed in the embodiment of the present application;

[0014] Figure 5 A partial cross-sectional schematic diagram of the bracket assembly and the camera disclosed in the embodiment of the present application;

[0015] Figure 6 A schematic diagram of the structure of the first enclosure disclosed in an embodiment of the present application;

[0016] Figure 7 A schematic diagram of the structure of the second enclosure disclosed in an embodiment of the present application;

[0017] Figure 8 A disassembly diagram of another form of camera module disclosed in an embodiment of the present application;

[0018] Fig. 9 This is an assembly flow chart of the camera module disclosed in the embodiment of the present application.

[0019] Description of reference numerals:

[0020] 10- bracket assembly;

[0021] 11-enclosure; 111-first enclosure; 1111-groove; 1112-first protrusion; 1113-notch; 112-second enclosure; 1121-input port; 1122-second protrusion; P-installation space; Q-accommodation channel; M-heat absorption zone; N-heat dissipation zone;

[0022] 12-heat conducting medium; 121-heat conducting liquid; 122-metal wire;

[0023] 20- camera; 21- heat source unit. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0025] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0026] The embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0027] refer to Figures 1 to 9 An embodiment of the present application discloses a camera module, which includes a bracket assembly 10 and a camera 20.

[0028] The bracket assembly 10 is a basic installation component, which can provide an installation basis for the camera 20. In addition, the bracket assembly 10 can also play a heat dissipation role for the camera 20 to prevent the camera 20 from overheating during operation.

[0029] The camera 20 may have a heat source 21, which may be a chip, etc. During the operation of the camera 20, the heat source 21 may generate heat, causing the temperature of the camera 20 to rise. In the embodiment of the present application, the bracket assembly 10 may absorb the heat of the heat source 21 and dissipate the heat to the outside, thereby achieving heat dissipation and cooling effects on the camera 20.

[0030] The bracket assembly 10 includes a fence 11, which can be used to install and fix the camera 20 to ensure the stability of the camera 20. In some embodiments, the fence 11 can enclose an installation space P, and the camera is arranged in the installation space P, such as Figures 1 to 4 As shown. Exemplarily, the installation space P can be a space surrounded by a tank body, or a space surrounded by a ring body. Of course, it can also be in other forms, which are not specifically limited here.

[0031] In some embodiments, the camera 20 may be a periscope camera, and the enclosure 11 may be arranged around the camera 20 to play a role in fixed installation. For example, the camera 20 may be in a rectangular shape, a cylindrical shape, etc., and accordingly, the enclosure 11 may be a rectangular ring frame structure or a circular ring frame structure to adapt to the shape of the camera 20.

[0032] Taking into account that the camera 20 generates heat and dissipates it outward during operation, in order to prevent the enclosure 11 from hindering the heat from dissipating outward, in the embodiment of the present application, the enclosure 11 may have a heat transfer function. In this way, the heat emitted by the camera 20 can be received by the enclosure 11 and transferred outward, thereby playing a certain heat dissipation and cooling effect on the camera 20.

[0033] In some embodiments, the enclosure 11 may be made of metal material, which has high strength and good thermal conductivity, and can ensure the stability of the camera 20 installation and the heat dissipation effect of the camera 20. For example, the metal material may be aluminum alloy, etc., and the processing technology used is die casting or powder metallurgy, etc.

[0034] However, different application environments require redesign of the enclosure 11 and even the entire bracket assembly 10, and correspondingly, the mold of the enclosure 11 and even the entire bracket assembly 10 needs to be redesigned, which makes the manufacturing cost relatively high; and, the metal enclosure 11 is heavy, which may increase the weight of the electronic device and affect the user experience.

[0035] Based on the above situation, the enclosure 11 can also be made of non-metallic materials. Compared with the enclosure 11 made of metal materials, on the one hand, it can reduce the manufacturing difficulty, and on the other hand, it can also reduce weight and reduce costs.

[0036] The non-metallic material may include plastic, etc. Of course, it may also be other types, which are not specifically limited here.

[0037] In addition, the enclosure 11 can be formed by injection molding to improve molding efficiency and also improve the overall strength of the enclosure 11.

[0038] However, the thermal conductivity of some non-metallic enclosures 11 is weaker than that of metal enclosures 11, making it difficult for the heat generated by the camera 20 to be transmitted and dissipated through the non-metallic enclosures 11, which can easily lead to junction temperature risks. If the heat cannot be dissipated for a long time, the camera 20 will be overheated and damaged.

[0039] Based on the above situation, in the embodiment of the present application, the heat conducting medium 12 is provided in the enclosure 11 and can be distributed along the surrounding direction of the enclosure 11 to transfer heat through the heat conducting medium 12. Exemplarily, the heat conducting medium 12 can be provided inside the enclosure 11 so as to surround the heat conducting medium 12 through the enclosure 11; of course, it can also be provided on the surface of the enclosure 11 so as to directly contact with the camera 20, which is conducive to improving the heat conduction efficiency.

[0040] like Figure 1 and Figure 2As shown, the enclosure 11 may have a heat absorption area M and a heat dissipation area N. The heat absorption area M is used to absorb the heat emitted by the camera 20, and the heat dissipation area N is used to dissipate the heat outwards. In addition, the heat absorption area M and the heat dissipation area N may be spaced a certain distance apart to reduce mutual interference between the two.

[0041] Among them, the heat absorption zone M can be set close to the heat source part 21 of the camera 20, such as in contact with the heat source part 21, or at a small distance, so that the heat at the heat source part 21 can be efficiently transferred to the heat absorption zone M; the heat dissipation zone N is set away from the heat source part 21 to facilitate heat dissipation and prevent the dissipated heat from affecting the heat source part 21.

[0042] Taking into account the cost, weight, manufacturing complexity and other factors of the enclosure 11 and even the entire bracket assembly 10, a non-metallic enclosure 11 can be used. In order to achieve efficient heat transfer between the heat absorption zone M and the heat dissipation zone N, the thermal conductive medium 12 is located between the heat absorption zone M and the heat dissipation zone N, and is used to transfer heat between the heat absorption zone M and the heat dissipation zone N. In this way, the thermal conductive medium 12 can effectively alleviate the problem of relatively weak thermal conductivity of the non-metallic enclosure 11 itself, so that the heat absorbed by the heat absorption zone M can be quickly and efficiently transferred to the heat dissipation zone N, and finally the heat is dissipated through the heat dissipation zone N. Therefore, the heat dissipation and cooling effect of the camera 20 can be achieved.

[0043] Based on the above configuration, the heat conducting medium 12 in the embodiment of the present application is used to cooperate with the heat absorbing area M and the heat source part 21 to absorb the heat generated by the heat source part 21, and to transfer the heat to the heat dissipating area N for dissipating the heat.

[0044] In the embodiment of the present application, the installation space P enclosed by the enclosure 11 of the bracket assembly 10 can accommodate the camera 20, and the heat-conducting medium 12 is arranged on the enclosure 11 and can be distributed along the surrounding direction of the enclosure 11. In this way, the heat absorbed by the heat-absorbing area of ​​the enclosure 11 from the heat source part 21 of the camera 20 can be transferred through the heat-conducting medium 12, so that the heat is transferred to the heat dissipation area N of the enclosure 11, and finally the heat is dissipated outwardly through the heat dissipation area N, thereby achieving the heat dissipation and cooling effect of the camera 20, so as to alleviate the problem of junction temperature risk caused by heat accumulation in the camera 20 due to poor heat dissipation effect of the bracket assembly 10, and thus effectively prevent the camera 20 from being damaged due to excessive temperature.

[0045] refer to Figure 5 In some embodiments, the enclosure 11 may be provided with a receiving channel Q, which extends along the circumferential direction of the enclosure 11, and the heat-conducting medium 12 is provided in the receiving channel Q for transferring heat between the heat-absorbing area M and the heat-dissipating area N. Based on this configuration, the heat-conducting medium 12 can be accommodated through the receiving channel Q, and a certain protective effect can also be played.

[0046] It should be noted here that the accommodating channel Q can be a closed channel to fully wrap the heat-conducting medium 12 , or can be a channel with an open side wall so that a part of the heat-conducting medium 12 can be exposed and in direct contact with the camera 20 .

[0047] In other embodiments, the heat-conducting medium 12 may also be disposed on the side wall of the enclosure 11 facing the installation space P, so that the heat-conducting medium 12 can be completely in contact with the camera 20 , which may be beneficial to improving the heat dissipation effect to a certain extent.

[0048] refer to Figures 3 to 8 In some embodiments, the enclosure 11 may include a first enclosure 111 and a second enclosure 112, and the second enclosure 112 is arranged outside the first enclosure 111. The first enclosure 111 is connected to the second enclosure 112 to form a receiving channel Q to receive the heat-conducting medium 12. Based on this situation, the heat-conducting medium 12 can be enclosed in the receiving channel Q between the first enclosure 111 and the second enclosure 112, so that a certain protection effect can be played on the heat-conducting medium 12, and the heat-conducting medium 12 can be separated from the external environment to prevent the external environment from affecting the heat-conducting effect of the heat-conducting medium 12.

[0049] Optionally, the connection between the first enclosure 111 and the second enclosure 112 may be a fixed connection or a detachable connection. The fixed connection includes bonding, welding, riveting, etc., and the detachable connection includes plugging, snapping, sliding, etc. In some more specific embodiments, the first enclosure 111 and the second enclosure 112 may be fixed by ultrasonic welding.

[0050] refer to Figure 3 and Figure 8 In some embodiments, a groove 1111 may be provided on the surface of the first enclosure 111 facing the second enclosure 112, and the groove 1111 extends from the heat absorption zone M to the heat dissipation zone N, and the surface of the second enclosure 112 facing the first enclosure 111 is blocked at the notch of the groove 1111 of the first enclosure 111, so that the groove 1111 with the blocked notch can form an accommodating channel Q, and the heat conducting medium 12 is arranged in the groove 1111, so that the heat absorbed by the heat absorption zone M can be transferred to the heat dissipation zone N through the heat conducting medium 12 for dissipation.

[0051] In other embodiments, the surface of the second enclosure 112 facing the first enclosure 111 may be provided with a groove 1111, which extends from the heat absorption zone M to the heat dissipation zone N, and the surface of the first enclosure 111 facing the second enclosure 112 is blocked at the notch of the groove 1111 of the second enclosure 112. In this way, the groove 1111 with the blocked notch can form an accommodating channel Q, and the heat conductive medium 12 is arranged in the groove 1111, so that the heat absorbed by the heat absorption zone M can be transferred to the heat dissipation zone N through the heat conductive medium 12 for dissipation.

[0052] In some further embodiments, a surface of the first enclosure 111 facing the second enclosure 112, and a surface of the second enclosure 112 facing the first enclosure 111 are both provided with grooves 1111, and the two grooves 1111 extend from the heat absorption zone M to the heat dissipation zone N, and are arranged opposite to each other, and the notches of the grooves 1111 of the first enclosure 111 and the notches of the grooves 1111 of the second enclosure 112 are interlocked to form an accommodating channel Q, and the heat conducting medium 12 is arranged between the two grooves 1111, so as to transfer the heat absorbed by the heat absorption zone M to the heat dissipation zone N through the heat conducting medium 12 for dissipation.

[0053] The above three situations can all be achieved by setting a heat-conducting medium 12 inside the enclosure 11, and transferring heat between the heat absorption area M and the heat dissipation area N of the enclosure 11 through the heat-conducting medium 12, so that the heat generated by the heat source part 21 can be transferred and dissipated through the heat-conducting medium 12, thereby ensuring that the temperature of the camera 20 is prevented from being too high.

[0054] In addition, the extending direction of the groove 1111 from the heat absorption area M to the heat dissipation area N is not limited to one direction, but can be adaptively set according to the shape of the enclosure 11 and the shape of the heat source part 21. Exemplarily, the groove 1111 can extend from the heat absorption area M to the heat dissipation area N along a straight line direction, and can also extend from the heat absorption area M to the heat dissipation area N along a curved line direction, such as an arc line, a broken line, etc.

[0055] refer to Figure 3 In some embodiments, the heat conducting medium 12 may be a heat conducting liquid 121, so that the groove 1111 is filled with the heat conducting liquid 121, and the heat conducting liquid 121 may flow in the groove 1111. The heat conducting liquid 121 may be deionized water, methanol, acetone, ethanol or other liquids, and of course, may also be other liquids, which are not specifically limited here.

[0056] In addition, the groove 1111 may be a capillary groove, and the heat-conducting liquid 121 may form a capillary effect in the capillary groove, so that the heat-conducting liquid 121 can flow in the capillary groove.

[0057] Based on the above situation, the heat-conducting medium 12 is used to change from liquid to gas when absorbing heat, and flows from the heat absorption zone M to the heat dissipation zone N through the capillary groove. Specifically: when the heat absorption zone M absorbs heat, the heat-conducting medium 12 near the heat absorption zone M in the capillary groove changes from liquid to gas after being heated, that is, the heat-conducting liquid 121 evaporates into gas when heated, and as gas is continuously generated in the area near the heat absorption zone M in the capillary groove, the pressure in the area will increase, so that the gas flows from the heat absorption zone M to the heat dissipation zone N along the capillary groove. At the same time, in the process of the heat-conducting medium 12 changing from liquid to gas, it will absorb heat, and as the gas flows, the heat will be transferred from the heat absorption zone M to the heat dissipation zone N, thereby achieving a cooling effect on the heat source part 21 and alleviating the problem of excessive temperature of the camera 20.

[0058] In addition, the heat-conducting medium 12 is also used to change from gas to liquid when releasing heat, and to flow back from the heat dissipation area N to the heat absorption area M via the capillary grooves. Specifically: when the gas flows to the heat dissipation area N and encounters cold, it will change from gas to liquid in the heat dissipation area N and release heat, thereby achieving heat dissipation; the heat-conducting liquid 121 formed by gas condensation will flow back from the heat dissipation area N to the heat absorption area M again under the capillary action of the capillary grooves to replenish the heat absorption area M with the heat-conducting liquid 121. In this way, as the heat-conducting liquid 121 changes from liquid to gas to absorb heat, and from gas to liquid to release heat, the heat transfer between the heat absorption area M and the heat dissipation area N and the heat dissipation from the heat dissipation area N are achieved, thereby achieving an autonomous heat dissipation effect on the camera 20 and achieving a better cooling effect.

[0059] In other embodiments, the heat conducting medium 12 may also be a metal wire 122, such as Figure 8 As shown, the metal wire 122 is arranged inside the enclosure 11, or at least partially exposed outside the enclosure 11. Specifically: the enclosure 11 may have an inner surface facing the installation space P and an outer surface facing away from the installation space P, and the metal wire 122 may be arranged between the inner surface and the outer surface, or the metal wire 122 may be arranged on the inner surface.

[0060] In some more specific embodiments, the metal wire 122 may be inserted into the accommodating channel Q and extend from the heat absorbing area M to the heat dissipating area N. Based on this, the heat absorbed by the heat absorbing area M may be quickly and efficiently transferred to the heat dissipating area N through the metal wire 122, so as to dissipate the heat in the heat dissipating area N. Of course, the heat conducting medium 12 may also be in the form of graphite strips, etc., as long as it can transfer heat, and the specific form is not limited.

[0061] In the embodiment of the present application, in order to speed up the heat dissipation efficiency in the heat dissipation area N, the heat dissipation area N can be brought into contact with the cold source of the electronic device, such as a heat sink or other structure. Of course, the heat dissipation area N can also be exposed to the external environment, or a fan can be used to blow gas to the heat dissipation area N to improve the heat dissipation efficiency.

[0062] In order to further improve the cooling effect on the camera 20, the area of ​​the heat-conducting medium 12 can be increased so as to increase the heat transfer area between the heat-conducting medium 12 and the heat source part 21, which is beneficial to improve the heat absorption efficiency and further improve the cooling effect.

[0063] In some embodiments, the heat conductive medium 12 can be arranged in multiple layers on the enclosure 11. The area of ​​the heat absorption zone M of the enclosure 11 covered by the multiple layers of heat conductive medium 12 is increased, thereby increasing the heat transfer area between the heat conductive medium 12 and the heat source part 21. In this way, heat is transferred from the heat absorption zone M to the heat dissipation zone N through the multiple layers of heat conductive medium 12, thereby improving the heat transfer efficiency and further improving the cooling effect on the camera 20.

[0064] Accordingly, the enclosure 11 may be provided with a plurality of accommodating channels Q, which are stacked along the extension direction of the center line of the enclosure 22, and each layer of the accommodating channels Q is provided with a heat conducting medium 12 which can be distributed along the surrounding direction of the enclosure 11. Based on this, the heat dissipation efficiency can be improved by providing multiple layers of heat conducting medium 12.

[0065] Furthermore, a multi-layer accommodating channel Q is formed between the first enclosure 111 and the second enclosure 112, and a heat-conducting medium 12 is provided in each layer of the accommodating channel Q. In this way, the multi-layer accommodating channel Q can accommodate multiple layers of heat-conducting media 12 to prevent the multiple layers of heat-conducting media 12 from interfering with each other and affecting the heat transfer efficiency.

[0066] refer to Figures 1 to 3 and Figure 6 In some more specific embodiments, the surface of the first enclosure 111 facing the second enclosure 112 may be provided with a plurality of grooves 1111, each layer of grooves 1111 extending from the heat absorption zone M to the heat dissipation zone N, and the surface of the second enclosure 112 facing the first enclosure 111 is sealed at the notch of the plurality of grooves 1111 of the first enclosure 111 to form a plurality of accommodating channels Q.

[0067] In other embodiments, the surface of the second enclosure 112 facing the first enclosure 111 may be provided with a plurality of layers of grooves 1111, each layer of grooves 1111 extending from the heat absorption zone M to the heat dissipation zone N, and the surface of the first enclosure 111 facing the second enclosure 112 is sealed at the notches of the plurality of layers of grooves 1111 of the second enclosure 112 to form a plurality of layers of accommodating channels Q.

[0068] In some further embodiments, a surface of the first enclosure 111 facing the second enclosure 112, and a surface of the second enclosure 112 facing the first enclosure 111 are both provided with a plurality of layers of grooves 1111, each layer of grooves 1111 extends from the heat absorption zone M to the heat dissipation zone N, and are arranged relative to each other, and the notches of the plurality of layers of grooves 1111 of the first enclosure 111 correspond to the notches of the plurality of layers of grooves 1111 of the second enclosure 112, respectively, to form a plurality of layers of accommodating channels Q.

[0069] In order to facilitate the input of the heat-conducting medium 12 into the containing channel Q, the side wall of the enclosure 11 can be provided with an openable and closable input port 1121, and each layer of the containing channel Q has a channel notch 1113 connected to the input port 1121, so that the heat-conducting medium 12 can be input into each layer of the containing channel Q through the input port and the notch 1113.

[0070] Of course, in order to prevent the heat-conducting medium 12 from escaping from the accommodation channel Q via the input port 1121, in the embodiment of the present application, a sealing material may be provided at the input port 1121, and the input port 1121 is blocked by the sealing material to prevent the heat-conducting medium 12 from escaping from the accommodation channel Q. The sealing material may be a sealant, or, of course, a plug.

[0071] refer to Figure 5 In some embodiments, the first enclosure 111 may be provided with a first protrusion 1112 at one end along the center line of the enclosure 11, and the first protrusion 1112 protrudes from the outer plate surface of the first enclosure 111 and extends along the circumferential direction of the enclosure; accordingly, the second enclosure 112 is provided with a second protrusion 1122 at one end along the center line, and the second protrusion 1122 protrudes from the inner half surface of the second enclosure 112 and extends along the circumferential direction of the enclosure 11.

[0072] When the first enclosure 111 and the second enclosure 112 are connected, the other end of the first enclosure 111 away from the first protrusion 1112 is sealedly connected to the end face of the inner half surface of the second enclosure 112 adjacent to the second protrusion 1122, and the other end of the second enclosure 112 away from the second protrusion 1122 is sealedly connected to the end face of the outer panel surface of the first enclosure 111 adjacent to the first protrusion 1112.

[0073] Based on the above arrangement, the volume of the entire enclosure 11 can be reduced while ensuring the firmness, reliability and sealing of the connection between the first enclosure 111 and the second enclosure 112, thereby reducing the space occupied by the camera module in the electronic device and alleviating the problem of cramped space.

[0074] In some more specific embodiments, the cross-section of the first enclosure 111 can be L-shaped, and the cross-section of the second enclosure 112 can also be L-shaped. In this case, the surface of the first enclosure 111 facing the second enclosure 112 can form a step surface, and the surface of the second enclosure 112 facing the first enclosure 111 can form a step surface. In this way, when the first enclosure 111 and the second enclosure 112 are connected, the two can be interlocked with each other, that is, the long side of the first enclosure 111 is in contact with the long side of the second enclosure 112, the end face of the long side of the first enclosure 111 is connected to the end face of the short side of the second enclosure 112, and the end face of the short side of the second enclosure 112 is connected to the end face of the long side of the second enclosure 112, thereby reducing the volume of the entire enclosure 11, and then reducing the space occupied by the camera module in the electronic device, which is conducive to alleviating the problem of cramped space.

[0075] To ensure the closedness of the accommodating cavity, ultrasonic welding can be used to fix the contact area between the first enclosure 111 and the second enclosure 112 to ensure the closedness of the accommodating cavity, prevent dust and the like from entering the accommodating cavity, and prevent the heat-conducting liquid 121 from leaking.

[0076] Based on the above-mentioned bracket assembly 10, an embodiment of the present application further discloses an electronic device, and the disclosed electronic device includes the above-mentioned camera module, wherein the camera module is a periscope camera module.

[0077] In summary, the embodiment of the present application provides a bracket assembly 10 with an autonomous heat dissipation function, which can reduce the weight of the bracket assembly 10 and the manufacturing cost while ensuring a good heat dissipation effect by combining a non-metallic enclosure 11 with a heat-conducting medium 12.

[0078] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A camera module, characterized in that: include: A bracket assembly (10) and a camera (20); The support assembly (10) comprises a enclosure (11) and a heat-conducting medium (12), wherein the enclosure (11) encloses an installation space (P), the camera (20) is arranged in the installation space (P), and the heat-conducting medium (12) is arranged in the enclosure (11) and can be distributed along the surrounding direction of the enclosure (11); The enclosure (11) has a heat absorption area (M) and a heat dissipation area (N), the camera (20) has a heat source part (21), the heat conducting medium (12) is used to cooperate with the heat source part (21) in the heat absorption area (M) to absorb the heat generated by the heat source part (21), and the heat conducting medium (12) is also used to transport the heat to the heat dissipation area (N) to dissipate the heat.

2. The camera module according to claim 1, characterized in that: The enclosure (11) is provided with a receiving channel (Q), and the receiving channel (Q) extends along the circumferential direction of the enclosure (11); The heat-conducting medium (12) is arranged in the containing channel (Q) and is used to transfer heat between the heat-absorbing area (M) and the heat-dissipating area (N).

3. The camera module according to claim 2, characterized in that: The enclosure (11) comprises a first enclosure plate (111) and a second enclosure plate (112), wherein the second enclosure plate (112) is arranged outside the first enclosure plate (111); A surface of the first enclosure (111) facing the second enclosure (112), and / or a surface of the second enclosure (112) facing the first enclosure (111) is provided with a groove (1111), wherein the groove (1111) extends from the heat absorption area (M) to the heat dissipation area (N); The surface of one of the first enclosure (111) and the second enclosure (112) is sealed to the notch of the groove (1111) of the other, or the notches of the grooves (1111) of both are interlocked to form the accommodating channel (Q).

4. The camera module according to claim 3, characterized in that: The groove (1111) is a capillary groove, and the heat-conducting medium (12) is a heat-conducting liquid (121); The heat-conducting medium (12) is used to transform from liquid to gas when absorbing heat, and to flow from the heat-absorbing area (M) to the heat-dissipating area (N) via the capillary grooves; The heat-conducting medium (12) is used to transform from gas to liquid when releasing heat, and to flow back from the heat-dissipating area (N) to the heat-absorbing area (M) via the capillary grooves.

5. The camera module according to claim 2, characterized in that: The enclosure (11) is provided with a plurality of the accommodating channels (Q), and the plurality of the accommodating channels (Q) are stacked along the center line direction of the enclosure (11); The heat-conducting medium (12) is arranged in each layer of the accommodating channel (Q) and can be distributed along the surrounding direction of the enclosure (11).

6. The camera module according to claim 5, characterized in that: The side wall of the enclosure (11) is provided with an input port (1121) that can be opened and closed; Each layer of the accommodating channel (Q) is connected to the input port (1121) via a notch (1113).

7. The camera module according to claim 3 or 4, characterized in that: A first protrusion (1112) is provided at one end of the first enclosure plate (111) along the center line of the enclosure (11), and the first protrusion (1112) protrudes from the outer plate surface of the first enclosure plate (111) and extends along the circumferential direction of the enclosure (11); A second protrusion (1122) is provided at one end of the second enclosure plate (112) along the center line, and the second protrusion (1122) protrudes from the inner plate surface of the second enclosure plate (112) and extends along the circumferential direction of the enclosure (11); The other end of the first enclosure plate (111) away from the first protrusion (1112) is sealingly connected to the end surface of the second protrusion (1122) adjacent to the inner plate surface of the second enclosure plate (112); The other end of the second enclosure plate (112) away from the second protrusion (1122) is sealedly connected to the end surface of the first protrusion (1112) adjacent to the outer plate surface of the first enclosure plate (111).

8. The camera module according to claim 1 or 2 or 3 or 5 or 6, characterized in that: The heat conducting medium (12) is a metal wire (122); The enclosure (11) has an inner surface facing the installation space (P) and an outer surface facing away from the installation space (P), and the metal wire (122) is arranged between the inner surface and the outer surface, or the metal wire (122) is arranged on the inner surface.

9. The camera module according to claim 1, characterized in that: The material of the enclosure (11) is a non-metallic material, and the non-metallic material includes plastic or plastic; And / or, the enclosure (11) is formed by injection molding.

10. An electronic device, characterized in that: include: The camera module described in any one of claims 1 to 9 is a periscope camera module.

Images