Resin molding apparatus and method for manufacturing resin molded article

Abstract

A resin molding device is provided with: a resin supply mechanism (21) for supplying a particulate resin (R) to an object (F) to be supplied; a molding die including an upper die and a lower die facing the upper die, the powder resin (R) being disposed between the upper die and the lower die; and a mold clamping mechanism for clamping the forming mold and performing compression molding. The resin supply mechanism (21) has: a cylindrical rotating body (230) having a plurality of recesses (232a) on an outer peripheral surface (231), the rotating body rotating about an axis (X); a resin supply unit (220) for storing the particulate resin (R) and having formed therein an opening (223) through which the particulate resin (R) freely falls and is supplied to the rotating body (230); and a blade-like member (224) disposed so that one end thereof is in contact with the outer peripheral surface (231) of the rotating body.

Description

Technical Field

[0001] The present disclosure relates to a resin molding device and a method for manufacturing a resin molded product. Background Art

[0002] A substrate or the like having a semiconductor chip fixed thereon is generally used as an electronic component by being encapsulated with a resin. Conventionally, there is known a resin molding apparatus having a resin supply mechanism for supplying a powdery or granular resin (for example, see Patent Document 1).

[0003] Patent document 1 describes a resin molding device having a resin supply mechanism ("resin material supply device" in Patent document 1), which supplies a powdered resin ("resin material" in Patent document 1) from a resin material supply port formed at the end of a groove to a supply object ("resin material conveying tray" in Patent document 1). Specifically, the groove is vibrated to cause the powdered resin to fall from the resin material supply port, so that the powdered resin is supplied to the supply object in a manner that the supply amount per unit time is constant. The supply object moves relative to the resin material supply port and returns to the supply start position without passing through the same relative position more than twice.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2018-65335 Summary of the invention

[0007] Problems to be solved by the invention

[0008] In order to manufacture a resin molded product with high precision, it is necessary to supply the powdery resin to the supply object with high precision. Therefore, the supply amount per unit time of the powdery resin supplied from the resin material supply port becomes smaller. In addition, in Patent Document 1, since the opening area of ​​the resin material supply port is smaller than the size of the supply object, a lot of time is required to supply the powdery resin to the entire supply object. In the case where the size of the supply object is large, it takes more time to move the supply object relatively.

[0009] Therefore, there is a demand for a resin molding apparatus and a method for producing a resin molded product that can increase the supply amount per unit time and shorten the supply time while maintaining the supply accuracy of the powder or granular resin.

[0010] Solutions for solving problems

[0011] The characteristic structure of the resin molding device disclosed in the present invention is that it is equipped with: a resin supply mechanism for supplying a powdery resin to a supply object; a molding die, including an upper die and a lower die opposite to the upper die, and the powdery resin is arranged between the upper die and the lower die; and a clamping mechanism for clamping the molding die and performing compression molding, the resin supply mechanism comprising: a rotating body, which is a cylindrical shape with a plurality of recessed portions on the outer peripheral surface, and the rotating body rotates around an axis; a resin supply portion for storing the powdery resin and forming an opening for allowing the powdery resin to fall freely and be supplied to the rotating body; and a scraper-like member, which is arranged in a manner that one end is in contact with the outer peripheral surface of the rotating body.

[0012] The manufacturing method of the resin molded product disclosed in the present invention is characterized in that it is a manufacturing method of the resin molded product using the resin molding device described above, which includes: a resin supply process, using the resin supply mechanism to supply the powdered resin to the supply object; and a molding process, supplying a pre-molding substrate and the supply object to the molding mold, and using the mold clamping mechanism to clamp the molding mold and perform resin molding of the resin molded product.

[0013] Effects of the Invention

[0014] According to the present disclosure, it is possible to provide a resin molding apparatus and a method for manufacturing a resin molded product that can increase the supply amount per unit time and shorten the supply time while maintaining the supply accuracy of a powder or granular resin. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram showing a resin molding apparatus according to this embodiment.

[0016] Figure 2 This is a schematic diagram showing a mold clamping mechanism of a resin molding device.

[0017] Figure 3 It is a schematic diagram showing the resin supply mechanism of the first embodiment.

[0018] Figure 4 This is a schematic diagram of the resin supply mechanism viewed from the X direction.

[0019] Figure 5 It is a diagram showing a modified example of the rotating body.

[0020] Figure 6 It is a diagram showing a modified example of the rotating body.

[0021] Figure 7 It is a diagram showing a modified example of the rotating body.

[0022] Figure 8 It is a diagram showing a modified example of the rotating body.

[0023] Fig. 9 It is a diagram showing a modified example of the rotating body.

[0024] Fig.10 This is a diagram showing a state where coarse particles lift up the scraper.

[0025] Fig.11 It is a figure which shows the modification of a scraper.

[0026] Fig.12 It is a schematic diagram showing a resin supply mechanism according to a second embodiment.

[0027] Fig.13 It is a schematic diagram showing the first moving mechanism of the second embodiment.

[0028] Fig.14 This is a diagram showing the procedure for measuring the weight of a powdery or granular resin.

[0029] Fig.15 This is a diagram showing the procedure for measuring the weight of a powdery or granular resin.

[0030] Fig.16 It is a schematic diagram showing the first moving mechanism and the second moving mechanism of the third embodiment.

[0031] Fig.17 It is a schematic diagram showing a resin supply mechanism according to a fourth embodiment.

[0032] Fig.18 It is a top view showing the resin holding mechanism.

[0033] Fig.19 It is a longitudinal sectional view showing the resin holding mechanism. DETAILED DESCRIPTION

[0034] Hereinafter, embodiments of the resin molding device and the method for manufacturing a resin molded product disclosed in the present invention will be described based on the accompanying drawings. In this embodiment, as an example of the resin molding device, Figure 1 As shown, a resin molding device D including the resin supply module 2 will be described. However, the present disclosure is not limited to the following embodiments, and various modifications can be made without departing from the gist of the present disclosure.

[0035] 〔Device composition〕

[0036] Substrates or the like having semiconductor chips fixed thereon are used as electronic parts by resin encapsulation. As a technique for resin encapsulation of a molding object, a compression method (compression molding), a transfer method, etc. can be cited. As one of the compression methods, the following resin encapsulation method can be cited: after a powdery resin is supplied to a release film, the release film is placed on the lower mold of a molding mold, and the molding object is immersed in a molten resin formed by melting the powdery resin on the release film to perform resin molding. The resin molding device D in this embodiment adopts a compression method, and the resin supply module 2 is a device for supplying a powdery resin to a release film F (an example of a supply object). In the following, the supply object to which the powdery resin is to be supplied is set as the release film F, the substrate S having a semiconductor chip (hereinafter sometimes referred to as a "chip") fixed thereon is set as an example of a molding object, the direction of gravity is set as the bottom, and the direction opposite to the direction of gravity is set as the top for explanation. It should be noted that, Figure 1 The Z direction shown is the up-down direction, the arrangement direction of the resin supply module 2, the compression molding module 3, and the substrate supply and accommodating module 4 described later is the X direction, and the direction perpendicular to the X direction and the Z direction (the depth direction of each module) is the Y direction. It should be noted that, as electronic components, in addition to semiconductor chips, resistor elements, capacitor elements, etc. can also be listed. In addition, the powdered resin not only includes powdered resins, granular resins with a larger particle size than the powdered resin, but also granular resins with a larger particle size. The powdered resin is a resin that is solid at room temperature and can be a thermoplastic resin or a thermosetting resin, but in the present embodiment, a thermosetting resin is preferably used.

[0037] Figure 1 The resin molding device D shown in the figure has: a substrate supply and storage module 4, three compression molding modules 3 (hereinafter, when distinguishing the three compression molding modules 3, they are respectively referred to as compression molding modules 3A, 3B, 3C), and a resin supply module 2 as components. The substrate supply and storage module 4, the compression molding modules 3A, 3B, 3C, and the resin supply module 2 as components are detachable and replaceable relative to other components. It should be noted that the compression molding module 3 in this embodiment is composed of three, but it can also be composed of one, two, or more than four.

[0038] The substrate supply and storage module 4 is provided with: a first storage section 43 for storing a pre-resin-encapsulated substrate Sa (a scheme of substrate S. An example of a pre-molding substrate) to which a chip before resin encapsulation is fixed; a second storage section 44 for storing a resin-encapsulated substrate Sb (a scheme of substrate S. An example of a resin molded product) after resin encapsulation; a substrate placement section 41 for transferring the pre-resin-encapsulated substrate Sa and the resin-encapsulated substrate Sb; and a substrate loader 42 for conveying the pre-resin-encapsulated substrate Sa and the resin-encapsulated substrate Sb. The substrate placement section 41 moves in the Y direction in the substrate supply and storage module 4. The substrate loader 42 moves in the X direction and the Y direction in the substrate supply and storage module 4 and each compression molding module 3. The specified position S1 is a position for waiting when the substrate loader 42 is not in operation.

[0039] The substrate supply and storage module 4 also includes an inspection mechanism (not shown). The inspection mechanism inspects the chip existence area in the resin-encapsulated front substrate Sa, which is the molding object in the compression molding module 3. The inspection mechanism checks whether the chip actually exists in the existence area of ​​the chip to be inspected by scanning with a laser displacement meter, and stores the places where the chip exists and the places where the chip does not exist. It should be noted that the inspection mechanism can also use a visible light camera or the like to photograph the resin-encapsulated front substrate Sa, and inspect the chip existence area in the resin-encapsulated front substrate Sa based on the photographed image.

[0040] Each compression molding module 3 is provided with a lower mold LM capable of being raised and lowered and an upper mold UM arranged opposite to the lower mold LM (see Figure 2 The upper mold UM and the lower mold LM constitute a molding mold M. Each compression molding module 3 has a mold clamping mechanism 35 ( Figure 1 The lower mold LM is provided with a lower mold cavity MC for supplying the release film F and the powdery resin R (see Figure 2 ). The lower mold LM and the upper mold UM can move relative to each other to close and open the mold.

[0041] The resin supply module 2 is provided with: an X-Y table including a base 27, a resin spraying table 22 provided on the base 27, and a ball screw 29; a mold release film supply mechanism 25 for supplying a mold release film F to the resin spraying table 22; a cleaning mechanism 24 for cleaning the lower surface or inner side surface of a frame 23 (an example of a supply object); a resin loader 26 for conveying the frame 23; a resin conveying mechanism 20 for feeding a powdery resin into the mold release film F in the frame 23; and a resin supply mechanism 21. The resin spraying table 22 is configured to be movable in the X direction and the Y direction in the resin supply module 2. The resin loader 26 is configured to be movable in the X direction and the Y direction in the resin supply module 2 and each compression molding module 3. The predetermined position M1 is a position for waiting when the resin loader 26 is not in operation.

[0042] The control unit 5 is a software for controlling the operation of the resin molding device D, which is composed of a program stored in hardware such as a HDD (Hard Disk Drive) and a memory, and is executed by a processor such as a CPU (Central Processing Unit) and an ASIC (Application Specific Integrated Circuit) of a computer. In the present embodiment, the control unit 5 controls the resin supply mechanism 21 of the resin supply module 2 to improve the accuracy of the supply amount (weight) of the powdery resin to the release film F. The notification unit 6 notifies the operation of the resin molding device D, and is composed of a display, an alarm lamp, etc., which are arranged on the front surface of the substrate supply storage module 4.

[0043] [Composition of molding die]

[0044] like Figure 2 As shown, the compression molding module 3 in this embodiment is composed of a press frame (Press frame) formed by integrating a lower fixed plate 31 and an upper fixed plate 33 by a flat plate-shaped member 32 arranged opposite to each other. It should be noted that the lower fixed plate 31 and the upper fixed plate 33 can also be connected by four connecting rods (columnar members) instead of the flat plate-shaped member 32. A movable platen 34 is provided between the lower fixed plate 31 and the upper fixed plate 33. The movable platen 34 can move up and down along the flat plate-shaped member 32. A clamping mechanism 35 is provided on the lower fixed plate 31 to move the movable platen 34 up and down by a ball screw or the like. The clamping mechanism 35 can close the molding mold M by moving the movable platen 34 upward, and open the molding mold M by moving the movable platen 34 downward. The driving source of the clamping mechanism 35 is not particularly limited, and for example, an electric motor such as a servo motor (not shown) can be used.

[0045] The upper mold UM and the lower mold LM as the molding mold M are arranged opposite to each other, and both are composed of molds and the like. An upper mold holder 39 including an upper heater 37 is arranged on the lower surface of the upper fixed plate 33, and the upper mold UM is installed below the upper mold holder 39. An upper mold substrate setting portion (not shown) for arranging the substrate S is provided on the upper mold UM, and a substrate S (resin encapsulation front substrate Sa) on which chips and the like are fixed is installed on the lower surface of the upper mold UM. A lower mold holder 38 including a lower heater 36 is arranged on the upper surface of the movable platen 34, and a lower mold LM is provided above the lower mold holder 38. By holding a release film F sucked by a suction mechanism in the lower mold cavity MC, the resin supply mechanism 21 supplies the powdery resin R supplied to the release film F to the lower mold cavity MC. By clamping the molding mold M by the clamping mechanism 35 and heating the lower mold LM by the lower heater 36, the powdery resin R in the lower mold cavity MC is melted and solidified. That is, with the pre-resin encapsulation substrate Sa and the release film F disposed between the upper mold UM and the lower mold LM, the molding mold M is closed by the mold closing mechanism 35 to perform resin encapsulation. Thus, the chip and the like fixed to the pre-resin encapsulation substrate Sa (pre-molding substrate) are resin encapsulated in the lower mold cavity MC to form a resin encapsulated substrate Sb (resin molded product).

[0046] [First embodiment]

[0047] Next, the resin supply mechanism 21 of the first embodiment will be described. Figure 3 , Figure 4 2 is a schematic diagram showing the resin conveying mechanism 20 , the resin supply mechanism 21 , and the XY stage of the resin supply module 2 .

[0048] like Figure 3 As shown in FIG. 5 , the resin conveying mechanism 20 includes a resin storage section 200, a vibrating section 202, a resin conveying path 204, and a first resin drop opening 207. The resin storage section 200 stores a powdery resin R. The resin conveying path 204 has one end connected to the resin storage section 200 near the bottom of the resin storage section 200, and has an opening, i.e., a first resin drop opening 207, at the other end for supplying the powdery resin R to the resin storage section 210 of the resin supply mechanism 21. The vibrating section 202 vibrates the resin storage section 200 and the resin conveying path 204 in accordance with an instruction from the control section 5. The vibrating section 202 applies vibration to the resin storage section 200 and the resin conveying path 204, so that the powdery resin R stored in the resin storage section 200 moves on the resin conveying path 204 and drops from the first resin drop opening 207 having a rectangular cross section toward the resin storage section 210 of the resin supply mechanism 21. At this time, the vibrator 202 vibrates the resin storage unit 200 and the resin transport path 204 .

[0049] The resin supply mechanism 21 includes a resin storage unit 210 , a weight measuring unit 212 , a resin supply unit 220 , a rotating body 230 , a rotating body driving unit 234 , a guide 240 , and a guide driving unit 248 .

[0050] The resin storage section 210 temporarily stores the powdery resin R supplied from the resin storage section 200 via the resin conveying path 204, and supplies the powdery resin R to the resin supply section 220 described later. The resin storage section 210 has a first resin input port 210A as an opening formed at the upper portion, and a second resin drop port 210B as an opening formed at the lower portion. The powdery resin R stored in the resin storage section 200 freely falls from the first resin drop port 207 and is supplied from the first resin input port 210A to the resin storage section 210. That is, the resin storage section 210 is arranged vertically below the first resin drop port 207 of the resin conveying mechanism 20. The powdery resin R temporarily stored in the resin storage section 210 freely falls from the second resin drop port 210B and is supplied to the resin supply section 220. In the present embodiment, the first resin input port 210A and the second resin drop port 210B have circular cross-sections, and the inner diameter of the second resin drop port 210B is smaller than the inner diameter of the first resin input port 210A.

[0051] A shutter (not shown) based on a choke valve is disposed at the second resin drop opening 210B. The shutter can block the second resin drop opening 210B, thereby preventing the powdery resin R stored in the resin storage section 210 from falling, and maintaining the powdery resin R stored in the resin storage section 210. In addition, by closing the shutter, when the type of the powdery resin R used for molding is changed while the powdery resin R remains in the resin storage section 210, the resin storage section 210 can be removed from the resin supply mechanism 21 without causing the powdery resin R to fall into the resin supply section 220.

[0052] The resin storage unit 210 of this embodiment does not have a function of vibrating the resin storage unit 210, and the powdery resin R supplied by the resin conveying mechanism 20 moves toward the second resin drop opening 210B due to its own weight. However, in order to drop the powdery resin R adhering to the inner peripheral surface of the resin storage unit 210, a vibration mechanism for vibrating the resin storage unit 210 may be separately provided.

[0053] The weight measuring unit 212 measures the weight of the resin storage unit 210 to measure the weight of the powdery or granular resin R stored therein. The measured weight data of the powdery or granular resin R is sent to the control unit 5 .

[0054] The resin supply unit 220 supplies the powdery resin R supplied from the resin storage unit 210 to the rotating body 230. That is, the resin supply unit 220 is arranged vertically below the second resin drop port 210B. The resin supply unit 220 has a hollow box shape and supplies the powdery resin R into the hollow space 221. In this embodiment, the resin supply unit 220 is composed of an upper plate 225, a front plate 226, a rear plate 227, and two side plates 228 (see Figure 4 ) Figure 3 As shown, the resin supply unit 220 does not have a bottom plate, and a rectangular third resin drop port 223 (an example of an opening) is formed on the bottom side by a front plate 226, a rear plate 227, and two side plates 228. A second resin inlet 222 having a circular cross-section for supplying the powdery granular resin R dropped from the second resin drop port 210B into the space 221 is formed on the upper plate 225. That is, the powdery granular resin R is supplied from the second resin inlet 222 and discharged from the third resin drop port 223. In this embodiment, as shown in FIG. Figure 3 As shown, the top end of the second resin drop port 210B enters the second resin input port 222 .

[0055] In the resin supply unit 220 of the present embodiment, the upper side of the rear plate 227 is arranged parallel to the vertical direction, and is bent in the middle of the rear plate 227 in a direction close to the front plate 226. As a result, the lower side of the rear plate 227 is inclined relative to the vertical direction. The front plate 226 is a flat plate as a whole, and is arranged inclined relative to the vertical direction in a manner that it approaches the rear plate 227 as it goes downward. The third resin drop opening 223 is configured as a rectangle whose inner dimension between the two side plates 228 is longer than the inner dimension between the front plate 226 and the rear plate 227.

[0056] A plate-shaped scraper 224 (an example of a scraper-shaped member) made of an elastic material such as rubber or an elastomer is mounted on the lower end of the front plate 226. The scraper 224 is mounted on the front plate 226 in a state of protruding downward from the front plate 226. The resin supply unit 220 is arranged relative to the rotating body 230 such that one end (lower end) of the scraper 224 contacts the outer peripheral surface 231 (side surface) of the rotating body 230, and a small gap is provided between the rear plate 227 and the outer peripheral surface 231 of the rotating body 230.

[0057] The rotating body 230 has a cylindrical shape, and a plurality of recesses 232 are formed on the outer peripheral surface 231. In the present embodiment, as an example of the recess 232, a plurality of grooves 232a (see FIG. 2 ) are formed which are parallel to the rotation axis X (an example of the axis. Hereinafter, also referred to as “axis X”) of the rotating body 230 and have the same length in the direction parallel to the axis X of the rotating body 230 (hereinafter, also referred to as the full length of the rotating body 230). Figure 4The rotating body 230 is rotated about the axis X by a rotating body driving unit 234 composed of a motor or the like. The rotating body 230 may be made of any material such as resin, ceramic, or metal, but ceramic is preferably used from the viewpoint of preventing the generation of foreign matter.

[0058] The rotating body 230 is supplied with the resin dropped from the third resin drop opening 223 of the resin supply unit 220. That is, the rotating body 230 is arranged vertically below the third resin drop opening 223 of the resin supply unit 220. Specifically, the entire length of the rotating body 230 is equal to or slightly shorter than the inner dimension between the two side plates 228 of the resin supply unit 220, and the rotating body 230 is arranged between the two side plates 228 (refer to Figure 4 ). In addition, the lower end of the rear plate 227 is configured to be located vertically above the axis X of the rotating body 230 or on the rotation direction side of the axis X. Moreover, the contact portion 224a of the scraper 224 that contacts the outer peripheral surface 231 of the rotating body 230 is located on the rotation direction side of the rear plate 227. That is, the rotating body 230 rotates from the rear plate 227 of the resin supply part 220 toward the scraper 224 (front plate 226). When observed in the vertical direction, the third resin drop port 223 is configured as a whole on the side of the rotation direction of the rotating body 230 that is closer to the axis X. It should be noted that the contact portion 224a refers to the linear portion where the scraper 224 contacts the outer peripheral surface 231 of the rotating body 230.

[0059] The scraper 224 is arranged so that the angle θ formed by the vertical plane p, which is a plane in the vertical direction passing through the axis X, and the contact surface q passing through the axis X and the contact portion 224a of the scraper 224 is greater than 0 degrees and less than 45 degrees, preferably less than 30 degrees. In this way, the rotating body 230 is arranged at a position close to the third resin drop opening 223, and there is almost no gap between the outer peripheral surface 231 of the rotating body 230 and the third resin drop opening 223. The powdery and granular resin R supplied from the resin storage part 210 to the resin supply part 220 diffuses in the space 221 in the direction of the axis X as a whole and then falls from the third resin drop opening 223, so that the powdery and granular resin R supplied to the rotating body 230 is supplied to the entire length direction of the groove 232a.

[0060] When the rotating body 230 rotates, when any groove 232a faces the third resin drop opening 223, that is, when the groove 232a is located vertically above the axis X, the powdery resin R is supplied to the entire groove 232a. At this time, the powdery resin R is supplied in a manner that it bulges above (outward in the radial direction) the outer peripheral surface 231 in addition to the entire groove 232a. Thereafter, when the rotating body 230 rotates and the groove 232a reaches the contact portion 224a of the scraper 224, the powdery resin R bulging from the groove 232a becomes redundant resin and is scraped off by the scraper 224. As a result, the powdery resin R having the same volume as the volume of the groove 232a remains in the groove 232a after passing through the contact portion 224a. When the groove 232a comes to a position below the axis X due to the rotation of the rotating body 230, the powdery resin R in the groove 232a freely falls from the groove 232a. With such a configuration, it is possible to always drop a certain amount of the powdery or granular resin R. It should be noted that the powdery or granular resin R is not dropped by applying vibration to the rotating body 230 .

[0061] The guide 240 is provided to make the powdery resin R dropped from the groove 232a of the rotating body 230 drop from the fourth resin drop port 242 onto the release film F. The guide 240 has a square cylindrical shape, and at least a portion of the rotating body 230 below the axis X enters the internal space 241 of the guide 240. Figure 3 , the substantially entire rotating body 230 enters the internal space 241. In the present embodiment, the guide 240 is composed of a front plate 246 (an example of a plate-shaped member), a rear plate 247, and two side plates (not shown). The fourth resin drop opening 242 is formed by the front plate 246, the rear plate 247, and the two side plates, and is configured in a rectangular shape in which the inner dimension between the two side plates is longer than the inner dimension between the front plate 246 and the rear plate 247. The length of the fourth resin drop opening 242 along the axis X direction (the inner dimension between the two side plates) is equal to or slightly larger than the total length of the rotating body 230.

[0062] In the guide 240, the upper side of the rear plate 247 is arranged parallel to the vertical direction, and is bent in the middle of the rear plate 247 toward the front plate 246, and then is bent again in a manner parallel to the vertical direction near the lower end. As a result, the lower side of the rear plate 247 is inclined relative to the vertical direction except near the lower end. The front plate 226 is a flat plate as a whole and is arranged parallel to the vertical direction.

[0063] The guide 240 is configured to be movable vertically by a guide driving unit 248 , which is composed of, for example, an air cylinder. The rotating body 230 and the resin supply unit 220 are not linked to the vertical movement of the guide 240 .

[0064] Thus, compared with the conventional structure of supplying the powdery resin R from the resin material supply port to the release film F, the resin supply mechanism 21 of the present embodiment has the rotating body 230 having a longer total length as the length in the direction parallel to the axis X, and thus can supply the powdery resin R of a volume equal to the volume of the groove 232a to the release film F at one time. Therefore, compared with the conventional resin supply mechanism, the supply amount of the powdery resin R per unit time can be increased. Thus, for example, even for a substrate of such a size that the release film F is conventionally supplied with the powdery resin R by reciprocating the release film F several times, the resin supply mechanism 21 of the present embodiment can supply the powdery resin R by moving the release film F only once (single pass) in one direction, and the time for supplying the powdery resin R to the release film F can be greatly shortened.

[0065] When the rotating body 230 rotates, the excess powdery resin R protruding from the groove 232a is scraped off by the scraper 224, so that the powdery resin R of a volume equal to the volume of the groove 232a after passing through the scraper 224 is always supplied. The powdery resin R of a volume equal to the volume of the groove 232a can be continuously supplied by the continuous rotation of the rotating body 230. In this way, in the resin supply mechanism 21 of the present embodiment, the supply amount per unit time can be increased while maintaining the supply accuracy of the powdery resin R, and the supply time of the powdery resin R to the release film F can be shortened.

[0066] [Manufacturing method of resin molded product]

[0067] Next, use Figure 1 to Figure 3 A method for producing a resin molded article will be described.

[0068] Reference Figure 1, the action of resin encapsulating the substrate S (pre-resin encapsulation substrate Sa) using the resin molding device D is described. The following actions are controlled by the control unit 5. First, in the substrate supply and storage module 4, the pre-resin encapsulation substrate Sa is sent from the first storage unit 43 to the substrate loading unit 41. Next, the substrate loader 42 is moved from the specified position S1 to the -Y direction to receive the pre-resin encapsulation substrate Sa from the substrate loading unit 41. At this time, the inspection mechanism pre-inspects the existence area of ​​chips and the like in the substrate S (pre-resin encapsulation substrate Sa) as the molding object. The control unit 5 pre-calculates (or sets) the target supply amount, target supply position, and / or resin supply track of the powdery resin R in the resin supply area in the frame 23 based on at least the size of the substrate S as the molding object and the existence area of ​​the chips and the like in the substrate S. Then, the substrate loader 42 is returned to the specified position S1. Next, for example, the substrate loader 42 is moved to the specified position P1 of the compression molding module 3B in the +X direction. Next, in the compression molding module 3B, the substrate loader 42 is moved in the -Y direction and stopped at a predetermined position C1 on the lower mold LM. Next, the substrate loader 42 is moved upward to fix the pre-resin encapsulated substrate Sa to the upper mold UM. The substrate loader 42 is returned to the predetermined position S1 of the substrate supply and storage module 4.

[0069] Next, in the resin supply module 2, the release film F supplied from the release film supply mechanism 25 to the resin spraying workbench 22 is cut into a predetermined size. Next, the resin loader 26 is moved from the predetermined position M1 to the -Y direction to receive the frame 23 cleaned by the cleaning mechanism 24. Next, the resin loader 26 is further moved to the -Y direction to place the frame 23 on the release film F adsorbed to the resin spraying workbench 22. Then, the resin loader 26 is returned to the original predetermined position M1. Next, the resin spraying workbench 22 is moved to the +X direction to stop the frame 23 at a predetermined position below the resin supply mechanism 21. Next, by moving the resin spraying workbench 22 (frame 23) in the X direction and the Y direction, a predetermined amount of powdery resin R is supplied from the resin supply mechanism 21 to the release film F in the frame 23 (resin supply process). Then, the resin spraying workbench 22 is returned to its original position.

[0070] In the resin supply process, Figure 3As shown, under the control of the control unit 5, the resin supply mechanism 21 supplies the powdery resin R of the weight corresponding to the target supply amount onto the release film F. First, the excitation unit 202 of the resin conveying mechanism 20 vibrates, and the powdery resin R stored in the resin storage unit 200 is conveyed on the resin conveying path 204, and is supplied to the resin storage unit 210 of the resin supply mechanism 21 from the first resin drop port 207. At this time, the shutter (not shown) of the resin storage unit 210 is closed. Then, when the weight measuring unit 212 measures that a predetermined amount of resin is stored and the weight data is sent to the control unit 5, the excitation unit 202 is stopped under the control of the control unit 5, and the supply of the powdery resin R from the resin conveying mechanism 20 is stopped, and the shutter is opened to supply the powdery resin R from the second resin drop port 210B to the resin supply unit 220.

[0071] When the weight measuring unit 212 measures the amount of reduction in the powdery resin R and determines that a predetermined amount of the powdery resin R has been supplied to the resin supply unit 220, the guide driving unit 248 moves the guide 240 downward. Figure 3 As shown in FIG. 1 , the fourth resin drop opening 242 is located below the upper surface (top surface) of the frame body 23 (in the direction close to the release film F). Then, the control unit 5 operates the rotating body driving unit 234. As a result, the rotating body 230 starts to rotate. When the rotation of the rotating body 230 starts, the resin is supplied in a manner that bulges upward (outward in the radial direction) on the outer peripheral surface 231 in addition to the entire groove 232a formed on the outer peripheral surface 231 of the rotating body 230.

[0072] When the rotating body 230 rotates and the groove 232a to which the powdery or granular resin R is supplied passes through the contact portion 224a of the scraper 224, the excess powdery or granular resin R protruding from the outer peripheral surface 231 is scraped off by the scraper 224, and the powdery or granular resin R having the same volume as the volume of the groove 232a remains in the groove 232a after passing through the contact portion 224a. Then, the powdery or granular resin R in the resin supply unit 220 including the scraped powdery or granular resin R is supplied to the next groove 232a located behind in the rotation direction of the rotating body 230. When the groove 232a comes to a position below the axis X due to the rotation of the rotating body 230, the powdery or granular resin R in the groove 232a passing through the contact portion 224a of the scraper 224 freely falls from the groove 232a toward the guide 240.

[0073] The powdery resin R dropped from the groove 232a into the guide 240 drops from the fourth resin drop port 242 and is supplied onto the release film F. At this time, the resin spraying table 22 of the X-Y table moves along the resin supply track calculated in advance under the control of the control unit 5. Thus, the powdery resin R of the target supply amount is supplied to the target supply position. It should be noted that the control unit 5 stores a calculation table or calculation formula regarding the supply amount of the powdery resin R to the release film F per unit time based on the size of the substrate S as the molding object or the existence area of ​​the chip or the like in the substrate S, the reduction amount of the powdery resin R from the resin storage unit 210 per unit time, the rotation speed of the rotating body 230, and the volume of the groove 232a, and calculates the target supply amount of the powdery resin R, the target supply position, and the resin supply track based on this.

[0074] After the supply of the powdery resin R to the release film F is completed, the guide 240 rises so that the fourth resin drop port 242 is located above the upper surface of the frame 23. Next, the resin loader 26 is moved from the predetermined position M1 to the -Y direction to receive the release film F supplied with the powdery resin R placed on the resin spraying workbench 22, and the resin loader 26 is returned to the original predetermined position M1 (see Figure 1 ). Next, the resin loader 26 is moved in the -X direction to the predetermined position P1 of the compression molding module 3B. Next, in the compression molding module 3B, the resin loader 26 is moved in the -Y direction and stops at the predetermined position C1 on the lower mold LM. Next, the resin loader 26 is lowered to supply the release film F supplied with the powdery resin R to the lower mold cavity MC. The resin loader 26 is returned to the predetermined position M1.

[0075] Next, in the compression molding module 3B, as Figure 2 As shown, the lower mold LM is moved upward by the mold clamping mechanism 35 to clamp the upper mold UM and the lower mold LM. After a specified time, the lower mold LM is moved downward to open the upper mold UM and the lower mold LM (molding process). Next, the substrate loader 42 is moved from the specified position S1 of the substrate supply and accommodating module 4 to the specified position C1 on the lower mold LM to receive the resin-encapsulated substrate Sb. Next, the substrate loader 42 is moved to the top of the substrate loading section 41 via the specified position S1 to hand over the resin-encapsulated substrate Sb to the substrate loading section 41. The resin-encapsulated substrate Sb is stored from the substrate loading section 41 to the second accommodating section 44. In this way, the resin encapsulation is completed. The control section 5 determines whether to continue the supply of the powdery resin R on the release film F, and executes the above-mentioned control again when the resin supply is continued, and ends the control when the resin supply is not continued.

[0076] [Deformation example of the concave portion of the rotating body]

[0077] In the above embodiment, the recessed portion 232 of the outer peripheral surface 231 of the rotating body 230 is formed with a plurality of grooves 232a parallel to the axis X, but the present invention is not limited thereto. Figure 5 As shown in FIG. 1 , the grooves 232a may be provided in a grid pattern in two directions, parallel to the axis X and perpendicular to the axis X. Figure 6 As shown in FIG. 1 , the lattice-shaped grooves 232a may also be formed in directions that are inclined relative to the axis X. Figure 7 As shown, a plurality of spiral grooves 232a parallel to the direction inclined relative to the axis X may also be formed. Figure 8 As shown in FIG. 2 , a spiral groove 232a may be formed in two directions. Fig. 9 As shown, the recessed portion 232 may include a plurality of pits 232b instead of the grooves 232a. In this way, the shape of the recessed portion 232 can be arbitrarily set according to the supply amount and supply accuracy of the powdery resin R. By making the recessed portion 232 the pits 232b, the intervals between adjacent pits 232b are smaller than the intervals between adjacent grooves 232a, and when the rotating body 230 is rotated, the powdery resin R can be continuously dropped, so that the powdery resin R can be supplied to the release film F with higher accuracy.

[0078] [Modification of the shape of the scraper]

[0079] In this embodiment, the scraper 224 is in the form of a flat plate. However, if coarse particles R1 having a larger particle size than usual are mixed into the powdery resin R for some reason, as shown in FIG. Fig.10 As shown, the coarse particles R1 may enter between the scraper 224 and the outer peripheral surface 231 of the rotating body 230. When the coarse particles R1 enter between the scraper 224 and the outer peripheral surface 231 of the rotating body 230, the scraper 224 is lifted, and the powdery granular resin R having a normal particle size smaller than that of the coarse particles R1 may be squeezed through the scraper 224 from both sides of the coarse particles R1. When the powdery granular resin R is squeezed through the scraper 224, a more powdery granular resin R than the target supply amount is supplied to the release film F.

[0080] In order to suppress this undesirable situation, Fig.11As shown, the scraper 224 may also be configured to have a plurality of scraper portions 224b by forming a cutout 224c of a predetermined length from one end toward the other end. That is, the scraper 224 has a so-called curtain shape. One end of the scraper 224 refers to the end portion that contacts the outer peripheral surface 231 of the rotating body 230. By forming a cutout 224c on the scraper 224 and providing a plurality of scraper portions 224b, even if coarse particles R1 are mixed into the powdery resin R and enter between the scraper 224 and the outer peripheral surface 231 of the rotating body 230, the scraper 224 that is lifted up by the coarse particles R1 is only the scraper portion 224b into which the coarse particles R1 enter. As a result, the other scraper portions 224b remain in contact with the contact portion 224a without being lifted up, and are not affected by the coarse particles R1. This can minimize or prevent the powdery resin R of normal particle size from squeezing through the scraper 224 from both sides of the coarse particles R1, thereby preventing the powdery resin R from being supplied to the release film F in excess of the target supply amount.

[0081] [Second embodiment]

[0082] Next, use Fig.12 , Fig.13 The resin supply mechanism 21 of the second embodiment is described. In the resin supply mechanism 21 of the present embodiment, a first moving mechanism 250 (an example of a moving mechanism) is provided which can move the entire resin supply mechanism 21 in the X direction. In addition, the resin supply module 2 of the present embodiment does not have a base 27 or a ball screw 29, but only has a resin spraying workbench 22 (an example of a workbench). The resin spraying workbench 22 does not move in the X-Y direction. Since the other structures are the same as those of the first embodiment, detailed description is omitted.

[0083] The first moving mechanism 250 includes a first driving unit 252 and a pair of first guide rails 254. The pair of first guide rails 254 extend in the X direction and support the resin supply mechanism 21. The first driving unit 252 is composed of a motor or the like. The resin supply mechanism 21 is configured to be movable in the +X direction and the -X direction on the first guide rails 254 by the first driving unit 252.

[0084] As described above, in this embodiment, the resin spraying stage 22 that does not move in the X-Y direction is provided, and the weight measuring mechanism 270 that measures the weight of the powdery resin R supplied to the release film F placed on the resin spraying stage 22 is provided. Fig.14 , Fig.15 A method for measuring the weight of the powdery or granular resin R using the weight measuring mechanism 270 will be described in detail.

[0085] The weight measuring mechanism 270 includes four rods 272 and a measuring device 274 (an example of a measuring unit) for measuring the weight of the powdery resin R. Fig.14 As shown in (a) of FIG. 1 , the resin spraying stage 22 is supported by four (two not shown) rods 272. The measuring device 274 is disposed below the resin spraying stage 22 with a gap therebetween.

[0086] Then, if Fig.14 As shown in (b), the mold release film F and the frame 23 are arranged on the resin spraying workbench 22. At this time, the mold release film F is only placed on the resin spraying workbench 22 and is not adsorbed by the air. The measuring device 274 still has a gap with the resin spraying workbench 22. This is to prevent the impact when the frame 23 is placed on the resin spraying workbench 22 from being transmitted to the measuring device 274, which has an adverse effect on the measuring device 274.

[0087] Next, the top end of the rod 272 is lowered so that the lower surface of the resin spraying table 22 contacts the measuring device 274. Thus, the measuring device 274 can measure the total weight of the resin spraying table 22, the frame 23, and the release film F. The weight measured by the measuring device 274 is sent to the control unit 5 and becomes the reference weight before the powdery resin R is supplied. Fig.14 As shown in (c), the resin supply mechanism 21 is moved in the X direction while supplying the powdery resin R onto the release film F. The weight increase measured by the measuring device 274 at this time is the weight of the powdery resin R supplied onto the release film F. The control unit 5 confirms that the weight of the powdery resin R is equal to the target supply amount.

[0088] Then, if Fig.14 As shown in (d) of FIG. 2 , the tip of the rod 272 is raised to separate the resin spraying stage 22 from the measuring device 274 . Thereafter, the frame 23 and the release film F are sandwiched by the conveying unit 28 and conveyed to the resin loader 26 .

[0089] Next, use Fig.15 Next, a method for measuring the weight of the powdery resin R using the weight measuring mechanism 270 having a structure for adsorbing the release film F by suction of air is described.

[0090] like Fig.15As shown by the dotted line in (a), a suction path 22a for sucking air is formed on the resin spraying workbench 22 in order to adsorb the release film F. In addition, a suction unit 273 is provided at the top of the four rods 272, and the suction unit 273 supports the resin spraying workbench 22 and is connected to the suction path 22a, and sucks air through a suction source such as a vacuum generator or a vacuum pump not shown. The measuring device 274 is arranged below the resin spraying workbench 22 with a gap therebetween. At this time, the suction source is turned off and air is not sucked.

[0091] Then, if Fig.15 As shown in (b), the mold release film F and the frame 23 are arranged on the resin spraying workbench 22, and the suction source is turned on to adsorb the mold release film F to the resin spraying workbench 22 by air suction. At this time, the measuring device 274 still has a gap with the resin spraying workbench 22.

[0092] Next, while the suction source is turned off and the air suction is stopped, the suction part 273 at the top of the rod 272 is lowered so that the lower surface of the resin spraying table 22 contacts the measuring device 274. The weight measured by the measuring device 274 is sent to the control unit 5 and becomes the reference weight before supplying the powdery resin R. Then, as shown in FIG. Fig.15 As shown in (c), the resin supply mechanism 21 is moved in the X direction while supplying the powdery resin R onto the release film F. The weight increase measured by the measuring device 274 at this time is the weight of the powdery resin R supplied onto the release film F. The control unit 5 confirms that the weight of the powdery resin R is equal to the target supply amount.

[0093] Then, if Fig.15 As shown in (d) of FIG. 2 , the tip of the rod 272 is raised to separate the resin spraying stage 22 from the measuring device 274 . Thereafter, the frame 23 and the release film F are sandwiched by the conveying unit 28 and conveyed to the resin loader 26 .

[0094] In this way, by moving the resin supply mechanism 21 to supply the powdery resin R onto the release film F while the resin spraying table 22 is fixed, the weight of the powdery resin R supplied onto the release film F can be directly measured by the measuring device 274. Therefore, compared with indirectly measuring the weight of the powdery resin R supplied onto the release film F based on the weight of the resin storage unit 210, the weight of the powdery resin R supplied onto the release film F can be measured more accurately.

[0095] [Third embodiment]

[0096] Next, use Fig.12 , Fig.16The resin supply mechanism 21 of the third embodiment is described. In the resin supply mechanism 21 of the present embodiment, in addition to being provided with a first moving mechanism 250 (an example of a moving mechanism, see Fig.12 ), and a second moving mechanism 260 (an example of a moving mechanism, see Fig.16 ). Fig.16 In the illustrated embodiment, the first moving mechanism 250 includes a base 256 that supports the resin supply mechanism 21. The base 256 is provided with an opening 256a, and the resin supply mechanism 21 can be moved in the X direction and the powdery resin R can be supplied to the release film F. Since the other structures are the same as those of the second embodiment, detailed description is omitted.

[0097] The second moving mechanism 260 includes a second driving unit 262 and a pair of second guide rails 264. The pair of second guide rails 264 extend in the Y direction and support the resin supply mechanism 21 via the base 256. The second driving unit 262 is composed of a motor or the like. The resin supply mechanism 21 is configured to be movable in the +Y direction and the -Y direction on the second guide rails 264 by the second driving unit 262.

[0098] According to the present embodiment, since the resin supply mechanism 21 can be moved in both the X direction and the Y direction, the powdery resin R can be supplied onto the release film F without moving the resin spraying table 22 even for a large-sized substrate S. In addition, since the resin spraying table 22 does not move when the powdery resin R is supplied, the weight of the powdery resin R supplied onto the release film F can be measured more accurately.

[0099] [Fourth embodiment]

[0100] In this embodiment, the resin supply mechanism 21 is the same as that in the first embodiment, and the mold release film F and the frame 23 are placed on the resin spraying stage 22 on the base 27 of the X-Y stage. Fig.17 As shown, the powdery resin R supplied from the resin supply mechanism 21 is not directly supplied to the release film F, but is temporarily supplied to the resin holding mechanism 280 (an example of a supply object), and is supplied from the resin holding mechanism 280 to the release film F. This embodiment is suitable for, for example, an apparatus for supplying resin to the release film F disposed on a molding die. Since the other configurations are the same as those of the first embodiment, detailed descriptions are omitted.

[0101] like Fig.18 , Fig.19As shown, the resin holding mechanism 280 comprises: a holding portion 281 having a plurality of first slits 282; and a baffle 283, which is closely disposed under the holding portion 281 and has a plurality of second slits 284 arranged in the same direction as the first slits 282. Figures 17 to 19 In the figure, the number of the first slits 282 and the second slits 284 of the resin holding mechanism 280 is shown to be more or less than the actual number.

[0102] The resin holding mechanism 280 of the present embodiment has a size that is substantially the same as the inner size of the frame 23 as a whole, and is arranged inside the frame 23 and above the release film F. In the resin holding mechanism 280, the holding portion 281 is arranged at the top and the shielding plate 283 is arranged at the bottom. The width of the first slit 282 of the holding portion 281 (the length in the direction parallel to the direction in which the plurality of first slits 282 are arranged) is wide at the top and narrow at the bottom, so that the powdery resin R supplied from the resin supply mechanism 21 located above the resin holding mechanism 280 can easily enter the first slit 282. On the other hand, the width of the second slit 284 of the shielding plate 283 (the length in the direction parallel to the direction in which the plurality of second slits 284 are arranged) is the same at both the top and the bottom. The width of the lower portion of the first slit 282 is the same as or larger than the width of the second slit 284, and the pitch of the first slit 282 (the length between adjacent first slits 282) is the same as the pitch of the second slit 284 (the length between adjacent second slits 284). Therefore, by shifting the relative position of the baffle 283 with respect to the retaining portion 281 by only 1 / 2 of the pitch in the width direction, the connection and blockage of the first slit 282 and the second slit 284 can be switched. Figures 17 to 19 In the resin holding mechanism 280 shown, the first slit 282 and the second slit 284 are blocked.

[0103] In the present embodiment, the resin holding mechanism 280 is placed in a state where the first slit 282 and the second slit 284 are blocked, and the resin spraying stage 22 of the X-Y stage is moved while the powdery resin R is supplied from the resin supply mechanism 21 to the resin holding mechanism 280. The powdery resin R supplied to the resin holding mechanism 280 enters the first slit 282. Since the first slit 282 and the second slit 284 are blocked, the powdery resin R supplied from the resin supply mechanism 21 is stored in the first slit 282. When the powdery resin R enters all the first slits 282 evenly, the rotation of the rotating body 230 is stopped, and the supply of the powdery resin R is stopped. At this time, the resin holding mechanism 280 may be vibrated in order to evenly distribute the powdery resin R into all the first slits 282.

[0104] Next, the shutter 283 is moved by a shutter moving mechanism (not shown) in the width direction by a half pitch, whereby the first slit 282 and the second slit 284 are connected, and the powdery resin R stored in the first slit 282 is supplied onto the release film F through the second slit 284 .

[0105] Thus, by providing the resin holding mechanism 280 between the resin supply mechanism 21 and the resin spraying stage 22, the powdery resin R can be supplied to the release film F disposed on the molding die. In addition, even when the size of the substrate S is large, the powdery resin R can be supplied by reciprocating the resin holding mechanism 280 multiple times.

[0106] [Other implementation methods]

[0107] Hereinafter, other embodiments of the above-mentioned embodiment will be described. It should be noted that, for the same components as those of the above-mentioned embodiment, the same terms and reference numerals will be used for description in order to facilitate understanding.

[0108] <1> In the above embodiment, the first resin drop port 207, the first resin inlet 210A, the second resin drop port 210B, and the second resin inlet 222 have a circular cross-section, but are not limited thereto. These cross-sectional shapes may be any shape such as a rectangle. In addition, these cross-sectional shapes do not need to be the same, and may each have a different cross-sectional shape.

[0109] However, if the shapes of the second resin drop port 210B and the second resin inlet 222 are the same as the shape of the opening of the third resin drop port 223 and are rectangular with the same length as the entire length of the rotating body 230, the powdery resin R can be supplied to the entire groove 232a of the rotating body 230 with a smaller amount of powdery resin R, which is preferred.

[0110] <2> In the above embodiment, the upper side of the rear plate 227 of the resin supply unit 220 is parallel to the vertical direction, and is bent in the middle toward the front plate 226. The front plate 226 is a flat plate as a whole, and is arranged to be inclined relative to the vertical direction so as to get closer to the rear plate 227 as it moves downward. However, the shapes of the front plate 226 and the rear plate 227 are not limited thereto. As long as the third resin drop port 223 has a shape that can appropriately supply the powdery resin R to the rotating body 230, the front plate 226 and the rear plate 227 may have any shape.

[0111] <3> In the above embodiment, the upper side of the rear plate 247 of the guide 240 is parallel to the vertical direction, and is bent in the middle toward the front plate 246. The front plate 246 is a flat plate as a whole and is arranged parallel to the vertical direction. However, the shapes of the front plate 246 and the rear plate 247 are not limited thereto. As long as the fourth resin drop port 242 has a shape that can appropriately supply the powdery resin R onto the release film F, the front plate 246 and the rear plate 247 may have any shape.

[0112] <4> In the above embodiment, either the resin supply mechanism 21 or the resin spraying stage 22 is configured to be movable. However, both the resin supply mechanism 21 and the resin spraying stage 22 may be configured to be movable.

[0113] <5> The substrate S in the above embodiment can be any shape such as circular or rectangular. The size of the substrate S is not particularly limited. By appropriately setting the movement amount of the resin spraying workbench 22 and / or the movement amount of the first moving mechanism 250 and the second moving mechanism 260, any shape and size of the substrate S can be accommodated.

[0114] <6> In the above embodiment, the die-down compression method is described, but the die-up compression method may be adopted, where a molding object such as a substrate is set as a supply object to which the powdery resin R is supplied in the resin supply mechanism 21.

[0115] <7> In the above embodiment, the release film F, the frame 23, and the grease holding mechanism 280 are described as the supply objects, but the substrate S and the molding die M may be the supply objects.

[0116] [Overview of the above-mentioned embodiment]

[0117] Hereinafter, an outline of the resin molding apparatus D and the method for manufacturing the resin molded product (resin-sealed substrate Sb) described in the above embodiment will be described.

[0118] (1) The characteristic structure of the resin molding device D is that the resin molding device D comprises: a resin supply mechanism 21 for supplying a powdery resin R to a supply object (a frame 23, a mold release film F, and a resin holding mechanism 280); a molding die M, comprising an upper die UM and a lower die LM opposed to the upper die UM, with the powdery resin R arranged between the upper die UM and the lower die LM; and a mold clamping mechanism 35 for clamping the molding die M and performing compression molding. The resin supply mechanism 21 has There are: a rotating body 230, which is a cylindrical body having a plurality of recesses 232 (grooves 232a, pits 232b) on the outer peripheral surface 231, and the rotating body rotates around the axis X; a resin supply part 220, which stores a powdery resin R and is formed with an opening (a third resin drop opening 223) for allowing the powdery resin R to fall freely and be supplied to the rotating body 230; and a scraper-like member (scraper 224), which is configured in a manner that one end is in contact with the outer peripheral surface 231 of the rotating body 230.

[0119] In the compression molding module 3, in order to improve the productivity of the resin-encapsulated substrate Sb, it is necessary to supply the powdery resin R to the supply object (release film F) in a short time and with high precision in the resin supply mechanism 21 of the resin supply module 2. However, in the technology described in Patent Document 1, in order to improve the precision when supplying the powdery resin R to the supply object, a resin material supply port is used to reduce the supply amount of the powdery resin R per unit time. Therefore, it takes time to supply the powdery resin R to the entire supply object. In the case where the supply object is large in size, more time is required. Therefore, the resin supply mechanism 21 of this embodiment has a rotating body 230 with a longer total length than the conventional resin material supply port, so that the powdery resin R of a volume equal to the volume of the groove 232a can be supplied to the release film F at one time. Therefore, compared with the conventional resin supply mechanism, the supply amount of the powdery resin R per unit time can be increased. At this time, since the excess powdery resin R protruding from the groove 232a is scraped off by the scraper 224, the powdery resin R having a volume equal to the volume of the groove 232a can be continuously supplied. In this way, the supply amount per unit time can be increased while maintaining the supply accuracy of the powdery resin R, thereby shortening the supply time of the powdery resin R onto the release film F.

[0120] (2) In the resin molding device D described in (1) above, the opening (third resin drop opening 223) of the resin supply portion 220 may be arranged on the side closer to the rotation direction of the rotating body 230 than the axis X when viewed in the vertical direction.

[0121] According to this configuration, the powdery resin R entering the groove 232a from the third resin drop port 223 does not fall in the direction opposite to the rotation direction from the axis X, so that the powdery resin R having a volume equal to the volume of the groove 232a can be supplied to the release film F.

[0122] (3) In the resin molding device D described in (2) above, the angle θ formed by the plane in the vertical direction passing through the axis X, i.e., the vertical plane p, and the contact surface q of the contact portion 224a of the scraper-shaped member (scraper 224) in contact with the outer peripheral surface 231 passing through the axis X can also be less than 45 degrees.

[0123] If the present structure is adopted, even if the coarse particles R1 of the powdery resin R lift the scraper 224, the powdery resin R will not fall onto the release film F from the gap of the lifted scraper 224 due to its own weight. Therefore, the undesirable situation of supplying more powdery resin R than the target supply amount to the release film F can be suppressed to a minimum.

[0124] (4) In the resin molding device D described in any one of (1) to (3) above, the supply object may include a release film F and a frame-shaped member (frame body 23).

[0125] According to this configuration, the powdery resin R can be accurately supplied to the portion of the release film F on the inner side of the frame body 23 .

[0126] (5) In the resin molding device D described in any one of (1) to (4) above, the scraper-shaped member (scraper 224) may have a cutout 224c extending from one end toward the other end.

[0127] In this configuration, the scraper 224 has a plurality of scraper portions 224b formed by the cutouts 224c. Therefore, even if the coarse particles R1 are mixed into the powdery resin R and enter between the scraper 224 and the outer peripheral surface 231 of the rotating body 230, the scraper 224 is lifted only to the scraper portion 224b into which the coarse particles R1 enter, and the other scraper portions 224b are not lifted and are not affected by the coarse particles R1. As a result, the powdery resin R from both sides of the coarse particles R1 can be squeezed through the scraper 224 to a minimum or not squeezed through the scraper 224, and the inconvenience of supplying the powdery resin R to the release film F in excess of the target supply amount can be suppressed.

[0128] (6) In any one of the resin molding devices D described in (1) to (5) above, there may also be provided: a plate-like member (front plate 246) which is arranged parallel to the axis X on the side of the rotating body 230 where the outer peripheral surface 231 moves downward due to the rotation of the rotating body 230 relative to the axis X.

[0129] According to this configuration, even if the powdery or granular resin R supplied to the groove 232a by the centrifugal force generated by the rotation of the rotating body 230 flies forward from the groove 232a in the rotation direction, it can collide with the front plate 246 and fall downward. Therefore, the powdery or granular resin R of the target supply amount can be supplied to the target supply position.

[0130] (7) In the resin molding device D described in (6) above, the plate-like member (front plate 246) may be configured to be movable up and down.

[0131] According to this configuration, by moving the guide 240 including the front plate 246 downward to approach the release film F, the powdery or granular resin R can be supplied to the target supply position in a more accurate manner at a target supply amount.

[0132] (8) The resin molding device D described in any one of (1) to (7) above may further include a moving mechanism (a first moving mechanism 250 and a second moving mechanism 260 ) for moving the resin supply mechanism 21 .

[0133] According to this configuration, the powdery resin R can be supplied while the stage (resin spraying stage 22 ) on which the release film F is placed is fixed. Therefore, for example, a measuring device 274 for measuring the weight of the powdery resin R can be arranged below the resin spraying stage 22 .

[0134] (9) The resin molding device D described in (8) above may also be provided with: a workbench (resin spraying workbench 22) for placing a supply object (frame 23, release film F); and a measuring unit (meter 274) located below the workbench (resin spraying workbench 22) for measuring the weight of the powdered resin R supplied to the supply object (frame 23, release film F).

[0135] According to this configuration, the weight of the powdery or granular resin R supplied onto the release film F can be directly measured by the measuring device 274, so the weight of the powdery or granular resin R on the release film F can be measured more accurately.

[0136] (10) The method for manufacturing a resin molded product (resin-encapsulated substrate Sb) using the resin molding device D described in any one of (1) to (9) above is characterized in that it includes: a resin supplying step, using a resin supplying mechanism 21 to supply a powdery resin R to a supply object (frame 23, release film F, resin retaining mechanism 280); and a molding step, supplying a pre-molding substrate (resin-encapsulated pre-substrate Sa) and a supply object (release film F) to a molding mold M, and clamping the molding mold M by a clamping mechanism 35 to perform compression molding.

[0137] In this method, since the resin supply mechanism 21 has a rotating body 230 having a longer overall length than the conventional resin material supply port, a resin supply process is included for supplying a volume of powdery resin R equal to the volume of the groove 232a to the release film F at one time. Therefore, compared with the conventional resin supply mechanism, the supply amount of the powdery resin R per unit time to the supply object (frame 23, release film F) can be increased. At this time, since the excess powdery resin R protruding from the groove 232a is scraped off by the scraper 224, the powdery resin R equal to the volume of the groove 232a can be continuously supplied. In this way, a method for manufacturing a resin molded product (resin-encapsulated substrate Sb) using the resin supply mechanism 21 having a large supply amount per unit time while maintaining the supply accuracy of the powdery resin R can be provided.

[0138] Industrial Applicability

[0139] The present disclosure can be used for a resin molding device and a method for manufacturing a resin molded product.

[0140] Description of Reference Numerals

[0141] 21: resin supply mechanism;

[0142] 22: Resin spraying workbench (workbench);

[0143] 23: frame (frame-shaped member, supply object);

[0144] 35: clamping mechanism;

[0145] 220: resin supply unit;

[0146] 223: third resin drop port (opening);

[0147] 224: scraper (scraper-like member);

[0148] 224a: contact part;

[0149] 224c: incision;

[0150] 230: Rotating body;

[0151] 231: outer peripheral surface;

[0152] 232: concave part;

[0153] 232a: Groove (concave);

[0154] 232b: pit (recess);

[0155] 246: front plate (plate-shaped member);

[0156] 250: first moving mechanism (moving mechanism);

[0157] 260: second moving mechanism (moving mechanism);

[0158] 274: measuring device (measuring unit);

[0159] 280: Resin holding mechanism (supply object);

[0160] F: release film (supply object);

[0161] LM: lower die;

[0162] M: forming die;

[0163] p: plumb plane;

[0164] q: contact surface;

[0165] R: powdery resin;

[0166] Sa: Resin encapsulation front substrate (pre-molding substrate);

[0167] Sb: Resin-encapsulated substrate (resin molded product);

[0168] UM: upper mold;

[0169] X: axis.

Claims

1. A resin molding device comprising: A resin supply mechanism supplies powdered or granular resin to a supply object; a molding die including an upper die and a lower die opposite to the upper die, wherein the powdery resin is arranged between the upper die and the lower die; and A mold clamping mechanism for clamping the molding die and performing compression molding; The resin supply mechanism comprises: The rotating body is in the shape of a cylinder having a plurality of recessed portions on the outer peripheral surface, and the rotating body rotates around the axis; a resin supplying section storing the powdery or granular resin and having an opening formed therein for allowing the powdery or granular resin to freely fall and be supplied to the rotating body; and The scraper-shaped member is arranged so that one end thereof contacts the outer peripheral surface of the rotating body.

2. The resin molding device according to claim 1, wherein: When viewed in the vertical direction, the opening of the resin supply portion is arranged on one side of the axis in the rotation direction of the rotating body relative to the axis.

3. The resin molding device according to claim 2, wherein: An angle formed by a vertical plane, which is a plane in a vertical direction passing through the axis, and a contact surface passing through the axis and a contact portion of the scraper-shaped member contacting the outer peripheral surface is 45 degrees or less.

4. The resin molding device according to any one of claims 1 to 3, wherein: The supply object includes a release film and a frame-shaped member.

5. The resin molding device according to any one of claims 1 to 4, wherein: The scraper-shaped member has a cutout extending from the one end toward the other end.

6. The resin molding device according to any one of claims 1 to 5, wherein: The resin molding device further includes a plate-shaped member disposed parallel to the axis on a side of the rotating body where the outer peripheral surface moves downward due to the rotation of the rotating body with respect to the axis.

7. The resin molding device according to claim 6, wherein: The plate-like member is configured to be movable up and down.

8. The resin molding device according to any one of claims 1 to 7, wherein: The resin molding device further includes a moving mechanism that moves the resin supply mechanism.

9. The resin molding device according to claim 8, wherein: The resin molding device further comprises: a workbench on which the supply object is placed; and The measuring unit is located below the table and measures the weight of the powdery or granular resin supplied to the supply target.

10. A method for manufacturing a resin molded product, using the resin molding device according to any one of claims 1 to 9, wherein: The method for manufacturing the resin molded product comprises: a resin supplying step of supplying the powdery or granular resin to the supply object using the resin supplying mechanism; and In the molding step, the pre-molding substrate and the supply object are supplied to the molding die, and the molding die is clamped by the clamping mechanism to perform the compression molding.

Images