Calculation device and system and detection method

Abstract

The invention provides a computing device and system and a detection method, and relates to the technical field of computing, the computing device comprises a first computing card, a second computing card, a backboard and a heat dissipation assembly, the backboard is used for being connected with the first computing card and the second computing card, the heat dissipation assembly is arranged at the edge of the first computing card, and the heat dissipation assembly comprises a reel, a buckle and a heat dissipation belt, the buckle is used for being clamped with the second computing card so as to drive the heat dissipation belt to be laid between the first computing card and the second computing card in the direction away from the reel. Thus, the heat dissipation belt can be laid between the first computing card and the second computing card under the driving of the buckle, the heat dissipation efficiency is improved, the use space of the computing cards is reduced, and the computing power of the computing device is improved.

Description

Technical Field

[0001] The present invention relates to the field of computing technology, and in particular to a computing device, system and detection method. Background Art

[0002] With the rise of intelligent driving technology, the demand for computing power of vehicle-mounted computing devices is getting higher and higher. The computing power units of existing computing cards are mainly composed of NPU and GPU, some of which are integrated inside the SoC, and some are expanded in the form of computing power plug-in cards. For computing devices that require stronger computing power, multiple computing cards are often required to be cascaded to meet the computing power requirements.

[0003] In the prior art, when multiple computing cards are cascaded, computing cards are often provided with a heat dissipation solution to meet usage requirements. In some heat dissipation solutions, the heat generated by the AI ​​computing board is actively dissipated through air cooling, but this solution requires a relatively complete air duct, has high requirements for the use environment, and cannot meet the dust and water resistance level requirements; in other heat dissipation solutions, a water cooling plate is added to the heat dissipation form, and a water cooling plate is inserted between two adjacent computing cards to dissipate the heat of the computing board, but this solution requires multiple water cooling plates, which is costly and the layout of the water channels of the water cooling plates is complicated, making it difficult to mass produce on a large scale. Therefore, the existing heat dissipation solutions for computing devices have the problems of high environmental requirements or great production difficulties. Summary of the invention

[0004] The purpose of the present invention is to address the deficiencies in the prior art and provide a computing device, system and detection method. This computing device can lay a heat dissipation belt between a first computing card and a second computing card through a reel to improve the heat dissipation effect of the computing card, thereby meeting the computing power requirements.

[0005] On the one hand, the present invention provides a computing device, which includes a first computing card, a second computing card, a backplane and a heat dissipation assembly, wherein the backplane is used to connect with the first computing card and the second computing card, the heat dissipation assembly is arranged at the edge of the first computing card, and the heat dissipation assembly includes a scroll, a buckle and a heat dissipation belt, and the buckle is used to engage with the second computing card to drive the heat dissipation belt to be laid between the first computing card and the second computing card in a direction away from the scroll.

[0006] In a possible implementation manner, the heat dissipation belt includes a graphene heat dissipation layer, and the graphene heat dissipation layer is used to be respectively attached to the first computing card and the second computing card.

[0007] In a possible implementation manner, the heat dissipation belt further includes a first conductive strip and a second conductive strip, the reel includes a conductive contact sheet, and the first conductive strip, the conductive contact sheet, the second conductive strip and the buckle form a conductive loop.

[0008] In a possible implementation manner, the first conductive tape and the second conductive tape are arranged in parallel.

[0009] In a possible implementation manner, the heat dissipation component is connected to a cooling system.

[0010] In a possible implementation manner, the area of ​​the heat dissipation belt is smaller than the area of ​​the first surface of the first computing card, and the first surface is arranged on a side close to the second computing card.

[0011] On the other hand, the present application further provides a computing system, including the computing device as described in the above possible implementation mode, the computing system also includes a central controller and a mainboard,

[0012] The central controller and the computing device are both connected to the mainboard, and the first computing card and the second computing card in the computing device are sequentially stacked in a direction parallel to the mainboard.

[0013] In a possible implementation manner, the computing system further includes an image acquisition device and a video deserializer, the image acquisition device is connected to the video deserializer, and the video deserializer is connected to the central controller.

[0014] In a possible implementation manner, the computing system further includes a communication module and a functional safety module, and the communication module and the functional safety module are respectively connected to the central controller.

[0015] On the other hand, the present application further provides a detection method for a computing device, the method being applied to the computing device described in the above possible implementation manner, the method comprising:

[0016] Engage the buckle of the heat dissipation assembly with the first edge of the second computing card, where the first edge is arranged on a side of the second computing card away from the backplane;

[0017] Pushing the first computing card so that the heat dissipation belt is respectively attached to the first computing card and the second computing card;

[0018] The voltage drop of the conductive loop is obtained to determine the unfolded length of the heat dissipation belt.

[0019] In a possible implementation manner, after obtaining the voltage drop of the conductive loop and determining the unfolded length of the heat dissipation belt, the method further includes:

[0020] When the unfolded length of the heat dissipation belt meets a preset unfolding condition, obtaining a first temperature difference value and / or a second temperature difference value of the first computing card and / or the second computing card within a preset time;

[0021] When the first temperature difference and / or the second temperature difference meets a preset temperature threshold condition, outputting a first prompt message, wherein the first prompt message indicates that the heat dissipation belt is in a normal state;

[0022] When the first temperature difference and / or the second temperature difference does not satisfy a preset temperature threshold condition, a second prompt information is output, wherein the second prompt information indicates that the heat dissipation belt is in an abnormal state.

[0023] The computing device provided by the present application has the following beneficial effects:

[0024] The present application provides a computing device, which relates to the field of computing technology. The computing device includes a first computing card, a second computing card, a back plate and a heat dissipation component. The back plate is used to connect with the first computing card and the second computing card. The heat dissipation component is arranged at the edge of the first computing card. The heat dissipation component includes a scroll, a buckle and a heat dissipation belt. The buckle is used to engage with the second computing card to drive the heat dissipation belt to be laid between the first computing card and the second computing card in a direction away from the scroll. In this way, the heat dissipation belt can be laid between the first computing card and the second computing card under the drive of the buckle, which improves the heat dissipation efficiency, reduces the use space of the computing card, and improves the computing power of the computing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 A schematic diagram of the structure of a heat dissipation belt in a computing device according to an embodiment of the present application in a contracted state;

[0027] Figure 2 A schematic diagram of the structure of a heat dissipation belt in a computing device according to an embodiment of the present application in an unfolded state;

[0028] Figure 3 A schematic diagram of the structure of a heat dissipation belt according to an embodiment of the present application;

[0029] Figure 4 A schematic diagram of the structure of a computing system according to an embodiment of the present application;

[0030] Figure 5 A hardware connection diagram of a computing system according to an embodiment of the present application;

[0031] Figure 6 A hardware connection diagram of a computing system according to an embodiment of the present application;

[0032] Figure 7 Schematic diagram of the process of the detection method of the embodiment of the present application.

[0033] The following is a supplementary description of the attached drawings:

[0034] 1. First computing card; 2. Second computing card; 3. Heat dissipation assembly; 31. Scroll; 32. Buckle; 33. Heat dissipation belt; 331. First conductive belt; 332. Second conductive belt; 4. Backplane; 5. Central controller; 511. First image acquisition device; 512. Second image acquisition device; 513. Third image acquisition device; 52. Video deserializer; 53. Ethernet switch; 541. First AI computing power card; 542. Second AI computing power card; 543. Third AI computing power card; 55. Communication module; 56. Functional safety module; 57. PCIe switch. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0036] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product, or server that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products, or devices.

[0037] It can be understood that a computing card refers to any hardware device used to perform computing tasks. A computing card may include a central processing unit (CPU), a graphics processing unit (GPU), a neural network processing unit (NPU), a field programmable gate array (FPGA), a tensor processing unit (TPU), etc. Among them, the AI ​​computing power card is a subset of the computing card. The AI ​​computing power card is a computing hardware specially optimized for artificial intelligence and deep learning tasks. The AI ​​computing power card may include a central processing unit (CPU) and a tensor processing unit (TPU). The AI ​​computing power card includes a computing unit and an auxiliary unit. The AI ​​computing power card is generally connected to the motherboard through various forms of interfaces such as MINIPCIE interface, M.2 interface, DIMM slot, etc. The AI ​​computing power card can also communicate with the motherboard through a high-speed connector or a gold finger slot.

[0038] Specifically, for computing devices that require stronger computing power, multiple AI computing power cards are often required to be cascaded to meet computing power requirements of tens to hundreds of TOPS or higher. The computing unit of the AI ​​computing power card exchanges data with the motherboard through a high-speed bus interface connector.

[0039] In the prior art, the heat dissipation solutions for AI computing power cards include: some heat dissipation solutions use the method of adding air-cooling heat dissipation devices to dissipate heat for AI computing power cards. The air-cooling heat dissipation devices actively dissipate the heat generated by the AI ​​computing board, but the air-cooling heat dissipation devices require the AI ​​computing power cards to have relatively complete air ducts and the AI ​​computing power cards cannot meet the dust and water resistance requirements during use; other heat dissipation solutions use the method of adding water-cooling plates to dissipate heat for AI computing power cards. Specifically, the water-cooling plate is set between two AI computing power cards to dissipate heat for AI computing power cards in adjacent card slots. However, this solution requires multiple water-cooling plates to meet the heat dissipation requirements of multiple AI computing power cards, and the layout interface of the water channel of the water-cooling plate is complex, which is not conducive to large-scale mass production.

[0040] Specifically, some AI computing power cards are integrated on the motherboard in the form of SOM modules through gold finger connectors and sockets, but this integration method generally requires occupying independent space on the motherboard and each AI computing power card requires adding a radiator or actively cooling the AI ​​computing power card on the domain controller housing. For a single motherboard, the space is limited and it is difficult to deploy multiple AI computing boards.

[0041] Specifically, the computing device of the present application can be applied to scenarios with high computing power requirements. The embodiments of the present application can be applied to various scenarios, including but not limited to artificial intelligence and deep learning, large-scale data processing and analysis, cloud computing and edge computing, autonomous driving and intelligent transportation, etc., and are particularly suitable for intelligent driving scenarios.

[0042] The following describes a computing device provided by an embodiment of the present application in conjunction with the accompanying drawings. The computing device includes a first computing card 1, a second computing card 2, a back plate 4, and a heat dissipation assembly 3. The back plate 4 is used to connect with the first computing card 1 and the second computing card 2. The heat dissipation assembly 3 is arranged at the edge of the first computing card 1. The heat dissipation assembly 3 includes a reel 31, a buckle 32, and a heat dissipation belt 33. The buckle 32 is used to engage with the second computing card 2 to drive the heat dissipation belt 33 to be laid between the first computing card 1 and the second computing card 2 in a direction away from the reel 31. In this way, the heat dissipation belt 33 can be laid between the first computing card 1 and the second computing card 2 under the drive of the buckle 32, which improves the heat dissipation efficiency, reduces the use space of the computing card, and improves the computing power of the computing device.

[0043] Specifically, in this embodiment, the first computing card 1 is a first AI computing power card 541, the second computing card 2 is a second AI computing power card 542, and the second computing card 2 includes a first edge and a second edge, the first edge is arranged on a side away from the back plate 4, and the second edge is arranged on a side close to the back plate 4. The buckle 32 is engaged with the first edge of the second computing card 2, and the heat dissipation belt 33 is laid from the first edge to the second edge.

[0044] Specifically, the heat dissipation assembly 3 is integrated at the edge of the first computing card 1 close to the back plate 4, the reel 31 is used to expand and contract the heat dissipation belt 33, the reel 31 is fixedly connected to the first computing card 1, the reel 31 is used to store and expand the heat dissipation belt 33, the buckle 32 is used to lock and release the heat dissipation belt 33, the reel 31 is accommodated inside the first computing card 1, when the heat dissipation belt 33 is retracted with the reel 31, the reel 31 and the heat dissipation belt 33 are both inside the first computing card 1, and the buckle 32 is outside the first computing card 1. When the heat dissipation belt 33 is not expanded, the buckle 32 is located at the edge close to the reel 31 and the buckle 32 is not in contact with the second computing card 2; when the heat dissipation belt 33 is expanded, the buckle 32 moves in a direction away from the reel 31, and at the same time drives the heat dissipation belt 33 to expand along the first direction L1. When the second computing card 2 needs to be replaced or removed, the buckle 32 drives the heat dissipation belt 33 to be retracted from between the first computing card 1 and the second computing card 2 into the reel 31.

[0045] Specifically, the heat dissipation belt 33 includes a graphene heat dissipation layer, which is used to be respectively attached to the first computing card 1 and the second computing card 2. By attaching the graphene heat dissipation layer to each computing card, the heat generated by each computing card can be effectively and quickly conducted to the heat dissipation belt 33, reducing the accumulation of heat on the surface of the computing card and improving the heat dissipation efficiency.

[0046] Specifically, graphene is one of the materials with the best thermal conductivity among known materials, and its thermal conductivity can reach 2000-5000W / m·K. Graphene has extremely high strength and flexibility, and is also very light and thin. The graphene heat dissipation layer will not significantly increase the weight and volume of the computing device. This allows the heat dissipation belt 33 to maintain efficient heat dissipation while still maintaining the overall compactness and flexibility of the computing device.

[0047] Specifically, the graphene heat dissipation layer is respectively attached to the first surface of the first computing card 1 and the second surface of the first computing card 1 , thereby achieving the effect of heat dissipation for the first computing card 1 and the second computing card 2 .

[0048] Specifically, the heat dissipation belt 33 further includes a first conductive strip and a second conductive strip, the reel 31 includes a conductive contact sheet, and the first conductive strip 331, the conductive contact sheet, the second conductive strip 332 and the buckle 32 form a conductive loop. By setting the conductive loop, the pull-out length and the laying position of the heat dissipation belt 33 can be monitored in real time. When the heat dissipation belt 33 between the first computing card 1 and the second computing card 2 reaches a predetermined position, the conductive loop will feedback a signal to ensure that the heat dissipation belt 33 is completely laid in place, thereby ensuring the heat dissipation effect.

[0049] Specifically, the conductive contact sheet is fixedly connected to the first computing card 1, and the conductive contact sheet is arranged on a side close to the reel 31. The resistance of the first conductive strip 331 and the second conductive strip 332 is 10Ω-500Ω. The resistance of the conductive contact sheet and the buckle 32 is much smaller than the resistance of the first conductive strip 331 and the second conductive strip 332. In the embodiment of this specification, the resistance of the conductive contact sheet and the buckle 32 can be ignored. In one possible implementation, the current of the conductive loop flows to the conductive contact sheet, the second conductive strip 332, the buckle 32 and the first conductive strip 331; in another possible implementation, the current of the conductive loop flows to the conductive contact sheet, the first conductive strip 331, the buckle 32 and the second conductive strip 332.

[0050] In a possible implementation, the first conductive strip 331 and the second conductive strip 332 are arranged in parallel. In this way, the conductive strips arranged in parallel are easier to manufacture and install, reducing the manufacturing difficulty and cost. The conductive strips arranged in parallel can form a uniform electric field distribution on the heat dissipation strip 33, which helps to reduce the resistance and inductance in signal transmission, thereby improving the performance and stability of the electrical connection.

[0051] Specifically, the relative distance between the first conductive tape 331 and the second conductive tape 332 is smaller than the width of the graphene heat dissipation layer. By arranging the first conductive tape 331 and the second conductive tape 332 in parallel, the voltage drop of the conductive loop is positively correlated with the unfolding length, thereby obtaining whether the laying state of the heat dissipation tape 33 meets the preset unfolding conditions.

[0052] Furthermore, the heat dissipation component 3 is connected to the cooling system. By connecting to the cooling system, the heat dissipation component 3 can more quickly conduct the heat generated by the computing card to the cooling medium, and dissipate the heat to the external environment through the cooling system, thereby significantly reducing the operating temperature of the computing card and improving the performance and life of the computing card.

[0053] Specifically, a heat dissipation path is provided inside the scroll 31, and the heat dissipation path is connected to a cooling system. In one possible embodiment, the cooling system is a water cooling system; in another possible embodiment, the cooling system is an air cooling system; in another possible embodiment, the cooling system is a heat dissipation direct contact heat pipe. The cooling system is used to guide the heat of the graphene heat dissipation layer to the scroll 31 to dissipate the heat of the computing card.

[0054] Specifically, the area of ​​the heat dissipation belt 33 is smaller than the area of ​​the first surface of the first computing card 1, and the first surface is arranged on the side close to the second computing card 2. In this way, the heat dissipation belt 33 can dissipate heat in the heat concentrated area in a targeted manner, effectively conduct and dissipate heat, and improve the overall heat dissipation efficiency of the computing card.

[0055] Specifically, in the embodiment of the present specification, the specifications of the first computing card 1 and the second computing card 2 are consistent, that is, the area of ​​the first surface of the first computing card 1 is consistent with the area of ​​the second surface of the second computing card 2, and the area of ​​the heat dissipation belt 33 is 70%-80% of the area of ​​the first surface of the first computing card 1 or the second surface of the second computing card 2. The heat dissipation belt 33 is used to cover the computing unit of the AI ​​computing power card to improve the heat dissipation effect. If the coverage area of ​​the heat dissipation belt 33 is too large, the heat dissipation belt 33 is easily damaged when plugging and unplugging the AI ​​computing power card; if the coverage area of ​​the heat dissipation belt 33 is too small, the heat dissipation effect of the heat dissipation belt 33 on the AI ​​computing power card is not high.

[0056] Please refer to Figure 4 , which shows a computing system provided by an embodiment of the present invention, including a computing device as described in the above possible implementation mode, the computing system also includes a central controller 5 and a motherboard, the central controller 5 and the computing device are both connected to the motherboard, and the first computing card 1 and the second computing card 2 in the computing device are stacked in sequence in a direction parallel to the motherboard. In this way, the computing system can place multiple computing cards more compactly, thereby accommodating more computing resources in a limited chassis space. The central controller 5 can collaboratively manage the temperature of each computing card, prevent heat accumulation by adjusting the heat dissipation component 3, and ensure the stable operation of the computing system.

[0057] Specifically, the central controller 5 and the backplane 4 are respectively connected to the mainboard, and the first AI computing power card 541, the second AI computing power card 542 and the third AI computing power card 543 are connected to the backplane 4. The central controller 5 includes a centralized SoC (System on Chip), which is used for the central processing unit (CPU), the graphics processing unit (GPU), the neural network processing unit (NPU) and the I / O interface to be integrated on the same control chip. In the field of intelligent driving, the central processing unit (CPU) and the graphics processing unit (GPU) are used to drive the display module to interact with the user, and the neural network processing unit (NPU) is used for the calculation and processing of intelligent driving algorithms, such as identifying lane lines, detecting vehicles, pedestrians and license plates, etc.

[0058] Specifically, the computing system includes multiple computing cards. In the embodiment of this specification, three computing cards are provided, namely a first AI computing power card 541, a second AI computing power card 542 and a third AI computing power card 543.

[0059] In one embodiment, the computing system includes n computing cards and n-1 heat dissipation belts 33, and the computing cards and the heat dissipation belts 33 are stacked in sequence.

[0060] Specifically, the computing system determines the operating parameters of the vehicle based on the calculation output data of the central controller 5 . For example, the computing system determines the acceleration, operating speed and steering angle of the vehicle based on the calculation output data of the central controller 5 .

[0061] Furthermore, the computing system further includes an image acquisition device and a video deserializer 52, the image acquisition device is connected to the video deserializer 52, and the video deserializer 52 is connected to the central controller 5. Through the image acquisition device and the video deserializer 52, the computing system can directly perform edge computing on the central controller 5, quickly process and analyze image data, and significantly improve the response speed and accuracy of the computing system.

[0062] Specifically, in the embodiments of the present specification, the computing system includes a first image acquisition device 511, a second image acquisition device 512 and a third image acquisition device 513, wherein the first image acquisition device 511, the second image acquisition device 512 and the third image acquisition device 513 use GMSL cameras. GMSL cameras can be used for cameras and video surveillance equipment, etc., and have the characteristics of high speed and low latency.

[0063] Specifically, the image acquisition device is used to capture the image or video signal of the target vehicle within a preset range. The image acquisition device can be set to a continuous acquisition mode or an on-demand acquisition mode. The image acquisition device is connected to the video deserializer 52 via a high-speed data transmission interface. In this embodiment, the image acquisition device is connected to the video deserializer 52 via a GMSL interface. The video deserializer 52 is used to convert the serial video signal from the image acquisition device into a parallel signal. The video deserializer 52 transmits the decoded parallel signal to the central controller 5. After receiving the parallel signal from the video deserializer 52, the central controller 5 performs image or video data processing, analysis or calculation tasks.

[0064] In an optional embodiment, if Figure 5 As shown, in the computing system, an AI computing power card is used to carry a neural network processing unit (NPU) or a graphics processing unit (GPU) to transmit data to the central controller 5 through an Ethernet switch (ETH Switch) 53. The Ethernet switch 53 is used to establish a first data path between the central controller 5 and the AI ​​computing power card. The first data path is responsible for transmitting the data to be processed to the AI ​​computing power card and feeding back the calculation results to the central controller 5.

[0065] Specifically, the image acquisition device outputs the acquired video information to the video deserializer 52, the video deserializer 52 outputs a parallel signal to the central controller 5, the central controller 5 transmits the parallel signal to be processed to the first AI computing power card 541, the second AI computing power card 542 and the third AI computing power card 543 through the first data path, each computing power card transmits the processed target information to the central controller 5, the central controller 5 generates execution information based on the target information, and the execution information is output to the communication module 55 and / or the functional safety module 56 to control the operating parameters of the target vehicle.

[0066] In an optional embodiment, if Figure 6 As shown, in the computing system, an AI computing power card is used to carry a neural network processing unit (NPU) or a graphics processing unit (GPU) to transmit data to the central controller 5 through a PCIe switch (PCIe Switch) 57. The PCIe switch 57 is used to establish a high-bandwidth, low-latency second data path between the central controller 5 and the AI ​​computing power card. The second data path is responsible for transmitting the data to be processed to the AI ​​computing power card and feeding back the calculation results to the central controller 5.

[0067] Specifically, the image acquisition device outputs the acquired video information to the video deserializer 52, the video deserializer 52 outputs a parallel signal to the central controller 5, the central controller 5 transmits the parallel signal to be processed to the first AI computing power card 541, the second AI computing power card 542 and the third AI computing power card 543 through the second data path, each computing power card transmits the processed target information to the central controller 5, the central controller 5 generates execution information based on the target information, and the execution information is output to the communication module 55 and / or the functional safety module 56 to control the operating parameters of the target vehicle.

[0068] In one embodiment, the image acquisition device acquires real-time road images and transmits the image data to the central controller 5 through the video deserializer 52. The central controller 5 processes the image data to identify road signs, vehicles, pedestrians, etc. The central controller 5 outputs the processing results and feeds them back to the vehicle control system, thereby realizing functions such as path planning and speed control.

[0069] Furthermore, the computing system further includes a communication module 55 and a functional safety module 56, which are respectively connected to the central controller 5. In this way, the computing system can quickly respond and take protective measures in various application scenarios, thereby improving the reliability of the computing system.

[0070] Specifically, the communication module 55 is responsible for exchanging data with external devices, networks or other systems. The communication module 55 is used to send data processed by the central controller 5 or receive remote commands; the functional safety module 56 is used to process the first control command of the target vehicle, and the first control command is used to control the safety module of the target vehicle. The functional safety module 56 is also used to send the first control command to the vehicle control domain. The vehicle control domain includes various safety modules that actually control the vehicle to execute commands, such as the power system, braking system and steering system. In this embodiment, the functional safety module 56 is specifically a functional safety MCU (Microcontroller Unit), which is a microcontroller used to perform tasks with functional safety requirements. Specifically, the communication module 55 includes a 5G module, a wireless module and a Bluetooth module. The centrally centralized SoC interacts with the cloud through the 5G module and also interacts with the user terminal device through a wireless module or a Bluetooth module.

[0071] Please refer to Figure 7 , Figure 7The embodiment of the present application provides a detection method for a computing device. This specification provides method operation steps as described in the embodiment or flowchart, but more or fewer operation steps may be included based on routine or non-creative work. The order of steps listed in the embodiment is only one way of executing the steps among many, and does not represent the only execution order. When the actual system or server product is executed, it can be executed in the order of the method shown in the embodiment or the accompanying drawings. Specifically, Figure 7 As shown, the method may include the following steps S701-S705. The detection method may be applied to a target computing device or a target computing system, and the method includes:

[0072] S701: Engage a buckle of the heat dissipation assembly with a first edge of a second computing card, where the first edge is disposed on a side of the second computing card away from the back plate.

[0073] Specifically, during the installation process, the buckle 32 of the heat dissipation assembly 3 is first positioned on the first edge of the second computing card 2 , and after the buckle 32 is aligned with the first edge, the buckle 32 is engaged with the first edge of the second computing card 2 by light pressure or sliding.

[0074] S703: Push the first computing card so that the heat dissipation belt fits the first computing card and the second computing card respectively.

[0075] Specifically, the first computing card 1 is pushed manually or mechanically toward the backplane 4 . During the pushing process, the buckle 32 drives the reel 31 to rotate, so that the heat dissipation belt 33 can effectively cover the heat source area between the first computing card 1 and the second computing card 2 .

[0076] S705: Obtain the voltage drop of the conductive loop and determine the unfolded length of the heat dissipation belt.

[0077] Specifically, the voltage detection device monitors the voltage change of the conductive loop in real time. When the heat dissipation belt 33 is being expanded, the change in the length of its conductive path will cause the resistance value to change. By measuring the voltage drop, the calculation system determines the expanded length of the heat dissipation belt 33.

[0078] Specifically, in the heat dissipation assembly 3, the voltage detection device needs to be connected to both ends of the conductive path of the heat dissipation belt 33. The voltage detection device calibrates the conductive path of the heat dissipation belt 33 when it is used for the first time, wherein the resistance is proportional to the length of the conductor. When the heat dissipation belt 33 is unfolded, the conductive path becomes longer and the resistance increases, thereby causing the voltage drop to increase. The voltage detection device transmits the voltage data monitored in real time to the central controller 5 or the dedicated processing unit, and calculates the unfolded length of the current heat dissipation belt 33 according to the pre-established voltage-length mapping relationship. By comparing the real-time voltage value with the preset voltage range, it is determined whether the heat dissipation belt 33 has been unfolded to the preset length. In this way, the calculation device can accurately determine the unfolded length of the heat dissipation belt 33, determine the heat dissipation effect, and ensure that the heat dissipation belt 33 is always in a heat dissipation state during operation through real-time monitoring.

[0079] After S705, it also includes:

[0080] S802: When the unfolded length of the heat dissipation belt 33 meets a preset unfolding condition, obtain a first temperature difference value and / or a second temperature difference value of the first computing card 1 and / or the second computing card 2 within a preset time.

[0081] Specifically, a temperature sensor is provided on the first computing card 1 and / or the second computing card 2, and the temperature sensor is used to monitor the surface temperature of the computing card or the temperature of the processing unit, respectively. The temperature data of the first computing card 1 and the second computing card 2 are continuously collected within a preset time and the temperature changes are recorded.

[0082] In one possible implementation, a first temperature difference ΔT1 of the first computing card 1 within a preset time is obtained; in one possible implementation, a second temperature difference ΔT2 of the second computing card 2 within a preset time is obtained; in one possible implementation, the first temperature difference ΔT1 of the first computing card 1 within a preset time and the second temperature difference ΔT2 of the second computing card 2 within a preset time are obtained.

[0083] S804: When the first temperature difference and / or the second temperature difference meets a preset temperature threshold condition, output a first prompt message, wherein the first prompt message indicates that the heat dissipation belt 33 is in a normal state.

[0084] Specifically, in one embodiment, a preset temperature threshold is set for the first computing card 1 and the second computing card 2, and a first temperature difference ΔT1 of the first computing card 1 within a preset time and a second temperature difference ΔT2 of the second computing card 2 within a preset time are compared with the preset temperature threshold. When the first temperature difference ΔT1 and the second temperature difference ΔT2 of the second computing card 2 within the preset time are greater than or equal to the preset temperature threshold, it indicates that the heat dissipation effect of the heat dissipation belt 33 is good, that is, the heat dissipation belt 33 is in a normal state, and the control device generates a first prompt message, which can be fed back to the user through a user interface display, an LED indicator light or other methods.

[0085] S806: When the first temperature difference and / or the second temperature difference does not satisfy the preset temperature threshold condition, output a second prompt message, where the second prompt message indicates that the heat dissipation belt 33 is in an abnormal state.

[0086] Specifically, in one embodiment, the first temperature difference ΔT1 of the first computing card 1 within the preset time and the second temperature difference ΔT2 of the second computing card 2 within the preset time are compared with the preset temperature threshold. When the first temperature difference ΔT1 and the second temperature difference ΔT2 of the second computing card 2 within the preset time are less than the preset temperature threshold, it indicates that the heat dissipation effect of the heat dissipation belt 33 does not meet the requirements, that is, the heat dissipation belt 33 is in an abnormal state, and the control device generates a second prompt message, and the second prompt message is used to remind the user that there is an abnormal heat dissipation situation. The second prompt message can specifically state that "the heat dissipation belt 33 is abnormal, and the system temperature is too high", and suggest that the user check the heat dissipation belt 33, such as readjusting the heat dissipation belt 33, checking whether the heat dissipation path is unobstructed, or replacing the heat dissipation component 3.

[0087] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A computing device, characterized in that: The computing device comprises a first computing card (1), a second computing card (2), a backplane (4) and a heat dissipation component (3). The backplane (4) is used to connect to the first computing card (1) and the second computing card (2); the heat dissipation component (3) is arranged at the edge of the first computing card (1); The heat dissipation assembly (3) comprises a reel (31), a buckle (32) and a heat dissipation belt (33); the buckle (32) is used to engage with the second computing card (2) to drive the heat dissipation belt (33) to be laid between the first computing card (1) and the second computing card (2) in a direction away from the reel (31).

2. The computing device according to claim 1, wherein: The heat dissipation belt (33) comprises a graphene heat dissipation layer, and the graphene heat dissipation layer is used to be respectively attached to the first computing card (1) and the second computing card (2).

3. The computing device according to claim 2, characterized in that The heat dissipation belt (33) further comprises a first conductive strip and a second conductive strip, the reel (31) comprises a conductive contact sheet, and the first conductive strip (331), the conductive contact sheet, the second conductive strip (332) and the buckle (32) form a conductive loop.

4. The computing device according to claim 3, characterized in that The first conductive strip (331) and the second conductive strip (332) are arranged in parallel.

5. The computing device according to claim 1 or 2, characterized in that: The heat dissipation component (3) is connected to a cooling system.

6. The computing device according to claim 1 or 2, characterized in that: The area of ​​the heat dissipation belt (33) is smaller than the area of ​​the first surface of the first computing card (1), and the first surface is arranged on a side close to the second computing card (2).

7. A computing system, characterized in that: The computing device comprises a computing device as claimed in any one of claims 1 to 6, wherein the computing system further comprises a central controller (5) and a mainboard. The central controller (5) and the computing device are both connected to the mainboard, and the first computing card (1) and the second computing card (2) in the computing device are stacked in sequence along a direction parallel to the mainboard.

8. The computing system according to claim 7, characterized in that: The computing system further comprises an image acquisition device and a video deserializer (52), wherein the image acquisition device is connected to the video deserializer (52), and the video deserializer (52) is connected to the central controller (5).

9. The computing system according to claim 7 or 8, characterized in that: The computing system further comprises a communication module (55) and a functional safety module (56), wherein the communication module (55) and the functional safety module (56) are respectively connected to the central controller (5).

10. A method for detecting a computing device, the method being applied to the computing device according to any one of claims 1 to 6, characterized in that: The method comprises: The buckle (32) of the heat dissipation component (3) is engaged with the first edge of the second computing card (2), wherein the first edge is arranged on a side of the second computing card (2) away from the back plate (4); Pushing the first computing card (1) so that the heat dissipation belt (33) is respectively attached to the first computing card (1) and the second computing card (2); The voltage drop of the conductive loop is obtained to determine the unfolded length of the heat dissipation belt (33).

11. The method according to claim 10, characterized in that After obtaining the voltage drop of the conductive loop and determining the unfolded length of the heat dissipation belt (33), the method further comprises: When the unfolded length of the heat dissipation belt (33) satisfies a preset unfolding condition, obtaining a first temperature difference value and / or a second temperature difference value of the first computing card (1) and / or the second computing card (2) within a preset time; When the first temperature difference and / or the second temperature difference meets a preset temperature threshold condition, outputting first prompt information, wherein the first prompt information indicates that the heat dissipation belt (33) is in a normal state; When the first temperature difference and / or the second temperature difference do not meet a preset temperature threshold condition, a second prompt information is output, wherein the second prompt information indicates that the heat dissipation belt (33) is in an abnormal state.

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