A semiconductor packaging machine

Abstract

The present invention provides a semiconductor packaging machine, belonging to the technical field of semiconductor packaging and shearing. It includes a conveying rack, which is connected with a first conveyor belt and a second conveyor belt. A semiconductor strip is provided on the surface of the first conveyor belt. A stop strip is fixedly connected to the inner side wall of the conveying rack. The conveying rack is connected with an upper driving component and a lower driving component. The upper driving component includes an upper rotating plate, and the lower driving component includes a lower rotating plate. There are a pair of upper rotating plates and a pair of lower rotating plates. It further includes: a fixing component, which can absorb the current generated by the semiconductor; a lead cutting component, which can cool down the pins to be lead-cut and increase the local air humidity; a supporting component, which can cooperate with the fixing component to fix a single semiconductor. The beneficial effects of this invention are: it can improve work efficiency, reduce the heat generated during cutting, increase the humidity of the local space to avoid static electricity, improve the chip performance, and reduce production costs.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor package shearing, and more particularly to a semiconductor packaging machine. Background Art

[0002] During the packaging process of semiconductor chips, after the chip injection molding and cooling are completed, multiple chip units on the lead frame need to be cut off one by one, and the chip leads are bent and shaped while being cut off, and finally finished chips are formed. After passing the test, the finished chips can be packaged.

[0003] Semiconductors usually use multiple pins to install various semiconductor wafers on a lead frame, and then an encapsulation body is formed on the lead frame. After that, the encapsulation body and a section of the pins are cut off on the overall frame of the semiconductor device to form a single semiconductor. During the cutting process, the pins are shaped at the same time. This process is called "trim". When the existing semiconductor packaging machine cuts the chips on the lead frame, it generally processes by moving the upper fixture up and down reciprocally in cooperation with the lower fixture. This requires the driving device of the upper fixture to start and stop frequently to change the moving direction of the upper fixture. However, this shearing method has general efficiency. And before cutting, the semiconductor chips are pretreated, such as cleaning and grounding, to reduce the initial static electricity. However, when cutting in a dry environment for a long time, static electricity may still be generated during the cutting process. These static electricity may accumulate in the cutting area and may discharge after accumulating to a certain extent, resulting in an increase in current density. This discharge will cause damage to the semiconductor material, such as breakdown and ablation, seriously affecting the reliability and life of the chip. Moreover, the high current density will cause the temperature in the cutting area to rise, expanding the thermal influence area, thereby reducing the cutting accuracy. How to invent a semiconductor packaging machine to solve these problems has become an urgent problem for those skilled in the art. Summary of the Invention

[0004] To make up for the above deficiencies, the present invention provides a semiconductor packaging machine, aiming to solve the problems that the driving fixture has general efficiency and static electricity will appear during the cutting process, resulting in damage to the semiconductor chips and affecting the use performance.

[0005] The present invention is implemented as follows:

[0006] The present invention provides a semiconductor packaging machine, including a conveying frame. The conveying frame is connected with a first conveyor belt and a second conveyor belt. The surface of the first conveyor belt is provided with semiconductor strips. The inner side wall of the conveying frame is fixedly connected with a stop strip. The conveying frame is connected with an upper driving component and a lower driving component. The upper driving component includes an upper rotating plate, and the lower driving component includes a lower rotating plate. There are a pair of upper rotating plates and a pair of lower rotating plates respectively. The semiconductor packaging machine further includes:

[0007] Fixing component, the fixing component is located between two upper rotating plates, and the fixing component can absorb the current generated by the semiconductor;

[0008] Die cutting component, the die cutting component is located between two upper rotating plates, and the die cutting component can cool down the pins that need to be die cut and increase the local air humidity;

[0009] Supporting component, the supporting component is located between two lower rotating plates, and the supporting component cooperates with the fixing component to fix a single semiconductor.

[0010] Preferably, the upper driving component further includes a driving motor one and an upper support seat. The driving motor one is fixedly connected to the side wall of the upper support seat. The upper support seat is fixedly connected to the conveyor frame. The upper support seat is located outside the upper rotating plate. A rotating shaft one is fixedly connected to the side wall of the upper rotating plate. The rotating shaft one penetrates through the side wall of the upper support seat and is fixedly connected to the output end of the driving motor one. The two upper rotating plates are symmetric about the center line of the conveyor frame.

[0011] Preferably, the lower driving component further includes a driving motor two and a lower support seat. The driving motor two is fixedly connected to the side wall of the lower support seat. The lower support seat is fixedly connected to the lower side wall of the conveyor frame. The lower support seat is located outside the lower rotating plate. A rotating shaft two is fixedly connected to the lower rotating plate. One end of the rotating shaft two penetrates through the side wall of the lower support seat and is fixedly connected to the output end of the driving motor two. The two lower rotating plates are symmetric about the center line of the conveyor frame.

[0012] Preferably, the die cutting component includes a die cutting blade, a telescopic airbag, a liquid storage box and a side plate. The two ends of the side plate are respectively fixedly connected to the opposite side walls of the two upper rotating plates. One side of the side plate is fixedly connected to the die cutting blade. The other side of the side plate is fixedly connected to the liquid storage box. The telescopic airbag is located inside the die cutting blade. One end of the telescopic airbag is fixedly connected to the side plate. Connecting hoses are provided on both sides of the telescopic airbag.

[0013] Preferably, the two ends of the connecting hose are respectively fixedly connected to the side wall of the telescopic airbag and the side wall of the die cutting blade. An air guiding groove is opened at the connection of the die cutting blade and the connecting hose. A diversion cavity is opened inside one end of the die cutting blade. The diversion cavity is connected to the opening at one end of the air guiding groove. Exhaust holes are opened between the inner wall of the diversion cavity and the side wall of the die cutting blade. A docking hole is opened on one side inner wall of the air guiding groove. A water absorption cotton strip is fixedly connected inside the docking hole. One end of the water absorption cotton strip penetrates through the side wall of the liquid storage box.

[0014] Preferably, the fixing component includes a pressing plate, a limiting rod and a buffer spring. The pressing plate is located inside the lead cutting blade. One end of the limiting rod passes through the side wall of the side plate and is fixedly connected to the pressing plate. The buffer spring is sleeved on the outer wall of the limiting rod, and the two ends of the buffer spring are respectively fixedly connected to the side wall of the pressing plate and the side wall of the side plate. The pressing plate is fixedly connected to the end of the telescopic airbag away from the side plate.

[0015] Preferably, a pressing strip is fixedly connected to the end of the pressing plate away from the limiting rod. The pressing strip is made of rubber. A cavity is formed inside the pressing plate, a diffusion plate is fixedly connected to the inner wall of the cavity, and an absorption partition is fixedly connected to one side of the diffusion plate.

[0016] Preferably, a conductive rod and an elastic member are connected to the side wall of the pressing plate. The conductive rod is arranged in a "T" shape. One end of the conductive rod penetrates through the inner wall of the cavity, and the elastic member is sleeved on the outer wall of the conductive rod. The two ends of the elastic member are respectively fixedly connected to the side wall of one end of the conductive rod and the side wall of the pressing plate.

[0017] Preferably, the supporting component includes a supporting plate. A fixing rod is fixedly connected to one side of the supporting plate, and the two ends of the fixing rod are respectively fixedly connected to the side walls of two lower rotating plates.

[0018] Preferably, a cutting strip and a supporting strip are fixedly connected to the end of the supporting plate away from the fixing rod. The cutting strip is located outside the supporting strip.

[0019] The beneficial effects of the present invention are as follows:

[0020] During the process of lead cutting of the semiconductor, the fixing component and the supporting component avoid the frequent start of the original lead cutting mechanism, improving the working efficiency. In addition, during the lead cutting process, through the telescopic airbag and the lead cutting blade, not only can the slight dust on the surface of the component be blown, but also the heat generated during lead cutting can be reduced, reducing the damage to the component, improving the performance of the semiconductor, and increasing the moisture diffusion speed on the surface of the absorbent cotton strip to increase the humidity in the local space, thereby avoiding the occurrence of static electricity during the cutting process, avoiding damage to the semiconductor material, improving the reliability and lifespan of the chip. At the same time, the temperature in the air can be reduced to improve the cooling effect, and the heat generated during the lead cutting of the chip pins can be effectively reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, so they should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0022] Figure 1 It is a schematic diagram of the overall front side structure of a semiconductor encapsulation machine provided by an embodiment of the present invention;

[0023] Figure 2 It is a schematic diagram of the overall rear side structure of a semiconductor encapsulation machine provided by an embodiment of the present invention;

[0024] Figure 3 It is a schematic diagram of the upper drive assembly and the lower drive assembly structure of a semiconductor encapsulation machine provided by an embodiment of the present invention;

[0025] Figure 4 It is a schematic diagram of the lead cutting assembly and the supporting assembly of a semiconductor encapsulation machine provided by an embodiment of the present invention;

[0026] Figure 5 It is a schematic diagram of the lead cutting assembly of a semiconductor encapsulation machine provided by an embodiment of the present invention;

[0027] Figure 6 It is a partial structural sectional view of the pressing plate and the lead cutting blade of a semiconductor encapsulation machine provided by an embodiment of the present invention;

[0028] Figure 7 It is a partial structural sectional view of the cutting tool of a semiconductor encapsulation machine provided by an embodiment of the present invention;

[0029] Figure 8 It is a partial schematic view of the semi-sectional structure of the upper drive assembly, the lower drive assembly and the conveyor rack of a semiconductor encapsulation machine provided by an embodiment of the present invention.

[0030] In the figure: 1. Conveyor rack; 2. Fixing assembly; 21. Pressure strip; 22. Pressing plate; 221. Cavity; 222. Diffusion plate; 223. Absorbing partition; 23. Conductive rod; 24. Limiting rod; 25. Buffer spring; 26. Elastic member; 3. Lead cutting assembly; 31. Lead cutting blade; 311. Exhaust hole; 312. Shunt cavity; 313. Air guide groove; 314. Docking hole; 32. Telescopic airbag; 33. Liquid storage box; 34. Connecting hose; 35. Side plate; 36. Absorbent cotton strip; 4. Upper drive assembly; 41. Driving motor 1; 42. Upper support seat; 43. Upper rotating plate; 44. Rotating shaft 1; 5. Lower drive assembly; 51. Driving motor 2; 52. Lower support seat; 53. Lower rotating plate; 54. Rotating shaft 2; 6. Supporting assembly; 61. Supporting plate; 611. Cutting strip; 612. Supporting strip; 62. Fixed rod; 7. Semiconductor strip; 8. Conveyor belt 1; 9. Stop bar; 10. Conveyor belt 2. Specific embodiments

[0031] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0032] Example, referring to Figures 1-8 , a semiconductor encapsulation machine, including a transfer rack 1, the transfer rack 1 is connected with a first conveyor belt 8 and a second conveyor belt 10, a semiconductor strip 7 is arranged on the surface of the first conveyor belt 8, a stop strip 9 is fixedly connected to the inner side wall of the transfer rack 1, the transfer rack 1 is connected with an upper driving component 4 and a lower driving component 5, the upper driving component 4 includes an upper rotating plate 43, the lower driving component 5 includes a lower rotating plate 53, and there are a pair of upper rotating plates 43 and a pair of lower rotating plates 53 respectively. It further includes:

[0033] A fixing component 2, the fixing component 2 is located between the two upper rotating plates 43, and the fixing component 2 can absorb the current generated by the semiconductor;

[0034] A lead cutting component 3, the lead cutting component 3 is located between the two upper rotating plates 43, and the lead cutting component 3 can cool down the pins to be cut and increase the local air humidity;

[0035] A supporting component 6, the supporting component 6 is located between the two lower rotating plates 53, and the supporting component 6 and the fixing component 2 can cooperate to fix a single semiconductor.

[0036] Further, the upper driving component 4 further includes a driving motor 41 and an upper support seat 42. The driving motor 41 is fixedly connected to the side wall of the upper support seat 42, the upper support seat 42 is fixedly connected to the transfer rack 1, the upper support seat 42 is located outside the upper rotating plate 43, a rotating shaft 44 is fixedly connected to the side wall of the upper rotating plate 43, the rotating shaft 44 penetrates through the side wall of the upper support seat 42 and is fixedly connected to the output end of the driving motor 41, and the two upper rotating plates 43 are symmetric about the center line of the transfer rack 1; the lower driving component 5 further includes a driving motor 51 and a lower support seat 52. The driving motor 51 is fixedly connected to the side wall of the lower support seat 52, the lower support seat 52 is fixedly connected to the lower side wall of the transfer rack 1, the lower support seat 52 is located outside the lower rotating plate 53, a rotating shaft 54 is fixedly connected to the lower rotating plate 53, and one end of the rotating shaft 54 penetrates through the side wall of the lower support seat 52 and is fixedly connected to the output end of the driving motor 51, and the two lower rotating plates 53 are symmetric about the center line of the transfer rack 1.

[0037] It should be noted that: The first driving motor 41 and the second driving motor 51 are important driving devices in the process of dicing the semiconductor strip 7. The first driving motor 41 drives the upper rotating plate 43 to enable the multiple fixing components 2 and the dicing component 3 to rotate counterclockwise, while the second driving motor 51 is the key to realizing the clockwise rotation of the supporting component 6 through the lower rotating plate 53, and the supporting component 6 corresponds one by one to the multiple fixing components 2 and the dicing component 3; In the process of dicing the semiconductor strip 7, first start the first conveyor belt 8 and the second conveyor belt 10 to work. The semiconductor strip 7 is transported towards the dicing component 3 side through the first conveyor belt 8. During the process of a single element on the semiconductor strip 7 separating from the first conveyor belt 8, the supporting plate 61 in the supporting component 6 first lifts the lower end of the element. At this time, the pressing strip 21 in the corresponding fixing component 2 also gradually contacts the surface of the element. The pressing strip 21 made of rubber not only has an insulating effect but also can buffer and protect the surface of the semiconductor element. During the continuous rotation, the supporting plate 61 gradually tends to be horizontal, and the pressure exerted by the pressing strip 21 on the element through the pressing plate 22 also gradually increases. When the pressing plate 22 is in the horizontal position, the pressure of the pressing strip 21 reaches the maximum value, and at the same time, the single element also completes the dicing process. The cut individual element will be located on the upper surface of the supporting plate 61. As the rotation continues, the pressing strip 21 will separate from the surface of the element. At this moment, the pressing strip 21 is no longer squeezed and fixed. Through the inclination of the supporting plate 61 and the action of the gravity of the element itself, the element can be lifted by the blocking strip 9 and then slide onto the surface of the second conveyor belt 10 for transportation. The blocking strip 9 is arranged in a "convex" shape. The length of the end of the blocking strip 9 close to the supporting plate 61 is less than the distance between the two supporting strips 612 on the surface of the supporting plate 61. Through such a setting, not only can the element be lifted, but also the movement interference of the supporting plate 61 can be avoided, thus ensuring the normal rotation of the supporting plate 61. Through the above operation method, the up-and-down pause process in the traditional punching process can be effectively avoided during the dicing of the semiconductor strip 7, improving the work efficiency.

[0038] Refer to Figures 2-7, Further, the fixing component 2 includes a pressing plate 22, a limiting rod 24 and a buffer spring 25. The pressing plate 22 is located inside the lead cutting blade 31. One end of the limiting rod 24 passes through the side wall of the side plate 35 and is fixedly connected to the pressing plate 22. The buffer spring 25 is sleeved on the outer wall of the limiting rod 24. The two ends of the buffer spring 25 are respectively fixedly connected to the side wall of the pressing plate 22 and the side wall of the side plate 35. The pressing plate 22 is fixedly connected to one end of the telescopic airbag 32 away from the side plate 35. A pressure bar 21 is fixedly connected to one end of the pressing plate 22 away from the limiting rod 24. The pressure bar 21 is made of rubber. A cavity 221 is formed inside the pressing plate 22. A diffusion plate 222 is fixedly connected to the inner wall of the cavity 221. An absorption partition plate 223 is fixedly connected to one side of the diffusion plate 222. A conductive rod 23 and an elastic member 26 are connected to the side wall of the pressing plate 22. The conductive rod 23 is arranged in a "T" shape. One end of the conductive rod 23 penetrates through the inner wall of the cavity 221. The elastic member 26 is sleeved on the outer wall of the conductive rod 23. The two ends of the elastic member 26 are respectively fixedly connected to the side wall of one end of the conductive rod 23 and the side wall of the pressing plate 22. The supporting component 6 includes a supporting plate 61. A fixing rod 62 is fixedly connected to one side of the supporting plate 61. The two ends of the fixing rod 62 are respectively fixedly connected to the side walls of the two lower rotating plates 53. A cutting strip 611 and a supporting strip 612 are fixedly connected to one end of the supporting plate 61 away from the fixing rod 62. The cutting strip 611 is located outside the supporting strip 612.

[0039] It should be noted that during the process of trimming the components, the cooperation between the pressing strip 21 and the supporting strip 612 can be used to fix the components, so as to prevent the problem that the position of the components shifts during the cutting process and affects the processing quality. During the fixing process of the pressing strip 21, the pressing plate 22 will be driven to move towards the side plate 35. At this time, the pressing plate 22 not only drives the limiting rod 24 to move but also compresses the buffer spring 25. The advantage of this is that the stress generated during extrusion can be absorbed during the fixing process of the components, avoiding the rupture of the components caused by the application of external force. In addition, the length of the conductive rod 23 is greater than the distance between the end surface of the pressing strip 21 and the pressing plate 22. Therefore, during the fixing process of the components, one end of the conductive rod 23 will contact the surface of the component, causing one end of the conductive rod 23 to gradually shrink into the cavity 221, and the end of the conductive rod 23 far from the component will contact the diffusion plate 222. The diffusion plate 222 adopts a closely arranged grid structure, and this structure can better absorb current by increasing the surface area and reducing the porosity. At the same time, it cooperates with the lightning-shaped absorption partition plate 223 to effectively absorb the current formed by the directional movement of free electrons and holes inside the semiconductor under the action of the electric field force when the trimming blade 31 cuts the semiconductor pins, avoiding the increase of local temperature, thereby reducing the damage to the semiconductor. The diffusion plate 222 and the absorption partition plate 223 can be made of conductive metals such as copper or aluminum. This kind of material not only has good electrical conductivity but also high heat dissipation efficiency. In addition, the conductive rod 23 can be made of a mixture of materials with good electrical conductivity such as metal powder and carbon fiber and a polymer matrix, which has a certain elasticity while ensuring the electrical conductivity effect;

[0040] When the pressing plate 22 and the supporting plate 61 are both in the horizontal position, at this moment, the pressing plate 22 moves to the highest position and shrinks into the trimming blade 31, and at this time, the cutting end of the trimming blade 31 protrudes, so as to cooperate with the action of the cutting strip 611 to squeeze each other to complete the cutting of all the pins of the component. During the process of the pressing plate 22 and the supporting plate 61 approaching each other, since one end of both of them will approach first, the pins on one side of the component may be cut first by the trimming blade 31 and the cutting strip 611, but this situation will not affect the overall cutting effect, and local cutting first can also reduce the accumulation of heat and avoid damage to the component caused by heat concentration.

[0041] Refer to Figures 4-8, Further, the lead frame cutting component 3 includes a lead frame cutting blade 31, a telescopic airbag 32, a liquid storage box 33 and a side plate 35. The two ends of the side plate 35 are respectively fixedly connected to the opposite side walls of two upper rotating plates 43. One side of the side plate 35 is fixedly connected to the lead frame cutting blade 31, and the other side of the side plate 35 is fixedly connected to the liquid storage box 33. The telescopic airbag 32 is located inside the lead frame cutting blade 31. One end of the telescopic airbag 32 is fixedly connected to the side plate 35, and communicating hoses 34 are arranged on both sides of the telescopic airbag 32. The two ends of the communicating hoses 34 are respectively fixedly connected to the side wall of the telescopic airbag 32 and the side wall of the lead frame cutting blade 31. An air guide groove 313 is formed at the connection between the lead frame cutting blade 31 and the communicating hose 34. A flow dividing cavity 312 is formed inside one end of the lead frame cutting blade 31. The flow dividing cavity 312 is connected to the opening at one end of the air guide groove 313. Exhaust holes 311 are formed between the inner wall of the flow dividing cavity 312 and the side wall of the lead frame cutting blade 31. A docking hole 314 is formed on one side inner wall of the air guide groove 313. A water-absorbing cotton strip 36 is fixedly connected inside the docking hole 314, and one end of the water-absorbing cotton strip 36 penetrates through the side wall of the liquid storage box 33.

[0042] It should be noted that during the process of the pressing plate 22 pressing the telescopic airbag 32, the gas inside the telescopic airbag 32 will be evenly dispersed into the corresponding air guide grooves 313 through multiple communicating hoses 34, and then discharged from multiple exhaust holes 311 through the flow dividing cavity 312 to achieve the effect of blowing air on the components. It can not only blow the slight dust on the surface of the components, but also reduce the heat generated during lead frame cutting, thereby reducing the damage to the components during the processing and improving the performance of the semiconductor. In addition, a coolant can be added to the inside of the liquid storage box 33. The coolant can be water or other cooling liquids with a diffusion effect, and is absorbed and diffused through the water-absorbing cotton strip 36. During the process of discharging the above-mentioned gas, the surface of the water-absorbing cotton strip 36 can be blown to improve the diffusion speed of water, so as to increase the humidity of the local space within the cutting range during lead frame cutting, thereby avoiding the generation of static electricity during the cutting process, avoiding damage to the semiconductor material, improving the reliability and lifespan of the chip. At the same time, due to the evaporation of water, the heat of surrounding objects can also be taken away to reduce the temperature in the air and improve the cooling effect.

[0043] It should be noted that the specific model and specification of the motor need to be selected and determined according to the actual specifications of the device. The specific selection calculation method adopts the existing technology in the field, so it will not be elaborated in detail here.

[0044] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A semiconductor packaging machine, comprising a conveyor frame (1), the conveyor frame (1) being connected to a conveyor belt 1 (8) and a conveyor belt 2 (10), a semiconductor strip (7) being provided on the surface of the conveyor belt 1 (8), a baffle strip (9) being fixedly connected to the inner side wall of the conveyor frame (1), the conveyor frame (1) being connected to an upper drive assembly (4) and a lower drive assembly (5), the upper drive assembly (4) comprising an upper rotating plate (43), the lower drive assembly (5) comprising a lower rotating plate (53), the upper rotating plate (43) and the lower rotating plate (53) being each provided with a pair, characterized in that: Also includes: A fixed component (2), the fixed component (2) being located between the two upper rotating plates (43), and the fixed component (2) being capable of absorbing current generated by the semiconductor; A rib cutting assembly (3), the rib cutting assembly (3) being located between the two upper rotating plates (43), the rib cutting assembly (3) being capable of cooling down the pins that need rib cutting and increasing the local air humidity; A supporting assembly (6), the supporting assembly (6) being located between the two lower rotating plates (53), and the supporting assembly (6) being able to fix a single semiconductor in cooperation with the fixing assembly (2); The rib cutting assembly (3) comprises a rib cutting blade (31), a telescopic airbag (32), a liquid storage box (33) and a side plate (35); two ends of the side plate (35) are respectively fixedly connected to opposite side walls of two upper rotating plates (43); one side of the side plate (35) is fixedly connected to the rib cutting blade (31); the other side of the side plate (35) is fixedly connected to the liquid storage box (33); the telescopic airbag (32) is located on the inner side of the rib cutting blade (31); one end of the telescopic airbag (32) is fixedly connected to the side plate (35); and connecting hoses (34) are provided on both sides of the telescopic airbag (32); The two ends of the connecting hose (34) are respectively fixedly connected to the side wall of the telescopic airbag (32) and the side wall of the rib cutting blade (31); an air guide groove (313) is provided at the connection between the rib cutting blade (31) and the connecting hose (34); a diversion cavity (312) is provided inside one end of the rib cutting blade (31); the diversion cavity (312) is connected to an opening at one end of the air guide groove (313); an exhaust hole (311) is provided between the inner wall of the diversion cavity (312) and the side wall of the rib cutting blade (31); a docking hole (314) is provided on the inner wall of one side of the air guide groove (313); an absorbent cotton strip (36) is fixedly connected inside the docking hole (314); one end of the absorbent cotton strip (36) passes through the side wall of the liquid storage box (33).

2. A semiconductor packaging machine according to claim 1, characterized in that: The upper driving assembly (4) further comprises a driving motor 1 (41) and an upper supporting seat (42), wherein the driving motor 1 (41) is fixedly connected to the side wall of the upper supporting seat (42), and the upper supporting seat (42) is fixedly connected to the conveying frame (1), and the upper supporting seat (42) is located outside the upper rotating plate (43), and the side wall of the upper rotating plate (43) is fixedly connected to a rotating shaft 1 (44), and the rotating shaft 1 (44) passes through the side wall of the upper supporting seat (42) and is fixedly connected to the output end of the driving motor 1 (41), and the two upper rotating plates (43) are symmetrical about the center line of the conveying frame (1).

3. A semiconductor packaging machine according to claim 1, characterized in that: The lower driving assembly (5) further comprises a second driving motor (51) and a lower supporting seat (52), wherein the second driving motor (51) is fixedly connected to the side wall of the lower supporting seat (52), and the lower supporting seat (52) is fixedly connected to the lower side wall of the conveying frame (1), and the lower supporting seat (52) is located on the outer side of the lower rotating plate (53), and the lower rotating plate (53) is fixedly connected to a second rotating shaft (54), and one end of the second rotating shaft (54) passes through the side wall of the lower supporting seat (52) and is fixedly connected to the output end of the second driving motor (51), and the two lower rotating plates (53) are symmetrical about the center line of the conveying frame (1).

4. A semiconductor packaging machine according to claim 1, characterized in that: The fixing assembly (2) comprises a pressing plate (22), a limiting rod (24) and a buffer spring (25); the pressing plate (22) is located on the inner side of the rib cutting blade (31); one end of the limiting rod (24) passes through the side wall of the side plate (35) and is fixedly connected to the pressing plate (22); the buffer spring (25) is sleeved on the outer wall of the limiting rod (24); two ends of the buffer spring (25) are respectively fixedly connected to the side wall of the pressing plate (22) and the side wall of the side plate (35); the pressing plate (22) is fixedly connected to one end of the telescopic airbag (32) away from the side plate (35).

5. A semiconductor packaging machine according to claim 4, characterized in that: One end of the pressing plate (22) away from the limiting rod (24) is fixedly connected to a pressure strip (21), the pressure strip (21) is made of rubber material, a cavity (221) is provided inside the pressing plate (22), a diffusion plate (222) is fixedly connected to the inner wall of the cavity (221), and an absorption partition (223) is fixedly connected to one side of the diffusion plate (222).

6. A semiconductor packaging machine according to claim 5, characterized in that: The side wall of the pressing plate (22) is connected to a conductive rod (23) and an elastic member (26); the conductive rod (23) is arranged in a "T" shape; one end of the conductive rod (23) passes through the inner wall of the cavity (221); the elastic member (26) is sleeved on the outer wall of the conductive rod (23); and two ends of the elastic member (26) are respectively fixedly connected to the side wall of one end of the conductive rod (23) and the side wall of the pressing plate (22).

7. The semiconductor packaging machine according to claim 1, characterized in that: The supporting assembly (6) comprises a supporting plate (61), one side of the supporting plate (61) is fixedly connected to a fixing rod (62), and both ends of the fixing rod (62) are respectively fixedly connected to the side walls of the two lower rotating plates (53).

8. A semiconductor packaging machine according to claim 7, characterized in that: One end of the supporting plate (61) away from the fixing rod (62) is fixedly connected to a cutting strip (611) and a supporting strip (612), and the cutting strip (611) is located outside the supporting strip (612).

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