Device and method for preparing shoe sole through heating of heating wire

Abstract

The invention relates to the field of shoe production and processing, and provides a device and method for preparing a shoe sole through heating of a heating fuse.The device comprises a rack, a mold body arranged on the rack and a driving device for driving the mold body to be opened and closed, the mold body comprises a bottom mold and a top mold, and a mold cavity is formed in the bottom mold and the top mold when the bottom mold and the top mold are closed; the bottom die and the top die are respectively provided with at least one wire groove, heating wires are distributed in the wire grooves and arranged on the top, the side walls and the bottom of the die body, sealing layers are arranged on the wire grooves and seal the heating wires into the wire grooves, and each heating wire is connected with a thermocouple. The heating wire is arranged on the mold body and replaces a traditional heating pipe, electric energy is saved, the temperature can be accurately controlled, the quality of a shoe sole is improved, and the technical problems that when the shoe sole is produced, heat loss is large, and heating efficiency is low are solved.

Description

Technical Field

[0001] The invention relates to the field of shoe production and processing, and in particular to a device and method for preparing shoe soles by heating with a heating wire. Background Art

[0002] Existing soles are manufactured using rubber vulcanizers, which provide pressure and heat to vulcanize the soles. The three elements of vulcanization are temperature, time, and pressure. The rubber vulcanizer has huge defects in heating the shoe mold and the sole. The rubber vulcanizer uses a heating rod to heat, and transfers the heat to the hot plate through heat conduction. The hot plate then conducts heat to the shoe mold, so that the shoe mold reaches the temperature for vulcanization of the sole, and the shoe mold then heats the material in the mold cavity. This method has the following defects: 1. The heat conduction link is too long. The heat needs to pass through the heating rod, hot plate, shoe mold, and sole in sequence, which increases the heat conduction time. Each heat conduction link will produce heat loss, especially the heating of the hot plate. The hot plate has a large area and a large amount of heat from the hot plate is dissipated in the air. The heat loss during heat conduction is huge. Therefore, the heating rod needs to be set at a higher temperature to ensure the temperature of the sole, which not only increases the production cost, but also takes a long time to heat up and has low production efficiency. 2. The heating rods are set on the top and bottom of the shoe mold. The heat conduction is only transmitted through the upper and lower surfaces of the shoe mold. There is no hot plate on the side of the shoe mold. The temperature of the side of the shoe mold is lower than that of the upper and lower surfaces of the shoe mold. The side molding force of the formed sole is poor. If the vulcanization time is too long, the sole may crack and become uneven. 3. The heating of each position of the sole is uneven. Even for a single surface, the closer the position is to the heating rod, the higher the temperature. The temperature of different positions of the shoe mold is different. For example, the inner core and the bottom surface of the sole are at different distances from the hot plate, resulting in uneven heating and cooling, poor molding ability, and the softness and elasticity of the local part of the sole cannot meet the requirements. The defective rate of the sole is high. Even for the soles of the same batch, the heat conduction is different each time the sole is formed, resulting in different performance of different soles; 4. For some special high-end shoes, different parts such as the heel, middle and tip of the shoe need to achieve different performance indicators such as softness and elasticity, which cannot be achieved by controlling the temperature; 5. The hot plate on the rubber vulcanizer dissipates heat around, making the temperature around the equipment high, affecting the working environment. If the staff accidentally touches the hot plate, they will get burned, which poses a safety hazard; 6. The rubber vulcanizer usually has multiple installation slots on the hot plate, and the heating tube is inserted into the installation slot. The hot plate is thick, and the heating tube needs to be regularly maintained and replaced, which increases the cost; 7. The heating tube may leak electricity, which may be a safety hazard; 8. After some soles are formed, the molds and hot plates need to be sprayed with water to cool them down. The spraying area is large, which wastes water resources.

[0003] Chinese patent application number: 202220332819.8, discloses a sole forming heating mechanism, which is used in conjunction with a sole forming mold, including an upper heating component arranged at the top of the sole mold and a lower heating component arranged at the bottom of the sole mold, the upper heating component includes a first fixing plate, a lamp tube mounting plate and a mounting frame, a temperature sensor and a lamp tube, the lamp tube mounting plate is provided with a lamp tube mounting groove, the lamp tube is arranged on the lamp tube mounting groove, the first temperature sensor is arranged at the top of the first fixing plate and runs through the top of the mounting frame, the lower heating component includes a driver fixing plate, a wrapping cover, a cover base, an infrared lamp tube and a first lifting driver, the wrapping cover is arranged at the top of the driver fixing plate, the infrared lamp tube is arranged inside the wrapping cover, and the first lifting driver is arranged at the bottom of the driver fixing plate and connected to the cover base. The heating mechanism adopts lamp tube heating, and the heat loss is huge during heat conduction. The lamp tube needs to be set at a higher temperature to ensure the temperature of the sole, which not only increases the production cost, but also takes a long time to heat and has low production efficiency. Summary of the invention

[0004] Therefore, in view of the above problems, the present invention proposes a device and method for preparing shoe soles by heating with heating wires, which solves the technical problems of large heat loss and low heating efficiency during shoe sole production.

[0005] To achieve the above object, the present invention adopts the following technical solutions: A device for preparing shoe soles by heating with heating wires, comprising a frame, a mold body arranged on the frame, and a driving device for driving the mold body to open and close the mold, the mold body comprising a bottom mold and a top mold, a mold cavity is formed inside the bottom mold and the top mold when the bottom mold and the top mold are closed, at least one wire groove is respectively provided on the bottom mold and the top mold, heating wires are arranged in the wire grooves, the heating wires are arranged on the top, side walls and bottom of the mold body, a sealing layer is provided on the wire grooves, the sealing layer seals the heating wires into the wire grooves, and each of the heating wires is connected to a thermocouple.

[0006] Further: The sealing layer is made of heat-conducting material.

[0007] The thermocouple is completely or partially arranged in the wire slot, each heating wire is connected with a thermocouple, and the thermocouple is completely or partially arranged in the wire slot.

[0008] The shortest distance between each part of the heating wire and the mold cavity is no more than 10 mm.

[0009] The frame is provided with two fixing seats, which are respectively connected to the bottom mold and the top mold. The fixing seats are provided with a cooling channel, which is connected to a first cooling device. The frame is provided with a second cooling device.

[0010] The wire trough includes at least one first trough body arranged on the bottom mold and the top mold, the first trough body is arranged in a circuitous manner along the width direction, the first trough body is arranged at the front end, the middle part and the rear end, the first trough body includes a plurality of first circuitous grooves arranged in the width direction, and the distance between the heating wires in two adjacent first circuitous grooves is 5mm to 20mm.

[0011] The wire groove includes at least two second groove bodies arranged on the side wall of the mold body, and the second groove bodies are distributed along the position of the mold cavity and are arranged at the front, middle and rear parts of the side wall of the mold body. The second groove body extends from the heel along the toe direction and then detours to the heel. At least one second groove body extends to the toe. The length of the upper second groove body extending toward the toe direction is greater than the length of the lower second groove body extending toward the toe direction. The second groove body includes at least two second detour grooves, and the distance between the heating wires in two adjacent second detour grooves is 5mm to 20mm.

[0012] The present invention also provides a method for preparing a shoe sole by heating with a heating wire based on the above-mentioned device, comprising the following method: S1. Cutting: Cutting the sole raw material into the mold cavity of the mold body; S2. Mold closing: The driving device drives the bottom mold and the top mold to close the mold, so that the mold cavity forms a closed space; S3. Heating stage: Start the heating wires, each heating wire quickly heats up to the set temperature, the thermocouple detects the temperature of the corresponding heating wire, the temperature of each heating wire can be set to be the same or different, the mold body is heated, the heat is transferred to the mold body through heat conduction, the mold body quickly heats up to the set temperature, and the mold body accurately heats the material in the mold cavity; S4. Temperature control stage: During the temperature control stage, the lowest temperature set by the system is T0, and the highest temperature set by the system is T1. The thermocouple detects the temperature of the heating wire connected to it, and feeds back the real-time temperature T of the corresponding heating wire to the system. When T≥T1, the corresponding heating wire is powered off and stops heating. When T≤T0, the heating wire is started and heated up. S5. Mold opening: The driving device drives the bottom mold and the top mold to open the mold and take out the molded sole.

[0013] Further: The frame is provided with two fixing seats, which are respectively connected to the bottom mold and the top mold, and the fixing seats are provided with a cooling channel, which is connected to the first cooling device, and the frame is provided with a second cooling device; after the S4 step is completed, there is also a cooling stage, the first cooling device inputs water or gas into the cooling channel, the water and gas cool the top mold and the bottom mold, the second cooling device sprays water or gas to the side wall of the mold body, the water or gas contacts the side wall of the mold body, cools the side wall of the mold body, reduces the temperature of the sole, and makes the sole harden and shape.

[0014] T0 is 183 degrees Celsius to 193 degrees Celsius, and T1 is 198 degrees Celsius to 208 degrees Celsius.

[0015] By adopting the above technical solution, the beneficial effects of the present invention are: The fixing seat of the present invention does not need to be provided with multiple heating tubes for heating, which can reduce the thickness of the fixing seat and reduce the overall height and weight of the equipment. The heating tube is replaced by a heating wire, which has the advantages of small size, light weight and fast heating speed compared with the heating tube. The sealing layer seals the heating wire, reduces heat loss and improves the efficiency of heat conduction. Since the heat does not need to be conducted through the fixing seat, the heating temperature of the heating wire is lower than the heating temperature of the heating tube, the heating wire has little effect on the temperature of the surrounding air, the heat loss is small, and electric energy is saved; during the heating process, the heating wire heating can accurately control the temperature according to requirements to ensure the accuracy of heating and reduce the defective rate of the product. For special high-end soles, the heating wire can heat different positions at different temperatures, so that different positions of the sole can achieve different performance indicators such as softness and elasticity, thereby improving the quality of the sole. The heating wire is light in weight and not easy to be damaged; further, the thermocouple can monitor the temperature of each heating wire in real time, and the temperature can be automatically adjusted through the control system to fully or partially control the temperature of the thermocouple. It is arranged in the wire groove, and the temperature measurement is not affected by the outside air, and the measurement is more accurate; further, the first groove body is arranged in a circuitous manner, which can reduce the number of heating wires. At the same time, the heating wires can be evenly arranged in the bottom mold and the top mold. The heating wire distance of the first circuitous groove is set in the range of 5mm to 20mm, which can better accurately control the temperature and improve the heating effect; further, the second groove body is distributed along the position of the mold cavity, which can reduce the length of the heating wire, reduce the manufacturing cost and heating cost of the mold body, and improve the efficiency of heating and cooling. The second groove body is arranged at the front, middle and rear parts, and can accurately heat the surrounding side of the entire sole; further, the present invention can realize automatic temperature control by setting the minimum temperature value T0 and the maximum temperature value T1; further, part of the sole needs to be cooled and shaped when it is formed and taken out, the top and bottom surfaces of the mold body are cooled by circulating water or gas, and the side walls of the mold body are cooled by spraying a small amount of water or gas, which can not only quickly cool down, but also have a small cooling area, can save water resources, and thus reduce cooling costs and improve cooling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the shoe-making device of the present invention.

[0017] Figure 2 It is a partial structural schematic diagram of the present invention.

[0018] Figure 3 It is a structural diagram of the mold body.

[0019] Figure 4 It is a structural diagram of the mold body from another angle.

[0020] Figure 5 It is the main view of the mold body.

[0021] Figure 6 It is a partial cross-sectional view of the heating wire.

[0022] Figure 7 It is a partial cross-sectional view of a thermocouple.

[0023] Figure 8 It is a top view of the top mold.

[0024] Fig. 9 This is the bottom view of the base mold.

[0025] Fig.10 It is a structural diagram of the bottom mold.

[0026] Fig.11 It is a side view of the bottom mold.

[0027] Fig.12 It is a structural schematic diagram of an embodiment of the second wire trough.

[0028] Fig.13 It is a structural schematic diagram of another embodiment of the second wire trough.

[0029] Fig.14 yes Fig.11 A schematic diagram of the structure from another angle.

[0030] Fig.15 It is a schematic diagram of the structure in which two first line slots are connected.

[0031] Fig.16 It is a schematic diagram of the structure in which the first wire groove is spiral.

[0032] Fig.17 It is a structural schematic diagram of another embodiment of the first wire trough.

[0033] Reference numerals: 1. Mold body; 10. Mold cavity; 11. Bottom mold; 12. Top mold; 13. Wire groove; 131. First trough body; 1310. First detour groove; 132. Second trough body; 1320. Second detour groove; 14. Heating wire; 15. Sealing layer; 16. Thermocouple; 17. Top; 18. Side wall; 19. Bottom; 2. Frame; 21. Guide rod; 22. Lifting seat; 220. Sliding sleeve; 3. Driving device; 4. Fixed seat; 40. Cooling channel; 41. Positioning rod; 42. Positioning hole. DETAILED DESCRIPTION

[0034] The present invention will now be further described with reference to the accompanying drawings and specific implementation methods.

[0035] refer to Figures 1 to 17The present embodiment provides a device for preparing shoe soles by heating with heating wires, comprising a frame 2, a mold body 1 arranged on the frame 2, and a driving device 3 for driving the mold body 1 to open and close the mold. The mold body 1 comprises a bottom mold 11 and a top mold 12. When the bottom mold 11 and the top mold 12 are closed, a mold cavity 10 is formed inside. The bottom mold 11 and the top mold 12 are respectively provided with wire grooves 13, and heating wires 14 are arranged in the wire grooves 13. The heating wires 14 are arranged on the top 17, side walls 18, and bottom 19 of the mold body 1. A sealing layer 15 is provided on the wire grooves 13. The sealing layer 15 is a heat-conducting material. The sealing layer 15 seals the heating wires 14 into the wire grooves 13, and each heating wire 14 is connected to a thermocouple 16.

[0036] refer to Figure 1 In one embodiment, the frame 2 is provided with a plurality of guide rods 21, the guide rods 21 are provided with a lifting seat 22 which can be raised and lowered, the lifting seat 22 is provided with a sliding sleeve 220, the sliding sleeve 220 is sleeved on the guide rods 21, one of the fixed seats 4 is fixed on the lifting seat 22, the telescopic end of the driving device 3 is connected to the lifting seat 22, and the driving device 3 drives the lifting seat 22 and the bottom mold 11 to rise and fall to realize mold opening and closing.

[0037] refer to Figure 2 In one embodiment, two fixing seats 4 are provided on the frame 2, and the two fixing seats 4 are respectively connected to the bottom mold 11 and the top mold 12. A cooling channel 40 is provided on the fixing seats 4, and the cooling channel 40 is connected to the first cooling device. A second cooling device is provided on the frame 2.

[0038] refer to Figure 2 In one embodiment, one of the fixing seats 4 is provided with a plurality of positioning rods 41, and another fixing seat 4 is provided with positioning holes 42 corresponding to the positioning rods 41, and the positioning rods 41 can be inserted into the positioning holes 42 for supporting and positioning.

[0039] refer to Figure 8 and Fig. 9 In one embodiment, the wire slot 13 includes a first slot body 131 provided in the bottom mold 11 and the top mold 12. The bottom mold 11 and the top mold 12 are respectively provided with two first slot bodies 131, and the two first slot bodies 131 are respectively provided in the upper part and the lower part. The first slot body 131 is arranged in a circuitous manner along the width direction, and the two ends of the first slot body 131 extend to the middle part. The first slot body 131 is arranged at the front end, the middle part and the rear end. The first slot body 131 includes a plurality of first circuitous slots 1310 arranged in the width direction, and the distance between the heating wires 14 in two adjacent first circuitous slots 1310 is 5 mm to 20 mm.

[0040] refer to Fig.10 and Fig.11In one embodiment, the wire groove 13 includes a plurality of second groove bodies 132 arranged on the side wall 18 of the shoe mold body, and the second groove bodies 132 are arranged at the front, middle and rear of the side wall 18 of the shoe mold body along the position of the mold cavity 10. The second groove bodies 132 extend from the heel of the shoe along the direction of the toe and then detour to the heel of the shoe. At least one second groove body 132 extends to the toe, and the length of the upper second groove body 132 extending in the direction of the toe is greater than the length of the lower second groove body 132 extending in the direction of the toe. The second groove body 132 includes at least two second detour grooves 1320, and the distance between the heating wires 14 in two adjacent second detour grooves 1320 is 5mm to 20mm.

[0041] The number of the wire slots 13 may also be one, that is, all the wire slots 13 are connected; the number of the wire slots 13 may also be two, three or even more, depending on the specific situation.

[0042] The thermocouple 16 can be replaced by a thermistor or other temperature detection device, which is a well-known device and will not be described here. The thermocouple 16 is usually arranged at the end of the wire slot 13, which is convenient for wiring; in one embodiment, the thermocouple 16 may not be arranged in the wire slot 13. In this structure, the accuracy of detecting temperature is relatively low; in another embodiment, the thermocouple 16 may not be arranged.

[0043] In one embodiment, the heating wire 14 is arranged on the top 17 and the bottom 19 of the mold body 1, and is not arranged on the side wall 18 of the mold body 1; in another embodiment, the heating wire 14 is arranged on the top 17 and the side wall 18 of the mold body 1, and is not arranged on the bottom 19 of the mold body 1; in another embodiment, the heating wire 14 is arranged on the bottom 19 and the side wall 18 of the mold body 1, and is not arranged on the top 17 of the mold body 1.

[0044] The sealing layer 15 is made of aluminum, iron, heat-conducting plastic or other heat-conducting materials, and can be sealed in the wire groove 13 by high-temperature melting; in another embodiment, the sealing layer 15 can also be made of wood material or other non-heat-conducting materials. This structure of the sealing layer 15 is not heat-conducting and is usually used for soles that do not need to be cooled with water, such as soles made of RB materials; in another embodiment, the sealing layer 15 can also be set with one, two or more materials, and some of the sealing layers 15 can conduct heat, while some of the sealing layers 15 cannot conduct heat. In another embodiment, the sealing layer 15 may not be set.

[0045] The above-mentioned wire groove 13 can also be arranged on the inner wall of the mold body 1. This structure has higher requirements for sealing the heating wire 14. The sealing layer 15 may have to be made into a pattern corresponding to the pattern of the sole. The production cost of the mold body 1 is high. At the same time, for some soles that need to be cooled, such as EVA soles, it is not conducive to water cooling, and it is also inconvenient to replace and maintain the wire groove 13. In another embodiment, part of the wire groove 13 is arranged on the inner wall of the mold body 1, and part of the wire groove 13 is arranged on the outer wall of the mold body 1.

[0046] The shortest distance between each part of the heating wire 14 and the mold cavity 10 is usually set to no more than 5m, such as 4mm, 3mm, etc. This structure has a better heating effect; it can also be other values, such as 5mm, 6mm, 8mm, 10mm, etc., or it can be set to be greater than 10mm, such as 11mm, 12mm, etc. The farther the distance, the worse the heating effect.

[0047] The side wall 18 of the mold body 1 is usually only arranged on the bottom mold 11. In one embodiment, the side wall 18 of the mold body 1 can also be arranged on the bottom mold 11 and the top mold 12, that is, part of the second trough body 132 is arranged on the bottom mold 11 and the top mold 12; in another embodiment, the side wall 18 of the mold body 1 can also be only arranged on the top mold 12.

[0048] The number of the first slot 131 and the corresponding heating wire 14 can be one, two, three or even more. Fig.15 The first groove 131 of the bottom mold 11 or the top mold 12 and the heating wire 14 may each have only one. Fig. 9 The two first slots 131 are connected, and only one first slot 131 is arranged in a circuitous manner along the width direction of the entire bottom mold 11 or the top mold 12; in another embodiment, the number of the above-mentioned first slots 131 is three, and the three first slots 131 are arranged in a circuitous manner at the front, middle, and top 17 respectively; in another embodiment, the above-mentioned first slot 131 can also be connected to the second slot 132, and a heating wire 14 extends from the first slot 131 to the second slot 132. In another embodiment, as Fig.16 The first slot body 131 can also be configured as one, wherein the first slot body 131 is configured in a spiral structure along the length direction. In this structure, the head and tail connection of the first slot body 131 is relatively inconvenient; in another embodiment, as Fig.17 The first groove body 131 may also be provided in a plurality, and the plurality of first groove bodies 131 are arranged in a spiral structure on the mold body 1; the first groove body 131 may also adopt a line segment, an arc, a spiral or other structures.

[0049] The first slot body 131 may also be electrically connected to the second slot body 132 , and a heating wire 14 extends from the first slot body 131 to the second slot body 132 .

[0050] The distance between two adjacent first detour grooves 1310 is usually set to 5mm to 10mm, such as 6mm, 8mm, etc.; it can also be greater than 5mm or less than 10mm, such as 3mm, 12mm, 15mm, 18mm, etc., depending on the specific situation.

[0051] The distance between two adjacent second detour grooves 1320 is usually set to 5mm to 10mm, such as 6mm, 8mm, etc.; it can also be greater than 5mm or less than 10mm, such as 3mm, 12mm, 15mm, 18mm, etc., depending on the specific situation.

[0052] The number of the second slot body 132 may also be one, that is, the plurality of second slot bodies 132 are connected end to end.

[0053] The above-mentioned second groove body 132 is usually set according to the position of the mold cavity 10, which can minimize the length of the heating wire 14 and the second groove body 132; in one embodiment, the second groove body 132 may not be distributed along the position of the mold cavity 10, that is, the second groove body 132 may be set on the side wall 18 where there is no mold cavity 10, or the second groove body 132 is not set on the side wall 18 corresponding to the mold cavity 10.

[0054] The second slot 132 may also be configured as a line segment, an arc, multiple circuitous configurations or other structures. Fig.12 The second grooves 132 may also be two, and the two second grooves 132 are respectively arranged on both sides of the mold body 1, and the second grooves 132 are arranged on the side wall 18 of the mold body 1 for multiple circuitous arrangements; in another embodiment, Fig.12 The two second slots 132 are connected, and only one heating wire 14 is used; in another embodiment, Fig.13 and Fig.14 The two second grooves 132 of the top 17 extend from the heel to the toe and then extend from the other side to the heel. The other two second grooves 132 are respectively arranged at the two side walls 18 in a circuitous manner; the above-mentioned second grooves 132 can also adopt line segments, arcs or other structures.

[0055] The driving device 3 can be a pneumatic cylinder, an oil cylinder or other linear motion devices, which are well-known devices and will not be described in detail here.

[0056] The first cooling device and the second cooling device may be a water tank and a water pump; the first cooling device and the second cooling device may also be fans or other devices capable of cooling, which are well-known devices, not shown in the figure, and will not be described in detail here.

[0057] The present invention also provides a method for preparing a shoe sole by heating with a heating wire based on the above-mentioned device, comprising the following method: S1. Feeding: Feeding the sole raw material into the mold cavity 10 of the mold body 1 .

[0058] S2. Mold closing: The driving device 3 drives the bottom mold 11 and the top mold 12 to close the mold, so that the mold cavity 10 forms a closed space.

[0059] S3. Heating stage: start the heating wire 14, each heating wire 14 heats up rapidly to reach the set temperature, the thermocouple 16 detects the temperature of the corresponding heating wire 14, the temperatures of each heating wire 14 can be set to be the same or different, to heat the mold body 1, the heat is transferred to the mold body 1 through heat conduction, the mold body 1 heats up rapidly to reach the set temperature, and the mold body 1 accurately heats the material in the mold cavity 10.

[0060] S4. Temperature control stage: During the temperature control stage, the lowest temperature set by the system is T0, and the highest temperature set by the system is T1. The thermocouple 16 detects the temperature of the heating wire connected thereto, and feeds back the detected real-time temperature T of the corresponding heating wire 14 to the system. When T≥T1, the corresponding heating wire 14 is powered off and the heating wire 14 stops heating. When T≤T0, the heating wire 14 is started and heated up.

[0061] S5. Mold opening: the driving device 3 drives the bottom mold 11 and the top mold 12 to open the mold and take out the molded sole.

[0062] The above method is used for soles that do not need to be cooled and shaped, such as soles made of RB materials. Some soles need to be cooled and shaped, otherwise, the shoes will be deformed when taken out at high temperature. Therefore, when producing soles that need to be cooled and shaped with water, such as EVA soles, etc. After the S4 step is completed, there is also a cooling stage, in which the first cooling device inputs water or gas to the cooling channel 40, and the water and gas cool the top mold 12 and the bottom mold 11, and the second cooling device sprays water or gas to the side wall 18 of the mold body 1, and the water or gas contacts the side wall 18 of the mold body 1, and cools the side wall 18 of the mold body 1, thereby reducing the temperature of the sole, and reducing the temperature of the sole to below 40 degrees Celsius, so that the sole is hardened and shaped, and deformation is prevented when the sole is taken out.

[0063] When the sole does not need to be cooled, the total time of the heating stage and the temperature control stage is usually set to about 240 seconds. Therefore, one process of sole production is about 4 minutes. In traditional sole production, since the temperature of the heating tube needs to reach about 250 degrees, heat needs to be transferred to the hot plate. The area of ​​the hot plate is large, and the heat loss is serious. The heating time is slow. One process of traditional sole production is about 8 minutes.

[0064] When the sole needs to be cooled, the total time of the heating stage and the temperature control stage is usually set to about 240 seconds, of which the heating stage is about 90 seconds, the temperature control stage is about 150 seconds, and the cooling stage is usually about 300 seconds. Therefore, the sole molding time is about 4 minutes, the cooling time is about 5 minutes, and the sole production process is about 10 minutes; while the cooling time of traditional soles is about 8 minutes, and the production process is more than 18 minutes.

[0065] The diameter of the heating wire 14 is usually 2mm to 6mm, and the depth of the wire groove 13 is usually set to 6mm to 10mm; the depth of the wire groove 13 is 3mm to 5mm larger than the diameter of the heating wire 14, and the depth of the wire groove 13 is usually 4mm larger than the diameter of the heating wire 14.

[0066] It has been verified in practice that a pair of double 220g soles are prepared using a traditional rubber vulcanizer. If the main body of the shoe mold is a steel mold, vulcanization requires 2.35 kWh of electricity; if the main body of the shoe mold is an aluminum mold, vulcanization requires 1.54 kWh of electricity, and the vulcanization time is about 7 to 8 minutes. After using the direct heating method of the heating wire 14 of the present invention, vulcanization only requires 0.44 kWh of electricity, and the vulcanization time is about 4 minutes.

[0067] Each pair of soles consumes 30% of the electricity of traditional aluminum molds and 20% of the electricity of traditional steel molds; it can save 70%-80% of electricity, shorten the vulcanization time by half; and reduce the defective rate by 30%.

[0068] Although the present invention has been specifically shown and described in conjunction with the preferred embodiments, it should be understood by those skilled in the art that various changes may be made to the present invention in form and details without departing from the spirit and scope of the present invention as defined by the appended claims, all of which are within the scope of protection of the present invention.

Claims

1. A device for preparing shoe soles by heating with a heating wire, characterized in that: The invention comprises a frame, a mold body arranged on the frame, and a driving device for driving the mold body to open and close the mold. The mold body comprises a bottom mold and a top mold. When the bottom mold and the top mold are closed, a mold cavity is formed inside. The bottom mold and the top mold are respectively provided with at least one wire groove. Heating wires are arranged in the wire groove. The heating wires are arranged on the top, side walls and bottom of the mold body. A sealing layer is provided on the wire groove. The sealing layer seals the heating wire into the wire groove. A thermocouple is connected to each heating wire.

2. The device for preparing shoe soles by heating with a heating wire according to claim 1, characterized in that: The sealing layer is made of heat-conducting material.

3. The device for preparing shoe soles by heating with a heating wire according to claim 1, characterized in that: The thermocouple is completely or partially arranged in the wire slot, each heating wire is connected with a thermocouple, and the thermocouple is completely or partially arranged in the wire slot.

4. The device for preparing shoe soles by heating with a heating wire according to claim 1, characterized in that: The shortest distance between each part of the heating wire and the mold cavity is no more than 10 mm.

5. The device for preparing shoe soles by heating with a heating wire according to claim 1, characterized in that: The frame is provided with two fixing seats, which are respectively connected to the bottom mold and the top mold. The fixing seats are provided with a cooling channel, which is connected to a first cooling device. The frame is provided with a second cooling device.

6. The device for preparing shoe soles by heating with a heating wire according to claim 1, characterized in that: The wire trough includes at least one first trough body arranged on the bottom mold and the top mold, the first trough body is arranged in a circuitous manner along the width direction, the first trough body is arranged at the front end, the middle part and the rear end, the first trough body includes a plurality of first circuitous grooves arranged in the width direction, and the distance between the heating wires in two adjacent first circuitous grooves is 5mm to 20mm.

7. A device for preparing shoe soles by heating with a heating wire according to claim 1 or 6, characterized in that: The wire groove includes at least two second groove bodies arranged on the side wall of the mold body, and the second groove bodies are distributed along the position of the mold cavity and are arranged at the front, middle and rear parts of the side wall of the mold body. The second groove body extends from the heel along the toe direction and then detours to the heel. At least one second groove body extends to the toe. The length of the upper second groove body extending toward the toe direction is greater than the length of the lower second groove body extending toward the toe direction. The second groove body includes at least two second detour grooves, and the distance between the heating wires in two adjacent second detour grooves is 5mm to 20mm.

8. A method for preparing a shoe sole by heating with a heating wire according to claim 1, characterized in that: The following methods are included: S1. Cutting: Cutting the sole raw material into the mold cavity of the mold body; S2. Mold closing: The driving device drives the bottom mold and the top mold to close the mold, so that the mold cavity forms a closed space; S3. Heating stage: Start the heating wires, each heating wire quickly heats up to the set temperature, the thermocouple detects the temperature of the corresponding heating wire, the temperature of each heating wire can be set to be the same or different, the mold body is heated, the heat is transferred to the mold body through heat conduction, the mold body quickly heats up to the set temperature, and the mold body accurately heats the material in the mold cavity; S4. Temperature control stage: During the temperature control stage, the lowest temperature set by the system is T0, and the highest temperature set by the system is T1. The thermocouple detects the temperature of the heating wire connected to it, and feeds back the real-time temperature T of the corresponding heating wire to the system. When T≥T1, the corresponding heating wire is powered off and stops heating. When T≤T0, the heating wire is started and heated up. S5. Mold opening: The driving device drives the bottom mold and the top mold to open the mold and take out the molded sole.

9. The method for preparing a shoe sole by heating with a heating wire according to claim 7, characterized in that: The frame is provided with two fixing seats, which are respectively connected to the bottom mold and the top mold, and the fixing seats are provided with a cooling channel, which is connected to the first cooling device, and the frame is provided with a second cooling device; after the S4 step is completed, there is also a cooling stage, the first cooling device inputs water or gas into the cooling channel, the water and gas cool the top mold and the bottom mold, the second cooling device sprays water or gas to the side wall of the mold body, the water or gas contacts the side wall of the mold body, cools the side wall of the mold body, reduces the temperature of the sole, and makes the sole harden and shape.

10. The method for preparing a shoe sole by heating with a heating wire according to claim 7, characterized in that: T0 is 183 degrees Celsius to 193 degrees Celsius, and T1 is 198 degrees Celsius to 208 degrees Celsius.

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