Diamond active heat dissipation device
By designing diamond active heat dissipation devices, using piezoelectric actuators to vibrate under high-frequency electrical signals to form airflow, the high cost and integration problems of diamond materials are solved, and efficient heat dissipation is achieved, suitable for small electronic devices.
Patent Information
- Application Number
- CN202411324772.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-23
- Publication Date
- 2024-12-13
AI Technical Summary
The high cost of diamond materials and the issues of how to efficiently integrate into the heat dissipation system and optimize the heat dissipation structure to improve heat dissipation efficiency.
Design a diamond active heat dissipation device, including diamond sheet, piezoelectric actuator sheet and fixing bolt. The diamond sheet has built-in channels and positioning holes. The piezoelectric actuator sheet vibrates under the action of high-frequency electrical signals to form airflow and quickly conduct heat. Fixing bolts are used to fix piezoelectric actuators.
It has achieved efficient integration of diamond materials and improved heat dissipation efficiency. It is suitable for small electronic devices, with simple structure, strong heat dissipation ability and small volume.
Smart Images
Figure CN119136508A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of diamond heat dissipation, in particular to a diamond active heat dissipation device. Background Art
[0002] Diamond has the highest thermal conductivity of all solid materials, more than five times that of copper, which makes it an ideal heat dissipation material that can quickly transfer heat from the heat source to the heat dissipation system. Diamond active heat dissipation devices are usually made by making diamond materials into heat sinks, heat sinks or other heat dissipation structures, and put them in close contact with the heat source. When the heat source generates heat, the diamond material uses its high thermal conductivity to quickly transfer the heat to the heat dissipation system, and dissipates the heat into the environment through active heat dissipation methods such as fans and liquid cooling, thereby reducing the temperature of the heat source.
[0003] However, the high cost of diamond materials is still one of the main factors restricting their widespread application. In addition, how to efficiently integrate diamond materials into the heat dissipation system and how to further optimize the heat dissipation structure to improve the heat dissipation efficiency are also technical problems that need to be solved. Summary of the invention
[0004] 1. Technical issues to be resolved In view of the deficiencies of the prior art, the present invention provides a diamond active heat dissipation device, which solves the problems of how to efficiently integrate diamond materials into a heat dissipation system and how to further optimize the heat dissipation structure to improve the heat dissipation efficiency.
[0005] (II) Technical solution To achieve the above objectives, the present invention is implemented through the following technical solutions: a diamond active heat dissipation device, including a diamond sheet, a piezoelectric actuator sheet and a fixing bolt, the diamond sheet including a built-in channel and a positioning hole, the diamond sheet is used to quickly transfer heat from a heat source to the surface of the diamond built-in channel, the built-in channel is used to place the piezoelectric actuator sheet, the positioning hole is used to fix the piezoelectric actuator sheet, the piezoelectric actuator sheet includes positioning holes on both sides and end fins, the end fins vibrate rapidly in a vertical direction under the action of a high-frequency electrical signal to form an airflow in the built-in channel of the diamond sheet, and the fixing bolt is used to fix the piezoelectric actuator sheet to the inside of the diamond sheet.
[0006] Preferably, the diamond sheet is prepared by natural mining, chemical vapor deposition or high temperature and high pressure, and has a thermal conductivity of 1000-2400 W / , specifically including single crystal or polycrystalline.
[0007] Preferably, the length of the diamond sheet ranges from 1 to 100 mm, and the thickness ranges from 0.3 to 10 mm.
[0008] Preferably, the diamond built-in channels are of two types: through holes and blind holes, with a size range of 0.5-99 mm and a thickness range of 0.1-9.5 mm.
[0009] Preferably, the material of the piezoelectric actuator sheet includes but is not limited to barium zirconate titanate, polyvinylidene fluoride, zinc oxide, niobium oxide and the like.
[0010] Preferably, the length of the piezoelectric actuator is in the range of 1-99 mm, and the width of the end fin is in the range of 1-60 mm.
[0011] Preferably, after the high-frequency electrical signal is input, the vibration frequency of the terminal fin is 0.1 Hz-10 MHz.
[0012] Working principle: When in use, place the diamond close to the heat source and pass a high-frequency electrical signal into the piezoelectric actuator. Under the action of the electrical signal, the end fins of the actuator vibrate rapidly in the vertical direction, forming an airflow in the channel, and quickly conducting the heat away along the surface of the built-in channel of the diamond.
[0013] (III) Beneficial effects The present invention provides a diamond active heat dissipation device having the following beneficial effects: The diamond active heat dissipation device has a simple structure, strong heat dissipation capacity, and a compact size. It is suitable for small electronic devices and can be easily and efficiently integrated into the heat dissipation system. The end fins of the actuator plate vibrate rapidly in the vertical direction under the action of the electrical signal to form an airflow in the channel, which can greatly improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the overall structure of the present invention.
[0015] Among them, 1. diamond sheet; 2. piezoelectric actuator sheet; 3. fixing bolt. DETAILED DESCRIPTION
[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Example:
[0017] like Figure 1As shown, an embodiment of the present invention provides a diamond active heat dissipation device, including a diamond sheet 1, a piezoelectric actuator sheet 2 and a fixing bolt 3. The diamond sheet 1 includes a built-in channel and a positioning hole. The diamond sheet 1 is used to quickly transfer heat from a heat source to the surface of the diamond built-in channel. The built-in channel is used to place the piezoelectric actuator sheet 2. The positioning hole is used to fix the piezoelectric actuator sheet 2. The piezoelectric actuator sheet 2 includes positioning holes on both sides and end fins. The end fins vibrate rapidly in a vertical direction under the action of a high-frequency electrical signal to form an airflow in the built-in channel of the diamond sheet 1. The fixing bolt 3 is used to fix the piezoelectric actuator sheet 2 to the inside of the diamond sheet 1.
[0018] The diamond sheet 1 is prepared by natural mining, chemical vapor deposition CVD or high temperature and high pressure HPHT, and has a thermal conductivity of 1000-2400 W / m·K, specifically including single crystal or polycrystalline; the length of the diamond sheet 1 ranges from 1 to 100 mm, and the thickness ranges from 0.3 to 10 mm; the diamond built-in channels are through holes and blind holes, with a size range of 0.5 to 99 mm and a thickness range of 0.1 to 9.5 mm; the piezoelectric actuator sheet 2 material includes but is not limited to barium zirconate titanate PZT, polyvinylidene fluoride PVDF, zinc oxide ZnO and niobium oxide Nb2O5, etc.; the length of the piezoelectric actuator sheet 2 ranges from 1 to 99 mm, and the width of the end fin ranges from 1 to 60 mm; after the high-frequency electrical signal is input, the vibration frequency of the end fin is 0.1 Hz to 10 Mhz.
[0019] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A diamond active heat dissipation device, comprising a diamond sheet (1), a piezoelectric actuator sheet (2) and a fixing bolt (3), characterized in that: The diamond plate (1) comprises a built-in channel and a positioning hole. The diamond plate (1) is used to quickly transfer heat from a heat source to the surface of the diamond built-in channel. The built-in channel is used to place a piezoelectric actuator plate (2). The positioning hole is used to fix the piezoelectric actuator plate (2). The piezoelectric actuator plate (2) comprises positioning holes on both sides and a terminal fin. The terminal fin vibrates rapidly in a vertical direction under the action of a high-frequency electrical signal to form an airflow in the built-in channel of the diamond plate (1). The fixing bolt (3) is used to fix the piezoelectric actuator plate (2) to the inside of the diamond plate (1).
2. A diamond active heat dissipation device according to claim 1, characterized in that: The diamond sheet (1) is prepared by natural mining, chemical vapor deposition (CVD) or high temperature and high pressure (HPHT) and has a thermal conductivity of 1000-2400 W / (m·K), and specifically includes single crystal or polycrystalline.
3. The diamond active heat dissipation device according to claim 1, characterized in that: The length of the diamond sheet (1) is in the range of 1-100 mm, and the thickness is in the range of 0.3-10 mm.
4. The diamond active heat dissipation device according to claim 1, characterized in that: The diamond built-in channels are of two types: through holes and blind holes, with a size range of 0.5-99 mm and a thickness range of 0.1-9.5 mm.
5. The diamond active heat dissipation device according to claim 1, characterized in that: The material of the piezoelectric actuator sheet (2) includes but is not limited to barium zirconate titanate (PZT), polyvinylidene fluoride (PVDF), zinc oxide (ZnO) and niobium oxide (Nb2O5).
6. The diamond active heat dissipation device according to claim 1, characterized in that: The piezoelectric actuator (2) has a length range of 1-99 mm and a terminal fin width range of 1-60 mm.
7. The diamond active heat dissipation device according to claim 1, characterized in that: After the high-frequency electrical signal is input, the vibration frequency of the terminal fin is 0.1 Hz-10 Mhz.