Quartz wafer polishing device and method

Abstract

The present application relates to a quartz wafer polishing device and method, belonging to the technical field of polishing equipment, which includes a frame, a lower grinding tool and an upper grinding tool are provided on the frame, a lifting member for lifting the upper grinding tool is provided on the frame, a driving assembly for driving the lower grinding tool and the upper grinding tool to rotate is also provided on the frame, a loading assembly for conveying quartz wafers is also provided on the frame, the loading assembly includes a base rotatably connected to the frame, a rotating rod is provided on the base, a feeding rod is provided on the rotating rod, and a tray for holding quartz wafers is provided at one end of the feeding rod away from the rotating rod. The present application has the effect of improving the polishing efficiency of quartz wafers.

Description

Technical Field

[0001] The present application relates to the field of wafer preparation, and in particular to a quartz wafer polishing device and method. Background Art

[0002] The high integration of semiconductors has increased the processing and storage capacity of information per unit area. This has led to the demand for large-diameter semiconductor wafers, miniaturization of circuit wiring widths, and multi-layer wiring. In order to form multi-layer wiring on a semiconductor wafer, the wafer is required to have a high degree of flatness. In order to achieve such a high degree of flatness, a wafer flattening process is required.

[0003] One of the wafer flattening processes is the wafer polishing process. Among them, the double-sided ultra-thin wafer polishing process uses two large plates to sandwich a planetary wheel, fix the quartz wafer on the planetary wheel, and drive the quartz wafer to act on the polishing pad through the reverse rotation of the large plates and the self-rotation of the planetary wheel. At this time, the chemically alkaline polishing liquid contacts the surface of the quartz wafer to cause a corrosion reaction. The surface of the quartz wafer will be corroded by the alkaline solution, and the corrosion layer will be removed by friction with the polishing pad. By cycling these two action processes, the polishing of the quartz wafer can be achieved.

[0004] However, the quartz wafers are manually placed on the planetary wheel piece by piece, and since the quartz wafers are relatively thin, it is difficult to achieve a fast and accurate effect by manual placement, thus reducing the efficiency of the quartz wafer polishing process. Summary of the invention

[0005] In order to improve the polishing efficiency of quartz wafers, the present application provides a quartz wafer polishing device and method.

[0006] The present application provides a quartz wafer polishing device and method using the following technical solutions:

[0007] In a first aspect, the present application provides a quartz wafer polishing device, which adopts the following technical solution:

[0008] A quartz wafer polishing device comprises a frame, on which a lower grinding tool and an upper grinding tool are arranged, on which a lifting member for lifting the upper grinding tool is arranged, on which a driving assembly for driving the lower grinding tool and the upper grinding tool to rotate is also arranged, on which a loading assembly for conveying quartz wafers is also arranged, and the loading assembly comprises a base rotatably connected to the frame, on which a rotating rod is arranged, on which a feeding rod is arranged, and on which an end of the feeding rod away from the rotating rod is arranged a tray for holding quartz wafers.

[0009] By adopting the above technical solution, the lifting member drives the upper mold to rise, the base rotates, and the rotating rod rotates, thereby driving the feeding rod to rotate. The feeding rod transfers the tray to between the upper mold and the lower mold, thereby quickly transferring the quartz wafer on the tray to between the upper mold and the lower mold, which is convenient for unloading the quartz wafer. The lifting member drives the upper mold to move toward the lower mold until the upper mold and the lower mold clamp the quartz wafer. The driving assembly drives the upper mold and the lower mold to rotate in opposite directions, thereby polishing and grinding the quartz wafer, thereby enabling rapid filling and polishing of the quartz wafer, thereby improving the polishing efficiency of the quartz wafer.

[0010] Optionally, the lower grinding tool includes an inner gear ring rotatably connected to the frame, the inner side of the inner gear ring is provided with an annular lower polishing pad rotatably connected to the frame, the inner side of the lower polishing pad is provided with a rotating shaft rotatably connected to the frame, the rotating shaft is provided with a driving gear opposite to the inner gear ring, the lower polishing pad is provided with a planetary wheel meshing with both the inner gear ring and the driving gear, the planetary wheel is provided with a limiting hole for limiting the position of the quartz wafer, the upper grinding tool includes an upper polishing pad arranged opposite to the lower polishing pad, the upper polishing pad is connected to the lifting member, and a clamping member is provided between the upper polishing pad and the rotating shaft.

[0011] By adopting the above technical solution, when the upper polishing pad and the lower polishing pad cooperate to clamp the quartz wafer, the clamping piece connects the upper polishing pad to the rotating shaft. When the rotating shaft rotates, the rotating shaft drives the upper polishing pad to rotate synchronously through the clamping piece. At the same time, the rotating shaft drives the planetary wheel to rotate, the planetary wheel drives the inner gear ring to rotate, and the planetary wheel drives the quartz wafer to rotate. Therefore, the upper polishing pad and the lower polishing pad polish both sides of the quartz wafer at the same time, thereby improving the polishing efficiency and effect of the quartz wafer.

[0012] Optionally, a clamping groove parallel to the axis of the rotating shaft is formed on the rotating shaft, and the clamping member includes a rotating block rotatably connected to the upper polishing pad, and the rotating block is provided with a clamping block inserted into the clamping groove.

[0013] By adopting the above technical solution, the angle of the rotating block is adjusted, and then whether the clamping block is inserted in the clamping slot is adjusted. When the clamping block is inserted in the clamping slot, the rotating shaft drives the upper polishing pad to rotate through the clamping block. When the clamping block is out of the clamping slot, the rotating shaft is separated from the upper polishing pad.

[0014] Optionally, a supporting groove is provided on the inner side of the tray, the planetary wheel is snap-fitted in the supporting groove, a first suction hole for fixing the planetary wheel and a second suction hole aligned with the limiting hole are provided at the bottom of the supporting groove, a connecting block is rotatably connected to the feeding rod, the connecting block is slidably connected to the rotating rod, and a driving member is provided on the base for driving the connecting block to slide and the feeding rod to rotate.

[0015] By adopting the above technical solution, when the planetary wheel is located inside the supporting groove and the chip is placed in the limiting hole of the planetary wheel, the first suction hole and the second suction hole simultaneously absorb the planetary wheel and the chip, the planetary wheel and the chip are fixed in the supporting groove, the base is rotated, and the rotating rod and the feeding rod are driven to rotate simultaneously, the feeding rod moves the tray between the upper polishing pad and the lower polishing pad, the driving member drives the feeding rod to rotate 180°, so that the planetary wheel and the chip are facing the lower polishing pad, the driving member drives the connecting block to slide along the rotating rod again, so that the planetary wheel and the chip are close to the lower polishing pad, the first suction hole and the second suction hole release the planetary wheel and the chip, the planetary wheel and the chip fall vertically onto the lower polishing pad, and the planetary wheel is simultaneously engaged between the driving gear and the inner ring gear, thereby quickly filling the chip on the lower polishing pad.

[0016] Optionally, the frame is provided with a filling mechanism for filling quartz wafers into the supporting groove, the filling mechanism comprising a support rod arranged on the frame, the support rod being provided with a shell for accommodating a stack of quartz wafers, the lower end of the shell being provided with a through hole penetrating the shell, one end of the through hole being provided with a cylinder mounted on the shell, and the other end being provided with a guide member, the piston rod of the cylinder being provided with a push plate for penetrating into the through hole and pushing the quartz wafer out of the through hole, the guide member comprising a guide plate arranged below the through hole, the guide plate being provided with a guide groove for the quartz wafer to slide, the end of the guide plate away from the shell being located above the tray, the end of the guide plate close to the tray being provided with a guide rod, the guide rod being located above the planetary wheel, the tray being rotatably connected to the feeding rod, when the quartz wafer is located above the planetary wheel, the quartz wafer abuts against the guide rod, and when the quartz wafer is located in the limiting hole, the quartz wafer is located below the guide rod.

[0017] By adopting the above technical solution, a stack of quartz wafers is placed in the shell, and the cylinder is extended and retracted, thereby driving the push plate to push the quartz wafer out of the through hole. After passing through the through hole, the quartz wafer falls into the guide groove and slides along the guide groove to the top of the planetary wheel on the tray. The tray rotates until the quartz wafer abuts against the guide rod and, driven by the tray, moves along the length direction of the guide rod until the quartz wafer falls into the limiting hole of the planetary wheel, thereby enabling the planetary wheel to be quickly and conveniently filled with quartz wafers, thereby improving the loading efficiency.

[0018] Optionally, the guide rod is inclined on a horizontal plane in a direction away from the guide plate, and the end of the guide rod away from one end of the guide plate is configured as a groove and is coordinated with the quartz wafer and the limiting hole, and a vibration motor is provided on the guide plate.

[0019] By adopting the above technical solution, the vibration motor drives the guide plate and the guide rod to vibrate quickly and with a small amplitude, so that the quartz wafer can move quickly along the direction of the guide groove and the guide rod, thereby improving the efficiency of the quartz wafer entering the limiting hole.

[0020] Optionally, a one-way component is provided between the base and the inner gear ring, the one-way component includes a pawl rotatably connected to the base, a coaxial ratchet is provided on the outer side of the inner gear ring, and an elastic member is also provided between the pawl and the base.

[0021] By adopting the above technical solution, after the quartz wafers are loaded on the tray, the tray moves to the top of the lower polishing pad as the base rotates, and the quartz wafers and the planetary wheel on the tray are placed on the lower polishing pad, and then the tray returns to its original position. During this process, the base drives the ratchet wheel to rotate through the pawl, so that each time the tray reaches the same position, there is space on the lower polishing pad for placing the planetary wheel and the quartz wafers, so there is no need for manual operation, and loading is fast and convenient.

[0022] Optionally, the driving assembly includes a rotating gear disposed below the lower polishing pad, the rotating gear meshing with the driving gear and the inner gear ring at the same time, the rotating gear being rotatably connected to the frame, and the frame being provided with a driving motor for driving the rotating gear.

[0023] By adopting the above technical solution, the driving motor drives the rotating gear to rotate, and the rotating gear drives the driving gear and the inner gear ring to rotate at the same time, and the driving gear and the inner gear ring rotate in opposite directions.

[0024] In a second aspect, the present application provides a quartz wafer polishing method, which adopts the following technical solution:

[0025] A quartz wafer polishing method comprises the following steps:

[0026] S100: the lifting member drives the upper polishing pad to rise, the base rotates, the tray moves to the top of the lower polishing pad, the feeding rod rotates, driving the tray to flip, and then the feeding rod descends, the suction port on the tray releases the planetary wheel and the quartz wafer, and the planetary wheel and the quartz wafer fall onto the lower polishing pad;

[0027] S200: The tray returns to the filling mechanism, the planetary wheel is placed in the supporting groove again, the cylinder pushes the quartz wafer into the guide groove, the vibration motor vibrates the guide plate, and the quartz crystal is transferred to the planetary wheel. The tray rotates, and the quartz wafer on the planetary wheel abuts against the guide rod and moves along the guide rod until it falls into the limiting hole of the planetary wheel;

[0028] S300: the upper polishing pad descends and presses the quartz wafer onto the lower polishing pad, and the driving assembly drives the upper polishing pad and the lower polishing pad to rotate in opposite directions to polish the quartz wafer;

[0029] S400: the upper polishing pad and the lower polishing pad are separated, and the planetary wheel and the polished quartz wafer are taken out;

[0030] S500: The tray moves again between the upper polishing plate and the lower polishing plate, and the one-way component drives the inner gear ring to rotate, thereby providing a placement position for the planetary wheel.

[0031] In summary, the present application includes at least one of the following beneficial technical effects:

[0032] When the planetary wheel is located inside the supporting groove, and the wafer is placed in the limiting hole of the planetary wheel, the first suction hole and the second suction hole simultaneously absorb the planetary wheel and the wafer, the planetary wheel and the wafer are fixed in the supporting groove, the rotating base drives the rotating rod and the feeding rod to rotate simultaneously, the feeding rod moves the tray between the upper polishing pad and the lower polishing pad, the driving member drives the feeding rod to rotate 180°, so that the planetary wheel and the wafer are facing the lower polishing pad, the driving member drives the connecting block to slide along the rotating rod again, so that the planetary wheel and the wafer are close to the lower polishing pad, the first suction hole and the second suction hole release the planetary wheel and the wafer, the planetary wheel and the wafer fall vertically onto the lower polishing pad, and the planetary wheel is simultaneously meshed between the driving gear and the inner gear ring, thereby quickly filling the wafer on the lower polishing pad;

[0033] The quartz wafer is placed in the housing, and the cylinder is extended and retracted, thereby driving the push plate to push the quartz wafer out of the through hole. After passing through the through hole, the quartz wafer falls into the guide groove, slides along the guide groove to the top of the planetary wheel on the tray, and the tray rotates until the quartz wafer abuts against the guide rod, and driven by the tray, moves along the length direction of the guide rod until the quartz wafer falls into the limiting hole of the planetary wheel, thereby quickly and conveniently filling the planetary wheel with quartz wafers, improving the loading efficiency;

[0034] After the quartz wafers are loaded on the tray, the tray moves to the top of the lower polishing pad as the base rotates, and the quartz wafers and planetary wheel on the tray are placed on the lower polishing pad. The tray then returns to its original position. During this process, the base drives the ratchet wheel to rotate through the pawl. Therefore, each time the tray reaches the same position, there is space on the lower polishing pad for placing the planetary wheel and quartz wafers. Therefore, no manual operation is required, and loading is fast and convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application.

[0036] Figure 2 It is a schematic diagram of the structure of a tray according to an embodiment of the present application.

[0037] Figure 3 It is a structural schematic diagram of a packing mechanism according to an embodiment of the present application.

[0038] Explanation of the reference numerals in the accompanying drawings: 1. frame; 2. lower grinding tool; 21. inner gear ring; 22. lower polishing pad; 23. rotating shaft; 231. clamping groove; 24. driving gear; 3. upper grinding tool; 31. upper polishing pad; 311. rotating block; 312. clamping block; 32. supporting frame; 4. planetary wheel; 41. limiting hole; 5. loading assembly; 51. base; 52. rotating rod; 53. feeding rod; 531. rotating motor; 54. tray; 541. supporting groove; 542. first suction hole; 543. second suction hole; 55. connecting block; 6. filling mechanism; 61. supporting rod; 62. housing; 63. cylinder; 631. push plate; 64. guide plate; 641. guide groove; 65. guide rod; 66. vibration motor; 7. one-way assembly; 71. pawl; 72. ratchet. DETAILED DESCRIPTION

[0039] The present application is further described in detail below in conjunction with the accompanying drawings.

[0040] The embodiment of the present application discloses a quartz wafer polishing device.

[0041] Reference Figure 1 and Figure 2 A quartz wafer polishing device includes a frame 1 on which a lower grinding tool 2 and an upper grinding tool 3 are provided, the frame 1 is provided with a lifting member for lifting the upper grinding tool 3, and the frame 1 is also provided with a driving assembly for driving the lower grinding tool 2 and the upper grinding tool 3 to rotate, the lower grinding tool 2 includes an inner gear ring 21 rotatably connected to the frame 1, the inner side of the inner gear ring 21 is provided with an annular lower polishing pad 22 installed on the frame 1, the inner side of the lower polishing pad 22 is provided with a rotating shaft 23 rotatably connected to the frame 1, the rotating shaft 23 is provided with a driving gear 24 opposite to the inner gear ring 21, the lower polishing pad 22 is provided with a planetary wheel 4 meshing with the inner gear ring 21 and the driving gear 24 at the same time, the planetary wheel 4 is provided with a limiting hole 41 for limiting the quartz wafer, the upper grinding tool 3 includes an upper polishing pad 31 arranged opposite to the lower polishing pad 22, the upper polishing pad 31 is connected to the lifting member, and a clamping member is provided between the upper polishing pad 31 and the rotating shaft 23.

[0042] When the upper polishing pad 31 and the lower polishing pad 22 cooperate to clamp the quartz wafer, the clamping piece connects the upper polishing pad 31 to the rotating shaft 23. When the rotating shaft 23 rotates, the rotating shaft 23 drives the upper polishing pad 31 to rotate synchronously through the clamping piece. At the same time, the rotating shaft 23 drives the planetary wheel 4 to rotate, and the planetary wheel 4 drives the inner gear ring 21 to rotate. At the same time, the planetary wheel 4 drives the quartz wafer to rotate, so that the upper polishing pad 31 and the lower polishing pad 22 polish both sides of the quartz wafer at the same time.

[0043] The rotating shaft 23 is provided with a clamping groove 231 arranged parallel to the axis of the rotating shaft 23, and the clamping member includes a rotating block 311 rotatably connected to the upper polishing pad 31, and a clamping block 312 inserted into the clamping groove 231 is fixed on the rotating block 311. When the rotating block 311 is facing the upper polishing pad 31, the rotating block 311 is rotated so that the clamping block 312 is inserted into the clamping groove 231. When the rotating shaft 23 rotates, the clamping block 312 rotates synchronously and drives the upper polishing pad 31 to rotate. When the clamping block 312 is separated from the clamping groove 231, the rotating shaft 23 is separated from the upper polishing pad 31.

[0044] The frame 1 is also provided with a loading assembly 5 for conveying quartz wafers. The loading assembly 5 includes a base 51 rotatably connected to the frame 1, a rotating rod 52 is provided on the base 51, a feeding rod 53 is provided on the rotating rod 52, and a tray 54 for holding quartz wafers is provided at one end of the feeding rod 53 away from the rotating rod 52. A rotating motor is provided inside the frame 1 to drive the base 51 to rotate.

[0045] The lifting member drives the upper mold 3 to rise, and the rotating motor drives the base 51 to rotate, driving the rotating rod 52 to rotate, thereby driving the feeding rod 53 to rotate, and the feeding rod 53 transfers the tray 54 to between the upper mold 3 and the lower mold 2, thereby quickly transferring the quartz wafer on the tray 54 to between the upper mold 3 and the lower mold 2, which is convenient for unloading the quartz wafer. The lifting member drives the upper mold 3 to move toward the lower mold 2 until the upper mold 3 and the lower mold 2 clamp the quartz wafer, and the driving assembly drives the upper mold 3 and the lower mold 2 to rotate in opposite directions, thereby polishing and grinding the quartz wafer.

[0046] The lifting member includes a fixed rod fixed on the frame 1, the fixed rod is arranged in an L shape, and one end of the fixed rod away from the frame 1 is fixedly connected to a vertically arranged hydraulic cylinder, the piston rod of the hydraulic cylinder is arranged vertically downward, and is fixedly connected to a support plate, the upper side of the support plate is abutted against a support frame 32, and the lower end of the support frame 32 is fixedly connected to the upper polishing pad 31.

[0047] The hydraulic cylinder contracts, and after the support plate abuts against the support frame 32, it continues to rise, and at the same time lifts the support frame 32 and the upper polishing pad 31, thereby separating the upper polishing pad 31 and the lower polishing pad 22, and then taking out the polished quartz wafer and placing the quartz wafer to be polished.

[0048] The driving assembly includes a driving motor disposed on the frame 1, and a rotating gear is fixedly connected to the output shaft of the driving motor. The rotating gear is located below the lower polishing pad 22, and the rotating gear is simultaneously meshed with the driving gear 24 and the inner gear ring 21. The driving motor drives the rotating gear to rotate, and the rotating gear simultaneously drives the driving gear 24 and the inner gear ring 21 to rotate. The driving gear 24 and the inner gear ring 21 rotate in opposite directions, so that the driving gear 24 and the inner gear ring 21 drive the planetary wheel 4 to rotate, so that the upper polishing pad 31 and the lower polishing pad 22 polish the quartz wafer simultaneously.

[0049] A supporting groove 541 which is coaxial with the tray 54 is formed on one side of the tray 54, and the planetary wheel 4 is snap-fitted into the supporting groove 541. A first suction hole 542 for fixing the planetary wheel 4 and a second suction hole 543 aligned with the limiting hole 41 are formed at the bottom of the supporting groove 541. When the planetary wheel 4 is located inside the supporting groove 541 and the chip is placed in the limiting hole 41 of the planetary wheel 4, the first suction hole 542 and the second suction hole 543 simultaneously absorb the planetary wheel 4 and the chip, and the planetary wheel 4 and the chip are fixed in the supporting groove 541.

[0050] The feed rod 53 is rotatably connected with a connecting block 55, which is slidably connected to the rotating rod 52. The feed rod 53 is horizontally perpendicular to the rotating rod 52, and a driving member for driving the connecting block 55 to slide and the feed rod 53 to rotate is provided on the base 51. The driving member includes an electric telescopic rod fixedly mounted on the base 51, the electric telescopic rod is arranged parallel to the rotating rod 52, and the electric telescopic rod connects the base 51 and the connecting block 55. A flip motor is provided inside the connecting block 55, and the flip motor is fixed coaxially with the feed rod 53.

[0051] When the planetary wheel 4 and the wafer are fixed in the supporting groove 541, the base is rotated to drive the rotating rod 52 and the feeding rod 53 to rotate simultaneously, and the feeding rod 53 moves the tray 54 to between the upper polishing pad 31 and the lower polishing pad 22. The flip motor drives the feeding rod 53 to rotate 180°, so that the planetary wheel 4 and the wafer are facing the lower polishing pad 22, and the electric telescopic rod drives the connecting block 55 to slide along the rotating rod 52, so that the planetary wheel 4 and the wafer are close to the lower polishing pad 22, and the first suction hole 542 and the second suction hole 543 release the planetary wheel 4 and the wafer, and the planetary wheel 4 and the wafer fall vertically onto the lower polishing pad 22, and the planetary wheel 4 is simultaneously engaged between the driving gear 24 and the inner gear ring 21, thereby quickly filling the wafer on the lower polishing pad 22.

[0052] Reference Figure 1 and Figure 3A filling mechanism 6 for filling quartz wafers into the supporting groove 541 is provided on the frame 1. The filling mechanism 6 includes a support rod 61 fixed on the frame 1. A shell 62 for accommodating a stack of quartz wafers is provided on the support rod 61. A through hole penetrating the shell 62 is opened at the lower end of the shell 62. A cylinder 63 installed on the shell 62 is provided at one end of the through hole, and a guide is provided at the other end. A push plate 631 is provided on the piston rod of the cylinder 63 to penetrate the through hole and push the quartz wafer out of the through hole.

[0053] The guide member includes a guide plate 64 fixedly connected to the shell 62, the guide plate 64 is located below the through hole, a guide groove 641 for the quartz wafer to slide is provided on the guide plate 64, the end of the guide plate 64 away from the shell 62 is located above the tray 54, and a guide rod 65 is provided at the end of the guide plate 64 close to the tray 54, and the guide rod 65 is located above the planetary wheel 4, the tray 54 is rotatably connected to the feeding rod 53, and a rotating motor 531 is installed below the feeding rod 53, and the rotating motor 531 is connected to the tray 54 through a bevel gear, thereby driving the tray 54 to rotate, when the quartz wafer is located above the planetary wheel 4, the quartz wafer abuts against the guide rod 65, and when the quartz wafer is located in the limiting hole 41, the quartz wafer is located below the guide rod 65.

[0054] The guide rod 65 is inclined on a horizontal plane in a direction away from the guide plate 64 , and the end of the guide rod 65 away from the guide plate 64 is configured as a groove shape and is matched with the quartz wafer and the limiting hole 41 . A vibration motor 66 is installed on the guide plate 64 .

[0055] A stack of quartz wafers is placed in the shell 62, and the cylinder 63 is extended and retracted, thereby driving the push plate 631 to push the quartz wafer out of the through hole. After the quartz wafer passes through the through hole, it falls into the guide groove 641. At this time, the vibration motor 66 drives the guide plate 64 and the guide rod 65 to vibrate quickly and slightly. Under the vibration, the quartz wafer slides along the guide groove 641 to the top of the planetary wheel 4 on the tray 54. The rotating motor 531 rotates the tray 54 until the quartz wafer abuts against the guide rod 65 and moves in the direction of the guide rod 65 until it enters the groove-shaped end of the guide rod 65, until the quartz wafer falls into the limiting hole 41 of the planetary wheel 4.

[0056] A one-way component 7 is provided between the base 51 and the inner gear ring 21. The one-way component 7 includes a pawl 71 rotatably connected to the base 51. A coaxial ratchet 72 is provided on the outer side of the inner gear ring 21. An elastic member is also provided between the pawl 71 and the base 51. The elastic member is configured as a torsion spring connecting the base 51 and the pawl 71.

[0057] After the quartz wafers are loaded on the tray 54, the tray 54 moves to the top of the lower polishing pad 22 as the base 51 rotates, and the quartz wafers and the planetary wheel 4 on the tray 54 are placed on the lower polishing pad 22. The tray 54 then returns to its original position. During this process, the base 51 drives the ratchet wheel 72 to rotate through the pawl 71. Therefore, each time the tray 54 reaches the same position, there is space on the lower polishing pad 22 for placing the planetary wheel 4 and the quartz wafers. Therefore, no manual operation is required, and loading is fast and convenient.

[0058] The working principle of the embodiment is as follows: the filling mechanism 6 is used to fill the tray 54 with quartz wafers. After the upper grinding tool 3 and the lower grinding tool 2 complete the polishing of a batch of quartz wafers and separate them, the base 51 rotates, and the planetary wheel 4 and the quartz wafers in the tray 54 are placed on the lower polishing pad 22 through the loading component 5, and then return to the original position. At this time, the inner gear ring 21 is driven to rotate through the one-way component 7, and the planetary wheel 4 on the lower polishing pad 22 is driven to move its position to make room for the next planetary wheel 4.

[0059] In a second aspect, the present application provides a quartz wafer polishing method, which adopts the following technical solution:

[0060] A quartz wafer polishing method comprises the following steps:

[0061] S100: The hydraulic cylinder drives the upper polishing pad 31 to rise, the base 51 rotates, the tray 54 moves to above the lower polishing pad 22, the feeding rod 53 rotates, driving the tray 54 to flip, and then the feeding rod 53 descends, the suction port on the tray 54 releases the planetary wheel 4 and the quartz wafer, and the planetary wheel 4 and the quartz wafer fall onto the lower polishing pad 22;

[0062] S200: the tray 54 returns to the filling mechanism 6, the planetary wheel 4 is placed in the supporting groove 541 again, the cylinder 63 pushes the quartz wafer into the guide groove 641, the vibration motor 66 vibrates the guide plate 64, and the quartz wafer is transferred to the planetary wheel 4. The tray 54 rotates, and the quartz wafer on the planetary wheel 4 abuts against the guide rod 65 and moves along the guide rod 65 until it falls into the limiting hole 41 of the planetary wheel 4.

[0063] S300: the upper polishing pad 31 descends and presses the quartz wafer onto the lower polishing pad 22, and the driving assembly drives the upper polishing pad 31 and the lower polishing pad 22 to rotate in opposite directions to polish the quartz wafer;

[0064] S400: the upper polishing pad 31 and the lower polishing pad 22 are separated, and the planetary wheel 4 and the polished quartz wafer are taken out;

[0065] S500: The tray 54 moves again between the upper polishing plate and the lower polishing plate, and the one-way component 7 drives the inner gear ring 21 to rotate, thereby providing a placement position for the planetary wheel 4.

[0066] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A quartz wafer polishing device, characterized in that: The invention comprises a frame, wherein a lower mold and an upper mold are arranged on the frame, a lifting member for lifting the upper mold is arranged on the frame, a driving assembly for driving the lower mold and the upper mold to rotate is also arranged on the frame, a loading assembly for conveying quartz wafers is also arranged on the frame, the loading assembly comprises a base rotatably connected to the frame, a rotating rod is arranged on the base, a feeding rod is arranged on the rotating rod, a tray for holding quartz wafers is arranged at one end of the feeding rod away from the rotating rod, the lower mold comprises an inner gear ring rotatably connected to the frame, and the inner side of the inner gear ring is provided with a gear connected to the frame rotatably The lower polishing pad is an annular shape, and a rotating shaft connected to the frame for rotation is arranged on the inner side of the lower polishing pad, and a driving gear opposite to the inner gear ring is arranged on the rotating shaft, and a planetary wheel meshing with the inner gear ring and the driving gear at the same time is arranged on the lower polishing pad, and a limiting hole for limiting the position of the quartz wafer is arranged on the planetary wheel; the upper grinding tool comprises an upper polishing pad arranged opposite to the lower polishing pad, and the upper polishing pad is connected to the lifting member, and a clamping member is arranged between the upper polishing pad and the rotating shaft, and a supporting groove is arranged on the inner side of the tray, and the planetary wheel is clamped and fitted in the supporting groove, and the bottom of the supporting groove is opened. A first suction hole for fixing the planetary wheel and a second suction hole aligned with the limit hole are provided, a connecting block is rotatably connected to the feeding rod, the connecting block is slidably connected to the rotating rod, a driving member for driving the connecting block to slide and the feeding rod to rotate is provided on the base, a filling mechanism for filling quartz wafers into the supporting groove is provided on the frame, the filling mechanism includes a supporting rod arranged on the frame, a shell for accommodating a stack of quartz wafers is provided on the supporting rod, a through hole penetrating the shell is opened at the lower end of the shell, a cylinder installed on the shell is provided at one end of the through hole, and a guide member is provided at the other end The piston rod of the cylinder is provided with a push plate that penetrates into the through hole and pushes the quartz wafer out of the through hole. The guide member includes a guide plate arranged below the through hole. A guide groove for the quartz wafer to slide is provided on the guide plate. The end of the guide plate away from the shell is located above the tray. A guide rod is provided at the end of the guide plate close to the tray. The guide rod is located above the planetary wheel. The tray is rotatably connected to the feeding rod. When the quartz wafer is located above the planetary wheel, the quartz wafer abuts against the guide rod. When the quartz wafer is located in the limiting hole, the quartz wafer is located below the guide rod.

2. A quartz wafer polishing device according to claim 1, characterized in that: The rotating shaft is provided with a clamping groove which is arranged parallel to the axis of the rotating shaft. The clamping member comprises a rotating block which is rotatably connected to the upper polishing pad. The rotating block is provided with a clamping block which is inserted into the clamping groove.

3. A quartz wafer polishing device according to claim 1, characterized in that: The guide rod is tilted on a horizontal plane in a direction away from the guide plate, and the end of the guide rod away from one end of the guide plate is configured as a groove and matched with the quartz wafer and the limiting hole. A vibration motor is provided on the guide plate.

4. A quartz wafer polishing device according to claim 3, characterized in that: A one-way component is provided between the base and the inner gear ring. The one-way component comprises a pawl rotatably connected to the base. A coaxial ratchet is provided on the outer side of the inner gear ring. An elastic member is also provided between the pawl and the base.

5. A quartz wafer polishing device according to claim 1, characterized in that: The driving assembly includes a rotating gear arranged below the lower polishing pad, the rotating gear meshes with the driving gear and the inner gear ring at the same time, the rotating gear is rotatably connected to the frame, and a driving motor for driving the rotating gear is arranged on the frame.

6. A quartz wafer polishing method using the quartz wafer polishing device according to claim 4, characterized in that: The following steps are included: S100: the lifting member drives the upper polishing pad to rise, the base rotates, the tray moves to the top of the lower polishing pad, the feeding rod rotates, driving the tray to flip, and then the feeding rod descends, the suction port on the tray releases the planetary wheel and the quartz wafer, and the planetary wheel and the quartz wafer fall onto the lower polishing pad; S200: The tray returns to the filling mechanism, the planetary wheel is placed in the supporting groove again, the cylinder pushes the quartz wafer into the guide groove, the vibration motor vibrates the guide plate, and the quartz wafer is transferred to the planetary wheel. The tray rotates, and the quartz wafer on the planetary wheel abuts against the guide rod and moves along the guide rod until it falls into the limiting hole of the planetary wheel; S300: the upper polishing pad descends and presses the quartz wafer onto the lower polishing pad, and the driving assembly drives the upper polishing pad and the lower polishing pad to rotate in opposite directions to polish the quartz wafer; S400: the upper polishing pad and the lower polishing pad are separated, and the planetary wheel and the polished quartz wafer are taken out; S500: The tray moves again between the upper polishing plate and the lower polishing plate, and the one-way component drives the inner gear ring to rotate, thereby providing a placement position for the planetary wheel.

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