Plasma processing apparatus
By using the design of the insulating member and the electrode holder in the plasma treatment device, a slewing flow is formed to reduce heat conduction, and the problem of damage to the fin member is solved and the stability and life of the equipment are improved.
Patent Information
- Application Number
- CN202410785026.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-06-20
- Filing Date
- 2024-06-18
- Publication Date
- 2024-12-20
AI Technical Summary
In the existing plasma processing device, the fin members are easily damaged due to the thermal influence of the electrodes and nozzles, resulting in a degradation of equipment performance.
A plasma processing device is designed, wherein the inner electrode and the electrode holder are surrounded by the outer electrode and the insulating member, and the fin member rotates through the processing gas inside the insulating member to form a gyro flow around the inner electrode, and blows out the plasma through the nozzle. The insulating member is fixed directly or indirectly to the outer electrode, and the fin member is fixed to the electrode holder in a separate state and is in contact with the insulating member to reduce heat conduction.
It effectively reduces damage and consumption of fin members, and improves the stability and service life of the equipment.
Smart Images
Figure CN119172912A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a plasma processing apparatus. Background Art
[0002] For example, as shown in Japanese Utility Model Application Laid-Open No. 6-54471, a plasma spray gun capable of swirling a processing gas is known. Summary of the invention
[0003] In the plasma processing apparatus described in Japanese Utility Model Application Laid-Open No. 6-54471, the fin member is in contact with the electrode and the nozzle, so there is a concern that the fin member may be damaged by the influence of heat from the electrode and the nozzle.
[0004] An object of the present disclosure is to provide a plasma processing apparatus capable of reducing damage to a fin member.
[0005] According to one aspect of the present disclosure, a plasma processing device comprises: an inner electrode to which a voltage is applied; an electrode holder that holds the inner electrode; an outer electrode that is formed in a cylindrical shape and surrounds the inner electrode and the electrode holder; an insulating member that is arranged between the inner electrode and the electrode holder and the outer electrode and surrounds the inner electrode and the electrode holder; a fin member that is used to form a swirling flow around the inner electrode by swirling a processing gas supplied to the inner side of the insulating member; and a nozzle that blows out the swirling flow after plasma formation, the insulating member being directly or indirectly fixed to the outer electrode, and the fin member being fixed to the electrode holder in a state separated from the inner electrode and in contact with the inner peripheral surface of the insulating member.
[0006] The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Figure 1 This is a cross-sectional perspective view of a plasma processing apparatus according to one embodiment of the present disclosure.
[0008] Figure 2 It is a cross-sectional view showing the relationship among the inner electrode, the electrode holder, and the insulating member.
[0009] Figure 3 It is an exploded perspective view of the electrode holder and the fin member. DETAILED DESCRIPTION
[0010] The embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be noted that in the drawings referred to below, the same or corresponding components are denoted by the same reference numerals.
[0011] Figure 1 1 is a cross-sectional perspective view of a plasma processing apparatus according to an embodiment of the present disclosure. The plasma processing apparatus 1 is suitable for surface modification of a workpiece.
[0012] like Figure 1 As shown, the plasma processing apparatus 1 includes an inner electrode 100 , an electrode holder 200 , an outer electrode 300 , an insulating member 400 , a fin member 500 , a nozzle 600 , a gas supply unit 700 , and an intermediate member 750 .
[0013] The inner electrode 100 has a shape extending linearly. The inner electrode 100 is made of, for example, tungsten. A voltage is applied to the inner electrode 100 from a power source (not shown).
[0014] The electrode holder 200 holds the inner electrode 100. The electrode holder 200 is made of, for example, copper. The electrode holder 200 will be described in detail later.
[0015] The outer electrode 300 is formed in a tubular shape. More specifically, the outer electrode 300 is formed in a cylindrical shape. The outer electrode 300 surrounds the inner electrode 100 and the electrode holder 200 .
[0016] The insulating member 400 is disposed between the inner electrode 100 and the electrode holder 200 and the outer electrode 300. The insulating member 400 surrounds the inner electrode 100 and the electrode holder 200. The insulating member 400 is formed in a cylindrical shape. The insulating member 400 defines the position where the plasma is generated between the inner electrode 100 and the outer electrode 300. Figure 1 As shown, the position of the front end of the insulating member 400 is set to expose the front end 101 of the inner electrode 100. That is, the processing gas is plasmatized near the front end 101 by the discharge phenomenon generated between the outer electrode 300 and the vicinity of the front end 101 of the inner electrode 100.
[0017] Here, the electrode holder 200 will be described in detail. Figure 1 to Figure 3 As shown, the electrode holder 200 includes an outer holder 210 , a first inner holder 220 , and a second inner holder 230 .
[0018] The outer holding body 210 surrounds the inner electrode 100. Figure 1 As shown in FIG. 2 , a reduced diameter portion 211 is formed on the inner peripheral surface of the outer holding body 210, the diameter of which gradually decreases toward the front end side (downstream side in the flow direction of the processing gas). Figure 2As shown in FIG. 1 , the outer peripheral surface of the outer retainer 210 has a contact surface S1 that contacts the inner peripheral surface of the insulating member 400 and a flow path forming surface S2 that is separated from the inner peripheral surface of the insulating member 400. The flow path forming surface S2 forms a flow path for the processing gas together with the inner peripheral surface of the insulating member 400. Figure 3 As shown, the flow path forming surface S2 is formed flat.
[0019] like Figure 1 as well as Figure 3 As shown, the outer holding body 210 has a holding portion 212 that holds the fin member 500. The holding portion 212 is formed on the downstream side of the flow path forming surface S2 in the flow direction of the process gas.
[0020] The first inner holding body 220 is disposed inside the outer holding body 210. The first inner holding body 220 surrounds the inner electrode 100. Figure 3 As shown in FIG. 2 , a slit S22 extending in a direction parallel to the axial direction of the first inner holding body 220 is formed at the front end of the first inner holding body 220. Therefore, by inserting the first inner holding body 220 into the outer holding body 210, the front end 221 of the first inner holding body 220 is pressed into the reduced diameter portion 211 of the outer holding body 210 and pressed against the inner electrode 100. Figure 1 As shown, a reduced diameter portion 222 which gradually reduces in diameter toward the distal end side is formed on the inner peripheral surface of the base end portion of the first inner holding body 220 .
[0021] The second inner holding body 230 is disposed inside the outer holding body 210. The second inner holding body 230 surrounds the inner electrode 100. Figure 3 As shown in the figure, a slit S23 extending in a direction parallel to the axial direction of the second inner holding body 230 is formed at the front end portion of the second inner holding body 230. Therefore, by inserting the second inner holding body 230 into the outer holding body 210, the front end 231 of the second inner holding body 230 is pressed into the reduced diameter portion 222 of the first inner holding body 220 and pressed against the inner electrode 100.
[0022] The fin member 500 is a member for forming a swirling flow around the inner electrode 100 by swirling the process gas (argon, air, etc.) supplied to the inner side of the insulating member 400. Figure 3 As shown in FIG. 1 , a plurality of grooves 501 are formed on the outer peripheral surface of the fin member 500. The fin member 500 is held by the holding portion 212 of the electrode holding body 200. Figure 1As shown in FIG. 1 , the outer peripheral surface of the fin member 500 contacts the inner peripheral surface of the insulating member 400. Therefore, the relative position of the holding portion 212 with respect to the insulating member 400 is effectively determined via the fin member 500. That is, the central axis of the inner electrode 100 coincides with the central axis of the insulating member 400 under the action of the fin member 500, the outer holding body 210, and the first inner holding body 220.
[0023] like Figure 1 As shown, the fin member 500 is separated from the inner electrode 100. Specifically, the fin member 500 includes a held portion 510 and an extended portion 520.
[0024] The held portion 510 is externally fitted to the holding portion 212. In other words, the held portion 510 is fitted to the holding portion 212 from the outer peripheral side of the holding portion 212.
[0025] The extension portion 520 extends from the held portion 510 toward the downstream side in the flow direction of the processed gas. Figure 1 As shown, the inner peripheral surface 500S of the extension portion 520 is separated from the inner electrode 100 .
[0026] like Figure 1 As shown in FIG. 1 , the length L between the fin member 500 and the front end 101 of the inner electrode 100 is preferably 3 times or more and 10 times or less of the inner diameter φ of the insulating member 400, and more preferably 5 times or more and 7 times or less of the inner diameter φ. In this way, it is easy to blow the processing gas from the nozzle 600 in a fully expanded state. It should be noted that the length L means the length between the front end 101 of the inner electrode 100 and the end portion of the downstream side of the groove 501 formed in the fin member 500.
[0027] The nozzle 600 is a part that blows out the swirling flow after the plasma is generated. The nozzle 600 is connected to the front end of the outer electrode 300. The front end (end on the downstream side) 402 of the insulating member 400 is fixed to the nozzle 600.
[0028] The gas supply unit 700 is a portion for supplying a processing gas to the inside of the insulating member 400. The gas supply unit 700 is provided at a position separated from the outer electrode 300 in a direction parallel to the central axis of the inner electrode 100.
[0029] like Figure 1 As shown, the intermediate member 750 is interposed between the gas supply unit 700 and the outer electrode 300. That is, the gas supply unit 700 is connected to the base end of the outer electrode 300 via the intermediate member 750. The intermediate member 750 has insulating properties. The base end 401 of the insulating member 400 is fixed to the intermediate member 750.
[0030] In the plasma processing apparatus 1 described above, when the processing gas is supplied from the gas supply unit 700, the processing gas flows into the inner side of the insulating member 400 through the inner peripheral surface of the intermediate member 750 and the outer peripheral surface of the outer holding body 210 in the electrode holding body 200, and passes between the insulating member 400 and the flow path forming surface S2 to reach the fin member 500. Thereafter, the processing gas passes through the grooves 501 of the fin member 500, thereby forming a swirling flow around the inner electrode 100, and is plasmatized near the front end 101 of the inner electrode 100, and is blown out from the nozzle 600.
[0031] As described above, in the plasma processing apparatus 1 of the present embodiment, the swirling flow is formed by the fin member 500, so that the path of the processing gas flowing between the inner electrode 100 and the outer electrode 300 becomes longer, thereby generating stable plasma. In addition, the insulating member 400 is directly or indirectly fixed to the outer electrode 300, and the fin member 500 is fixed to the electrode holder 200 and contacts the inner peripheral surface of the insulating member 400, so that the positional deviation of the central axis of the inner electrode 100 relative to the outer electrode 300 is effectively suppressed.
[0032] In addition, the inner electrode 100 is held at multiple locations including the front end 221 of the first inner holding body 220 and the front end 231 of the second inner holding body 230 , so that positional deviation of the central axis of the inner electrode 100 relative to the outer electrode 300 is more reliably suppressed.
[0033] Those skilled in the art will appreciate that the above-described multiple exemplary embodiments are specific examples of the following aspects.
[0034] [Solution 1]
[0035] A plasma processing device, wherein:
[0036] The plasma processing device comprises:
[0037] an inner electrode to which a voltage is applied;
[0038] an electrode holder that holds the inner electrode;
[0039] an outer electrode formed in a cylindrical shape and surrounding the inner electrode and the electrode holder;
[0040] an insulating member disposed between the inner electrode and the electrode holder and the outer electrode, and surrounding the inner electrode and the electrode holder;
[0041] a fin member for forming a swirling flow around the inner electrode by swirling the process gas supplied to the inner side of the insulating member; and
[0042] a nozzle for blowing out the swirling flow after being converted into plasma,
[0043] The insulating member is fixed directly or indirectly to the outer electrode,
[0044] The fin member is fixed to the electrode holder in a state of being separated from the inner electrode and is in contact with the inner peripheral surface of the insulating member.
[0045] In the plasma processing device, the insulating member is directly or indirectly fixed to the outer electrode, and the fin member is fixed to the electrode holder in a state separated from the inner electrode and in contact with the inner peripheral surface of the insulating member, so that heat conduction from the inner electrode and the outer electrode to the fin member is suppressed. Therefore, damage and consumption of the fin member are suppressed.
[0046] [Solution 2]
[0047] The plasma processing apparatus according to claim 1, wherein:
[0048] The electrode holder has:
[0049] a contact surface that contacts the inner peripheral surface of the insulating member; and
[0050] A flow path forming surface is separated from the inner peripheral surface of the insulating member and forms a flow path of the processing gas together with the inner peripheral surface of the insulating member.
[0051] In this aspect, the position of the electrode holder relative to the insulating member is effectively determined.
[0052] [Solution 3]
[0053] The plasma processing apparatus according to claim 2, wherein:
[0054] The electrode holder has a holding portion for holding the fin member.
[0055] The holding portion is formed on a downstream side of the flow path forming surface in a flow direction of the process gas.
[0056] [Solution 4]
[0057] A plasma processing apparatus according to any one of items 1 to 3, wherein:
[0058] The plasma processing device further comprises:
[0059] a gas supply unit provided at a position separated from the outer electrode in a direction parallel to a central axis of the inner electrode and supplying the processing gas; and
[0060] an intermediate member, which is interposed between the gas supply unit and the outer electrode,
[0061] The base end portion of the insulating member is fixed to the intermediate member,
[0062] The front end portion of the insulating member is fixed to the nozzle.
[0063] [Solution 5]
[0064] A plasma processing apparatus according to any one of items 1 to 4, wherein:
[0065] The length between the fin member and the front end of the inner electrode is not less than 5 times and not more than 20 times the inner diameter of the insulating member.
[0066] Although the embodiments of the present invention have been described, the embodiments disclosed this time should be considered to be illustrative in all aspects and not restrictive. The scope of the present invention is indicated by the claims, and it is intended to include all changes within the meaning and scope equivalent to the claims.
Claims
1. A plasma processing device, in, The plasma processing device comprises: an inner electrode to which a voltage is applied; an electrode holder that holds the inner electrode; an outer electrode formed in a cylindrical shape and surrounding the inner electrode and the electrode holder; an insulating member disposed between the inner electrode and the electrode holder and the outer electrode, and surrounding the inner electrode and the electrode holder; a fin member for forming a swirling flow around the inner electrode by swirling the process gas supplied to the inner side of the insulating member; and a nozzle for blowing out the swirling flow after being converted into plasma, The insulating member is fixed directly or indirectly to the outer electrode, The fin member is fixed to the electrode holder in a state of being separated from the inner electrode and is in contact with the inner peripheral surface of the insulating member.
2. The plasma processing device according to claim 1, in, The electrode holder has: a contact surface that contacts the inner peripheral surface of the insulating member; and A flow path forming surface is separated from the inner peripheral surface of the insulating member and forms a flow path of the processing gas together with the inner peripheral surface of the insulating member.
3. The plasma processing device according to claim 2, in, The electrode holder has a holding portion for holding the fin member. The holding portion is formed on a downstream side of the flow path forming surface in a flow direction of the process gas.
4. The plasma processing apparatus according to claim 1, in, The plasma processing device further comprises: a gas supply unit provided at a position separated from the outer electrode in a direction parallel to a central axis of the inner electrode and supplying the processing gas; and an intermediate member, which is interposed between the gas supply unit and the outer electrode, The base end portion of the insulating member is fixed to the intermediate member, The front end portion of the insulating member is fixed to the nozzle.
5. The plasma processing apparatus according to claim 1, in, The length between the fin member and the front end of the inner electrode is not less than 3 times and not more than 10 times the inner diameter of the insulating member.