Power module assembly and electronic device having same

Abstract

A power module assembly and an electronic device having the same are provided. The power module assembly comprises a plastic package body, a first substrate arranged in the plastic package body, a power chip arranged on the first substrate, and at least one gasket. The plastic package body is provided with a first surface and a second surface which are opposite to each other, and comprises at least one connecting part located at the end part of the plastic package body. The at least one gasket is arranged on the first surface of the plastic package body and corresponds to the at least one connecting part, and the orthographic projection of the gasket on the first surface is not overlapped with the orthographic projection of the first substrate on the first surface. And the plastic package body is configured to be connected with the heat exchanger through the gasket and the connecting part, so that the second surface of the plastic package body is in contact with the heat exchanger.

Description

Power module assembly and electronic device having the same

[0001] This application claims priority to Chinese patent applications with application number 202211442177.8 filed on November 17, 2022, application number 202211457344.6 filed on November 17, 2022, and application number 202311117772.9 filed on August 31, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the technical field of electronic equipment, and in particular to a power module assembly and an electronic device having the same. Background Art

[0003] Semiconductor power modules generate heat during use. To ensure good heat dissipation, they are usually mounted on a heat exchanger and dissipated using air.

[0004] Summary of the Invention

[0005] In one aspect, a power module assembly is provided, comprising a plastic package, a first substrate disposed within the plastic package, a power chip disposed on the first substrate, and at least one gasket. The plastic package has a first surface and a second surface facing each other, and includes at least one connecting portion located at an end of the plastic package. At least one gasket is disposed on the first surface of the plastic package and corresponds to the at least one connecting portion, and an orthographic projection of the gasket on the first surface does not overlap with an orthographic projection of the first substrate on the first surface. The plastic package is configured to be connected to a heat exchanger via the gasket and the connecting portion, such that the second surface of the plastic package contacts the heat exchanger.

[0006] On the other hand, an electronic device is provided, comprising a controller and the above-mentioned power module assembly, wherein the power module assembly is connected to the controller. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] FIG1 is a schematic diagram showing the positional relationship between a first substrate and a gasket of a power module assembly in the related art;

[0008] FIG2 is a packaging effect diagram of a power module assembly in the related art;

[0009] FIG3 is a schematic diagram of a power module assembly according to some embodiments of the present disclosure;

[0010] FIG4 is a schematic diagram of a power module assembly according to some embodiments of the present disclosure;

[0011] FIG5 is a schematic diagram of the positional relationship between a first substrate and a gasket according to some embodiments of the present disclosure;

[0012] FIG6 is a schematic diagram showing the positional relationship between a first substrate and a gasket according to some embodiments of the present disclosure;

[0013] FIG7 is a packaging effect diagram of a power module assembly according to some embodiments of the present disclosure;

[0014] FIG8 is a cross-sectional view of a power module assembly according to some embodiments of the present disclosure;

[0015] FIG9 is a packaging effect diagram of a power module assembly according to some embodiments of the present disclosure;

[0016] FIG10 is a cross-sectional view of a power module assembly according to some embodiments of the present disclosure;

[0017] FIG11 is a schematic diagram of a power module assembly according to some embodiments of the present disclosure;

[0018] FIG12 is a schematic diagram of a power module assembly according to some embodiments of the present disclosure;

[0019] FIG13 is a cross-sectional view of a power module according to some embodiments of the present disclosure;

[0020] FIG14 is a packaging effect diagram of a power module according to some embodiments of the present disclosure;

[0021] FIG15 is a cross-sectional view of a power module according to some embodiments of the present disclosure;

[0022] FIG16 is a schematic diagram of a packaging mold of a power module according to some embodiments of the present disclosure;

[0023] FIG17 is a cross-sectional view of a power module according to some embodiments of the present disclosure;

[0024] FIG18 is a plan view of a power module according to some embodiments of the present disclosure;

[0025] FIG19 is a block diagram of an electronic device according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0026] The following will be combined with the accompanying drawings to clearly and completely describe some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0027] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0028] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0029] When describing some embodiments, the term "connected" and its derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. The embodiments disclosed herein are not necessarily limited to the embodiments disclosed herein.

[0030] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0031] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value, where the acceptable range of deviation is determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0032] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. The exemplary embodiments disclosed herein should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0033] Semiconductor power modules inevitably generate heat during use. To ensure effective heat dissipation, the power module's heat dissipation area needs to be increased. Therefore, when designing the power module, the size of the first substrate (insulated heat dissipation substrate) is often increased as much as possible. In related art, as shown in Figures 1 and 2, the power module 100 can be mounted on a heat exchanger using screws for heat dissipation. This requires reserving screw mounting locations on the plastic package 10 of the power module 100, but this limits the size of the first substrate 20. Furthermore, when the plastic package 10 is fixedly connected to the heat exchanger, the heat exchanger squeezes the plastic package 10. The squeezing force is transmitted through the plastic package 10 to the first substrate 20, which can easily damage the first substrate 20. Therefore, the screws are typically used in conjunction with a gasket 30 to distribute the screw preload and provide a certain degree of cushioning against the squeezing effect of the heat exchanger. However, this also causes the axial force on the gasket 30 to act on the edge of the first substrate 20 through the plastic package 10, increasing the risk of the first substrate 20 being crushed, resulting in lower structural reliability of the power module.

[0034] Based on this, an embodiment of the present disclosure provides a power module assembly, including a power module and at least one gasket, which can be applied to electronic devices. The power module can be an intelligent power module (IPM).

[0035] As shown in FIG. 3 to FIG. 12 , the power module 100 may include a plastic package 10 , a first substrate 20 disposed in the plastic package 10 , and a power chip 40 disposed on the first substrate 20 .

[0036] The plastic package body 10 has a first surface 101 and a second surface 102 that are arranged opposite to each other along the thickness direction Z of the power module 100 (i.e., the thickness direction of the plastic package body 10). The first surface 101 is located on the side of the power chip 40 away from the first substrate 20, and the second surface 102 is located on the side of the first substrate 20 away from the power chip 40. The plastic package body 10 may include at least one connecting portion 11 located at an end thereof, and the connecting portion 11 is configured to connect to the heat exchanger. For example, the connecting portion 11 is provided at an end of the plastic package body 10 along the length direction X of the power module 100 (i.e., the length direction of the plastic package body 10).

[0037] The first substrate 20 may be an insulating heat dissipation substrate. For example, the surface (front) of the first substrate 20 near the first surface 101 serves as a power pad, on which the power chip 40 is disposed. The surface (back) of the first substrate 20 near the second surface 102 is flush with the second surface 102, such that the first substrate 20 is exposed by the second surface 102 of the plastic package 10, thereby providing a heat dissipation path for the power chip 40.

[0038] At least one gasket 30 may be disposed on the first surface 101 of the plastic package body 10, and the at least one gasket 30 corresponds to the at least one connecting portion 11. The orthographic projection of the gasket 30 on the first surface 101 of the plastic package body 10 does not overlap with the orthographic projection of the first substrate 20 on the first surface 101 of the plastic package body 10 (i.e., the two are staggered).

[0039] It can be understood that the correspondence between at least one gasket 30 and at least one connecting portion 11 means that along the thickness direction Z of the power module 100 , the positions of the gasket 30 and the connecting portion 11 correspond to each other.

[0040] It should be noted that when describing the structure of the power module 100, reference is made to the length direction X, width direction Y, and thickness direction Z of the power module 100. The thickness direction Z of the power module 100 (i.e., the thickness direction of the plastic package 10) refers to a direction perpendicular to the plane where the first substrate 20 is located. The length direction X (i.e., the length direction of the plastic package 10) and the width direction Y (i.e., the width direction of the plastic package 10) of the power module 100 are both parallel to the plane where the first substrate 20 is located. The length direction X of the power module 100 refers to the arrangement direction of multiple base islands for arranging multiple power chips 40, and the width direction Y of the power module 100 refers to the extension direction of any base island.

[0041] To achieve good heat dissipation, the plastic package 10 of the power module 100 can be connected to a heat exchanger. When connecting the plastic package 10 to the heat exchanger, screws can be sequentially passed through the gasket 30 and the connecting portion 11 of the plastic package 10, so that the plastic package 10 is connected to the heat exchanger, and the second surface 102 of the plastic package 10 is in contact with the heat exchanger. In this way, the heat exchanger can absorb the heat generated by the power chip 40 in the plastic package 10 through the first substrate 20 exposed by the second surface 102 of the plastic package 10, and exchange heat with the external air to achieve the effect of dissipating heat from the plastic package 10 and the power chip 40 therein, thereby ensuring stable and efficient operation of the power module 100.

[0042] Based on this, the gasket 30 used in the embodiment of the present disclosure can be a standard gasket, and there is no need to customize a special gasket. Among them, the standard gasket refers to a gasket with standard specifications specified in ISO-7089 to ISO-7093, and there are two types of gasket specifications applicable here: one is a gasket with an inner diameter of 3.2mm and an outer diameter of 7mm, and the other is an enlarged gasket with an inner diameter of 3.2mm and an outer diameter of 9mm. Under normal circumstances, the installation solution can use a gasket with an inner diameter of 3.2mm and an outer diameter of 7mm. Without changing the size of the gasket 30, the thickness and material of the plastic package 10, and the structure and weight of the heat exchanger, the size of the first substrate 20 can be controlled so that the orthographic projection of the gasket 30 on the first surface 101 of the plastic package 10 and the orthographic projection of the first substrate 20 on the first surface 101 of the plastic package 10 are staggered with each other, so as to achieve a balance between the heat dissipation performance and mechanical properties of the power module 100. Since the contact between the second surface 102 of the plastic package 10 and the heat exchanger can enable the power module 100 to have a good heat dissipation effect, reducing the size of the first substrate 20 so that the first substrate 20 and the gasket 30 are staggered in the thickness direction Z of the power module 100 will not cause the heat dissipation performance of the power module 100 to deteriorate. That is, the embodiment of the present disclosure reduces the size of the first substrate 20 while ensuring the heat dissipation performance of the power module 100, so that the orthographic projection of the gasket 30 on the first surface 101 of the plastic package 10 does not overlap with the orthographic projection of the first substrate 20 on the first surface 101 of the plastic package 10.

[0043] Thus, by disposing the gasket 30 at the position of the plastic package 10 corresponding to the connection portion 11, the extrusion effect of the heat exchanger can be buffered to a certain extent, thereby improving the structural reliability of the power module 100. The orthographic projection of the gasket 30 on the first surface 101 of the plastic package 10 is staggered with the orthographic projection of the first substrate 20 on the first surface 101 of the plastic package 10. This prevents the force transmitted to the gasket 30 from directly acting perpendicularly on the first substrate 20. Instead, the force needs to be transmitted to the plastic package 10 and evenly distributed on the plastic package 10 before being transmitted to the first substrate 20. This can significantly reduce the force applied to the first substrate 20, which is conducive to achieving a balance between heat dissipation performance and mechanical properties of the power module 100. This not only improves the service life of the first substrate 20 and the structural stability and reliability of the power module 100, but also avoids significantly changing the structural design of the power module 100, thereby reducing production costs.

[0044] In some embodiments, the orthographic projection of the gasket 30 on the first surface 101 of the plastic package 10 is spaced apart from the orthographic projection of the first substrate 20 on the first surface 101 of the plastic package 10. In other words, the orthographic projection of the gasket 30 on the first surface 101 is spaced apart from the orthographic projection of the first substrate 20 on the first surface 101 by a certain distance.

[0045] In this case, when the extrusion force of the heat exchanger is transmitted to the gasket 30 and then to the plastic package 10 through the gasket 30, because the orthographic projection of the gasket 30 on the first surface 101 and the orthographic projection of the first substrate 20 on the first surface 101 are separated by a certain distance, the force needs to be further dispersed on the plastic package 10 before it acts on the first substrate 20. In other words, the plastic package 10 buffers and absorbs the force to a certain extent. This can effectively reduce the force transmitted from the gasket 30 to the first substrate 20, thereby improving the stability and reliability of the first substrate 20.

[0046] In other embodiments, the edge of the orthographic projection of the gasket 30 on the first surface 101 of the plastic package 10 contacts but does not overlap with the edge of the orthographic projection of the first substrate 20 on the first surface 101 of the plastic package 10. In other words, the edge of the orthographic projection of the gasket 30 on the first surface 101 is tangent to the edge of the orthographic projection of the first substrate 20 on the first surface 101.

[0047] In this case, since the orthographic projection of the gasket 30 on the first surface 101 and the orthographic projection of the first substrate 20 on the first surface 101 are close to each other, the size of the power module 100 along its length direction X is reduced, making the structure of the power module 100 more compact, which is conducive to the miniaturization design of the power module 100.

[0048] Whether the orthographic projection of the gasket 30 on the first surface 101 of the plastic package body 10 is in contact with or spaced apart from the orthographic projection of the first substrate 20 on the first surface 101 of the plastic package body 10 can be designed according to actual needs.

[0049] In some embodiments, as shown in Figures 3 to 12 , the at least one connection portion 11 may include two connection portions 11 located at both ends of the plastic package body 10 along the length direction X of the power module 100, with the two connection portions 11 being symmetrically arranged. Accordingly, the at least one gasket 30 may include two gaskets 30 corresponding to the two connection portions 11, respectively.

[0050] In this way, when the plastic package body 10 is fixed to the heat exchanger by screws and gaskets 30, since the two connecting parts 11 are symmetrically arranged at the two ends of the plastic package body 10, the two gaskets 30 are also symmetrically arranged at the two ends of the plastic package body 10, thereby ensuring the force balance at both ends of the plastic package body 10.

[0051] In some embodiments, as shown in Figures 3 to 12, the connecting portion 11 can be a notch, such as a closed notch (e.g., a circular notch) or a semi-closed notch (e.g., a U-shaped notch). Along the thickness direction Z of the power module 100, the center of the gasket 30 is aligned with the center of the notch.

[0052] For example, the connecting portion 11 is a U-shaped notch. In the length direction X of the power module 100, the opening of the U-shaped notch faces away from the center of the power module 100. In the thickness direction Z of the power module 100, the U-shaped notch is a through hole extending vertically. A through hole 31 is defined at the center of the gasket 30. The center of the through hole 31 coincides with the orthographic projection of the center of the U-shaped notch on the plane of the plastic package 10.

[0053] It is understood that the connection portion 11 serves as a screw hole. When connecting the heat exchanger and the plastic-encapsulated body 10, screws can be sequentially inserted through the through-hole 31 of the gasket 30, the screw hole in the plastic-encapsulated body 10, and the screw hole in the heat exchanger to achieve a fixed connection between the two. In addition, to ensure that the gasket 30 effectively buffers the force applied by the screw, the diameter of the screw head must be less than or equal to the diameter of the gasket 30. This allows the force from the screw to be dispersed to a certain extent through the gasket 30, which has a larger area (relative to the screw head).

[0054] This arrangement can make it easier to disperse the force transmitted from the gasket 30 to the plastic package body 10 , further reduce the force acting on the first substrate 20 , and thus further improve the structural reliability of the power module 100 .

[0055] In order to ensure that the orthographic projection of the gasket 30 on the first surface 101 of the plastic package 10 does not overlap with the orthographic projection of the first substrate 20 on the first surface 101 of the plastic package 10, the size of the first substrate 20, the positional relationship between the gasket 30 and the first substrate 20 and the plastic package 10, and the positional relationship between multiple gaskets 30 can be designed.

[0056] In some embodiments, as shown in FIG. 5 , a dimension of the first substrate 20 along a length direction X of the power module is L1 , and L1 satisfies: 22.3 mm < L1 < 22.9 mm.

[0057] For example, the gasket 30 is located on at least one side of the first substrate 20 along its length direction X. The length of the first substrate 20 (i.e., the dimension along the length direction X of the power module 100) is L1, and L1 satisfies the relationship: 22.3mm<L1<22.9mm. When the length L1 of the first substrate 20 is less than 22.3mm, there is a risk of insufficient heat dissipation performance. When the length L1 of the first substrate 20 exceeds 22.9mm, the gasket 30 may press against the first substrate 20. Based on this, by setting the length of the first substrate 20 between 22.3 mm and 22.9 mm, for example, 22.7 mm, not only can the orthographic projection of the first substrate 20 on the first surface 101 of the plastic package 10 and the orthographic projection of the gasket 30 on the first surface 101 of the plastic package 10 be prevented from overlapping, thereby causing the gasket 30 to directly transmit the force vertically downward to the first substrate 20, but also the first substrate 20 being prevented from being too short, resulting in unsatisfactory heat dissipation performance, thereby affecting the normal operation of the power chip 40. Furthermore, within the above range, the larger L1 is, the better the heat dissipation performance is, and the smaller L1 is, the lower the cost is.

[0058] In some embodiments, as shown in FIG. 5 , the distance between the center of the gasket 30 and the side of the first substrate 20 close to the gasket 30 is L2 , and L2 satisfies: 3.45 mm < L2 < 3.75 mm.

[0059] For example, along the length direction X of the power module 100, the distance between the center of the gasket 30 and the side of the first substrate 20 closest to the gasket 30 is L2, and L2 satisfies the relationship: 3.45mm<L2<3.75mm. The lower limit of L2 is determined by comprehensively considering the size of the gasket 30 and the tolerances of various dimensions. For example, if the radius of the gasket 30 is 3.5mm, the lower limit of L2 is set to 3.45mm. The upper limit of L2 is the maximum size that can be implemented by comprehensively considering other dimensions (such as L1 mentioned above and L3 described below). Based on this, by setting the distance between the center of the gasket 30 and the side of the first substrate 20 to between 3.45 mm and 3.75 mm, for example, 3.55 mm, it is not only possible to prevent the distance between the two from being too large, which would cause the volume of the power module 100 to be too large, thereby increasing the production cost of the power module 100 and the difficulty of installing it on the electronic device, but also to prevent the distance between the two from being too small, which would cause the force applied to the gasket 30 to be easily directly and vertically transmitted to the first substrate 20, making the first substrate 20 easily damaged. In this way, the structural reliability of the power module 100 can be further improved. Furthermore, within the above range, the smaller L2 is, the larger the design size of L1 can be, and the heat dissipation performance can be improved; the larger L2 is, the larger the distance between the gasket and the first substrate 20 is, and the lower the risk of the gasket 30 cracking the first substrate 20.

[0060] In some embodiments, as shown in FIG. 7 , the distance between the center of the gasket 30 and the side of the plastic package body 10 close to the gasket 30 is L4, and L4 satisfies: 1.5 mm < L4 ≤ 3 mm.

[0061] For example, along the length direction X of the power module 100, the distance between the center of the gasket 30 and the side of the plastic package 10 closest to the gasket 30 is L4, and L4 satisfies the relationship: 1.5mm<L4≤3mm. The range of L4 is determined by comprehensively considering the overall size, cost, and actual use. The upper limit of L4 is set at 3mm to meet the requirements of cost and size control; the lower limit of L4 is set at 1.5mm to ensure that the gasket 30 with a radius of 3.5mm does not have a large area hanging in the air, thereby avoiding reliability risks. Based on this, by setting the distance between the center of the gasket 30 and the side of the plastic package 10 between 1.5 mm and 3 mm, not only can the size of the plastic package 10 along the length direction X of the power module 100 be prevented from being too large, thereby causing the plastic package 10 to be too large, but also, compared to the 1.5 mm distance in the related art, the distance between the center of the gasket 30 and the side of the plastic package 10 adjacent to the gasket 30 is larger, thereby increasing the contact area between the gasket 30 and the plastic package 10, thereby making the force transmitted by the gasket 30 to the plastic package 10 more stable and uniform, preventing excessive concentration of force transmitted from the gasket 30 to the plastic package 10, which would result in excessive concentration of force transmitted from the plastic package 10 to the first substrate 20, thereby further improving the structural stability and reliability of the first substrate 20. Furthermore, within the above range, the smaller L4 is, the smaller the product size, the higher the power density, and the lower the cost.

[0062] In some embodiments, as shown in FIG. 6 , the distance between the centers of the two gaskets 30 is L3 , and L3 satisfies: 29.5 mm < L3 < 30 mm.

[0063] For example, the plastic package body 10 is provided with a gasket 30 at each end along its length direction X. The distance between the centers of the two gaskets 30 is L3, and L3 satisfies the relationship: 29.5mm<L3<30mm. The range of L3 is determined based on existing products on the market and installation tolerances. Based on this, the volume of the power module 100 can be ensured not to be too large while reducing the magnitude of the force transmitted by the gasket 30 to the first substrate 20, thereby further improving the structural reliability of the power module 100. Furthermore, within the above range, the smaller L3 is, the smaller the product size is, the higher the power density is, and the lower the cost is.

[0064] In some embodiments, as shown in FIG5 , the gasket 30 is a circular gasket having a diameter D, and D satisfies: 6.8 mm < D < 7 mm.

[0065] For example, the gasket 30 can be a standard gasket with a diameter D that satisfies the relationship: 6.8 mm < D < 7 mm. Based on this, a gasket 30 with an appropriate diameter can be selected based on the process requirements for installing different power modules 100 and heat exchangers. This allows the gasket 30 to meet the requirements of a wider range of power modules 100 without requiring custom gaskets, thereby improving the applicability of the gasket 30.

[0066] On this basis, since L2 satisfies the relationship: 3.4 mm < L2 < 3.75 mm, and D satisfies the relationship: 6.8 mm < D < 7 mm, the radius of the gasket 30 is less than or equal to the distance L2 between the center of the gasket 30 and the side of the first substrate 20 close to the gasket 30 (i.e., D / 2 ≤ L2). Thus, the difference between the distance L2 between the center of the gasket 30 and the side of the first substrate 20 close to the gasket 30 and the radius of the gasket 30 (i.e., L2 - D / 2) is the distance between the orthographic projection of the gasket 30 on the first surface 101 of the plastic package 10 and the orthographic projection of the first substrate 20 on the first surface 101 of the plastic package 10.

[0067] It can be understood that the above-mentioned multiple embodiments regarding the size of the first substrate 20, the positional relationship between the gasket 30 and the first substrate 20 and the plastic package 10, and the positional relationship between the gaskets 30 can be used individually as a definition of the power module, or can be partially or completely combined as a definition of the power module, as long as the orthographic projection of the gasket 30 on the first surface 101 and the orthographic projection of the first substrate 20 on the first surface 101 do not overlap.

[0068] In the embodiments of the present disclosure, as shown in Figures 3 to 12, the power module 100 may further include a second substrate 50 disposed within the plastic package 10, a driver chip 60 disposed on the second substrate 50, and a plurality of power pins 70 and a plurality of driver pins 80 spaced apart along the length direction X of the power module 100. The second substrate 50 and the first substrate 20 are spaced apart along the width direction Y of the power module 100. One end of the power pin 70 is connected to the first substrate 20, and the other end extends outside the plastic package 10; one end of the driver pin 80 is connected to the second substrate 50, and the other end extends outside the plastic package 10. The plurality of driver pins 80 and the plurality of power pins 70 are located on both sides of the power module 100 along the width direction Y thereof.

[0069] The driver chip 60 is electrically connected to the power chip 40 and is used to drive the power chip 40 to operate, thereby realizing the functions of the power module 100. For example, the driver chip 60 may include a first driver chip, such as a low-voltage driver chip, and a second driver chip, such as a high-voltage driver chip. A portion of the multiple driver pins 80 are electrically connected to the low-voltage driver chip, and another portion are electrically connected to the high-voltage driver chip. When the power module 100 is operating, the multiple driver pins 80 and the multiple power pins 70 can be connected to an external controller, thereby realizing electrical connection between the internal circuit of the power module 100 and the external circuit.

[0070] The first substrate 20, the power chip 40, the second substrate 50, and the driver chip 60 are all disposed in a plastic package 10. The plastic package 10 may be, for example, a protective shell formed of an encapsulating resin, which is used to provide protection for the internal structure thereof, thereby making the assembly of the first substrate 20 and the second substrate 50 more reliable and providing good protection for the driver chip 60 and the power chip 40.

[0071] In some embodiments, as shown in FIG8 , the first substrate 20 may include a conductive layer 210, a ceramic layer 220, and a heat dissipation layer 230. As shown in FIG11 and FIG12 , along the thickness direction Z of the power module 100, the conductive layer 210 and the heat dissipation layer 230 are respectively located on both sides of the ceramic layer 220, and along the length direction X and the width direction Y of the power module 100, the edge of the ceramic layer 220 protrudes outward relative to the edge of the conductive layer 210. The power chip 40 is disposed on the conductive layer 210, and the surface of the heat dissipation layer 230 away from the conductive layer 210 is flush with the second surface 102 of the plastic package 10. For example, the conductive layer 210 and the heat dissipation layer 230 can both be copper layers, and the ceramic layer 220 can be made of an insulating material with good thermal conductivity. Together, the three constitute a DBC (Direct Bond Copper) structure. The copper layer on one side of the ceramic layer 220 is etched with a pattern and is configured to carry the power chip 40 and act as a conductor. The copper layer on the other side of the ceramic layer 220 is a whole layer structure and is configured to provide a heat dissipation path, while the ceramic layer 220 can act as an insulator.

[0072] It can be understood that, for the first substrate 20 with a DBC structure, the above L2 refers to the distance between the center of the gasket 30 and the side of the ceramic layer 220 close to the gasket 30 .

[0073] Based on this, when the power module 100 is connected to the heat exchanger, the force transmitted from the gasket 30 to the first substrate 20 is first transmitted to the ceramic layer 220, and then to the conductive layer 210 and the power chip 40. This improves the structural reliability of the conductive layer 210 and the power chip 40 located thereon. In addition, the heat generated by the power chip 40 during operation can be promptly dissipated through the conductive layer 210, the ceramic layer 220, and the heat dissipation layer 230 to achieve heat dissipation of the power module 100, thereby ensuring the reliability of the power chip 40 and improving the performance of the power module 100.

[0074] In other embodiments, as shown in FIG13 , the first substrate 20 may include a conductive layer 210 and a ceramic layer 220 located on a side of the conductive layer 210 away from the first surface 101. The power chip 40 is disposed on the conductive layer 210, and the surface of the ceramic layer 220 away from the conductive layer 210 is flush with the second surface 102 of the plastic package 10. For example, the conductive layer 210 may be made of copper, and the ceramic layer 220 may be made of an insulating material with good heat dissipation, and the two may form a single-sided copper-clad ceramic plate structure. The copper layer may be etched with a pattern and configured to carry the power chip 40. The surface of the ceramic layer 220 away from the conductive layer 210 is exposed from the plastic package 10, providing both insulation and heat dissipation.

[0075] In this way, the heat generated by the power chip 40 during operation can be dissipated promptly through the conductive layer 210 and the ceramic layer 220 to achieve heat dissipation of the power module 100, thereby ensuring the reliability of the power chip 40 and improving the performance of the power module 100.

[0076] In some other embodiments, the conductive layer 210 can have an integral structure with the power pin. That is, the conductive layer 210 includes a portion located within the plastic package 10 and a portion extending outside the plastic package 10. The portion of the conductive layer 210 located within the plastic package 10 can be used as a solder pad for the power chip 40, and the portion of the conductive layer 210 extending outside the plastic package 10 can be used as a power pin. On this basis, in addition to the conductive layer 210 having an integral structure with the power pin, the first substrate 20 can also include an insulating resin heat sink, which is composed of an insulating resin sheet connected to a heat sink on one side. The other side of the insulating resin sheet is connected to the conductive layer 210 that constitutes the solder pad of the power chip 40. The surface of the heat sink away from the conductive layer 210 is flush with the second surface 102 of the plastic package 10. The heat sink can be a copper sheet, and the insulating resin heat sink is typically an insulating resin copper sheet.

[0077] It should be noted that the materials of the various layers and the effects that can be achieved in this embodiment are similar to those in the above-mentioned embodiment in which the first substrate 20 adopts a DBC structure, and are not described in detail here.

[0078] In some embodiments, as shown in Figures 14 and 15, the plastic package body 10 may further include at least one resin injection portion 12 located on its first side surface 103 (i.e., the side surface close to the portion of the power pin 70 extending outside the plastic package body 10), and the at least one resin injection portion 12 is arranged opposite to the second substrate 50 along the width direction Y of the power module 100.

[0079] During the packaging process of the main structure of the power module 100 (first substrate 20 and power chip 40, second substrate 50 and driver chip 60), as shown in FIG16 , the main structure of the power module 100 can be placed in a mold cavity 910 of a packaging mold. The packaging mold has a resin injection port A. Liquid resin is injected into the mold cavity 910 through the resin injection port A and fills the space between the main structure of the power module 100 and the cavity wall. After the resin solidifies, the molded body 10 shown in FIG17 is formed. The portion of the molded body 10 corresponding to the resin injection port A is the resin injection portion 12. The roughness of the resin injection portion 12 is greater than that of the other portions of the molded body 10.

[0080] The encapsulation mold comprises an upper shell and a lower shell, which snap together to form an internal mold cavity. The side surface of the plastic encapsulation body 10 formed by the encapsulation mold has a resin parting surface corresponding to the snap-fit ​​position of the upper and lower shells. Referring to Figures 16 and 17 , the resin injection port A is typically positioned near the snap-fit ​​position of the upper and lower shells. Accordingly, the resin injection portion 12 is positioned near the resin parting surface, for example, corresponding to the resin parting surface, or above or below the resin parting surface. This arrangement facilitates the processing of the encapsulation mold.

[0081] Based on this, it can be seen that the resin injection portion 12 is located on the first side 103 of the plastic package body 10, opposite the second substrate 50. Since the second substrate 50 is provided with the driver chip 60, these structures inevitably create a certain resistance to the flow of the resin. However, the resin injection portion 12 (resin injection port A) is located opposite the second substrate 50, which can enhance the fluidity of the resin and prevent uneven resin flow rate.

[0082] It is understood that the second substrate 50 and the first substrate 20 are spaced apart in the width direction Y of the power module 100. Therefore, at least one resin injection portion 12 is also positioned opposite the first substrate 20 along the width direction Y of the power module 100. Similarly, structures such as the power chip 40 on the first substrate 20 will also create a certain resistance to the flow of resin. The resin injection portion 12 (resin injection port A) is positioned opposite the first substrate 20 to enhance the fluidity of the resin and prevent uneven resin flow.

[0083] In some embodiments, as shown in FIG18 , the second substrate 50 may include two soldering portions 510 spaced apart along the length direction X of the power module 100 . Each soldering portion 510 is configured to accommodate a driver chip 60 . For example, one soldering portion 510 is configured to accommodate a low-voltage driver chip, and the other soldering portion 510 is configured to accommodate a high-voltage driver chip. Based on this, the at least one resin injection portion 12 may include two resin injection portions 12 . Along the width direction Y of the power module 100 , the two resin injection portions 12 correspond to the two soldering portions 510 , respectively.

[0084] Since the driver chip 60 needs to be electrically connected to the power chip 40 and the driver pin 80 through wires, there will be many wires above the welding part 510, and these wires will cause a certain resistance to the flow of the resin. During the packaging process of the power module 100, the liquid resin flows from the side where the power pin is located to the side where the driver pin is located. Therefore, along the width direction Y of the power module 100, the area corresponding to the welding part 510 is subjected to greater resistance than other areas where no welding part is provided. By providing a resin injection part 12 corresponding to the number of welding parts 510, and making the two resin injection parts 12 correspond to the two welding parts 510 along the width direction Y of the power module 100 (that is, the position of the resin injection port A corresponds to the position of the welding part 510), not only can the resin fluidity in the area corresponding to the welding part 510 be increased, but also the uneven distribution of the resin can be avoided, thereby maintaining the uniformity of the resin flow in the cavity and avoiding the generation of gaps.

[0085] In some embodiments, as shown in FIG18 , the two welding portions 510 may include a first welding portion 510 located near the third side 105 of the molded body 10 and a second welding portion 510 located near the fourth side 106 of the molded body 10. The third side 105 and the fourth side 106 are disposed opposite each other along the length direction X of the power module 100. Along the width direction Y of the power module 100, of the two resin injection portions 12, one resin injection portion 12 corresponds to a portion of the first welding portion 510 located near the third side 105, and the other resin injection portion 12 corresponds to a portion of the second welding portion 510 located near the fourth side 106. That is, along the length direction X of the power module 100, the distance from the resin injection portion 12 (resin injection port A) to the corresponding welding portion 510 located away from the edge of the molded body 10 is greater than the distance from the resin injection portion 12 (resin injection port A) to the corresponding welding portion 510 located near the edge of the molded body 10.

[0086] It should be noted that, in the length direction X of the power module 100 , the portion of the first welding portion 510 close to the third side surface 105 is located in the middle of the left half of the plastic package body 10 , and the portion of the second welding portion 510 close to the fourth side surface 106 is located in the middle of the right half of the plastic package body 10 .

[0087] In this way, the two resin injection portions 12 (resin injection ports A) can be respectively arranged in the middle of the two parts of the plastic package body 10 along the length direction X of the power module 100, which is conducive to maintaining the uniformity of resin flow inside the cavity and thus avoiding the generation of gaps.

[0088] On this basis, as shown in FIG18 , a first driver chip, such as a low-voltage driver chip, can be disposed on the first soldering portion 510, and a second driver chip, such as a high-voltage driver chip, can be disposed on the second soldering portion 510. Along the width direction Y of the power module 100, the distance between the first driver chip and the edge of the first soldering portion 510 near the driver pin 80 is smaller than the distance between the first driver chip and the edge of the first soldering portion 510 near the power pin 70, and the distance between the second driver chip and the edge of the second soldering portion 510 near the driver pin 80 is substantially the same as the distance between the second driver chip and the edge of the second soldering portion 510 near the power pin 70.

[0089] That is, the first driver chip is disposed on the first soldering portion 510 close to the side where the driving pin 80 is located, and the second driver chip is disposed in the middle of the second soldering portion 510 .

[0090] Since a low-voltage driver chip is provided on the first welding portion 510, and the driver pins electrically connected to the low-voltage driver chip are distributed relatively densely, the low-voltage driver chip is provided on the side of the first welding portion 510 close to the driver pin 80. This can reduce the deformation of the wire used to electrically connect the low-voltage driver chip and the corresponding driver pin, thereby optimizing the structural design of the power module 100.

[0091] The dimension of the second soldering portion 510 along the length direction X of the power module 100 is greater than the dimension of the first soldering portion 510 along the length direction X of the power module 100. Since a high-voltage driver chip is disposed on the second soldering portion 510, and compared to a low-voltage driver chip, the high-voltage driver chip has fewer driver pins electrically connected to it, disposing the high-voltage driver chip in the middle of the second soldering portion 510 helps ensure the stability and reliability of the high-voltage driver chip.

[0092] In some embodiments, as shown in Figure 18, the first substrate 20 may include a first base island 201, a second base island 202, a third base island 203 and a fourth base island 204 arranged in sequence along the length direction X of the power module 100, and at least one power chip 40 is arranged on each base island.

[0093] At this time, along the width direction Y of the power module 100, the two resin injection parts 12 may correspond to the first base island 201 and the fourth base island 204 respectively. This arrangement is conducive to maintaining the uniformity of resin flow inside the cavity, thereby avoiding the generation of gaps.

[0094] Alternatively, along the width direction Y of the power module 100, one resin injection portion 12 may correspond to a position between the first base island 201 and the second base island 202, and another resin injection portion 12 may correspond to the fourth base island 204. This arrangement helps improve the uniformity of the resin flowing between the first base island 201 and the second base island 202, thereby further preventing the generation of voids.

[0095] As shown in FIG18 , the multiple power pins 70 of the power module 100 include a first power pin electrically connected to the power chip 40 on the first base island 201, a second power pin electrically connected to the power chip 40 on the second base island 202, a third power pin electrically connected to the power chip 40 on the third base island 203, and a fourth power pin (e.g., a plurality of fourth power pins) electrically connected to the power chip 40 on the fourth base island 204. Electrical connections are established between the power chip 40 and the corresponding power pins via wires.

[0096] It is understandable that, based on the structural design of each base island, each base island and its corresponding power pin are not directly aligned in the width direction Y of the power module 100. For example, the first base island 201 may correspond to the third power pin in the width direction Y of the power module 100, and the second base island 202, the third base island 203, and the fourth base island 204 may all correspond to the fourth power pins in the width direction Y of the power module 100.

[0097] Based on this, along the width direction Y of the power module 100, one resin injection portion 12 can correspond to the third power pin, and another resin injection portion 12 can correspond to the fourth power pin farthest from the third power pin among the plurality of fourth power pins. In this way, the third power pin and the fourth power pin corresponding to the resin injection portion 12 are respectively located between the two parts of the plastic package 10 along the length direction X of the power module 100, which helps maintain uniform resin flow within the cavity and thus avoids the formation of gaps.

[0098] For example, at least one of the first power pin, the second power pin, the third power pin and the fourth power pin is provided with a through hole, which can increase the bonding between the resin and the packaging mold and prevent external moisture or air from entering the cavity of the packaging mold, thereby further avoiding the generation of gaps and improving the reliability of the power module 100.

[0099] Considering that the power module 100 is a structure obtained by encapsulating a main structure located within a mold cavity of a packaging mold using liquid resin and then curing the resin, and the flowing resin can easily impact the first substrate 20, causing displacement thereof, in some embodiments, as shown in FIG3 and FIG17 , the plastic package body 10 may further include a first stepped portion 13 recessed in the direction from the plurality of power pins 70 to the plurality of drive pins 80. The first stepped portion 13 is located on a side of the portion of the plurality of power pins 70 extending outside the plastic package body 10, close to the second surface 102 of the plastic package body 10. The first stepped portion 13 includes a first stepped surface 131 and a first connecting surface 132 connected between the first stepped surface 131 and the second surface 102. When the first substrate 20 adopts a DBC structure or a single-sided copper-clad ceramic structure, along the thickness direction Z of the power module 100, the distance H1 from the first stepped surface 131 to the second surface 102 is less than the distance H0 from the resin injection portion 12 to the second surface 102, and the distance H1 from the first stepped surface 131 to the second surface 102 is less than the distance H4 from the surface of the power chip 40 away from the second surface 102 to the second surface 102. Here, the recessed first stepped portion 13 means that the first stepped portion 13 is recessed into the interior of the plastic package body 10.

[0100] It is understandable that the shape of the cavity wall of the encapsulation mold matches the outer shape of the plastic encapsulation body 10. Therefore, as shown in FIG16 , the encapsulation mold cavity 910 has a first step 921 corresponding to the first step portion 13 of the plastic encapsulation body 10. The distance H1′ from the step surface of the first step 921 to the cavity bottom is less than the distance from the surface of the power chip 40 away from the cavity bottom to the cavity bottom. Furthermore, the distance H1′ from the step surface of the first step 921 to the cavity bottom is less than the height H0′ of the resin injection port A (i.e., the distance H0′ from the resin injection port A to the cavity bottom).

[0101] In this way, the provision of the first stepped portion 13 can reduce the space between the first substrate 20 and the side surface of the cavity of the encapsulation mold corresponding to the side where the power pins 70 are located, so as to reduce the amount of resin accumulated at this position during the resin injection process, thereby reducing the risk of burrs generated by the resin overflowing from the bottom surface of the first substrate 20. In addition, since the distance H1 from the first stepped surface 131 to the second surface 102 is less than the distance H0 from the resin injection portion 12 to the second surface 102, when injecting resin into the cavity of the encapsulation mold through the resin injection port A, the liquid resin first falls on the first step 921, and this first step plays a certain buffering role for the liquid resin, reducing the height of the resin flowing towards the first substrate 20 and reducing the obliquely downward impact force of the resin on the first substrate 20. On this basis, the distance H1 from the first stepped surface 131 to the second surface 102 is less than the distance H4 from the top surface of the power chip 40 to the second surface 102, causing the resin to flow from low to high towards the power chip 40. Therefore, the flow of the resin is smoother, further reducing the impact force of the resin on the first substrate 20 and the power chip 40, thereby alleviating the problem that the first substrate 20 may be displaced.

[0102] In some embodiments, the distance H1 from the first stepped surface 131 to the second surface 102 can be less than the distance from the surface of the power chip 40 close to the first surface 101 to the second surface 102 (i.e., the height of the power chip 40). In this way, when injecting resin into the cavity of the encapsulation mold through the resin injection port A, the resin can flow relatively smoothly to the first substrate 20 and the power chip 40, reducing the impact force of the resin on the first substrate 20 and the power chip 40, thereby further alleviating the problem that the first substrate 20 may be displaced.

[0103] In some embodiments, the distance H0 from the resin injection portion 12 to the second surface 102 can be greater than the distance from the surface of the power chip 40 close to the first surface 101 to the second surface 102 (i.e., the height of the power chip 40). In this way, when injecting resin into the cavity of the encapsulation mold through the resin injection port A, the injected resin can submerge the power chip 40, so as to encapsulate the power chip 40 in the plastic package 10.

[0104] Furthermore, the distance S from the edge of the first side surface 103 of the first substrate 20 close to the plastic package 10 to the first connection surface 132 satisfies: 0.5 times the thickness of the first substrate 20 < S < 1.5 times the thickness of the first substrate 20.

[0105] If S is too large, the resin may easily overflow from the bottom surface of the first substrate 20. For example, when S is ≥ 1.5 times the thickness of the first substrate 20, the space between the edge of the first substrate 20 near the power pin 70 and the first connection surface 132 is large, and resin may easily accumulate in this location, resulting in a defect in which the resin may overflow from the bottom surface of the first substrate 20 and cause burrs.

[0106] If S is too small, it will be difficult for the resin to fully fill the space between the first connection surface 132 and the first side surface 103 of the plastic package 10, which can easily lead to the formation of gaps. For example, when S is ≤ 0.5 times the thickness of the first substrate 20, a narrow gap will form between the edge of the first substrate 20 near the power pin 70 and the first connection surface 132, making it difficult for the resin to fully fill this space, which can easily lead to gap defects.

[0107] For example, the thickness of the first substrate 20 is 1.05 mm. If S=0.518 mm, the resin will not be able to fully fill the position; if S=2.0 mm, the first substrate 20 will be prone to overflow risk.

[0108] Based on this, by limiting the distance S to between 0.5 times and 1.5 times the thickness of the first substrate 20, it is easier to fill the position with resin, and the risk of resin accumulation causing overflow from the bottom surface of the first substrate 20 can be reduced, so as to prevent burrs and avoid gaps, thereby ensuring the insulation stability of the power module 100 and improving its electrical safety.

[0109] In some embodiments, as shown in Figures 3 and 17 , the plastic package body 10 may further include a second step portion 14 recessed in the direction from the plurality of drive pins 80 to the plurality of power pins 70. The second step portion 14 is located on the side of the portion of the plurality of drive pins 80 extending outside the plastic package body 10, near the second surface 102 of the plastic package body 10. The second step portion 14 includes a second step surface 141 and a second connection surface 142 connected between the second step surface 141 and the second surface 102. Along the thickness direction Z of the power module 100, the distance H2 from the second step surface 141 to the second surface 102 is approximately equal to the distance H1 from the first step surface 131 to the second surface 102. Furthermore, along the width direction Y of the power module 100, the distance from the second connection surface 142 to the second side surface 104 of the plastic package body 10, opposite the first side surface 103, is approximately equal to the distance from the first connection surface 132 to the first side surface 103. Here, a recessed second step portion 14 means that the second step portion 14 is recessed toward the interior of the plastic package body 10.

[0110] Similar to the first step portion 13, as shown in Figures 16 and 18, the cavity 910 of the packaging mold has a second step 922 corresponding to the second step portion 14 of the plastic package body 10, and the structural dimensions of the second step 922 can refer to the above description of the second step portion 14.

[0111] In this way, the provision of the second step portion 14 can reduce the space between the first substrate 20 and the side of the mold cavity of the packaging mold corresponding to the side where the drive pin 80 is located, thereby reducing the amount of resin accumulated in this location during the resin injection process, thereby reducing the risk of resin overflowing from the bottom surface of the first substrate 20 and generating burrs. The provision of the second step portion 14 can also regulate the flow rate of the resin in the area near the drive pin 80 in the mold cavity, making the overall mold flow speed more balanced, thereby speeding up the injection time and avoiding the formation of gaps. In addition, the second step portion 14 and the first step portion 13 are symmetrically arranged along the width direction Y of the power module 100, which can simplify the manufacturing process.

[0112] In some embodiments, as shown in Figures 4 and 17 , the plastic package body 10 may further include a third step portion 15 recessed in the direction from the multiple power pins 70 to the multiple driver pins 80. The third step portion 15 is located on a side of the portion of the multiple driver pins 80 extending outside the plastic package body 10, close to the first surface 101 of the plastic package body 10. The third step portion 15 has a third step surface 151 and a third connecting surface 152 connecting the third step surface 151 and the first surface 101. Along the thickness direction Z of the power module 100, a distance H3 from the third step surface 151 to the first surface 101 is less than a distance H1 from the first step surface 131 to the second surface 102.

[0113] In this way, by providing steps on both the upper and lower surfaces of the side of the plastic package body 10 where the drive pin 80 is provided, the flow rate of the resin in the area near the drive pin 80 in the cavity can be better adjusted, so that the entire mold flow speed is more balanced, thereby speeding up the injection time and avoiding the generation of gaps.

[0114] In some embodiments, as shown in Figures 3 and 4, at least one of the first step 13, the second step 14, and the third step 15 may include a guide. The guide may be provided at a corner of the corresponding step to generate a component force that guides the resin toward the opposite side during resin flow, thereby promoting the flow of resin at the corner and avoiding the risk of voids caused by resin stagnation and accumulation at the corner.

[0115] It is understood that the corner of the step portion refers to the portion where the connection surface of the step portion is located between the main portion extending along the length direction X of the power module 100 and the end portion extending along the width direction Y of the power module 100. For example, the guide portion may be a chamfer, a rounded corner, a groove, or other structure that can achieve resin diversion.

[0116] In some examples, the first step portion 13 may include a first guide portion 133 located at at least one corner. The first step portion 13 may include a first main portion extending along the length direction X of the power module 100, a first end portion extending along the width direction Y of the power module 100, and a first guide portion 133 connected between the first main portion and the first end portion.

[0117] In other examples, the second step portion 14 may include a second air guide portion 143 located at at least one corner.

[0118] In some other examples, the third step portion 15 may include a third air guide portion 153 located at at least one corner.

[0119] The structures of the second air guide portion 143 and the third air guide portion 153 are similar to the structure of the first air guide portion 133 , and are not described in detail here.

[0120] It should be noted that, in addition to forming a guide portion at a corner position of at least one of the first step portion 13, the second step portion 14 and the third step portion 15, a guide portion may also be formed at a corner position between any two adjacent side surfaces of the first side surface 103, the second side surface 104, the third side surface 105 and the fourth side surface 106 of the plastic package body 10, for example, a guide portion may be formed at each corner, or a guide portion may be selectively formed at certain corners.

[0121] As a result, when liquid resin flows to the corner of the cavity corresponding to the guide portion, the guide portion can promote the flow of resin, thereby preventing resin stagnation and accumulation, which may cause resin voids. Furthermore, the provision of the guide portion can also reduce the amount of resin accumulation, further reducing the risk of resin overflowing from the bottom surface of the first substrate 20 and causing burrs.

[0122] An embodiment of the present disclosure provides an electronic device. As shown in FIG19 , the electronic device 1000 may include the power module 100 in any of the above embodiments and a controller 200 connected to the power module 100 .

[0123] For example, there may be one or more power modules 100, and the electronic device 1000 may include, but is not limited to, an inverter device or a rectifier device, such as a motor drive controller. The controller 200 may generate a control signal based on a user instruction and send the control signal to the power module 100. The power module 100 may generate a drive signal based on the control signal and output it to the corresponding driven component to implement functions such as drive control, inversion, or rectification conversion.

[0124] Based on this, by applying the power module 100 in the above embodiment to electronic equipment, the structural stability and electrical safety of the electronic equipment can be improved, thereby enhancing the product competitiveness of the electronic equipment and improving the user experience.

[0125] It should be noted that the electronic device provided by the embodiment of the present disclosure has the same technical effects as the power module in the above-mentioned embodiment included therein, which will not be described in detail here.

[0126] In the description of the present disclosure, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature therebetween. A first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is at a higher level than the second feature.

[0127] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation.

[0128] Although the embodiments of the present disclosure have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

[0129] Those skilled in the art will understand that the scope of the disclosure of the present invention is not limited to the specific embodiments described above, and that certain elements of the embodiments may be modified and replaced without departing from the spirit of the present application. The scope of the disclosure of the present application is limited by the appended claims.

Claims

1. A power module assembly, comprising: A plastic package body having a first surface and a second surface opposite to each other, and comprising at least one connecting portion located at an end of the plastic package body; A first substrate is arranged inside the plastic package body; A power chip is provided on the first substrate; as well as At least one gasket is disposed on the first surface of the plastic package body and corresponds to the at least one connecting portion, wherein an orthographic projection of the gasket on the first surface does not overlap with an orthographic projection of the first substrate on the first surface; The plastic package body is configured to be connected to the heat exchanger through a gasket and a connecting portion, so that the second surface of the plastic package body is in contact with the heat exchanger.

2. The power module assembly according to claim 1, wherein: The orthographic projection of the spacer on the first surface is spaced apart from the orthographic projection of the first substrate on the first surface.

3. The power module assembly according to claim 1 or 2, wherein: The at least one connecting portion includes two connecting portions located at two ends of the plastic packaging body along the length direction of the plastic packaging body and symmetrically arranged, and the at least one gasket includes two gaskets corresponding to the two connecting portions respectively.

4. The power module assembly according to claim 3, wherein: The connecting portion includes a notch; along the thickness direction of the plastic package body, the center of the gasket is opposite to the center of the notch.

5. The power module assembly according to claim 4, wherein: The distance between the centers of the two gaskets is L3, and L3 satisfies: 29.5 mm < L3 < 30 mm.

6. The power module assembly according to any one of claims 1 to 5, wherein: The dimension of the first substrate along the length direction of the plastic package body is L1, and L1 satisfies: 22.3 mm < L1 < 22.9 mm; and / or The distance between the center of the gasket and the side of the first substrate close to the gasket is L2, and L2 satisfies: 3.45mm<L2<3.75mm; and / or The distance between the center of the gasket and the side of the plastic package body close to the gasket is L4, and L4 satisfies the following: 1.5mm<L4≤3mm.

7. The power module assembly according to any one of claims 1 to 6, wherein: The gasket is a circular gasket with a diameter of D, and D satisfies: 6.8 mm < D < 7 mm.

8. The power module assembly according to any one of claims 1 to 7, wherein: The first substrate comprises a conductive layer, a ceramic layer and a heat dissipation layer; along the thickness direction of the plastic package, the conductive layer and the heat dissipation layer are respectively located on both sides of the ceramic layer; the power chip is arranged on the conductive layer, and the surface of the heat dissipation layer away from the conductive layer is flush with the second surface of the plastic package; or The first substrate includes a conductive layer and a ceramic layer located on a side of the conductive layer away from the first surface; the power chip is arranged on the conductive layer, and a surface of the ceramic layer away from the conductive layer is flush with the second surface of the plastic package body.

9. The power module assembly according to any one of claims 1 to 8, further comprising: A second substrate is arranged inside the plastic package body; The second substrate is spaced apart from the first substrate in a width direction of the plastic package body; A driver chip is provided on the second substrate; the driver chip is electrically connected to the power chip; A plurality of driving pins are arranged at intervals along the length direction of the plastic package; one end of the driving pin is connected to the second substrate, and the other end extends out of the plastic package; A plurality of power pins are spaced apart along the length direction of the plastic package body; one end of the power pin is connected to the first One end is connected to the substrate, and the other end extends out of the plastic package; And At least one resin injection part, located on the first side of the plastic package close to the part where the power pins extend out of the plastic package; Wherein, the multiple driving pins and the multiple power pins are located on both sides of the plastic package along its width direction.

10. The power module assembly according to claim 9, wherein: The second substrate includes two welding parts arranged at intervals along the length direction of the plastic package, and the welding parts are configured to set driving chips; The at least one resin injection part includes two resin injection parts; along the width direction of the plastic package, the two resin injection parts respectively correspond to the two welding parts.

11. The power module assembly according to claim 10, wherein: The two welding parts include a first welding part close to the third side of the plastic package and a second welding part close to the fourth side of the plastic package, and the third side and the fourth side are oppositely arranged along the length direction of the plastic package; Among the two resin injection parts, one resin injection part corresponds to the part of the first welding part close to the third side, and the other resin injection part corresponds to the part of the second welding part close to the fourth side.

12. The power module assembly according to claim 10 or 11, wherein: The first substrate includes a first base island, a second base island, a third base island and a fourth base island arranged at intervals in sequence along the length direction of the plastic package; Along the width direction of the plastic package, the two resin injection parts respectively correspond to the first base island and the fourth base island.

13. The power module assembly according to claim 10, wherein: The two welding parts include a first welding part close to the third side of the plastic package and a second welding part close to the fourth side of the plastic package, and the third side and the fourth side are oppositely arranged along the length direction of the plastic package; The driving chips include a first driving chip and a second driving chip, the first driving chip is arranged on the first welding part, and the second driving chip is arranged on the second welding part; Wherein, along the width direction of the plastic package, the distance from the first driving chip to the edge of the first welding part close to the driving pins is less than the distance from the first driving chip to the edge of the first welding part close to the power pins.

14. The power module assembly according to claim 13, wherein: Along the width direction of the plastic package, the distance from the second driving chip to the edge of the second welding part close to the driving pins is basically the same as the distance from the second driving chip to the edge of the second welding part close to the power pins.

15. The power module assembly according to any one of claims 9 to 14, wherein: The plastic package further includes: A first stepped part, located on one side of the part where the multiple power pins extend out of the plastic package close to the second surface of the plastic package, and recessed in the direction where the multiple power pins point to the multiple driving pins; the first stepped part has a first stepped surface and a first connecting surface connected between the first stepped surface and the second surface; Wherein, along the thickness direction of the plastic package, the distance from the first stepped surface to the second surface is less than the distance from the surface of the power chip away from the second surface to the second surface.

16. The power module assembly according to claim 15, wherein: The distance S from the edge of the first substrate close to the first side of the plastic package to the first connecting surface satisfies: 0.5 times the thickness of the first substrate < S < 1.5 times the thickness of the first substrate.

17. The power module assembly according to claim 15 or 16, wherein: The plastic package further includes: The second step portion is located on a side of the portion of the plurality of drive pins extending out of the plastic package body close to the second surface of the plastic package body, and is recessed in the direction in which the plurality of drive pins point to the plurality of power pins; the second step portion having a second step surface and a second connecting surface connected between the second step surface and the second surface; In which, along the thickness direction of the plastic packaging body, the distance from the second step surface to the second surface is approximately equal to the distance from the first step surface to the second surface; and / or, along the width direction of the plastic packaging body, the distance from the second connecting surface to the second side surface of the plastic packaging body opposite to the first side surface is approximately equal to the distance from the first connecting surface to the first side surface.

18. The power module assembly according to any one of claims 15 to 17, wherein: The plastic package further comprises: A third step portion is located on a side of a portion of the plurality of driving pins extending out of the plastic package body close to the first surface of the plastic package body and is recessed in a direction in which the plurality of driving pins point toward the plurality of power pins; the third step portion has a third step surface and a third connecting surface connected between the third step surface and the first surface; Wherein, along the thickness direction of the plastic package body, the distance from the third step surface to the first surface is smaller than the distance from the first step surface to the second surface.

19. The power module assembly according to claim 18, wherein: The first step portion includes a first air guide portion located at a corner; and / or the second step portion includes a second air guide portion located at a corner; and / or the third step portion includes a third air guide portion located at a corner. 20 . An electronic device comprising a controller and the power module assembly according to claim 1 , wherein the power module assembly is connected to the controller.

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