A device and method for detecting thermal conductivity of circuit boards

Abstract

The present invention relates to the field of circuit board detection technology, and in particular, provides a device and method for detecting the thermal conductivity of circuit boards. The device for detecting the thermal conductivity of circuit boards comprises a rectangular frame, a connecting plate is fixed to the left end of the frame, the right end of the frame is open, a first guide plate and a second guide plate are fixed to the right side of the connecting plate, the first guide plate and the second guide plate are symmetrically arranged on the two inner sides of the frame, and a sliding gap is left between the two inner sides of the frame, the first guide plate and the second guide plate extend from one end of the connecting plate to the outside of the right end of the frame, the first guide plate and the second guide plate are installed with a heating seat that can slide left and right, and the circuit boards made of two or more materials complete the thermal conductivity detection, so as to achieve the purpose of identifying the quality level and improve the detection effect.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board detection, and in particular to a device and method for detecting thermal conductivity of a circuit board. Background Art

[0002] Circuit boards, also known as PCB boards, aluminum substrates, high-frequency boards, thick copper boards, etc., are mainly used in electronic products. A large number of electrical components are installed on them. These electrical components are interconnected and generate high heat when powered on. The high heat is transferred to the circuit board by welding. The high-quality circuit board has higher thermal conductivity, which also improves the heat dissipation efficiency. However, the existing circuit board production industry lacks devices and methods for detecting its thermal conductivity. Directly applying the circuit board to the circuit will not only affect its service life, but also affect the heat dissipation of each component, resulting in a reduction in the service life of each component. Summary of the invention

[0003] In order to solve the above problems, the present invention provides the following technical solutions:

[0004] A thermal conductivity testing device for a circuit board, comprising a rectangular frame, a connecting plate fixed to the left end of the frame, the right end of the frame being open, a first guide plate and a second guide plate fixed to the right side of the connecting plate, the first guide plate and the second guide plate being symmetrically arranged on the two inner sides of the frame, and having sliding gaps respectively between the two inner side surfaces of the frame, the first guide plate and the second guide plate extending away from one end of the connecting plate to the outside of the right end of the frame, a heating seat capable of sliding left and right being installed on the first guide plate and the second guide plate, two front and rear locking seats being installed on the top surface of the left end of the frame, the two locking seats being located above the top surface of the connecting plate, and having a locking gap between the top surface of the connecting plate, a locking screw being installed on the locking seat, the bottom end of the locking screw extending into the locking gap, the left end of the circuit board being located in the locking gap and being locked by the locking screw, the right end of the circuit board extending horizontally to the heating seat, and being heated by the heating seat;

[0005] A fixing frame extending to the left is fixed on the heating seat, a detection seat is fixed in the middle of the fixing frame, a thermal detector is installed in the detection seat, a detection port is opened on the detection seat, and the detection port is located above the top surface of the circuit board, and a driving mechanism is provided between one side of the frame and the detection seat. When the detection seat moves to the left with the heating seat, the detection seat is driven to rise and fall by the driving mechanism, and the detection seat carries the thermal detector to complete temperature detection at multiple positions on the circuit board.

[0006] Further preferably, two front and rear sliding sleeves are installed on the bottom surface of the heating seat, and the two sliding sleeves are slidably fitted on the first guide plate and the second guide plate respectively.

[0007] Further preferably, a heating tube is fixed in the heating seat, a power cord is connected to the heating seat, the heating seat is rectangular, and the heating tube is in a multi-section curved shape and filled in the rectangular cavity of the heating seat.

[0008] Further preferably, an assembly groove is provided on the detection seat, the opening of the assembly groove faces upward, and a countersunk hole is provided at the bottom of the assembly groove, the countersunk hole and the detection port are connected up and down, the driving mechanism includes a support spring fixed in the countersunk hole and an assembly cabin fixed at the top of the support spring and sliding up and down in the assembly groove, the opening of the assembly cabin faces upward, and a through hole is provided at the bottom of the assembly cabin that is connected up and down with the countersunk hole and the detection port, the detection end of the detector is inverted in the assembly cabin, and the probe of the thermal detector passes through the through hole, the countersunk hole, and the detection port in sequence to reach the top of the circuit board, the driving mechanism also includes a driving rod fixed at the end of the assembly cabin, the driving rod extends toward the side direction and reaches the inner surface of one side of the frame, the driving mechanism also includes a caster fixed above the frame and on the same side as the extended end of the driving rod, the casters are at least three and are arranged at equal intervals, so that a detection space is formed between each two adjacent casters, and the extended end of the driving rod is provided with a bending portion bent to the left.

[0009] Further preferably, a slide rail is provided along the length direction on the opposite side of the frame to the other side on which the caster is installed, and both ends of the slide rail are directly connected to the two ends of the frame, and a rack that slides left and right is installed in the slide rail, and a gear that meshes with the rack is installed on the frame, and the rack is connected to the heating seat, and when the gear drives the rack to move linearly, the heating seat is driven by the rack to move linearly, and the heating seat drives the detection seat and the driving rod to move linearly.

[0010] Further preferably, a scale is provided in the length direction of the frame, and the scale is arranged on the side of the frame where the slide rail is provided.

[0011] Further preferably, a timer is fixed on the fixing frame.

[0012] The present invention also provides a method for detecting the thermal conductivity of a circuit board, which is applicable to the above-mentioned device for detecting the thermal conductivity of a circuit board, and comprises the following steps:

[0013] Step S01, placing the circuit board to be tested flat in the frame, and locking one end of the circuit board on the top surface of the connecting plate by using the locking screw to fix the circuit board;

[0014] Step S02, installing a thermal detector on the assembly chamber, aligning the probe of the thermal detector downwardly with the top surface of the circuit board, and pushing the heating seat so that its left end is against the right end of the circuit board;

[0015] Step S03, supplying current to the heating seat, observing the reading on the thermal detector, and recording;

[0016] Step S04, changing the position of the heating seat above the circuit board, using a thermal detector to detect the temperature of different positions on the top surface of the circuit board, observing the readings on the thermal detector, and completing the thermal conductivity test.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. A rectangular frame is set, one end of the frame is welded and the other end is open. During testing, the circuit board is clamped in the frame, and the gear meshes with the rack to move linearly, so that the heating seat provides heat source to the top surface of the circuit board. The probe of the heat detector is pressed against the circuit board to complete the synchronous detection of the thermal conductivity of the circuit board, thereby improving the detection efficiency.

[0019] 2. A driving mechanism is set up on the equipment. The driving mechanism is linked between the thermal detector and the frame, and the linkage action is realized through the driving rod. The operator turns the gear to drive the heating seat to move the thermal detector to the next detection position of the circuit board. At this time, the driving mechanism is triggered to move, so that the assembly cabin descends with the thermal detector, and the probe of the thermal detector is pushed against the circuit board to complete the detection of this detection point of the circuit board. When the thermal detector moves to the next detection point driven by the assembly cabin, the assembly cabin will rise with the thermal detector. At this time, the probe leaves the circuit board and the detection is completed. The probe of the thermal detector can only descend for detection when it reaches a detection position. In the process of moving from one detection position to another, the probe will automatically leave the circuit board, thereby ensuring that the probe will not rub against the top surface of the circuit board when moving in a straight line, and ensuring that the probe will not be damaged when changing the detection position. The operator changes the detection point of the thermal detector's probe by turning the gear, and uses these detection points to obtain multiple data on the circuit board. Based on these data, the thermal conductivity of the circuit board can be more accurately known. According to this detection method, the thermal conductivity test of circuit boards made of more than two materials is completed, achieving the purpose of identifying quality grades and improving the detection effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of a circuit board thermal conductivity testing device provided by an embodiment of the present invention;

[0021] Figure 2 A working principle diagram of a circuit board thermal conductivity testing device provided by an embodiment of the present invention;

[0022] Figure 3 A circuit board thermal conductivity testing device provided by the embodiment of the present invention comprises Figure 2 The schematic diagram after partial sectioning is shown;

[0023] Figure 4 A circuit board thermal conductivity testing device provided by the embodiment of the present invention comprises Figure 3 The enlarged schematic diagram of the A part is shown;

[0024] Figure 5 A circuit board thermal conductivity testing device provided by the embodiment of the present invention comprises Figure 3 The derived top view plan diagram;

[0025] Figure 6 A circuit board thermal conductivity testing device provided by the embodiment of the present invention comprises Figure 3 The schematic diagram from the rear side perspective is drawn;

[0026] Figure 7 A schematic diagram of a circuit board thermal conductivity testing device from a bottom-up perspective provided in an embodiment of the present invention.

[0027] In the figure: 1. frame; 2. connecting plate; 3. first guide plate; 4. second guide plate; 5. sliding gap; 6. heating seat; 7. fixing frame; 8. detection seat; 10. detection port; 11. locking seat; 12. locking gap; 13. locking screw; 14. sliding sleeve; 15. heating tube; 16. assembly groove; 17. countersunk hole; 18. support spring; 19. assembly compartment; 20. through hole; 21. driving rod; 22. caster; 23. bending part; 24. scale; 25. slide rail; 26. rack; 27. gear; 28. circuit board; 29. ​​timer; 30. detection space. DETAILED DESCRIPTION

[0028] The above and other embodiments and advantages of the present invention are described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments.

[0029] In one embodiment, Figure 1-Figure 7As shown: This embodiment provides a device for testing the thermal conductivity of a circuit board, comprising a rectangular frame 1, a connecting plate 2 is fixed to the left end of the frame 1, the right end of the frame 1 is open, a first guide plate 3 and a second guide plate 4 are fixed to the right side of the connecting plate 2, the first guide plate 3 and the second guide plate 4 are symmetrically arranged on the two inner sides of the frame 1, and a sliding gap 5 is left between the two inner sides of the frame 1, one end of the first guide plate 3 and the second guide plate 4 away from the connecting plate 2 extends to the outside of the right end of the frame 1, a heating seat 6 capable of sliding left and right is installed on the first guide plate 3 and the second guide plate 4, and a heating seat 6 is fixed inside the heating seat 6. There is a heating tube 15, a power line is connected to the heating seat 6, the heating seat 6 is rectangular, the heating tube 15 is bent in multiple sections and filled in the rectangular cavity of the heating seat 6, the left end top surface of the frame 1 is installed with two front and rear locking seats 11, the two locking seats 11 are located above the top surface of the connecting plate 2, and a locking gap 12 is left between the top surface of the connecting plate 2, a locking screw 13 is installed on the locking seat 11, the bottom end of the locking screw 13 extends into the locking gap 12, the left end of the circuit board 28 is located in the locking gap 12 and is locked by the locking screw 13, and the right end of the circuit board 28 extends horizontally to the heating seat 6 and is heated by the heating seat 6;

[0030] A fixing frame 7 extending to the left is fixed on the heating seat 6, a detection seat 8 is fixed in the middle of the fixing frame 7, a heat detector is installed in the detection seat 8, a detection port 10 is opened on the detection seat 8, and the detection port 10 is located above the top surface of the circuit board 28. A driving mechanism is provided between one side of the frame 1 and the detection seat 8. When the detection seat 8 moves to the left with the heating seat 6, the detection seat 8 is driven to move up and down by the driving mechanism, and the detection seat 8 carries the heat detector to complete temperature detection at multiple positions on the circuit board 28. Two front and rear sliding sleeves 14 are installed on the bottom surface of the heating seat 6. The two sliding sleeves 14 are respectively slidably matched on the first guide plate 3 and the second guide plate 4. A timer 29 is fixed on the fixing frame 7. A scale 24 is provided in the length direction of the frame 1.

[0031] When in use, the circuit board 28 is placed flat in the frame 1, and one end of the circuit board 28 is fixed between the bottom surfaces of the two locking seats 11 and the top surface of the connecting plate 2 by using two locking screws 13. The free end of the circuit board 28 extends toward the heating seat 6, and the heating seat 6 is pushed. The heating seat 6 moves along the first guide plate 3 and the second guide plate 4 through the sliding sleeve 14 until the bottom surface of the heating seat 6 completely overlaps with the top surface of the free end of the circuit board 28. The power cord is plugged in and current is passed through the heating tube 15. The heating tube 15 releases heat and transfers the heat to the heating seat. 6, and then the heat is transferred to the circuit board 28 by the free end, the timer 29 is pressed, the timer 29 starts timing, the thermal detector is pressed, the probe of the thermal detector descends and presses against the top surface of the circuit board 28, the heat on the circuit board 28 is transferred to the probe, and the heat temperature is presented in a digital manner on the thermal detector through existing detection technology. If the data on the detector is greater than the normal temperature, it proves that the circuit board 28 has been thermally conductive, and the thermal conductivity of the circuit board 28 is obtained based on the detected temperature and the time taken to detect this temperature.

[0032] Move the heating seat 6, so that the detection seat 8 moves to another heating position on the top surface of the circuit board 28, and record the moving distance of the detection seat 8 according to the scale 24. Driven by the detection seat 8, the heat detector reaches the next detection point along the top surface of the circuit board 28, press the timer 29 to re-time, the heating seat 6 continues to heat the new heating position on the top surface of the circuit board 28, the heat detector detects the new detection point on the top surface of the circuit board 28 again, and obtains new temperature data on the detector. Move the heating seat 6 again in an equidistant manner, so that the detection seat 8 moves to another heating position on the top surface of the circuit board 28 again. At the same time, the heat detector reaches the next detection point along the top surface of the circuit board 28 again under the drive of the detection seat 8, press the timer 29 to re-time again, the heating seat 6 continues to heat the new heating position on the top surface of the circuit board 28, the heat detector detects the new detection point on the top surface of the circuit board 28 again, and presents the detection temperature on the detector again, and so on to complete multiple tests. Record the time used for each test and record the temperature measured each time. For example, the sum of the time used for three tests is 12 minutes, the sum of the temperature for three tests is 120 degrees, and the sum of the distances moved by the test base 8 with the thermal detector for three times is 10 centimeters. When the same test method is used to test a circuit board of another material, if the sum of the time used for three tests is greater than 12 minutes, the sum of the temperature for three tests is less than 120 degrees, and the sum of the distances moved by the test base 8 with the thermal detector for three times is greater than 10 centimeters, it proves that the thermal conductivity of the latter circuit board is inferior to that of the former circuit board.

[0033] like Figure 4 , Figure 6As shown, the detection seat 8 is provided with an assembly groove 16, the opening of the assembly groove 16 faces upward, a countersunk hole 17 is provided at the bottom of the assembly groove 16, the countersunk hole 17 and the detection port 10 are connected vertically, the driving mechanism includes a support spring 18 fixed in the countersunk hole 17 and an assembly cabin 19 fixed at the top of the support spring 18 and sliding up and down in the assembly groove 16, the opening of the assembly cabin 19 faces upward, and a through hole 20 is provided at the bottom of the assembly cabin 19, which is connected vertically with the countersunk hole 17 and the detection port 10, the detection end of the detector is inverted in the assembly cabin 19, and the probe of the heat detector It passes through the through hole 20, the countersunk hole 17, and the detection port 10 in sequence to reach the top of the circuit board 28. The driving mechanism also includes a driving rod 21 fixed at the end of the assembly cabin 19. The driving rod 21 extends toward the side and reaches the inner surface of one side of the frame 1. The driving mechanism also includes a caster 22 fixed above the frame 1 and on the same side as the extended end of the driving rod 21. There are at least three casters 22, and they are arranged at equal intervals, so that a detection space 30 is formed between each two adjacent casters 22, and the extended end of the driving rod 21 is provided with a bending portion 23 bent to the left. On the other side of the frame 1 where the caster 22 is installed, a slide rail 25 is provided along the length direction, and the two ends of the slide rail 25 pass through the two ends of the frame 1. A rack 26 that slides left and right is installed in the slide rail 25. A gear 27 that meshes with the rack 26 is installed on the frame 1. The rack 26 is connected to the heating seat 6. When the gear 27 drives the rack 26 to move linearly, the rack 26 drives the heating seat 6 to move linearly, and the heating seat 6 drives the detection seat 8 and the driving rod 21 to move linearly. The scale 24 is set on the side of the frame 1 where the slide rail 25 is provided.

[0034] In actual use, the thermal detector is inverted in the assembly cabin 19, so that the probe of the detector passes through the through hole 20 and enters the detection port 10. The bottom surface of the assembly cabin 19 is lifted upward under the support of the support spring 18, and the assembly cabin 19 lifts the detector upward so that the probe at the bottom of the detector remains in the countersunk hole 17. Only when the assembly cabin 19 descends can the detector be lowered with it, and the probe at the bottom of the detector can pass through the detection port 10 and hit the circuit board 28. According to this principle, the operator rotates the gear 27 and uses the meshing relationship to move the rack 26 along the slide rail 25 toward one end of the connecting plate 2. The rack 26 drives the heating seat 6 to move, and the heating seat 6 moves the detection seat 8, and the detection seat 8 moves the assembly cabin 19. The assembly cabin 19 moves the thermal detector to the next detection position of the circuit board 28, and also moves the drive rod 21, and the drive rod 21 moves the bending part 23, and the bending part 23 moves to the position adjacent to the first caster 2. 2, it is squeezed and lowered by the caster 22, and the driving rod 21 is lowered by the bending part 23, and the assembly cabin 19 is lowered by the driving rod 21, and the heat detector is lowered by the assembly cabin 19, so that the probe of the heat detector is pushed against the circuit board 28 to complete the detection. At the same time, the support spring 18 is compressed and shortened, and when the heat detector is driven by the assembly cabin 19 and moves to the next detection point position of the circuit board 28, the bending part 23 leaves the first caster 22, and the support spring 18 recovers its length and pushes the assembly cabin 19 to rise, and the assembly cabin 19 rises with the heat detector, and the probe leaves the circuit board 28. It can be seen that the probe of the heat detector can only be lowered for detection when it reaches a detection position, and in the process of moving from one detection position to another, the probe will automatically leave the circuit board 28, thereby ensuring that the probe leaves the circuit board 28 when moving in a straight line, and the probe will not rub against the top surface of the circuit board 28 during linear motion, and the probe will not be damaged when changing the detection position. The operator changes the detection point of the probe of the thermal detector by rotating the gear 27, and obtains multiple data on the circuit board 28 by using these detection points, and more accurately knows the thermal conductivity of the circuit board 28 based on these data. According to this detection method, the thermal conductivity test of circuit boards made of more than two materials is completed, thereby achieving the purpose of identifying quality grades and improving the detection effect.

[0035] The present invention also provides a method for detecting the thermal conductivity of a circuit board, which is applicable to the above-mentioned device for detecting the thermal conductivity of a circuit board, and comprises the following steps:

[0036] Step S01, placing the circuit board 28 to be tested flat in the frame 1, and locking one end of the circuit board 28 on the top surface of the connecting plate 2 by using the locking screw 13, so that the circuit board 28 is fixed;

[0037] Step S02, install the thermal detector on the assembly chamber 19, align the probe of the thermal detector downwardly with the top surface of the circuit board 28, and push the heating seat 6 so that its left end is against the right end of the circuit board 28;

[0038] Step S03, supply current to the heating seat 6, observe the reading on the thermal detector, and record it;

[0039] Step S04, changing the position of the heating seat 6 above the circuit board 28, using a thermal detector to detect the temperature of different positions on the top surface of the circuit board 28, observing the readings on the thermal detector, and completing the thermal conductivity test.

[0040] The above orientation designations do not represent the specific orientations of the components in this implementation scheme. This implementation scheme is only for the convenience of describing the scheme, and the orientations are described relatively with reference to the figures. In essence, the specific orientations of the components are described according to their actual installation and actual use as well as the customary orientations of technicians in this field. This is hereby explained.

[0041] The specific implementation methods described above further describe the invention purpose, technical solutions, and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the protection scope of the present invention. It is particularly pointed out that for those skilled in the art, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A device for testing the thermal conductivity of a circuit board, characterized in that: The invention comprises a rectangular frame (1), a connecting plate (2) being fixed at the left end of the frame (1), the right end of the frame (1) being open, a first guide plate (3) and a second guide plate (4) being fixed on the right side of the connecting plate (2), the first guide plate (3) and the second guide plate (4) being symmetrically arranged on the two inner sides of the frame (1) and having sliding gaps (5) between the two inner sides of the frame (1), the first guide plate (3) and the second guide plate (4) having one end away from the connecting plate (2) extending outside the right end of the frame (1), the first guide plate (3) and the second guide plate (4) being installed A heating seat (6) capable of sliding left and right is provided, and two front and rear locking seats (11) are installed on the top surface of the left end of the frame (1), and the two locking seats (11) are located above the top surface of the connecting plate (2), and a locking gap (12) is left between the two locking seats (11) and the top surface of the connecting plate (2), and a locking screw (13) is installed on the locking seat (11), and the bottom end of the locking screw (13) extends into the locking gap (12), the left end of the circuit board (28) is located in the locking gap (12) and is locked by the locking screw (13), and the right end of the circuit board (28) extends horizontally to the heating seat (6) and is heated by the heating seat (6); A fixing frame (7) extending to the left is fixed on the heating seat (6), a detection seat (8) is fixed in the middle of the fixing frame (7), a heat detector is installed in the detection seat (8), a detection port (10) is opened on the detection seat (8), and the detection port (10) is located above the top surface of the circuit board (28), and a driving mechanism is provided between one side of the frame (1) and the detection seat (8), and when the detection seat (8) moves to the left along with the heating seat (6), the detection seat (8) is driven by the driving mechanism to move up and down, and the detection seat (8) carries the heat detector to complete temperature detection at multiple positions on the circuit board (28).

2. The thermal conductivity testing device for circuit boards according to claim 1, characterized in that: Two front and rear sliding sleeves (14) are installed on the bottom surface of the heating seat (6), and the two sliding sleeves (14) are slidably fitted on the first guide plate (3) and the second guide plate (4) respectively.

3. The thermal conductivity testing device for circuit boards according to claim 2, characterized in that: A heating tube (15) is fixed inside the heating seat (6), a power line is connected to the heating seat (6), the heating seat (6) is rectangular, and the heating tube (15) is in a multi-section curved shape and filled in the rectangular cavity of the heating seat (6).

4. The thermal conductivity testing device for circuit boards according to claim 3, characterized in that: The detection seat (8) is provided with an assembly groove (16), the opening of the assembly groove (16) faces upward, a countersunk hole (17) is provided at the bottom of the assembly groove (16), the countersunk hole (17) and the detection port (10) are connected vertically, the driving mechanism comprises a support spring (18) fixed in the countersunk hole (17) and an assembly cabin (19) fixed at the top of the support spring (18) and sliding up and down in the assembly groove (16), the opening of the assembly cabin (19) faces upward, a through hole (20) is provided at the bottom of the assembly cabin (19) and is connected vertically with the countersunk hole (17) and the detection port (10), the detection end of the detector is inverted in the assembly cabin (19), and the heat detector The probe passes through the through hole (20), the counterbore (17), and the detection port (10) in sequence to reach the top of the circuit board (28); the driving mechanism also includes a driving rod (21) fixed at the end of the assembly chamber (19); the driving rod (21) extends in a side direction and reaches the inner surface of one side of the frame (1); the driving mechanism also includes a caster (22) fixed above the frame (1) and on the same side as the extended end of the driving rod (21); the casters (22) are at least three and are arranged at equal intervals, so that a detection space (30) is formed between each two adjacent casters (22); and the extended end of the driving rod (21) is provided with a left-bending portion (23).

5. The thermal conductivity testing device for circuit boards according to claim 4, characterized in that: A slide rail (25) is provided along the length direction of the frame (1) on the other side where the caster (22) is installed. The two ends of the slide rail (25) are directly connected to the two ends of the frame (1). A rack (26) that slides left and right is installed in the slide rail (25). A gear (27) that meshes with the rack (26) is installed on the frame (1). The rack (26) is connected to the heating seat (6). When the gear (27) drives the rack (26) to move linearly, the rack (26) drives the heating seat (6) to move linearly, and the heating seat (6) drives the detection seat (8) and the driving rod (21) to move linearly.

6. The thermal conductivity testing device for circuit boards according to claim 5, characterized in that: The frame (1) is provided with scales (24) in the length direction, and the scales (24) are arranged on the side of the frame (1) where the slide rail (25) is provided.

7. The thermal conductivity testing device for circuit boards according to claim 6, characterized in that: A timer (29) is fixed on the fixing frame (7).

8. A method for detecting thermal conductivity of a circuit board, applicable to the device for detecting thermal conductivity of a circuit board as claimed in claim 4, characterized in that: The following steps are involved: Step S01, placing the circuit board (28) to be tested flatly in the frame (1), and using the locking screw (13) to lock one end of the circuit board (28) on the top surface of the connecting plate (2), so that the circuit board (28) is fixed; Step S02, installing a thermal detector on the assembly chamber (19), with the probe of the thermal detector pointing downward toward the top surface of the circuit board (28), and pushing the heating seat (6) so that its left end abuts against the right end of the circuit board (28); Step S03, supplying current to the heating seat (6), observing and recording the reading on the thermal detector; Step S04, changing the position of the heating seat (6) above the circuit board (28), using a thermal detector to detect the temperature of different positions on the top surface of the circuit board (28), observing the reading on the thermal detector, and completing the thermal conductivity test.

Images