Processing method of PTFE high-frequency material resin plug hole for PCB

Through pre-baking and temperature control methods, abnormal problems such as bursting holes of PTFE high-frequency material resin plug holes after curing are solved, which improves product quality and stability, reduces scrap rate, and improves material and ink compatibility.

CN119172933APending Publication Date: 2024-12-20YIXING SILICON VALLEY ELECTRONICS TECH
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Patent Information

Application Number
CN202411274747.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-12
Publication Date
2024-12-20

AI Technical Summary

Technical Problem

After curing, PTFE high-frequency material resin plug holes are prone to burst holes, hollows and depressions, resulting in unstable product performance and scrapping, which is mainly due to the problems caused by water vapor caused by the water absorption of the plate when baking the plate at high temperature.

Method used

The pre-drying and controlling the panel surface temperature are used to ensure that the plate is carried out in an environment of about 50℃ during the plugging process, avoid placing it in the air-conditioned room, and plug the holes in the oven by circulating to reduce the water vapor content in the holes.

Benefits of technology

Effectively prevent plug holes from bursting, improve product quality and stability, reduce scrap rate, improve material and ink compatibility, improve production efficiency and customer satisfaction.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to a processing method of a PTFE (Polytetrafluoroethylene) high-frequency material resin plug hole for a PCB (Printed Circuit Board), which comprises the following steps of: (1) preparing a plug hole machine in advance, and using a plug hole base plate of a corresponding product; (2) for the PTFE high-frequency material product, controlling the temperature of the board surface to be 50 + / -5 DEG C after hole plugging and pre-drying; (3) after baking is completed, the board is placed in an oven, the board is strictly prohibited from being placed in an air-conditioned room, and the temperature of the oven is set to be 50 DEG C; and (4) taking the plate from the oven during hole plugging, taking the plate from the oven again to plug the hole after plugging one plate, and circulating in sequence until the product is plugged. The method has the advantages that the performance and quality of products are improved, hole plugging and hole blasting are effectively prevented, and the stability and smoothness of new materials used in a production line are improved.
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