A semiconductor chip etching device

Abstract

The present invention discloses a semiconductor chip etching device, which includes a base. An etching tank is installed on the base, and an etching solution is contained in the etching tank. A filter tank capable of resetting is arranged in the etching tank. A drainage groove is provided through the bottom of the filter tank, and a filter screen is installed in the drainage groove. A detachable support plate is installed in the filter tank. A placement hole is provided through the support plate, and a support mesh is fixed to the bottom of the support plate. The support mesh blocks the placement hole. When a semiconductor chip is placed in the placement hole, it can be supported by the support mesh. A movable box capable of moving up and down is installed on the base. In the present invention, the continuous operation of the motor can perform pulsed flushing on the semiconductor chip during etching and pulsed cleaning on its surface. During the process of the semiconductor chip moving upward after etching is completed, suspended substances can be collected, and at the same time, the surface of the semiconductor chip can be air-dried and cleaned.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip etching, and particularly relates to a semiconductor chip etching device. Background Art

[0002] A semiconductor chip is a semiconductor device that can achieve a certain function by etching and wiring on a semiconductor sheet.

[0003] Currently, during the etching process, generally, the semiconductor chip is directly placed in the etching device to contact the etching solution to achieve etching. However, the semiconductor chips will sink and stack in the etching device, which will cause some semiconductor chips not to be fully etched. If the wetting solution is agitated, it will cause wear between the semiconductors.

[0004] In addition, some suspended impurities will float on the surface of the etching solution after use. If they are not cleaned in time, when the semiconductor chips are taken out of the etching device, these suspended impurities will adhere to the surface of the semiconductor chips, affecting subsequent processing. Therefore, after taking out the semiconductor chips, the semiconductor chips need to be processed again, increasing the processing steps. Moreover, the etching solution will remain on the surface of the semiconductor chips after being taken out of the etching solution. If not cleaned, it will affect the subsequent staff to take them out. If manually processed, the etching process of the semiconductor chips may need to be stopped, which will reduce the etching efficiency of the semiconductor chips. For this reason, the present application proposes a semiconductor chip etching device. Summary of the Invention

[0005] The purpose of the present invention is to solve the above technical problems and propose a semiconductor chip etching device.

[0006] To achieve the above purpose, the present invention adopts the following technical solutions:

[0007] A semiconductor chip etching device, comprising a base, an etching tank is installed on the base, an etching solution is contained in the etching tank, a filter tank capable of resetting is arranged in the etching tank, a drain groove is arranged through the bottom of the filter tank, a filter screen is installed in the drain groove, a detachable support plate is installed in the filter tank, a placement hole is arranged through the support plate, a support net is fixed to the bottom of the support plate, the support net seals the placement hole, and a semiconductor chip placed in the placement hole can be supported by the support net. A movable box capable of moving up and down is installed on the base, a sealing plate is fixed to the inner wall of the movable box, a diversion cavity is formed between the sealing plate and the movable box, a plurality of liquid supply pipes opposite to the placement holes are arranged through the sealing plate, the movable box moves down to be connected with the filter tank and drives the filter tank to sink in the etching solution, so as to etch the semiconductor chip. A pumping mechanism capable of conveying the etching solution into the movable box is installed on the movable box, the etching solution evenly flows into the placement holes through the liquid supply pipes to wash the semiconductor chip, and when the movable box and the filter tank are reset, the etching solution can be filtered and stored in the filter tank.

[0008] Preferably, four support columns are fixedly connected to the base, a mounting plate is installed on the four support columns, two electric push rods are installed on the mounting plate, a pull rod is fixed to the output end of the electric push rod, and the pull rod is fixedly connected to the upper end of the movable box.

[0009] Preferably, four guide columns are fixed in the etching tank, sliders slidably connected to the guide columns are sleeved on the four guide columns, the sliders are fixedly connected to the filter tank, springs are fixed to the bottoms of the sliders, the lower ends of the springs are fixedly connected to the inner bottom of the etching tank, and the springs are arranged outside the guide columns.

[0010] Preferably, a drain pipe is installed on the etching tank, and a control valve is installed on the drain pipe.

[0011] Preferably, a support frame is fixed to the inner wall of the etching tank, and the support plate is placed on the support frame.

[0012] Preferably, a rectangular frame is fixed to the inner wall of the movable box, and the outer wall of the rectangular frame is slidably matched with the inner wall of the filter tank.

[0013] Preferably, when the movable box abuts against the filter tank, the liquid supply pipes are arranged opposite to the placement holes.

[0014] Preferably, the pumping mechanism includes a motor and a support base installed at the upper end of the moving box. A piston cylinder is installed on the support base. A moving piston capable of reciprocating movement is slidably connected in the piston cylinder. A connecting rod is hinged to the moving piston. A shaft rod is fixed to the output end of the motor. A circular plate is fixed to the shaft rod. The connecting rod is eccentrically hinged to the upper end of the circular plate. A liquid inlet pipe and a liquid outlet pipe are installed on the piston cylinder. A first one-way valve is installed on the liquid inlet pipe. The liquid outlet pipe is communicated with the shunt chamber. A second one-way valve is installed on the liquid outlet pipe.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0016] 1. The etching solution enters the filter box through the drain groove and the filter screen and finally submerges the semiconductor chip, so that the semiconductor chip can be etched. In this way, the suspended matter generated by the last etching process and filtered by the filter screen can be backwashed, avoiding the blockage of the filter screen and affecting the discharge of the etching solution.

[0017] 2. The etching solution is discharged through the liquid supply pipe and impacts on the semiconductor chip, which can wash the semiconductor chip and make it move, so that the part in contact with the support net moves, and more effective etching treatment can be carried out on the semiconductor chip.

[0018] 3. The etching solution is discharged through the liquid supply pipe and impacts on the semiconductor chip, which can wash away the impurities generated by the etching of the semiconductor chip.

[0019] 4. When the moving box is filled with the etching solution, due to the intermittent supply of the etching solution into the shunt chamber, the pressure in the shunt chamber increases intermittently. In this way, the liquid supply pipe discharges in a pulsed manner, and then the etching solution impacts on the semiconductor chip in a pulsed manner, making the semiconductor chip vibrate more effectively by impact, which is beneficial to the etching and cleaning of the semiconductor chip.

[0020] 5. Air is conveyed into the shunt chamber, so that the pressure in the shunt chamber can be increased, and the discharge of the etching solution through the liquid supply pipe can be accelerated. In this way, the fast-discharged etching solution will drive the suspended matter to be discharged through the liquid supply pipe, and it is not easy to stay in the shunt chamber, avoiding accumulation in the shunt chamber.

[0021] 6. The etching solution falls on the semiconductor chip. Due to the fast flow of the etching solution, the suspended matter is not easy to fall on the semiconductor chip.

[0022] 7. Air is discharged through the liquid supply pipe in a pulsed manner and blown onto the semiconductor chip, which can air-dry the semiconductor chip and quickly remove the etching solution on the surface, so that the staff can take the semiconductor chip.

[0023] 8. It can effectively avoid the disadvantages that the semiconductor chips are stacked and cannot be effectively etched, and the semiconductor chips are collided and scratched.

[0024] 9. The motor works continuously. During the etching process of the semiconductor chip, it can flush and move the semiconductor chip, so as to perform a more comprehensive etching treatment on the semiconductor chip. At the same time, it can flush and clean the impurities generated by the etching of the semiconductor chip, so as to better etch the semiconductor chip. When the semiconductor chip leaves the etching solution, the suspended matter floating on the etching solution can be discharged, filtered and collected, and the suspended matter can be prevented from remaining on the semiconductor chip. When the semiconductor chip leaves the etching solution, the residual etching solution on the semiconductor chip can be cleaned, so that the staff can take it. The whole process is smooth, and the suspended matter can be collected and processed during the etching process of the semiconductor chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic structural diagram of an etching device for a semiconductor chip proposed by the present invention;

[0026] Figure 2 It is a front view schematic diagram of a piston cylinder in an etching device for a semiconductor chip proposed by the present invention;

[0027] Figure 3 It is a rear view schematic diagram of a piston cylinder in an etching device for a semiconductor chip proposed by the present invention;

[0028] Figure 4 It is a schematic structural diagram of an etching tank in an etching device for a semiconductor chip proposed by the present invention;

[0029] Figure 5 It is a schematic structural diagram of a spring in an etching device for a semiconductor chip proposed by the present invention;

[0030] Figure 6 It is a cross-sectional view of a moving box in an etching device for a semiconductor chip proposed by the present invention;

[0031] Figure 7 It is a schematic structural diagram of a filter screen in an etching device for a semiconductor chip proposed by the present invention;

[0032] Figure 8 It is a bottom view of an etching device for a semiconductor chip proposed by the present invention.

[0033] In the figure: 1 base, 2 support column, 3 mounting plate, 4 electric push rod, 5 moving box, 6 pull rod, 7 etching tank, 8 drain pipe, 9 motor, 10 shaft rod, 11 circular plate, 12 moving piston, 13 support seat, 14 piston cylinder, 15 rectangular frame, 16 first one-way valve, 17 second one-way valve, 18 liquid inlet pipe, 19 liquid outlet pipe, 20 filter box, 21 support plate, 22 slider, 23 spring, 24 guide post, 25 support frame, 26 drain groove, 27 filter screen, 28 sealing plate, 29 liquid supply pipe, 30 shunt cavity, 31 connecting rod, 32 placement hole. Specific embodiments

[0034] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0035] Refer to Figures 1 - 8 , a semiconductor chip etching device, including a base 1, an etching tank 7 is installed on the base 1, the etching tank 7 is filled with an etching solution, a drain pipe 8 is installed on the etching tank 7, and a control valve is installed on the drain pipe 8. Opening the control valve can discharge the etching solution in the etching tank 7 for replacement.

[0036] A filter box 20 capable of resetting is provided in the etching tank 7. Four guide posts 24 are fixed in the etching tank 7. Sliders 22 slidably connected to the guide posts 24 are sleeved on the four guide posts 24. The sliders 22 are fixedly connected to the filter box 20. A spring 23 is fixed to the bottom of the slider 22, and the lower end of the spring 23 is fixedly connected to the inner bottom of the etching tank 7. The spring 23 is sleeved outside the guide post 24. The slider 22 and the filter box 20 can be supported by the spring 23. Initially, the filter box 20 is located above the etching solution.

[0037] A drain groove 26 is provided through the bottom of the filter box 20, a filter screen 27 is installed in the drain groove 26, a support plate 21 that can be disassembled is installed in the filter box 20, a support frame 25 is fixed to the inner wall of the etching tank 7, and the support plate 21 is placed on the support frame 25. The support frame 25 can support the support plate 21, so as to ensure its stability when placed in the filter box 20. The support plate 21 can be taken out by pulling it up.

[0038] A placement hole 32 is provided through the support plate 21, and the inner diameter of the placement hole 32 is greater than the diameter of the semiconductor chip; a support net is fixed to the bottom of the support plate 21, and the support net blocks the placement hole 32. Placing a semiconductor chip in the placement hole 32 can be supported by the support net. The support net is provided not only to support the semiconductor chip, but also to enable the etching solution to pass through the placement hole 32 and be discharged.

[0039] A movable box 5 capable of moving up and down is installed on a base 1. Four support columns 2 are fixedly connected to the base 1. An installation plate 3 is installed on the four support columns 2. Two electric push rods 4 are installed on the installation plate 3. A pull rod 6 is fixed to the output end of the electric push rod 4. The pull rod 6 is fixedly connected to the upper end of the movable box 5. The movement of the output end of the electric push rod 4 drives the pull rod 6 to move, so that you can realize the up and down movement of the movable box 5.

[0040] A sealing plate 28 is fixed to the inner wall of the movable box 5. A diversion cavity 30 is formed between the sealing plate 28 and the movable box 5. A plurality of liquid supply pipes 29 opposite to the placement holes 32 are penetrated through the sealing plate 28. When the movable box 5 abuts against the filter box 20, the liquid supply pipes 29 are arranged opposite to the placement holes 32, so that the etching liquid can impact more effectively and concentratedly on the semiconductor chip.

[0041] The movable box 5 moves down to be connected to the filter box 20 and drives the filter box 20 to sink into the etching liquid, so as to etch the semiconductor chip. A pumping mechanism capable of transporting the etching liquid into the movable box 5 is installed on the movable box 5. The etching liquid flows evenly into the placement holes 32 through the liquid supply pipes 29 to wash the semiconductor chip. When the movable box 5 and the filter box 20 are reset, the etching liquid can be filtered and stored in the filter box 20.

[0042] Explanation of the pumping mechanism: The pumping mechanism includes a motor 9 installed at the upper end of the movable box 5 and a support seat 13. A piston cylinder 14 is installed on the support seat 13. A movable piston 12 capable of reciprocating movement is slidably connected in the piston cylinder 14. A connecting rod 31 is hinged to the movable piston 12. A shaft rod 10 is fixed to the output end of the motor 9. A circular plate 11 is fixed to the shaft rod 10. The connecting rod 31 is eccentrically hinged to the upper end of the circular plate 11. An inlet pipe 18 and an outlet pipe 19 are installed on the piston cylinder 14. A first one-way valve 16 is installed on the inlet pipe 18. Among them, the first one-way valve 16 only allows the etching liquid to enter the piston cylinder 14 through the inlet pipe 18; the outlet pipe 19 is communicated with the diversion cavity 30. A second one-way valve 17 is installed on the outlet pipe 19. The second one-way valve 17 only allows the etching liquid to be transported from the piston cylinder 14 into the outlet pipe 19.

[0043] During use, the staff places the semiconductor chip in the placement hole 23, and then places the entire support plate 21 in the filter box 20 and abuts against the support frame 25. At this time, the filter box 20 is located above the etching liquid; then the electric push rod 4 is started. The electric push rod 4 drives the movable box 5 to move down. As the movable box 5 moves down, the rectangular frame 15 slides in the filter box 20. Finally, the movable box 5 abuts against the filter box 20. As the output end of the electric push rod 4 moves down, the movable box 5 drives the filter box 20 to move down. Finally, the filter box 20 is located in the etching liquid, and at this time the inlet pipe 18 enters the etching liquid;

[0044] The etching solution enters the filtration box 20 through the drain tank 26 and the filter screen 27 and finally submerges the semiconductor chip, enabling the etching treatment of the semiconductor chip. In this way, the suspended matter generated by the filtration of the filter screen 27 during the previous etching treatment can be backflushed to prevent the filter screen 27 from being blocked and affecting the discharge of the etching solution;

[0045] Start the motor 9. The operation of the motor 9 drives the shaft rod 10 to rotate. The rotation of the shaft rod 10 drives the circular plate 11 to rotate. The rotation of the circular plate 11 drives the connecting rod 31 to move. The movement of the connecting rod 31 drives the moving piston 12 to reciprocate in the piston cylinder 14. When the moving piston 12 moves close to the motor 9, it can suck the etching solution into the piston cylinder 14 through the liquid inlet pipe 18. When the moving piston 12 moves away from the motor 9, it can transport the etching solution in the piston cylinder 14 to the shunt cavity 30. In this way, the continuous movement of the moving piston 12 can transport the etching solution to the shunt cavity 30. The etching solution is discharged through the liquid supply pipe 29 and impacts on the semiconductor chip. It can not only wash the semiconductor chip to make it move, causing the part in contact with the support net to move, and enabling more effective etching treatment of the semiconductor chip; at the same time, it can wash away the impurities generated by the etching of the semiconductor chip;

[0046] When the moving box 5 is filled with the etching solution, due to the intermittent supply of the etching solution to the shunt cavity 30, the pressure in the shunt cavity 30 increases intermittently. In this way, the liquid supply pipe 29 discharges in a pulsed manner, and then the etching solution impacts the semiconductor chip in a pulsed manner, making the semiconductor chip vibrate more effectively by impact, which is beneficial to the etching and cleaning of the semiconductor chip;

[0047] Part of the impurities generated by the etching of the semiconductor chip enter the filtration box 20 through the support net. Since the impurities will float on the liquid surface of the etching solution and the moving box 5 is continuously supplied with the etching solution, part of the impurities will enter the moving box 5;

[0048] After the etching work is completed, the electric push rod 4 drives the moving box 5 to reset. At this time, the motor 9 is still working. As the moving box 5 resets, the liquid inlet pipe 18 is separated from the etching solution at this time. Under the action of the spring 23, the slider 22 and the filtration box 20 are reset. At this time, the moving piston 12 moves, and air enters the piston cylinder 14 through the liquid inlet pipe 18 and then is transported to the shunt cavity 30. In this way, the pressure in the shunt cavity 30 can be increased, and the discharge of the etching solution through the liquid supply pipe 29 can be accelerated. The rapidly discharged etching solution will drive the suspended matter to be discharged through the liquid supply pipe 29 and is not likely to remain in the shunt cavity 30; the etching solution falls on the semiconductor chip. Since the etching solution flows rapidly, the suspended matter is not likely to fall on the semiconductor chip, but there may be some suspended matter that will fall on the semiconductor chip;

[0049] Since air is conveyed into the shunt chamber 30 at this time, the air is discharged pulsatively through the liquid supply pipe 29 and blown onto the semiconductor chip, so that the semiconductor chip can be air-dried and the etching solution on the surface can be quickly removed, facilitating the staff to take the semiconductor chip. The support plate 21 can be removed as a whole, or the semiconductor chip can be taken out separately;

[0050] Since the used etching solution falls into the filter box 20, the finally filtered etching solution flows back into the etching tank 7 again, which can be recycled and there are no suspended substances in the etching solution; after using for a period of time, the support plate 21 can be removed to clean the filter screen 27;

[0051] In this way, the disadvantages that the semiconductor chips cannot be effectively etched due to stacking and the semiconductor chips are scratched by collision can be effectively avoided;

[0052] Remove the semiconductor chip and place the semiconductor chip to be processed, and repeat the above work;

[0053] In summary, the motor 9 works continuously, and can wash and move the semiconductor chip during the etching process of the semiconductor chip, so that the semiconductor chip can be etched more comprehensively. At the same time, the impurities generated by the etching of the semiconductor chip can be washed and cleaned to better etch the semiconductor chip; when the semiconductor chip leaves the etching solution, the suspended substances floating on the etching solution can be discharged, filtered and collected, and the suspended substances can be prevented from remaining on the semiconductor chip. The residual etching solution on the semiconductor chip can also be cleaned to facilitate the staff to take it. The whole process is smooth, and the suspended substances can be collected and processed during the etching process of the semiconductor chip.

[0054] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent replacements or changes, and should be covered by the protection scope of the present invention.

Claims

1. A semiconductor chip etching device, comprising a base (1), characterized in that, An etching box (7) is installed on the base (1), and etching liquid is contained in the etching box (7). A filter box (20) that can be reset is provided in the etching box (7), a drainage groove (26) is provided through the bottom of the filter box (20), a filter screen (27) is installed in the drainage groove (26), and a detachable support plate (21) is installed in the filter box (20), a placement hole (32) is provided through the support plate (21), and a support net is fixed to the bottom of the support plate (21), and the support net seals the placement hole (32). The semiconductor chip is placed in the placement hole (32) and can be supported by the support net. A movable box (5) capable of moving up and down is installed on the base (1). A sealing plate (28) is fixed to the inner wall of the movable box (5). A diversion cavity (30) is formed between the sealing plate (28) and the movable box (5). A plurality of liquid supply pipes (29) opposite to the placement hole (32) are provided through the sealing plate (28). The movable box (5) moves downward to connect with the filter box (20) and drives the filter box (20) to sink into the etching liquid, so that the semiconductor chip can be etched. The movable box (5) is provided with a pumping mechanism capable of conveying the etching liquid into the movable box (5), the pumping mechanism comprising a piston cylinder (14) installed at the upper end of the movable box (5), a liquid inlet pipe (18) and a liquid outlet pipe (19) installed on the piston cylinder (14), the liquid inlet pipe (18) enters the etching liquid, and the etching liquid is sucked into the piston cylinder (14) through the liquid inlet pipe (18); a movable piston (12) capable of reciprocating movement is slidably connected in the piston cylinder (14), and the liquid outlet pipe (19) is connected to the diversion chamber (30). The movable piston (12) continuously moves to transport the etching liquid to the diversion chamber (30) through the liquid outlet pipe (19), and the etching liquid is discharged through the liquid supply pipe (29) and impacts the semiconductor chip. When the movable box (5) and the filter box (20) are in contact with each other, the liquid supply pipe (29) and the placement hole (32) are arranged opposite to each other, and the etching liquid flows into the placement hole (32) through the liquid supply pipe (29) to flush the semiconductor chip. When the movable box (5) and the filter box (20) are reset, the etching liquid can be filtered and stored in the filter box (20).

2. The semiconductor chip etching device according to claim 1, wherein Four support columns (2) are fixedly connected to the base (1), a mounting plate (3) is installed on the four support columns (2), two electric push rods (4) are installed on the mounting plate (3), a pull rod (6) is fixed to the output end of the electric push rod (4), and the pull rod (6) is fixedly connected to the upper end of the moving box (5).

3. A semiconductor chip etching device according to claim 1, characterized in that, Four guide columns (24) are fixed in the etching box (7). The four guide columns (24) are each sleeved with a slider (22) slidably connected thereto. The slider (22) is fixedly connected to the filter box (20). A spring (23) is fixed to the bottom of the slider (22). The lower end of the spring (23) is fixedly connected to the inner bottom of the etching box (7). The spring (23) is sleeved on the outside of the guide column (24).

4. A semiconductor chip etching device according to claim 1, wherein, A drain pipe (8) is installed on the etching tank (7), and a control valve is installed on the drain pipe (8).

5. A semiconductor chip etching device according to claim 1, characterized in that, A support frame (25) is fixed to the inner wall of the etching tank (7), and the support plate (21) is placed on the support frame (25).

6. The semiconductor chip etching device according to claim 1, wherein, A rectangular frame (15) is fixed to the inner wall of the moving box (5), and the outer wall of the rectangular frame (15) is slidably matched with the inner wall of the filter box (20).

7. The semiconductor chip etching device according to claim 1, wherein, A motor (9) and a support seat (13) are installed at the upper end of the moving box (5), the piston cylinder (14) is installed on the support seat (13), a connecting rod (31) is hinged to the moving piston (12), a shaft rod (10) is fixed to the output end of the motor (9), a circular plate (11) is fixed to the shaft rod (10), the connecting rod (31) is eccentrically hinged to the upper end of the circular plate (11), a first one-way valve (16) is installed on the liquid inlet pipe (18), and a second one-way valve (17) is installed on the liquid outlet pipe (19).

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