Resonance and non-resonance fused vibration auxiliary machining device for precision machining of microstructure of difficult-to-machine material

Abstract

The invention discloses a resonance and non-resonance fused vibration auxiliary machining device for precision machining of a microstructure of a difficult-to-machine material, and belongs to the technical field of vibration auxiliary machining. The method solves the problem that when a traditional non-resonance tool is used for machining a microstructure of a difficult-to-machine material, the improvement of the machining precision is limited due to the defects of serious tool abrasion, surface microcrack defects, microstructure outlet burrs and the like. The resonance and non-resonance fused vibration auxiliary machining device comprises a base 1, a bending vibration ceramic set 2, an amplitude-change pole 3, a longitudinal vibration ceramic set 4, a blade 5, a blade fixing screw 6, a tool bit fixing screw 7, a tool bit 8 and an insulating ring 9. The processing of microstructures with different morphologies can be realized through low-frequency vibration excited by the implanted longitudinal vibration ceramic group; and meanwhile, by means of high-frequency vibration excited by the implanted bending vibration ceramic set, the intermittent cutting effect can be achieved, the cutting force of brittle and hard materials difficult to machine is reduced, surface microcracks are reduced, and the surface microstructure machining precision is improved. According to the design, resonance and non-resonance fusion is ingeniously achieved, low-frequency vibration of the tool is accompanied by high-frequency vibration at the same time, cuttings can be discharged in time, the situation that the cuttings scratch the machined surface is avoided, meanwhile, outlet burrs are reduced, and the surface roughness of the microstructure is reduced.

Description

Technical Field

[0001] The invention belongs to the field of surface microstructure processing, and in particular relates to a resonance and non-resonance fusion vibration auxiliary processing device for precision processing of microstructures of difficult-to-process materials. Background Art

[0002] Surface microstructure refers to a microstructure with a characteristic size less than micrometers, a tiny geometric shape and a large aspect ratio, which can give the surface of the part special optical and physical properties. The processing of the surface microstructure of brittle and hard-to-process materials (ceramics, glass, titanium alloy, etc.) makes them have special properties such as friction reduction, super hydrophobicity, and high reflectivity. It has important application and research value in the fields of optical instruments, aerospace, etc. Vibration-assisted cutting can achieve surface microstructure processing through the reciprocating vibration of the tool and the precision feed motion of the machine tool. It is an important means to prepare the surface microstructure of parts. Traditional non-resonant vibration-assisted processing tools can achieve precision processing of the surface microstructure of conventional materials, but in the microstructure processing of brittle and hard-to-process materials, there are defects such as severe tool wear, surface microcrack defects, and microstructure exit burrs, which limit the improvement of processing accuracy.

[0003] Resonance-type ultrasonic assisted processing technology can reduce tool cutting force, reduce cutting burrs, and reduce the probability of microcracks, and can be used to improve the processing accuracy of microstructures of difficult-to-process materials. Therefore, the present invention provides a resonance and non-resonance fusion vibration-assisted microstructure processing device for precision processing of microstructures of difficult-to-process materials. The longitudinal vibration non-resonance actuation ceramic group is combined with the bending vibration resonant ceramic group. The longitudinal vibration non-resonance ceramic is actuated axially to provide large-amplitude low-frequency vibration for forming complex microstructure morphology; the bending vibration resonant ceramic group is actuated tangentially to provide small-amplitude high-frequency ultrasonic vibration for reducing cutting force and promoting chip removal. The resonance and non-resonance fusion design can reduce burrs at the processing outlet of microstructures of difficult-to-process materials, reduce microcracks, and reduce tool wear, thereby achieving precision processing of microstructures of difficult-to-process materials. Summary of the invention

[0004] In order to solve the problem of limited improvement in machining accuracy caused by defects such as severe tool wear, surface microcrack defects, and microstructure outlet burrs in the machining of difficult-to-machine materials microstructures by non-resonant tools, the present invention proposes a vibration-assisted machining device that combines resonance and non-resonance for precision machining of difficult-to-machine material microstructures, which can reduce burrs, microcracks, and tool wear in machining of difficult-to-machine material microstructures.

[0005] The present invention is achieved through the following scheme:

[0006] A resonance and non-resonance fusion vibration-assisted processing device for precision processing of microstructures of difficult-to-process materials, the resonance and non-resonance fusion vibration-assisted processing device comprising a base 1, a bending vibration ceramic group 2, a variable amplitude rod 3, a longitudinal vibration ceramic group 4, a blade 5, a blade fixing screw 6, a cutter head fixing screw 7, a cutter head 8, and an insulating ring 9; the bending vibration ceramic group 2 is clamped between the base 1 and the variable amplitude rod 3, the variable amplitude rod 3 is connected to the base 1 through a thread, and the insulating ring 9 is sleeved on the variable amplitude rod 3 to insulate the bending vibration ceramic group 2; the longitudinal vibration ceramic group 4 is arranged inside the front end of the variable amplitude rod 3, and the end face of the cutter head 8 is pressed against the longitudinal vibration ceramic group 4 through the cutter head fixing screw 7; the blade 5 is installed in a groove at the end of the cutter head 8 and is fixed to the cutter head 8 through the blade fixing screw 6.

[0007] Furthermore, two non-resonant excitation signals A and resonant excitation signals B of different frequencies are simultaneously applied to the longitudinal vibration ceramic group 4 and the bending vibration ceramic group 2, and the frequency range of the non-resonant excitation signal A is f1 (0-5khz) and the frequency range of the resonant excitation signal B is f2 (greater than 20khz). The f1 low-frequency signal is applied to the longitudinal vibration ceramic group 4 to excite low-frequency vibrations along the X direction. The f2 high-frequency signal is applied to the bending vibration ceramic group 2 to excite high-frequency bending vibrations along the Z-axis direction. The amplitude transformer 3 amplifies the small amplitude, realizes the low-frequency and large-amplitude output in the X direction of the tool tip, and simultaneously outputs high-frequency vibrations in the Z direction, realizing the fusion of the resonant and non-resonant working states of a single piezoelectric vibration-assisted cutting tool.

[0008] Furthermore, the low-frequency vibration in the X direction excited by the longitudinal vibration ceramic group 4 can realize the turning of the microstructure contour, and different microstructure contours can be processed by selecting different frequencies and amplitudes. At the same time, the high-frequency and small-amplitude vibration in the Z direction excited by the bending vibration ceramic group 2 can realize intermittent processing in the cutting direction, and reduce the cutting force in the microstructure processing process. At the same time, the ultrasonic vibration in the X direction helps to discharge the chips. Under the combined effect of the two beneficial effects, the tool can realize the microstructure processing of difficult-to-process materials, and reduce the exit burrs, microcracks, and tool wear, thereby improving the microstructure processing accuracy.

[0009] Beneficial effects of the present invention

[0010] 1. The low-frequency vibration excited by the tool longitudinal vibration ceramic group realizes the low-frequency and large-amplitude output in the X direction, which can realize the micro-structure processing of different contours, and combined with the high-frequency bending vibration ceramic group excitation, it produces high-frequency vibration in the Z direction. The introduction of ultrasonic vibration in the micro-structure processing process forms an intermittent cutting effect, reduces the cutting force of brittle and hard-to-process materials, reduces the generation of surface micro-cracks, and improves the surface micro-structure processing accuracy.

[0011] 2. The fusion of resonance and non-resonance, the low-frequency vibration of the tool is accompanied by high-frequency vibration, which reduces the adhesion of chips to the tool, allows the chips to be discharged in time, avoids the chips scratching the processed surface, reduces the exit burrs, reduces the surface roughness of the microstructure, and reduces the difficulty of post-processing of the microstructure.

[0012] 3. Low-frequency vibration realizes the processing of microstructure contours of different morphologies. At the same time, the tool vibrates slightly at high frequency along the cutting direction, which makes the tool and the workpiece produce intermittent cutting processing effect, which is beneficial to the heat dissipation of the tool, reduces tool wear, reduces the frequency of blade replacement, and reduces the economic cost of microstructure processing of difficult-to-process materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a cross-sectional view of the front view of the present invention;

[0014] Figure 2 It is an isometric view of the present invention;

[0015] Figure 3 is an excitation signal diagram of the present invention; DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0017] The embodiments of the present invention are further described in detail below with reference to the accompanying drawings.

[0018] like Figure 1 As shown, a resonant and non-resonant fusion vibration-assisted processing device for precision processing of microstructures of difficult-to-process materials, the device comprises a base 1, a bending vibration ceramic group 2, a variable amplitude rod 3, a longitudinal vibration ceramic group 4, a blade 5, a blade fixing screw 6, a cutter head 8, and an insulating ring 9; the above-mentioned bending vibration ceramic group 2 is clamped between the base 1 and the variable amplitude rod 3, the variable amplitude rod 3 is connected to the base 1 through a thread, and the insulating ring 9 is sleeved on the variable amplitude rod 3 to insulate the bending vibration ceramic group 2; the longitudinal vibration ceramic group 4 is arranged inside the front end of the variable amplitude rod 3, and the end face of the cutter head 8 is pressed against the longitudinal vibration ceramic group 4 by the cutter head fixing screw 7; the blade 5 is installed in a groove at the end of the cutter head 8 and is fixed to the cutter head 8 by the blade fixing screw 6.

[0019] Two non-resonant excitation signals A and resonant excitation signals B of different frequencies are simultaneously applied to the longitudinal vibration ceramic group 4 and the bending vibration ceramic group 2. The frequency range of the non-resonant excitation signal A is f1 (0-5 khz) and the frequency range of the resonant excitation signal B is f2 (greater than 20 khz). The f1 low-frequency signal is applied to the longitudinal vibration ceramic group 4 to excite low-frequency vibrations along the X direction. The f2 high-frequency signal is applied to the bending vibration ceramic group 2 to excite high-frequency bending vibrations along the Z-axis direction. The amplitude transformer 3 amplifies the small amplitude, realizes the low-frequency and large-amplitude output in the X direction of the tool tip, and simultaneously outputs high-frequency vibrations in the Z direction, realizing the fusion of the resonant and non-resonant working states of a single piezoelectric vibration-assisted cutting tool.

[0020] The low-frequency vibration in the X direction stimulated by the longitudinal vibration ceramic group 4 can realize the turning of the microstructure contour, and different microstructure contours can be processed by selecting different frequencies and amplitudes. At the same time, the high-frequency and small-amplitude vibration in the Z direction stimulated by the bending vibration ceramic group 2 can realize intermittent processing in the cutting direction, and reduce the cutting force in the microstructure processing process. At the same time, the ultrasonic vibration in the X direction helps to discharge the chips. Under the combined effect of the two beneficial effects, the tool can realize the microstructure processing of difficult-to-process materials, and reduce the exit burrs, microcracks, and tool wear, thereby improving the microstructure processing accuracy.

[0021] It should be noted that, in the present invention, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0022] The foregoing is merely a specific embodiment of the present invention, which enables those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features applied herein.

Claims

1. A resonance and non-resonance fusion vibration-assisted processing device for precision processing of microstructures of difficult-to-process materials, the resonance and non-resonance fusion vibration-assisted processing device comprising a base (1), a bending vibration ceramic group (2), a horn (3), a longitudinal vibration ceramic group (4), a blade (5), a blade fixing screw (6), a cutter head fixing screw (7), a cutter head (8), and an insulating ring (9); the bending vibration ceramic group (2) is clamped between the base (1) and the horn (3), the horn (3) is connected to the base (1) by a thread, and the insulating ring (9) is sleeved on the horn (3) to insulate the bending vibration ceramic group (2); the longitudinal vibration ceramic group (4) is arranged inside the front end of the horn (3), and the end face of the cutter head (8) is pressed against the longitudinal vibration ceramic group (4) by the cutter head fixing screw (7); the blade (5) is installed in a groove at the end of the cutter head (8) and is fixed to the cutter head (8) by the blade fixing screw (6).

2. A resonant and non-resonant fusion vibration-assisted machining device for precision machining of microstructures of difficult-to-machine materials according to claim 1, characterized in that: Two non-resonant excitation signals A and resonant excitation signals B of different frequencies are simultaneously applied to the longitudinal vibration ceramic group (4) and the bending vibration ceramic group (2), wherein the frequency range of the non-resonant excitation signal A is f1 (0-5 kHz) and the frequency range of the resonant excitation signal B is f2 (greater than 20 kHz). The f1 low-frequency signal is applied to the longitudinal vibration ceramic group (4) to excite low-frequency vibration along the X direction. The f2 high-frequency signal is applied to the bending vibration ceramic group (2) to excite high-frequency bending vibration along the Z axis. The amplitude transformer (3) amplifies the small amplitude, realizes the output of low-frequency and large-amplitude vibration in the X direction of the tool tip, and simultaneously outputs high-frequency vibration in the Z direction, thereby realizing the fusion of the resonant and non-resonant working states of a single piezoelectric vibration-assisted cutting tool.

3. A resonant and non-resonant fusion vibration-assisted machining device for precision machining of microstructures of difficult-to-machine materials according to claim 1, characterized in that: The low-frequency vibration in the X direction excited by the longitudinal vibration ceramic group (4) can realize turning processing of microstructure contours, and different microstructure contours can be processed by selecting different frequencies and amplitudes. At the same time, the high-frequency and small-amplitude vibration in the Z direction excited by the bending vibration ceramic group (2) can realize intermittent processing in the cutting direction, thereby reducing the cutting force during the microstructure processing process. At the same time, the ultrasonic vibration in the X direction helps to discharge the chips. Under the combined effect of the two beneficial effects, the tool can realize microstructure processing of difficult-to-process materials, and reduce the exit burrs, microcracks, and tool wear, thereby improving the microstructure processing accuracy.

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