Camera module, preparation method thereof and electronic equipment

Abstract

The invention relates to a camera module, a preparation method thereof and electronic equipment, which can effectively reduce the shoulder height of the module and meet the miniaturization requirement of the camera module. The camera module comprises a first circuit board; the photosensitive chip is electrically connected to the first circuit board; the base comprises a first part and a second part; the first part is positioned on the back surface of the first circuit board to support the first circuit board; the second part is at least partially positioned on the periphery of the first part and upwards protrudes out of the first part; a movable portion attached to the second portion; and the lens assembly is arranged on the movable part so as to be movably restrained in the photosensitive path of the photosensitive chip.

Description

Technical Field

[0001] The present invention relates to the field of imaging technology, and in particular to a camera module, a preparation method thereof, and electronic equipment. Background Art

[0002] With the advancement and development of science and technology, electronic devices with camera functions are increasingly moving towards high performance and lightweight. As one of the core configurations of electronic products, the camera module must be adaptively adjusted in terms of performance and size. In other words, in this round of technological innovation, each component in the camera module needs to make corresponding changes in performance and size.

[0003] As an indispensable component of a high-pixel camera module, the motor is used to drive the lens to move in multiple directions during the operation of the camera module, so as to realize the optical autofocus function (hereinafter referred to as AF function; English: AutoFocus; Chinese: auto focus) and optical image stabilization function (hereinafter referred to as OIS function; English: Optical ImageStabilization; Chinese: optical image stabilization) during shooting.

[0004] However, the existing camera module is usually assembled together with a relatively independent motor and photosensitive component, that is, the existing camera module usually fixes the motor base to the color filter holder of the photosensitive component, and the color filter holder is usually installed above the circuit board of the photosensitive component, resulting in a large shoulder height of the camera module, which is difficult to meet the miniaturization requirements of the camera module. Summary of the invention

[0005] One advantage of the present application is that it provides a camera module and a preparation method and electronic device thereof, which can effectively reduce the shoulder height of the module and meet the miniaturization requirements of the camera module.

[0006] In order to achieve at least one of the above advantages or other advantages and purposes of the present invention, the present invention provides a camera module, including: A first circuit board; A photosensitive chip, electrically connected to the first circuit board; A base, comprising a first portion located on the back of the first circuit board to support the first circuit board and a second portion at least partially located on the periphery of the first portion and protruding upward from the first portion; a movable portion mounted on the second portion; and The lens assembly is arranged on the movable part so as to be movably constrained in the light sensing path of the light sensing chip.

[0007] With such a configuration, the base of the present application can not only support and reinforce the first circuit board through the first part, so that the first circuit board is not easy to bend, so that the electrical connection between the photosensitive chip and the first circuit board is not easy to fail, which helps to improve the reliability of the camera module; but also can serve as the mounting base of the movable part of the motor through the second part, so that the integration of components in the camera module is higher, and there is no need to process the mounting base of the first circuit board and the mounting base of the movable part separately and then assemble them together, so as to reduce the assembly process. More importantly, the mounting base of the motor in the present application is at least partially lower than the first circuit board, and is designed to be sunken compared with the mounting base of the motor in the prior art, thereby effectively reducing the shoulder height of the module to meet the miniaturization requirements of the camera module.

[0008] According to one embodiment of the present application, the camera module also includes a first coil and a magnetic member relatively located above the first coil; the second part includes a first mounting portion, the first coil is arranged on the first mounting portion and is electrically connected to the first circuit board, and the magnetic member is arranged on the movable part.

[0009] In this way, the base of the present application can serve as a supporting carrier for the first coil to generate a stable Lorentz force with the magnetic component when the first coil is energized, so as to drive the movable part to drive the lens assembly to move relative to the photosensitive chip, thereby achieving the desired anti-shake function.

[0010] According to one embodiment of the present application, the second part includes a first mounting part; the camera module also includes a second circuit board installed on the first mounting part, wherein the second circuit board is located between the movable part and the first circuit board in the direction of the optical axis, and the second circuit board is provided with a second through hole corresponding to the photosensitive chip; wherein the second circuit board is electrically connected to the first circuit board, and the first coil is installed on the second circuit board.

[0011] With such a configuration, the present application can achieve electrical connection between the first coil and the first circuit board through the second circuit board, ensuring more convenient processing and assembly.

[0012] According to one embodiment of the present application, the base has a accommodating space and a notch connected to the accommodating space, and the notch is located on a first side of the base; wherein a connector is provided on the portion of the first circuit board that passes through the notch and extends out of the accommodating space, and the first mounting portion avoids the first side of the base.

[0013] With such an arrangement, on the one hand, the present application arranges the connector of the first circuit board outside the accommodating space, so as to facilitate the electrical connection between the connector and the external power supply structure, thereby facilitating the power supply to the camera module; on the other hand, the present application allows the first mounting portion to avoid the side where the connector is located, and can reasonably arrange the first mounting portion and the notch on the peripheral side of the base, which can make the camera module structure more compact and facilitate the miniaturization of the camera module.

[0014] According to one embodiment of the present application, the first mounting portion includes at least two first sub-portions arranged at intervals along the circumferential direction; the second circuit board includes at least two side portions, at least one of which is connected to the first sub-portion on the corresponding side and is provided with the first coil.

[0015] With such a configuration, the first mounting portion of the present application can support the side of the second circuit board through the first sub-portion, so that the side is not easily warped, deformed or bent, ensuring that the electrical connection between the first coil and the second circuit board is not easily failed.

[0016] According to an embodiment of the present application, the second circuit board further includes a connecting portion located within the accommodating space, the connecting portion connects the bottoms of two adjacent side portions, and is located below the movable portion.

[0017] With such a configuration, the connection part of the present application is located within the accommodation space and below the movable part, so that the connection part can be designed as a limit structure for the movable part and / or the lens assembly to move downward, and the space between the two adjacent side parts and the space outside thereof can be reserved in the inner and outer directions to facilitate the spatial arrangement of other components of the camera module, which helps to reduce the lateral size of the camera module. In addition, the present application connects the connection part to the bottom of the two adjacent side parts, which can reserve more space above the connection part to design the travel of the movable part in the direction of the optical axis, which helps to reduce the shoulder height of the module.

[0018] According to one embodiment of the present application, the second part also includes at least three second mounting parts arranged at intervals along the circumferential direction, and the camera module also includes a suspension assembly arranged between the movable part and the second mounting part, wherein the notch is formed between a pair of adjacent second mounting parts, and the first sub-part is provided between other adjacent second mounting parts.

[0019] In this way, the present application provides the first sub-part between adjacent second mounting parts for supporting the suspension component, which not only makes the support point of the suspension component in the second part and the mounting position of the first coil in the second part spaced circumferentially, but also makes the support point of the suspension component in the second part and the mounting position of the first coil in the second part more dispersed in the circumferential direction, ensuring that the driving force driving the movable part to move and the suspension force applied to the movable part are more balanced, which helps to reduce assembly tilt.

[0020] According to an embodiment of the present application, the first mounting portion and the second mounting portion are connected, and the second mounting portion is located outside the connecting portion of the second circuit board.

[0021] With such a configuration, the present application designs the second mounting portion to be located outside the connecting portion, so that the connecting portion and the second mounting portion can be reasonably arranged in the inner and outer directions, which is beneficial to reducing the lateral size of the camera module.

[0022] According to one embodiment of the present application, a side portion of the second circuit board is located at the notch and is provided with a pin, and the pin is electrically connected to the first circuit board; the first portion includes a main body portion that together with the second portion defines the accommodating space and an extension portion extending from the main body portion to the outside of the notch.

[0023] With such arrangement, the present application can not only shorten the circuit design path by arranging pins electrically connected to the first circuit board on the side portion located at the notch; but also by arranging an extension portion located outside the notch on the first portion, the first portion can better support the electrical connection between the second circuit board and the first circuit board, thereby ensuring that the first circuit board is not prone to bending or breaking, and ensuring that the electrical connection between the pins of the second circuit board and the first circuit board is not prone to failure.

[0024] According to one embodiment of the present application, the base also includes a first conductive member embedded in the first mounting portion and electrically connected to the first circuit board; wherein the first coil is mounted on the first mounting portion, and the first coil is electrically connected to the first conductive member.

[0025] With such a configuration, the camera module of the present application can omit the second circuit board, and directly electrically connect the first coil with the first circuit board through the first conductive member embedded in the first mounting portion, thereby saving the space occupied by the second circuit board and further reducing the size of the camera module.

[0026] According to one embodiment of the present application, the second part includes a second mounting portion that is higher than the first mounting portion; wherein the camera module also includes a suspension component arranged between the movable part and the second mounting portion.

[0027] With such a configuration, the present application can allow for a reasonable design of the height difference between the second mounting portion and the first mounting portion through the design of the height position relationship between the second mounting portion and the first mounting portion, and can reserve sufficient accommodation space for the magnetic part while avoiding the camera module from being too large in size.

[0028] According to one embodiment of the present application, the second mounting portion includes a second sub-portion, the movable portion includes an anti-shake bracket constrained to the second portion in a manner that allows it to move in a direction perpendicular to the optical axis, and the lens assembly is constrained to the anti-shake bracket; the suspension assembly includes a ball constrained between the anti-shake bracket and the second sub-portion.

[0029] According to one embodiment of the present application, there are multiple second sub-sections, and they are distributed at intervals along the circumferential direction; each of the second sub-sections is provided with a first strip groove, and the multiple first strip grooves are rotationally symmetrically distributed relative to the optical axis of the lens assembly; the anti-shake bracket is provided with multiple second strip grooves that correspond one-to-one to the first strip grooves and extend in directions perpendicular to each other, and each of the second strip grooves and the corresponding first strip groove together form a ball cavity for accommodating the ball.

[0030] With such a configuration, the ball bearing of the present application can support the anti-shake bracket while allowing the anti-shake bracket to move in a direction perpendicular to the optical axis, so as to achieve the desired anti-shake function.

[0031] According to one embodiment of the present application, the second mounting portion also includes a third sub-portion, and the third sub-portion is at least partially located at a corner of the second portion. The suspension assembly includes a first spring sheet, and the first spring sheet includes a first section whose two ends are constrained between the anti-shake bracket and the third sub-portion.

[0032] With such a configuration, the present application uses the first spring sheet to provide damping and elastic force for the movement of the anti-shake bracket during resetting, which can make the anti-shake movement and resetting of the anti-shake bracket more stable; at the same time, the size design of the first spring sheet between the anti-shake bracket and the third sub-section affects the anti-shake stroke. Since the length at the diagonal is larger, the present application arranges at least a part of the third sub-section at the corner of the second section, so that the camera module has enough space to arrange the part of the first spring sheet between the anti-shake bracket and the third sub-section, that is, it can allow more space to be reserved for designing the anti-shake stroke, which is conducive to the miniaturization of the camera module.

[0033] According to one embodiment of the present application, the movable part also includes a focus bracket constrained to the anti-shake bracket in a manner that it can move along the optical axis, and the lens assembly is constrained to the focus bracket; the first spring piece also includes a second section whose two ends are constrained between the focus bracket and the anti-shake bracket; the magnetic part is arranged on the anti-shake bracket, and the camera module also includes a second coil arranged on the focus bracket and opposite to the magnetic part; the base also includes a second conductive part embedded in the third sub-part and electrically connected to the first circuit board, the first spring piece is a metal part, and electrically conducts the second conductive part and the second coil.

[0034] With such a configuration, the present application uses the first spring sheet to provide damping and elastic force for resetting the movement of the focus bracket, and through the design of embedding the second conductive member into the third sub-part, the focus bracket can be electrically connected to the first circuit board through the first spring sheet and the second conductive member, so as to power the electromagnetic drive mechanism of the focus bracket and simplify the motor circuit design; at the same time, the present application can simplify the design of the motor drive mechanism through the design of the first coil and the second coil sharing the magnetic member, which contributes to the miniaturization of the camera module.

[0035] According to one embodiment of the present application, the second mounting portion includes a second sub-portion and a third sub-portion protruding upward from the second sub-portion, and the suspension assembly includes a first suspension member and a second suspension member, the first suspension member is arranged between the second sub-portion and the lower portion of the movable part, and the second suspension member is arranged between the third sub-portion and the upper portion of the movable part.

[0036] With such an arrangement, the suspension assembly of the present application can constrain the movable part from the upper and lower parts respectively, so that the force on the movable part is more balanced, so as to suspend the movable part more stably and the movable part is not prone to assembly tilt.

[0037] According to an embodiment of the present application, the base is a molded body formed on the first circuit board.

[0038] According to one embodiment of the present application, the first part is provided with a receiving hole, and the first circuit board is provided with a first through hole corresponding to the photosensitive chip; the photosensitive chip is located in the receiving hole and is flipped on the first circuit board.

[0039] With such a configuration, the present application mounts the photosensitive chip on the back side of the first circuit board so that the back focal length of the camera module partially overlaps with the base, thereby being able to reduce the module shoulder height.

[0040] According to one embodiment of the present application, the camera module further includes a filter element, and the filter element is installed on the front side of the first circuit board to cover the first through hole.

[0041] With such arrangement, the present application eliminates the need for a color filter holder by directly mounting the filter element on the front side of the first circuit board, thereby further reducing the module shoulder height.

[0042] According to one embodiment of the present application, the camera module also includes a lens barrel constrained by the movable part, and the lens assembly is installed inside the lens barrel; the filter element is rectangular, and the long side of the filter element is at least partially located inside the lens barrel; wherein an electronic component installation area is provided on the front side of the first circuit board, and the electronic component installation area is located between the long side of the filter element and the inner edge of the lens barrel.

[0043] In this way, the present application can reduce the size of the filter element by locating at least part of the long side of the filter element inside the lens barrel, so that the filter element is not easy to crack. In addition, the electronic component installation area is arranged on the front of the first circuit board, which can reduce the magnetic interference with the photosensitive chip; the electronic component installation area is arranged between the long side of the filter element and the inner edge of the lens barrel, and the space between the long side of the filter element and the inner edge of the lens barrel can be reasonably used to arrange electronic components, thereby allowing the distance between the short side of the filter element and the corresponding side of the camera module to be shortened, which helps to reduce the width of the camera module.

[0044] According to another aspect of the present application, the present application further provides an electronic device, including: The device itself; and Any of the camera modules described above, wherein the camera module is assembled on the device body.

[0045] According to another aspect of the present application, the present application further provides a method for preparing a camera module, comprising the steps of: Placing a second conductive member in the cavity of the first injection mold to injection mold a third sub-section embedded with the second conductive member; Placing the first circuit board and a plurality of third sub-parts in the cavity of the second injection mold, so as to form a base by injection molding a portion of the second part excluding the third sub-parts and the first part, wherein the first part is located at the back of the first circuit board to support the first circuit board and includes a main body and an extension part, and the second part protrudes upward from the first part and is located at the periphery of the main body; Flip-mounting the photosensitive chip on the first circuit board; and The movable part with the lens assembly is mounted on the second part of the base to obtain a camera module.

[0046] With such a configuration, the present application uses a secondary injection molding method to form the base, which can allow a sufficient height difference to be designed between the third sub-section and the portion of the base excluding the third sub-section. This is because when the height difference between the third sub-section and the portion of the base excluding the third sub-section is large, using a one-time injection molding method to mold the base is prone to poor molding during injection molding. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 is a three-dimensional schematic diagram of a camera module according to an embodiment of the present application; Figure 2 An exploded schematic diagram of a camera module according to the above embodiment of the present application is shown; Figure 3 A cross-sectional schematic diagram of a camera module according to the above embodiment of the present application is shown; Figure 4 An example of a camera module without a housing according to the above embodiment of the present application is shown; Figure 5 A cross-sectional schematic diagram of a camera module according to the above example of the present application is shown; Figure 6 A schematic diagram of the structure of a photosensitive component in a camera module according to the above example of the present application is shown; Figure 7 A modified example of the camera module according to the above embodiment of the present application is shown; Figure 8 The present invention is a flow chart of a method for preparing a camera module according to an embodiment of the present application.

[0048] Description of main component symbols: 1. Camera module; 11. First circuit board; 1101. First through hole; 1102. Electronic component installation area; 111. Hard board part; 112. Soft board part; 113. Connector; 12. Photosensitive chip; 121. Photosensitive area; 122. Non-photosensitive area; 13. Base; 13a. First side; 130. Molded body; 1301. Accommodating space; 1302. Notch; 131. First part; 1310. Accommodating hole; 1311. Main body; 1312. Extension part; 132. Second part; 1321. First installation part; 13210. First sub-part; 1322. Second installation part; 13220. First strip groove; 13221. Second sub-part; 13222. Third sub-part; 133. First conductive member; 134. second conductive member; 14. movable portion; 141. focusing bracket; 142. anti-shake bracket; 1420. second strip groove; 15. optical lens; 151. lens assembly; 152. lens barrel; 16. suspension assembly; 161. first spring piece; 1611. first section; 1612. second section; 162. ball bearing; 163. second spring piece; 17. electromagnetic drive mechanism; 171. first coil; 172. magnetic member; 173. second coil; 18. second circuit board; 180. second through hole; 181. side portion; 1811. lateral region; 1812. first longitudinal region; 1813. second longitudinal region; 1814. pin; 182. connecting portion; 19. reinforcing plate; 20. filter element; 21. housing.

[0049] The above description of the main component symbols is combined with the accompanying drawings and specific implementation methods to further illustrate the present invention in detail. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0051] It should be noted that when a component is referred to as being "mounted on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a central component at the same time. When a component is considered to be "fixed to" another component, it may be directly fixed on the other component or there may be a central component at the same time.

[0052] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "or / and" used herein includes any and all combinations of one or more of the related listed items.

[0053] Considering that the existing camera module fixes the motor base to the color filter bracket of the photosensitive component, the shoulder height of the camera module is still relatively large, which makes it difficult to meet the miniaturization requirements of the camera module. Therefore, the present application proposes a camera module and a preparation method thereof and an electronic device, which can effectively reduce the module shoulder height to meet the miniaturization requirements of the camera module.

[0054] Specifically, refer to the attached Figures 1 to 3 As shown, an embodiment of the present application provides an electronic device, which may include a device body and a camera module 1 mounted on the device body, so as to collect image information for the device body through the camera module 1. It is understandable that the electronic device mentioned in the present application may be implemented as, but not limited to, a smart phone, a smart watch, a tablet or a notebook, etc.

[0055] More specifically, if Figures 1 to 7 As shown, the camera module 1 may include a first circuit board 11, a photosensitive chip 12, a base 13, a movable part 14 and an optical lens 15. The photosensitive chip 12 is electrically connected to the first circuit board 11. The base 13 includes a first part 131 located on the back of the first circuit board 11 to support the first circuit board 11 and a second part 132 at least partially located on the periphery of the first part 131 and protruding upward from the first part 131. The movable part 14 is mounted on the second part 132, and the optical lens 15 is arranged on the movable part 14 to be movably constrained in the photosensitive path of the photosensitive chip 12, ensuring that external light first passes through the optical lens 15 and is then received by the photosensitive chip 12 for imaging.

[0056] It is worth noting that the base 13 mentioned in the present application can not only support and reinforce the first circuit board 11 through the first part 131, so that the first circuit board 11 is not easy to bend, so that the electrical connection between the photosensitive chip 12 and the first circuit board 11 is not easy to fail, which helps to improve the reliability of the camera module 1; but also can serve as the mounting base of the movable part 14 of the motor through the second part 132, so that the integration of the components in the camera module 1 is higher, and there is no need to process the mounting base of the first circuit board 11 and the mounting base of the movable part 14 separately and then assemble them together, so as to reduce the assembly process. More importantly, the second part 132 used as the motor mounting base in the present application is at least partially lower than the first circuit board 11, and is designed to be sunken compared with the motor mounting base in the prior art, thereby effectively reducing the shoulder height of the module, so as to meet the miniaturization requirements of the camera module 1.

[0057] In addition, if Figure 2 As shown, the base 13 mentioned in the present application may have a receiving space 1301 and a notch 1302 communicating with the receiving space 1301, and the notch 1302 is located at the first side 13a of the base 13. A connector 113 is provided on the first circuit board 11 at a portion passing through the notch 1302 and out of the receiving space 1301.

[0058] In one example of this application, Figure 2 As shown, the first part 131 may include a main body 1311 and an extension 1312, wherein the main body 1311 and the second part 132 together form a receiving space 1301 and a notch 1302, wherein the notch 1302 is connected to the receiving space 1301 and is located at the first side 13a of the base 13. The extension 1312 is located outside the receiving space 1301 and corresponds to the first side 13a of the base 13. Accordingly, the first circuit board 11 may include a hard board part 111, a soft board part 112 and a connector 113, wherein the hard board part 111 extends out of the receiving space 1301 from the notch 1302; the soft board part 112 is connected to a side of the hard board part 111 extending out of the receiving space 1301, and the connector 113 is disposed on the soft board part 112 to facilitate electrical connection with an external power supply structure. In particular, the back side of the hard board portion 111 is attached to the first part 131, so that the first part 131 supports and reinforces the hard board portion 111, ensuring that the hard board portion 111 is not easily bent, so that the electrical connection between the photosensitive chip 12 and the hard board portion 111 is not easily failed, thereby improving the reliability of the camera module.

[0059] In one example of this application, Figure 2 and Figure 3As shown, the main body 1311 of the first part 131 may be provided with the accommodating hole 1310, and the hard board part 111 of the first circuit board 11 is provided with a first through hole 1101 corresponding to the photosensitive chip 12; the photosensitive chip 12 is located in the accommodating hole 1310 and is flipped on the first circuit board 11. The photosensitive chip 12 has a photosensitive area 121 corresponding to the first through hole 1101 and a non-photosensitive area 122 located around the photosensitive area 121, and the non-photosensitive area 122 of the photosensitive chip 12 is fixedly connected to the first circuit board 11. It can be understood that "the first through hole 1101 corresponds to the photosensitive chip 12" means that the light emitted from the optical lens 15 can be irradiated to the photosensitive area 121 of the photosensitive chip 12 through the first through hole 1101. In other words, the camera module 1 of the present application can overlap the space of the first part 131 and the space of the photosensitive chip 12 in the direction of the optical axis by accommodating the photosensitive chip 12 in the accommodating hole 1310 and flipping it on the first circuit board 11, so that the back focal length of the camera module 1 partially overlaps with the base 13, thereby reducing the shoulder height of the module.

[0060] It is worth noting that in other embodiments of the present application, the photosensitive chip can be installed on the front of the first circuit board or in the receiving hole of the first circuit board. The photosensitive chip and the first circuit board can also be electrically connected by wire bonding.

[0061] In addition, if Figure 3 As shown, the camera module 1 may further include an electromagnetic driving mechanism 17 for driving the movable part 14 to drive the optical lens 15 to move relative to the photosensitive chip 12 to achieve the focusing and / or anti-shake function of the camera module 1.

[0062] For example, Figure 3 As shown, the electromagnetic drive mechanism 17 of the camera module 1 may include a first coil 171 and a magnetic member 172 located above the first coil 171; the first coil 171 is disposed on the second portion 132 and is electrically connected to the first circuit board 11, and the magnetic member 172 is disposed on the movable portion 14. In this way, the base 13 of the present application can serve as a support carrier for the first coil 171 to generate a stable Lorentz force with the magnetic member 172 when the first coil 171 is energized, so as to drive the movable portion 14 to drive the optical lens 15 to move relative to the photosensitive chip 12, thereby achieving the desired anti-shake function.

[0063] Alternatively, if Figure 3 and Figure 5As shown, the movable part 14 includes an anti-shake bracket 142, and the anti-shake bracket 142 is constrained to the second part 132 in a manner that it can move in a direction perpendicular to the optical axis, and the optical lens 15 is constrained to the anti-shake bracket 142. At this time, the magnetic member 172 is arranged on the anti-shake bracket 142 and corresponds to the first coil 171, so that when the first coil 171 is energized, it generates a Lorentz force with the magnetic member 172, driving the anti-shake bracket 142 to drive the optical lens 15 to move in a direction perpendicular to the optical axis, thereby realizing the anti-shake function of the camera module 1. It can be understood that in other examples of the present application, the installation positions of the first coil 171 and the magnetic member 172 can be interchanged, and the required anti-shake function can still be realized, and this application will not be repeated; in addition, the optical axis mentioned in this application refers to the optical axis of the optical lens 15.

[0064] Alternatively, if Figure 3 and Figure 4 As shown, the movable part 14 also includes a focus bracket 141, and the focus bracket 141 is constrained to the anti-shake bracket 142 in a manner that it can move along the optical axis, and the optical lens 15 is installed on the focus bracket 141. At this time, the electromagnetic drive mechanism 17 can also include a second coil 173 arranged on the focus bracket 141 and opposite to the magnetic member 172, and the second coil 173 is electrically connected to the first circuit board 11, so that when the second coil 173 is energized, it generates a Lorentz force with the magnetic member 172, drives the focus bracket 141 to drive the optical lens 15 to move along the optical axis, and realizes the focusing function of the camera module 1.

[0065] It is worth noting that in the above examples of this application, Figure 3 As shown, the first coil 171 and the second coil 173 can share the same magnetic part 172, which can not only generate a Lorentz force with the magnetic part 172 after the first coil 171 is energized, so as to drive the anti-shake bracket 142 to drive the optical lens 15 to move in a direction perpendicular to the optical axis to achieve optical image stabilization, but also generate a Lorentz force with the magnetic part 172 after the second coil 173 is energized, so as to drive the focus bracket 141 to drive the optical lens 15 to move in the opposite direction along the optical axis to achieve automatic focus. It can be understood that in other examples of the present application, the movable part 14 may not include the focus bracket 141, but realize the required focusing function by moving the photosensitive chip 12, wherein the autofocus driving mechanism of the photosensitive chip 12 refers to the prior art; in addition, the installation positions of the second coil 173 and the magnetic part 172 mentioned in the present application can also be interchanged, which will not be described in detail in the present application.

[0066] According to the above embodiments of the present application, Figures 2 to 6As shown, the second part 132 may include a first mounting portion 1321; the camera module 1 also includes a second circuit board 18 mounted on the first mounting portion 1321. The second circuit board 18 is located between the movable part 14 and the first circuit board 11 in the direction of the optical axis, and the second circuit board 18 is provided with a second through hole 180 corresponding to the photosensitive chip 12. The second circuit board 18 is electrically connected to the first circuit board 11, and the first coil 171 is mounted on the second circuit board 18. In this way, the camera module 1 of the present application can realize the electrical connection between the first coil 171 and the first circuit board 11 through the second circuit board 18, ensuring that the processing and assembly are more convenient. It can be understood that the “second through hole 180 corresponding to the photosensitive chip 12” mentioned in the present application means that the second through hole 180 allows the light emitted from the optical lens 15 to be irradiated to the photosensitive area 121 of the photosensitive chip 12 through the second through hole 180; there is no limitation on the positional relationship between the optical lens 15 and the second through hole 180, and the optical lens 15 can be located above the second circuit board 18, or the optical lens 15 can be passed through the second through hole 180.

[0067] Alternatively, if Figure 2 and Figure 6 As shown, the first mounting portion 1321 avoids the first side 13a of the base 13. In this way, the first mounting portion 1321 can avoid the side where the connector 113 is located, and the first mounting portion 1321 and the notch 1302 can be reasonably arranged on the peripheral side of the base 13, which can make the structure of the camera module 1 more compact and facilitate the miniaturization of the camera module 1.

[0068] It is worth noting that the first mounting portion 1321 includes at least two first sub-portions 13210 arranged at intervals along the circumferential direction; the second circuit board 18 includes at least two side portions 181, wherein at least one of the side portions 181 is connected to the first sub-portion 13210 on the corresponding side and is provided with the first coil 171. For example, Figure 2 and Figure 3 As shown, the first mounting portion 1321 may include three first sub-portions 13210 arranged at intervals along the circumferential direction; the second circuit board 18 may include four side portions 181, each of which may be provided with the first coil 171, wherein the three side portions 181 are connected to the first sub-portion 13210 on the corresponding side. In this way, the first mounting portion 1321 of the present application can support the side portion 181 of the second circuit board 18 through the first sub-portion 13210, so that the side portion 181 is not prone to warping, deformation or bending, ensuring that the electrical connection between the first coil 171 and the second circuit board 18 is not prone to failure.

[0069] Alternatively, if Figure 6As shown, the second circuit board 18 also includes a connecting portion 182 located within the accommodating space 1301, the connecting portion 182 connects the bottoms of the two adjacent side portions 181, and is located below the movable portion 14. In this way, the connecting portion 182 of the present application is within the accommodating space 1301 and is located below the movable portion 14, so that the connecting portion 182 can be designed as a limiting structure for the movable portion 14 and / or the optical lens 15 to move downward, and can also reserve the space between the two adjacent side portions 181 and the outer space in the inner and outer directions, so as to facilitate the spatial arrangement of other components of the camera module 1, which helps to reduce the lateral size of the camera module 1. In addition, the present application connects the connecting portion 182 to the bottoms of the two adjacent side portions 181, which can reserve more space above the connecting portion 182 to design the travel of the movable portion 14 in the direction of the optical axis, which helps to reduce the module shoulder height.

[0070] For example, Figure 6 As shown, the second circuit board 18 has four side portions 181, and the two ends of the connecting portion 182 are respectively fixedly connected to the two adjacent side portions 181 to jointly define the second through hole 180 located at the periphery of the optical lens 15, so that the second circuit board 18 can limit the movement of the movable part 14 in the direction of the optical axis while allowing the optical lens 15 to be as close to the photosensitive chip 12 as possible to reduce the overall height of the module.

[0071] Alternatively, if Figure 6 As shown, each side portion 181 may have a lateral region 1811 fixedly connected to the upper surface of the first sub-portion 13210 and a first longitudinal region 1812 extending downward from the inner edge of the lateral region 1811, and the connecting portion 182 extends inward from the lower edge of the first longitudinal region 1812; the first coil 171 is correspondingly installed in the lateral region 1811 of the side portion 181.

[0072] Alternatively, if Figure 3 and Figure 6 As shown, a side portion 181 of the second circuit board 18 is located at the notch 1302 and is provided with a pin 1814, and the pin 1814 is electrically connected to the first circuit board 11. In other words, the side portion 181 of the second circuit board 18 corresponding to the notch 1302 may have a second longitudinal region 1813 extending downward from the outer edge of the transverse region 1811 and a pin 1814 provided in the second longitudinal region 1813, so that the second circuit board 18 is electrically connected to the first circuit board 11 through the pin 1814.

[0073] According to the above embodiments of the present application, Figure 2 , Figure 5 as well as Figure 6As shown, the second part 132 also includes at least three second mounting parts 1322 spaced apart in the circumferential direction, and the camera module 1 also includes a suspension assembly 16 disposed between the movable part 14 and the second mounting part 1322, wherein the notch 1302 is formed between a pair of adjacent second mounting parts 1322, and the first sub-part 13210 is disposed between other adjacent second mounting parts 1322. In this way, the present application provides the first sub-part 13210 between adjacent second mounting parts 1322 to support the suspension assembly 16, so that not only the supporting point of the suspension assembly 16 at the second part 132 and the mounting position of the first coil 171 at the second part 132 are spaced apart in the circumferential direction, but also the supporting point of the suspension assembly 16 at the second part 132 and the mounting position of the first coil 171 at the second part 132 are more dispersed in the circumferential direction, so as to ensure that the driving force for driving the movable part 14 to move and the suspension force applied to the movable part 14 are more balanced, which helps to reduce the assembly tilt.

[0074] Alternatively, if Figure 2 and Figure 6 As shown, the first mounting portion 1321 is connected to the second mounting portion 1322, and the second mounting portion 1322 is located outside the connecting portion 182 of the second circuit board 18. In this way, the second mounting portion 1322 is designed to be located outside the connecting portion 182, and the connecting portion 182 and the second mounting portion 1322 can be reasonably arranged in the inner and outer directions, which is conducive to reducing the lateral size of the camera module 1.

[0075] Alternatively, if Figure 2 and Figure 3 As shown, the first mounting portion 1321 is lower than the second mounting portion 1322, and the suspension assembly 16 is connected between the movable portion 14 and the second mounting portion 1322. In this way, the height position relationship design of the second mounting portion 1322 and the first mounting portion 1321 allows for a reasonable design of the height difference between the second mounting portion 1322 and the first mounting portion 1321, and can reserve sufficient accommodation space 1301 for the magnetic member 172 while avoiding the camera module 1 from being too large in size.

[0076] It is worth noting that Figure 2 , Figure 5 as well as Figure 6As shown, the second mounting portion 1322 may include a second sub-portion 13221 and a third sub-portion 13222 protruding upward from the second sub-portion 13221; accordingly, the suspension assembly 16 may include a first suspension member and a second suspension member, the first suspension member being disposed between the second sub-portion 13221 and the lower portion of the movable portion 14, and the second suspension member being disposed between the third sub-portion 13222 and the upper portion of the movable portion 14. In this way, the suspension assembly 16 of the present application can be constrained from the upper and lower portions of the movable portion 14 respectively, so as to more stably suspend the movable portion 14. It can be understood that the first suspension member mentioned in the present application can be but not limited to being implemented as a ball 162; the second suspension member mentioned in the present application can be but not limited to being implemented as a first spring 161; of course, in other examples of the present application, the suspension component 16 can also be implemented as a guide column or a wire, etc., as long as the desired suspension effect can be achieved, and the present application will not go into details.

[0077] For example, Figure 5 As shown, the second mounting portion 1322 includes a second sub-portion 13221, the movable portion 14 includes an anti-shake bracket 142 constrained to the second portion 132 in a manner that it can move in a direction perpendicular to the optical axis, and the optical lens 15 is constrained to the anti-shake bracket 142; the suspension assembly 16 includes a ball 162 constrained between the anti-shake bracket 142 and the second sub-portion 13221.

[0078] Alternatively, if Figure 2 , Figure 5 as well as Figure 6 As shown, the second mounting portion 1322 includes a plurality of second sub-portions 13221 spaced apart along the circumferential direction; each second sub-portion 13221 is provided with a first strip groove 13220, and the plurality of first strip grooves 13220 are rotationally symmetrically distributed relative to the optical axis of the optical lens 15; the anti-shake bracket 142 is provided with a plurality of second strip grooves 1420 corresponding to the first strip grooves 13220 one by one and extending in directions perpendicular to each other, and each second strip groove 1420 and the corresponding first strip groove 13220 together form a ball cavity for accommodating the ball 162. In this way, the ball 162 of the present application can support the anti-shake bracket 142 while allowing the anti-shake bracket 142 to move in a direction perpendicular to the optical axis, so as to achieve the desired anti-shake function.

[0079] Alternatively, if Figure 2 , Figure 4 ,as well as Figure 5As shown, the second mounting portion 1322 also includes a plurality of third sub-portions 13222; the third sub-portion 13222 is at least partially located at the corner of the second portion 132, and the suspension assembly 16 includes a first spring plate 161, and the first spring plate 161 includes a first section 1611 whose two ends are constrained between the anti-shake bracket 142 and the third sub-portion 13222. In this way, the present application uses the first spring clip 161 to provide damping and elastic force during resetting for the movement of the anti-shake bracket 142, which can make the anti-shake movement and resetting of the anti-shake bracket 142 more stable; at the same time, the size design of the first spring clip 161 between the anti-shake bracket 142 and the third sub-section 13222 affects the anti-shake stroke. Since the length at the diagonal is larger, the present application arranges at least a part of the third sub-section 13222 at the corner of the second part 132, so that the camera module 1 has enough space to arrange the first spring clip 161 between the anti-shake bracket 142 and the third sub-section 13222, that is, it can allow more space to be reserved for designing the anti-shake stroke, which is conducive to the miniaturization of the camera module 1.

[0080] Alternatively, if Figure 3 and Figure 4 As shown, the movable part 14 also includes a focus bracket 141 constrained to the anti-shake bracket 142 in a manner that it can move along the optical axis direction, and the optical lens 15 is constrained to the focus bracket 141; the first spring plate 161 also includes a second section 1612 whose two ends are constrained between the focus bracket 141 and the anti-shake bracket 142; the magnetic member 172 is arranged on the anti-shake bracket 142, and the camera module 1 also includes a second coil 173 arranged on the focus bracket 141 and opposite to the magnetic member 172; the base 13 also includes a second conductive member 134 embedded in the third sub-portion 13222 and electrically connected to the first circuit board 11, the first spring plate 161 is a metal member, and electrically conducts the second conductive member 134 and the second coil 173. In this way, the present application uses the first spring piece 161 to provide damping and elastic force for resetting the movement of the focus bracket 141, and the design of embedding the second conductive member 134 into the third sub-part 13222 enables the focus bracket 141 to achieve electrical conduction with the first circuit board 11 through the first spring piece 161 and the second conductive member 134, which can power the electromagnetic drive mechanism of the focus bracket 141 and simplify the motor circuit design; at the same time, the present application can simplify the design of the motor drive mechanism through the design of the first coil 171 and the second coil 173 sharing the magnetic member 172, which helps to miniaturize the camera module 1.

[0081] It is worth noting that Figure 4 and Figure 5As shown, the two ends of the first elastic sheet 161 are respectively fixedly connected to the upper part of the third sub-section 13222 and the upper part of the focus bracket 141, so as to be implemented as an upper elastic sheet constrained from the upper part of the movable part 14. Figure 4 As shown, the middle portion of the first elastic sheet 161 is fixedly connected to the upper portion of the anti-shake bracket 142 , so that the anti-shake bracket 142 is constrained from the upper and lower sides of the movable part 14 by the first elastic sheet 161 and the ball 162 .

[0082] In addition, if Figure 5 As shown, the suspension assembly 16 of the present application may further include a second spring piece 163, the two ends of which are respectively fixedly connected to the lower portion of the focusing bracket 141 and the lower portion of the anti-shake bracket 142, so that the focusing bracket 141 can be constrained from the upper and lower sides of the movable part 14 by the first spring piece 161 and the second spring piece 163.

[0083] It is worth mentioning that in a modified example of the present application, Figure 7 As shown, the camera module 1 may also not include the second circuit board 18; in this case, the base 13 also includes a first conductive member 133 embedded in the first mounting portion 1321 and electrically connected to the first circuit board 11; wherein the first coil 171 is mounted on the first mounting portion 1321, and the first coil 171 is electrically connected to the first conductive member 133. In this way, the camera module 1 of the present application directly electrically connects the first coil 171 with the first circuit board 11 through the first conductive member 133 embedded in the first mounting portion 1321, without the need to additionally set up the second circuit board 18, thereby saving the space occupied by the second circuit board 18, so as to further reduce the size of the camera module 1.

[0084] According to the above embodiments of the present application, Figure 2 , Figure 3 as well as Figure 6 As shown, the camera module 1 also includes a filter element 20, which is mounted on the front of the first circuit board 11 to cover the first through hole 1101. In this way, the camera module 1 of the present application directly mounts the filter element 20 on the front of the first circuit board 11 so as to omit the color filter holder, which is conducive to further reducing the module shoulder height. It is understandable that the filter element 20 mentioned in the present application can be mounted on the front of the first circuit board 11.

[0085] Alternatively, if Figures 1 to 7 As shown, the camera module 1 also includes a reinforcing plate 19, wherein the reinforcing plate 19 is attached to the first part 131 to seal the accommodating hole 1310, which can prevent the back side of the photosensitive chip 12 from being exposed, so as to protect the photosensitive chip 12 and reduce external impact on the photosensitive chip 12.

[0086] Alternatively, if Figure 3 As shown, there is a gap between the upper surface of the reinforcing plate 19 and the back surface of the photosensitive chip 12, ensuring that when the camera module 1 is impacted on its back, the reinforcing plate 19 will not contact the photosensitive chip 12, thereby preventing the impact on the reinforcing plate 19 from being transmitted to the photosensitive chip 12.

[0087] It is worth noting that a buffer glue can be filled between the reinforcing plate 19 and the photosensitive chip 12, so that the buffer glue can absorb the impact on the back of the photosensitive chip 12, protect the photosensitive chip 12, and make it not easily damaged. It can be understood that the present application can make the photosensitive component of the camera module 1 both thin and light and the photosensitive chip 12 not easily damaged by reasonably designing the distance between the reinforcing plate 19 and the photosensitive chip 12.

[0088] In addition, glue can be filled between the peripheral side wall of the photosensitive chip 12 and the first part 131. The glue can be glue with a large elastic modulus, such as DA glue, which can reinforce the connection between the photosensitive chip 12, the first part 131 and the reinforcing plate 19 to improve the reliability of the connection; or, the glue can also be glue with a small elastic modulus, such as buffer glue, which can convert mechanical energy into thermal energy, thereby eliminating the impact effect and achieving stress buffering for the photosensitive chip 12.

[0089] Alternatively, if Figures 1 to 3 As shown, the camera module 1 further includes a housing 21, and the housing 21 is covered on the second portion 132 to cover the movable portion 14. It can be understood that the housing 21 can be implemented as a metal housing to play the role of a magnetic yoke.

[0090] Alternatively, if Figure 3 and Figure 4 As shown, the optical lens 15 in the camera module 1 may include a lens assembly 151 and a lens barrel 152 constrained by the movable part 14, and the lens assembly 151 is installed in the lens barrel 152. Specifically, the lens barrel 152 may be installed on the focus bracket 141 to achieve the installation of the optical lens 15 on the focus bracket 141; a lens mounting hole is provided inside the lens barrel 152, and the lens assembly 151 is installed in the lens mounting hole.

[0091] More specifically, if Figure 3As shown, the filter element 20 may be rectangular, and the long side of the filter element 20 is at least partially located inside the lens barrel 152; wherein the front of the first circuit board 11 is provided with an electronic component installation area 1102, and the electronic component installation area 1102 is located between the long side of the filter element 20 and the inner edge of the lens barrel 152. In this way, the present application can reduce the size of the filter element 20 by locating at least a part of the long side of the filter element 20 inside the lens barrel 152, so that the filter element 20 is not easy to crack. In addition, the electronic component mounting area 1102 is arranged on the front side of the first circuit board 11, which can reduce magnetic interference with the photosensitive chip 12; the electronic component mounting area 1102 is arranged between the long side of the filter element 20 and the inner edge of the lens barrel 152, and can reasonably utilize the space between the long side of the filter element 20 and the inner edge of the lens barrel 152 to arrange electronic components, thereby allowing the distance between the short side of the filter element 20 and the corresponding side of the camera module 1 to be shortened, which helps to reduce the width of the camera module 1.

[0092] It is understandable that in other examples of the present application, the optical lens 15 may also only include the lens assembly 151, and the focusing bracket 141 is provided with a lens mounting hole, and the lens assembly 151 is directly installed in the lens mounting hole of the focusing bracket 141, and this application will not go into details.

[0093] It is worth mentioning that, according to the above embodiments of the present application, Figure 2 and Figure 5 As shown, the base 13 may be, but is not limited to, implemented as a molded body 130 formed on the first circuit board 11 , which may be prepared by a one-time injection molding process or a two-time injection molding process.

[0094] Specifically, according to another aspect of the present application, Figure 8 As shown, an embodiment of the present application further provides a method for preparing a camera module, which may include the steps of: S100: placing a second conductive member in a cavity of a first injection mold to injection mold a third sub-section embedded with the second conductive member; S200: placing a first circuit board and a plurality of third sub-parts in a cavity of a second injection mold, and injection molding a portion of the second part excluding the third sub-parts and the first part to form a base, wherein the first part is located on the back of the first circuit board to support the first circuit board and includes a main body and an extension part, and the second part protrudes upward from the first part and is located at the periphery of the main body; S300: flip-mounting the photosensitive chip on the first circuit board; and S400: Install the movable part with the lens assembly on the second part of the base to obtain a camera module.

[0095] It is worth noting that if the base 13 is prepared by a one-time injection molding process, poor molding may easily occur during injection molding due to the large height difference between different parts of the base 13; therefore, the preparation method of the present application preferably uses a secondary injection molding process to mold the base 13, which can allow the third sub-portion 13222 and the part of the base 13 other than the third sub-portion 13222 to be designed with a sufficient height difference, that is: first, the third sub-portion 13222 with a larger height is injection molded for the first time, and then the other parts of the base 13 are injection molded for the second time on the first circuit board 11 and the third sub-portion 13222, to ensure that the base 13 is well molded.

[0096] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

Claims

1. A camera module, characterized in that: include: A first circuit board; A photosensitive chip, electrically connected to the first circuit board; A base, comprising a first portion located on the back of the first circuit board to support the first circuit board and a second portion at least partially located on the periphery of the first portion and protruding upward from the first portion; a movable portion mounted on the second portion; as well as The lens assembly is arranged on the movable part so as to be movably constrained in the light sensing path of the light sensing chip.

2. The camera module according to claim 1, characterized in that: The camera module also includes a first coil and a magnetic member relatively located above the first coil; the second part includes a first mounting portion, the first coil is arranged on the first mounting portion and is electrically connected to the first circuit board, and the magnetic member is arranged on the movable part.

3. The camera module according to claim 2, characterized in that: The camera module also includes a second circuit board installed on the first mounting portion, wherein the second circuit board is located between the movable part and the first circuit board in the direction of the optical axis, and the second circuit board is provided with a second through hole corresponding to the photosensitive chip; wherein the second circuit board is electrically connected to the first circuit board, and the first coil is installed on the second circuit board.

4. The camera module according to claim 3, characterized in that: The base has a containing space and a notch connected to the containing space, wherein the notch is located on a first side of the base; wherein a connector is provided on the first circuit board at a position extending from the notch through the containing space, and the first mounting portion avoids the first side of the base.

5. The camera module according to claim 4, characterized in that: The first mounting portion includes at least two first sub-portions arranged at intervals along the circumferential direction; the second circuit board includes at least two side portions, at least one of which is connected to the first sub-portion on the corresponding side and is provided with the first coil.

6. The camera module according to claim 5, characterized in that: The second circuit board further includes a connecting portion located within the accommodating space, the connecting portion connects the bottoms of two adjacent side portions and is located below the movable portion.

7. The camera module according to claim 6, characterized in that: The second part also includes at least three second mounting parts arranged at intervals along the circumferential direction, and the camera module also includes a suspension assembly arranged between the movable part and the second mounting part, wherein the gap is formed between a pair of adjacent second mounting parts, and the first sub-part is arranged between other adjacent second mounting parts.

8. The camera module according to claim 7, characterized in that: The first mounting portion is connected to the second mounting portion, and the second mounting portion is located outside the connecting portion of the second circuit board.

9. The camera module according to claim 5, characterized in that: A side portion of the second circuit board is located at the notch and is provided with a pin, and the pin is electrically connected to the first circuit board; the first portion includes a main body portion that together with the second portion defines the accommodating space and an extension portion extending from the main body portion to the outside of the notch.

10. The camera module according to claim 2, characterized in that: The base further includes a first conductive member embedded in the first mounting portion and electrically connected to the first circuit board; wherein the first coil is mounted on the first mounting portion, and the first coil is electrically connected to the first conductive member.

11. The camera module according to claim 2, characterized in that: The second part includes a second mounting portion that is higher than the first mounting portion; wherein the camera module also includes a suspension component arranged between the movable part and the second mounting portion.

12. The camera module according to claim 11, characterized in that: The second mounting portion includes a second sub-portion, the movable portion includes an anti-shake bracket constrained to the second portion in a manner that allows it to move in a direction perpendicular to the optical axis, and the lens assembly is constrained to the anti-shake bracket; the suspension assembly includes a ball constrained between the anti-shake bracket and the second sub-portion.

13. The camera module according to claim 12, characterized in that: There are multiple second sub-sections, which are distributed at intervals along the circumferential direction; each of the second sub-sections is provided with a first strip groove, and the multiple first strip grooves are rotationally symmetrically distributed relative to the optical axis of the lens assembly; the anti-shake bracket is provided with multiple second strip grooves that correspond to the first strip grooves one by one and extend in directions perpendicular to each other, and each of the second strip grooves and the corresponding first strip groove together form a ball cavity for accommodating the ball.

14. The camera module according to claim 12, characterized in that: The second mounting portion further includes a third sub-portion, which is at least partially located at a corner of the second portion. The suspension assembly includes a first elastic sheet, which includes a first section whose two ends are constrained between the anti-shake bracket and the third sub-portion.

15. The camera module according to claim 14, characterized in that: The movable part also includes a focus bracket constrained to the anti-shake bracket in a manner that it can move along the optical axis, and the lens assembly is constrained to the focus bracket; the first spring sheet also includes a second section whose two ends are constrained between the focus bracket and the anti-shake bracket; the magnetic part is arranged on the anti-shake bracket, and the camera module also includes a second coil arranged on the focus bracket and opposite to the magnetic part; the base also includes a second conductive part embedded in the third sub-part and electrically connected to the first circuit board, the first spring sheet is a metal part, and electrically conducts the second conductive part and the second coil.

16. The camera module according to claim 11, characterized in that: The second mounting portion includes a second sub-portion and a third sub-portion protruding upward from the second sub-portion, and the suspension assembly includes a first suspension member and a second suspension member, the first suspension member is arranged between the second sub-portion and the lower portion of the movable portion, and the second suspension member is arranged between the third sub-portion and the upper portion of the movable portion.

17. The camera module according to any one of claims 1 to 16, characterized in that: The base is a molded body formed on the first circuit board.

18. The camera module according to any one of claims 1 to 16, characterized in that: The first part is provided with a receiving hole, and the first circuit board is provided with a first through hole corresponding to the photosensitive chip; the photosensitive chip is located in the receiving hole and is flipped on the first circuit board.

19. The camera module according to claim 18, characterized in that: The camera module also includes a filter element, which is installed on the front side of the first circuit board to cover the first through hole.

20. The camera module according to claim 19, characterized in that: The camera module also includes a lens barrel constrained by the movable part, and the lens assembly is installed in the lens barrel; the filter element is rectangular, and the long side of the filter element is at least partially located in the lens barrel; wherein the front side of the first circuit board is provided with an electronic component installation area, and the electronic component installation area is located between the long side of the filter element and the inner edge of the lens barrel.

21. An electronic device, characterized in that include: Equipment body; and The camera module as described in any one of claims 1 to claim 20 is assembled on the device body.

22. A method for preparing a camera module, characterized in that: Includes steps: Placing a second conductive member in the cavity of the first injection mold to injection mold a third sub-section embedded with the second conductive member; Placing the first circuit board and a plurality of third sub-parts in the cavity of the second injection mold, so as to form a base by injection molding a portion of the second part excluding the third sub-parts and the first part, wherein the first part is located at the back of the first circuit board to support the first circuit board and includes a main body and an extension part, and the second part protrudes upward from the first part and is located at the periphery of the main body; Flip-mounting the photosensitive chip on the first circuit board; as well as The movable part with the lens assembly is mounted on the second part of the base to obtain a camera module.

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