Chip recovery system, chip transport device, chip recovery device, and chip recovery method

Abstract

The invention provides a chip recovery system, a chip conveying device, a chip recovery device and a chip recovery method which can properly recover chips of a belt member discharged from a production line. A chip collection system (component mounting system (1)) is provided with: a chip conveyance device having a conveyance unit for conveying chips of a tape member discharged from a tape feeder, and line storage units (G (1)-G (3)) for storing the chips conveyed by the conveyance unit; and a chip recovery device (40) that recovers chips accommodated in the production line accommodation units (G (1)-G (3)) to the centralized accommodation unit (Gc) by negative pressure. The production line housing units (G (1)-G (3)) are provided in production lines (L1-L3) including component mounting devices having tape feeders, and are provided at positions accessible to a chip recovery device (40).

Description

Technical Field

[0001] The present invention relates to a chip recovery system, a chip conveying device, a chip recovery device and a chip recovery method for recovering chips of a tape component discharged from a tape feeder. Background Art

[0002] The component assembly device assembles the components supplied by a belt member (carrier tape) conveying and arranging a plurality of components to be stored on a substrate. The belt member after the components are supplied is discharged from the belt feeder, cut into a predetermined length by a cutting device, and recovered as chips of the belt member. Patent document 1 discloses the following production line: the chips of the belt member discharged from a plurality of belt feeders are conveyed to an air outlet by air pressure through a recovery path (pipeline), the chips conveyed to the air outlet are conveyed to the upper part of a compression part by a conveyor, and the chips compressed by the compression part are recovered to a storage part arranged below.

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2022-77059 Summary of the invention

[0006] Problems to be solved by the invention

[0007] However, in the prior art including Patent Document 1, although the chips of the belt components discharged from multiple belt feeders are collected in a storage section for recycling, thereby making it easy to recycle the chips of the belt components, there are problems due to the structure of conveying the chips to the compression section by a conveyor. That is, there is the following problem: the chips enter between the circulating conveyor belts through the air ejected from the air outlet together with the chips. In addition, there is the following problem: since it is necessary to set up a conveyor and a storage section for transporting chips for each production line, it is necessary to circulate the chips of the belt components in multiple storage sections while recycling them in a site equipped with multiple production lines.

[0008] Therefore, an object of the present invention is to provide a chip recovery system, a chip conveying device, a chip recovery device, and a chip recovery method capable of appropriately recovering chips of a component discharged from a production line.

[0009] Solutions to Solve Problems

[0010] The chip recovery system of the present invention comprises: a chip conveying device, which has a conveying portion for conveying chips of a belt component discharged from a belt feeder and a production line storage portion for storing the chips conveyed by the conveying portion; and a chip recovery device, which recovers the chips stored in the production line storage portion to a centralized storage portion through negative pressure, the production line storage portion being arranged in a production line including a component assembly device having the belt feeder, and being arranged at a position accessible to the chip recovery device.

[0011] The chip conveying device of the present invention conveys chips of a belt component discharged from a belt feeder, wherein the chip conveying device comprises: a conveying portion that conveys the chips; and a production line storage portion that stores the chips conveyed by the conveying portion, the production line storage portion being disposed in a production line including a component assembly device having the belt feeder, and being disposed in a position accessible to a chip recovery device that recovers the chips stored in the production line storage portion of the chip conveying device to a centralized storage portion through negative pressure.

[0012] The chip recovery device of the present invention recovers the chips of the belt component discharged from the belt feeder to a centralized storage section, wherein the production line storage section of the chip conveying device having a conveying section for conveying the chips and a production line storage section for storing the chips conveyed by the conveying section is arranged in a production line including a component assembly device having the belt feeder, and the chip recovery device is arranged at a position capable of accessing the production line storage section, and recovers the chips to the centralized storage section through negative pressure.

[0013] The chip recovery method of the present invention recovers chips of a belt component discharged from a belt feeder to a centralized storage section, wherein the production line storage section of a chip conveying device having a conveying section for conveying the chips and a production line storage section for storing the chips conveyed by the conveying section is arranged in a production line including a component assembly device having the belt feeder, and a chip recovery device for recovering the chips contained in the production line storage section by negative pressure is arranged in a position capable of accessing the production line storage section, so that the conveying section conveys the chips to the production line storage section, and the chip recovery device recovers the chips conveyed to the production line storage section to the centralized storage section by the negative pressure.

[0014] Effects of the Invention

[0015] According to the present invention, it is possible to appropriately recover the scraps of the belt member discharged from the production line. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is an explanatory diagram showing the structure of a component mounting system according to one embodiment of the present invention.

[0017] Figure 2 It is an explanatory diagram showing the configuration of a production line included in a component assembly system according to one embodiment of the present invention.

[0018] Figure 3 It is a side view showing the structure of the main part of the component mounting device provided in the component mounting system according to one embodiment of the present invention.

[0019] Figure 4 It is a perspective view showing the structure of a chip conveying device provided in the component assembly system according to one embodiment of the present invention.

[0020] Figure 5 (a) is a side view showing the vicinity of the receiving opening of the duct of the feeder carriage and the chip conveying device included in the component assembly system according to one embodiment of the present invention, Figure 5 (b) is a top view.

[0021] Figure 6 (a) and (b) are explanatory diagrams showing a state in which a discharge opening of a discharge portion of a feeder carriage provided in a component assembly system according to an embodiment of the present invention contacts a receiving opening of a duct of a chip transport device.

[0022] Figure 7 (a) is an explanatory diagram showing a state in which chips are discharged from a chute of a feeder carriage provided in a component assembly system according to an embodiment of the present invention, Figure 7 (b) is an explanatory diagram showing a state where discharged chips are blown away by air.

[0023] Figure 8 (a), (b), and (c) are explanatory diagrams of conveying chips in a chip conveying device provided in the component assembly system according to one embodiment of the present invention.

[0024] Fig. 9 (a) is an explanatory diagram showing a state in which chips are recovered by a chip recovery device in a production line storage section of a chip transport device provided in a component assembly system according to an embodiment of the present invention, Fig. 9 (b) is an explanatory diagram showing a state in which chips are collected by an operator.

[0025] Fig.10 (a) is a side cross-sectional view for explaining chip recovery to a centralized storage portion in a chip recovery device provided in a component assembly system according to an embodiment of the present invention, Fig.10 (b) is a top view for explaining replacement of the chip separation filter.

[0026] Fig.11This is a block diagram showing the configuration of a control system of a component mounting system according to one embodiment of the present invention.

[0027] Fig.12 This is a timing chart for explaining a method of collecting chips into a line storage section in a chip transport device of a component assembly system according to an embodiment of the present invention.

[0028] Fig.13 This is a timing chart for explaining a method for collecting chips into a concentrated storage portion in a component assembly system according to an embodiment of the present invention.

[0029] Description of reference numerals:

[0030] 1. Component assembly system (chip recovery system)

[0031] 2 Moving in

[0032] 6 Tape Feeder

[0033] 30 Chip handling device

[0034] 36 Production line storage department recovery door (first door)

[0035] 40 Chip recovery device

[0036] 43a Installation

[0037] 44 Separator filter (filter)

[0038] 48 Centralized storage department recovery door (second door)

[0039] B. Buildings

[0040] D. Transport Department

[0041] Fp production floor (first floor)

[0042] Fm Mechanical Room (Second Venue)

[0043] G, G(1)~G(3) Production line storage department

[0044] Gc Centralized Containment Department

[0045] L1~L3 production line

[0046] M1~M3 component assembly device

[0047] NP Negative pressure supply unit

[0048] P Recovery Road

[0049] P1~P3 production line negative pressure supply pipe (second route)

[0050] Pa1~Pa3 production line opening

[0051] Pc centralized negative pressure supply pipe (first route)

[0052] Pca Recycling Opening

[0053] Sp Position detection unit (detection unit)

[0054] Sw Weight measuring unit (measuring unit)

[0055] T-belt components

[0056] Ts Chips

[0057] Vb(1)~Vb(3) Production line valve

[0058] Vc central valve. DETAILED DESCRIPTION

[0059] Hereinafter, an embodiment of the present invention will be described in detail using the accompanying drawings. The structures, shapes, etc. described below are examples for explanation and can be appropriately changed according to the specifications of the component assembly system (chip recovery system), component assembly device, feeder trolley, chip conveying device, and chip recovery device. Hereinafter, the same reference numerals are marked on the corresponding elements in all the accompanying drawings, and repeated descriptions are omitted.

[0060] exist Figure 1 In the following part, the X-axis ( Figure 1 The left and right direction in the substrate transport direction), the Y axis ( Figure 1 The left and right directions in the horizontal plane) are two axes that are orthogonal to each other in the horizontal plane. Figure 3 In the following part, the Z axis ( Figure 3 The up and down directions in the figure are taken as the height direction perpendicular to the horizontal plane.

[0061] First, refer to Figure 1 The structure of the component assembly system 1 is described. The component assembly system 1 includes: a plurality of (here, three) production lines L1 to L3 set in a production site Fp in a building B; and a chip recovery device 40 and a positive pressure supply device 41 set in a machine room Fm. The machine room Fm is provided with a carrying port 2 for entering and exiting from the outside of the building B. The plurality of production lines L1 to L3 include a plurality of component assembly devices M1 to M3 and a chip conveying device 30 (see Figure 2 ).

[0062] In addition to the function of producing a mounting substrate on which components are mounted, the component assembly system 1 also has the function of a chip recovery system as a centralized storage section Gc for recovering chips of the belt components supplied to the machine room Fm. It should be noted that the production lines L1 to L3 provided by the component assembly system 1 are not limited to three, and may be one or two, or may be four or more. Thus, in the component assembly system 1 (chip recovery system), the machine room Fm (second site) is an area different from the production site Fp (first site) where the component assembly devices M1 to M3 are installed. In addition, the machine room Fm is an area having an entrance 2 of a building B where the component assembly devices M1 to M3 are installed. It should be noted that the component assembly system 1 (chip recovery system) may also be a structure in which the centralized storage section Gc (chip recovery device 40) is installed in the production site Fp (first site).

[0063] Next, refer to Figure 2 The structures of the production lines L1 to L3 are described. The three production lines L1 to L3 have the same structure, and here, the production line L1 is used as an example for description. The production line L1 is equipped with a plurality of (here three) component assembly devices M1 to M3 and a chip conveying device 30. The component assembly devices M1 to M3 are arranged above the conveying section D (main duct Dm, sub-duct Ds) of the chip conveying device 30 (refer to Figure 3 ).

[0064] It should be noted that the number of component assembly devices M1 to M3 provided in the production line L1 is not limited to three, and may be one, two, or more than four. In addition, the production line L1 may also be configured to include a printing device for printing solder paste on a substrate upstream of the component assembly devices M1 to M3, and a reflow soldering device for melting the solder paste for soldering downstream (not shown).

[0065] Next, refer to Figure 3 The structures of the component assembly devices M1 to M3 are described. The three component assembly devices M1 to M3 have the same structure. Here, the component assembly device M1 is used as an example for description. Figure 3 The left side of the Y axis ( Figure 1 , Figure 2 The lower side) is called "front", and the right side ( Figure 1 , Figure 2 The upper side of the component assembly device M1 is called "rear". The component assembly device M1 includes a component assembly main body 3 and two feeder carts 4. The feeder carts 4 are connected to the component supply parts 5 on the front and rear sides of the component assembly main body 3 in a manner that can be freely loaded and unloaded ( Figure 2 Arrow a).

[0066] A plurality of tape feeders 6 are arranged along the X-axis and mounted on the upper surface of the feeder carriage 4. On the feeder carriage 4, a reel 8 on which a tape member T for storing a component 7 supplied to the component assembly main body 3 is wound is held in a rotatable manner. The tape feeder 6 conveys the tape member T stored in the reel 8 in the tape feeding direction and supplies the component 7 to the component assembly main body 3. When the feeder carriage 4 is mounted on the component supply part 5, the plurality of tape feeders 6 are connected to an assembly control device 9 provided in the component assembly main body 3 via the feeder carriage 4. The assembly control device 9 sends a supply instruction of the component 7 to the tape feeder 6, and the tape feeder 6 receiving the instruction feeds the tape member T and supplies the component 7 to the component removal position.

[0067] exist Figure 3 In the embodiment, two substrate conveying mechanisms 11 are arranged in a front-to-back arrangement between the component supplying parts 5 on the front and rear sides of the upper surface of the base 10 of the component assembly main body 3. The substrate conveying mechanisms 11 convey substrates 12 along the X-axis and position and hold them. Two assembly heads 14 are arranged above the substrate conveying mechanisms 11 and are moved in the horizontal direction (X-axis direction and Y-axis direction) by a head moving mechanism 13.

[0068] The assembly control device 9 controls the head moving mechanism 13 and the assembly head 14 to perform a component assembly operation in which the assembly head 14 takes out the component 7 supplied to the component taking-out position by the tape feeder 6 and transfers the mounted component to the assembly point of the substrate 12 held by the substrate conveying mechanism 11. A main body cover 15 that can be opened and closed is provided above the feeder carriage 4, and the main body cover 15 is covered in a manner that the operator does not come into contact with the movable mechanism such as the assembly head 14 during the component assembly operation.

[0069] exist Figure 3 In the embodiment, a chute 16 is provided on the side of the feeder carriage 4 coupled to the base 10 to guide the empty tape member T discharged from the tape feeder 6 downward. A cutter 17 for cutting the empty tape member T is provided in the chute 16. The cutter 17 is controlled by the assembly control device 9, and when the empty tape member T discharged from any of the tape feeders 6 reaches a predetermined length (e.g., 10 cm), the empty tape member T is cut at the same time.

[0070] exist Figure 3 , Figure 5 , Figure 7In the embodiment, the lower portion of the chute 16 is connected to an upper opening 18a formed on the upper surface of a receiving portion 18 provided below the chute 16. The receiving portion 18 receives the chips Ts of the belt component T that has passed through the chute 16. An overlapping portion 19 extending upward and surrounding the upper opening 18a is provided on the upper surface of the receiving portion 18. The receiving portion 18 is fixed to the chute 16 in a state where the lower portion of the chute 16 enters the overlapping portion 19 and is connected to the upper opening 18a, thereby preventing the chips Ts from leaking to the outside from the gap between the chute 16 and the upper opening 18a. That is, the chute 16 and the receiving portion 18 are provided in a manner that they are connected without a gap. It should be noted that the receiving portion 18 does not need to be fixed to the chute 16, as long as it is a structure that is connected without a gap to the chute 16.

[0071] A discharge opening 18b for discharging the chips Ts received by the receiving portion 18 is formed on the side of the base 10 of the receiving portion 18 (the rear side in the Y-axis direction in the case of the feeder carriage 4 connected to the front side). When the feeder carriage 4 is connected to the component assembly main body 3, the discharge opening 18b of the receiving portion 18 contacts the receiving opening Dsa of the front end portion of the sub-duct Ds of the chip conveying device 30 provided below the component assembly main body 3. That is, the receiving opening Dsa of the sub-duct Ds is opened on the side of the feeder carriage 4 (the front side in the Y-axis direction in the case of the component supply portion 5 on the front side).

[0072] exist Figure 7 In the embodiment, a fulcrum 20 is provided inside the receiving portion 18 on the side opposite to the discharge opening 18b across the upper opening 18a, and a flat plate-shaped guide plate 21 is provided that can rotate around the axis of the fulcrum 20 in the X-axis direction. In addition, an air ejection portion 22 that ejects air in the direction of the discharge opening 18b is provided in front of the wall on the side opposite to the discharge opening 18b inside the receiving portion 18. That is, the receiving portion 18 has the air ejection portion 22 that ejects air in the direction of the discharge opening 18b.

[0073] The air (positive pressure) supplied by the air ejection unit 22 is supplied from the positive pressure supply device 41 provided in the machine room Fm through an air supply path (not shown). In the air supply path, six carriage valves Vtf1 to Vtf3, Vtr1 to Vtr3 (see FIG. 1 ) are arranged corresponding to the feeder carriages 4 before and after the component assembly devices M1 to M3 provided in the production line L1. Fig.11 ).

[0074] exist Fig.11In the embodiment, the opening and closing of the carriage valves Vtf1 to Vtf3 and Vtr1 to Vtr3 are controlled by the first control unit 51 included in the system control device 50. That is, when the carriage valves Vtf1 to Vtf3 and Vtr1 to Vtr3 are opened by the first control unit 51, air is ejected from the air ejection unit 22. In addition, when the carriage valves Vtf1 to Vtf3 and Vtr1 to Vtr3 are closed by the first control unit 51, the ejection of air from the air ejection unit 22 is stopped.

[0075] exist Figure 7 In (a), when no air is ejected from the air ejection portion 22, the guide plate 21 is in a posture of descending toward the discharge opening 18b. In this state, the chute 16 is lowered (arrow b), and the chips Ts entering the interior of the receiving portion 18 from the upper opening 18a are guided toward the discharge opening 18b along the upper surface of the guide plate 21.

[0076] exist Figure 7 In (b), when air is ejected from the air ejection portion 22, the guide plate 21 rotates upward (arrow c) under the action of the ejected air, and the upper opening 18a is closed by the guide plate 21. In addition, the chips Ts that have entered the interior of the receiving portion 18 under the action of the ejected air are pushed out through the discharge opening 18b and the receiving opening Dsa toward the depth of the sub-duct Ds (in the direction of the main duct Dm) (arrow d).

[0077] As described above, the receiving portion 18 receives the chips Ts of the belt member T passing through the chute 16 and discharges it from the discharge opening 18b. In addition, the chute 16 and the receiving portion 18 constitute a discharge portion 23 ( Figure 3 That is, the feeder carriage 4 of the component mounting devices M1 to M3 has a discharge portion 23 that receives the chips Ts and discharges them from the discharge opening 18b. In addition, the chip conveying device 30 has a sub-duct Ds that receives the chips Ts discharged from the discharge opening 18b through the receiving opening Dsa.

[0078] Next, the structure of the chip conveying device 30 provided in the production line L1 will be described. Figure 2 , Figure 4 In the embodiment, the chip conveying device 30 has two main pipes Dm, six sub-pipes Ds, and a positive pressure opening and closing part 31. The chip conveying device 30 has the function of conveying the chips Ts discharged from the feeder carriage 4 to the production line storage part G. The main pipe Dm is a tubular member extending along the arrangement direction (X-axis direction) of the component assembly devices M1 to M3, and is set on the ground of the production site Fp. Two main pipes Dm are arranged in a front-to-back arrangement.

[0079] The front side of the main pipeline Dm provided at the front side is connected to three sub-pipes Ds corresponding to the three feeder carts 4 connected to the front side. In addition, the rear side of the main pipeline Dm provided at the rear side is connected to three sub-pipes Ds corresponding to the three feeder carts 4 connected to the rear side. In the sub-pipe Ds, a receiving opening Dsa is opened at the front end portion on the side opposite to the end side connected to the main pipeline Dm.

[0080] exist Figure 2 In the figure, one end of the two main pipelines Dm is connected to the positive pressure opening and closing part 31, and the other end is connected to the production line storage part G. Air (positive pressure) is supplied to the positive pressure opening and closing part 31 from the positive pressure supply device 41 installed in the machine room Fm through the positive pressure supply pipeline Pp. The positive pressure opening and closing part 31 is provided with a pipeline valve Vdf for switching the ejection and stop of the air supplied to the main pipeline Dm installed on the front side, and a pipeline valve Vdr for switching the ejection and stop of the air supplied to the main pipeline Dm installed on the rear side.

[0081] The opening and closing of the pipe valves Vdf and Vdr are controlled by the first control unit 51 included in the system control device 50. That is, when the pipe valves Vdf and Vdr are opened by the first control unit 51, air is ejected from the positive pressure opening and closing unit 31 to the main pipe Dm. In addition, when the pipe valves Vdf and Vdr are closed by the first control unit 51, the ejection of air from the positive pressure opening and closing unit 31 to the main pipe Dm is stopped.

[0082] Figure 8 This is a schematic diagram for explaining the internal structure and function of the main duct Dm and the sub-duct Ds on the front side of the chip conveying device 30, and the front side feeder carriage 4 in a state connected to the component mounting devices M1 to M3. Figure 8 In the embodiment, a connection opening Dma is formed at a connection portion with the sub-pipe Ds on the side wall of the main pipe Dm. An opening and closing plate 32 for opening and closing the connection opening Dma is arranged inside the main pipe Dm. The opening and closing plate 32 is arranged to be rotatable around an axis in the Z-axis direction (up and down direction) via a hinge 33 provided on the inner surface of the side wall of the main pipe Dm on the positive pressure opening and closing portion 31 side relative to the connection opening Dma.

[0083] Next, refer to Figure 8 (a)~ Figure 8 (c) of the present invention describes a method for conveying the chips Ts with the member T to the line storage section G in the feeder carriage 4 and the chip conveying device 30. Figure 8 (a) shows a state where air is neither ejected from the air ejection portion 22 of the receiving portion 18 of the feeder carriage 4 nor ejected from the positive pressure opening and closing portion 31 (for example, Fig.12In this state, the opening and closing plate 32 blocks the connection opening Dma in a closed state. In addition, the chips Ts passing through the chute 16 fall to the receiving portion 18 at any time ( Figure 7 Arrow b) of (a).

[0084] exist Figure 8 In (b), when air is not ejected from the positive pressure opening and closing section 31, if air is ejected from the air ejection section 22, the opening and closing plate 32 is rotated toward the inside of the main pipe Dm (arrow e) by the ejected air to open the connection opening Dma, and the chips Ts received by the receiving section 18 and the sub-pipe Ds are pushed out to the main pipe Dm through the sub-pipe Ds (refer to Figure 7 (b)). That is, Figure 8 (b) shows a state where the first control unit 51 closes the pipeline valve Vdf and opens any of the carriage valves Vtf1 to Vtf3 (for example, Fig.12 The state of the vehicle 2 between time T3 and time T4 in FIG.

[0085] exist Figure 8 In (c), when air is not ejected from the air ejection section 22, if air is ejected from the positive pressure opening and closing section 31, the opening and closing plate 32 is rotated in the direction of the connection opening Dma by the ejected air (arrow f) to close the connection opening Dma, and the chips Ts in the main duct Dm are pushed out in the direction of the production line storage section G (arrow g) and stored in the production line storage section G (refer to Fig. 9 (a)). That is, Figure 8 (c) shows a state where the first control unit 51 opens the pipeline valve Vdf and closes the carriage valves Vtf1 to Vtf3 (for example, Fig.12 The state between time T4 and time T5 in the graph).

[0086] Next, refer to Figure 4 , Fig. 9 , the structure of the production line storage section G is described. The two main pipes Dm of the chip conveying device 30 are connected to the interior of the production line storage section G. The ends of the two main pipes Dm pass through the side of the production line storage section G and enter the interior of the production line storage section G. In addition, the production line negative pressure supply pipe P1 (P2, P3) connected to the chip recovery device 40 passes through the top of the production line storage section G and the end enters the interior of the production line storage section G. A skirt 34 that expands downward is provided at the end of the production line negative pressure supply pipe P1 where the production line opening Pa1 (Pa2, Pa3) is opened.

[0087] As described later, negative pressure is supplied to the line negative pressure supply pipe P1 from the chip recovery device 40. In addition, the line negative pressure supply pipe P1 is provided with a line valve Vb whose opening and closing is controlled by the first control unit 51. When the line valve Vb is opened by the first control unit 51, negative pressure is supplied to the skirt portion 34 through the line negative pressure supply pipe P1. In addition, when the line valve Vb is closed by the first control unit 51, the supply of negative pressure to the skirt portion 34 is stopped.

[0088] exist Fig. 9 In (a), a tray 35 is arranged near the bottom of the production line storage section G. The chips Ts (arrow h) conveyed to the interior of the production line storage section G by the chip conveying device 30 are recovered to the tray 35. In addition, when the production line valve Vb is opened and negative pressure is supplied to the skirt 34, the chips Ts conveyed to the interior of the production line storage section G by positive pressure are sucked up by the production line negative pressure supply pipe P1 (arrow i), and are recovered to the chip recovery device 40. In this way, the chips Ts conveyed to the production line storage section G are more efficiently recovered to the chip recovery device 40 by applying the positive pressure supplied from the main pipeline Dm to the negative pressure supplied from the production line negative pressure supply pipe P1.

[0089] exist Fig. 9 In (b), when the chips TS transported to the production line storage section G are recovered from the production line storage section G, the pipeline valves Vdf, Vdr and the production line valve Vb are closed to stop the ejection of air from the main pipeline Dm and the supply of negative pressure from the production line negative pressure supply pipe P1. In this state, the operator opens the production line storage section recovery door 36 disposed in the production line storage section G, and recovers the chips Ts accumulated on the tray 35 from the production line storage section recovery opening Ga opened in the production line storage section G (arrow j). In this way, the production line storage section G has a production line storage section recovery door 36 (first door) for taking out the chips Ts from the production line storage section G.

[0090] exist Fig. 9 In the production line storage section G, a weight measuring unit Sw is provided to measure the weight of the tray 35. The measurement result of the weight measuring unit Sw is sent to the determination unit 53 ( Fig.11 The judgment unit 53 calculates the weight of the chips Ts in the production line storage unit G based on the difference between the weight of the tray 35 measured by the weight measuring unit Sw and the weight of the empty tray 35 without the chips Ts piled up. Thus, the weight measuring unit Sw is a measuring unit of the production line storage unit G that measures the weight of the chips Ts in the production line storage unit G.

[0091] In addition, the production line storage section G is provided with a position detection section Sp such as an optical sensor that detects that the chips Ts are accumulated to a preset recovery height. The detection result based on the position detection section Sp is sent to the judgment section 53. When the judgment section 53 receives a detection result indicating that the chips Ts are detected from the position detection section Sp (for example, the detection light irradiated by the position detection section Sp is shielded by the chips Ts), it judges that the chips Ts in the production line storage section G are accumulated to the recovery height. In this way, the position detection section Sp is a detection section of the production line storage section G that detects the chips Ts at a predetermined height (recovery height) in the production line storage section G.

[0092] Next, refer to Figures 4 to 6 Next, the structure of the contact portion between the discharge opening 18b of the discharge portion 23 of the feeder carriage 4 and the receiving opening Dsa of the sub-duct Ds of the chip conveying device 30 will be described.

[0093] exist Figure 5 In the embodiment, an upper surface plate 25 having a width W2 greater than the width W1 (length in the X-axis direction) of the receiving portion 18 is arranged on the upper surface of the receiving portion 18 of the discharge portion 23. That is, both ends of the upper surface plate 25 in the X-axis direction extend laterally compared to the receiving portion 18. The receiving portion 18 is arranged in a cutout portion 4b formed in a bottom plate 4a fixed to the feeder trolley 4. The cutout portion 4b is open on the side of the sub-duct Ds (the rear side in the Y-axis direction in the case of the feeder trolley 4 connected to the front side), and has a width W3 (length in the X-axis direction) greater than the width W1 of the receiving portion 18. The receiving portion 18 is inserted into the cutout portion 4b from the side of the sub-duct Ds in a manner that the upper surface plate 25 is located above the bottom plate 4a of the feeder trolley 4.

[0094] At the positions where the upper surface plate 25 overlaps with the bottom plate 4a, the parts on both sides extending from the receiving portion 18 are respectively formed with escape holes 25a that penetrate up and down. On the bottom plate 4a, a step pin 26 is connected to penetrate the escape hole 25a. The length of the escape hole 25a in the X-axis direction and the Y-axis direction is larger than the diameter of the pin portion 26a of the step pin 26 connected to the bottom plate 4a. In addition, the flange portion 26b of the step pin 26 located above the bottom plate 4a is larger than the length of the escape hole 25a in the X-axis direction and the Y-axis direction. That is, the flange portion 26b is set to a size that will not fall off from the escape hole 25a.

[0095] exist Figure 5In (a), a rear plate 4c extending downward is arranged on the lower surface of the bottom plate 4a, at a position behind the cutout portion 4b (the front side in the Y-axis direction in the case of the feeder carriage 4 connected to the front side). Between the rear plate 4c and the receiving portion 18, a force-applying portion 27 composed of an elastic body such as a spring connected to the rear plate 4c at one end and the receiving portion 18 at the other end is arranged. By the force-applying portion 27, the discharge portion 23 including the receiving portion 18 is applied to the side of the secondary duct Ds (the rear side in the Y-axis direction in the case of the feeder carriage 4 connected to the front side).

[0096] The receiving portion 18, which is urged by the urging portion 27 and moved to the sub-duct Ds side, stops when the pin portion 26a of the stepped pin 26 that penetrates the receiving portion 18 abuts against the inner wall of the escape hole 25a on the side opposite to the sub-duct Ds. Figure 5 In addition, when the receiving portion 18 is pushed from the sub-duct Ds side, it moves to the side opposite to the sub-duct Ds by a margin distance Ym in the Y-axis direction, and stops when the pin portion 26a contacts the inner wall of the avoidance hole 25a on the sub-duct Ds side (not shown).

[0097] exist Figure 5 In the same manner, the receiving portion 18 can move in the X-axis direction by a margin distance Xm. That is, the receiving portion 18 can move from a state where the pin portion 26a abuts against the wall of the escape hole 25a in the X-axis direction ( Figure 5 The receiving portion 18 is in a state where no external force is applied in the Z-axis direction (up and down direction) except for gravity ( Figure 5 In the state (a) of FIG. 1 , the lower surface of the upper surface plate 25 abuts against the upper surface of the bottom plate 4a and stops. In this state, there is a margin of a movement margin distance Zm in the Z-axis direction between the upper surface of the upper surface plate 25 and the lower surface of the flange portion 26b of the step pin 26. When the receiving portion 18 is moved upward, the movement margin distance Zm in the Z-axis direction is increased, and the upper surface of the upper surface plate 25 abuts against the lower surface of the flange portion 26b of the step pin 26 and stops (not shown).

[0098] In this way, the discharge portion 23 is arranged to be movable in the direction in which the feeder trolley 4 is connected to the auxiliary pipe Ds (component assembly main body 3). In addition, the feeder trolley 4 has a force-applying portion 27 that applies force to the discharge portion 23 in a manner toward the auxiliary pipe Ds. Moreover, the avoidance hole 25a and the stepped pin 26 of the upper surface plate 25 constitute a limiting portion R, which limits the movement of the receiving portion 18 (discharge portion 23) in the Y-axis direction (the direction in which the feeder trolley 4 is connected to the auxiliary pipe Ds (component assembly main body 3)), the X-axis direction (the direction intersecting the direction connected to the auxiliary pipe Ds in the horizontal plane) or the Z-axis direction (up and down direction).

[0099] It should be noted that in Figure 5 In the embodiment, the discharge portion 23 is a structure that moves in the direction of the auxiliary pipe Ds, but the auxiliary pipe Ds may also be a structure that moves in the direction of the discharge portion 23. Moreover, the force applying portion 27 only needs to apply force to one of the discharge portion 23 and the auxiliary pipe Ds in such a way that one of them moves toward the other. In addition, in addition to the structure in which the receiving portion 18 of the discharge portion 23 is fixed to the chute 16 and the receiving portion 18 and the chute 16 move in the up-down direction as a whole, the chute 16 may be fixed to the feeder carriage 4 and only the receiving portion 18 moves in the up-down direction.

[0100] exist Figure 4 , Figure 5 In the embodiment, positioning pins 28 protruding in the direction toward the auxiliary pipe Ds are provided on both side surfaces of the receiving portion 18 in the X-axis direction. In addition, extension portions 37 and extension portions 38 extending in the X-axis direction are provided next to the receiving opening Dsa on both side surfaces of the auxiliary pipe Ds in the X-axis direction. A positioning hole 37a having a size substantially the same as that of the positioning pin 28 is formed in the extension portion 37 on one side so as to penetrate the extension portion 37. In addition, a positioning long hole 38a longer than the positioning hole 37a in the X-axis direction is formed in the extension portion 38 on the other side so as to penetrate the extension portion 38.

[0101] exist Figure 5 , Figure 6 In the process of connecting the feeder carriage 4 to the component assembly main body 3, a pair of positioning pins 28 engage with the positioning hole 37a of the extension portion 37 and the positioning long hole 38a of the extension portion 38. At this time, even if there is an offset between the position of the discharge portion 23 of the feeder carriage 4 and the setting position of the secondary pipe Ds of the chip conveying device 30, the offset in the X-axis direction is adjusted by the adjustment amount of the positioning long hole 38a. In addition, the offset in the X-axis direction, the Y-axis direction, and the Z-axis direction is adjusted within the range of the X-axis direction movement margin distance Xm, the Y-axis direction movement margin distance Ym, and the Z-axis direction movement margin distance Zm of the limiting portion R.

[0102] Figure 6 (a) and Figure 6 (b) schematically shows a state in the vicinity of a connection portion between the discharge portion 23 of the feeder carriage 4 and the sub-duct Ds of the chip conveying device 30 after the feeder carriage 4 is connected to the component assembly main body 3, as viewed from the side.

[0103] Figure 6(a) shows a situation where the position of the discharge portion 23 of the feeder carriage 4 and the sub-duct Ds of the chip conveying device 30 is not offset. The discharge opening 18b of the discharge portion 23 and the receiving opening Dsa of the sub-duct Ds are in contact from the direction in which the feeder carriage 4 is connected to the component assembly main body 3. Moreover, in a state in which the feeder carriage 4 is connected to the component assembly main body 3, the discharge portion 23 (receiving portion 18) is pressed toward the sub-duct Ds by the force applying portion 27. Thus, in a state in which the feeder carriage 4 is connected to the component assembly main body 3, the discharge opening 18b is in contact with the receiving opening Dsa in a manner that the chips Ts discharged from the discharge portion 23 to the sub-duct Ds do not leak to the outside.

[0104] Figure 6 (b) shows a state where the position of the discharge portion 23 of the feeder carriage 4 and the auxiliary pipe Ds of the chip conveying device 30 are offset by ΔX (omitted from the figure) in the X-axis direction, ΔY in the Y-axis direction, and ΔZ in the Z-axis direction. Even if there is an offset (ΔX, ΔY, ΔZ) between the discharge portion 23 and the auxiliary pipe Ds, the position is adjusted within the range of the moving margin distance (Xm, Ym, Zm) by the force applying portion 27 and the limiting portion R. Thus, it is possible to prevent the chips Ts from leaking to the outside from the connection portion between the discharge portion 23 and the auxiliary pipe Ds.

[0105] In this way, the pair of positioning pins 28 constitute a pair of convex parts provided on both sides of the discharge opening 18b. In addition, the positioning hole 37a and the positioning long hole 38a constitute a pair of holes provided on both sides of the receiving opening Dsa and engaged with the pair of convex parts. In addition, the pair of convex parts are positioning parts provided in the discharge part 23, and the pair of holes are positioned parts provided in the auxiliary pipe Ds. It should be noted that the auxiliary pipe Ds may also be configured to have a positioning part with a pair of convex parts, and the discharge part 23 may have a positioned part with a pair of holes.

[0106] That is, as long as one of the discharge portion 23 and the auxiliary pipe Ds has a positioning portion for positioning relative to the other, and the other has a positioned portion positioned by the positioning portion. In addition, one of the pair of holes (the positioning long hole 38a) has an adjustment amount for adjusting the position of the receiving portion 18 relative to the auxiliary pipe Ds when engaging with the convex portion. Thus, the positions of the discharge opening 18b of the discharge portion 23 and the receiving opening Dsa of the auxiliary pipe Ds can be positioned during the process of connecting the feeder trolley 4 to the component assembly main body 3. It should be noted that the positioning hole 37a and the positioning long hole 38a are not limited to holes that penetrate the extension portion 37 and the extension portion 38, and can also be non-penetrating recessed portions.

[0107] exist Figure 5 , Figure 6In the embodiment, an elastic member 29 of elastically deformable hard sponge or rubber is arranged around the discharge opening 18b on the surface where the receiving portion 18 (discharge portion 23) contacts the auxiliary duct Ds. When the feeder carriage 4 is connected to the component assembly main body 3, the gap between the outer periphery of the discharge opening 18b and the outer periphery of the receiving opening Dsa is filled by the elastic member 29 that is elastically deformed. Thus, even if the positions of the discharge opening 18b and the receiving opening Dsa are offset, the chips Ts can be prevented from leaking to the outside from the connection portion between the discharge portion 23 and the auxiliary duct Ds.

[0108] In this way, the feeder carriage 4 has an elastic member 29, which is elastically deformed when the discharge portion 23 is positioned relative to the auxiliary duct Ds to fill the gap between the outer periphery of the discharge opening 18b and the outer periphery of the receiving opening Dsa. It should be noted that the elastic member 29 can also be arranged around the receiving opening Dsa of the auxiliary duct Ds. That is, the component assembly devices M1 to M3 only need to have the elastic member 29, which is elastically deformed when one of the discharge portion 23 and the auxiliary duct Ds is positioned relative to the other to fill the gap between the outer periphery of the discharge opening 18b and the outer periphery of the receiving opening Dsa.

[0109] As described above, the feeder carriage 4 of the present embodiment holds the tape feeder 6 and is connected to the component assembly devices M1 to M3 including the component assembly main body 3 for assembling the component 7 supplied from the tape feeder 6 on the substrate 12. In addition, the feeder carriage 4 has a discharge portion 23 that allows the chips Ts of the tape component T discharged from the tape feeder 6 to pass through and be discharged from the discharge opening 18b. The discharge opening 18b contacts the receiving opening Dsa of the sub-duct Ds of the chip conveying device 30 that conveys the chips Ts to the production line storage section G (storage section) when the feeder carriage 4 is connected to the component assembly main body 3, so that the chips Ts discharged from the discharge portion 23 do not leak to the outside. As a result, it is possible to prevent the chips Ts of the tape component T from leaking from the connection portion between the feeder carriage 4 and the chip conveying device 30.

[0110] In addition, the component assembly devices M1 to M3 of the present embodiment include a feeder carriage 4 and a component assembly main body 3, and have a discharge portion 23 that allows the chips Ts of the belt component T discharged from the belt feeder 6 to pass through and be discharged from the discharge opening 18b. The discharge opening 18b contacts the receiving opening Dsa of the sub-duct Ds of the chip conveying device 30 that conveys the chips Ts to the production line storage section G (storage section) when the feeder carriage 4 is connected to the component assembly main body 3, so that the chips Ts discharged from the discharge portion 23 do not leak to the outside. As a result, it is possible to prevent the chips Ts of the belt component T from leaking from the connection portion between the feeder carriage 4 and the chip conveying device 30.

[0111] In addition, the chip conveying device 30 of the present embodiment has a sub-duct Ds for receiving chips Ts from a receiving opening Dsa, and the discharge opening 18b of the discharge section 23 for passing and discharging the chips Ts, which is provided by the component assembly devices M1 to M3 including the feeder carriage 4 and the component assembly main body 3, contacts the receiving opening Dsa in a manner that prevents the chips Ts discharged from the discharge section 23 to the sub-duct Ds from leaking to the outside, and conveys the chips Ts of the belt component T discharged from the belt feeder 6 to the production line storage section G (storage section). Thus, the chips Ts of the belt component T can be prevented from leaking from the connection portion between the feeder carriage 4 and the chip conveying device 30.

[0112] In addition, the component assembly system 1 of the present embodiment is a chip recovery system, which includes component assembly devices M1 to M3 including a feeder trolley 4 and a component assembly main body 3, and a chip conveying device 30, and the discharge opening 18b contacts with the receiving opening Dsa in a state where the feeder trolley 4 is connected to the component assembly main body 3 so that the chips Ts discharged from the discharge portion 23 to the auxiliary duct Ds do not leak to the outside, and conveys the chips Ts of the belt component T discharged from the belt feeder 6 to the production line storage portion G (storage portion). The chip recovery system of the present embodiment can prevent the chips Ts of the belt component T from leaking from the connection portion between the feeder trolley 4 and the chip conveying device 30.

[0113] Next, refer to Figure 1 , Fig.10 , the structure of the chip recovery device 40 provided in the component assembly system 1 (chip recovery system) is described. As described above, the sub-duct Ds and the main duct Dm of the chip conveying device 30 provided in the production lines L1 to L3 respectively constitute a conveying section D ( Figure 2 The chip conveying device 30 includes a conveying section D and a line storage section G for storing the chips Ts conveyed by the conveying section D. The conveying section D conveys the chips Ts discharged from the tape feeder 6 to the line storage section G using positive pressure (air).

[0114] Furthermore, the line openings Pa1 to Pa3 (see FIG. 1 ) of the line negative pressure supply pipes P1 to P3 communicating with the chip recovery device 40 are connected to the line storage parts G(1) to G(3) of the lines L1 to L3, respectively. Fig. 9 ). In addition, the chip recovery device 40 provided separately from the production lines L1 to L3 is connected to the recovery opening Pca of the concentrated negative pressure supply pipe Pc. Furthermore, the production line negative pressure supply pipes P1 to P3 of the production lines L1 to L3 are connected to the concentrated negative pressure supply pipe Pc.

[0115] exist Fig.10In (a), the chip recovery device 40 has a centralized storage portion Gc and a negative pressure supply chamber 42 inside. The centralized storage portion Gc and the negative pressure supply chamber 42 are separated by a partition wall 43 and a partition filter 44 located therebetween. The partition filter 44 is provided on a mounting portion 43a formed on the upper portion of the partition wall 43. The mesh size of the partition filter 44 is such that air can pass through but chips Ts of the belt member T larger than a specified size cannot pass through.

[0116] exist Fig.10 In (b), a filter mounting opening 43b connected to the mounting portion 43a is provided on the side of the chip recovery device 40. The partition filter 44 is mounted on the mounting portion 43a through the filter mounting opening 43b. In this way, a partition filter 44 (filter) is provided between the centralized storage portion Gc and the space (negative pressure supply chamber 42) in which the negative pressure supply portion NP is provided, and chips Ts larger than a specified size do not pass through the partition filter 44 but are retained in the centralized storage portion Gc. In addition, the chip recovery device 40 has a mounting portion 43a on which the partition filter 44 can be slidably mounted. Thus, the partition filter 44 can be easily replaced.

[0117] exist Fig.10 In (a), a negative pressure supply unit NP for generating negative pressure is provided in the negative pressure supply chamber 42. The negative pressure supply unit NP is controlled by a second control unit 52 ( Fig.11 ) control. An exhaust opening 42a connected to the negative pressure supply chamber 42 is formed on the rear surface of the chip recovery device 40. An exhaust filter 45 is arranged at the exhaust opening 42a. The mesh size of the exhaust filter 45 is such that air can pass through but the smaller chips Ts and dust that have passed through the partition filter 44 cannot pass through.

[0118] exist Fig.10 In (a), a recovery container 46 with an upper opening is arranged in the centralized storage part Gc. A rectifying plate 47 is provided at the top of the centralized storage part Gc between the recovery opening Pca of the centralized negative pressure supply pipe Pc and the partition filter 44, and the rectifying plate 47 prevents the chips Ts entering the centralized storage part Gc from the recovery opening Pca from being directly attracted in the direction of the partition filter 44.

[0119] When the negative pressure supply unit NP is operated, the air in the centralized storage unit Gc is discharged to the negative pressure supply chamber 42 via the partition filter 44. As a result, negative pressure is generated in the centralized storage unit Gc, and the chips Ts stored in the production line storage units G(1) to G(3) are recovered to the centralized storage unit Gc through the centralized negative pressure supply pipe Pc and the production line negative pressure supply pipes P1 to P3 (arrow k). The chips Ts recovered to the centralized storage unit Gc are recovered to the recovery container 46. The air discharged from the centralized storage unit Gc to the negative pressure supply chamber 42 is discharged to the outside of the chip recovery device 40 via the exhaust filter 45.

[0120] exist Fig.10 In (b), a centralized storage section recovery opening Gca connected to the centralized storage section Gc is formed on the side of the chip recovery device 40. When the chip recovery device 40 is in operation, the centralized storage section recovery opening Gca is closed by the centralized storage section recovery door 48. When recovering the chips Ts accumulated in the recovery container 46, the operator opens the centralized storage section recovery door 48 in a state where the negative pressure supply part NP is stopped, and takes out the recovery container 46 from the centralized storage section recovery opening Gca. In addition, the operator returns the empty recovery container 46 to the centralized storage section Gc and closes the centralized storage section recovery door 48. In this way, the centralized storage section Gc has a centralized storage section recovery door 48 (second door) for taking out the chips Ts from the centralized storage section Gc.

[0121] exist Figure 1 As described above, the production line negative pressure supply pipes P1 to P3 and the centralized negative pressure supply pipe Pc of this embodiment are tubular recovery paths P in which the production line openings Pa1 to Pa3 are connected to the production line storage parts G(1) to G(3), and the recovery opening Pca is connected to the centralized storage part Gc. In addition, the component assembly system 1 (chip recovery system) includes a plurality of production line storage parts G(1) to G(3), and the plurality of production line storage parts G(1) to G(3) are respectively provided in the plurality of production lines L1 to L3.

[0122] Furthermore, the recovery path P has a first path (centralized negative pressure supply pipe Pc) and a plurality of second paths (production line negative pressure supply pipes P1 to P3) branching from the first path. The first path has a recovery opening Pca, and the plurality of second paths have production line openings Pa1 to Pa3, respectively. The plurality of production line openings Pa1 to Pa3 are respectively connected to the plurality of production line storage parts G(1) to G(3).

[0123] exist Fig.10In the embodiment, the centralized storage section Gc and the negative pressure supply section NP constitute a recovery unit Q for recovering the chips Ts accommodated in the production line storage sections G(1) to G(3) to the centralized storage section Gc by means of negative pressure. The centralized storage section Gc is connected to the production line openings Pa1 to Pa3 and to the recovery opening Pca of the tubular recovery path P of the production line storage sections G(1) to G(3). The negative pressure supply section NP supplies negative pressure from the recovery opening Pca to the recovery path P, thereby transporting the chips Ts accommodated in the production line storage sections G(1) to G(3) to the centralized storage section Gc.

[0124] exist Figure 1 In the embodiment, the production line storage sections G(1) to G(3) are provided in production lines L1 to L3 including component assembly devices M1 to M3 having a belt feeder 6, and are provided at positions where the chips Ts can be recovered from the production line storage sections G(1) to G(3) to the centralized storage section Gc through the recovery path P using the negative pressure generated by the negative pressure supply section NP. That is, the length of the recovery path P from the centralized storage section Gc to the production line storage sections G(1) to G(3) is set in consideration of the negative pressure supply capacity of the negative pressure supply section NP. That is, the production line storage sections G(1) to G(3) are provided at positions accessible to the recovery unit Q. Thus, the chips Ts of the belt components T discharged from the production lines L1 to L3 can be appropriately recovered to the centralized storage section Gc.

[0125] exist Figure 1 In the centralized negative pressure supply pipe Pc (first path), a centralized valve Vc is provided between the branch to the production line negative pressure supply pipes P1 to P3 (second path) and the centralized storage section Gc. In addition, in the plurality of production line negative pressure supply pipes P1 to P3 (second paths), production line valves Vb (1) to Vb (3) are provided between the branch from the centralized negative pressure supply pipe Pc (first path) and the production line storage sections G (1) to G (3), respectively. The opening and closing of the production line valves Vb (1) to Vb (3) are controlled by a first control section 51 provided in the system control device 50. The opening and closing of the centralized valve Vc is controlled by a second control section 52 provided in the system control device 50 ( Fig.11 ).

[0126] Thus, the recovery path P includes a valve (centralized valve Vc) provided in the first path (centralized negative pressure supply pipe Pc) and valves (production line valves Vb(1) to Vb(3)) provided in the plurality of second paths (production line negative pressure supply pipes P1 to P3). In addition, the component assembly system 1 (chip recovery system) includes a first control unit 51 for controlling the opening and closing of the valves (production line valves Vb(1) to Vb(3)) provided in the plurality of second paths (production line negative pressure supply pipes P1 to P3), and a second control unit 52 for controlling the opening and closing of the valve (centralized valve Vc) provided in the first path (centralized negative pressure supply pipe Pc). It should be noted that the valves (production line valves Vb(1) to Vb(3)) do not need to be provided in all the second paths (production line negative pressure supply pipes P1 to P3), and may be provided in at least one of the plurality of second paths. As another embodiment, all the second paths (line negative pressure supply pipes P1 to P3) may be configured not to include valves (line valves Vb(1) to Vb(3)).

[0127] In addition, the chip conveying device 30 for conveying the chips Ts of the belt component T discharged from the belt feeder 6 has a conveying section D for conveying the chips Ts, and a production line storage section G(1) to G(3) for storing the chips Ts conveyed by the conveying section D. Furthermore, the production line storage sections G(1) to G(3) are provided in production lines L1 to L3 including component assembly devices M1 to M3 having the belt feeder 6, and are provided at a position accessible to a chip recovery device 40 (recovery unit Q) for recovering the chips Ts stored in the production line storage sections G(1) to G(3) of the chip conveying device 30 to the centralized storage section Gc by negative pressure. Thus, the chips Ts of the belt component T discharged from the production lines L1 to L3 can be appropriately recovered to the centralized storage section Gc.

[0128] In addition, the chip recovery device 40 for recovering the chips Ts of the belt component T discharged from the belt feeder 6 to the centralized storage section Gc has a recovery unit Q for recovering the chips Ts by negative pressure. Furthermore, the production line storage sections G(1) to G(3) of the chip transport device 30 having a transport section D for transporting the chips Ts and production line storage sections G(1) to G(3) for storing the chips Ts transported by the transport section D are provided in production lines L1 to L3 including component assembly devices M1 to M3 having the belt feeder 6, and the chip recovery device 40 (recovery unit Q) is provided at a position that can access the production line storage sections G(1) to G(3). Thus, the chips Ts of the belt component T discharged from the production lines L1 to L3 can be appropriately recovered to the centralized storage section Gc.

[0129] In addition, the component assembly system 1 is a chip recovery system, which includes: a chip conveying device 30 having a conveying section D for conveying chips Ts of the belt component T discharged from the belt feeder 6 and a production line storage section G(1) to G(3) for storing the chips Ts conveyed by the conveying section D; and a chip recovery device 40 (recovery unit Q) for recovering the chips Ts stored in the production line storage section G(1) to G(3) to the centralized storage section Gc by negative pressure. In addition, the production line storage section G(1) to G(3) is provided in the production lines L1 to L3 including the component assembly devices M1 to M3 having the belt feeder 6, and is provided at a position accessible to the chip recovery device 40 (recovery unit Q). As a result, the chips Ts of the belt component T discharged from the production lines L1 to L3 can be appropriately recovered to the centralized storage section Gc.

[0130] Next, refer to Figure 11 to Figure 13 Next, a chip recovery method for recovering the chips Ts of the tape member T discharged from the tape feeder 6 into the concentrated storage portion Gc using the component assembly system 1 (chip recovery system) will be described.

[0131] exist Fig.11 In the embodiment, the system control device 50 of the component assembly system 1 includes a first control unit 51, a second control unit 52, and a determination unit 53. The first control unit 51 controls the opening and closing of the line valves Vb(1) to Vb(3), the pipeline valves Vdf(1) to Vdf(3), Vdr(1) to Vdr(3), the trolley valves Vtf1(1) to Vtf3(3), and Vtr1(1) to Vtr3(3) of the production lines L1 to L3.

[0132] The second control unit 52 controls the opening and closing of the centralizing valve Vc and the negative pressure supply unit NP of the chip recovery device 40. The determination unit 53 determines the amount of chips Ts stored in the line storage units G(1) to G(3) based on signals sent from the position detection units Sp(1) to Sp(3) (detection units) and the weight measurement units Sw(1) to Sw(3) (measurement units) of the line storage units G(1) to G(3) provided in the lines L1 to L3.

[0133] Fig.12 The timing diagram of the chip recovery method is to transport the chips Ts of the tape member T discharged from the tape feeder 6 to the production line storage parts G(1) to G(3) (storage parts) by the feeder carriage 4 and the chip transport device 30. Here, the conveying part D on the front side of the chip transport device 30 of the production line L1 and the feeder carriage 4 are taken as an example. Figure 7 to Figure 9 The following describes the conveyance of the chips Ts by the chip conveyance device 30. The conveyance unit D and the feeder carriage 4 at the rear side of the line L1 and the chip conveyance devices 30 of the other lines L2 to L3 are similar, and their description is omitted.

[0134] exist Fig.12 During the period of conveying the chips Ts to the production line storage section G (1), the negative pressure supply section NP is operated by the second control section 52, and the centralized valve Vc is also opened. That is, negative pressure is supplied from the chip recovery device 40 to the production line valve Vb (1). In addition, when the chip conveying device 30 does not convey the chips Ts (for example, after time T0 to T1 and time T7), the production line valve Vb (1), the pipeline valve Vdf (1), and the trolley valves Vtf1 (1) to Vtf3 (1) are all closed. During this period, in the discharge section 23 of the feeder trolley 4, the chips Ts fall to the receiving section 18 through the chute 16 ( Figure 7 The arrow b of (a) Figure 8 (a)).

[0135] exist Fig.12 In the process, the first control unit 51 opens the carriage valve Vtf1 (1) of the component mounting device M1 between the time T1 and the time T2, and ejects air from the air ejection unit 22 ( Figure 7 (b) Figure 8 (b)). As a result, the chips Ts discharged from the discharge opening 18b are pushed out to the main conduit Dm through the sub-conduit Ds. The first control unit 51 closes the carriage valve Vtf1 (1) at time T2.

[0136] Next, the first control unit 51 opens the production line valve Vb(1) and the pipe valve Vdf(1) between time T2 and time T3. As a result, while air is ejected from the positive pressure opening and closing unit 31 to the main pipe Dm, negative pressure is supplied to the skirt 34 of the production line storage section G(1) through the production line negative pressure supply pipe P1. As a result, the chips Ts in the main pipe Dm are transported to the production line storage section G(1) ( Figure 8 The arrow g of (c) Fig. 9 In addition, the chips Ts recovered in the production line storage section G (1) are sucked toward the chip recovery device 40 by the negative pressure supplied from the production line negative pressure supply pipe P1 ( Fig. 9 (a) (arrow i). The first control unit 51 closes the production line valve Vb(1) and the pipeline valve Vdf(1) at time T3.

[0137] exist Fig.12Similarly, between time T3 and time T4, the first control unit 51 opens the carriage valve Vtf2 (1) of the component assembly device M2 to eject air from the air ejection unit 22, and pushes the chips Ts ejected from the discharge opening 18b into the main pipe Dm. Next, between time T4 and time T5, the first control unit 51 opens the production line valve Vb (1) and the pipe valve Vdf (1) to eject air from the positive pressure opening and closing unit 31 into the main pipe Dm, and transports the chips Ts in the main pipe Dm to the production line storage unit G (1). Then, similarly, the first control unit 51 pushes the chips Ts of the component assembly device M3 into the main pipe Dm (time T5-T6), and transports the chips Ts in the main pipe Dm to the production line storage unit G (1) (time T6-T7).

[0138] In this way, the first control unit 51 opens and closes the carriage valves Vtf1(1) to Vtf3(1) in sequence to eject air from the air ejection unit 22 and push the chips Ts into the main pipeline Dm. That is, the discharge unit 23 ejects air in the direction toward the discharge opening 18b. Furthermore, the first control unit 51 transports the chips Ts located in the main pipeline Dm to the production line storage unit G(1) by opening and closing the production line valve Vb(1) and the pipeline valve Vdf(1). That is, the chip transport device 30 recovers the chips Ts discharged from the discharge opening 18b to the production line storage unit G(1) through the transport unit D (pipeline). In this way, by opening and closing the carriage valves Vtf1(1) to Vtf3(1) in sequence, the positive pressure supplied by the positive pressure supply device 41 can be used efficiently.

[0139] Fig.13 1 is a timing chart of a chip recovery method for recovering chips Ts stored in the line storage sections G(1) to G(3) of the lines L1 to L3 to the centralized storage section Gc of the chip recovery device 40. Fig.12 The method shown in the figure sequentially pushes the chips Ts discharged from the component assembly devices M1 to M3 into the main pipeline Dm of the conveying section D. For example, in the production line L1, except for the time period between the time T11 and the time T12 when the production line valve Vb(1) and the pipeline valve Vdf(1) are opened, the first control unit 51 sequentially opens and closes the carriage valves Vtf1(1) to Vtf3(1) and Vtr1(1) to Vtr3(1), so that air is ejected from the air ejection unit 22 to push the chips Ts into the main pipeline Dm.

[0140] exist Fig.13In the embodiment, when the chip recovery device 40 recovers the chips Ts to the centralized storage part Gc (time T10-T15), the negative pressure supply part NP is operated by the second control part 52, and the centralized valve Vc is also opened. In addition, the first control part 51 controls the line valves Vb(1)-Vb(3) respectively provided in the plurality of line negative pressure supply pipes P1-P3 (second paths) so as to open and close them in sequence.

[0141] For example, between time T11 and time T12, the first control unit 51 opens the line valve Vb(1) and the pipeline valves Vdf(1) and Vdr(1) of the line L1, and closes the line valves Vb(2) and Vb(3) and the pipeline valves Vdf(2), Vdr(2), Vdf(3) and Vdr(3) of the other lines L2 and L3. Thus, negative pressure (Vdr) is supplied only to the line storage section G(1) of the line L1 through the line negative pressure supply pipe P1. Fig. 9 In addition, positive pressure is supplied from the positive pressure opening and closing unit 31 to the main pipe Dm of the conveying unit D of the production line L1 ( Fig. 9 As a result, the chips Ts in the main pipeline Dm are transported to the production line storage section G(1), and are recovered to the centralized storage section Gc through the production line negative pressure supply pipe P1 and the centralized negative pressure supply pipe Pc ( Fig.10 (a) arrow k).

[0142] Similarly, the first control unit 51 opens the line valve Vb(2) and pipeline valves Vdf(2) and Vdr(2) of the production line L2 between time T12 and time T13, and closes the line valves Vb(1) and Vb(3) and pipeline valves Vdf(1), Vdr(1), Vdf(3), and Vdr(3) of the other production lines L1 and L3. As a result, the chips Ts are recovered from the production line L2 to the centralized storage section Gc. In addition, the first control unit 51 opens the line valve Vb(3) and pipeline valves Vdf(3) and Vdr(3) of the production line L3 between time T13 and time T14, and closes the line valves Vb(1) and Vb(2) and pipeline valves Vdf(1), Vdr(1), Vdf(2), and Vdr(2) of the other production lines L1 and L2. As a result, the chips Ts are recovered from the production line L3 to the centralized storage section Gc.

[0143] Thus, in the chip recovery method of the present embodiment, the conveying section D of the chip conveying device 30 conveys the chips Ts to the production line storage sections G(1) to G(3), and the chip recovery device 40 recovers the chips Ts conveyed to the production line storage sections G(1) to G(3) to the centralized storage section Gc by negative pressure. Thus, the chips Ts of the belt member T discharged from the production lines L1 to L3 can be properly recovered. In addition, the first control section 51 controls the production line valves Vb(1) to Vb(3) in a sequentially open and closed manner, and the negative pressure supplied by the negative pressure supply section NP can be efficiently used.

[0144] exist Fig.13 In the embodiment, when the chips Ts are taken out from the centralized storage section Gc (time T15-T16), the second control section 52 stops the negative pressure supply section NP and closes the centralized valve Vc provided in the centralized negative pressure supply pipe Pc (first path). As a result, the pressure in the centralized storage section Gc becomes the same as the pressure outside the chip recovery device 40. In addition, it is also possible to prevent the chips Ts from falling from the centralized negative pressure supply pipe Pc to the centralized storage section Gc. In this state, the operator can recover the chips Ts by opening the centralized storage section recovery door 48 (second door) and taking out the recovery container 46 from the centralized storage section recovery opening Gca. In this way, when the chips Ts are taken out from the centralized storage section Gc, the negative pressure supply section NP stops.

[0145] It should be noted that in Fig.13 In the embodiment, the first control unit 51 sequentially collects the chips Ts from the production lines L1 to L3 at a predetermined time, but the chip collection method is not limited to this method. For example, when the amount of chips Ts collected by the production line storage parts G(1) to G(3) of the production lines L1 to L3 exceeds a predetermined threshold value, the first control unit 51 may open and close the production line valves Vb(1) to Vb(3) and the pipeline valves Vdf(1) to Vdf(3) and Vdr(1) to Vdr(3) in such a manner that the chips Ts are collected from the production line storage parts G(1) to G(3).

[0146] In this case, the judgment unit 53 judges from which production line storage section G(1) to G(3) the chips Ts are to be recovered based on the information received from the position detection units Sp(1) to Sp(3) or weight measurement units Sw(1) to Sw(3) provided in the production line storage sections G(1) to G(3).

[0147] For example, when the position detection unit Sp(1) (detection unit) of the production line storage unit G(1) detects the chips Ts (detects that the chips Ts have reached a predetermined height), the judgment unit 53 sends a command to the first control unit 51 to recover the chips Ts from the production line storage unit G(1). In addition, when the judgment unit 53 determines that the weight of the chips Ts in the production line storage unit G(1) measured by the weight measurement unit Sw(1) (measurement unit) reaches a predetermined value or more, the judgment unit 53 sends a command to the first control unit 51 to recover the chips Ts from the production line storage unit G(1). The first control unit 51 that receives the command controls the valve so that negative pressure is supplied from the chip recovery device 40 to the recovery path P connected to the production line storage unit G(1), and positive pressure is supplied to the main pipeline Dm of the production line L1.

[0148] In this way, by opening the corresponding production line valves Vb(1) to Vb(3) only when the chips Ts are recovered from the production line storage parts G(1) to G(3), the negative pressure supplied by the negative pressure supply part NP can be used efficiently. In addition, the second control part 52 can also be controlled in a manner that the negative pressure supply part NP is operated and the central valve Vc is opened only when the chips Ts are recovered from the production line storage parts G(1) to G(3). That is, the second control part 52 can also control the negative pressure supply part NP and the central valve Vc provided in the central negative pressure supply pipe Pc (first path) in a manner that intermittently supplies negative pressure to the recovery path P. In this way, the power consumption based on the negative pressure supply part NP can be reduced.

[0149] Industrial Applicability

[0150] The chip recovery system, chip conveying device, chip recovery device, and chip recovery method of the present invention have the effect of being able to appropriately recover chips of a member with a component discharged from a production line, and are useful in the field of mounting components on a substrate.

Claims

1. A chip recovery system, wherein: The chip recovery system comprises: a chip conveying device including a conveying portion for conveying chips of a tape member discharged from a tape feeder and a line storage portion for storing the chips conveyed by the conveying portion; and A chip recovery device recovers the chips stored in the production line storage section to a centralized storage section by negative pressure. The line storage section is provided in a production line including a component assembly device having the tape feeder, and is provided at a position accessible to the chip recovery device.

2. The chip recovery system according to claim 1, wherein: The chip recovery device is arranged separately from the production line. The chip recovery system has: The centralized storage section is connected to a recovery opening of a tubular recovery path of the production line opening connected to the production line storage section; and A negative pressure supplying unit supplies negative pressure from the recovery opening to the recovery path, thereby conveying the chips stored in the line storage unit to the centralized storage unit.

3. The chip recovery system according to claim 2, wherein: The chip recovery system comprises a plurality of production line storage sections. The plurality of production line storage parts are respectively arranged on the plurality of production lines. The recovery path includes a first path and a plurality of second paths branching from the first path. The first path has the recovery opening, The plurality of second paths respectively have the production line openings, The plurality of production line openings are respectively connected to the plurality of production line accommodating portions.

4. The chip recovery system according to claim 3, wherein: The chip recovery system further includes a valve provided on the first passage.

5. The chip recovery system according to claim 3, wherein: The chip recovery system further includes a valve provided in at least one of the plurality of second passages.

6. The chip recovery system according to claim 5, wherein: The chip recovery system further includes valves provided in the plurality of second passages, respectively.

7. The chip recovery system according to claim 6, wherein: The chip recovery system further includes a first control unit configured to control the valves so as to sequentially open and close the valves respectively provided in the plurality of second passages.

8. The chip recovery system according to claim 3, wherein: The chip recovery system further includes a second control unit that controls the negative pressure supply unit and the valve provided in the first passage so that negative pressure is intermittently supplied to the recovery passage.

9. The chip recovery system according to claim 7, wherein: The production line storage section includes a measuring section for measuring the weight of the chips in the production line storage section. The first control unit performs control so that negative pressure is supplied to the recovery path when the weight measured by the measuring unit is equal to or greater than a predetermined value.

10. The chip recovery system according to claim 7, wherein: The line storage section includes a detection section for detecting the chips at a predetermined height in the line storage section. The first control unit performs control so that a negative pressure is supplied to the recovery path when the detection unit detects the chips.

11. The chip recovery system according to claim 2, wherein: The line storage section includes a first door for taking out the chips from the line storage section.

12. The chip recovery system according to any one of claims 2 to 7, wherein: The concentrated storage section includes a second door for taking out the chips from the concentrated storage section, and the negative pressure supply section is stopped when the chips are taken out from the concentrated storage section.

13. The chip recovery system according to any one of claims 4 to 7, wherein: The centralized storage section has a second door for taking out the chips from the centralized storage section. When the chips are taken out from the concentrated storage portion, the negative pressure supply portion is stopped and the valve provided on the first passage is closed.

14. The chip recovery system according to any one of claims 2 to 7, wherein: A filter is provided between the centralized storage portion and the space where the negative pressure supply portion is provided. The chips having a size larger than a predetermined size do not pass through the filter and are retained in the concentrated storage portion.

15. The chip recovery system according to claim 14, wherein: The chip recovery device includes a mounting portion on which the filter can be slidably mounted.

16. The chip recovery system according to any one of claims 2 to 7, wherein: The centralized storage section is provided at a first site where the component mounting device is provided or at a second site different from the first site.

17. The chip recovery system according to claim 16, wherein: The centralized storage section is provided in a region having an entrance of a building where the component assembly device is installed.

18. The chip recovery system according to any one of claims 1 to 7, wherein: The conveying section conveys the chips discharged from the tape feeder to the line storage section by positive pressure.

19. A chip conveying device for conveying chips of a belt member discharged from a belt feeder, wherein: The chip transport device comprises: a transporting portion that transports the chips; and a production line storage section for storing the chips transported by the transport section, The production line storage section is provided in a production line including a component assembly device having the tape feeder, and is provided at a position accessible by a chip recovery device that recovers the chips stored in the production line storage section of a chip transport device to a centralized storage section by negative pressure.

20. A chip recovery device for recovering chips of a belt member discharged from a belt feeder into a centralized storage portion, wherein: The production line storage part of the chip conveying device having a conveying part for conveying the chips and a production line storage part for storing the chips conveyed by the conveying part is provided in a production line including a component assembly device having the tape feeder, The chip recovery device is provided at a position accessible to the production line storage section, and recovers the chips to the centralized storage section by negative pressure.

21. A chip recovery method for recovering chips of a tape member discharged from a tape feeder into a centralized storage portion, wherein: The production line storage part of the chip conveying device having a conveying part for conveying the chips and a production line storage part for storing the chips conveyed by the conveying part is provided in a production line including a component assembly device having the tape feeder. In a state where a chip recovery device for recovering the chips stored in the production line storage section by negative pressure is arranged at a position that can access the production line storage section, The conveying unit conveys the chips to the production line storage unit. The chip recovery device is caused to recover the chips conveyed to the line storage section into the concentrated storage section by the negative pressure.

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