Circuit board assembly and electronic equipment

Abstract

The invention provides a circuit board assembly and electronic equipment, and relates to the technical field of electronic equipment. The electronic equipment comprises a shell, a circuit board assembly and an electronic device. The circuit board assembly comprises a circuit board, the surface of the circuit board is provided with a first area, the first area is used for arranging electronic devices, and only one electronic device can be arranged in the first area. The first area is provided with a plurality of first welding spots and a plurality of second welding spots, and the first welding spots and the second welding spots are used for being connected with different electronic devices respectively. The problem that the production cost of the circuit board is high due to the fact that different circuit boards are manufactured for different electronic devices is solved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a circuit board assembly and an electronic equipment. Background Art

[0002] With the evolution of terminal electronic products, it has become common to use a standardized circuit board with multiple electronic devices of different specifications. Due to the large number of electronic device manufacturers, the specifications of each electronic device are inconsistent. Therefore, different circuit boards need to be made for different electronic devices, which increases the production cost of the circuit boards. Summary of the invention

[0003] The present application provides a circuit board assembly and an electronic device, which are used to solve the problem that different circuit boards are manufactured for different electronic devices, resulting in high production costs of the circuit boards.

[0004] In order to achieve the above objectives, this application adopts the following technical solutions: In a first aspect, the present application provides a circuit board assembly, including a circuit board, wherein the surface of the circuit board has a first area, the first area is used to set an electronic device, and the first area can only set one electronic device. The first area is provided with a plurality of first solder joints and a plurality of second solder joints, and the plurality of first solder joints and the plurality of second solder joints are respectively used to connect different electronic devices.

[0005] The circuit board assembly provided in the first aspect of the present application, by setting the first solder point and the second solder point in the first area, realizes that different electronic devices can be selectively connected to the same area of ​​the circuit board, thereby improving the application scope of the circuit board, effectively reducing the production cost of the circuit board, and meeting the normalized design requirements of the circuit board.

[0006] In a possible implementation manner of the first aspect, the plurality of first welding points are sequentially distributed to form an annular area, and the plurality of second welding points are disposed in the annular area.

[0007] In this structure, based on the formation of a ring with multiple first solder joints, the electronic devices connected by the first solder joints cover a relatively large area in the first area, and the second solder joints are arranged in the ring area, and the electronic devices connected by the second solder joints also cover a relatively large area in the first area. Compared with dividing the first solder joints and the second solder joints into a left-right layout in the width direction, or dividing them into an up-and-down layout in the length direction in the first area, the ring area will make the electronic devices cover a larger area in the first area, which is conducive to improving the connection strength of the electronic devices in the first area.

[0008] In another possible implementation of the first aspect, the plurality of second welding points include a plurality of first sub-welding points and a plurality of second sub-welding points, the plurality of first sub-welding points are sequentially distributed along the length direction of the annular region, and the plurality of second sub-welding points are sequentially distributed along the length direction of the annular region. The plurality of first sub-welding points and the plurality of second sub-welding points are sequentially and alternately distributed along the length direction of the annular region, and the first sub-welding points and the second sub-welding points are distributed along the width direction of the annular region.

[0009] In this way, it is helpful to increase the distance between two adjacent first sub-solder points and second sub-solder points, and can reduce the risk of tin flows on the first sub-solder points and the second sub-solder points converging together when multiple second solder points are connected to electronic devices, causing the electronic devices or circuit boards to short-circuit due to the connection between the two solder points, thereby improving the reliability of the second solder point welding.

[0010] In another possible implementation manner of the first aspect, along the width direction of the annular area, the first sub-soldering point and the adjacent first soldering point with the smallest distance are used to connect to the same functional circuit of the circuit board.

[0011] In this way, when the electronic device is soldered to the plurality of first solder joints in the first area, even if the tin of the first solder joint flows to the second solder joint that is closer, so that the two solder joints are connected together, since the two solder joints are connected to the same functional circuit, a short circuit will not occur, which is conducive to ensuring the stability of the electrical connection between the electronic device and the circuit board, thereby ensuring the reliability of the entire circuit on the circuit board.

[0012] In another possible implementation manner of the first aspect, along the width direction of the annular area, the second sub-soldering point and the adjacent first soldering point with the smallest distance therebetween are used to connect to the same functional circuit of the circuit board.

[0013] In this way, when the electronic device is soldered to multiple first solder joints in the first area, even if the tin of the first solder joint flows to the second solder joint and causes excessive tin between the solder joints, the circuit board or the electronic device will not be short-circuited due to excessive tin, thereby ensuring the stability of the electrical connection between the electronic device and the circuit board, thereby ensuring the reliability of the entire circuit on the circuit board.

[0014] In another possible implementation manner of the first aspect, a plurality of third welding points are further disposed on the first area, the third welding points are disposed outside the annular area, and the third welding points and the second welding points are used to connect to the same electronic device.

[0015] In this way, due to the limited space in the annular area, the number of the plurality of second solder joints is limited by the annular space. Therefore, a third solder joint is set outside the annular area, and the second solder joint and the third solder joint are used to connect the same electronic device, thereby improving the connection strength between the electronic device and the circuit board, thereby reducing the risk of the solder joint between the electronic device and the circuit board breaking due to bumps or collisions, causing the electronic device and the circuit board to separate.

[0016] In another possible implementation of the first aspect, the circuit board assembly also includes an adapter board, the adapter board having a first surface and a second surface arranged opposite to each other, the first surface being used to connect to the second solder point, and a plurality of fourth solder points being arranged on the second surface, and the fourth solder points and the first solder points being used to connect different electronic devices.

[0017] As a result, based on electronic devices of different specifications and different pin sequences, one electronic device is connected through a circuit board, and another electronic device is connected through an adapter board, thereby achieving compatibility between the circuit board and the adapter board, which is conducive to the development trend of normalization of circuit boards.

[0018] For example, the electronic device may be a camera module, and the pin sequence of different models of camera modules is different. Therefore, the first solder joint on the circuit board can be used to connect a camera module of one model, and the fourth solder joint on the adapter board can be used to connect a camera module of another model, which is conducive to improving the compatibility of circuit board components and facilitating the development trend of circuit board standardization.

[0019] In another possible implementation manner of the first aspect, a hollow area is provided on the circuit board, and the adapter plate is fixed in the hollow area.

[0020] In this way, the material of the adapter plate can be provided by the material of the reserved hollow area of ​​the circuit board. For example, before the production line workers cut off the material of the hollow area, they can use the material of the hollow area to process the shape of the adapter plate. The material of the adapter plate is completely provided by the board body of the circuit board. Although the adapter plate structure is increased, no new material is added, which saves the cost of the adapter plate and realizes the zero-cost compatible design of the adapter plate.

[0021] In another possible implementation manner of the first aspect, a plurality of adapter plates are provided, and the plurality of adapter plates are all disposed in the hollow area.

[0022] As a result, any position on the circuit board that needs to be processed into a hollow area can be processed with multiple different types or multiple adapter boards of the same type, without adding additional materials to process the adapter boards, thereby expanding the value of the circuit board and saving the cost of the adapter boards.

[0023] In another possible implementation of the first aspect, at least one edge of the adapter plate is fixedly connected to the side wall of the hollow area. In this way, at least one edge of the adapter plate is connected to the side wall of the hollow area, which plays a role in fixing the adapter plate.

[0024] In another possible implementation manner of the first aspect, the circuit board further has a second area, the adapter board can cover the first area and the second area, and the first surface of the adapter board can be connected to the solder joint of the second area.

[0025] Under this structure, on the one hand, the adapter board is not only connected to the second solder joint and the third solder joint, but also to the solder joint in the second area, which increases the connection area between the adapter board and the circuit board, and further strengthens the reliability of the connection between the adapter board and the circuit board; on the other hand, the second area can also be used to set other electronic devices. For example, it is used to weld flash modules, screens, FPC boards, sensors, capacitors, resistors, etc. This expands the practicality of the adapter board and improves its use value.

[0026] In a second aspect, the present application provides an electronic device, which includes a housing, a circuit board assembly and an electronic device. The circuit board assembly is arranged in the housing, and the electronic device is arranged in a first area of ​​a circuit board of the circuit board assembly.

[0027] The electronic device provided in the second aspect of the present application includes the circuit board assembly as described in any of the above technical solutions. Therefore, the same technical problem can be solved and the same technical effect can be achieved. That is, by setting the first solder joint and the second solder joint in the first area, different electronic devices can be selectively connected to the same area of ​​the circuit board, thereby increasing the application range of the circuit board, effectively reducing the production cost of the circuit board, and meeting the normalized design requirements of the circuit board.

[0028] In another possible implementation of the second aspect, the electronic device includes a first electronic device, and the first electronic device is fixedly connected to the first solder joint. Exemplarily, the first electronic device may be a camera module, and the pin sequence corresponding to the camera module matches the first solder joint.

[0029] In another possible implementation of the second aspect, the electronic device includes a second electronic device, the adapter board of the circuit board assembly is fixedly connected to the second solder joint, and the second electronic device is disposed on a surface of the adapter board away from the circuit board. Exemplarily, the second electronic device may be another camera module, and a pin sequence corresponding to the camera module matches a fourth solder joint on the adapter board. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application; Figure 2An exploded diagram of an electronic device provided in an embodiment of the present application; Figure 3 It is a structural diagram of the connection between the camera module and the circuit board; Figure 4 A schematic diagram of the structure of a circuit board assembly provided in an embodiment of the present application; Figure 5 A schematic diagram of a pin sequence of a camera module provided in an embodiment of the present application; Figure 6 A schematic diagram of a pin sequence of another camera module provided in an embodiment of the present application; Figure 7 A schematic diagram of the structure of another circuit board assembly provided in an embodiment of the present application; Figure 8 A schematic structural diagram of a first region of another circuit board assembly provided in an embodiment of the present application; Fig. 9 A schematic structural diagram of another adapter board of a circuit board assembly provided in an embodiment of the present application; Fig.10 A schematic diagram of a structure of another circuit board assembly provided in an embodiment of the present application in which a circuit board is connected to a second electronic device via an adapter board; Fig.11 A schematic diagram of the structure of a circuit board assembly provided for related technology; Fig.12 A schematic structural diagram of an adapter board included in a circuit board assembly provided in the related art; Fig.13 A schematic diagram of the structure of another adapter board included in the circuit board assembly provided in the related art; Fig.14 A schematic diagram of the structure of a hollowed-out area in another circuit board assembly provided in an embodiment of the present application; Fig.15 A schematic structural diagram of a second region of another circuit board assembly provided in an embodiment of the present application; Fig.16 for Fig.15 A schematic structural diagram of a flash module is provided on the second area of ​​the provided circuit board assembly. Reference numerals

[0031] 100- electronic equipment; 1-display module; 11-display screen; 12-translucent cover plate; 2-shell; 21-back cover; 22-frame; 23-accommodating cavity; 24-middle plate; 3- Camera module; 4-circuit board assembly; 41-circuit board; 411-first area; 412-second area; 42, adapter board; 42a-first adapter board; 42b-second adapter board; 421-first surface; 422-second surface; 43-hollow area; 5-FPC board; 6-BTB connector; 61-male connector; 62-female connector; 7-flashlight module; 71-shrapnel; H-first universal welding point; Q-second universal welding point; F-first welding point; S-second welding point; S1-first sub-welding point; S2-second sub-welding point; T-third welding point; E-fourth welding point; V-fifth welding point; X-sixth welding point. DETAILED DESCRIPTION

[0032] In the embodiments of the present application, the terms "exemplarily" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplarily" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplarily" or "for example" is intended to present related concepts in a specific way.

[0033] In the description of the embodiments of the present application, the term "and / or" refers to and covers any and all possible combinations of one or more of the associated listed items. The term "and / or" is a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in the present application generally indicates that the associated objects before and after are in an "or" relationship.

[0034] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0035] In the description of the embodiments of the present application, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0036] The embodiment of the present application provides an electronic device. Specifically, the electronic device may be a portable electronic device or other types of electronic devices. For example, the electronic device may be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a monitor, a camera, a personal computer, a notebook computer, a wearable device, etc. For the convenience of description, the following examples are all taken as an example of the electronic device being a mobile phone.

[0037] See also Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of an electronic device 100 provided in an embodiment of the present application. Figure 2 The exploded view of the electronic device 100 provided in the embodiment of the present application. As can be seen from the above, in the present embodiment, the electronic device 100 is a mobile phone, and the electronic device 100 can be in an approximately rectangular plate-shaped structure. The electronic device 100 can include a display module 1, a housing 2, a circuit board assembly 4 and an electronic device.

[0038] In order to facilitate the description of the embodiments below, a coordinate system is established for the electronic device 100. Specifically, the thickness direction of the electronic device 100 (that is, the stacking direction of the display screen 11 and the transparent cover plate 12) is defined as the Z-axis direction (that is, the second direction), and the directions perpendicular to the Z-axis are the Y-axis direction (that is, the first direction) and the X-axis direction (that is, the third direction), and the Y-axis direction is perpendicular to the X-axis direction. Specifically, in this embodiment, the electronic device 100 is an approximately rectangular plate-like structure, wherein the length direction of the electronic device 100 is the Y-axis direction, and the width direction of the electronic device 100 is the X-axis direction. It can be understood that the coordinate system setting of the electronic device 100 can be flexibly set according to actual needs, and no specific limitation is made here.

[0039] The above-mentioned display module 1 is used to display images, videos, etc. The display module 1 may include a light-transmitting cover plate 12 and a display screen 11 (English name: panel, also called a display panel), and the light-transmitting cover plate 12 is stacked with the display screen 11. The material of the light-transmitting cover plate 12 includes but is not limited to glass. For example, the light-transmitting cover plate 12 can adopt an ordinary light-transmitting cover plate 12, which is used to protect the display screen 11 to prevent the display screen 11 from being damaged due to external force, and can play a dust-proof role. Alternatively, the light-transmitting cover plate 12 can also adopt a light-transmitting cover plate 12 with a touch function, so that the electronic device 100 has a touch function, which makes it more convenient for users to use. Therefore, the present application does not specifically limit the specific material of the light-transmitting cover plate 12.

[0040] In addition, the display screen 11 may be a flexible display screen or a rigid display screen. For example, the display screen 11 may be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen, a mini light-emitting diode display screen, a micro light-emitting diode display screen, a micro organic light-emitting diode display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD).

[0041] The housing 2 is used to protect the electronic devices inside the electronic device 100. The housing 2 may include a back cover 21 and a frame 22. The back cover 21 is located on the side of the display screen 11 away from the light-transmitting cover plate 12, and is stacked with the light-transmitting cover plate 12 and the display screen 11. The frame 22 is located between the light-transmitting cover plate 12 and the back cover 21. The frame 22 is fixed to the back cover 21. For example, the frame 22 may be fixed to the back cover 21 by bonding, threading, welding, snapping, etc.; or, the frame 22 may also be an integrally formed structure with the back cover 21, that is, the frame 22 and the back cover 21 form a structural component as a whole. The light-transmitting cover plate 12 may be fixed to the frame 22 by gluing, so that the light-transmitting cover plate 12, the back cover 21 and the frame 22 enclose a receiving cavity 23 inside the electronic device 100, and the circuit board 41 and the electronic devices are all arranged in the receiving cavity 23.

[0042] In some embodiments, the housing 2 may further include a middle plate 24, which is disposed in the accommodating cavity 23 and is located on the side of the display screen 11 away from the light-transmitting cover plate 12. The middle plate 24 is fixedly connected to the frame 22 to form a middle frame of the electronic device 100. For example, the middle plate 24 and the frame 22 may be fixedly connected by gluing, threading, welding, snapping, etc.; or, the middle plate 24 and the frame 22 may also be an integrally formed structure, that is, the middle plate 24 and the frame 22 form a structural component as a whole. The middle plate 24 divides the accommodating cavity 23 into two independent spaces, one of which is located between the light-transmitting cover plate 12 and the middle plate 24, and the display screen 11 is located in the space. The other space is located between the middle plate 24 and the back cover 21, and the circuit board assembly 4 is located in the space.

[0043] The electronic devices are used to implement various functions of the electronic device 100. For example, the electronic devices may be a camera module 3, a flash module, a control chip (such as a system on chip, SOC), a graphics processing unit (GPU), a universal flash storage (UFS), a capacitor, a resistor, an inductor, etc. In the following embodiments, the electronic device is taken as an example of a camera module 3.

[0044] The circuit board assembly 4 is used to set different electronic devices of the electronic device 100 to realize different functions of the electronic device 100. The circuit board 41 can be fixed to the middle plate 24 by gluing, screwing, welding, clamping, etc. Therefore, the present application does not specifically limit the fixing method of the circuit board 41.

[0045] The circuit board assembly 4 may include a circuit board 41, and the camera module 3 may be fixed on the circuit board 41, or may be electrically connected to the circuit board 41 through an electrical connector. For example, the electrical connector may be an FPC board 5 (Flexible Printed Circuit Board, flexible printed circuit board 41), a spring or other forms of electrical connectors. Figure 3 , Figure 3 It is a structural diagram of the connection between the camera module 3 and the circuit board 41. One end of the FPC board 5 is electrically connected to the camera module 3, and the other end of the FPC board 5 is electrically connected to the circuit board 41 to achieve electrical connection between the camera module 3 and the circuit board 41.

[0046] The length direction of the circuit board 41 is the Y-axis direction of the electronic device 100 ; the thickness direction of the circuit board 41 is the Z-axis direction of the electronic device 100 ; and the width direction of the circuit board 41 is the X-axis direction of the electronic device 100 .

[0047] For some examples, see Figure 3 The FPC board 5 and the circuit board 41 may be connected by a connector, for example, the connector may be a BTB connector 6 (Board To Board Connector), an onboard connector or a modular connector, etc. This application uses the BTB connector 6 as an example for description.

[0048] Specifically, the BTB connector 6 includes a male connector 61 and a female connector 62. The male connector 61 is used to be fixedly connected to the above-mentioned FPC board 5, and the corresponding female connector 62 is used to be fixedly connected to the above-mentioned circuit board 41, thereby facilitating the improvement of the connection reliability between the FPC board 5 and the circuit board 41, and reducing the difficulty of processing and installation.

[0049] In some other possible examples, the male connector 61 may be fixedly connected to the circuit board 41, and the corresponding female connector 62 may be fixedly connected to the FPC board 5. Therefore, this application does not make any special limitation to this.

[0050] In addition, the BTB connector 6 can be electrically connected to the solder joints on the circuit board 41 through its pins. The specific process of processing the solder joints of the circuit board 41 is as follows: First, the circuit board 41 is subjected to a windowing process. The windowing process refers to removing the green oil layer (i.e., the protective layer) on the surface of the circuit board 41 by a hole-opening process method (such as drilling, milling, etc.) at the position where the solder joint is to be set on the circuit board 41, so as to expose the substrate inside the circuit board 41.

[0051] Next, a steel mesh is set on the surface of the circuit board 41, and the mesh holes on the steel mesh are set one by one corresponding to the above-mentioned openings. Then, solder paste is applied to the surface of the steel mesh away from the circuit board 41 so that the solder paste fills the mesh holes and the above-mentioned openings. After the solder paste solidifies to form solder joints, the steel mesh can be removed.

[0052] Finally, the pins of the BTB connector 6 are welded to the solder joints on the circuit board 41. For example, reflow soldering, hot pressing soldering, etc. may be used.

[0053] For example, see Figure 4 , Figure 4 Schematic diagram of the structure of a circuit board assembly 4 provided in an embodiment of the present application. In the circuit board assembly 4, the surface of the circuit board 41 has a first area 411. The surface of the circuit board 41 can be the circuit board 41 facing the first area 411. Figure 2 The surface of the rear cover 21 shown; it can also be the circuit board 41 facing Figure 2 The surface of the middle plate 24 is shown. In the embodiment of the present application, the surface of the circuit board 41 facing the rear cover 21 is used as an example.

[0054] The first area 411 is provided with a plurality of first universal solder joints H processed by the above process, and the first universal solder joints H are used to connect electronic devices (such as the camera module 3) through the BTB connector 6. However, different electronic devices have different pin sequences. Figure 5 and Figure 6 , Figure 5 A schematic diagram of a pin sequence of a camera module 3 provided in an embodiment of the present application, Figure 6 A schematic diagram of a pin sequence of another camera module 3 provided in an embodiment of the present application.

[0055] Among them, different pins of the camera module 3 can be used to connect different functional circuits. Therefore, when the pin line sequence is different, the solder joints corresponding to the pins on the circuit board 41 also need to be connected to different functional circuits. For example, Figure 5 The pin A corresponding to the camera module 3 shown is used to connect the signal a1 and Figure 6 The pins A corresponding to the camera modules 3 shown are connected to different signals a2, that is, the signals a1 and a2 are connected to different functional circuits. Therefore, corresponding to the two camera modules 3, the corresponding solder joints need to be processed on different circuit boards 41, that is, the two circuit boards 41 need to be processed separately.

[0056] The functional circuit refers to the circuits used to implement different functions in the circuit board 41. For example, for the camera module 3 of the electronic device 100, different functions need to be controlled based on different functional circuits, such as the auto focus, anti-shake, shooting or video recording functions of the camera module 3.

[0057] In this way, when processing the circuit board 41 on the production line, it is necessary to process a plurality of different circuit boards 41 for different pin sequences corresponding to different camera modules 3, that is, the welding pins of different circuit boards 41 are processed separately to adapt to a plurality of camera modules 3. This method will increase the production cost and material cost of the circuit board 41, extend the development cycle of the electronic device 100, and increase the production cost of the electronic device 100.

[0058] In some examples, in order to solve the above problem, the circuit board 41 can be selectively connected to different electronic devices by means of jumpers on the circuit board 41. Specifically, the circuit board 41 is provided with solder joints for connecting the camera module 3. Figure 5 In the scene of the camera module 3 shown in the figure, the solder joints on the circuit board 41 are connected to the corresponding pins of the camera module 3 through jumpers to achieve electrical connection between the two. Figure 6 The camera module 3 shown in the figure is connected to the circuit board 41 by a jumper. Figure 6 The signals required by the camera module 3 shown.

[0059] This requires that the two camera modules 3 have the same number of pins to implement the jumper solution, which reduces the application range of the circuit board 41. In addition, the jumper requires a higher resistance, resulting in a higher battery power requirement for the electronic device 100.

[0060] Furthermore, the jumper wires need to occupy a large amount of space for wiring on the circuit board 41 , thus affecting the distribution of other electronic components and being disadvantageous for miniaturization of the electronic device 100 .

[0061] Moreover, the line aging problem is inevitable in the jumper solution, which will lead to the deterioration of the signal quality of the electronic device 100 and the problem that the high-speed signal eye diagram cannot meet the threshold constraint. Therefore, the jumper solution has relatively strict requirements on the number of transfer signals, the level of the circuit board 41, and the layout area.

[0062] Based on this, the present application embodiment provides another circuit board assembly 4, see Figure 7 , Figure 7 A schematic diagram of the structure of another circuit board assembly 4 provided in an embodiment of the present application. In the circuit board assembly 4, the first area 411 on the surface of the circuit board 41 can only be provided with one electronic device, such as the camera module 3 mentioned above. The camera module 3 is electrically connected to the circuit board 41 through the FPC board 5 and the BTB connector 6, that is, the BTB connector 6 is fixed on the first area 411.

[0063] The first region 411 is provided with a plurality of first solder joints F and a plurality of second solder joints S. The plurality of first solder joints F and the plurality of second solder joints S are respectively used to connect different electronic devices. That is, the electronic device may include a first electronic device and a second electronic device. For example, the first electronic device and the second electronic device may be Figure 5 The camera module 3 and Figure 6 The camera module 3 shown. Among them, Figure 5 The BTB connector 6 corresponding to the camera module 3 shown can be fixedly connected to a plurality of first welding points F. Figure 6 The camera module 3 shown can be connected to multiple second welding points S.

[0064] In this way, by setting multiple first solder points F and multiple second solder points S in the first area 411, different electronic devices can be selectively connected to the same area of ​​the circuit board 41, thereby improving the application scope of the circuit board 41, effectively reducing the production cost of the circuit board 41, and meeting the normalized design requirements of the circuit board 41.

[0065] It should be noted that the normalization of the circuit board 41 means that different types or models of electronic devices can be selectively connected in the same area on the circuit board 41. Figure 5 and Figure 6 The two different types of camera modules 3 shown can both be arranged in the first area 411 of the above-mentioned circuit board 41, and can be selected based on actual needs, so that the circuit board 41 has a wider range of applications.

[0066] In addition, the first electronic device and the second electronic device are not limited to the above-mentioned camera module 3, and may also be other types of electronic devices, such as flash modules, capacitors, resistors, inductors, etc. Therefore, this application does not make any special limitation on this.

[0067] In some examples, the shape of the first welding spot F includes but is not limited to a circle, a polygon, an ellipse, a semicircle, a racetrack or a special shape. Also, the shape of the second welding spot S includes but is not limited to a circle, a polygon, an ellipse, a semicircle, a racetrack or a special shape. Therefore, the embodiment of the present application does not specifically limit this.

[0068] Please continue reading Figure 7 In some embodiments of the present application, a plurality of first solder joints F are sequentially distributed to form an annular area, and a plurality of second solder joints S are arranged in the annular area. Under this structure, a plurality of first solder joints F form an annular area, that is, the electronic device connected to the first solder joint F covers a relatively large area on the first area 411, and the second solder joint S is arranged in the annular area, and the electronic device connected to the second solder joint S also covers a relatively large area in the first area 411. Compared with dividing the first solder joint F and the second solder joint S into a left-right layout in the width direction, or dividing them into an up-and-down layout in the length direction in the first area 411, the electronic device covers a larger area in the first area 411, which is beneficial to improve the connection strength of the camera module 3 in the first area 411.

[0069] The plurality of second soldering points S may include a plurality of first sub-soldering points S1 and a plurality of second sub-soldering points S2. The plurality of first sub-soldering points S1 are sequentially distributed along the length direction of the annular region, and the plurality of second sub-soldering points S2 are sequentially distributed along the length direction of the annular region. The plurality of first sub-soldering points S1 and the plurality of second sub-soldering points S2 are sequentially and alternately distributed along the length direction of the annular region, and the plurality of first sub-soldering points S1 and the plurality of second sub-soldering points S2 are distributed along the width direction of the annular region.

[0070] In this way, it is helpful to increase the distance between two adjacent first sub-solder points S1 and second sub-solder points S2, and can reduce the risk of the camera module 3 or the circuit board 41 being short-circuited due to the connection between the two solder points when multiple second solder points S are connected to electronic devices due to the tin flow on the first sub-solder point S1 and the second sub-solder point S2 merging together, thereby improving the reliability of the welding of the second solder point S.

[0071] In some possible examples, the length direction of the annular area may correspond to the length direction of the circuit board 41; the thickness direction of the annular area may correspond to the thickness direction of the circuit board 41; and the width direction of the annular area may correspond to the thickness direction of the circuit board 41. This correspondence is only one possible example, and the direction of the annular area may be flexibly defined based on actual needs.

[0072] In addition, along the width direction of the annular region, the plurality of first sub-soldering points S1 and the adjacent first soldering point F with the smallest distance can be used to connect the same functional circuit of the circuit board 41. Also, along the width direction of the annular region, the plurality of second sub-soldering points S2 and the adjacent first soldering point F with the smallest distance are used to connect the same functional circuit of the circuit board 41.

[0073] In this way, when the camera module 3 is welded to multiple first solder joints F in the first area 411, even if the tin of the first solder joint F flows to the second solder joint S which is closer, so that the two solder joints are connected together, since the two solder joints are connected to the same functional circuit, a short circuit will not occur, thereby ensuring the stability of the electrical connection between the electronic device and the circuit board 41, thereby ensuring the reliability of the circuit on the circuit board 41.

[0074] In some embodiments, see Figure 8 , Figure 8 A schematic diagram of the structure of another first region 411 of a circuit board assembly 4 provided in an embodiment of the present application. A plurality of third solder joints T are also provided on the first region 411, and the plurality of third solder joints T are provided outside the annular region. The third solder joints T and the second solder joints S are used to connect the same electronic device. Exemplarily, the plurality of third solder joints T and the plurality of second solder joints S can be used to connect a second electronic device (e.g. Figure 6 The camera module shown is 3).

[0075] In this way, based on the limited space in the annular region, the number of the plurality of second soldering points S is limited by the space in the annular region. Therefore, a third soldering point T is arranged outside the annular region, and the second soldering point S and the third soldering point T are connected to the same electronic device, thereby improving the electronic device (for example Figure 6 The connection strength between the BTB connector 6) corresponding to the camera module 3 shown and the circuit board 41 is increased to reduce the risk of the solder joints between the electronic device and the circuit board 41 breaking due to bumps or collisions, causing the electronic device to separate from the circuit board 41.

[0076] In some examples, the plurality of third solder joints T may be arranged in at least one row in both the length direction and the width direction outside the annular region to enhance the connection between the circuit board 41 and the second electronic device ( Figure 6 The reliability between the camera modules 3) is shown.

[0077] In some examples, the shape of the third welding point T includes, but is not limited to, a circle, a polygon, an ellipse, an oval, a semicircle, a racetrack, or an irregular shape.

[0078] On this basis, the circuit board assembly 4 may further include an adapter board 42. Fig. 9 , Fig. 9 A schematic diagram of the structure of another adapter plate 42 of a circuit board assembly 4 provided in an embodiment of the present application. The adapter plate 42 has a first surface 421 and a second surface 422 disposed opposite to each other. The first surface 421 is a surface of the adapter plate 42 facing the circuit board 41, and the second surface 422 is a surface of the adapter plate 42 away from the circuit board 41.

[0079] The first surface 421 of the adapter plate 42 can be fixedly connected to the second soldering point S and the third soldering point T. A plurality of fourth soldering points E are disposed on the second surface 422 of the adapter plate 42. The fourth soldering points E and the first soldering points F are used to connect different electronic devices.

[0080] For example, the first solder joint F on the surface of the circuit board 41 can be used to connect the first electronic device (eg Figure 5 The fourth solder joint E on the second surface 422 of the adapter plate 42 can be used to connect a second electronic device (eg Figure 6 The camera module shown in Figure 3).

[0081] See also Fig.10 , Fig.10 A schematic diagram of a circuit board 41 in another circuit board assembly 4 provided in an embodiment of the present application is connected to a second electronic device via an adapter board 42. The second electronic device may be a camera module 3 (for example, the pin sequence of the camera module 3 may be Figure 6 ), the camera module 3 can be fixedly connected to the fourth welding point E through the FPC board 5 and the BTB connector 6.

[0082] Therefore, based on Figure 5 The pin sequence of the camera module 3 shown is similar to Figure 6 The pin sequence of the camera module 3 shown is different, and the first solder joint F of the circuit board 41 is connected Figure 5 The camera module 3 shown is connected to the adapter plate 42 Figure 6The camera module 3 shown in the figure can be equipped with at least two different camera modules 3 in the same area (i.e., the first area 411) on the circuit board 41 through the adapter plate 42, so as to improve the compatibility of the circuit board 41, thereby facilitating the development trend of the normalization of the circuit board 41.

[0083] In other embodiments of the present application, the first surface 421 may be connected to a plurality of first welding points F, or the first surface 421 may be used to be connected to a plurality of third welding points T.

[0084] It should be noted that in the process of applying solder paste to the circuit board 41 and the adapter board 42, three types of steel meshes are used, namely: steel mesh a corresponding to the first solder point F on the surface of the circuit board 41, steel mesh b corresponding to the fourth solder point E on the second surface 422 of the adapter board 42, and steel mesh c corresponding to the second solder point S and the third solder point T on the surface of the circuit board 41, which are hereinafter referred to as steel mesh a, steel mesh b and steel mesh c, respectively, and steel mesh a, steel mesh b and steel mesh c are not universal. The specific use of the steel mesh is as follows: The first soldering point F of the circuit board 41 is Figure 5 The camera module 3 shown is connected in a matching manner, and the steel mesh a can be used to apply solder paste to multiple first solder joints F on the circuit board 41.

[0085] The fourth welding point E on the second surface 422 of the adapter plate 42 is Figure 5 The camera module 3 shown is connected in a matching manner, and solder paste is applied to the fourth soldering point E using a steel mesh b.

[0086] In order to achieve the connection between the first area 411 of the circuit board 41 and the first surface 421 of the adapter board 42, solder paste is applied to the second solder joint S and the third solder joint T using the steel mesh c.

[0087] Based on this, in the related art, a circuit board assembly 4 is provided, see Fig.11 , Fig.11 A schematic diagram of the structure of a circuit board assembly 4 provided for related art. The circuit board assembly 4 includes a circuit board 41 and an adapter board 42. A plurality of second universal solder joints Q are arranged on a first area 411 of the circuit board 41. The first area 411 of the circuit board 41 is used to arrange different adapter boards 42. Different adapter boards 42 are used to connect different electronic devices (for example, Figure 5 The camera module 3 and Figure 6 The camera module 3 shown).

[0088] For some examples, see Fig.12 , Fig.12A schematic diagram of a structure of an adapter board 42 included in a circuit board assembly 4 provided in the related art. The adapter board 42 may include a first adapter board 42a, the first adapter board 42a includes a first surface 421 and a second surface 422, and a second universal solder joint Q matched with the first area 411 is provided on the first surface 421.

[0089] The first area 411 of the circuit board 41 can be electrically connected to the first surface 421 of the first adapter board 42a through the second universal solder joint Q. A plurality of fifth solder joints V are provided on the second surface 422 of the first adapter board 42a. The plurality of fifth solder joints V can be used to connect Figure 5 The camera module 3 is shown.

[0090] For other examples, see Fig.13 , Fig.13 A schematic diagram of the structure of another adapter board 42 included in the circuit board assembly 4 provided in the related art. The adapter board 42 may also include a second adapter board 42b. The second adapter board 42b includes a first surface 421 and a second surface 422, and a second universal solder joint Q matched with the first area 411 is provided on the first surface 421.

[0091] The first area 411 of the circuit board 41 can be electrically connected to the first surface 421 of the second adapter board 42b through the second universal solder joint Q. A plurality of sixth solder joints X are provided on the second surface 422 of the second adapter board 42b. Figure 6 The camera module 3 is shown.

[0092] It can be seen that in the circuit board assembly 4 provided by the related art, by replacing different adapter plates 42, namely the first adapter plate 42a and the second adapter plate 42b, the circuit board 41 can be selectively connected to different camera modules 3. Compared with the embodiment of the present application, the related art increases the processing cost of the adapter plate 42.

[0093] In addition, in the process of brushing solder paste on the circuit board 41 and the adapter board 42 (the first adapter board 42a and the second adapter board 42b) provided for the above-mentioned related technology, three types of steel meshes are also required, namely: steel mesh d corresponding to the second common solder joint Q of the first area 411 of the circuit board 41 and the first surface 421 of the first adapter board 42a, steel mesh e corresponding to the fifth solder joint V on the first adapter board 42a, and steel mesh f corresponding to the sixth solder joint X on the second adapter board 42b, hereinafter referred to as steel mesh d, steel mesh e and steel mesh f, respectively, three types of steel meshes are used, and steel mesh d, steel mesh e and steel mesh f are not universal. The specific situation of the use of steel mesh is as follows: In order to achieve connection between the first region 411 of the circuit board 41 and the first surface 421 of the first adapter board 42a, solder paste may be applied to the second common solder joints Q on the first region 411 and the first surface 421 using a steel mesh d.

[0094] In order to realize the first adapter plate 42a and Figure 5 The camera module 3 is connected as shown, and the fifth solder joint V on the second surface 422 of the first adapter plate 42a can be brushed with solder paste using a steel mesh e.

[0095] In order to realize the second adapter plate 42b and Figure 6 The camera module 3 is connected as shown, and the sixth solder joint X on the second surface 422 of the second adapter plate 42b can be brushed with solder paste using a steel mesh f.

[0096] It can be seen that compared with the related art, the embodiment of the present application uses the same number of steel meshes, and the cost of the steel mesh is not increased. However, the embodiment of the present application can connect different camera modules 3 (for example, Figure 5 The camera module 3 and Figure 6 The camera module 3 shown in the figure) does not need to set up a variety of different adapter plates 42 (that is, there is no need to make the second adapter plate 42b), which is beneficial to saving processing costs.

[0097] In some embodiments of the present application, the circuit board 41 has a hollow area 43. Fig.14 , Fig.14 The schematic diagram of the structure of another hollow area 43 in the circuit board assembly 4 provided in the embodiment of the present application is as follows. The adapter board 42 is fixed in the hollow area 43 .

[0098] Exemplarily, for the convenience of transportation, the production line workers pre-fix the finished adapter plate 42 to the hollow area 43 of the circuit board 41, and the fixing method includes but is not limited to gluing.

[0099] In this way, the material of the adapter plate 42 can be provided by the material of the reserved hollow area 43 of the circuit board 41. For example, before the production line workers cut off the material of the hollow area 43, the material of the hollow area 43 can be used to process the shape of the adapter plate 42. The material of the adapter plate 42 is completely provided by the board body of the circuit board 41. Although the structure of the adapter plate 42 is increased, no new material is added, which saves the cost of the adapter plate 42 and realizes the zero-cost compatible design of the adapter plate 42.

[0100] It should be noted that the hollow area 43 may be an area where a hole is opened for mounting electronic components on the circuit board 41 , for example, it may be an opening area for mounting a camera module 3 or a flash module.

[0101] In some embodiments, multiple adapter plates 42 are provided, and the multiple adapter plates 42 are all provided in the hollow area 43. For example, the multiple adapter plates 42 may be provided in the same hollow area 43; or the multiple adapter plates 42 may be provided in multiple hollow areas 43.

[0102] As a result, any position on the circuit board 41 that needs to be processed into a hollow area 43 can be processed with multiple different types or multiple adapter plates 42 of the same type, without adding additional materials to process the adapter plates 42, thereby expanding the value of the circuit board 41 and saving the cost of the adapter plates 42.

[0103] Please continue reading Fig.14 In some embodiments, at least one edge of the adapter plate 42 is fixedly connected to the side wall of the hollow area 43. In this way, at least one edge of the adapter plate 42 is connected to the side wall of the hollow area 43, which plays a role in fixing the adapter plate 42.

[0104] It should be noted that when the electronic device 100 is required to install Figure 6 In the scene of the camera module 3 shown, the plate body of the adapter plate 42 can be cut out from the hollow area 43 of the circuit board 41, and the cutting method includes but is not limited to a milling cutter.

[0105] For example, the material of the adapter plate 42 may be provided by the board body of the circuit board 41; or the adapter plate 42 may be formed by processing on other boards separately. In some other embodiments of the present application, the circuit board 41 further has a second area 412. Fig.15 , Fig.15 The schematic diagram of the structure of the second area 412 of another circuit board assembly 4 provided in an embodiment of the present application is as follows. The adapter plate 42 can cover the first area 411 and the second area 412 , and the first surface 421 of the adapter plate 42 can be connected to the solder joint of the second area 412 .

[0106] Under this structure, on the one hand, the adapter plate 42 is not only connected to the second solder point S and the third solder point T, but also connected to the solder point of the second area 412, which increases the connection area between the adapter plate 42 and the circuit board 41, and further strengthens the reliability of the connection between the adapter plate 42 and the circuit board 41; on the other hand, the second area 412 can also be used to set other electronic devices. For example, it is used to weld the flash module, the display screen 11, the FPC board 5, the sensor, the capacitor, the resistor, etc. The practicality of the adapter plate 42 is expanded and the use value of the adapter plate 42 is improved.

[0107] Take flash module 7 as an example, please refer to Fig.16 , Fig.16 for Fig.15A schematic diagram of the structure of the flash module 7 is provided on the second area 412 of the provided circuit board assembly 4, in which the dotted line is the boundary between the first area 411 and the second area 412. The circuit board 41 is connected to the flash module 7 through a spring 71. The spring 71 is usually used to raise the flash module 7 to achieve electrical connection. The distance between the flash module 7 and the circuit board 41 is L1. The larger L1 is, the more it is necessary to select a spring 71 with a higher bow height. In order to further ensure the stability of the spring 71 supporting the flash module 7, the volume of the spring 71 is also increased accordingly.

[0108] In the second area 412 of the present application, the adapter plate 42 is provided, that is, the spring piece of the flash module 7 is raised to the adapter plate 42, thereby shortening the distance L1 between the flash module 7 and the circuit board 41, that is, the distance L2 between the flash module 7 and the adapter plate 42. Therefore, a spring piece 71 with a smaller bow height can be selected for spring connection, and the volume of the spring piece 71 will be reduced accordingly. In this way, by providing the second area 412, the production cost of the spring piece 71 is reduced without additionally increasing the cost, and the space of the spring piece 71 is saved.

[0109] It is worth further explaining that after the window opening process is performed on the circuit board 41, the copper sheet will be exposed on the outside. In some related technologies, ENIG (chemical nickel-gold plating) + OSP (organic solderability protection film, also known as copper protection agent) or full-board OSP is usually used to perform surface treatment on the exposed copper sheet, which is mainly used to prevent the copper sheet at the window opening from oxidation.

[0110] Specifically, in the present application, when the surface treatment method of the pad on the circuit board 41 is ENIG+OSP, the surface treatment process of the pad of the adapter board 42 adopts ENIG to prevent the pad from being oxidized when the adapter board 42 and the circuit board 41 are stored.

[0111] When the surface treatment method of the pad on the circuit board 41 is OSP, when welding the adapter board 42, pre-tin can be used to tin the solder joints of the adapter board 42. When welding the adapter board 42 to the circuit board 41, both sides have tin at the same time, which improves the welding reliability.

[0112] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0113] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some of the technical features can be replaced by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board assembly, characterized in that: It includes a circuit board, the surface of which has a first area, the first area is used to set up an electronic device, and the first area can only set up one electronic device; the first area is provided with a plurality of first solder points and a plurality of second solder points, and the plurality of first solder points and the plurality of second solder points are respectively used to connect different electronic devices.

2. The circuit board assembly according to claim 1, characterized in that: The plurality of first welding spots are sequentially distributed to form an annular area, and the plurality of second welding spots are arranged in the annular area.

3. The circuit board assembly according to claim 2, characterized in that: The plurality of second welding points include a plurality of first sub-welding points and a plurality of second sub-welding points, the plurality of first sub-welding points are sequentially distributed along the length direction of the annular region, and the plurality of second sub-welding points are sequentially distributed along the length direction of the annular region; The plurality of first sub-welding points and the plurality of second sub-welding points are alternately distributed in sequence along the length direction of the annular area, and the first sub-welding points and the second sub-welding points are distributed along the width direction of the annular area.

4. The circuit board assembly according to claim 3, characterized in that: Along the width direction of the annular area, the first sub-soldering point and the first soldering point adjacent to each other and with the smallest distance therebetween are used to connect to the same functional circuit of the circuit board.

5. The circuit board assembly according to claim 3, characterized in that: Along the width direction of the annular area, the second sub-soldering point and the first soldering point which is adjacent to each other and has the smallest distance therebetween are used to connect to the same functional circuit of the circuit board.

6. The circuit board assembly according to claim 2, characterized in that: A plurality of third welding points are also arranged on the first area. The third welding points are arranged outside the annular area. The third welding points and the second welding points are used to connect the same electronic device.

7. The circuit board assembly according to any one of claims 1 to 6, characterized in that: The circuit board assembly also includes an adapter board, which has a first surface and a second surface arranged opposite to each other, the first surface is used to connect with multiple second solder points, and multiple fourth solder points are arranged on the second surface. The multiple fourth solder points and the multiple first solder points are used to connect different electronic devices.

8. The circuit board assembly according to claim 7, characterized in that: The circuit board has a hollow area, and the adapter plate is fixed in the hollow area.

9. The circuit board assembly according to claim 8, characterized in that: There are multiple adapter plates, and the multiple adapter plates are all arranged in the hollow area.

10. The circuit board assembly according to claim 8, characterized in that: At least one edge of the adapter plate is fixedly connected to the side wall of the hollow area.

11. The circuit board assembly according to claim 7, characterized in that: The circuit board also has a second area, the adapter board can cover the first area and the second area, and the first surface of the adapter board can be connected to the solder joints of the second area.

12. An electronic device, characterized in that: include: case; A circuit board assembly, which is the circuit board assembly according to any one of claims 1 to 11, wherein the circuit board assembly is arranged in the housing; The electronic device is arranged in a first area of ​​a circuit board of the circuit board assembly.

13. The electronic device according to claim 12, characterized in that: The electronic device includes a first electronic device, and the first electronic device is fixedly connected to the first welding point.

14. The electronic device according to claim 12, characterized in that: The electronic device includes a second electronic device. The adapter board of the circuit board assembly is fixedly connected to the second solder joint. The second electronic device is arranged on a surface of the adapter board away from the circuit board.

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