Semiconductor manufacturing control system

Abstract

The invention relates to a semiconductor manufacturing control system. A semiconductor manufacturing control system and method of operation may include: detecting a state with a control board communicatively coupled to a semiconductor manufacturing tool; collecting process information from the semiconductor manufacturing tool using the control board based on the state change or the elapsed predetermined time; storing the process information to a server with a control board, the control board communicatively coupled to the server over a network connection; and bonding an automatic stop mechanism of the semiconductor manufacturing tool to prevent the semiconductor manufacturing tool from operating based on the erroneous process information.

Description

Technical Field

[0001] The present disclosure relates to semiconductor manufacturing and, more particularly, to control systems for manufacturing equipment. Background Art

[0002] Semiconductors have quickly become an integral part of modern life around the world; finding applications in manufacturing, public infrastructure, and consumer devices. Semiconductors can be found in mobile phones and computers, for example, but can also be found in a wide variety of things such as coffee machines, lights, high-speed rail, and airplanes.

[0003] Semiconductors are produced in advanced manufacturing facilities with strict process and quality controls. These manufacturing facilities are large, complex, and rely on many different manufacturing tools.

[0004] Testers and handlers are two types of manufacturing tools and are used herein as non-limiting descriptive examples. Manufacturing tools may also include a variety of machines that perform the many different processes required to produce semiconductors.

[0005] As semiconductor factories age, new manufacturing tools are often introduced while older manufacturing tools that have been in routine use for decades continue to be used. Many problems unique to the semiconductor manufacturing industry arise when both new and old tools are required to meet the ever-increasing process and quality standards required to manufacture the most advanced semiconductors.

[0006] The next generation of semiconductors will require greater control over the manufacturing process than is currently available. A competitive next generation manufacturing system should provide solutions to meet these future demands.

[0007] Solutions should include monitoring and real-time control of processes to prevent defects and blockages. These next-generation manufacturing systems should also provide real-time monitoring, reduced maintenance requirements and remote production stop capabilities (such as automatic stop functions).

[0008] Importantly, the ability to close the loop and collect data from manufacturing tools remains a key requirement for competitive next-generation manufacturing systems. For example, semiconductors moving through manufacturing tools are very small and very sensitive to defects from electrostatic discharge (ESD), physical contamination, and mechanical forces.

[0009] During the sorting process, it is important to ensure that all parts of the sorting machine through which the semiconductor product passes are properly grounded to prevent damage due to ESD. Collecting manufacturing tool data to ensure proper grounding of the manufacturing tools can increase defect prevention from ESD.

[0010] Previous developments required that the sorter be manually tested at multiple grounding points during a setup procedure that had to be performed each time the sorter was set up or maintenance was performed.

[0011] This form of manual testing can take ten to fifteen minutes, which in a factory setting must be multiplied by the number of sorters in use and each maintenance or setup procedure performed. In addition, current manual testing procedures require the sorter to be offline and off the production line, which can negatively impact factory throughput, cycle time, tool availability, tool downtime, maintenance tasks, maintenance training, and other production metrics.

[0012] Closed loop control should allow the manufacturing tool to be shut down using a mechanism such as an auto stop mechanism, which may include, for example, a circuit to implement an auto stop, and is very important when the manufacturing tool is in a runaway condition that may occur in different manufacturing critical processes. Data collection from the manufacturing tool can be done manually, but such manual data collection requires a manual connection via a serial cable.

[0013] Therefore, data is typically only collected during maintenance actions which increases downtime, maintenance time, and maintenance tasks. There have been many attempts to design manufacturing tools that ensure proper grounding to prevent ESD damage and save time, proactively addressing issues related to yield, clogging, and temperature.

[0014] Many industry roadmaps have identified a significant gap between the high demand for next generation semiconductor products and the ability of currently available semiconductor manufacturing tools to provide closed loop control based on manufacturing data collection. In addition, increasing competitive pressures require manufacturing solutions that can achieve high factory output, low cycle times, increased tool availability, reduced tool downtime, reduced maintenance tasks, reduced maintenance training, and importantly, reduced costs.

[0015] Current technology is not able to provide closed-loop control based on manufacturing data collection. One previous development included using off-the-shelf cell controller products. These previous developments could be installed in the sorting machine, the testing machine, or between the two.

[0016] These off-the-shelf cell controllers do not provide manufacturing data collection, such as continuous ground monitoring or real-time yield monitoring. These off-the-shelf cell controllers also do not have full closed-loop integration capabilities between the handler and tester, and automatically stop when a trigger is reached.

[0017] These off-the-shelf cell controllers are also costly, ranging from a few thousand dollars to tens of thousands of dollars per setup. These costs do not include annual subscription fees and should be multiplied for each sorting machine using the off-the-shelf cell controller if used in a factory environment.

[0018] Given the increasing market pressures for complex semiconductors and their attendant manufacturing requirements, it is critical to find solutions that provide closed-loop control based on manufacturing data collection.

[0019] Therefore, there remains a need for a manufacturing control system that provides closed loop control based on manufacturing data collection.Solutions to these problems have long been sought, but prior developments have not taught or suggested any solutions and, thus, solutions to these problems have long eluded those skilled in the art. Summary of the invention

[0020] In one aspect of the present disclosure, a method for operating a manufacturing control system is provided, comprising: detecting the state of a semiconductor manufacturing tool using a control board, the control board being communicatively coupled to the semiconductor manufacturing tool; collecting process information from the semiconductor manufacturing tool using the control board based on a state change or a predetermined time that has passed; and engaging an automatic stop mechanism of the semiconductor manufacturing tool with the control board to prevent the semiconductor manufacturing tool from operating based on erroneous process information.

[0021] In another aspect of the present disclosure, a method for operating a manufacturing control system is provided, comprising: detecting a status using a control panel communicatively coupled to a semiconductor manufacturing tool; collecting process information from the semiconductor manufacturing tool using the control panel based on a status change or a predetermined time that has passed; storing the process information in a server using the control panel, the control panel being communicatively coupled to the server via a network connection; and engaging an automatic stop mechanism of the semiconductor manufacturing tool to prevent the semiconductor manufacturing tool from operating based on erroneous process information.

[0022] In yet another aspect of the present disclosure, a manufacturing control system is provided, comprising a control board, which is configured to: detect the status of a semiconductor manufacturing tool using the control board, the control board being communicatively coupled to the semiconductor manufacturing tool; collect process information from the semiconductor manufacturing tool based on a status change or a predetermined time that has passed; and engage an automatic stop mechanism of the semiconductor manufacturing tool to prevent the semiconductor manufacturing tool from operating based on erroneous process information. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The control system is illustrated in the accompanying drawings, which are intended to be illustrative and not limiting, in which like reference numerals are intended to refer to like components, and in which:

[0024] Figure 1 is a graphical view of the control system.

[0025] Figure 2 In the first embodiment Figure 1 Top view of the control panel and connections.

[0026] Figure 3 In the second embodiment Figure 1 Top view of the control panel.

[0027] Figure 4 It is the method of operating the control system. DETAILED DESCRIPTION

[0028] In the following description, reference is made to the accompanying drawings which form a part hereof, and in which are shown by way of diagrammatic representation embodiments in which the control system may be practiced. It should be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the control system.

[0029] When features, aspects or embodiments of a control system are described in terms of process steps, operations, control flows or flow charts, it should be understood that these steps may be combined, performed in a different order, deleted or include additional steps without departing from the control system as described herein.

[0030] The control system is described in sufficient detail to enable those skilled in the art to make and use the control system, and numerous specific details are provided to give a thorough understanding of the control system; however, it will be apparent that the control system can be practiced without these specific details.

[0031] In order to avoid obscuring the control system, some well-known system configurations and descriptions are not disclosed in detail. Likewise, the drawings showing embodiments of the system are semi-schematic and not drawn to scale, and in particular, some dimensions are for clarity and are shown greatly exaggerated in the drawings. As used herein, the term "communicatively coupled" means a connection between elements through which communications can be sent or received, such as through a wired electrical connection, an optical cable connection, or a wireless connection.

[0032] Reference Figure 1 , which shows a graphical view of a control system 100. One step in the semiconductor manufacturing process requires that semiconductors be tested to ensure quality and functionality before reaching customers. Such testing includes the use of testers and sorters.

[0033] Semiconductor manufacturing tools may include testers and sorters, but may also include other tools for manufacturing semiconductors, including deposition machines, photolithography machines, etchers, implanters, and packaging machines. For ease of description, control system 100 is described herein with respect to sorter 102 and tester 104, and is not intended to limit the scope of the invention unless stated in the claims.

[0034] The sorting machine 102 may be loaded with semiconductor products 106 , which are transported individually from the sorting machine 102 to the testing machine 104 , where the quality and functionality of the semiconductor products 106 are tested.

[0035] The sorting machine 102 can be a gravity feed type sorting machine or a pick and place type sorting machine. As shown, the sorting machine 102 and the tester 104 can sort and test the packaged semiconductor chips. Typically, a pair including a sorting machine 102 and a tester 104 can test about one thousand to three thousand units per hour.

[0036] Other embodiments are contemplated that can sort, test, and process wafers and packaged semiconductor chips. When processing wafers or chips, the sorter 102 and tester 104 will be physically different, but the control system 100 can provide process control for each manufacturing tool. Wafer manufacturing tools are only found in the early stages of manufacturing.

[0037] The handler 102 and the tester 104 may be communicatively coupled to a control board 108 that will collect process information 110. The process information 110 is expected to include information collected from the manufacturing tool, whether running, stopped, or idle. That is, the process information 110 may be information about the handler 102, the tester 104, or even the semiconductor product 106 itself.

[0038] The control board 108 can be communicatively coupled to the sorting machine 102 in a variety of ways; however, when the sorting machine 102 is a newer type of sorting machine 102 having a CPU 112 that controls the sorting machine 102, the control board 108 can be communicatively coupled to the sorting machine 102 via a serial connection 114, through which process information 110 is transmitted sequentially or serially between the control board 108 and the CPU 112.

[0039] The serial connection may be any type of serial connection, however, because even new manufacturing tools share backward compatibility with older tools, the serial connection may be, for example, a recommended standard 232 (RS232) connection 114. Hardware conforming to similar standards such as RS422 and RS485 is also contemplated, as are other serial connections including Ethernet and USB.

[0040] The control board 108 can collect process information 110 by sending queries to the sorting machine 102 using the sorting machine's communication protocol. When the sorting machine 102 is a newer type with a control CPU 112, the control board 108 can collect each type of process information 110 through a serial connection 114.

[0041] However, when the sorting machine 102 is an older machine that does not rely on the CPU 112 for control and management, the control board 108 may use other connections to collect process information 110 from the sorting machine 102 .

[0042] For example, the control board 108 may collect a sorting machine status 118 of the sorting machine 102 as a piece of process information 110. The sorting machine status 118 may be collected using a light pole sensor 120 connected to a light pole 122 of the sorting machine 102.

[0043] The light pole 122 may be a tower light status indicator for operating the sorting machine 102. The light pole sensor 120 may monitor the sorting machine status 118 displayed with the light pole 122, including on, off, or flashing.

[0044] The sorter status 118 is used to determine the activity of the sorter 102. A green light on means that the sorter 102 is on and running in production, while a red light on means that the sorter 102 is off and production has stopped, and a flashing red light may mean that the sorter 102 is jammed or similarly stops production.

[0045] The control board 108 may synchronously or asynchronously collect the process information 110. Asynchronous data collection may occur when the control board 108 detects a change in the sorter state 118 of the sorter 102 based on a change in the state of the lights within the light bars 122.

[0046] The control board 108 can monitor the state of the light pole 122 for any changes, and once a change is detected, the control board 108 can query and collect process information 110 from the sorting machine 102. For example, whenever the state of the light pole 122 changes from shutdown to startup or from startup to shutdown, when the control board 108 obtains process information 110 from the sorting machine 102, asynchronous data collection can occur.

[0047] Synchronous data collection occurs when the control board 108 obtains process information 110 from the sorting machine 102 at a predetermined time, such as every hour. One example of synchronously collected process information 110 is a product count 124, or the number of parts processed through the sorting machine 102. One reason for this is because when the sorting machine 102 runs for several hours without any downtime, it will take some time before the control board 108 can collect the product count 124.

[0048] Continuing with the above example, the control board 108 may collect handler temperature readings 126 as a piece of process information 110. The handler temperature readings 126 may be obtained from a plurality of temperature sensors 128 located on the handler 102, however particular attention may be paid to the temperature along the path of the semiconductor product 106 through the handler 102.

[0049] The handler temperature readings 126 can be compared to a set temperature and any temperature variations tracked for quality control, tool health, and maintenance purposes. It is contemplated that the handler temperature readings 126 can be recorded and compared to temperature thresholds above and below a set temperature or temperature required for process control.

[0050] The sorter temperature readings 126 at various points may be compared to the inter-station temperature difference thresholds to determine acceptable temperature differences from station to station across the temperature sensors 128. If the sorter temperature readings 126 exceed the temperature threshold or the inter-station temperature difference threshold, the control board 108 may stop the sorter 102 by triggering a sorter auto-stop 130 using serial communications.

[0051] As used herein, a threshold may be exceeded based on information or data moving from one side of the threshold to the other in a positive or negative direction. Exceeding a threshold may also mean that the data is above an upper threshold or below a lower threshold.

[0052] The sorting machine automatic stop device 130 is an automatic stop mechanism, which may include any combination of circuits and software to prevent the sorting machine 102 from operating based on erroneous process information 110, which means that process control is disrupted, a threshold value related to the process information 110 is exceeded, or an unexpected value is detected. The sorting machine automatic stop device 130 may, for example, be part of an emergency shutdown system, a door interlock system, or other interlock system of the sorting machine 102.

[0053] For example, the handler auto-stop 130 may be engaged based on the detection of an out-of-control condition by the control board 108. The control board 108 may engage the handler auto-stop 130 by interrupting an interlock system or an emergency system of the handler 102. The handler auto-stop 130 thereby provides closed-loop control of the handler 102, which is important when a manufacturing tool is in an out-of-control condition, which may occur in various manufacturing critical processes.

[0054] Thus, the handler auto-stop 130 can prevent possible production defects from spreading due to an out-of-control condition and provide an opportunity to take corrective action before affecting subsequent semiconductor products 106 that are sorted by the handler 102. The handler temperature reading 126 can be a trigger for automatically stopping the handler 102 or the handler 102 and the tester 104 together.

[0055] The sorter temperature readings 126 can be collected asynchronously based on changes in the sorter state 118 of the light bar 122, or synchronously based on a predetermined time interval. When the sorter 102 is a newer type with a control CPU 112, the control board 108 can collect the sorter temperature readings 126 as a type of process information 110 through the serial connection 114.

[0056] The control board 108 may further collect handler ground readings 132 as a piece of process information 110. The handler ground readings 132 may be continuously monitored from a plurality of ground sensors 134 located on the handler 102, however, it is more important to pay particular attention to the handler ground readings 132 along the path of the semiconductor product 106 through the handler 102. The handler ground readings 132 may be collected, processed, stored, and transmitted to the control board 108 by a continuous ground monitoring board 136.

[0057] The handler ground reading 132 can be compared to the process control grounding requirements and any grounding excursions tracked for quality control, tool health and maintenance purposes. It is contemplated that the handler ground reading 132 can be recorded and compared to grounding thresholds above and below the grounding levels required for setup or process control.

[0058] It has been found that automatically recording handler grounding readings 132, even while the handler is running, can save 27.25 handler hours per week, thereby improving overall equipment effectiveness, an important metric in the cost-constrained semiconductor manufacturing industry.

[0059] The sorter ground reading 132 at multiple points may be compared to the inter-station ground difference threshold to determine acceptable ground differences from station to station across the ground sensor 134. If the sorter ground reading 132 exceeds the ground threshold or the inter-station ground difference threshold, the control board 108 may stop the sorter 102 by triggering the sorter automatic stop device 130 or an automatic stop circuit within the sorter 102.

[0060] Thus, the handler auto-stop 130 can prevent possible production defects from spreading due to an out-of-control condition and provide an opportunity to take corrective action before affecting subsequent semiconductor products 106 that are sorted by the handler 102. The handler ground reading 132 can be a trigger for automatically stopping the handler 102 or the handler 102 and the tester 104 together.

[0061] The sorter grounding readings 132 can be collected asynchronously based on changes in the sorter state 118 of the light bar 122, or synchronously based on predetermined time intervals. When the sorter 102 is a newer type with a control CPU 112, the control board 108 can collect the sorter grounding readings 132 as a type of process information 110 through the serial connection 114.

[0062] The control board 108 can further collect a handler vibration reading 138 as a piece of process information 110. The handler vibration reading 138 can be obtained from a plurality of vibration sensors 140 located on the handler 102, however, it is more important to pay special attention to the handler vibration reading 138 along the path of the semiconductor product 106 through the handler 102.

[0063] The sorter vibration readings 138 may be sent directly from the vibration sensor 140 to the control board 108 via a serial connection. The serial connection may be any suitable serial connection such as I2C, for example.

[0064] The sorter vibration readings 138 can be compared to process control vibration requirements and any vibration changes tracked for quality control, tool health and maintenance purposes. It is contemplated that the sorter vibration readings 138 can be recorded and compared to vibration thresholds above and below the vibration levels required for setup or process control.

[0065] The sorter vibration readings 138 at multiple points may be compared to the inter-station vibration difference thresholds to determine acceptable vibration differences from station to station across the vibration sensors 140. If the sorter vibration readings 138 exceed the vibration threshold or the inter-station vibration difference threshold, the control board 108 may stop the sorter 102 by triggering the sorter auto-stop device 130 or an auto-stop circuit within the sorter 102.

[0066] Thus, the handler auto-stop 130 can prevent possible production defects from spreading due to an out-of-control condition and provide an opportunity to take corrective action before affecting subsequent semiconductor products 106 that are sorted by the handler 102. The handler vibration reading 138 can be a trigger for automatically stopping the handler 102 or the handler 102 and the tester 104 together.

[0067] The sorter vibration readings 138 may be collected asynchronously based on changes in the sorter status 118 of the light bar 122, or synchronously based on predetermined time intervals. When the sorter 102 is a newer type having a control CPU 112, the control board 108 may collect the sorter vibration readings 138 as a type of process information 110 through the serial connection 114, and the sorter vibration readings 138 may not be collected using the continuous ground monitoring board 136.

[0068] The control board 108 can further collect a handler jam reading 142 as a piece of process information 110. The handler jam reading 142 can be obtained from a plurality of jam sensors 144 located on the handler 102, which are in contact with components of the handler 102 that contact the semiconductor products 106. The handler jam reading 142 can be collected, processed, stored, and transmitted to the control board 108 by a sensor interface board 146.

[0069] The sorter jam readings 142 are tracked for quality control, tool health, and maintenance purposes. The sorter jam readings 142 can be compared to process control thresholds that limit the number of jams detected during a specified amount of time or during a specified amount of product running through the sorter 102.

[0070] If the sorter jam reading 142 exceeds the jam threshold, the control board 108 may stop the sorter 102 by triggering the sorter auto-stop device 130 or an auto-stop circuit within the sorter 102 .

[0071] Thus, the handler auto-stop 130 can prevent possible production defects from spreading due to an out-of-control condition and provide an opportunity to take corrective action before affecting subsequent semiconductor products 106 that are sorted by the handler 102. The handler jam reading 142 can be a trigger for automatically stopping the handler 102 or the handler 102 and the tester 104 together.

[0072] The sorter jam readings 142 may be collected asynchronously based on changes in the sorter status 118 of the light bar 122, or synchronously based on predetermined time intervals. When the sorter 102 is a newer type having a control CPU 112, the control board 108 may collect the sorter jam readings 142 as a type of process information 110 via the serial connection 114, and the sensor interface board 146 may not be utilized.

[0073] The control board 108 may further collect a sorter bin reading 148 as a piece of process information 110. After a semiconductor product 106 is run through the tester 104 and sent back to the sorter 102, the sorter bin reading 148 may be acquired from a bin sensor 150 of the semiconductor product.

[0074] After the tester 104 has tested the semiconductor products 106 and assigned bins based on the errors, defects, or performance of the semiconductor products 106, the sorter 102 may place the semiconductor products 106 into physically separated containers, referred to as "bins." Many typical testers 104 will bin the semiconductor products 106 based on pass / fail responses from the semiconductor products 106 during testing. The sorter bin readings 148 may be collected, processed, stored, and transmitted to the control board 108 via the tester interface board 152.

[0075] The sorter box readings 148 are tracked for quality control, tool health, and maintenance purposes. The sorter box readings 148 may be further processed to determine other forms of process information 110 including soak time data 154, which may be a measure of the time that the semiconductor product 106 spends in process within a manufacturing tool including the sorter 102 and the tester 104.

[0076] The sorting machine 102 may further track site map data 156. The site map data 156 is captured from the sorting machine 102 using a separate command specifically for capturing the site map data 156.

[0077] The site map data 156 is the sorting position of the semiconductor products 106 as they move through the handler 102. For example, a four-station handler and the site map may be 1, 2, 3, 4 or 4, 3, 2, 1 or 1, 2, 4, 3. The site map data 156 may depend on the settings required for the test program and the tools used to process the test.

[0078] The sorter bin readings 148 may be collected asynchronously based on changes in the sorter state 118 of the light bar 122, or synchronously based on predetermined time intervals. When the sorter 102 is a newer type having a control CPU 112, the control board 108 may collect the sorter bin readings 148, soak time data 154, and site map data 156 as types of process information 110 via the serial connection 114, and the tester interface board 152 may not be utilized.

[0079] If the sorter bin reading 148 shows an erroneous bin, the soak time data 154 exceeds a threshold, or if the site map data 156 is erroneous, the control board 108 may stop the sorter 102 by triggering the sorter auto-stop device 130 or an auto-stop circuit within the sorter 102 .

[0080] The control board 108 may further collect de-bag data 158, fault data 160, and process control data 162. The de-bag data 158, fault data 160, and process control data 162 may be collected from a keyboard 164.

[0081] The debagging data 158 may be the control and time stamps from the debagging process steps required to load the sorter 102. The fault data 160 may be any faults generated by the sorter 102 and their time stamps. The process control data 162 may be a record of any commands entered into the sorter 102 via the keyboard 158 and their time stamps.

[0082] The bag removal data 158, the fault data 160, and the process control data 162 can be collected asynchronously based on the change of the sorter state 118 of the light bar 122, or synchronously based on a predetermined time interval. When the sorter 102 is a newer type with a control CPU 112, the control board 108 can collect the bag removal data 158, the fault data 160, and the process control data 162 as the type of process information 110 through the serial connection 114.

[0083] It is contemplated that the control board 108 may collect other types of process information 110 based on the needs of the manufacturing process and the manufacturing tool. It is contemplated that the control board 108 may use a serial connection and use serial communications between the control board 108 and other elements to retrieve process information 110 including: sorter status 118 from the light bar 122, sorter temperature readings 126 from the temperature sensor 128, sorter ground readings 132 from the ground sensor 134 via the continuous ground monitoring board 136, sorter jam readings 142 from the jam sensor 144 via the sensor interface board 146, sorter bin readings 148 from the bin sensor 150 via the tester interface board 152, bag removal data 158 from the keyboard 164, fault data 160 from the keyboard 164, and process control data 162 from the keyboard 164.

[0084] The control board 108 may be connected to the test machine 104 with a server 166 therebetween. The server 166 may be communicatively coupled to the test machine 104 and the control board 108 via a network connection 168.

[0085] It is contemplated that the network connection 168 may be any suitable connection, however, since the manufacturing tool interfaces with both new and old tools, an RS485 network connection, a TCP / IP network connection, an Ethernet connection, or even a wireless connection may be used.

[0086] Although the network connection 168 is shown and described as communicatively coupling the control board 108 to the server 166, it is contemplated that the network connection 168 may also communicatively couple the control board 108 to an intranet, for example. The network connection 168 may couple multiple sorting machines 102 to the server 166, and in some embodiments, thirty sorting machines 102 may be coupled to a single server 166.

[0087] The control board 108 may collect process information 110 from the tester 104 through the server 166 and the network connection 168. For example, the control board 108 may retrieve process information 110, such as a tester temperature reading 174.

[0088] The tester temperature readings 170 can be compared to the set temperature and any temperature variations tracked for quality control, tool health, and maintenance purposes. It is contemplated that the tester temperature readings 170 can be recorded and compared to temperature thresholds above and below the set temperature or process control windows of desired temperature.

[0089] The handler temperature readings 126 at multiple points may be compared to the inter-station temperature difference thresholds to determine acceptable temperature differences from station to station across the tester 104. If the tester temperature readings 170 exceed the temperature threshold or the inter-station temperature difference threshold, the control board 108 may stop the handler 102 by triggering the handler auto-stop 130, or the tester 104 by triggering a tester auto-stop 172 having a series connection.

[0090] The tester auto-stop 172 is an automatic stop mechanism that may include any combination of circuitry and software to prevent the tester 104 from operating based on erroneous process information 110, meaning that process control is compromised, a threshold associated with the process information 110 is exceeded, or an unexpected value is detected. The tester auto-stop 172 may, for example, be part of an emergency shutdown system, a door interlock system, or other interlock system of the tester 104.

[0091] For example, the test machine auto-stop 172 may be engaged based on detection of a runaway condition by the control board 108. The control board 108 may engage the test machine auto-stop 172 by interrupting an interlock system or an emergency system of the test machine 104. The test machine auto-stop 172 thereby provides closed-loop control of the test machine 104, which is important when a manufacturing tool is in a runaway condition, which may occur in various manufacturing critical processes.

[0092] Therefore, the tester automatic stop device 172 can prevent possible production defects from spreading due to the uncontrolled state and provide an opportunity to take corrective measures before affecting the subsequent semiconductor products 106 sorted by the tester 104. The handler temperature reading 126 or the tester temperature reading 170 can be some triggers for automatically stopping the handler 102 or automatically stopping the handler 102 and the tester 104 together.

[0093] The tester temperature readings 170 may also be used for automatic temperature calibration and adjustment on the handler 102. The server 166 may retrieve the process information 110 from the control board 108 and may write the process information 110 to a return table 174 of a front-end database 176.

[0094] The return table 174 of the front-end database 176 can be obtained by the network service 178. The network service 178 continuously reads the return table 174 of the front-end database 176 and sends a response 180 back to the control board 108.

[0095] The response 180 may be used to determine the communication status of the network connection 168 between the server 166 and the control board 108. The control board 108 may display the communication status "online" on the display 182 of the keyboard 164 based on the response 180 received by the control board 108 from the server 166 within the time window.

[0096] The control board 108 may display a communication status of “offline” on the display 182 of the keyboard 164 based on the control board 108 not receiving a response 180 from the server 166 within the time window.

[0097] The response 180 may also include an auto-stop trigger 184. The control board 108 may trigger the sorter auto-stop 130, the tester auto-stop 172, or both based on receiving the auto-stop trigger 184 within the response 180. The auto-stop trigger 184 may be generated by the server 166 or the network service 178 based on a comparison between the process information 110 and a threshold value or based on an analysis of the process information 110.

[0098] For example, if one of the process information 110, such as the handler temperature reading 126, exceeds a threshold value; then the auto stop trigger 184 can be included in the response 180 and cause the control board 108 to engage the handler auto stop 130 and the tester auto stop 172, forcing a production stop on the tool. Similarly, if the process information 110 is analyzed and the value is not expected, then the auto stop trigger 184 can be included in the response 180 and cause the control board 108 to engage the handler auto stop 130 and the tester auto stop 172, forcing a production stop on the tool.

[0099] The web service 178 may collect the process information 110 through the return table 174 of the front-end database 176. The web service 178 may process and analyze the process information 110 to calculate the product count through the tool, the product count through the tool over time, and the product count through the tool per jam. The web service 178 may save the process information 110 on the back-end database 186 along with the product count through the tool, the product count through the tool over time, and the product count through the tool per jam.

[0100] The server 166 may also retrieve the process information 110 from the test machine 104 via the network connection 168 using a cron job 188 operating on the web service 178, and may store the process information 110 to the backend database 186. The process information 110 retrieved using the cron job 188 may include an index time 190, a number of products that passed 192, a number of products that failed 194, a total number of products that passed the test machine 104 196, and a batch number 198 of the semiconductor product 106 run.

[0101] It is contemplated that the process information 110 including the sorter bin readings 148, the sorter jam readings 142, the sorter temperature readings 126, the station map data 156, and the soak time data 154 can be analyzed in the server 166 and using the web service 178 to determine severe jams and calculate the efficiency of the sorter 102, such as the number of products per jam run. A severe jam is a particular type of jam that causes significant problems and requires repair before production can be restarted.

[0102] A severe jam may be detected based on a combination of error codes or process information 110. It is further contemplated that the process information 110 may be used to alert a support team or maintenance team when a setting yield or efficiency is low.

[0103] The process information 110 can further be used to detect incorrect temperature or soak time settings. Other uses of the process information 110 include early detection of problems, data analysis, and even identifying predictive maintenance of manufacturing tools.

[0104] The server 166 and web service 178 may further analyze the process information 110 by making comparisons between the part count throughputs of both the sorter 102 and the tester 104 to proactively detect mis-binning, which is a leading cause of customer issues.

[0105] Thus, the control board 108 may be integrated with the server 166 and the web service 178 to save the process information 110 to a database for analysis. The control system 100 is also integrated with real-time jam monitoring, real-time yield monitoring, and an event-driven out-of-control program (OCAP) to detect severe jams and stop the sorter 102 via the sorter automatic stop device 130. The event-driven OACP is a program that automatically displays to the operator, providing instructions for resolving the problem.

[0106] The network service 178 can also be used to process the process information 110 and detect critical events. A critical event can be an event that triggers the sorting machine automatic stop device 130 to engage and stop the sorting machine 102. Alternatively, the network service 178 can process the process information 110 and detect critical events to shut down the tester 104 using the tester automatic stop device 172.

[0107] Reference Figure 2 , which shows the first embodiment Figure 1 The control board 108 and connections are shown in top view. The control board 108 can be communicatively coupled to the sorting machine 102 via the serial connection 114, through which the Figure 1 The process information 110 is transmitted sequentially or serially between the control board 108 and the sorting machine 102.

[0108] The serial connection may be any type of serial connection, however, because even new manufacturing tools share backward compatibility with older tools, the serial connection may be, for example, an RS232 connection 114. Hardware conforming to similar standards such as RS422 and RS485 is also contemplated, as are other serial connections including Ethernet and USB.

[0109] The control board 108 may collect process information 110 by sending queries to the sorting machine 102 using the sorting machine's communication protocol. The control board 108 may collect Figure 1 The sorting machine status 118 is used as a process information 110.

[0110] The sorter state 118 may be collected by detecting changes in the state of the light pole 122 using the state connection 202. It is contemplated that in one embodiment, the control board 108 may control the state of the light pole 122;

[0111] The status connection 202 may be a pair of RS232 connectors communicatively coupled to the light pole 122. The status connection 202 may be a serial connection between the control board 108 and the sorting machine 102. It is contemplated that in one embodiment, the control board 108 may control the light pole 122 of the sorting machine 102 through the status connection 202.

[0112] The control panel 108 can also collect Figure 1 The handler temperature reading 126 is provided as a piece of process information 110. The handler temperature reading 126 may be obtained from a plurality of temperature sensors 128 located on the handler 102 having temperature monitoring connections 204. The temperature monitoring connections 204 may be serial strap and pin connections between the control board 108 and the handler 102.

[0113] If the sorter temperature reading 126 exceeds a temperature threshold or an inter-station temperature difference threshold, the control board 108 may stop the sorter 102 by triggering the sorter auto-stop device 130 using an auto-stop connection 206. The auto-stop connection 206 may be a series connection with screw terminals between the control board 108 and the sorter 102.

[0114] The handler auto-stop 130 may be a circuit that stops the handler 102 from operating when process control is disrupted, such as when the temperature exceeds a threshold. The handler auto-stop 130 thereby provides closed-loop control of the handler 102, which is important when the manufacturing tool is in an out-of-control state, which may occur in various manufacturing critical processes.

[0115] It is contemplated that the sorter automatic stop device 130 may be connected to the door interlock of the sorter 102. When a runaway condition is detected by the control board 108, the control board 108 may interrupt the door interlock circuit of the sorter 102 to engage the sorter automatic stop device 130. The sorter temperature reading 126 may be used for automatic stop Figure 1 A trigger that automatically stops the sorting machine 102 or the testing machine 104 together.

[0116] The sorter temperature readings 126 may be collected asynchronously based on changes in the sorter status 118 of the light pole 122, or synchronously based on predetermined time intervals. The control board 108 may further collect Figure 1 The sorter ground reading 132 is used as a piece of process information 110.

[0117] The sorter ground readings 132 may be continuously monitored by a plurality of ground sensors 134 located on the sorting machine 102. The sorter ground readings 132 may be collected, processed, stored by a continuous ground monitoring board 136 and transmitted to the control board 108 via a ground monitoring connection 208. The ground monitoring connection 208 may be a serial strap and pin connection between the control board 108 and the sorter 102.

[0118] If the sorter ground reading 132 exceeds the ground threshold or the site-to-site ground difference threshold, the control board 108 can stop the sorter 102 by triggering the sorter automatic stop device 130 or an automatic stop circuit within the sorter 102. The sorter ground reading 132 can be a trigger for automatically stopping the sorter 102 or automatically stopping the sorter 102 and the tester 104 together. The sorter ground reading 132 can be collected asynchronously based on changes in the sorter state 118 of the light pole 122, or synchronously based on predetermined time intervals.

[0119] The control panel 108 can further collect Figure 1 The sorting machine vibration reading 138 in the process information 110 is used as the sorting machine vibration reading 138. The sorting machine vibration reading 138 can be obtained from a vibration sensor 140 located on the sorting machine 102.

[0120] The control board 108 may provide a separate vibration monitoring connection 210. The vibration monitoring connection 210 may provide a connection between the vibration sensor 140 and the control board 108. The vibration monitoring connection 210 may be, for example, a serial connection such as an I2C connection.

[0121] The sorter vibration reading 138 may be a trigger for automatically stopping the sorter 102 or both the sorter 102 and the tester 104. The sorter vibration reading 138 may be collected asynchronously based on changes in the sorter state 118 of the light pole 122, or synchronously based on predetermined time intervals.

[0122] The control panel 108 can further collect Figure 1 The sorting machine blockage reading 142 is used as a piece of process information 110. The sorting machine blockage reading 142 can be obtained from a plurality of blockage sensors 144 located on the sorting machine 102, and the plurality of blockage sensors are connected to the sorting machine 102. Figure 1 The semiconductor product 106 is in direct contact with the component contacts.

[0123] The sorter jam readings 142 may be collected, processed, stored by the sensor interface board 146 and transmitted to the control board 108 via the sensor interface connection 212. The sensor interface connection 212 may be a serial ribbon and pin connection between the control board 108 and the sorter 102.

[0124] If the sorter jam reading 142 exceeds the jam threshold, the control board 108 can stop the sorter 102 by triggering the sorter auto-stop device 130 or an auto-stop circuit within the sorter 102. The sorter jam reading 142 can be a trigger for automatically stopping the sorter 102 or automatically stopping the sorter 102 and the tester 104 together. The sorter jam reading 142 can be collected asynchronously based on changes in the sorter status 118 of the light pole 122, or synchronously based on predetermined time intervals.

[0125] The control panel 108 can further collect Figure 1 The sorter bin reading 148 of the semiconductor product 106 is used as a piece of process information 110. As the semiconductor product 106 runs through the sorter 102, the sorter bin reading 148 can be obtained from a bin sensor 150, which can collect bin data for the semiconductor product.

[0126] The handler bin readings 148 may be collected, processed, stored by the tester interface board 152 and transmitted to the control board 108 via the tester interface connection 214. The tester interface connection 214 may be a serial ribbon and pin connection between the control board 108 and the handler 102.

[0127] The sorter bin reading 148 can be collected asynchronously with the change of the sorter status 118 of the light bar 122, or synchronously based on a predetermined time interval. If the sorter bin reading 148 is erroneous, the control board 108 can stop the sorter 102 by triggering the sorter automatic stop device 130 or the automatic stop circuit within the sorter 102.

[0128] The control panel 108 can further collect all Figure 1 The de-bag data 158, the fault data 160, and the process control data 162 in the sorter 102 may be collected from a keyboard 164, which is communicatively coupled to the control board 108 via a keyboard connection 216. The keyboard connection 216 may be a serial tape and pin connection between the control board 108 and the sorter 102.

[0129] The de-bag data 158 , the fault data 160 , and the process control data 162 may be collected asynchronously based on changes in the sorter status 118 of the light pole 122 , or synchronously based on predetermined time intervals.

[0130] The control board 108 may be connected to the test machine 104 with a server 166 therebetween. The server 166 may be communicatively coupled to the test machine 104 and the control board 108 via a network connection 168.

[0131] The network connection 168 is depicted as a serial ribbon and pin connection between the control board 108 and the server 166. It is contemplated that the network connection 168 may be any suitable connection, however, because the manufacturing tool interfaces with both legacy and new tools, an RS485 network connection, a TCP / IP network connection, or an Ethernet connection may be used.

[0132] Although the network connection 168 is shown and described as communicatively coupling the control board 108 to the server 166, it is contemplated that the network connection 168 may also communicatively couple the control board 108 to an intranet, for example. The network connection 168 may couple multiple sorting machines 102 to the server 166, and in some embodiments, thirty sorting machines 102 may be coupled to a single server 166.

[0133] The control board 108 can be communicatively coupled to the sorting shuttle sensor 218 for collecting information about the shuttle within the sorting machine 102, such as whether the shuttle is empty or full, and whether the shuttle requires operator assistance. The sorting shuttle sensor 218 can be communicatively coupled to the control board 108 via the sorting shuttle connection 220.

[0134] The sorting shuttle connection 220 may be a serial ribbon and pin connection between the control board 108 and the sorter 102. The sorting information may be collected asynchronously based on changes in the sorter state 118 of the light pole 122, or synchronously based on predetermined time intervals.

[0135] The control board 108 may further reserve a run-stop connection 222 that provides an additional connection between the keyboard 164 and the control board 108. The run-stop connection 222 may be a serial strap and pin connection between the control board 108 and the sorter 102.

[0136] The temperature monitoring connection 204, ground monitoring connection 208, sensor interface connection 212, tester interface connection 214, keyboard connection 216, sorting shuttle connection 220, run-stop connection 222 and network connection 168 are described as serial ribbon and pin connections, however, it is contemplated that the connections may be any other suitable connections.

[0137] Manufacturing tools are the product of intensive cost reduction pressures. This may result in circuits and chips using fewer connections and relying on serial connections. The serial connection between the control board 108 and the sorter 102 or between the control board 108 and its many external sensors and accessories can be any serial communication connection, including recommended standard 232 or its related standards, serial peripheral interface, internal integrated circuit bus, peripheral component interconnect fast connection, etc.

[0138] Reference Figure 3, which shows a top view of the control board 300 in the second embodiment. The control board 300 of the second embodiment is similar to the control board 108 of the first embodiment and can be similarly described, with the differences being set forth below.

[0139] The control board 300 of the second embodiment is different from the control board 300 of the first embodiment. Figure 2 The main difference between the control board 108 and the control board 300 is that the control board 300 can collect Figure 1 process information 110, without the need for all Figure 2 The process information 110 can be obtained by the temperature monitoring connection 204, the ground monitoring connection 208, the sensor interface connection 212, the tester interface connection 214, the keyboard connection 216, the sorting shuttle connection 220, or the run-stop connection 222 of the control board 300. The process information 110 can be captured by sending a command requesting the process information 110 from the serial connection 114 of the control board 300 to the sorting machine 102.

[0140] The control board 300 is depicted with a transient voltage suppressor diode 302 and a resettable fuse 304 on the power line 306 to improve power stability and address the problem of the fuse blowing when inrush current enters the circuit.

[0141] The control board 300 is further shown having the network connection 168 converted to a Transmission Control Protocol and Internet Protocol (TCP / IP) connection 308. The control board 300 may provide a separate vibration monitoring connection 310.

[0142] The vibration monitoring connection 310 can be Figure 1 A connection is provided between the vibration sensors 140. The vibration monitoring connection 310 may be, for example, a serial connection such as an I2C connection.

[0143] Reference Figure 4 , in which a method of operating a control system 100 is shown. The method of operating a manufacturing control system may include: in block 402, using a control board communicatively coupled to a semiconductor manufacturing tool to detect a state; in block 404, using the control board to collect process information from the semiconductor manufacturing tool based on a change in state or a predetermined time that has passed; in block 406, using the control board to store the process information to a server, the control board being communicatively coupled to the server via a network connection; and in block 408, engaging an automatic stop mechanism of the semiconductor manufacturing tool to prevent the semiconductor manufacturing tool from operating based on erroneous process information.

[0144] Thus, it has been discovered that the control system provides important and heretofore unknown and unavailable solutions, capabilities and functional aspects. The resulting configuration is straightforward, cost-effective, uncomplicated, highly versatile, accurate, sensitive and effective, and can be implemented by employing known components for ready, efficient and economical manufacture, application and utilization.

[0145] The control system includes integration of ground monitoring sensors, temperature sensors, light bar sensors, jam sensors and bin sensors to provide a closed loop control system with automatic stop devices for the sorting machine, while providing automatic collection of important process information, which saves man-hours and improves tool availability, while providing increased control over important production controls, resulting in improved quality control. Thus, the control system can provide continuous ground monitoring, automatic stop capability and real-time yield monitoring, and automatically stop when a trigger is reached.

[0146] Although the control system has been described in conjunction with a specific best mode, it should be understood that many alternatives, modifications and variations will be apparent to those skilled in the art in light of the foregoing description. It is therefore intended to encompass all such alternatives, modifications and variations that fall within the scope of the included claims. All matters set forth herein or shown in the accompanying drawings are to be interpreted in an illustrative and non-restrictive sense.

Claims

1. A method of operating a manufacturing control system, comprising: detecting a status of a semiconductor manufacturing tool using a control board, the control board being communicatively coupled to the semiconductor manufacturing tool; collecting process information from the semiconductor manufacturing tool using the control panel based on a change in state or a predetermined time that has passed; as well as An automatic stop mechanism of the semiconductor manufacturing tool is engaged with the control board to prevent the semiconductor manufacturing tool from operating based on erroneous process information.

2. The method of claim 1, wherein collecting the process information comprises collecting: product counts, temperature readings, grounding readings, vibration readings, jam readings, soak time data, site map data, bag removal data, or failure data. 3 . The method of claim 1 , wherein collecting the process information comprises collecting the process information using a serial connection between the control board and the semiconductor manufacturing tool. 4 . The method of claim 1 , wherein engaging the auto-stop mechanism comprises engaging the auto-stop mechanism wired into a door interlock of the semiconductor manufacturing tool. 5 . The method of claim 1 , wherein engaging the auto-stop mechanism comprises engaging the auto-stop mechanism based on the process information exceeding a threshold value.

6. A method of operating a manufacturing control system, comprising: detecting the status using a control board communicatively coupled to the semiconductor manufacturing tool; collecting process information from the semiconductor manufacturing tool using the control panel based on a change in state or a predetermined time that has passed; storing the process information to a server using the control board, the control board being communicatively coupled to the server via a network connection; as well as An automatic stop mechanism of the semiconductor manufacturing tool is engaged to prevent the semiconductor manufacturing tool from operating based on erroneous process information.

7. The method of claim 6, further comprising sending a response from the server to the control board, the response indicating a connection status between the control board and the server.

8. The method of claim 6, further comprising collecting an index time, a number of passed products, a number of failed products, a total number of products, or a batch number from a testing machine communicatively coupled to the server.

9. The method of claim 6, wherein engaging the auto-stop mechanism comprises engaging the auto-stop mechanism based on a network service running on the server determining that the process information is erroneous.

10. The method of claim 6, further comprising determining a count of products passing through the semiconductor manufacturing tool, a count of products passing through the semiconductor manufacturing tool over time, or a count of products passing through the semiconductor manufacturing tool per congestion of a network service running on the server.

11. A manufacturing control system comprising a control board, wherein the control board is configured to: detecting a status of a semiconductor manufacturing tool using the control board, the control board being communicatively coupled to the semiconductor manufacturing tool; collecting process information from the semiconductor manufacturing tool based on a change in state or a predetermined time that has passed; as well as An automatic stop mechanism of the semiconductor manufacturing tool is engaged to prevent the semiconductor manufacturing tool from operating based on erroneous process information.

12. The system of claim 11, wherein the control board is configured to collect product counts, temperature readings, grounding readings, vibration readings, jam readings, soak time data, site map data, bag removal data, or failure data.

13. The system of claim 11, wherein the control board is configured to collect the process information via a serial connection between the control board and the semiconductor manufacturing tool.

14. The system of claim 11, wherein the control board is configured to engage the auto-stop mechanism wired into a door interlock of the semiconductor manufacturing tool.

15. The system of claim 11, wherein the control board is configured to engage the automatic stop mechanism based on the process information exceeding a threshold value.

16. The system of claim 11, wherein the control board is configured to store the process information in a server having a network connection therebetween.

17. The system of claim 16, wherein the control board is configured to receive a response from the server, the response indicating a connection status between the control board and the server.

18. The system of claim 16, wherein the control board is configured to collect the data types from the serial connection based on the control board sending queries for each of the data types, the data types comprising: Sorter box readings, sorter blockage readings, site map data, temperature readings or soak time.

19. The system of claim 16, wherein the control board is configured to engage the automatic stop mechanism based on a determination by a web service running on the server that the process information is erroneous.

20. The system of claim 16, further comprising determining a product count passing through the semiconductor manufacturing tool, a product count passing through the semiconductor manufacturing tool over time, or a product count passing through the semiconductor manufacturing tool per congestion of a network service running on the server based on the process information collected by the control board.

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