Cleaning device for soft copper bar welding materials

Abstract

The invention relates to the technical field of copper foil cleaning, and discloses a cleaning device for soft copper bar welding materials, which comprises a cleaning cabinet, and a cleaning cavity is arranged in the cleaning cabinet; a first bearing plate is arranged in the cleaning cavity and used for bearing the copper foil; a plurality of first through holes are formed in the first bearing plate and penetrate through the first bearing plate in the vertical direction; a first air exhaust cover is arranged on the lower end face, in the vertical direction, of the first bearing plate and covers the first through hole; a first cleaning spray head assembly is arranged over the first bearing plate in the vertical direction, and the first cleaning spray head assembly is used for spraying plasmas to the copper foils. A plasma cleaning mode is adopted to replace a traditional liquid cleaning mode, so that the stripping force between copper foil layers can be remarkably improved; and no special environment-friendly equipment needs to be arranged for treating waste water generated during manufacturing, so that the cleaning process cost is reduced, and the green sustainable development concept is met.

Description

Technical Field

[0001] The invention relates to the technical field of copper foil cleaning, and in particular to a cleaning device for soft copper busbar welding materials. Background Art

[0002] Copper foil soft connection products have good electrical conductivity, anti-static and electromagnetic shielding effects, so they are widely used in automobiles, transformers and other fields. With the development of the economy and society and the progress of the times, the manufacturing industry is increasingly upgrading to green environmental protection and low-carbon manufacturing, and the automotive industry has higher and higher requirements for parts. The traditional copper foil base material is generally manufactured with a width of 3000mm-6000mm, while the copper foil material width for producing copper foil soft connection products is generally 20mm-200mm. The copper foil base material needs to be slit. A roll of base material will be slit N times, resulting in oxidation of the surface of the copper foil material to form an oxide layer. When multiple copper foil sheets are overlapped and welded into a whole through molecular diffusion welding to form a copper foil soft connection product, it is easy to cause the connection between the copper foil layers to be unstable, making the peeling force between the copper foil layers weak and easy to detach. Therefore, the copper foil surface needs to be cleaned before use.

[0003] The traditional cleaning method is to rinse the surface of the cut copper foil with a cleaning liquid, and then use a passivation liquid to remove the oxide layer on the surface of the copper foil to meet and stabilize the welding peeling force; however, the traditional cleaning method is complex and energy-intensive, and requires the configuration of special environmental protection equipment to treat the wastewater generated by manufacturing, which does not conform to the concept of green and sustainable development. Therefore, there is an urgent need for a cleaning device with low cleaning process cost and meeting the concept of green and sustainable development. Summary of the invention

[0004] In view of this, the present invention provides a cleaning device for soft copper busbar welding materials to solve the problem that the traditional copper foil cleaning method is high in cost and does not meet the concept of green and sustainable development.

[0005] The present invention provides a cleaning device for soft copper busbar welding materials, comprising:

[0006] A cleaning cabinet having a cleaning chamber disposed therein;

[0007] A first carrier plate is disposed in the cleaning chamber and is used to carry the copper foil; a plurality of first through holes are disposed on the first carrier plate, and the first through holes penetrate the first carrier plate in a vertical direction;

[0008] A first exhaust hood is disposed on the lower end surface of the first supporting plate in the vertical direction and covers the first through hole;

[0009] The first cleaning nozzle assembly is arranged directly above the first supporting plate in the vertical direction and is used for blowing plasma toward the copper foil.

[0010] A cleaning device for soft copper busbar welding materials according to the present invention has at least the following beneficial effects:

[0011] By providing a first through hole on the first carrier plate and providing a first exhaust hood on the lower end of the first carrier plate, when the copper foil is placed on the first carrier plate for cleaning, the first exhaust hood is started to suck air, so that the copper foil is adsorbed and closely attached to the upper surface of the first carrier plate under the action of the pressure difference, ensuring that when the first cleaning nozzle assembly sprays plasma to the surface of the copper foil to physically bombard and chemically react the oxide layer on the surface of the copper foil to remove the oxide layer, the copper foil will not be bent or plastically deformed, and the copper foil to be cleaned can be fixed without the need for clamping with the help of a clamp and the copper foil can be cleaned. Plasma cleaning can be performed at any position on the entire surface of the copper foil to improve the cleaning quality. Compared with the traditional cleaning treatment method, on the one hand, the dyne value of the copper foil surface cleaned by the cleaning device can reach 50 or above, which improves the peeling force between the copper foil layers and ensures the stability of the whole formed by overlapping and welding multiple copper foil sheets. On the other hand, during the process of plasma cleaning the copper foil surface by the cleaning device, it is always kept in a waterless environment, that is, no wastewater is generated, and there is no need to configure special environmental protection equipment to treat the wastewater generated by manufacturing, which reduces the cleaning process cost and meets the concept of green and sustainable development.

[0012] In an optional embodiment, the first cleaning nozzle assembly includes two rows of first cleaning nozzle modules arranged opposite to each other along the second horizontal direction; each row of the first cleaning nozzle modules includes a plurality of first cleaning nozzles arranged at intervals along the first horizontal direction; the first horizontal direction, the second horizontal direction and the vertical direction are perpendicular to each other.

[0013] In an optional embodiment, a first linear drive and a first guide rail are relatively arranged in the cleaning chamber along the second horizontal direction, the first linear drive is provided with a first mounting plate that moves along the first horizontal direction, and one end of the first cleaning nozzle assembly along the first horizontal direction is provided on the first mounting plate, and the other end is slidably provided on the first guide rail.

[0014] In an optional embodiment, the first cleaning nozzle assembly also includes two first connecting plates arranged at intervals along a first horizontal direction, two second connecting plates are arranged between the two first connecting plates, the second connecting plates are slidably arranged on the first connecting plates along a second horizontal direction, and are locked by a first locking assembly; two rows of the first cleaning nozzle modules are respectively arranged on the two second connecting plates.

[0015] In an optional embodiment, a first T-slot is provided at the upper end of the first connecting plate in the vertical direction, and the first locking assembly includes a matching first T-bolt and a first nut, and the first T-bolt is slidably arranged in the first T-slot; a second through hole is formed through the upper end of the second connecting plate in the vertical direction, and the second through hole is used for the rod of the first T-bolt to pass through.

[0016] In an optional embodiment, it also includes an unwinder and a reel, the unwinder is arranged on the relatively left side of the cleaning cabinet along the first horizontal direction, and the unwinder is used to unwind the copper foil; the reel is arranged on the relatively right side of the cleaning cabinet along the first horizontal direction, and the reel is used to rewind the copper foil; the cleaning cabinet is provided with an inlet and an outlet on the relatively left side and the relatively right side along the first horizontal direction, respectively, and the inlet and the outlet are both used for allowing the copper foil to pass through; the first horizontal direction and the vertical direction are perpendicular to each other.

[0017] In an optional embodiment, the feed port is provided with a feed guide roller, and the discharge port is provided with a discharge guide roller.

[0018] In an optional embodiment, a second carrier plate is provided in the cleaning chamber, and the second carrier plate and the first carrier plate are staggered along the first horizontal direction; the second carrier plate is located relatively above the first carrier plate, and a gap is formed in the clamping area of ​​the second carrier plate and the first carrier plate along the vertical direction, and the gap is used for copper foil to pass through; a plurality of third through holes are provided on the second carrier plate, and the third through holes penetrate the second carrier plate along the vertical direction; a second exhaust hood is provided on the upper end surface of the second carrier plate in the vertical direction, and the second exhaust hood covers the third through holes; a second cleaning nozzle assembly is provided directly below the second carrier plate in the vertical direction, and the second cleaning nozzle assembly is used to spray plasma onto the copper foil.

[0019] In an optional embodiment, a second linear drive and a second guide rail are relatively arranged in the cleaning chamber along the second horizontal direction, and the second linear drive is provided with a second mounting plate that moves along the first horizontal direction; one end of the second cleaning nozzle assembly along the second horizontal direction is arranged on the second mounting plate, and the other end is slidably arranged on the second guide rail; the first horizontal direction, the second horizontal direction and the vertical direction are perpendicular to each other;

[0020] And / or, the second cleaning nozzle assembly includes two third connecting plates arranged at intervals along the first horizontal direction, two fourth connecting plates are arranged between the two third connecting plates, the fourth connecting plates are slidably arranged on the third connecting plates along the second horizontal direction, and are locked by the second locking assembly; a row of second cleaning nozzle modules is arranged on the side facing each other of the two fourth connecting plates, the second cleaning nozzle module includes a plurality of second cleaning nozzles arranged at intervals along the first horizontal direction; the first horizontal direction, the second horizontal direction and the vertical direction are perpendicular to each other.

[0021] In an optional embodiment, a second T-slot is provided at the upper end of the third connecting plate in the vertical direction, and the second locking assembly includes a matching second T-bolt and a second nut, and the second T-bolt is slidably arranged in the second T-slot; a fourth through hole is formed through the upper end of the fourth connecting plate in the vertical direction, and the fourth through hole is used for the rod of the second T-bolt to pass through. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 A three-dimensional structural view of an embodiment of the present invention;

[0024] Figure 2 for Figure 1 A schematic diagram of a three-dimensional structure from another perspective;

[0025] Figure 3 It is a schematic diagram of the assembly structure of the first cleaning nozzle assembly, the first carrying plate and the first exhaust hood in an embodiment of the present invention;

[0026] Figure 4 Schematic diagram of the assembly structure of the first cleaning nozzle assembly, the first linear drive and the first guide rail in an embodiment of the present invention;

[0027] Figure 5 is a schematic diagram of the assembly exploded structure of the first connecting plate and the second connecting plate in an embodiment of the present invention;

[0028] Figure 6 It is a schematic diagram of the assembly structure of the first carrying plate and the first exhaust hood in an embodiment of the present invention;

[0029] Figure 7It is a schematic diagram of the assembly structure of the second cleaning nozzle assembly, the second carrying plate and the second exhaust hood in an embodiment of the present invention;

[0030] Figure 8 It is a schematic diagram of the assembly structure of the second carrying plate and the second exhaust hood in an embodiment of the present invention.

[0031] Description of reference numerals:

[0032] 100-cleaning cabinet, 110-cleaning chamber, 120-feeding guide roller, 130-discharging guide roller;

[0033] 210 - first bearing plate, 211 - first through hole, 220 - first exhaust hood;

[0034] 300 - first cleaning nozzle assembly, 310 - first cleaning nozzle, 320 - first connecting plate, 321 - first T-slot, 330 - second connecting plate, 331 - second through hole, 332 - first connecting portion;

[0035] 410 - first linear drive, 411 - first mounting plate, 420 - first guide rail;

[0036] 510 - second bearing plate, 511 - third through hole, 520 - second exhaust hood;

[0037] 600-second cleaning nozzle assembly, 610-third connecting plate, 611-second T-slot, 620-fourth connecting plate, 621-fourth through hole, 630-second cleaning nozzle

[0038] 710 - second linear drive, 711 - second mounting plate, 720 - second guide rail. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0040] In the description of this embodiment, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing this embodiment and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting this embodiment. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0041] In the description of this embodiment, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this embodiment can be understood according to specific circumstances.

[0042] Most of the related technologies for cleaning copper foil with an oxide layer on the surface are to rinse the surface of the cut copper foil with a cleaning liquid, and then use a passivation liquid for passivation cleaning to remove the oxide layer on the surface of the copper foil. However, the dyne value of the copper foil surface cleaned by the above traditional cleaning method can only reach 35 and 38, which cannot meet the special use requirements of the peeling force between the copper foil layers. In addition, the traditional cleaning method has complex processes, high energy consumption, and requires the configuration of special environmental protection equipment to treat the wastewater generated by manufacturing. In order to solve the above technical defects, a cleaning device for soft copper busbar welding materials according to an embodiment of the present invention is provided.

[0043] Combine the following Figures 1 to 8 , describing an embodiment of the present invention.

[0044] According to an embodiment of the present invention, a cleaning device for soft copper busbar welding materials is provided, comprising a cleaning cabinet 100, wherein a cleaning chamber 110 is arranged in the cleaning cabinet 100; a first carrier plate 210 is arranged in the cleaning chamber 110, and the first carrier plate 210 is used to carry copper foil; a plurality of first through holes 211 are arranged on the first carrier plate 210, and the first through holes 211 penetrate the first carrier plate 210 in the vertical direction; a first exhaust hood 220 is arranged on the lower end surface of the first carrier plate 210 in the vertical direction, and the first exhaust hood 220 covers the first through holes 211; a first cleaning nozzle assembly 300 is arranged directly above the first carrier plate 210 in the vertical direction, and the first cleaning nozzle assembly 300 is used to spray plasma onto the copper foil. It can be understood that the first horizontal direction, the second horizontal direction and the vertical direction in the text refer to Figure 1and Figure 3 The first horizontal direction, the second horizontal direction and the vertical direction are perpendicular to each other, and the first horizontal direction and the second horizontal direction are located on the same horizontal plane.

[0045] The cleaning device of this embodiment is provided with a first through hole 211 on the first carrier plate 210, and a first exhaust hood 220 is provided on the lower end surface of the first carrier plate 210. When the copper foil is placed on the first carrier plate 210 for cleaning, the first exhaust hood 220 is started to suck air, so that the copper foil is adsorbed and closely attached to the upper surface of the first carrier plate 210 under the action of the pressure difference, ensuring that when the first cleaning nozzle assembly 300 sprays plasma to the surface of the copper foil to physically bombard and chemically react to remove the oxide layer on the surface of the copper foil, the copper foil will not be bent or plastically deformed, and the copper foil to be cleaned can be fixed without being clamped by a clamp without being offset, and the entire surface of the copper foil can be cleaned. Plasma cleaning can be performed at any position of the copper foil to improve the cleaning quality. Compared with the traditional cleaning treatment method, on the one hand, the dyne value of the copper foil surface cleaned by the cleaning device of this embodiment can reach 50 or above, which significantly improves the peeling force between the copper foil layers and the copper foil layers, and ensures the stability of the whole (copper foil soft connection product) formed by overlapping and welding multiple copper foil sheets, especially meeting the special use requirements of large peeling force between the copper foil layers. On the other hand, in the process of plasma cleaning the copper foil surface by the cleaning device of this embodiment, it is always kept in a waterless environment, that is, no wastewater is generated, and there is no need to configure special environmental protection equipment to treat the wastewater generated by manufacturing, which reduces the cost of the cleaning process and meets the concept of green and sustainable development.

[0046] It should be noted that the principle of cleaning the copper foil surface by the cleaning device of this embodiment is to rely on the "activation effect" of the active particles in the plasma to achieve the purpose of removing stains on the surface of the object. The gas is excited into a plasma state; heavy particles collide with the solid surface; electrons and active groups react with the solid surface and are resolved into new gas phase substances and leave the surface.

[0047] The specific structure and distribution of the first cleaning nozzle assembly 300 of this embodiment are described in detail below.

[0048] like Figure 3 and Figure 4As shown, in some embodiments, the first cleaning nozzle assembly 300 includes two rows of first cleaning nozzle modules arranged opposite to each other along the second horizontal direction; each row of first cleaning nozzle modules includes a plurality of first cleaning nozzles 310 arranged at intervals along the first horizontal direction. By arranging two rows of first cleaning nozzle modules, the dimensions of the copper foil surface along the second horizontal direction are covered, so that the copper foil is plasma cleaned without moving and adjusting the position of the first cleaning nozzle assembly 300 along the first horizontal direction, thereby improving the cleaning efficiency; at the same time, by arranging each row of first cleaning nozzle modules into a plurality of first cleaning nozzles 310 arranged at intervals along the first horizontal direction, plasma cleaning can be performed simultaneously on different positions of the copper foil surface along the first horizontal direction, thereby improving the cleaning efficiency.

[0049] like Figure 3 and Figure 4 As shown, specifically, a first linear driver 410 and a first guide rail 420 are relatively arranged in the cleaning chamber 110 along the second horizontal direction, and the first linear driver 410 is provided with a first mounting plate 411 that moves along the first horizontal direction. One end of the first cleaning nozzle assembly 300 along the first horizontal direction is arranged on the first mounting plate 411, and the other end is slidably arranged on the first guide rail 420. By slidingly arranging the first cleaning nozzle assembly 300 in the cleaning chamber 110 along the first horizontal direction, during the process of plasma cleaning the copper foil surface, the first linear driver 410 is started to drive the first cleaning nozzle assembly 300 to reciprocate along the first horizontal direction, which can not only realize the cleaning of any position of the copper foil surface along the first horizontal direction on the basis of reducing the number of the first cleaning nozzles 310, thereby ensuring the cleaning effect, but also prevent oxidation from occurring when cleaning one position of the copper foil surface and cleaning another position. At the same time, the first guide rail 420 guides and supports the end of the first cleaning nozzle assembly 300 away from the first mounting plate 411, ensuring that the lower end of the first cleaning nozzle 310 and the surface of the copper foil are always spaced in the vertical direction in the process of driving the first cleaning nozzle assembly 300 to move along the first horizontal direction, thereby ensuring that the dyne value is maintained at each position of the cleaned copper foil surface. More specifically, the first linear drive 410 can be set as one of an electric cylinder, an air cylinder, a linear motor, or a ball screw nut subassembly, and drives the first mounting plate 411 to reciprocate along the first horizontal direction.

[0050] like Figures 3 to 5As shown, specifically, the first cleaning nozzle assembly 300 further includes two first connecting plates 320 spaced apart along the first horizontal direction, one end of the first connecting plate 320 along the first horizontal direction is arranged on the first mounting plate 411, and the other end is slidably arranged on the first guide rail 420; two second connecting plates 330 are arranged between the two first connecting plates 320, and the second connecting plates 330 are slidably arranged on the first connecting plates 320 along the second horizontal direction, and are locked by the first locking assembly; two rows of first cleaning nozzle modules are respectively arranged on the two second connecting plates 330. By making both the two second connecting plates 330 slidably connected to the first connecting plate 320 along the second horizontal direction, the two second connecting plates 330 can be moved closer to or farther from each other along the second horizontal direction, thereby adjusting the spacing between the two rows of first cleaning nozzle modules along the second horizontal direction, so as to meet the plasma cleaning of copper foils of different sizes, and has a wide range of applications.

[0051] like Figure 3 and Figure 5 As shown, specifically, the first connecting plate 320 is provided with a first T-shaped slot 321 at the upper end along the vertical direction, and the first locking assembly includes a matching first T-shaped bolt and a first nut, and the first T-shaped bolt is slidably arranged in the first T-shaped slot 321; the second connecting plate 330 is formed with a second through hole 331 along the vertical direction, and the second through hole 331 is used for the rod of the first T-shaped bolt to pass through. When the second connecting plate 330 needs to be moved and adjusted in the second horizontal direction, it is only necessary to loosen the first nut on the rod of the first T-shaped bolt so that the first nut is separated from the upper end surface of the second connecting plate 330, and remove the downward locking force applied to the second connecting plate 330, so that the second connecting plate 330 can be smoothly adjusted to move in the second horizontal direction; when the second connecting plate 330 is adjusted to the desired position, it is only necessary to tighten the first nut on the rod of the first T-shaped bolt until it abuts against the upper end surface of the second connecting plate 330, and re-apply the downward locking force on the second connecting plate 330 to lock it; the entire adjustment process is simple and convenient to operate.

[0052] In order to better slide the second connecting plate 330 relative to the first connecting plate 320 along the second horizontal direction to adjust the position, as shown in FIG. Figure 5 As shown, a first connecting portion 332 is protruding from the lower end of the second connecting plate 330 , and the first connecting portion 332 is slidably disposed in the vertical section of the first T-shaped slot 321 .

[0053] In a specific application, the first cleaning nozzle 310 adopts a plasma rotating nozzle of model HRS-R-D10, HRS-R-D20 or HRS-R-D30 currently sold on the market.

[0054] In some embodiments, the cleaning device further includes an unwinder and a rewinder. The unwinder is arranged on the relatively left side of the cleaning cabinet 100 along the first horizontal direction, and the unwinder is used to unwind the copper foil. The rewinder is arranged on the relatively right side of the cleaning cabinet 100 along the first horizontal direction, and the rewinder is used to rewind the copper foil. The cleaning cabinet 100 is provided with an inlet and an outlet on the relatively left side and relatively right side along the first horizontal direction, respectively, and the inlet and the outlet are used for the copper foil to pass through. The copper foil is automatically transported to the cleaning chamber 110 for cleaning and transported to the rewinder for automatic rewinding by the unwinder, which reduces the labor intensity of the operator and has a higher degree of automation.

[0055] In specific applications, the winder can be replaced by a punch press, so that the cleaned copper foil is transported to the punch press to be cut into the required length, and then transported to the subsequent process to be stacked and welded into a whole.

[0056] like Figure 1 and Figure 2 As shown, specifically, a feed guide roller 120 is provided at the feed port, and a discharge guide roller 130 is provided at the discharge port. The projection of the discharge guide roller 130 along the first horizontal direction overlaps with the feed guide roller 120. Through the guiding and supporting effect of the feed guide roller 120 and the discharge guide roller 130, the copper foil entering the cleaning chamber 110 is in a horizontal state to ensure the cleaning effect of the copper foil.

[0057] like Figure 1 , Figure 2 , Figure 7 and Figure 8As shown, in some embodiments, a second carrier plate 510 is provided in the cleaning chamber 110, the second carrier plate 510 and the first carrier plate 210 are staggered along the first horizontal direction, and are located on the relatively left side of the first carrier plate 210 along the first horizontal direction; the second carrier plate 510 is located relatively above the first carrier plate 210, and a gap is formed in the clamping area of ​​the second carrier plate 510 and the first carrier plate 210 along the vertical direction, and the gap is used for copper foil to pass through; a plurality of third through holes 511 are provided on the second carrier plate 510, and the third through holes 511 penetrate the second carrier plate 510 along the vertical direction; a second exhaust hood 520 is provided on the upper end surface of the second carrier plate 510 in the vertical direction, and the second exhaust hood 520 covers the third through holes 511; a second cleaning nozzle assembly 600 is provided directly below the second carrier plate 510 in the vertical direction, and the second cleaning nozzle assembly 600 is used to spray plasma onto the copper foil. By staggering the first carrier plate 210 and the second carrier plate 510 along the first horizontal direction, that is, the projection of the first carrier plate 210 along the vertical direction does not fall within the range of the second carrier plate 510, and the gap size between the first carrier plate 210 and the second carrier plate 510 along the vertical direction matches the thickness of the copper foil, it is ensured that the copper foil entering the cleaning chamber 110 is in a horizontal state; and by providing a second cleaning nozzle assembly 600 directly below the second carrier plate 510, the first cleaning nozzle assembly 300 performs plasma cleaning on the upper surface of the copper foil located on the upper end surface of the first carrier plate 210, while the second cleaning nozzle assembly 600 performs plasma cleaning on the lower surface of the copper foil located on the lower end surface of the second carrier plate 510, that is, while achieving simultaneous plasma cleaning of the upper and lower surfaces of the copper foil to improve the cleaning efficiency, interference between the first cleaning nozzle assembly 300 and the second cleaning nozzle assembly 600 is avoided. At the same time, by providing a second vacuum hood 520 on the upper end surface of the second carrier plate 510, during the cleaning process of the copper foil in the cleaning chamber 110, the second vacuum hood 520 is started to suction air, so that the copper foil is adsorbed and tightly adhered to the lower end surface of the second carrier plate 510 under the action of the pressure difference, ensuring that when the second cleaning nozzle assembly 600 sprays plasma to the lower surface of the copper foil to physically bombard and chemically react the oxide layer on the lower surface of the copper foil to remove the oxide layer, it will not cause the copper foil to bend or plastically deform, and it can be ensured that the copper foil to be cleaned is fixed without the need for clamping with the help of a clamp and plasma cleaning can be performed on any position of the entire lower surface of the copper foil, thereby improving the cleaning quality.

[0058] The specific structure and distribution of the second cleaning nozzle assembly 600 of this embodiment are described in detail below.

[0059] like Figure 6As shown, in some embodiments, the second cleaning nozzle assembly 600 includes two third connecting plates 610 arranged at intervals along the first horizontal direction, and two fourth connecting plates 620 are arranged between the two third connecting plates 610. The fourth connecting plates 620 are slidably arranged on the third connecting plates 610 along the second horizontal direction and locked by the second locking assembly; a row of second cleaning nozzle modules are arranged on the sides facing each other of the two fourth connecting plates 620, and the second cleaning nozzle modules include a plurality of second cleaning nozzles 630 arranged at intervals along the first horizontal direction. By arranging two rows of second cleaning nozzle modules to cover the dimensions of the lower surface of the copper foil along the second horizontal direction, the lower surface of the copper foil can be plasma cleaned without moving and adjusting the position of the second cleaning nozzle assembly 600 along the second horizontal direction, thereby improving the cleaning efficiency; and by arranging each row of second cleaning nozzle modules into a plurality of second cleaning nozzles 630 arranged at intervals along the first horizontal direction, plasma cleaning can be performed simultaneously on different positions of the lower surface of the copper foil along the first horizontal direction, thereby improving the cleaning efficiency. By allowing the two fourth connecting plates 620 to be slidably connected to the third connecting plate 610 along the second horizontal direction, the two fourth connecting plates 620 can be moved closer to or farther away from each other along the second horizontal direction, thereby adjusting the spacing between the two rows of second cleaning nozzle modules along the second horizontal direction to meet the plasma cleaning needs of copper foils of different sizes, with a wide range of applications.

[0060] Specifically, the third connecting plate 610 is provided with a second T-slot 611 at the upper end along the vertical direction, and the second locking assembly includes a matching second T-bolt and a second nut, and the second T-bolt is slidably arranged in the second T-slot 611; the fourth connecting plate 620 is provided with a fourth through hole 621 along the vertical direction, and the fourth through hole 621 is used for the rod of the second T-bolt to pass through. When the fourth connecting plate 620 needs to be moved and adjusted in the second horizontal direction, it is only necessary to loosen the second nut on the rod of the second T-bolt so that the second nut is separated from the upper end surface of the fourth connecting plate 620, and remove the downward locking force applied to the fourth connecting plate 620, so that the fourth connecting plate 620 can be smoothly adjusted to move in the second horizontal direction; when the fourth connecting plate 620 is adjusted to the desired position, it is only necessary to tighten the second nut on the rod of the second T-bolt until it abuts against the upper end surface of the fourth connecting plate 620, and re-apply the downward locking force on the fourth connecting plate 620 to lock it; the entire adjustment process is simple and convenient to operate.

[0061] In order to better slide and adjust the position of the fourth connecting plate 620 relative to the third connecting plate 610 along the second horizontal direction, a second connecting portion is protruded from the lower end of the fourth connecting plate 620 , and the second connecting portion is slidably disposed in the vertical section of the second T-slot 611 .

[0062] Specifically, the first cleaning nozzle 310 and the second cleaning nozzle 630 are set to the same model to ensure that the upper surface and the lower surface of the copper foil have basically the same plasma cleaning effect, so that the upper surface and the lower surface of the copper foil have the same dyne value, thereby ensuring that the peeling force between each two adjacent copper foil layers and the copper foil layers in the copper foil soft connection product produced from multiple copper foils remains basically the same.

[0063] Specifically, the two rows of first cleaning nozzle modules are located between the two rows of second cleaning nozzle modules along the second horizontal direction to avoid mutual interference between the activation positions of the first cleaning nozzle assembly 300 and the second cleaning nozzle assembly 600 on the copper foil surface.

[0064] like Figure 7 As shown, specifically, a second linear drive 710 and a second guide rail 720 are relatively arranged in the cleaning chamber 110 along the second horizontal direction, and the second linear drive 710 is provided with a second mounting plate 711 that moves along the first horizontal direction; one end of the second cleaning nozzle assembly 600 along the second horizontal direction is arranged on the second mounting plate 711, and the other end is slidably arranged on the second guide rail 720. By slidingly arranging the second cleaning nozzle assembly 600 in the cleaning chamber 110 along the first horizontal direction, during the process of plasma cleaning the lower surface of the copper foil, the second linear drive 710 is started to drive the second cleaning nozzle assembly 600 to reciprocate along the first horizontal direction, so that any position of the lower surface of the copper foil along the first horizontal direction can be cleaned on the basis of reducing the number of the second cleaning nozzles 630, thereby ensuring the cleaning effect; and oxidation can be prevented when cleaning one position of the lower surface of the copper foil and cleaning another position. At the same time, the second guide rail 720 guides and supports the end of the second cleaning nozzle assembly 600 away from the second mounting plate 711, ensuring that the distance between the lower end of the second cleaning nozzle 630 and the lower surface of the copper foil in the vertical direction is always consistent during the process of driving the second cleaning nozzle assembly 600 to move along the first horizontal direction, thereby ensuring that the dyne value is maintained at each position of the cleaned lower surface of the copper foil. More specifically, the second linear drive 710 can be set as one of an electric cylinder, a pneumatic cylinder, a linear motor, or a ball screw nut subassembly, and drives the second mounting plate 711 to reciprocate along the first horizontal direction.

[0065] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A cleaning device for soft copper busbar welding materials, It is characterized in that include: A cleaning cabinet (100) is provided with a cleaning chamber (110); A first carrier plate (210) is arranged in the cleaning chamber (110) and is used to carry the copper foil; a plurality of first through holes (211) are arranged on the first carrier plate (210), and the first through holes (211) penetrate the first carrier plate (210) in a vertical direction; A first exhaust hood (220) is arranged on the lower end surface of the first supporting plate (210) in the vertical direction and covers the first through hole (211); The first cleaning nozzle assembly (300) is arranged directly above the first carrier plate (210) in the vertical direction and is used to spray plasma toward the copper foil.

2. A cleaning device for soft copper busbar welding materials according to claim 1, It is characterized in that The first cleaning nozzle assembly (300) comprises two rows of first cleaning nozzle modules arranged opposite to each other along a second horizontal direction; each row of the first cleaning nozzle modules comprises a plurality of first cleaning nozzles (310) arranged at intervals along the first horizontal direction; the first horizontal direction, the second horizontal direction and the vertical direction are perpendicular to each other.

3. A cleaning device for soft copper busbar welding materials according to claim 2, It is characterized in that A first linear drive (410) and a first guide rail (420) are arranged relatively to each other in the cleaning chamber (110) along a second horizontal direction; the first linear drive (410) is provided with a first mounting plate (411) movable along the first horizontal direction; one end of the first cleaning nozzle assembly (300) along the first horizontal direction is arranged on the first mounting plate (411), and the other end is slidably arranged on the first guide rail (420).

4. A cleaning device for soft copper busbar welding materials according to claim 2, It is characterized in that The first cleaning nozzle assembly (300) further comprises two first connecting plates (320) spaced apart along a first horizontal direction, two second connecting plates (330) being arranged between the two first connecting plates (320), the second connecting plates (330) being slidably arranged on the first connecting plates (320) along a second horizontal direction and being locked by a first locking assembly; the two rows of the first cleaning nozzle modules are respectively arranged on the two second connecting plates (330).

5. A cleaning device for soft copper busbar welding materials according to claim 4, It is characterized in that The first connecting plate (320) is provided with a first T-shaped slot (321) at the upper end along the vertical direction, and the first locking assembly comprises a matching first T-shaped bolt and a first nut, and the first T-shaped bolt is slidably arranged in the first T-shaped slot (321); the second connecting plate (330) is provided with a second through hole (331) penetrating along the vertical direction, and the second through hole (331) is used for the rod of the first T-shaped bolt to pass through.

6. A cleaning device for soft copper busbar welding materials according to any one of claims 1 to 5, It is characterized in that The invention also comprises an unwinder and a rewinder, wherein the unwinder is arranged on the relatively left side of the cleaning cabinet (100) along the first horizontal direction, and the unwinder is used to unwind the copper foil; the rewinder is arranged on the relatively right side of the cleaning cabinet (100) along the first horizontal direction, and the rewinder is used to rewind the copper foil; the cleaning cabinet (100) is provided with an inlet and an outlet on the relatively left side and the relatively right side along the first horizontal direction, respectively, and the inlet and the outlet are used to allow the copper foil to pass through; the first horizontal direction and the vertical direction are perpendicular to each other.

7. A cleaning device for soft copper busbar welding materials according to claim 6, It is characterized in that The material inlet is provided with a material inlet guide roller (120), and the material outlet is provided with a material outlet guide roller (130).

8. A cleaning device for soft copper busbar welding materials according to claim 6, It is characterized in that A second carrier plate (510) is arranged in the cleaning chamber (110), and the second carrier plate (510) and the first carrier plate (210) are staggered in a first horizontal direction; the second carrier plate (510) is located relatively above the first carrier plate (210), and a gap is formed in the clamping area of ​​the second carrier plate (510) and the first carrier plate (210) in the vertical direction, and the gap is used for copper foil to pass through; a plurality of third through holes (511) are arranged on the second carrier plate (510), and the third through holes (511) penetrate the second carrier plate (510) in the vertical direction; a second exhaust hood (520) is arranged on the upper end surface of the second carrier plate (510) in the vertical direction, and the second exhaust hood (520) covers the third through holes (511); a second cleaning nozzle assembly (600) is arranged directly below the second carrier plate (510) in the vertical direction, and the second cleaning nozzle assembly (600) is used for spraying plasma onto the copper foil.

9. A cleaning device for soft copper busbar welding materials according to claim 8, It is characterized in that A second linear drive (710) and a second guide rail (720) are arranged relatively in the cleaning chamber (110) along a second horizontal direction, and the second linear drive (710) is provided with a second mounting plate (711) movable along the first horizontal direction; one end of the second cleaning nozzle assembly (600) along the second horizontal direction is arranged on the second mounting plate (711), and the other end is slidably arranged on the second guide rail (720); the first horizontal direction, the second horizontal direction and the vertical direction are perpendicular to each other; And / or, the second cleaning nozzle assembly (600) includes two third connecting plates (610) arranged at intervals along the first horizontal direction, two fourth connecting plates (620) are arranged between the two third connecting plates (610), the fourth connecting plates (620) are slidably arranged on the third connecting plates (610) along the second horizontal direction, and are locked by a second locking assembly; a row of second cleaning nozzle modules are arranged on the side facing each other of the two fourth connecting plates (620), and the second cleaning nozzle modules include a plurality of second cleaning nozzles (630) arranged at intervals along the first horizontal direction; the first horizontal direction, the second horizontal direction and the vertical direction are perpendicular to each other.

10. A cleaning device for soft copper busbar welding materials according to claim 9, It is characterized in that The third connecting plate (610) is provided with a second T-slot (611) at the upper end along the vertical direction, and the second locking assembly includes a matching second T-bolt and a second nut, and the second T-bolt is slidably arranged in the second T-slot (611); the fourth connecting plate (620) is provided with a fourth through hole (621) penetrating along the vertical direction, and the fourth through hole (621) is used for the rod of the second T-bolt to pass through.

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