Preparation method of nozzle

Abstract

The invention discloses a preparation method of a nozzle. The preparation method comprises the following steps: providing a first substrate and a second substrate; forming a groove structure on the first substrate; the groove structure comprises an atomization groove, and a liquid inlet groove and an air inlet groove which are communicated with the atomization groove; forming a heating body on the first substrate and / or the second substrate; and the first substrate and the second substrate are bonded, so that the second substrate is matched with the atomization groove, the liquid inlet groove and the air inlet groove to form an atomization cavity, a liquid inlet channel and an air inlet channel. According to the nozzle, the heating body is integrated on the nozzle, so that the heating and atomizing functions of the nozzle are integrated. According to the atomizing nozzle, the single nozzle is not influenced by the viscosity of a medium and the temperature of a using environment during atomizing, so that the stability and the consistency of the atomizing performance are improved.

Description

Technical Field

[0001] The present application relates to the field of atomization technology, and in particular to a method for preparing a nozzle. Background Art

[0002] In the related technologies, the processing of atomizing nozzles is usually based on conventional processing methods such as mechanical processing, 3D printing, and injection molding. The functions are single and multifunctional integration cannot be achieved. The nozzle only realizes a single atomization function and cannot achieve atomization and viscosity reduction at the same time. The atomizing nozzle is affected by the viscosity and temperature of the aerosol generating matrix. There are large deviations in the stability and consistency of the atomization performance, and the atomization amount and atomized particle size fluctuate significantly. Summary of the invention

[0003] In view of this, the present application provides a method for preparing a nozzle to solve the problems in the prior art such as the single function of the nozzle and large deviations in stability and consistency.

[0004] In order to solve the above technical problems, the first technical solution provided in the present application is: providing a method for preparing a nozzle, comprising: providing a first substrate and a second substrate; forming a groove structure on the first substrate; the groove structure comprises an atomization groove and a liquid inlet groove and an air inlet groove connected to the atomization groove; forming a heating body on the first substrate and / or the second substrate; bonding the first substrate to the second substrate; wherein the second substrate cooperates with the atomization groove, the liquid inlet groove and the air inlet groove to form an atomization chamber, a liquid inlet channel and an air inlet channel respectively.

[0005] Optionally, the first substrate includes a first surface and a second surface arranged opposite to each other; the second substrate includes a third surface and a fourth surface arranged opposite to each other; forming a groove structure on the first substrate includes forming the groove structure on the first surface, and bonding the first substrate to the second substrate includes bonding the first surface to the third surface; wherein, forming a heater on the first substrate and / or the second substrate includes: forming the heater on the bottom surface of the groove structure; and / or forming the heater on the second surface; and / or forming the heater on the third surface; and / or forming the heater on the fourth surface.

[0006] Optionally, forming the heating body on the first substrate and / or the second substrate includes forming the heating body on the bottom surface of the groove structure; wherein, before bonding the first substrate to the second substrate, the step also includes opening a lead hole on the second substrate; bonding the first substrate to the second substrate also includes setting the lead hole corresponding to the heating body; after bonding the first substrate to the second substrate, the step also includes leading out electrodes of the heating body through the lead hole.

[0007] Optionally, forming the heating body on the bottom surface of the groove structure includes forming the heating body on the bottom surface of the liquid inlet groove; opening the lead hole on the second substrate includes opening a first lead hole and a second lead hole in a portion of the second substrate corresponding to the liquid inlet groove; and setting the lead hole corresponding to the heating body includes exposing the first electrode of the heating body through the first lead hole and exposing the second electrode of the heating body through the second lead hole.

[0008] Optionally, forming the heating body on the first substrate and / or the second substrate includes forming the heating body on the third surface; wherein, before bonding the first substrate to the second substrate, the step also includes opening a lead hole on the first substrate; bonding the first substrate to the second substrate also includes setting the lead hole corresponding to the heating body; after bonding the first substrate to the second substrate, the step also includes leading out electrodes of the heating body through the lead hole.

[0009] Optionally, forming the heating body on the third surface includes forming the heating body in an area of ​​the third surface corresponding to the liquid inlet groove; opening lead holes on the first substrate includes opening a first lead hole and a second lead hole on a bottom wall of the liquid inlet groove; and arranging the lead holes corresponding to the heating body includes exposing a first electrode of the heating body through the first lead hole and exposing a second electrode of the heating body through the second lead hole.

[0010] Optionally, the electrode lead-out of the heating body through the lead hole includes: leading out an electrode lead electrically connected to the heating body from the lead hole, and sealing the lead hole with a sealant; or inserting a pin into the lead hole and abutting against the heating body, and sealing the lead hole with a sealant.

[0011] Optionally, forming the groove structure on the first surface includes: forming the atomization groove and a liquid inlet groove and an air inlet groove connected to the atomization groove on the first surface, and opening a notch on the side wall of the atomization groove; bonding the first substrate to the second substrate includes the second substrate and the notch cooperating to form a mist outlet; or forming the atomization groove and a fluid groove surrounding the atomization groove, and a plurality of liquid inlet grooves connecting the fluid groove and the atomization groove on the first surface, and opening a first through hole on the bottom wall of the atomization groove as the air inlet groove, and the outer side wall of the fluid groove has a liquid inlet; the preparation method of the nozzle It also includes opening a second through hole on the second substrate as a mist outlet; the bonding of the first substrate to the second substrate includes connecting the mist outlet with the atomization groove; or forming the atomization groove and a fluid groove surrounding the atomization groove on the first surface, and a plurality of air inlet grooves connecting the fluid groove and the atomization groove; the bottom wall of the atomization groove has a first through hole as a liquid inlet groove; the outer wall of the fluid groove has an air inlet; the method for preparing the nozzle also includes opening a second through hole on the second substrate as a mist outlet; the bonding of the first substrate to the second substrate includes connecting the mist outlet with the atomization groove.

[0012] Optionally, the first substrate includes a plurality of first preset portions, and the second substrate includes a plurality of second preset portions; forming a groove structure on the first substrate includes forming the groove structure in each of the first preset portions; forming a heating body on the first substrate and / or the second substrate includes forming the heating body in each of the first preset portions or each of the second preset portions; bonding the first substrate to the second substrate includes arranging a plurality of the first preset portions and a plurality of the second preset portions in a one-to-one correspondence; and after bonding the first substrate to the second substrate, the step further includes cutting the bonded first substrate and the second substrate to obtain a plurality of nozzles.

[0013] Optionally, the first substrate is a silicon wafer or glass, and the second substrate is a silicon wafer or glass.

[0014] Optionally, forming the heating body on the first substrate and / or the second substrate includes: forming a patterned heating film by mask deposition; or depositing a heating film and patterning the heating film.

[0015] Optionally, the heating film is a metal film with a thickness of 100-1000 nm.

[0016] Beneficial effects of the present application: Different from the prior art, the preparation method of the nozzle of the present application forms a groove structure on the first substrate; the groove structure includes an atomization groove and a liquid inlet groove and an air inlet groove connected to the atomization groove; a heating body is formed on the first substrate and / or the second substrate; the first substrate is bonded to the second substrate so that the second substrate cooperates with the atomization groove, the liquid inlet groove and the air inlet groove to form an atomization chamber, a liquid inlet channel and an air inlet channel respectively. The present application integrates the heating and atomization functions of the nozzle by integrating a heating body on the nozzle. When a single nozzle is atomized, it is not affected by the viscosity of the medium or the temperature of the use environment, thereby improving the stability and consistency of the atomization performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 It is an overall flow chart of the method for preparing the nozzle provided in the present application;

[0019] Figure 2 is a process flow chart of a method for preparing a nozzle provided in the first embodiment of the present application;

[0020] Figure 3 is a process flow chart of the sub-steps of step SA2 provided in the first embodiment of the present application;

[0021] Figure 4 is a process flow chart of the sub-steps of step SA3 provided in the first embodiment of the present application;

[0022] Figure 5 is a process flow chart of a method for preparing a nozzle provided in the second embodiment of the present application;

[0023] Figure 6 is a flowchart of a method for preparing a nozzle provided in the second embodiment of the present application;

[0024] Figure 7 is a process flow chart of a method for preparing a nozzle provided in the third embodiment of the present application;

[0025] Figure 8 It is a flow chart of the method for preparing a nozzle provided in the third embodiment of the present application;

[0026] Fig. 9 is a flowchart of a method for preparing a nozzle provided in a fourth embodiment of the present application;

[0027] Fig.10It is a schematic diagram of some modules of the electronic atomization device provided in this application. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0029] The terms "first", "second" and "first" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" can expressly or implicitly include at least one of the features. All directional indications (such as up, down, left, right, front, back ...) in the embodiments of the present application are only used to explain the relative position relationship, movement conditions, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0030] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0031] The inventors of this application have found that the processing of atomizing nozzles is usually based on conventional processing methods such as mechanical processing, 3D printing, and injection molding, which have single functions and cannot achieve multi-functional integration. Specifically, the nozzle processing method of the prior art has the following problems:

[0032] Atomizing nozzles manufactured using conventional processing methods such as machining, 3D printing, and injection molding have a single function and are unable to achieve multifunctional integration.

[0033] Ordinary MEMS (Micro-Electro-Mechanical Systems) nozzles do not achieve multifunctional integration, and the nozzles only achieve a single atomization function, and cannot achieve atomization and viscosity reduction at the same time.

[0034] Atomizing nozzles are affected by the viscosity and temperature of the medium. There are large deviations in the stability and consistency of atomization performance, and significant fluctuations in atomization volume and atomization particle size.

[0035] In order to solve the above problems, the present application proposes a method for preparing a nozzle 100. The integrated heating nozzle 100 manufactured based on the MEMS process is not only small in size and high in precision, but also has integrated manufacturing, and can realize multi-function integration on the atomizing nozzle 100, expand the functionality of the atomizing nozzle 100 or improve the atomization effect. The heating function of the atomizing nozzle 100 is integrated, and the temperature control function is provided, so that the heating and atomization processes of the atomizing nozzle 100 can be carried out simultaneously.

[0036] See also Figure 1 , Figure 1 It is an overall flow chart of the method for preparing the nozzle provided in this application.

[0037] The method for preparing the nozzle 100 provided in the present application may include:

[0038] S1: providing a first substrate 10 and a second substrate 20 .

[0039] Specifically, the first substrate 10 includes a first surface 11 and a second surface 12 that are arranged opposite to each other; the second substrate 20 includes a third surface 21 and a fourth surface 22 that are arranged opposite to each other. The second substrate 20 is used to cover the first substrate 10 to form the main structure of the nozzle 100. The first substrate 10 can be used as the main body substrate of the nozzle 100, and the second substrate 20 can be used as the cover substrate of the nozzle 100. The first substrate 10 and the second substrate 20 can both be silicon wafers or glass, and the thickness can be 0.5mm-1mm. It can be understood that the first substrate 10 and the second substrate 20 can also be other materials, and this application does not limit this.

[0040] S2: forming a groove structure 13 on the first substrate 10 .

[0041] Specifically, the groove structure 13 can be formed on the first substrate 10 by etching or other processes. The groove structure 13 includes an atomization groove 132 and a liquid inlet groove 131 and an air inlet groove 133 connected to the atomization groove 132. The specific shape and size of the groove structure 13 are not limited, and can be as follows: Figure 2 and 5 The structure shown can also be Figure 6 The structure shown.

[0042] It can be understood that before forming the groove structure 13 on the first substrate 10, the first substrate 10 needs to be cleaned first (the second substrate 20 can also undergo the same cleaning steps), for example, ultrasonic cleaning with acetone, ethanol, and deionized water for 3 minutes in sequence, then drying the surface moisture, and then using plasma cleaning for 5 minutes.

[0043] Exemplarily, the method of forming the groove structure 13 may be:

[0044] A first photoresist layer (not shown) is coated on the first surface 11. Specifically, the photoresist is uniformly coated with a thickness of 5-20 μm, and then placed in a 90-120° C. oven or on a hot plate to bake and cure.

[0045] The first mask (not shown) with the flow path pattern of the nozzle 100 is used for contact exposure to transfer the flow path pattern on the first mask to the first photoresist layer, wherein the contact exposure time is 30s-120s. The flow path area and the non-flow path area can be distinguished by ultraviolet exposure.

[0046] The first photoresist layer is developed to remove the photoresist on the flow channel area to obtain the flow channel area, that is, the area where the groove structure 13 is located. The time for developing the first photoresist layer is 30s-120s. The photoresist is developed, and the photoresist can be dissolved by the developer, thereby removing the photoresist on the surface of the flow channel area, leaving a photoresist pattern with a certain thickness. It can be understood that the pattern obtained by development is consistent with the flow channel of the nozzle 100.

[0047] The flow channel region is etched to form a groove structure 13 including an atomization groove 132, a liquid inlet groove 131 and an air inlet groove 133. Specifically, etching the flow channel region includes performing ICP-RIE etching on the first substrate 10 that is not blocked by the photoresist layer to form the atomization groove 132, the liquid inlet groove 131 and the air inlet groove 133, and the etching depth is 100-300 μm. ICP-RIE etching can achieve high-rate and low-damage etching, with low working gas pressure, which is conducive to controlling the etching morphology, and high plasma density.

[0048] S3 : forming a heating body 30 on the first substrate 10 and / or the second substrate 20 .

[0049] Specifically, forming the heating body 30 on the first substrate 10 and / or the second substrate 20 may include forming the heating body 30 on the bottom surface of the groove structure 13, and / or forming the heating body 30 on the second surface 12, and / or forming the heating body 30 on the third surface 21, and / or forming the heating body 30 on the fourth surface 22. The heating body 30 includes a first electrode 31 and a second electrode 32 disposed at two ends, and the first electrode 31 and the second electrode 32 may be led out through a wire (not shown) or a pin (not shown), and may be electrically connected to the power supply assembly 200 after being led out.

[0050] The formation of the integrated heating body 30 on the second surface 12, the third surface 21 or the fourth surface 22 does not require high precision, so a stainless steel mask can be used to transfer the heating body 30 pattern on the stainless steel mask to the sputtered metal film, and a lift-off process is used to avoid the use of separate photolithography and stripping processes. The process is simple and low-cost.

[0051] The above configurations can all meet the purpose of heating the aerosol-generating substrate in the liquid inlet channel 15, and the present application does not impose any limitation thereto. Preferably, the heating body 30 can be arranged on the bottom surface of the groove structure 13 to improve the heating effect on the aerosol-generating substrate.

[0052] Step S3 of forming the heating body 30 on the first substrate 10 and / or the second substrate 20 can be implemented in the following two ways:

[0053] Method 1: Form a patterned heating film through mask deposition.

[0054] Specifically, a patterned heating film can be deposited on the bottom surface of the groove structure 13 by a mask process. For example, a 1-2 μm photoresist layer (not shown) can be coated on the second surface 12, and the pattern on the mask corresponding to the mask process can be transferred to the photoresist layer by an exposure process; the photoresist layer is developed to remove the photoresist to obtain a region to be deposited; a heating film is further deposited on the region to be deposited by a magnetron sputtering process; and the photoresist on the second surface 12 except the region to be deposited is removed to obtain a heating body 30.

[0055] For another example, the integrated heating body 30 formed on the second surface 12, the third surface 21 or the fourth surface 22 does not require high precision, so a stainless steel mask can be used to transfer the heating body 30 pattern on the stainless steel mask to the sputtered metal film, and the Lift-off process is used to avoid the use of photolithography and stripping processes. The process is simple and low in cost. The specific operation steps are: use the stainless steel with the heating body 30 pattern as a mask (stainless steel thickness 10-100μm), closely fit it on the first substrate 10, align it with the nozzle 100, and align it with the horizontal alignment accuracy of 50-100μm, and then place it in the sputtering machine as a whole to deposit the metal heating film. After deposition, directly remove the stainless steel mask to obtain the heating body 30.

[0056] Method 2: depositing a heating film and patterning the heating film.

[0057] Specifically, a whole layer of heating film can be formed on the bottom surface of the groove structure 13 or the second surface 12 of the first substrate 10, and then the whole layer of heating film can be patterned to form the heating film area required in this embodiment. For example, a metal layer can be deposited on the second surface 12 first, and then a 1-2 μm photoresist layer (not shown) can be coated on the metal layer, and the pattern on the mask corresponding to the mask process can be transferred to the photoresist layer by an exposure process; the photoresist layer can be developed to remove the photoresist to obtain an exposed area; the metal layer exposed in the exposed area can be further removed by etching; the photoresist on the second surface 12 except the exposed area can be removed to obtain a patterned metal layer as the heating body 30.

[0058] The heating film is a metal film with a thickness of 100-1000 nm. The metal film material is Au, NiCr, Pt or other metals used to generate Joule heat, serving as the heating body 30 .

[0059] S4: Bonding the first substrate 10 and the second substrate 20 .

[0060] Specifically, the second substrate 20 is covered on the first substrate 10 , and the two are integrated into one by a bonding process to form the nozzle 100 .

[0061] Specifically, when the heating body 30 is formed on the bottom surface of the groove structure 13, the third surface 21 or the fourth surface 22 of the second substrate 20 can be bonded to the first surface 11. Accordingly, corresponding lead holes 16 need to be opened on the second substrate 20 to lead out the two electrodes of the heating body 30 through wires or pins.

[0062] When the heater 30 is formed on the second surface 12, the two electrodes of the heater 30 can be directly led out by the ejector pins without opening the lead holes 16. Meanwhile, when the first substrate 10 is bonded to the second substrate 20, the first surface 11 is bonded to the third surface 21 or the fourth surface 22.

[0063] When the heater 30 is formed on the third surface 21 or the fourth surface 22, if the side with the heater 30 faces the groove structure 13, it is necessary to open a lead hole 16 on the first substrate 10 or the second substrate 20 to lead out the two electrodes of the heater 30. If the side with the heater 30 faces away from the groove structure 13, it is not necessary to open a lead hole 16 on the first substrate 10 or the second substrate 20, and the two electrodes of the heater 30 can be directly led out through the ejector pin.

[0064] For example, in one embodiment, when the heater 30 is formed on the third surface 21, a lead hole 16 can be opened on the first substrate 10 or the second substrate 20 to lead out two electrodes of the heater 30. At the same time, when the first substrate 10 and the second substrate 20 are bonded, the first surface 11 and the third surface 21 are bonded together.

[0065] For another example, in another embodiment, when the heater 30 is formed on the fourth surface 22, the two electrodes of the heater 30 can be directly led out through the ejector pins, without the need to open the lead holes 16. At the same time, when the first substrate 10 is bonded to the second substrate 20, the first surface 11 is bonded to the third surface 21.

[0066] After the second substrate 20 is bonded to the first substrate 10, the second substrate 20 can cooperate with the atomization groove 132, the liquid inlet groove 131 and the air inlet groove 133 formed on the first substrate 10 to form the atomization chamber 17, the liquid inlet channel 15 and the air inlet channel 14. The bonding temperature is 300-450°C, the bonding voltage is 500-800V, and the bonding time is 10-20min.

[0067] The following is a specific embodiment of the method for preparing the nozzle 100 provided in the present application.

[0068] First embodiment:

[0069] See also Figures 2 to 4 , Figure 2 is a process flow chart of a method for preparing a nozzle provided in the first embodiment of the present application; Figure 3 is a process flow chart of the sub-steps of step SA2 provided in the first embodiment of the present application; Figure 4 It is a process flow chart of the sub-steps of step SA3 provided in the first embodiment of the present application.

[0070] SA1: Provide a first substrate 10 and a second substrate 20 .

[0071] For the specific content, please refer to the specific description of S1 above and will not be repeated here.

[0072] SA2: forming a groove structure 13 on the first surface 11 .

[0073] Specifically, the groove structure 13 can be formed by etching the first surface 11. The first surface 11 forms an atomization groove 132 and a liquid inlet groove 131 and an air inlet groove 133 connected to the atomization groove 132, and a notch 135 is formed on the side wall of the atomization groove 132. The shape of the groove structure 13 in this embodiment is not limited, and can also be used. Figure 6 The groove structure in this embodiment is only Figure 2 The structure in which the atomizing groove 132 , the liquid inlet groove 131 and the air inlet groove 133 are all located on the first surface 11 is described as an example.

[0074] like Figure 3 As shown, in one embodiment, step SA2 of forming the groove structure 13 on the first surface 11 may include the following steps SA21 and SA22:

[0075] SA21 : Form a first mask 181 on the first substrate 10 .

[0076] Specifically, in this embodiment, the first mask 181 is patterned and has a hollow area, so that the first surface 11 is partially exposed to form a first exposed area 191. The specific steps are: coating the first surface 11 with a first photoresist layer (not shown): uniformly coating the photoresist with a thickness of 5-20 μm, and then placing it in an oven or on a hot plate at 90-120° C. to bake and cure the photoresist.

[0077] The first mask (not shown) with the flow path pattern of the nozzle 100 is used for contact exposure to transfer the flow path pattern on the first mask to the first photoresist layer, wherein the contact exposure time is 30s-120s. The flow path area and the non-flow path area can be distinguished by ultraviolet exposure.

[0078] The first photoresist layer is developed to remove the photoresist on the flow channel area, thereby obtaining the flow channel area, namely, the first mask 181. The time for developing the first photoresist layer is 30s-120s. The photoresist is developed, and the photoresist can be dissolved by the developer, thereby removing the photoresist on the surface of the flow channel area, leaving a first mask 181 with a certain thickness. It can be understood that the pattern of the first mask 181 obtained by development is consistent with the flow channel of the nozzle 100.

[0079] SA22: Etching the first surface 11 through the first mask 181 to form a groove structure 13.

[0080] Specifically, the first mask 181 can be etched to form an atomization groove 132, a liquid inlet groove 131 and an air inlet groove 133. Specifically, etching the first mask 181 includes performing ICP-RIE etching on the first substrate 10 that is not blocked by the optical first resist layer to form an atomization groove 132, a liquid inlet groove 131 and an air inlet groove 133, and the etching depth is 100-300μm. ICP-RIE etching can achieve high-rate and low-damage etching, with low working gas pressure, which is conducive to controlling the etching morphology, and the plasma density is high. Specifically, the groove structure 13 formed in the first preset portion includes an atomization groove 132 and a liquid inlet groove 131 and an air inlet groove 133 connected to the atomization groove 132.

[0081] SA3: forming a heating body 30 on the second surface 12 .

[0082] Specifically, a heating film can be formed on the second surface 12 of the first substrate 10 by deposition, evaporation, electroplating or other processes as the heating body 30. The shape of the heating body 30 in this embodiment is not limited, and the heating body 30 can be formed by method 1 or method 2 in step S3, which will not be described in detail here.

[0083] In this embodiment, a heating film may be formed on the bottom surface of the groove structure 13 as the heating body 30 , or a plurality of heating columns may be provided on the bottom surface of the groove structure 13 to form the heating body 30 .

[0084] Further, such as Figure 4 As shown, in one embodiment, step SA3 of forming the heating body 30 on the second surface 12 may include the following steps:

[0085] SA31 : Form a second mask 182 on the second substrate 20 .

[0086] Specifically, the second mask 182 is patterned and has a hollow area, so that the first surface 11 is partially exposed to form a second exposed area 192. The second mask 182 is formed in the same manner as the first mask 181, and can be formed by processes such as coating a photoresist layer, contact exposure, and development. For details, please refer to the above step SA21, which will not be repeated here.

[0087] SA32 : forming the heating body 30 on the second mask 182 .

[0088] Specifically, a heating film can be formed on the second mask 182 by deposition, evaporation, electroplating and other processes as the heating body 30. Specifically, the heating body 30 can be formed by the first or second method in step S3, which will not be described in detail here.

[0089] SA4: Bonding the first substrate 10 and the second substrate 20 .

[0090] Specifically, the heating body 30 and the groove structure 13 are arranged correspondingly so that the heating body 30 arranged on the second mask 182 can heat the corresponding position of the groove structure 13. In the present embodiment, the heating body 30 arranged on the second surface 12 is preferably arranged at a position corresponding to the liquid inlet groove 131 to heat the aerosol generating matrix in the liquid inlet groove 131, thereby reducing the viscosity of the aerosol generating matrix. In other embodiments, the heating body 30 arranged on the second surface 12 can also be arranged corresponding to the entire surface of the groove structure 13 to heat the nozzle 100 as a whole. The second substrate 20 is matched with the notch 135 to form a mist outlet 134, and the mist outlet 134 is connected to the atomization groove 132, so that the atomized aerosol flows from the atomization chamber 17 to the mist outlet 134, and flows out from the mist outlet 134.

[0091] Second embodiment:

[0092] See also Figure 5 and Figure 6 , Figure 5 is a process flow chart of a method for preparing a nozzle provided in the second embodiment of the present application, Figure 6 It is a flowchart of the method for preparing a nozzle provided in the second embodiment of the present application.

[0093] The difference between the second embodiment and the first embodiment is that the heating body 30 of the second embodiment is disposed on the third surface 21 of the second substrate 20, so corresponding lead holes 16 need to be opened on the first substrate 10 to lead out the two electrodes of the heating body 30. For details, refer to the following content.

[0094] SB1: Provide a first substrate 10 and a second substrate 20.

[0095] For the specific content, please refer to the specific description of S1 above, which will not be repeated here.

[0096] SB2: forming a groove structure 13 on the first surface 11 .

[0097] Specifically, the groove structure 13 includes the above-mentioned atomization groove 132 and a liquid inlet groove 131 and an air inlet groove 133 connected to the atomization groove 132. Further, the groove structure 13 may also include a notch 135 opened on the side wall of the atomization groove 132. In this embodiment, the second substrate 20 is covered behind the first surface 11, and the second substrate 20 cooperates with the notch 135 to form a mist outlet 134.

[0098] The specific formation method of the groove structure 13 is the same as that in the first embodiment, and can be referred to Figure 3 The relevant contents of SB21 and SB22 in the first embodiment are not repeated here.

[0099] SB3: Opening lead holes 16 on the first substrate 10 .

[0100] In this embodiment, the lead hole 16 is formed on the first substrate 10 by forming a first lead hole 161 and a second lead hole 16 on the bottom wall of the liquid inlet groove 131. Specifically, the first lead hole 161 and the second lead hole 162 can be formed on the first substrate 10 by etching, so that after the first substrate 10 is bonded to the second substrate 20, the first electrode 31 of the heating body 30 is exposed through the first lead hole 161, and the second electrode 32 of the heating body 30 is exposed through the second lead hole 162. That is, the first electrode 31 is led out from the first lead hole 161, and the second electrode 32 is led out from the second lead hole 162.

[0101] SB4: A heating body 30 is formed on the third surface 21 .

[0102] Similarly, a heating film as the heating body 30 may be formed on the third surface 21 by deposition, evaporation, electroplating or other processes.

[0103] Specifically, a heating body 30 is formed in a region of the third surface 21 corresponding to the liquid inlet groove 131 , so as to improve the heating effect of the heating body 30 on the aerosol generating substrate in the liquid inlet groove 131 .

[0104] SB5: Bonding the first substrate 10 and the second substrate 20 .

[0105] Specifically, when the first substrate 10 and the second substrate 20 are bonded, the lead hole 16 is set corresponding to the heater 30, which can facilitate the subsequent steps to lead out the electrodes of the heater 30, while saving leads to the greatest extent and preventing problems such as the leads being too long and entangled.

[0106] SB6: The electrodes of the heating element are led out through the lead holes.

[0107] Method 1: The electrode of the heating body 30 is led out through the lead hole 16. The electrode lead 33 can be led out from the lead hole 16 to be electrically connected to the heating body 30, and the lead hole 16 is sealed with a sealant.

[0108] Specifically, a wire bonding machine can be used to lead out the electrode lead 33, and a sealant can be used to seal the inner wall of the lead hole 16 and the electrode lead 33, which can prevent the electrode lead 33 from short-circuiting with other components and also prevent the electrode lead 33 from shaking in the lead hole 16.

[0109] Method 2: insert a pin into the lead hole 16 and abut against the heating body 30 , and seal the lead hole 16 with a sealant.

[0110] Specifically, electrical connection is achieved by abutting the ejector pin against the heater 30 to lead out the first electrode 31 and the second electrode 32 of the heater 30, and a sealant is used to seal the inner wall of the lead hole 16 and the ejector pin, so as to prevent the ejector pin from short-circuiting with other components and also prevent the ejector pin from shaking in the lead hole 16.

[0111] Third embodiment:

[0112] See also Figure 7 and Figure 8 , Figure 7 is a process flow chart of a method for preparing a nozzle provided in the third embodiment of the present application, Figure 8 It is a flowchart of the method for preparing a nozzle provided in the third embodiment of the present application.

[0113] The third embodiment is different from the first embodiment and the second embodiment in that the heating body 30 of the third embodiment is disposed on the bottom surface of the groove structure 13, corresponding lead holes 16 are provided on the second substrate 20 to lead out the two electrodes of the heating body 30, and the mist outlet 134 is provided on the second substrate 20, and the mist outlet 134 is connected to the atomization groove 132 provided on the first substrate 10. For details, please refer to the following content.

[0114] SC1: providing a first substrate 10 and a second substrate 20 .

[0115] For the specific content, please refer to the specific description of S1 above, which will not be repeated here.

[0116] SC2: forming a groove structure 13 on the first surface 11 .

[0117] Specifically, an atomizing groove 132 and a fluid groove 137 surrounding the atomizing groove 132, as well as a plurality of liquid inlet grooves 131 connecting the fluid groove 137 and the atomizing groove 132 are formed on the first surface 11, a first through hole 136 is provided on the bottom wall of the atomizing groove 132 as an air inlet groove 133; and a second through hole 201 is provided on the second substrate 20 as a mist outlet 134. The outer side wall of the annular liquid inlet groove 131 has a liquid inlet 130, and the liquid inlet 130 is connected to the liquid inlet groove 131. Through the liquid inlet 130, the aerosol generating matrix in the liquid storage tank (not shown) can enter the liquid inlet groove 131, and enter the atomizing groove 132 through the plurality of liquid inlet grooves 131.

[0118] In this embodiment, the functions of the air inlet groove 133 and the liquid inlet port 130 can also be interchanged, that is, liquid is introduced through the first through hole 136 opened in the center of the first substrate 10, and air is introduced through the liquid inlet port 130 opened on the outer wall of the fluid groove 137, and the functions of synchronous air and liquid introduction can also be realized. For example, an atomizing groove 132 and a fluid groove 137 surrounding the atomizing groove 132 are formed on the first surface 11, and a plurality of air inlet grooves (not shown) connecting the fluid groove 137 and the atomizing groove 132 are formed; the bottom wall of the atomizing groove 132 has a first through hole 136 as a liquid inlet groove (not shown); the outer wall of the fluid groove 137 has an air inlet port (not shown); a second through hole 201 is opened on the second substrate 20 as a mist outlet 134; bonding the first substrate 10 to the second substrate 20 includes connecting the mist outlet 134 to the atomizing groove 132.

[0119] In this embodiment, the mist outlet 134 may be a second through hole 201 opened on the second substrate 20, and the second through hole 201 may be opened at the center position or other positions of the second substrate 20. Preferably, the second through hole 201 and the first through hole 136 are both opened at the center positions of the first substrate 10 and the second substrate 20, and the first through hole 136 and the second through hole 201 are connected to each other.

[0120] SC3: Open the lead hole 16 on the second substrate 20 .

[0121] Specifically, the lead hole 16 is used to lead out the two electrodes of the heating body 30 provided on the first substrate 10 or the second substrate 20. Specifically, a first lead hole 161 and a second lead hole 162 are provided in the portion of the second substrate 20 corresponding to the liquid inlet groove 131. The first electrode 31 is led out from the first lead hole 161, and the second electrode 32 is led out from the second lead hole 162. After the first electrode 31 and the second electrode 32 are led out, they can be electrically connected to the power supply assembly 200. After the electrode lead 33 electrically connected to the heating body 30 is led out from the lead hole 16, it is necessary to use a sealant to seal the lead hole 16. The specific sealing method is the same as that in the second embodiment and will not be repeated here. The use of a sealant to seal the inner wall of the lead hole 16 and the ejector pin can prevent the ejector pin from short-circuiting with other components, and can also prevent the ejector pin from shaking in the lead hole 16.

[0122] SC4: A heating body 30 is formed on the bottom surface of the groove structure 13 .

[0123] Specifically, the heater 30 is arranged on the bottom surface of the groove structure 13 and can specifically correspond to the bottom surface of the liquid inlet groove 131, so that the heater 30 can directly heat the aerosol generating matrix flowing through the liquid inlet channel 15 to improve the heating effect, thereby reducing the viscosity of the aerosol generating matrix. When the heater 30 is embedded in the inner bottom surface of the groove structure 13, the heat generated by the heater 30 is directly conducted to the aerosol generating matrix in the flow channel of the nozzle 100 without going through the intermediate conduction process of the nozzle 100 material, so the heating effect is better and the heating rate of the aerosol generating matrix is ​​faster. At the same time, the heat source is sealed, and the external temperature of the nozzle 100 is relatively low, so that the nozzle 100 packaging with a lower temperature is achieved.

[0124] SC5: Bonding the first substrate 10 and the second substrate 20 .

[0125] Specifically, in this embodiment, bonding the first substrate 10 and the second substrate 20 includes connecting the mist outlet 134 with the atomization groove 132. Specifically, the first through hole 136 and the second through hole 201 can be aligned during bonding to achieve the connection between the mist outlet 134 and the atomization groove 132. At the same time, the first lead hole 161 is aligned with the first electrode 31, and the second lead hole 162 is aligned with the second electrode 32 to bond the first substrate 10 and the second substrate 20.

[0126] The bonding method of the first substrate 10 and the second substrate 20 is the same as that in the second embodiment, and will not be described again here.

[0127] SC6: The electrodes of the heater 30 are led out through the lead holes 16 .

[0128] Specifically, the method of leading out the electrodes of the heating body 30 is the same as that in SB6, and will not be repeated here.

[0129] Fourth embodiment:

[0130] See also Fig. 9 , Fig. 9 This is a flow chart of the method for preparing a nozzle provided in the fourth embodiment of the present application.

[0131] SD1: A plurality of first preset portions are formed on the first substrate 10 .

[0132] Specifically, forming a plurality of first preset portions (not shown) on the first substrate 10 may be performed by dividing the first substrate 10 into a plurality of regions, each region corresponding to a size of a nozzle 100 .

[0133] SD2: The second substrate 20 includes a plurality of second preset portions.

[0134] Specifically, forming a plurality of second preset portions (not shown) on the second substrate 20 may be performed by dividing the second substrate 20 into a plurality of regions, each region corresponding to the size of a nozzle 100 .

[0135] SD3: A groove structure 13 is formed in each first preset portion.

[0136] Specifically, the groove structure 13 can be any one of the structures of the first, second and third embodiments, and the present application does not limit this.

[0137] SD4: A heating body 30 is formed in each first preset portion or each second preset portion.

[0138] Specifically, the structure and formation method of the heater 30 formed in the first preset part or each second preset part can be any one of the first, second and third embodiments, which will not be described in detail here. It should be noted that when the heater 30 is arranged on the side close to the groove structure 13, it is necessary to open the lead hole 16 to lead out the electrode of the heater 30; when the heater 30 is arranged on the side away from the groove structure 13, it is not necessary to open the lead hole 16 to lead out the electrode of the heater 30, and the electrode of the heater 30 can be directly led out through the ejector pin.

[0139] SD5: arranging and bonding the plurality of first preset parts and the plurality of second preset parts in a one-to-one correspondence.

[0140] Specifically, multiple first preset parts and multiple second preset parts are bonded one by one to form multiple nozzles 100. Specifically, the groove structure 13 opened on the first preset part and the heating body 30 arranged on the second preset part need to be arranged correspondingly. Please refer to the relevant content of the corresponding arrangement of the groove structure 13 and the heating body 30 in the third embodiment, which will not be repeated here.

[0141] SD6: Cutting the bonded first substrate 10 and the second substrate 20 to obtain a plurality of nozzles 100 .

[0142] Specifically, as described above, since the first substrate 10 and the second substrate 20 both have a plurality of preset portions, the first substrate 10 and the second substrate 20 need to be cut after being bonded to form a plurality of nozzles 100. By simultaneously manufacturing a plurality of nozzles 100 through the first substrate 10 and the second substrate 20, the manufacturing efficiency can be improved, while the manufacturing cost of each nozzle 100 can be saved.

[0143] It should be noted that the step of leading the electrode lead 33 out of the electrode of the heating body 30 may be before or after cutting the first substrate 10 and the second substrate 20 , and the present application does not impose any limitation on this.

[0144] See also Fig.10 , Fig.10It is a schematic diagram of some modules of the electronic atomization device provided in this application.

[0145] The nozzle 100 of the present application can be applied to an electronic atomization device 400, which can be an active liquid supply type, and the electronic atomization device 400 can be used for atomization of an aerosol-generating matrix. The electronic atomization device 400 includes an atomizer 300 and a power supply assembly 200 electrically connected to each other, the power supply assembly 200 is coupled to the atomizer 300, and is used to provide power to the atomizer 300, and the power supply assembly 200 controls the atomizer 300 of the electronic atomization device 400 to work.

[0146] The atomizer 300 is used to store the aerosol-generating substrate and atomize the aerosol-generating substrate to form an aerosol that can be inhaled by the user. The atomizer 300 can be used in different fields, such as medical treatment, beauty treatment, leisure inhalation, etc.

[0147] In one embodiment, the atomizer 300 can be used in an electronic aerosolization device to atomize an aerosol-generating matrix and generate an aerosol for a user to inhale. The power supply assembly 200 is used to couple the atomizer 300 of the active liquid supply electronic atomization device 400 to control the operation of the atomizer 300.

[0148] The nozzle 100 provided in the present application is specifically arranged in the atomizer 300. A sensor 40 may be arranged on the outer surface or in the flow channel of the nozzle 100, and a processor 210 may be arranged in the power supply assembly 200 electrically connected to the heating body 30, and the processor 210 is electrically connected to the sensor 40. The detection information of the sensor 40 is received by the processor 210, and the detection information includes the temperature information and viscosity information of the aerosol generating substrate, so that the nozzle 100 of the atomizer 300 is controlled to work according to the temperature information or the viscosity information, including controlling the heating body 30 to heat the aerosol generating substrate flowing through the liquid inlet channel 15 and other operations. In this way, the viscosity and temperature of the aerosol generating substrate in the nozzle 100 are regulated, so that the nozzle 100 has a consistent atomization effect when atomizing aerosol generating substrates of different viscosities, and it can also ensure that the nozzle 100 has consistency when used in different temperature environments.

[0149] The preparation method of the nozzle disclosed in the present application includes: providing a first substrate and a second substrate; forming a groove structure on the first substrate; the groove structure includes an atomization groove and a liquid inlet groove and an air inlet groove connected to the atomization groove; forming a heating body on the first substrate and / or the second substrate; bonding the first substrate to the second substrate so that the second substrate cooperates with the atomization groove, the liquid inlet groove and the air inlet groove to form an atomization chamber, a liquid inlet channel and an air inlet channel respectively. The present application integrates multiple functions on the same nozzle through MEMS processes such as photolithography, etching, metal deposition, and bonding to assist atomization or enhance multifunctional atomization. Specifically, by integrating a heating body on the nozzle, the heating and atomization functions of the nozzle are integrated.

[0150] At the same time, the heating function of the present application is temperature controlled, so that the single nozzle is not affected by the viscosity of the aerosol generating matrix or the temperature of the use environment during atomization, thereby effectively improving the atomization performance while improving the stability and consistency of atomization.

[0151] The above are only implementation methods of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method for preparing a nozzle, characterized in that: include: providing a first substrate and a second substrate; A groove structure is formed on the first substrate; the groove structure includes an atomization groove and a liquid inlet groove and an air inlet groove connected to the atomization groove; forming a heating body on the first substrate and / or the second substrate; The first substrate is bonded to the second substrate; wherein the second substrate cooperates with the atomization slot, the liquid inlet slot and the air inlet slot to form an atomization chamber, a liquid inlet channel and an air inlet channel respectively.

2. The method for preparing a nozzle according to claim 1, characterized in that: The first substrate includes a first surface and a second surface that are opposite to each other; the second substrate includes a third surface and a fourth surface that are opposite to each other; the forming of the groove structure on the first substrate includes forming the groove structure on the first surface, and the bonding of the first substrate and the second substrate includes bonding the first surface to the third surface; wherein the forming of the heating body on the first substrate and / or the second substrate includes: Forming the heating body on the bottom surface of the groove structure; and / or forming the heating body on the second surface; and / or Forming the heating body on the third surface; and / or The heating body is formed on the fourth surface.

3. The method for preparing a nozzle according to claim 2, characterized in that: The forming of the heating body on the first substrate and / or the second substrate includes forming the heating body on the bottom surface of the groove structure; wherein, before bonding the first substrate to the second substrate, the method also includes opening a lead hole on the second substrate; bonding the first substrate to the second substrate also includes setting the lead hole corresponding to the heating body; after bonding the first substrate to the second substrate, the method also includes leading out electrodes of the heating body through the lead hole.

4. The method for preparing a nozzle according to claim 3, characterized in that: The forming of the heating body on the bottom surface of the groove structure includes forming the heating body on the bottom surface of the liquid inlet groove; the opening of lead holes on the second substrate includes opening a first lead hole and a second lead hole in a portion of the second substrate corresponding to the liquid inlet groove; and the setting of the lead holes corresponding to the heating body includes exposing the first electrode of the heating body through the first lead hole and exposing the second electrode of the heating body through the second lead hole.

5. The method for preparing a nozzle according to claim 2, characterized in that: The forming of the heating body on the first substrate and / or the second substrate includes forming the heating body on the third surface; wherein, before bonding the first substrate to the second substrate, the forming also includes opening a lead hole on the first substrate; bonding the first substrate to the second substrate also includes setting the lead hole corresponding to the heating body; after bonding the first substrate to the second substrate, the forming also includes leading out electrodes of the heating body through the lead hole.

6. The method for preparing a nozzle according to claim 5, characterized in that: The forming of the heating body on the third surface includes forming the heating body in an area of ​​the third surface corresponding to the liquid inlet groove; the opening of lead holes on the first substrate includes opening a first lead hole and a second lead hole on the bottom wall of the liquid inlet groove; and the setting of the lead holes corresponding to the heating body includes exposing the first electrode of the heating body through the first lead hole and exposing the second electrode of the heating body through the second lead hole.

7. The method for preparing a nozzle according to any one of claims 3 to 6, characterized in that: The step of leading out the electrodes of the heating body through the lead holes comprises: Leading out an electrode lead electrically connected to the heating body from the lead hole, and sealing the lead hole with a sealant; or A ejector pin is inserted into the lead hole and abuts against the heating body, and a sealant is used to seal the lead hole.

8. The method for preparing a nozzle according to any one of claims 2 to 6, characterized in that: The forming the groove structure on the first surface comprises: The atomizing groove and the liquid inlet groove and the air inlet groove connected to the atomizing groove are formed on the first surface, and a notch is opened on the side wall of the atomizing groove; the bonding of the first substrate and the second substrate includes the second substrate and the notch cooperating to form a mist outlet; or The atomizing groove and the fluid groove surrounding the atomizing groove, and a plurality of liquid inlet grooves connecting the fluid groove and the atomizing groove are formed on the first surface, and a first through hole is opened on the bottom wall of the atomizing groove as the air inlet groove, and the outer side wall of the fluid groove has a liquid inlet; the preparation method of the nozzle also includes opening a second through hole on the second substrate as a mist outlet; the bonding of the first substrate to the second substrate includes connecting the mist outlet with the atomizing groove; or The atomization groove, a fluid groove surrounding the atomization groove, and a plurality of air inlet grooves connecting the fluid groove and the atomization groove are formed on the first surface; the bottom wall of the atomization groove has a first through hole as a liquid inlet groove; the outer wall of the fluid groove has an air inlet; the method for preparing the nozzle also includes opening a second through hole on the second substrate as a mist outlet; and bonding the first substrate to the second substrate includes connecting the mist outlet to the atomization groove.

9. The method for preparing a nozzle according to any one of claims 1 to 6, characterized in that: The first substrate includes a plurality of first preset portions, and the second substrate includes a plurality of second preset portions; forming a groove structure on the first substrate includes forming the groove structure in each of the first preset portions; forming a heating body on the first substrate and / or the second substrate includes forming the heating body in each of the first preset portions or each of the second preset portions; bonding the first substrate and the second substrate includes arranging a plurality of the first preset portions and a plurality of the second preset portions in a one-to-one correspondence; and after bonding the first substrate and the second substrate, cutting the bonded first substrate and the second substrate to obtain a plurality of nozzles is further included.

10. The method for preparing a nozzle according to any one of claims 1 to 6, characterized in that: The forming of a heating body on the first substrate and / or the second substrate comprises: Forming a patterned heat-generating film by mask deposition; or Depositing a heating film and patterning the heating film; Wherein, the heating film is a metal film with a thickness of 100-1000nm.

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