Micro LED intelligent detection device

Abstract

The invention relates to a Micro LED intelligent detection device comprising an outer frame of a U-shaped structure; the conveying assembly is mounted at the lower end in the outer frame; the packaging assembly is mounted in the middle of the interior of the outer frame; the detection assembly is installed at the upper end of the interior of the outer frame and used for detecting the Micro LED packaged by the packaging assembly; the driving assembly is mounted on the front side wall of the outer frame; according to the invention, the chip conveyed by the conveying assembly is packaged through the packaging assembly, the rapid, accurate and stable packaging process of the chip can be realized, and the detection assembly can carry out material taking and 180-degree overturning on the packaging body, so that a metal substrate on the outer side of the overturned packaging body can be accurately matched with a detection base, and the detection efficiency is improved. Whether the chip is lighted or not and the brightness of the chip can be detected by electrifying the packaging body, and whether the chip has cracks and is damaged or not can be detected by photographing the packaging body, so that the accuracy and consistency of detection are improved.

Description

Technical Field

[0001] The present application relates to the field of Micro LED detection technology, and in particular to a Micro LED intelligent detection device. Background Art

[0002] Micro LED technology is an emerging display technology. It uses Micro LEDs as pixels, each of which can independently control brightness and color, achieving extremely high contrast, faster response speed, and a wider color gamut. Due to the extremely small size and small number of Micro LEDs, traditional inspection methods often cannot meet the requirements of high efficiency and accuracy. Therefore, batch intelligent inspection of Micro LEDs is particularly important.

[0003] The Chinese patent publication number is CN 115555269 A, and the name is "A Micro LED Detection and Grading Device". It has a Y-axis guide rail on the inspection table, and a movable dot screen fixture is set on the Y-axis guide rail. The ranging detection module, Gamma detection module, API detection module and Demura detection module are installed on the inspection table in sequence along the Y-axis guide rail. The loading and unloading robot places the Micro LED to be inspected on the dot screen fixture after alignment by the CCD alignment mechanism. The dot screen fixture moves along the Y-axis guide rail according to the set distance, and pauses every time it reaches a detection module. The corresponding detection module detects the Micro LED. When all detections are completed, the dot screen fixture returns to its initial position, the loading and unloading robot takes out the Micro LED that has completed the inspection, and puts in the next Micro LED to be inspected, and transports the Micro LED that has completed the inspection to the transfer table.

[0004] The prior art of the above patent can also realize the detection of Micro LED, but on the one hand, when the above prior art detects the chip, although it sets multiple detection units along the X-axis direction, it can only detect a single chip at a time, and Micro LED is at a trace level, and detecting a single chip is not only inefficient but also costly; on the other hand, when the above prior art detects the chip, it can only detect the appearance of the chip, and cannot perform electrical detection on the chip, and thus cannot accurately determine whether the chip is lit and the brightness of the chip. The detection dimension of the chip is insufficient, and the chip needs to be electrically detected again, which increases the cumbersomeness of subsequent chip detection; based on this, there is still room for improvement on the basis of the existing Micro LED intelligent detection equipment. Summary of the Invention

[0005] In order to accurately perform appearance and electrical inspection on Micro LEDs, the present application provides a Micro LED intelligent inspection device.

[0006] The present application provides a Micro LED intelligent detection device that adopts the following technical solutions:

[0007] A Micro LED intelligent detection device includes: an outer frame with a U-shaped structure; a conveying component, which is installed at the lower end of the inner part of the outer frame, and the conveying component is used to drive the Micro LED to be transported at a uniform speed; a packaging component, which is installed in the middle of the inner part of the outer frame, and the packaging component is located above the right side of the conveying component, and the packaging component is used to pick up and package the Micro LEDs transported at a uniform speed on the conveying component; a detection component, which is installed at the upper end of the inner part of the outer frame, and the detection component is used to detect the Micro LEDs packaged by the packaging component; a driving component, which is installed on the front side wall of the outer frame, and the driving component is used to drive the packaging component and the detection component to operate.

[0008] The detection component includes a detection shaft, a pressing mechanism, a detection mechanism, a photographing mechanism and a fixed sleeve. The fixed sleeves are respectively installed on the front and rear side walls of the outer frame. The detection shaft is installed between the two fixed sleeves through a bearing. The detection shaft is a hollow cylinder. The detection shaft is evenly provided with detection grooves along its circumference. The detection mechanism is installed in the detection groove. A pressing mechanism is provided inside the detection shaft. The pressing mechanism is fixedly installed on the outer frame. The photographing mechanism is arranged at the top of the outer frame, and the photographing mechanism is arranged above the detection shaft.

[0009] Furthermore, the packaging assembly includes a packaging shaft, an extrusion rod, an adsorption mechanism, a glue injection mechanism and a fixed sleeve. A fixed sleeve is respectively installed on both side walls of the outer frame. A packaging shaft is installed between the two fixed sleeves through a bearing. The packaging shaft is a hollow cylinder. Adsorption grooves are evenly opened on the packaging shaft along its circumference. The adsorption mechanism is installed in the adsorption groove. An extrusion rod is provided through the inside of the packaging shaft. The extrusion rod is fixedly installed on the outer frame. The extrusion rod is a cylindrical mechanism. Arc-shaped protrusions that cooperate with the adsorption mechanism are respectively provided on the upper and lower sides of the extrusion rod. The glue injection mechanism is installed on the outer frame. The center of the glue injection mechanism is on the same horizontal plane as the axis center of the packaging shaft. The glue injection mechanism cooperates with the adsorption mechanism.

[0010] Furthermore, the adsorption mechanism includes an adsorption cover, an adsorption plate, a limiting plate, a pushing rod and a spring. The adsorption cover is installed inside the adsorption groove. A pushing groove for connecting the adsorption groove with the inside of the packaging shaft is provided on the packaging shaft. The pushing rod is slidingly arranged inside the pushing groove. The inner side of the pushing rod cooperates with the arc-shaped protrusion on the extrusion rod. An adsorption plate is installed on the outer side of the pushing rod. Adsorption holes for adsorbing Micro LEDs are evenly arranged on the adsorption plate. The limiting plates are provided on both side walls of the adsorption cover, and the spring is provided on the pushing rod.

[0011] Furthermore, the glue injection mechanism includes a fixed plate, a glue injection bracket, a power push rod and a glue injection plate. The fixed plate is fixedly installed on the two side walls of the outer frame. The glue injection bracket is evenly arranged on the right side of the fixed plate. The glue injection bracket is a hollow barrel structure. A power push rod is arranged inside the glue injection bracket, and the glue injection plate is arranged at the top of the power push rod.

[0012] Furthermore, the pressing mechanism includes a fixed plate, an electric push rod and a push plate. The fixed plate is fixedly mounted on the outer frame, the electric push rods are evenly mounted on the lower end of the fixed plate, and the push plate is provided at the lower end of the electric push rod.

[0013] Furthermore, the detection mechanism includes a detection cover, a detection frame, a pushing frame, a reset spring, a flip unit and a detection base. The detection cover is installed inside the detection groove. The bottom of the detection cover is symmetrically provided with a pushing groove. The pushing frame is slidably arranged in the pushing groove. The pushing frame has a U-shaped structure. A reset spring is installed between the inner side of the pushing frame and the detection cover. The detection frame is installed on the outer side of the pushing frame. The flip unit is installed on the inner wall of the detection cover. The detection frame is connected to the flip unit. The detection base is installed on the inner side of the detection cover.

[0014] Furthermore, the detection frame includes a support plate, a detection plate, a piston frame and a rotating shaft. The support plate is a rectangular hollow structure. The rotating shafts are installed on both sides of the support plate. The rotating shafts are connected to the ends of the push frame through bearings. The piston frames are evenly installed on the inner sides of the support plate. The detection plates are installed between the inner sides of the piston frames. The detection plates are hollow structures. Detection holes are evenly arranged on the outer side of the detection plates. The hollow structure of the detection plate is connected to the detection holes and the inside of the piston frame.

[0015] Furthermore, the flipping unit includes a flipping gear, a rack plate and a limit block. A flipping groove is provided on one side of the inner wall of the detection cover, a flipping gear is provided in the flipping groove, the flipping gear is connected to the rotating shaft on one side of the support plate, a rack plate meshing with the flipping gear is provided on the inner wall of the flipping groove, a limiting groove is provided on the other side of the inner wall of the detection cover, a limiting block is slidably provided in the limiting groove, and the limit block is installed on the rotating shaft on the other side of the support plate.

[0016] Furthermore, the limiting groove includes rectangular groove one and rectangular groove two, rectangular groove two is symmetrically arranged at both ends of rectangular groove one, the limiting block has an arc-shaped structure, the outer circle diameter of the limiting block is smaller than the width of rectangular groove one, and the width of the limiting block is smaller than the width of rectangular groove two, and the limiting block is gap-matched with rectangular groove two.

[0017] Furthermore, the driving assembly includes a driving motor, a driving gear, a packaging gear, a detection gear and a driving shaft. The driving shaft is installed on the front side wall of the outer frame through a bearing. The driving motor is fixedly installed on one end of the driving shaft. The driving motor is fixedly installed on the front side wall of the outer frame. The driving gear is installed on the other end of the driving shaft. The packaging gear is installed on the packaging shaft. The detection gear is installed on the detection shaft. The driving gear is meshed with the packaging gear and the detection gear respectively.

[0018] In the above technical solution, the present invention provides a Micro LED intelligent detection device. The present invention uses a packaging component to package the chips conveyed by the conveying component, which can realize a fast, accurate and stable packaging process of the chip, so that multiple single chips can form a package body that is easy to detect. The multiple single chips can be one or more groups of R-type, G-type, and B-type chips. The chips are accurately packaged on the metal substrate. The detection component can take the material from the package body and flip it 180°, so that the metal substrate on the outside of the flipped package body can accurately match the detection base. The detection component can detect the package body that has been completed, including electrical and appearance quality detection. By powering on the package body, it is possible to detect whether the chip is lit and the brightness of the chip. Moreover, by taking pictures of the package body, it is possible to detect whether the chip has cracks or damage, thereby reducing manual intervention and improving the accuracy and consistency of detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below with reference to the accompanying drawings and examples.

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of this application.

[0021] Figure 2 This is the first cross-sectional structural diagram of this application.

[0022] Figure 3 This is a second cross-sectional structural diagram of the present application.

[0023] Figure 4 It is a schematic diagram of the cross-sectional structure of this application.

[0024] Figure 5 It is a schematic diagram of the cross-sectional structure of the packaging component of this application.

[0025] Figure 6 It is a schematic diagram of the cross-sectional structure of the adsorption mechanism of the present application.

[0026] Figure 7 It is a schematic cross-sectional view of the glue injection mechanism of the present application.

[0027] Figure 8 It is a schematic diagram of the cross-sectional structure of the detection component of this application.

[0028] Figure 9 It is a schematic diagram of the cross-sectional structure of the first detection mechanism of this application.

[0029] Figure 10 It is a schematic diagram of the cross-sectional structure of the second detection mechanism of this application.

[0030] Figure 11 It is a schematic diagram of the cross-sectional structure of the third detection mechanism of this application.

[0031] Figure 12 It is a schematic diagram of the cross-sectional structure of the pressing mechanism of the present application.

[0032] Figure 13 It is a schematic diagram of the planar structure between the detection cover, rectangular slot 1, rectangular slot 2, rotating shaft and limit block of the present application.

[0033] Explanation of the reference numerals: 1. outer frame; 2. conveying assembly; 21. bracket; 22. conveyor belt; 3. packaging assembly; 31. packaging shaft; 32. extrusion rod; 33. adsorption mechanism; 331. adsorption cover; 332. adsorption plate; 333. limit plate; 334. push rod; 335. spring; 34. glue injection mechanism; 341. fixed plate; 342. glue injection bracket; 343. power push rod; 344. glue injection plate; 35. fixed sleeve; 4. detection assembly; 41. detection shaft; 42. pressing mechanism; 421. fixed plate; 422. electric push rod; 423. push plate; 43. detection Testing mechanism; 431, testing cover; 432, testing frame; 4321, supporting plate; 4322, testing plate; 4323, piston frame; 4324, rotating shaft; 433, pushing frame; 434, reset spring; 435, flip unit; 4351, flip gear; 4352, rack plate; 4353, limit block; 4354, rectangular slot one; 4355, rectangular slot two; 436, testing base; 44, photographing mechanism; 45, fixed sleeve two; 5, driving assembly; 51, driving motor; 52, driving gear; 53, packaging gear; 54, testing gear; 55, driving shaft. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0035] See also Figure 1A Micro LED intelligent detection device provided in an embodiment of the present invention includes an outer frame 1, which has a U-shaped structure; a conveying component 2, which is installed at the lower end of the inner part of the outer frame 1, and the conveying component 2 is used to drive the Micro LED to be transported at a uniform speed; a packaging component 3, which is installed in the middle of the inner part of the outer frame 1, and the packaging component 3 is located above the right side of the conveying component 2, and the packaging component 3 is used to take and package the Micro LED transported at a uniform speed on the conveying component 2; a detection component 4, which is installed at the upper end of the inner part of the outer frame 1, and the detection component 4 is used to detect the Micro LED packaged by the packaging component 2; a driving component 5, which is installed on the front side wall of the outer frame 1, and the driving component 5 is used to drive the packaging component 3 and the detection component 4 to operate.

[0036] In the above technical solution, a glass substrate adhered to a metal base is fed into the interior of the packaging component 3. The packaging component 3 first adsorbs and fixes the glass substrate. When the glass substrate moves above the conveying component 2, the packaging component 3 drives the glass substrate downward to pick up the chip. Afterwards, the packaging component 3 injects glue and packages the outer side of the metal substrate adhered to the chip. The detection component 4 picks up and detects the chip packaged by the packaging component 3. The driving component 5 is used to drive the packaging component 3 and the detection component 4 to operate. The driving component 5 is used to drive the packaging component 3 and the detection component 4 to rotate synchronously.

[0037] See Figure 4 As shown, as a preferred technical solution of this embodiment, the conveying assembly 2 includes a bracket 21 and a conveyor belt 22 . The bracket 21 is installed at the lower part of the outer frame 1 , and the conveyor belt 22 is evenly arranged on the bracket 21 .

[0038] In the above technical solution, the unpackaged chip is transported at a constant speed by the conveyor belt 22. When the chip is transported to the bottom of the packaging component 3, the packaging component 3 adheres to the chip and takes the material.

[0039] See Figure 5As shown, as the preferred technical solution of this embodiment, the packaging component 3 includes a packaging shaft 31, an extrusion rod 32, an adsorption mechanism 33, a glue injection mechanism 34 and a fixed sleeve 35. Fixed sleeves 35 are respectively installed on both side walls of the outer frame 1, and the packaging shaft 31 is installed between the two fixed sleeves 35 through a bearing. The packaging shaft 31 is a hollow cylinder, and adsorption grooves are evenly opened on the packaging shaft 31 along its circumference. The adsorption mechanism 33 is installed in the adsorption groove. An extrusion rod 32 is provided through the inside of the packaging shaft 31, and the extrusion rod 32 is fixedly installed on the outer frame 1. The extrusion rod 32 is a cylindrical mechanism, and arc-shaped protrusions cooperating with the adsorption mechanism 33 are respectively provided on the upper and lower sides of the extrusion rod 32. The glue injection mechanism 33 is installed on the outer frame 1, and the center of the glue injection mechanism 33 is on the same horizontal plane as the axis of the packaging shaft 31. The glue injection mechanism 33 cooperates with the adsorption mechanism 33.

[0040] In the above technical solution, during the rotation of the packaging shaft 31, when the suction mechanism 33 moves to the right side of the packaging shaft 31, the staff will place the glass substrate with the metal base adhered to it into the suction mechanism 33. The suction mechanism 33 can suction and fix the glass substrate. When the suction mechanism 33 moves to the bottom of the packaging shaft 31, the suction mechanism 33 is ejected by the arc-shaped protrusion on the squeezing rod 32, and the metal base on the suction mechanism 33 adheres to the chip conveyed by the conveying assembly 2. When the suction mechanism 33 moves to the left side of the packaging shaft 31, the glue injection mechanism 34 injects glue into the metal base with the chip adhered to it, so that the metal base with the chip adhered to it and the glue form a package. As the suction mechanism 33 moves from the left side to the top, the adhesion between the metal base and the glass substrate is reduced by heating. When the suction mechanism 33 moves to the top of the packaging shaft 31, the suction mechanism 33 is also ejected by the arc-shaped protrusion on the squeezing rod 32. The inspection assembly 4 moves downward to pick up the package. The metal base moves synchronously with the package into the inspection assembly 4, and the glass substrate continues to remain on the suction mechanism 33.

[0041] Continue reading Figure 6 As shown, as the preferred technical solution of this embodiment, the adsorption mechanism 33 includes an adsorption cover 331, an adsorption plate 332, a limiting plate 333, a pushing rod 334 and a spring 335. The adsorption cover 331 is installed inside the adsorption groove, and the packaging shaft 31 is provided with a pushing groove for connecting the adsorption groove with the inside of the packaging shaft 31. The pushing rod 334 is slidably arranged inside the pushing groove. The inner side of the pushing rod 334 cooperates with the arc-shaped protrusion on the extrusion rod 32. The outer side of the pushing rod 334 is installed with an adsorption plate 332. The adsorption plate 332 is evenly arranged with adsorption holes for adsorbing Micro LEDs. The limiting plate 333 is provided on the two side walls of the adsorption cover 331, and the spring 335 is provided on the pushing rod 334.

[0042] In the above technical solution, the adsorption plate 332 adsorbs and fixes the glass substrate adhered to the metal base by negative pressure adsorption. When the packaging shaft 31 drives the push rod 334 to move and contact the arc-shaped protrusion, the arc-shaped protrusion will drive the push rod 334 to move outward, so that the adsorption plate 332 can move synchronously, which is convenient for the glass substrate on the adsorption plate 332 to take the chip and eject the package body after injection of glue. The spring 335 plays a buffering and resetting role.

[0043] Continue reading Figure 7 As shown, as the preferred technical solution of this embodiment, the glue injection mechanism 34 includes a fixed plate 341, a glue injection bracket 342, a power push rod 343 and a glue injection plate 344. The fixed plate 341 is fixedly installed on the two side walls of the outer frame 1, and the glue injection bracket 342 is evenly arranged on the right side of the fixed plate 341. The glue injection bracket 342 is a hollow barrel structure. The power push rod 343 is arranged inside the glue injection bracket 342, and the glue injection plate 344 is arranged at the top of the power push rod 343.

[0044] In the above technical solution, the number and position of the glue injection bracket 342 correspond to the adsorption mechanism 33 on one side of the packaging shaft 31. When the adsorption mechanism 33 moves to the left side of the packaging shaft 31, a glue injection cavity is provided on the glue injection plate 344, and a liquid injection port connected to the glue injection cavity is provided on the outer side of the glue injection plate 344. The power push rod 343 arranged inside the glue injection bracket 342 pushes the glue injection plate 344 to the right, and a closed space is formed between the glue injection cavity on the glue injection plate 344 and the metal base. The glue is injected into the closed space through the liquid injection port. The metal base with the chip adhered is encapsulated with the glue to form a package body, which is convenient for chip detection.

[0045] Continue reading Figure 8 As shown, as the preferred technical solution of this embodiment, the detection component 4 includes a detection shaft 41, a pressing mechanism 42, a detection mechanism 43, a photographing mechanism 44 and a fixed sleeve 2 45. The fixed sleeve 2 45 is respectively installed on the front and rear side walls of the outer frame 1, and the detection shaft 41 is installed between the two fixed sleeves 2 45 through a bearing. The detection shaft 41 is a hollow cylinder, and detection grooves are evenly opened on the detection shaft 41 along its circumference. The detection mechanism 43 is installed in the detection groove. A pressing mechanism 42 is provided through the inside of the detection shaft 41, and the pressing mechanism 42 is fixedly installed on the outer frame 1. The photographing mechanism 44 is arranged at the top of the outer frame 1, and the photographing mechanism 44 is arranged above the detection shaft 41.

[0046] In the above technical solution, during the rotation of the detection shaft 41, when the detection mechanism 43 runs above the adsorption mechanism 33, the detection mechanism 43 moves downward to adsorb the package and take the material. When the detection mechanism 43 runs above the detection shaft 41, the photographing mechanism 44 will detect the package on the detection mechanism 43.

[0047] See Figure 12 As shown, as the preferred technical solution of this embodiment, the pressing mechanism 42 includes a fixed plate 421, an electric push rod 422 and a push plate 423. The fixed plate 421 is fixedly installed on the outer frame 1, and the electric push rod 422 is evenly installed on the lower end of the fixed plate 421, and the push plate 423 is provided at the lower end of the electric push rod 422.

[0048] In the above technical solution, when the detection mechanism 43 moves above the adsorption mechanism 33, the electric push rod 422 drives the push plate 423 to move downward, and the push plate 423 pushes the detection mechanism 43 to move outward, and the detection mechanism 43 adsorbs and takes materials from the package on the adsorption mechanism 33.

[0049] See Figure 9-11 As shown, as the preferred technical solution of this embodiment, the detection mechanism 43 includes a detection cover 431, a detection frame 432, a pushing frame 433, a reset spring 434, a flip unit 435 and a detection base 436. The detection cover 431 is installed inside the detection groove. The bottom of the detection cover 431 is symmetrically provided with a push groove. The pushing frame 433 is slidably set in the push groove. The pushing frame 433 is U-shaped. A reset spring 434 is installed between the inner side of the pushing frame 433 and the detection cover 431. The detection frame 432 is installed on the outer side of the pushing frame 433. A flip unit 435 is installed on the inner wall of the detection cover 431. The detection frame 432 is connected to the flip unit 435. A detection base 436 is installed on the inner side of the detection cover 431.

[0050] In the above technical solution, when the detection frame 432 adsorbs the package on the adsorption mechanism 33, the pressing mechanism 42 pushes the pushing frame 433 to move downward, and the flip unit 435 drives the detection frame 432 to flip, so that the detection frame 432 flips 180°. At this time, the detection frame 432 faces the outside of the detection axis 41; when the adsorption work is completed, the pressing mechanism 42 is reset, and the reset spring 434 pushes the pushing frame 433 to move inward, and the detection frame 432 flips 180° again. At this time, the detection frame 432 faces the inside of the detection axis 41, and the detection frame 432 drives the metal base inside the package to cooperate with the detection base 436. When the detection frame 432 runs to the upper end of the detection axis 41, the photographing mechanism 44 first takes a picture of the package that is not powered on. After that, the detection base 436 is powered on, and the photographing mechanism 44 takes a picture of the package that is powered on again, thereby realizing appearance inspection and electrical inspection of the chip inside the package.

[0051] It should be noted that the photos taken by the photographing mechanism 44 are transmitted to the computer so that the photos taken can be compared with the reference photos, and then the cracks and damage on the chip can be detected. When the detection base 436 is powered on, the photographing mechanism 44 can detect the brightness of the chip and whether the light is on.

[0052] See Figure 10 As shown, as the preferred technical solution of this embodiment, the detection frame 432 includes a support plate 4321, a detection plate 4322, a piston frame 4323 and a rotating shaft 4324. The support plate 4321 is a rectangular hollow structure, and the rotating shaft 4324 is installed on both sides of the support plate 4321. The rotating shaft 4324 is connected to the end of the push frame 433 through a bearing. The piston frame 4323 is evenly installed on the inner side of the support plate 4321, and the detection plate 4322 is installed between the inner sides of the piston frame 4323. The detection plate 4322 is a hollow structure, and detection holes are evenly arranged on the outer surface of the detection plate 4322. The hollow structure of the detection plate 4322 is connected to the detection holes and the interior of the piston frame 4323.

[0053] In the above technical solution, the piston frame 4323 includes three parts: a piston rod, a piston head and a piston sleeve. When the detection frame 432 moves downward to complete the flip, the detection plate 4322 contacts the package body on the adsorption mechanism 33. At this time, the detection frame 432 still moves downward, and the piston rod on the detection frame 432 drives the piston head to move toward the inside of the piston sleeve. At this time, the piston head discharges the gas inside the piston sleeve and the detection plate 4322 through the detection hole. When the detection plate 4322 moves upward, the hollow area of ​​the detection plate 4322 forms a negative pressure, so that the detection plate 4322 can adsorb the package body on the glass substrate, which is convenient for subsequent detection of the chip inside the package body. When the photographing mechanism 44 performs detection, the hollow structure of the support plate 4321 can prevent the chip from being blocked.

[0054] See Figure 10-11 As shown, as the preferred technical solution of this embodiment, the flip unit 435 includes a flip gear 4351, a rack plate 4352 and a limit block 4353. A flip groove is provided on one side of the inner wall of the detection cover 431, and a flip gear 4351 is provided in the flip groove. The flip gear 4351 is connected to the rotating shaft 4324 on one side of the support plate 4321, and a rack plate 4352 meshing with the flip gear 4351 is provided on the inner wall of the flip groove. A limiting groove is provided on the other side of the inner wall of the detection cover 431, and a limiting block 4352 is slidably provided in the limiting groove. The limiting block 4352 is installed on the rotating shaft 4324 on the other side of the support plate 4321.

[0055] In the above technical solution, when the flipping gear 4351 flips and rotates, it drives the rotating shaft 4324 and the support plate 4321 to rotate together, and the rack plate 4352 converts the rotational motion of the flipping gear 4351 into linear motion, thereby driving the detection frame 432 to flip through the rotating shaft 4324, and the limit block 4353 ensures that the detection frame 432 does not flip excessively during the flipping process.

[0056] See Figure 13As shown, as the preferred technical solution of this embodiment, the limiting groove includes a rectangular groove 1 4354 and a rectangular groove 2 4355, and the rectangular groove 2 4355 is symmetrically arranged at both ends of the rectangular groove 1 4354. The limiting block 4352 has an arc-shaped structure, and the outer circle diameter of the limiting block 4352 is smaller than the width of the rectangular groove 1 4354, and the width of the limiting block 4352 is smaller than the width of the rectangular groove 2 4355. The limiting block 4352 is clearance-matched with the rectangular groove 2 4355.

[0057] In the above technical solution, when the pressing mechanism 42 is not working, the limit block 4353 is inside the rectangular groove 2 4355 at the upper end of the limit groove. When the limit block 4353 is squeezed into the rectangular groove 1 4354, the flipping gear 4351 is engaged with the rack plate 4352. The rack plate 4352 drives the detection frame 432 to flip 180° through the flipping gear 4351. At the same time, the limit block 4353 enters the rectangular groove 2 4355 from the rectangular groove 1 4354. Since there is a clearance fit between the limit block 4352 and the rectangular groove 2 4355, the lower end of the detection frame 432 is in a horizontal state after flipping, which avoids the detection frame 432 from tilting when it is adsorbed with the package body, and ensures that the detection frame 432 can be accurately adsorbed and fixed to the package body.

[0058] See Figure 3 As shown, as the preferred technical solution of this embodiment, the driving assembly 5 includes a driving motor 51, a driving gear 52, a packaging gear 53, a detection gear 54 and a driving shaft 55. The driving shaft 55 is installed on the front side wall of the outer frame 1 through a bearing, and the driving motor 51 is fixedly installed on one end of the driving shaft 55. The driving motor 51 is fixedly installed on the front side wall of the outer frame 1, and the driving gear 52 is installed on the other end of the driving shaft 55. The packaging gear 53 is installed on the packaging shaft 31, and the detection gear 54 is installed on the detection shaft 41. The driving gear 52 is meshed with the packaging gear 53 and the detection gear 54 respectively.

[0059] In the above technical solution, when the driving motor 51 rotates to drive the driving shaft 55 , the driving gear 52 on the driving shaft 55 drives the packaging gear 53 and the detection gear 54 to rotate synchronously.

[0060] The above description is merely illustrative of certain exemplary embodiments of the present invention. It goes without saying that those skilled in the art will be able to modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and description are illustrative in nature and should not be construed as limiting the scope of protection of the claims.

Claims

1. A Micro LED intelligent detection device, characterized in that: include: an outer frame (1) having a U-shaped structure; and A conveying component (2) is installed at the lower end of the inner part of the outer frame (1), and the conveying component (2) is used to drive the Micro LED to be conveyed at a uniform speed; A packaging component (3) is installed in the middle of the outer frame (1), the packaging component (3) is located above the right side of the conveying component (2), and the packaging component (3) is used to take and package the Micro LEDs uniformly conveyed on the conveying component (2); A detection component (4) is installed at the upper end of the inner part of the outer frame (1), and the detection component (4) is used to detect the Micro LED packaged by the packaging component (2); A driving assembly (5) is mounted on the front side wall of the outer frame (1), and the driving assembly (5) is used to drive the packaging assembly (3) and the detection assembly (4) to operate; The detection assembly (4) comprises a detection shaft (41), a pressing mechanism (42), a detection mechanism (43), a photographing mechanism (44) and a second fixed sleeve (45). The second fixed sleeve (45) is respectively installed on the front and rear side walls of the outer frame (1). The detection shaft (41) is installed between the two second fixed sleeves (45) via a bearing. The detection shaft (41) is a hollow cylinder. The detection shaft (41) is evenly provided with detection grooves along its circumference. The detection mechanism (43) is installed in the detection groove. The detection shaft (41) is provided with a pressing mechanism (42) running through the inside. The pressing mechanism (42) is fixedly installed on the outer frame (1). The photographing mechanism (44) is arranged at the top of the outer frame (1). The photographing mechanism (44) is arranged above the detection shaft (41).

2. The Micro LED intelligent detection device according to claim 1, characterized in that: The packaging assembly (3) comprises a packaging shaft (31), an extrusion rod (32), an adsorption mechanism (33), a glue injection mechanism (34) and a fixed sleeve (35). The fixed sleeves (35) are respectively installed on the two side walls of the outer frame (1). The packaging shaft (31) is installed between the two fixed sleeves (35) via a bearing. The packaging shaft (31) is a hollow cylinder. The packaging shaft (31) is evenly provided with adsorption grooves along its circumference. The adsorption grooves are installed in the adsorption mechanisms (33). The packaging shaft (31) is provided with an extrusion rod (32) penetrating therein, the extrusion rod (32) is fixedly mounted on the outer frame (1), the extrusion rod (32) is a cylindrical structure, and arc-shaped protrusions cooperating with the adsorption mechanism (33) are respectively arranged on the upper and lower sides of the extrusion rod (32), the glue injection mechanism (33) is installed on the outer frame (1), the center of the glue injection mechanism (33) is on the same horizontal plane as the axis of the packaging shaft (31), and the glue injection mechanism (33) cooperates with the adsorption mechanism (33).

3. The Micro LED intelligent detection device according to claim 2, characterized in that: The adsorption mechanism (33) comprises an adsorption cover (331), an adsorption plate (332), a limiting plate (333), a pushing rod (334) and a spring (335); the adsorption cover (331) is installed inside the adsorption groove; a pushing groove for connecting the adsorption groove with the inside of the encapsulation shaft (31) is provided on the encapsulation shaft (31); the pushing rod (334) is slidably arranged inside the pushing groove; the inner side of the pushing rod (334) cooperates with the arc-shaped protrusion on the extrusion rod (32); an adsorption plate (332) is installed outside the pushing rod (334); adsorption holes for adsorbing Micro LEDs are evenly arranged on the adsorption plate (332); the limiting plate (333) is arranged on both side walls of the adsorption cover (331); and the spring (335) is arranged on the pushing rod (334).

4. The Micro LED intelligent detection device according to claim 2, characterized in that: The glue injection mechanism (34) comprises a fixed plate (341), a glue injection bracket (342), a power push rod (343) and a glue injection plate (344); the fixed plate (341) is fixedly mounted on the two side walls of the outer frame (1); the glue injection bracket (342) is evenly arranged on the right side of the fixed plate (341); the glue injection bracket (342) is a hollow barrel-shaped structure; the power push rod (343) is arranged inside the glue injection bracket (342); and the glue injection plate (344) is arranged on the top of the power push rod (343).

5. The Micro LED intelligent detection device according to claim 1, characterized in that: The pressing mechanism (42) comprises a fixing plate (421), an electric push rod (422) and a push plate (423); the fixing plate (421) is fixedly mounted on the outer frame (1); the electric push rod (422) is evenly mounted on the lower end of the fixing plate (421); and the push plate (423) is arranged on the lower end of the electric push rod (422).

6. The Micro LED intelligent detection device according to claim 1, characterized in that: The detection mechanism (43) comprises a detection cover (431), a detection frame (432), a pushing frame (433), a reset spring (434), a flip unit (435) and a detection base (436); the detection cover (431) is installed inside the detection groove; a pushing groove is symmetrically provided at the bottom of the detection cover (431); the pushing frame (433) is slidably arranged in the pushing groove; the pushing frame (433) is in a U-shaped structure; a reset spring (434) is installed between the inner side of the pushing frame (433) and the detection cover (431); the detection frame (432) is installed outside the pushing frame (433); a flip unit (435) is installed on the inner wall of the detection cover (431); the detection frame (432) is connected to the flip unit (435); and the detection base (436) is installed inside the detection cover (431).

7. The Micro LED intelligent detection device according to claim 6, characterized in that: The detection frame (432) comprises a support plate (4321), a detection plate (4322), a piston frame (4323) and a rotating shaft (4324); the support plate (4321) is a rectangular hollow structure; the rotating shafts (4324) are installed on both sides of the support plate (4321); the rotating shafts (4324) are connected to the ends of the push frame (433) through bearings; the piston frame (4323) is evenly installed on the inner side of the support plate (4321); the piston frame (4323) comprises three parts, namely a piston rod, a piston head and a piston sleeve; the detection plate (4322) is installed between the inner sides of the piston frame (4323); the detection plate (4322) is a hollow structure; the outer side surface of the detection plate (4322) is evenly provided with detection holes; the hollow structure of the detection plate (4322) is connected to the detection holes and the inside of the piston frame (4323).

8. The Micro LED intelligent detection device according to claim 7, characterized in that: The flip unit (435) comprises a flip gear (4351), a rack plate (4352) and a limit block (4353); a flip groove is provided on one side of the inner wall of the detection cover (431); a flip gear (4351) is provided in the flip groove; the flip gear (4351) is connected to a rotating shaft (4324) on one side of the support plate (4321); a rack plate (4352) meshing with the flip gear (4351) is provided on the inner wall of the flip groove; a limit groove is provided on the other side of the inner wall of the detection cover (431); a limit block (4352) is slidably provided in the limit groove; and the limit block (4352) is mounted on the rotating shaft (4324) on the other side of the support plate (4321).

9. The Micro LED intelligent detection device according to claim 8, characterized in that: The limiting groove includes a rectangular groove 1 (4354) and a rectangular groove 2 (4355), wherein the rectangular groove 2 (4355) is symmetrically arranged at both ends of the rectangular groove 1 (4354), the limiting block (4352) is an arc-shaped structure, the outer diameter of the limiting block (4352) is smaller than the width of the rectangular groove 1 (4354), and the width of the limiting block (4352) is smaller than the width of the rectangular groove 2 (4355), and the limiting block (4352) and the rectangular groove 2 (4355) are clearance-matched.

10. The Micro LED intelligent detection device according to claim 1, characterized in that: The driving assembly (5) comprises a driving motor (51), a driving gear (52), a packaging gear (53), a detection gear (54) and a driving shaft (55); the driving shaft (55) is mounted on the front side wall of the outer frame (1) via a bearing; one end of the driving shaft (55) is fixedly mounted with the driving motor (51); the driving motor (51) is fixedly mounted on the front side wall of the outer frame (1); the other end of the driving shaft (55) is mounted with the driving gear (52); the packaging gear (53) is mounted on the packaging shaft (31); the detection gear (54) is mounted on the detection shaft (41); and the driving gear (52) is meshed with the packaging gear (53) and the detection gear (54) respectively.

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