In-hole film stripping process for vacuum film pasting process

Abstract

The invention discloses an in-hole film stripping process for a vacuum film pasting process, relates to the technical field of PCB (Printed Circuit Board) processing processes, and can solve the problem that a dry film in a product hole in the vacuum film pasting process cannot be completely stripped. The in-hole film stripping process for the vacuum film pasting process comprises the following steps of bulking, primary film stripping, secondary film stripping, third film stripping, primary water washing, secondary water washing and plate discharging. According to the method, bulking is carried out firstly, then multiple times of film stripping and multiple times of water washing are carried out, and film stripping and water washing are carried out in multiple different modes, so that the problem that dry films in product holes in the vacuum film pasting process cannot be completely stripped can be solved.

Description

Technical Field

[0001] The invention relates to the technical field of PCB processing technology, and in particular to a vacuum film sticking process hole film stripping process. Background Art

[0002] With the continuous optimization and upgrading of PCB process flow, vacuum laminators are gradually introduced and applied by many PCB manufacturers, or used in the gold plating or etching gold finger wire process in the wire method process, or used in the electroplating process of products with uneven board surfaces such as rigid-flexible combination, etc., which can better solve the plating and erosion phenomenon caused by the height difference of the board line or the height difference of the rigid-flexible combination itself, and can also simplify the original complex process of wet film + dry film double-layer filling, improve process efficiency and reduce production costs. However, when the graphic design has dry film masking and solder mask plugging design, the hole is expanded and contracted into the hole due to the negative pressure during vacuum lamination, and it is difficult to peel off the film in the hole during the subsequent process, and the dry film in the hole is not completely removed.

[0003] Vacuum lamination is different from ordinary hot roller lamination. The principle of vacuum lamination is to evacuate the PCB board with dry film attached in a vacuum environment, and then apply pressure and exhaust air through the air bag after heating, so that the dry film is attached to the surface of the PCB board, which has a good filling effect. When there are through holes on the PCB board surface that needs vacuum lamination and no window is needed to come out, the dry film above the through hole is suspended during the lamination process. When heating and exhausting air are formed in the through hole, the dry film above the through hole flows into the hole to form a dry film inlet hole. After the PCB board is electroplated or the wire is etched, the film needs to be stripped. At this time, the dry film is adsorbed in the hole. During conventional film stripping, the hole is blocked and the film stripping solution cannot be exchanged well, so the dry film in the hole cannot be removed. The smaller the hole diameter, the more serious this situation will be. Summary of the invention

[0004] The purpose of the present invention is to solve at least one of the technical problems existing in the prior art and to provide a vacuum film laminating process inner hole film removal process, which can improve the problem that the dry film in the hole of the vacuum film laminating process product cannot be completely removed.

[0005] According to a first aspect of the present invention, a vacuum film laminating process in-hole film stripping is provided, comprising the following steps: bulking→primary film stripping→secondary film stripping→tertiary film stripping→primary water washing→secondary water washing→board discharging.

[0006] According to the in-hole film-removing process of a vacuum film-sticking process described in the present invention, immersion-type swelling is adopted in the swelling step.

[0007] According to the vacuum film-sticking process in-hole film stripping process described in the present invention, the temperature setting in the bulking step is higher than the temperature setting during the first film stripping, the second film stripping and the third film stripping.

[0008] According to the vacuum film laminating process in-hole film stripping process described in the present invention, spray film stripping is adopted in the initial film stripping step, and the spraying pressure is 0.35 MPa.

[0009] According to the in-hole film stripping process of a vacuum film laminating process described in the present invention, immersion ultrasonic film stripping is used in the secondary film stripping step.

[0010] According to the vacuum film laminating process in-hole film stripping process described in the present invention, in the secondary film stripping step, there are 6 upper and lower ultrasonic vibration plates, 6 sets are set, the power of each set of vibration plates is 1.6kw, each set of vibration plates contains 32 vibrators, and the ultrasonic power output intensity is 90%.

[0011] According to the vacuum film laminating process in-hole film stripping process described in the present invention, in the three film stripping steps, spray film stripping is adopted with a spray pressure of 0.35 MPa.

[0012] According to the vacuum film laminating process in-hole film stripping process described in the present invention, in the initial water washing step, pressurized water washing is adopted with a spraying pressure of 0.3 MPa.

[0013] According to the vacuum film laminating process in-hole film stripping process described in the present invention, in the initial water washing step, the water washing is circulated three times.

[0014] According to the vacuum film laminating process in-hole film stripping process described in the present invention, in the secondary water washing step, high-pressure swing water washing is adopted with a spray pressure of 5 MPa.

[0015] The present invention has at least the following beneficial effects: a vacuum film laminating process inner hole film stripping process comprises the following steps: bulking → primary film stripping → secondary film stripping → tertiary film stripping → primary water washing → secondary water washing → board output. By bulking first, then stripping and washing multiple times, and stripping and washing in multiple different ways, the problem that the dry film in the hole of the vacuum film laminating process product cannot be completely stripped can be improved.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention is further described below in conjunction with the accompanying drawings and embodiments;

[0018] Figure 1 The process flow chart of the preferred embodiment of the present invention. DETAILED DESCRIPTION

[0019] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0020] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0021] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0022] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0023] Reference Figure 1 A vacuum film laminating process in which the film is removed in a hole comprises the following steps: bulking → primary film removal → secondary film removal → tertiary film removal → primary water washing → secondary water washing → board discharge.

[0024] It is understandable that the problem of the dry film in the pores of the vacuum lamination process product being unable to be completely removed can be improved by first expanding the film and then removing the film and washing the film multiple times, and removing the film and washing the film in a variety of different ways.

[0025] Furthermore, in an embodiment of the present invention, immersion leavening is adopted in the leavening step.

[0026] Further, in an embodiment of the present invention, the temperature setting in the bulking step is higher than the temperature setting during the first film stripping, the second film stripping and the third film stripping.

[0027] It is worth noting that, in the embodiment of the present invention, the temperature setting of the bulking step should be higher than the temperature setting of the subsequent first, second and third film stripping, so as to enhance the softening of the dry film in the bulking step and improve the subsequent film stripping effect.

[0028] Furthermore, in an embodiment of the present invention, spray film stripping is adopted in the initial film stripping step, and the spraying pressure is 0.35 MPa.

[0029] Furthermore, in an embodiment of the present invention, immersion ultrasonic film stripping is used in the secondary film stripping step.

[0030] Furthermore, in an embodiment of the present invention, in the secondary film stripping step, there are 6 upper and lower ultrasonic vibration plates, 6 sets are provided, each set of vibration plates has a power of 1.6kw, each set of vibration plates contains 32 vibrators, and the ultrasonic power output intensity is 90%.

[0031] It is worth mentioning that in the embodiment of the present invention, the ultrasonic film stripping section is specifically designed to utilize ultrasonic high-frequency mechanical vibration waves and tiny eddy currents to increase the effect of liquid exchange and film stripping on the dry film fragments in the hole and the line gap.

[0032] Furthermore, in an embodiment of the present invention, in the three film stripping steps, spray film stripping is adopted, and the spraying pressure is 0.35 MPa.

[0033] Furthermore, in an embodiment of the present invention, in the initial water washing step, pressurized water washing is used with a spray pressure of 0.3 MPa.

[0034] Furthermore, in an embodiment of the present invention, in the initial water washing step, the water is circulated and washed three times.

[0035] It should be noted that in the film stripping step and the water washing step, the spray pressure is designed to be a medium-pressure pump spray, which is more conducive to the film stripping solution and water washing to flush the holes and line gaps, reducing the residual dry film fragments.

[0036] Furthermore, in an embodiment of the present invention, in the secondary water washing step, high-pressure swing water washing is adopted with a spray pressure of 5 MPa.

[0037] It is worth noting that, in the embodiment of the present invention, the high-pressure swing water washing spray pressure is increased, and high-pressure spraying is used to produce an impact cleaning effect on the residual dry film fragments in the hole.

[0038] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A vacuum film laminating process in-hole film stripping process, characterized in that: The following steps are involved: Bulking → first film removal → second film removal → third film removal → first water washing → second water washing → board production.

2. The vacuum film sticking process in-hole film stripping process according to claim 1, characterized in that: In the swelling step, immersion swelling is adopted.

3. The vacuum film sticking process in-hole film stripping process according to claim 2, characterized in that: The temperature setting in the bulking step is higher than the temperature setting during the primary, secondary and tertiary film stripping.

4. The vacuum film sticking process in-hole film stripping process according to claim 1, characterized in that: In the first film stripping step, spray film stripping is adopted, and the spraying pressure is 0.35 MPa.

5. The vacuum film sticking process in-hole film stripping process according to claim 1, characterized in that: In the secondary film stripping step, immersion ultrasonic film stripping is used.

6. The vacuum film sticking process in-hole film stripping process according to claim 5, characterized in that: In the secondary film stripping step, there are 6 upper and lower ultrasonic vibration plates, 6 sets, each set of vibration plates has a power of 1.6kw, each set of vibration plates contains 32 vibrators, and the ultrasonic power output intensity is 90%.

7. The vacuum film sticking process in-hole film stripping process according to claim 1, characterized in that: In the three film stripping steps, spray film stripping is adopted with a spray pressure of 0.35 MPa.

8. The vacuum film sticking process in-hole film stripping process according to claim 1, characterized in that: In the initial water washing step, pressurized water washing is used with a spray pressure of 0.3 MPa.

9. The vacuum film sticking process in-hole film stripping process according to claim 8, characterized in that: In the initial water washing step, the water is circulated for three times.

10. The vacuum film sticking process in-hole film stripping process according to claim 1, characterized in that: In the secondary water washing step, high-pressure swing water washing is adopted with a spray pressure of 5 MPa.

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