An automatic tin storage machine for semiconductor module soldering

Abstract

The present invention relates to the technical field of tin storage machines, and specifically to an automatic tin storage machine for tin soldering of semiconductor modules, comprising a tin storage cylinder, a tin adding drive mechanism, an extrusion mechanism and an electric heating sleeve, wherein the bottom surface of the tin adding drive mechanism is detachably connected to the top end of the tin storage cylinder, and the extrusion mechanism is threadedly connected to the bottom end of the tin storage cylinder. The present invention adopts automation technology, and automatically controls the operation of a fixing seat and the electric heating sleeve by connecting an electric control module of a soldering machine. The flexible heat insulation structure is combined with a heating control system, and can effectively maintain the temperature inside the tin storage cylinder, ensuring that the tin liquid always maintains fluidity during continuous operation, thereby achieving precise tin addition. The extrusion mechanism of the extrusion mechanism can stably and accurately transport the tin liquid to a welding area through a pressurized extrusion design, further ensuring the uniformity and efficiency of the tin addition process, and improving the tin addition accuracy. The electric heating sleeve is sleeved on the outside of the tin storage cylinder.

Description

Technical Field

[0001] The invention relates to the technical field of tin storage machines, in particular to an automatic tin storage machine for tin soldering of semiconductor modules. Background Art

[0002] In the semiconductor module soldering process, traditional tin storage machines usually use separate wire feeding and hot melt structures, which have obvious shortcomings. In a common tin storage machine design, the tin wire is transported to the melting chamber through an independent wire feeding device to heat and melt, and then the molten tin is transported to the welding area through other pipes. However, due to the separation of the wire feeding and hot melt structures, this design causes a time difference between the flow of the tin liquid and the tin addition process. Temperature fluctuations during the hot melt process often lead to unstable flow of the tin liquid, which in turn affects the accuracy and uniformity of tin addition. This method is not easy to accurately control the melting speed and flow rate of the tin liquid, and it is easy to cause tin liquid blockage or insufficient tin supply, reducing welding efficiency and quality.

[0003] Another type of tin storage machine uses an injection structure to transport the tin liquid, and the heated tin liquid is injected into the welding area for tinning. However, this type of injection structure also has the problem of insufficient precision. Since the injection mechanism lacks a pressurization design when pushing the tin liquid, the flow rate and speed of the tin liquid are difficult to maintain consistency, resulting in an unstable supply of tin liquid during the tinning process, and it is easy to add too much or too little tin, affecting the quality of the welding joints. In addition, the injection design is prone to tin liquid blockage after working for a long time, especially the tin liquid in a molten state cannot continue to maintain stable fluidity, which further increases the difficulty of equipment maintenance and cleaning.

[0004] In summary, the existing tin storage machine has many defects in the precise addition of tin and flow control of tin liquid, and cannot fully meet the requirements of high-precision and continuous work. In view of this, the existing problems are studied and improved, and an automatic tin storage machine for semiconductor module soldering is provided. Summary of the invention

[0005] The present invention aims to solve one of the technical problems existing in the prior art or related art, especially the shortcomings of the existing tin storage equipment in tin liquid flow control, tin addition accuracy and equipment maintenance, which cannot meet the needs of high-precision semiconductor module welding.

[0006] To this end, the technical solution adopted by the present invention is: an automatic tin storage machine for semiconductor module soldering, comprising: a tin storage cylinder, a tin adding drive mechanism, an extrusion mechanism and a flexible heat-insulating sleeve structure. The tin storage cylinder is used to store tin liquid, and the tin adding drive mechanism is responsible for conveying the tin liquid from the tin storage cylinder to the extrusion mechanism. The extrusion mechanism accurately and stably conveys the tin liquid to the welding area through a pressurized extrusion design, and the flexible heat-insulating sleeve ensures that the tin liquid maintains an appropriate temperature during the conveying and welding process to prevent the tin liquid from solidifying.

[0007] In a preferred example, the present invention can be further configured as follows: the tinning drive mechanism is automatically controlled by the electric control module, and the delivery speed and flow rate of the tin liquid can be adjusted according to the welding requirements to ensure the stable supply of the tin liquid. This design improves the delivery accuracy of the tin liquid and can continuously supply tin during the welding process, avoiding the problem of insufficient or excessive tin addition, and improving the welding quality.

[0008] In a preferred example, the present invention can be further configured as follows: the extrusion mechanism adopts a pressurization design, and the tin liquid flows more evenly through the efficient pressurization device, and the problem of unstable tin liquid flow is prevented. Through the pressurization extrusion design, the tin liquid can be accurately delivered to the welding point, ensuring the uniformity of tin addition, improving the efficiency and accuracy of welding, and is suitable for high-demand semiconductor module welding.

[0009] In a preferred example, the present invention can be further configured as follows: the electromagnetic induction heating system is embedded in the flexible heat-insulating sleeve structure, which can accurately control the temperature of the tin storage cylinder, the tin adding drive mechanism and the extrusion mechanism to ensure that the tin liquid maintains fluidity under high temperature conditions. This design prevents the tin liquid from solidifying due to temperature changes after long-term work through precise temperature control, ensuring the fluidity of the tin liquid and the stability of tin addition during the entire welding process.

[0010] In a preferred example, the present invention can be further configured as follows: the device is equipped with an automatic fault detection function, which can monitor the flow state of the tin liquid in real time. If a blockage or abnormality occurs, an automatic alarm is issued and a shutdown operation is triggered. Through the automatic detection function, problems such as tin liquid blockage and transmission abnormality can be warned and solved in a timely manner, avoiding interference with the welding process and ensuring the safe operation and stable operation of the equipment.

[0011] In a preferred example, the present invention can be further configured as follows: the needle assembly of the extrusion mechanism has an automatic cleaning function, which can regularly remove residual tin liquid to avoid clogging. This design reduces the maintenance workload, extends the service life of the equipment, and ensures that the equipment can still maintain good tinning effect and stability after long-term operation.

[0012] The beneficial effects achieved by the present invention are:

[0013] 1. The present invention adopts automation technology, and automatically controls the operation of the fixing seat and the electric heating set by connecting the electric control module of the soldering machine. The flexible heat insulation structure is combined with the heating control system, which can effectively maintain the temperature inside the tin storage cylinder, ensuring that the tin liquid always maintains fluidity during continuous work, thereby achieving precise tin addition. The extrusion mechanism of the extrusion mechanism can stably and accurately transport the tin liquid to the welding area through the pressurized extrusion design, further ensuring the uniformity and efficiency of the tin addition process and improving the tin addition accuracy.

[0014] 2. The present invention adopts feedback control technology, through a special elastic abutment connection between the drive seat and the fixed seat, and uses the touch switch on the surface of the tin adding bucket to sense the blockage state of the tin liquid. Once blockage or transmission abnormality occurs, the system can automatically detect the fault, immediately alarm and trigger automatic shutdown to ensure the safe operation of the equipment.

[0015] 3. The present invention is easy to maintain and clean. The design of the device makes it easy to disassemble and assemble each component, especially the needle tube needle assembly in the extrusion mechanism has an automatic cleaning function, which can reduce blockage and residue generation. At the same time, through the lock structure and threaded connection design of the screw buckle ear, the rapid assembly of the tin storage cylinder, tin adding drive mechanism, extrusion mechanism and electric heating set is realized, which simplifies maintenance and cleaning operations and significantly improves the service life of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present invention;

[0017] Figure 2 A schematic diagram of the cross-sectional structure of a tin storage cylinder according to an embodiment of the present invention;

[0018] Figure 3 A schematic diagram of the structure of a tin-adding driving mechanism according to an embodiment of the present invention;

[0019] Figure 4 It is a schematic diagram of the structure of a tin adding driving mechanism and a tin storage cylinder according to an embodiment of the present invention;

[0020] Figure 5 A schematic diagram of a partial cross-sectional structure of an electric heating sleeve according to an embodiment of the present invention;

[0021] Figure 6 It is a schematic diagram of the exploded structure of an extrusion mechanism according to an embodiment of the present invention;

[0022] Figure 7 It is a schematic diagram of the exploded inverted structure of an extrusion mechanism according to an embodiment of the present invention.

[0023] Reference numerals:

[0024] 100, tin storage cylinder; 110, screw-on ear;

[0025] 200, tin adding driving mechanism; 210, driving seat; 220, fixing seat; 230, tin adding bucket; 240, elastic connecting strip; 250, conveying rotating shaft; 221, motor; 222, rotating sensor;

[0026] 300, extrusion mechanism; 310, injection box; 320, bottom cover; 330, shaft; 340, moving guide plate; 350, moving vortex; 360, static vortex; 311, liquid inlet hole; 321, needle tube; 331, eccentric pin;

[0027] 400, electric heating set; 410, eddy current coil; 411, electrode strip. DETAILED DESCRIPTION

[0028] To make the purpose, technical solution and advantages of the present invention more clear, the present invention is further described in detail below in combination with specific implementations and with reference to the accompanying drawings. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0029] It is to be understood that these descriptions are exemplary only and are not intended to limit the scope of the invention.

[0030] An automatic tin storage machine for soldering semiconductor modules provided by some embodiments of the present invention will be described below in conjunction with the accompanying drawings.

[0031] Combination Figure 1-Figure 7 As shown, the present invention provides an automatic tin storage machine for semiconductor module soldering, which includes four parts: a tin storage cylinder 100, a tin adding driving mechanism 200, an extrusion mechanism 300 and an electric heating sleeve 400. The structure, function and working principle thereof are described in detail below.

[0032] 1. Structure and function of the tin storage cylinder 100

[0033] The tin storage cylinder 100 is a tin storage cylinder for storing molten tin. A screw-on ear 110 is provided at the top thereof. During the assembly process, the electric heating sleeve 400 is sleeved on the outer surface of the tin storage cylinder 100 to play a role in heat insulation.

[0034] The bottom end of the tin storage cylinder 100 is engaged with the extrusion mechanism 300 through a threaded connection, so that the tin liquid can smoothly flow from the tin storage cylinder 100 into the extrusion mechanism 300 .

[0035] The inner cavity of the tin storage cylinder 100 stores the tin liquid, and cooperates with the transmission mechanism to make the tin liquid flow through the pipeline to the extrusion mechanism to achieve accurate tin liquid supply.

[0036] 2. Structure and function of the tinning drive mechanism 200

[0037] The tin adding driving mechanism 200 is a tin adding driving mechanism, which is detachably connected to the top end of the tin storage cylinder 100 and is used to drive the transmission of the tin liquid.

[0038] The tin adding driving mechanism 200 comprises a driving seat 210, a fixing seat 220, a tin adding bucket 230 and an elastic connecting bar 240. The elastic connecting bar 240 is an elastic connecting bar symmetrically arranged on both sides of the driving seat 210 and the fixing seat 220 for providing elastic support.

[0039] The tin adding bucket 230 is fixedly mounted on the top surface of the driving seat 210 and is provided with a touch switch. When elastic separation occurs between the fixing seat 220 and the tin adding bucket 230, the switch is triggered, the work stops and an alarm is sounded.

[0040] The motor 221 is used to drive the rotation of the conveying swivel 250 to drive the tin liquid from the tin storage cylinder 100 into the extrusion mechanism 300. The rotation sensor 222 is used to detect the rotation angle or rotation number of the conveying swivel 250 to ensure the stability of the flow of the tin liquid.

[0041] The conveying rotary shaft 250 is a spiral shaft structure, and its surface is in sliding contact with the inner wall of the tin storage cylinder 100, so as to convey the tin liquid to the extrusion mechanism.

[0042] 3. Structure and function of extrusion mechanism 300

[0043] The extrusion mechanism 300 is an extrusion mechanism for accurately outputting the tin liquid. The extrusion mechanism 300 includes an injection box 310, a bottom cover 320, a shaft 330, a moving guide plate 340, a moving scroll 350 and a static scroll 360. A pressurized extrusion channel is formed between the moving scroll 350 and the static scroll 360 for extruding the tin liquid.

[0044] The shaft 330 is connected to the conveying swivel 250 through a key shaft to drive it to rotate. After the tin liquid enters the extrusion mechanism 300, the rotation of the shaft 330 pushes the tin liquid to flow to the pressurized area between the moving guide plate 340 and the moving vortex 350.

[0045] The liquid inlet hole 311 connects the tin storage cylinder 100 and the injection and pressure box 310 to ensure that the tin liquid smoothly enters the extrusion chamber injection and pressure box 310 from the tin storage cylinder 100.

[0046] The needle tube 321 is located at the bottom of the bottom cover 320, and needles of different specifications can be replaced according to needs for accurate tin liquid filling.

[0047] 4. Structure and function of electric heating set 400

[0048] The electric heating sleeve 400 is a flexible heat-insulating rubber sleeve structure, which is sleeved on the outside of the tin storage cylinder 100 to ensure the stability of the tin liquid temperature. A number of eddy current coils 410 are embedded in it for eddy current heating.

[0049] The ends of the eddy current coils 410 are electrically connected to the electrode strips 411 and connected to the eddy current generator to achieve induction heating of the conveying shaft 250, the moving guide plate 340, the moving vortex 350, the static vortex 360 and the tin liquid. Multiple eddy current coils 410 are set in different temperature zones as needed to achieve zoned heating and temperature control.

[0050] The electric heating set 400 has good heat insulation effect to prevent heat loss, and continuously heats and insulates the molten tin through the eddy current heater to ensure that the molten tin always remains in a flowing state and avoids solidification.

[0051] The working principle and use process of the present invention are as follows:

[0052] 1. Assembly process:

[0053] A screw-on ear 110 is disposed at the top of the tin storage cylinder 100 . During the assembly process, the electric heating sleeve 400 is first sleeved onto the outer surface of the tin storage cylinder 100 .

[0054] Next, the top surface of the extrusion mechanism 300 is threadedly connected to the bottom end of the tin storage cylinder 100 through the injection box 310 to make them tightly combined.

[0055] Then, the bottom conveying shaft 250 of the tin adding driving mechanism 200 is inserted into the inner side of the tin storage cylinder 100 until the bottom end of the conveying shaft 250 reaches the bottom end of the inner cavity of the tin storage cylinder 100 and the bottom end of the conveying shaft 250 is engaged with the top end of the shaft 330 .

[0056] By rotating the tin storage cylinder 100 by 90 degrees, the screw buckle ear 110 is engaged with the bottom groove of the driving seat 210, and finally the tin storage cylinder 100, the tin adding driving mechanism 200, the extrusion mechanism 300 and the electric heating sleeve 400 are quickly assembled.

[0057] 2. Tinning operation:

[0058] Before the tinning operation is performed, an external power source is first connected through the electrode strips 411 on the surface of the electric heating sleeve 400, and eddy currents are introduced into each eddy current coil 410 to perform induction heating on the conveying shaft 250 inside the tin storage cylinder 100 and the moving guide plate 340, the moving vortex 350 and the static vortex 360 inside the injection box 310 to achieve preheating operation.

[0059] After the preheating is completed, the tin liquid filling device is connected through the tin adding hopper 230, so that the tin liquid can smoothly enter the interior of the tin storage cylinder 100 for storage, preparing for the next operation.

[0060] 3.Semiconductor module soldering operation:

[0061] When the semiconductor module is soldering, the electronic control module will automatically connect the eddy current coils 410 inside the electric heating sleeve 400 to perform induction heating on the tin liquid inside the tin storage cylinder 100 as well as the conveying shaft 250, the moving guide plate 340, the moving vortex 350 and the static vortex 360 and maintain a constant temperature, ensuring that the tin liquid is always in a flowing state to avoid solidification or blockage.

[0062] The electric control module controls the operation of the motor 221 according to the soldering action instruction, and the motor 221 drives the conveying rotary shaft 250 to rotate, and simultaneously drives the shaft 330 to rotate.

[0063] During the rotation of the conveying shaft 250, the tin liquid is pushed into the interior of the injection box 310 through the liquid inlet hole 311, and under the guidance of the eccentric pin 331 on the surface of the shaft 330, the movable guide plate 340 and the movable scroll 350 swing eccentrically relative to the fixed scroll 360.

[0064] The tin liquid thus enters between the movable vortex 350 and the static vortex 360, and is pressurized and squeezed out in the process of gradually moving toward its axis. The precise tinning operation of the tin liquid is achieved through the needle tube 321 at the bottom end of the bottom cover 320, ensuring that the tin liquid is accurately delivered to the soldering area.

[0065] 4. Control system:

[0066] During the tin adding process, if the tin liquid is blocked inside the extrusion mechanism 300 and the tin discharge is interrupted, the rotational movement of the conveying rotary shaft 250 is blocked, and a reaction force is generated.

[0067] This reaction force will push the fixing seat 220 and the top surface of the tin adding bucket 230 to separate elastically under the elastic limiting action of the elastic connecting strip 240, triggering the touch switch on the top surface of the tin adding bucket 230, automatically stopping the operation of the fixing seat 220, and then triggering an alarm prompt to ensure safe operation.

[0068] Meanwhile, during the normal operation of the fixed seat 220, the rotation sensor 222 detects the rotation angle or number of rotations of the conveying rotary shaft 250 to monitor the output of the tin liquid in real time. When the set amount is reached, the system will automatically control the shutdown to ensure the accuracy and consistency of tin addition.

[0069] Through the above working principle and use process, the present invention realizes precise control, efficient heating and flow management during the tinning process of the tin liquid, thereby ensuring stable output and precise positioning of the tin liquid.

[0070] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0071] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An automatic tin storage machine for semiconductor module soldering, characterized in that: include: A tin storage cylinder (100), a tin adding drive mechanism (200), an extrusion mechanism (300), an electric heating sleeve group (400), and a control system, wherein the bottom surface of the tin adding drive mechanism (200) is detachably connected to the top end of the tin storage cylinder (100), the extrusion mechanism (300) is threadedly connected to the bottom end of the tin storage cylinder (100), and the electric heating sleeve group (400) is sleeved on the outside of the tin storage cylinder (100); The tin adding driving mechanism (200) comprises: a driving seat (210), a fixed seat (220), a tin adding bucket (230), an elastic connecting bar (240) and a conveying rotary shaft (250); the elastic connecting bar (240) is used for elastic connection between the driving seat (210) and the fixed seat (220); the elastic connecting bar (240) is symmetrically arranged, connected to both sides of the driving seat (210) and the fixed seat (220), and forms an elastic connection therebetween; the elastic connecting bar (240) is U-shaped; the elastic connecting bar (240) is an elastic metal strip structure, and is used for tightly pressing the fixed seat (220) and the tin adding bucket (230) to form a pressing contact; The extrusion mechanism (300) comprises: an injection box (310), a bottom cover (320), a shaft (330), a moving guide plate (340), and a fixed component static vortex (360) and a moving component moving vortex (350). The fixed component static vortex (360) is located on the upper surface of the bottom cover (320), and the moving component moving vortex (350) is located on the lower surface of the moving guide plate (340). The top end of the shaft (330) is provided with a key shaft that is sleeved with the bottom end of the conveying swivel (250) and connected by plugging. The shaft (330) is installed on the axis of the injection box (310) and is connected to the moving guide plate (340) via an eccentric pin (331). The surface of the injection box (310) is provided with a guide channel liquid inlet hole (311) that is connected to the inner cavity of the tin storage cylinder (100) and is used for guiding tin liquid.

2. The automatic tin storage machine for semiconductor module soldering according to claim 1, characterized in that: The tin adding bucket (230) is fixed to the top surface of the driving seat (210), and a touch switch is provided on the top surface thereof, which is in contact with the bottom surface of the fixing seat (220). A motor (221) is fixedly mounted on the outer surface of the fixing seat (220), and a rotation sensor (222) which is a monitoring device for monitoring the rotation angle or number of cycles of the output shaft is provided on the top of the motor (221). The output shaft of the motor (221) passes through the tin adding bucket (230) and is fixedly connected to the conveying rotary shaft (250), and the conveying rotary shaft (250) is rotatably sleeved on the inner side of the tin storage cylinder (100).

3. The automatic tin storage machine for semiconductor module soldering according to claim 2, characterized in that: The rotation sensor (222) is used to monitor the rotation state of the conveying rotary shaft (250) in real time and to accurately control the conveying of the molten tin.

4. The automatic tin storage machine for semiconductor module soldering according to claim 2, characterized in that: The tin adding bucket (230) is provided with a sleeve hole for sleeve-connecting the output shaft of the motor (221), and the output shaft of the motor (221) moves up and down in the sleeve hole.

5. The automatic tin storage machine for semiconductor module soldering according to claim 2, characterized in that: The control system is integrated inside the device and is used to monitor the flow state inside the extrusion mechanism (300) during the tinning process. When the tin liquid is transported, the rotation of the transport swivel (250) generates a reaction force, and the elastic separation generated by the elastic connecting strip (240) causes the top surface of the tinning bucket (230) to trigger a switch, stop the motor (221), and activate an alarm prompt device. At the same time, the control system detects the rotation angle or number of rotations of the conveying rotary shaft (250) in real time through the rotation sensor (222), automatically calculates the output amount of the molten tin, and when a preset value is reached, controls the motor (221) to stop running, thereby ensuring accurate output of the molten tin.

6. The automatic tin storage machine for semiconductor module soldering according to claim 1, characterized in that: The conveying swivel (250) is a spiral shaft structure, and the surface of the conveying swivel (250) is slidably matched with the inner wall of the tin storage cylinder (100). The surfaces of the conveying swivel (250), the moving guide plate (340), the moving scroll (350) and the static scroll (360) are coated with a high-temperature resistant anti-stick coating to reduce the adhesion and sticking of tin liquid.

7. The automatic tin storage machine for semiconductor module soldering according to claim 1, characterized in that: The movable vortex (350) and the static vortex (360) are located in the same plane and are arranged between the movable guide plate (340) and the bottom cover (320). The bottom cover (320) is fixedly mounted on the bottom surface of the injection box (310) and is detachably connected to a needle tube (321) of a needle assembly for accurately positioning tin addition.

8. The automatic tin storage machine for semiconductor module soldering according to claim 1, characterized in that: The electric heating sleeve (400) is a flexible heat-insulating rubber sleeve structure. A plurality of flexible electromagnetic induction coil eddy current coils (410) are embedded inside the electric heating sleeve (400). The ends of the eddy current coils (410) are electrically connected to conductive terminal electrode strips (411) on the surface of the electric heating sleeve (400). The conductive terminals are connected to an eddy current generator for performing eddy current induction heating on the conveying shaft (250), the moving guide disc (340), the moving vortex (350), the static vortex (360) and the tin liquid to adjust the working temperature. The plurality of eddy current coils (410) form a plurality of independent temperature control areas.

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