Semiconductor automated nickel-palladium-gold electroless plating process and electroless plating cleaning equipment

Abstract

The present invention belongs to the technical field of semiconductor chemical plating equipment, and in particular to semiconductor automated nickel-palladium-gold chemical plating process and chemical plating cleaning equipment, including a cleaning pool, wherein an ultrasonic cleaning area, a high-pressure cleaning area and a rinsing area are sequentially arranged side by side in the cleaning pool, and the three areas are completely separated by a vertical partition, and the partition is fixedly connected to the inner wall of the cleaning pool. In the process of cleaning semiconductor materials, the filter component of the present invention can filter water, thereby realizing the reuse of water resources and saving water. At the same time, as the filtered water is pumped back into the ultrasonic cleaning area, the refluxed cleaning water can bring the oil and floating impurities floating on the liquid surface into the collection tank, thereby realizing the separate collection of oil and floating impurities, and also can avoid the oil and floating impurities from sticking to the surface of the semiconductor material to be cleaned later in the subsequent cleaning process.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor chemical plating equipment, and in particular relates to a semiconductor automated nickel-palladium-gold chemical plating process and chemical plating cleaning equipment. Background Art

[0002] High-end nickel-palladium-gold surface treatment technology is a new type of surface treatment process in the integrated circuit industry. It is mainly used in PCB, FPCB, semiconductors, substrates, Rigid-FlexPCB, COB products, miniLED, high-frequency and high-speed optical module substrates, ceramic substrates, glass substrates, Wafer wafers and other products. At present, the nickel-palladium-gold process commonly used in integrated circuits is mostly palladium and thick gold with a thickness of less than 0.15um. The technical problems of thick palladium and thick gold for high-end integrated circuit products have not been solved.

[0003] In addition, before chemical plating the semiconductor material, in order to improve the quality of chemical plating, it is generally necessary to perform sandblasting on the semiconductor material, thereby increasing the contact area between the semiconductor material and the coating and improving the stability of the coating. After the sandblasting operation is completed, the semiconductor material needs to be cleaned. However, since there are residual fine sand and oil stains on the surface of the semiconductor material, it is not easy to clean it during cleaning. In addition, during the cleaning process, the residual fine sand and oil stains will also quickly pollute the water in the cleaning pool. Therefore, in order to ensure the cleaning quality, frequent water changes are required, which increases the water consumption.

[0004] Therefore, it is necessary to invent a semiconductor automated nickel-palladium-gold chemical plating process and a chemical plating cleaning equipment to solve the above problems. Summary of the invention

[0005] In view of the above problems, the present invention provides a semiconductor automated nickel-palladium-gold chemical plating process and a chemical plating cleaning device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor automated nickel-palladium-gold chemical plating process and chemical plating cleaning equipment, comprising a cleaning pool, wherein an ultrasonic cleaning area, a high-pressure cleaning area and a rinsing area are sequentially arranged side by side in the cleaning pool, and the three areas are completely separated by a vertical partition, the partition is fixedly connected to the inner wall of the cleaning pool, an ultrasonic generator is installed on the side of the cleaning pool close to the ultrasonic cleaning area, a cleaning basket is arranged in the ultrasonic cleaning area, two hanging rods are symmetrically fixedly connected to the front and rear sides of the top of the cleaning basket, and the hanging rods are hung at the top positions of the front and rear sides of the cleaning pool, a collecting cover is arranged at the bottom of the cleaning basket, and a water suction pipe is connected to the bottom end of the collecting cover, A water suction pipe is inserted through and connected to the bottom inner wall of the cleaning pool, a collecting cylinder is provided on the rear side of the cleaning pool, a filtering assembly is provided in the collecting cylinder, the bottom end of the collecting cylinder is connected to the water suction pipe, the top end of the collecting cylinder is connected to a return pipe, and a water pump is installed on the return pipe, the top end of the return pipe is inserted through and connected to the rear inner wall of the ultrasonic cleaning area, a through hole is provided on the front inner wall of the ultrasonic cleaning area, a collecting groove is provided on the front side of the through hole, the collecting groove is fixedly connected to the front side of the cleaning pool, the opening of the collecting groove faces upward, the inner width of the collecting groove matches the width of the through hole, and the inner side of the collecting groove is connected to the ultrasonic cleaning area through the through hole, and an oil-water separation assembly is provided in the collecting groove.

[0007] Furthermore, the filter assembly includes a filter cartridge, and the opening of the filter cartridge faces downward, the top of the filter cartridge is a sealed design, and the side wall of the filter cartridge is a filter screen design, the bottom of the filter cartridge is detachably connected to a connecting cartridge, the connecting cartridge is detachably mounted on the bottom inner wall of the collecting cartridge, and the inner diameter of the connecting cartridge is larger than the inner diameter of the filter cartridge, the top of the connecting cartridge is an open design, the bottom end of the connecting cartridge is provided with a water inlet hole, and the water inlet hole is connected to the bottom end of the suction pipe, there is a gap between the top of the filter cartridge and the top inner wall of the collecting cartridge, a funnel cover is provided in the connecting cartridge, and the opening of the funnel cover faces upward, the top edge of the funnel cover protrudes upward, and the top of the funnel cover A connecting hole is provided through the portion of the edge that protrudes upward, and the top of the funnel cover is rotatably mounted on the bottom edge of the filter cartridge. A plurality of spiral blades are annularly distributed on the bottom of the funnel cover, and the spiral blades are fixedly connected to the bottom of the funnel cover, and the plurality of spiral blades are rotationally symmetrical about the axis of the funnel cover. A fixed shaft is vertically fixedly connected to the inner wall of the bottom of the funnel cover, and a plurality of vertical brush strips are annularly distributed on the periphery of the fixed shaft. Bristles are evenly arranged on one side of the brush strip close to the inner wall of the filter cartridge, and the bristles are in contact with the inner wall of the filter cartridge, and two fixing rods are horizontally fixedly connected to one side of the brush strip away from the bristles, and one end of the fixing rod away from the brush strip is vertically fixedly connected to the surface of the fixed shaft.

[0008] Furthermore, the oil-water separation component includes a U-shaped plate, the opening of the U-shaped plate faces forward, and the top of the U-shaped plate is flush with the top of the collecting tank, the U-shaped plate is fixedly connected to the bottom inner wall of the collecting tank, and the two sides of the U-shaped plate divide the entire collecting tank into two overflow areas and an interception area, and the two overflow areas are symmetrically distributed on both sides of the interception area, a notch is provided at the top position of the rear side of the U-shaped plate, and the bottom inner wall of the notch is flush with the bottom inner wall of the through hole, waist-shaped holes are penetrated on both sides of the U-shaped plate, and the height of the top inner wall of the waist-shaped hole is lower than the height of the bottom inner wall of the through hole, and both sides of the notch are symmetrically fixedly connected with guide holes matching the opening height of the through hole The guide plate is inserted through the through hole, and the rear sides of the two guide plates are respectively fitted with the inner walls of the two sides of the ultrasonic cleaning area, a baffle is arranged between the two guide plates, and the height of the baffle is greater than twice the height of the through hole, both sides of the baffle are fixedly connected with limit rods matching the height thereof, and a limit sleeve is slidably sleeved on the limit rod, and the two limit sleeves are respectively fixedly connected with the sides of the two guide plates separated from each other, an oil hole matching the height of the through hole is penetrated and opened on the upper half of the baffle, a U-shaped pressure rod is fixedly connected to the top of the baffle, a floating plate is fixedly connected to the rear side of the baffle, and the top of the floating plate is flush with the inner wall of the bottom of the oil hole.

[0009] Furthermore, the gravity of the baffle is smaller than the buoyancy of the floating plate, and when the pressure rod is flush with the top of the cleaning tank under the pressure of the hanging rod, the oil hole on the baffle completely overlaps with the through hole.

[0010] Furthermore, a strip plate is provided on the rear inner wall of the ultrasonic cleaning area, and the strip plate is hollow in design. A strip hole is horizontally opened on the front side of the strip plate, and a vertical strip socket is opened on the rear side of the strip plate, and the top end of the return pipe is inserted in the strip socket. Vertical limit strips are slidably installed on both sides of the strip plate, and the limit strips are fixedly connected to the rear inner wall of the ultrasonic cleaning area. Floating blocks are symmetrically fixedly connected to both sides of the strip plate, and the buoyancy of the floating blocks is greater than the gravity of the strip plate.

[0011] Furthermore, the height of the area where the strip holes move up and down is always opposite to the opening area of ​​the through hole, and the strip holes can be flush with the liquid surface under the buoyancy of the floating block on the strip plate.

[0012] Furthermore, a plurality of strip-shaped guide holes are evenly penetrated through the side wall of the collecting hood, a guide strip with a length matching the guide hole is fixedly connected to the top of the guide hole, and the guide strip is tilted downward on the side away from the guide hole.

[0013] Furthermore, three drain valves are connected to the front side of the cleaning pool near the bottom, and the three drain valves are connected to the ultrasonic cleaning area, the high-pressure cleaning area and the rinsing area respectively. A high-pressure nozzle is provided in the high-pressure cleaning area.

[0014] The present invention also provides a nickel-palladium-gold chemical plating process using a semiconductor automated nickel-palladium-gold chemical plating cleaning device, the process comprising the following steps:

[0015] Step 1: Plasma cleaning is performed on the semiconductor material to be plated, and then micro-etching, water washing, ceramic brush grinding and sandblasting are performed on the cleaned semiconductor material in sequence;

[0016] Step 2: Put the semiconductor material after sandblasting into the cleaning basket, and then put the cleaning basket into the ultrasonic cleaning area in the cleaning tank for ultrasonic cleaning. During cleaning, the water pump can be started to circulate the water in the ultrasonic cleaning area through the suction pipe and the return pipe, saving water. The filter component is used to filter the impurities that fall into the water during the cleaning process, and the oil-water separation component is used to separately collect the oil and floating impurities floating on the water surface;

[0017] Step 3: After the semiconductor material has been ultrasonically cleaned, the cleaning basket is placed in the high-pressure cleaning area and the rinsing area of ​​the cleaning tank for high-pressure washing and rinsing operations, thereby thoroughly cleaning the fine sand and large particles of debris remaining on the semiconductor material during the sandblasting process;

[0018] Step 4: The rinsed semiconductor material is then dried, degreased, washed with pure water, microetched, washed with pure water, washed with ultrasonic pure water, pickled, washed with pure water, pre-soaked, activated and post-soaked in sequence;

[0019] Step 5: The post-immersion semiconductor material is sequentially subjected to chemical nickel, pure water washing, chemical thick palladium, ultrasonic pure water washing, chemical thick palladium, pure water washing, chemical thick gold, ultrasonic pure water washing, chemical thick gold, and pure water washing to obtain the final desired product.

[0020] Technical effects and advantages of the present invention:

[0021] 1. In the process of cleaning the semiconductor material, the filter assembly can filter the water, thereby realizing the reuse of water resources and saving water. At the same time, as the filtered water is pumped back into the ultrasonic cleaning area, the refluxed cleaning water can bring the oil and floating impurities floating on the liquid surface into the collection tank, thereby realizing the separate collection of the oil and floating impurities, and also preventing the oil and floating impurities from adhering to the surface of the semiconductor material to be cleaned in the subsequent cleaning process;

[0022] 2. The present invention uses a thick palladium and thick gold process to increase the coating thickness of the semiconductor material surface to .-.um, thereby improving the product's appearance, electrical conductivity, high-temperature oxidation resistance and other properties, and extending the product's service life;

[0023] 3. The present invention is provided with a strip plate. When the water in the ultrasonic cleaning area flows back to the ultrasonic cleaning area through the reflux pipe under the action of the water pump, the water flowing out of the reflux pipe can enter the inner side of the strip plate through the strip jack. Then, the water entering the inner side of the strip plate can impact on the liquid surface through the strip holes, thereby better driving the oil and floating impurities floating on the water surface toward the direction of the collecting tank, thereby improving the collection efficiency of the collecting tank for oil and floating impurities. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a first stereoscopic schematic diagram of the structures of the ultrasonic cleaning area, the collecting cover, the filtering component and the oil-water separation component in the present invention;

[0026] Figure 3 is a three-dimensional cross-sectional view of the ultrasonic cleaning area of ​​the present invention;

[0027] Figure 4 It is a second stereoscopic schematic diagram of the structures of the ultrasonic cleaning area, the collecting cover, the filtering component and the oil-water separation component in the present invention;

[0028] Figure 5 It is a three-dimensional schematic diagram of the return pipe, water pump, strip plate and floating block in the present invention;

[0029] Figure 6 It is a three-dimensional cross-sectional view of the collecting tube and its internal structure in the present invention;

[0030] Figure 7 It is a three-dimensional schematic diagram of a part of the filter assembly in the present invention;

[0031] Figure 8 It is a three-dimensional schematic diagram of the collecting tank and part of the oil-water separation component in the present invention;

[0032] Fig. 9 It is a three-dimensional schematic diagram of part of the oil-water separation component of the present invention.

[0033] In the figure: 1, cleaning tank; 2, partition; 3, ultrasonic generator; 4, cleaning basket; 5, hanging rod; 6, collecting cover; 7, water suction pipe; 8, collecting cylinder; 9, reflux pipe; 10, water pump; 11, through hole; 12, collecting tank; 13, filter cylinder; 14, connecting cylinder; 15, funnel cover; 16, connecting hole; 17, spiral blade; 18, fixed shaft; 19, brush strip; 20, brush hair; 21, fixing rod; 22, U-shaped plate; 23, notch; 24, waist-shaped hole; 25, guide plate; 26, baffle; 27, limit rod; 28, limit sleeve; 29, oil hole; 30, pressure rod; 31, floating plate; 32, strip plate; 33, strip hole; 34, strip jack; 35, limit strip; 36, floating block; 37, guide hole; 38, guide strip; 39, drain valve. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the embodiments of the present invention more clear, the technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0035] The present invention provides Figures 1 to 9 The semiconductor automated nickel-palladium-gold chemical plating process and chemical plating cleaning equipment shown in the figure include a cleaning pool 1, in which an ultrasonic cleaning area, a high-pressure cleaning area and a rinsing area are arranged side by side in sequence, and the three areas are completely separated by a vertical partition 2, and the partition 2 is fixedly connected to the inner wall of the cleaning pool 1, an ultrasonic generator 3 is installed on the side of the cleaning pool 1 close to the ultrasonic cleaning area, a cleaning basket 4 is arranged in the ultrasonic cleaning area, and two hanging rods 5 are symmetrically fixedly connected to the front and rear sides of the top of the cleaning basket 4, and the hanging rods 5 are hung at the top positions of the front and rear sides of the cleaning pool 1, a collecting cover 6 is arranged at the bottom of the cleaning basket 4, and a water suction pipe 7 is connected to the bottom end of the collecting cover 6, and the water suction pipe 7 is inserted through the bottom inner wall of the cleaning pool 1, a collecting cylinder 8 is arranged on the rear side of the cleaning pool 1, and a filtering component is arranged in the collecting cylinder 8, and the collecting The bottom end of the collecting cylinder 8 is connected with the water suction pipe 7, the top end of the collecting cylinder 8 is connected with a return pipe 9, and a water pump 10 is installed on the return pipe 9, the top end of the return pipe 9 is inserted through the rear inner wall of the ultrasonic cleaning area, and a through hole 11 is opened through the front inner wall of the ultrasonic cleaning area, and a collecting tank 12 is arranged on the front side of the through hole 11, and the collecting tank 12 is fixedly connected to the front side of the cleaning pool 1, the opening of the collecting tank 12 faces upward, the inner side width of the collecting tank 12 matches the width of the through hole 11, and the inner side of the collecting tank 12 is connected with the ultrasonic cleaning area through the through hole 11, and an oil-water separation component is arranged in the collecting tank 12, and three drain valves 39 are connected to the front side of the cleaning pool 1 near the bottom, and the three drain valves 39 are respectively connected to the ultrasonic cleaning area, the high-pressure cleaning area and the rinsing area, and a high-pressure nozzle is arranged in the high-pressure cleaning area;

[0036] When cleaning the semiconductor material, the semiconductor material is placed in the cleaning basket 4, and then the cleaning basket 4 is first placed in the ultrasonic cleaning area. At this time, the through hole 11 on the front side of the collecting tank 12 is opened, and then the water pump 10 and the ultrasonic generator 3 are started, so as to use ultrasonic waves to clean the semiconductor material. In this process, as the water pump 10 is running, the collecting cover 6 can suck the cleaned fine sand and impurities into the filter assembly under the suction force of the water pump 10 on the water suction pipe 7, thereby achieving the filtering effect on the cleaning water, and then the filtered cleaning water can flow back to the ultrasonic cleaning area through the return pipe 9, thereby realizing the reuse of water resources;

[0037] At the same time, as the filtered water is pumped back into the ultrasonic cleaning area, the refluxed cleaning water can bring the oil and floating impurities floating on the liquid surface into the collection tank 12, thereby realizing the separate collection of the oil and floating impurities;

[0038] When the semiconductor material is cleaned by ultrasonic cleaning, as the cleaning basket 4 is taken out of the ultrasonic area, the oil-water separation component can automatically close the through hole 11, thereby preventing oil and floating impurities from returning to the ultrasonic cleaning area, and also preventing oil and floating impurities from adhering to the surface of the semiconductor material to be cleaned in the subsequent cleaning process;

[0039] Then, the semiconductor material after ultrasonic cleaning is sequentially placed into the high-pressure cleaning area and the rinsing area in the cleaning tank 1 for high-pressure washing and rinsing operations, so as to thoroughly clean the fine sand and large particles of debris remaining on the semiconductor material during the sandblasting process;

[0040] When the water in the ultrasonic cleaning area, high-pressure cleaning area or rinsing area cannot be used anymore due to contamination, the corresponding drain valve can be opened to quickly drain the sewage.

[0041] like Figures 2 to 7As shown, the filter assembly includes a filter cartridge 13, and the opening of the filter cartridge 13 faces downward, the top of the filter cartridge 13 is of sealed design, and the side wall of the filter cartridge 13 is of filter screen design, the bottom of the filter cartridge 13 is detachably connected with a connecting cylinder 14, the connecting cylinder 14 is detachably mounted on the bottom inner wall of the collecting cylinder 8, and the inner diameter of the connecting cylinder 14 is larger than the inner diameter of the filter cartridge 13, the top of the connecting cylinder 14 is of open design, the bottom end of the connecting cylinder 14 is provided with a water inlet hole, and the water inlet hole is connected with the bottom end of the suction pipe 7, there is a gap between the top of the filter cartridge 13 and the top inner wall of the collecting cylinder 8, a funnel cover 15 is arranged in the connecting cylinder 14, and the opening of the funnel cover 15 faces upward, the top edge of the funnel cover 15 protrudes upward, and the top edge of the funnel cover 15 protrudes upward A connecting hole 16 is provided through the part, the top of the funnel cover 15 is rotatably mounted on the bottom edge of the filter cartridge 13, a plurality of spiral blades 17 are annularly distributed on the bottom of the funnel cover 15, the spiral blades 17 are fixedly connected to the bottom of the funnel cover 15, and the plurality of spiral blades 17 are rotationally symmetrical about the axis of the funnel cover 15, a fixed shaft 18 is vertically fixedly connected to the inner wall of the bottom of the funnel cover 15, a plurality of vertical brush strips 19 are annularly distributed on the periphery of the fixed shaft 18, bristles 20 are evenly arranged on the side of the brush strip 19 close to the inner wall of the filter cartridge 13, and the bristles 20 are in contact with the inner wall of the filter cartridge 13, two fixing rods 21 are horizontally fixedly connected to the side of the brush strip 19 away from the bristles 20, and one end of the fixing rod 21 away from the brush strip 19 is vertically fixedly connected to the surface of the fixing shaft 18;

[0042] After the water containing fine sand and impurities is sucked into the collecting tube 8 by the water suction pipe 7, the water flow can enter the connecting tube 14, and then the water flow entering the connecting tube 14 can flow upward along the bottom of the funnel cover 15, and then enter the filter tube 13 through the connecting hole 16 at the top edge of the funnel cover 15, and then the water entering the filter tube 13 can flow to the outside of the filter tube 13 through the side wall of the filter tube 13 after the filtering effect of the filter tube 13, and finally flow back to the ultrasonic cleaning area through the return pipe 9, while the fine sand and impurities are left in the filter tube 13. In addition, due to the existence of the funnel cover 15, the fine sand and some heavier impurities entering the funnel cover 15 can be deposited in the funnel cover 15 under the action of gravity, so as not to block the filter screen part of the side wall of the filter tube 13;

[0043] In addition, when the water flows through the water inlet hole at the bottom of the connecting tube 14 and hits the outside of the funnel cover 15, the spiral blades 17 can drive the funnel cover 15 to rotate under the impetus of the water flow, and as the funnel cover 15 rotates, the fixed shaft 18 can drive the brush strip 19 to brush along the inner wall of the filter tube 13 through the fixed rod 21, so that the bristles 20 on the brush strip 19 are used to clean the inner wall of the filter tube 13 to prevent impurities from adhering to the inner wall of the filter tube 13, and when the semiconductor material is cleaned and the water pump 10 is turned off, as the water flow inside the filter tube 13 becomes still, the impurities in the water can be deposited in the funnel cover 15 and collected, and when the water pump 10 works again, the impurities deposited in the funnel cover 15 will not be directly impacted by the water flow due to the shielding of the funnel cover 15, thereby ensuring that most of the deposited impurities can maintain a relatively stable static state, and will not block the filter screen part of the filter tube 13.

[0044] like Figures 2 to 9 As shown, the oil-water separation component includes a U-shaped plate 22, the opening of the U-shaped plate 22 faces forward, and the top of the U-shaped plate 22 is flush with the top of the collecting tank 12, the U-shaped plate 22 is fixedly connected to the bottom inner wall of the collecting tank 12, and the two sides of the U-shaped plate 22 divide the entire collecting tank 12 into two overflow areas and an interception area, and the two overflow areas are symmetrically distributed on both sides of the interception area, a notch 23 is opened at the top position of the rear side of the U-shaped plate 22, and the bottom inner wall of the notch 23 is flush with the bottom inner wall of the through hole 11, waist-shaped holes 24 are opened on both sides of the U-shaped plate 22, and the height of the top inner wall of the waist-shaped hole 24 is lower than the height of the bottom inner wall of the through hole 11, and the two sides of the notch 23 are symmetrically fixedly connected with guide plates 25 matching the opening height of the through hole 11, the guide plates 25 are inserted through the through hole 11, and the rear sides of the two guide plates 25 are respectively connected to the super The inner walls of the two sides of the sonic cleaning area are fitted together, a baffle 26 is arranged between the two guide plates 25, and the height of the baffle 26 is greater than twice the height of the through hole 11, and both sides of the baffle 26 are fixedly connected with limit rods 27 matching their heights, and limit sleeves 28 are slidably sleeved on the limit rods 27, and the two limit sleeves 28 are respectively fixedly connected to the separated sides of the two guide plates 25, and the upper half of the baffle 26 is penetrated by an oil hole 29 matching the opening height of the through hole 11, and a U-shaped pressure rod 30 is fixedly connected to the top of the baffle 26, and a floating plate 31 is fixedly connected to the rear side of the baffle 26, and the top of the floating plate 31 is flush with the bottom inner wall of the oil hole 29, the gravity of the baffle 26 is less than the buoyancy of the floating plate 31, and when the pressure rod 30 is flush with the top of the cleaning pool 1 under the pressure of the hanging rod 5, the oil hole 29 on the baffle 26 completely overlaps with the through hole 11;

[0045] When the cleaning basket 4 is placed in the ultrasonic cleaning area, as the hanging rod 5 presses the pressure rod 30, the baffle 26 can move downward under the limiting effect of the limiting sleeve 28 on the limiting rod 27, so that the oil hole 29 on the baffle 26 remains opposite to the through hole 11. At this time, as the water pump 10 is started, when the water flow returning to the ultrasonic cleaning area impacts the liquid surface, the oil and floating impurities floating on the water surface can be driven by the water flow to move toward the direction of the collecting tank 12. Subsequently, the oil and floating impurities can enter the interception area in the collecting tank 12 through the notch 23 of the U-shaped plate 22 under the action of the two guide plates 25. Due to the existence of the U-shaped plate 22, when the oil and floating impurities enter the interception area, the oil and floating impurities floating on the liquid surface can be intercepted by the two sides of the U shape, and the water can enter the overflow area through the waist-shaped hole 24 and finally flow back to the ultrasonic cleaning area, while the oil and floating impurities remain in the collecting tank 12.

[0046] When the semiconductor material is cleaned, as the cleaning basket 4 is moved out of the ultrasonic cleaning area, the floating plate 31 can drive the baffle 26 to move upward, thereby closing the through hole 11, thereby preventing the oil and floating impurities in the interception area from flowing back into the ultrasonic cleaning area. At the same time, it can also prevent the oil and floating impurities from sticking to the surface of the semiconductor material to be cleaned in the subsequent cleaning process.

[0047] like Figure 4 and Figure 5 As shown, a strip plate 32 is provided on the inner wall of the rear side of the ultrasonic cleaning area, and the strip plate 32 is hollow in design. A strip hole 33 is horizontally opened on the front side of the strip plate 32, and a vertical strip plug hole 34 is opened on the rear side of the strip plate 32, and the top end of the reflux pipe 9 is inserted into the strip plug hole 34. Vertical limit strips 35 are slidably installed on both sides of the strip plate 32, and the limit strips 35 are fixedly connected to the inner wall of the rear side of the ultrasonic cleaning area. Floating blocks 36 are symmetrically fixedly connected on both sides of the strip plate 32, and the buoyancy of the floating blocks 36 is greater than the gravity of the strip plate 32. The height of the area where the strip hole 33 moves up and down is always opposite to the opening area of ​​the through hole 11, and the strip hole 33 can be flush with the liquid surface under the buoyancy of the floating blocks 36 on the strip plate 32;

[0048] By providing the strip plate 32, when the water in the ultrasonic cleaning area flows back to the ultrasonic cleaning area through the reflux pipe 9 under the action of the water pump 10, the water flowing out of the reflux pipe 9 can enter the inner side of the strip plate 32 through the strip plug hole 34, and then the water entering the inner side of the strip plate 32 can impact on the liquid surface through the strip hole 33, thereby driving the oil and floating impurities floating on the water surface toward the collecting tank 12 more quickly, thereby improving the collection efficiency of the collecting tank 12 for the oil and floating impurities.

[0049] like Figure 2 and Figure 4 As shown, a plurality of strip-shaped guide holes 37 are evenly penetrated on the side wall of the collecting cover 6, and a guide strip 38 of a length matching the guide hole 37 is fixedly connected to the top of the guide hole 37, and the guide strip 38 is tilted downward away from the side of the guide hole 37;

[0050] In the process of cleaning the semiconductor material, when the fine sand and impurities cleaned fall onto the inner wall of the collecting hood 6, some of the fine sand will remain on the inner wall of the collecting hood 6. At this time, the guide hole 37 is provided. When the water pump 10 is working, as the collecting hood 6 generates suction on the water in the ultrasonic cleaning area, the water outside the collecting hood 6 can enter the inner side of the collecting hood 6 through the guide hole 37. Then, the water flow can be obliquely impacted on the inner wall of the collecting hood 6 under the guidance of the guide strip 38, thereby pushing some of the fine sand and impurities attached to the surface of the collecting hood 6 toward the inner wall of the bottom of the collecting hood 6, so that the part of the fine sand and impurities can finally be sucked into the collecting tube 8 by the suction pipe 7 for filtration.

[0051] The present invention also provides a nickel-palladium-gold chemical plating process using a semiconductor automated nickel-palladium-gold chemical plating cleaning device, the process comprising the following steps:

[0052] Step 1: Plasma cleaning is performed on the semiconductor material to be plated, and then micro-etching, water washing, ceramic brush grinding and sandblasting are performed on the cleaned semiconductor material in sequence;

[0053] Step 2: Put the semiconductor material after sandblasting into the cleaning basket 4, and then put the cleaning basket 4 into the ultrasonic cleaning area in the cleaning tank 1 for ultrasonic cleaning. During cleaning, the water pump 10 can be started to circulate the water in the ultrasonic cleaning area through the water suction pipe 7 and the return pipe 9, so that the impurities falling into the water during the cleaning process are filtered by the filter component, and the oil and water separation component is used to separately collect the oil and floating impurities floating on the water surface;

[0054] Step 3: After the semiconductor material has been ultrasonically cleaned, the cleaning basket 4 is sequentially placed in the high-pressure cleaning area and the rinsing area of ​​the cleaning tank 1 for high-pressure washing and rinsing operations, thereby thoroughly cleaning the fine sand and large particles of debris remaining on the semiconductor material during the sandblasting process;

[0055] Step 4: The rinsed semiconductor material is then dried, degreased, washed with pure water, microetched, washed with pure water, washed with ultrasonic pure water, pickled, washed with pure water, pre-soaked, activated and post-soaked in sequence;

[0056] Step 5: The post-immersion semiconductor material is sequentially subjected to chemical nickel, pure water washing, chemical thick palladium, ultrasonic pure water washing, chemical thick palladium, pure water washing, chemical thick gold, ultrasonic pure water washing, chemical thick gold, and pure water washing to obtain the final desired product.

[0057] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them.

Claims

1. Semiconductor automated nickel-palladium-gold chemical plating cleaning equipment, comprising a cleaning tank (1), characterized in that: The cleaning pool (1) is provided with an ultrasonic cleaning area, a high-pressure cleaning area and a rinsing area arranged side by side in sequence, and the three areas are completely separated by a vertical partition (2), the partition (2) being fixedly connected to the inner wall of the cleaning pool (1), an ultrasonic generator (3) being installed on the side of the cleaning pool (1) close to the ultrasonic cleaning area, a cleaning basket (4) being provided in the ultrasonic cleaning area, two hanging rods (5) being symmetrically fixedly connected to the front and rear sides of the top of the cleaning basket (4), and the hanging rods (5) being hung at the top positions of the front and rear sides of the cleaning pool (1), a collecting hood (6) being provided at the bottom of the cleaning basket (4), a water suction pipe (7) being connected to the bottom end of the collecting hood (6), the water suction pipe (7) being inserted through the bottom inner wall of the cleaning pool (1), and a collecting cylinder (6) being provided at the rear side of the cleaning pool (1). 8), a filter assembly is arranged in the collecting cylinder (8), the bottom end of the collecting cylinder (8) is communicated with the water suction pipe (7), the top end of the collecting cylinder (8) is connected with a return pipe (9), and a water pump (10) is installed on the return pipe (9), the top end of the return pipe (9) is inserted into the rear inner wall of the ultrasonic cleaning area, a through hole (11) is opened through the front inner wall of the ultrasonic cleaning area, a collecting groove (12) is arranged in front of the through hole (11), the collecting groove (12) is fixedly connected to the front side of the cleaning tank (1), the opening of the collecting groove (12) faces upward, the inner width of the collecting groove (12) matches the width of the through hole (11), and the inner side of the collecting groove (12) is communicated with the ultrasonic cleaning area through the through hole (11), and an oil-water separation assembly is arranged in the collecting groove (12); The filter assembly comprises a filter cartridge (13), wherein the opening of the filter cartridge (13) faces downward, the top of the filter cartridge (13) is of a sealed design, and the side wall of the filter cartridge (13) is of a filter screen design, the bottom of the filter cartridge (13) is detachably connected to a connecting cartridge (14), the connecting cartridge (14) is detachably mounted on the bottom inner wall of a collecting cartridge (8), and the inner diameter of the connecting cartridge (14) is larger than the inner diameter of the filter cartridge (13), the top of the connecting cartridge (14) is of an open design, the bottom end of the connecting cartridge (14) is provided with a water inlet hole, and the water inlet hole is connected to the bottom end of a water suction pipe (7), a gap is provided between the top of the filter cartridge (13) and the top inner wall of the collecting cartridge (8), a funnel cover (15) is provided in the connecting cartridge (14), the opening of the funnel cover (15) faces upward, the top edge of the funnel cover (15) protrudes upward, and the upwardly protruding portion of the top edge of the funnel cover (15) penetrates the opening A connecting hole (16) is provided, the top of the funnel cover (15) is rotatably mounted on the bottom edge of the filter cartridge (13), a plurality of spiral blades (17) are annularly distributed on the bottom of the funnel cover (15), the spiral blades (17) are fixedly connected to the bottom of the funnel cover (15), and the plurality of spiral blades (17) are rotationally symmetrical about the axis of the funnel cover (15), a fixed shaft (18) is vertically fixedly connected to the inner wall of the bottom of the funnel cover (15), a plurality of vertical brush strips (19) are annularly distributed on the periphery of the fixed shaft (18), bristles (20) are evenly arranged on the side of the brush strip (19) close to the inner wall of the filter cartridge (13), and the bristles (20) are in contact with the inner wall of the filter cartridge (13), and two fixed rods (21) are horizontally fixedly connected to the side of the brush strip (19) away from the bristles (20), and one end of the fixed rod (21) away from the brush strip (19) is vertically fixedly connected to the surface of the fixed shaft (18); The oil-water separation component comprises a U-shaped plate (22), the opening of the U-shaped plate (22) faces forward, and the top of the U-shaped plate (22) is flush with the top of the collecting tank (12), the U-shaped plate (22) is fixedly connected to the bottom inner wall of the collecting tank (12), and the two sides of the U-shaped plate (22) divide the entire collecting tank (12) into two overflow areas and an interception area, and the two overflow areas are symmetrically distributed on both sides of the interception area, a notch (23) is opened at the top position of the rear side of the U-shaped plate (22), and the bottom inner wall of the notch (23) is flush with the bottom inner wall of the through hole (11), waist-shaped holes (24) are opened on both sides of the U-shaped plate (22), and the height of the top inner wall of the waist-shaped hole (24) is lower than the height of the bottom inner wall of the through hole (11), and guide plates (25) matching the opening height of the through hole (11) are symmetrically fixedly connected on both sides of the notch (23), and the guide plates (25) (25) are symmetrically fixedly connected to the two ... 5) is inserted through the through hole (11), and the rear sides of the two guide plates (25) are respectively fitted with the inner walls of the two sides of the ultrasonic cleaning area, a baffle (26) is arranged between the two guide plates (25), and the height of the baffle (26) is greater than twice the height of the through hole (11), both sides of the baffle (26) are fixedly connected with limit rods (27) matching the height thereof, and the limit rods (27) are slidably sleeved with limit sleeves (28), and the two limit sleeves (28) are respectively fixedly connected with the sides of the two guide plates (25) separated from each other, and the upper half of the baffle (26) is penetrated with an oil hole (29) matching the opening height of the through hole (11), the top of the baffle (26) is fixedly connected with a U-shaped pressure rod (30), and the rear side of the baffle (26) is fixedly connected with a floating plate (31), and the top of the floating plate (31) is flush with the bottom inner wall of the oil hole (29).

2. The semiconductor automated nickel-palladium-gold chemical plating cleaning equipment according to claim 1, characterized in that: The gravity of the baffle (26) is smaller than the buoyancy of the floating plate (31), and when the pressure rod (30) is flush with the top of the cleaning pool (1) under the pressure of the hanging rod (5), the oil hole (29) on the baffle (26) completely overlaps with the through hole (11).

3. The semiconductor automated nickel-palladium-gold chemical plating cleaning equipment according to claim 2, characterized in that: A strip plate (32) is arranged on the inner wall at the rear side of the ultrasonic cleaning zone. The strip plate (32) is of hollow design. A strip hole (33) is horizontally opened on the front side of the strip plate (32). A vertical strip plug hole (34) is opened on the rear side of the strip plate (32). The top end of the return pipe (9) is inserted into the strip plug hole (34). Vertical limit strips (35) are slidably installed on both sides of the strip plate (32). The limit strips (35) are fixedly connected to the inner wall at the rear side of the ultrasonic cleaning zone. Floating blocks (36) are symmetrically fixedly connected to both sides of the strip plate (32). The buoyancy of the floating blocks (36) is greater than the gravity of the strip plate (32).

4. The semiconductor automated nickel-palladium-gold chemical plating cleaning equipment according to claim 3, characterized in that: The height of the area where the strip hole (33) moves up and down is always opposite to the opening area of ​​the through hole (11), and the strip hole (33) can be flush with the liquid surface under the buoyancy of the floating block (36) on the strip plate (32).

5. The semiconductor automated nickel-palladium-gold chemical plating cleaning equipment according to claim 4, characterized in that: A plurality of strip-shaped flow guide holes (37) are evenly penetrated through the side wall of the collection hood (6), a flow guide strip (38) having a length matching that of the flow guide hole (37) is fixedly connected to the top of the flow guide hole (37), and the side of the flow guide strip (38) away from the flow guide hole (37) is tilted downward.

6. The semiconductor automated nickel-palladium-gold chemical plating cleaning equipment according to claim 5, characterized in that: Three drain valves (39) are connected to the front side of the cleaning pool (1) near the bottom, and the three drain valves (39) are respectively connected to the ultrasonic cleaning area, the high-pressure cleaning area and the rinsing area, and a high-pressure nozzle is provided in the high-pressure cleaning area.

7. A nickel-palladium-gold chemical plating process using the semiconductor automated nickel-palladium-gold chemical plating cleaning equipment according to claim 6, characterized in that: The process includes the following steps: Step 1: Plasma cleaning is performed on the semiconductor material to be plated, and then micro-etching, water washing, ceramic brush grinding and sandblasting are performed on the cleaned semiconductor material in sequence; Step 2: placing the semiconductor material after sandblasting into a cleaning basket (4), and then placing the cleaning basket (4) into the ultrasonic cleaning area in the cleaning pool (1) for ultrasonic cleaning. During cleaning, the water pump (10) can be started to circulate the water in the ultrasonic cleaning area through the water suction pipe (7) and the return pipe (9), so that the impurities falling into the water during the cleaning process are filtered by the filter component, and the oil and water separation component is used to separately collect the oil and floating impurities floating on the water surface; Step 3: After the semiconductor material has been ultrasonically cleaned, the cleaning basket (4) is sequentially placed in the high-pressure cleaning area and the rinsing area of ​​the cleaning tank (1) for high-pressure washing and rinsing operations, thereby thoroughly cleaning away the fine sand and large particles of debris remaining on the semiconductor material during the sandblasting process; Step 4: The rinsed semiconductor material is then dried, degreased, washed with pure water, microetched, washed with pure water, washed with ultrasonic pure water, pickled, washed with pure water, pre-soaked, activated and post-soaked in sequence; Step 5: The post-immersion semiconductor material is sequentially subjected to chemical nickel, pure water washing, chemical thick palladium, ultrasonic pure water washing, chemical thick palladium, pure water washing, chemical thick gold, ultrasonic pure water washing, chemical thick gold, and pure water washing to obtain the final desired product.

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