Diffusion furnace sensor position calibration method, diffusion furnace, storage medium and program product

Abstract

The present invention provides a diffusion furnace wafer position calibration method, a diffusion furnace, a storage medium and a program product. The method obtains a first distance threshold, a second distance threshold and a third distance threshold, as well as the distance between a first edge point on the edge of a target wafer and the first end of a second wafer boat tooth, the distance between the second edge point and the first end of the first wafer boat tooth, and the distance between the third edge point and the first end of the third wafer boat tooth at the current moment; and then determines whether it is necessary to calibrate the position of the target wafer based on the acquired data. If necessary, the position of the target wafer is calibrated based on the acquired data. If not, a first notification message is sent to notify the user to replace the equipment. The method can reasonably set the wafer position calibration process in combination with the deformation of the diffusion furnace to improve the safety of the wafer.

Description

Technical Field

[0001] The invention relates to the technical field of diffusion furnaces, and in particular to a diffusion furnace chip position calibration method, a diffusion furnace, a storage medium and a program product. Background Art

[0002] The diffusion furnace is one of the important process equipment in the front process of the semiconductor production line. It is used for diffusion, oxidation, annealing, alloying and sintering in industries such as large-scale integrated circuits, discrete devices, power electronics, optoelectronic devices and optical fibers.

[0003] When the diffusion furnace is working normally, the wafer boat teeth can stably support the wafer. When the diffusion furnace is subjected to high temperature process, the wafer boat and the heat preservation barrel are usually deformed, which in turn causes the position of the wafer boat teeth in the wafer boat to change. Since the wafer is supported on the wafer boat teeth, the change in the position of the wafer boat teeth causes the wafer support to change. At this time, the wafer may scratch or collide with the wafer boat, or the wafer may fall off the wafer boat teeth. Therefore, it is necessary to calibrate the position of the diffusion furnace conveyor, that is, the wafer.

[0004] The existing diffusion furnace wafer position calibration method is mostly manual calibration, which manually changes the transmission data to adjust the wafer position. This method requires the operator to always pay attention to the position of the wafer in the diffusion furnace and the deformation of the diffusion furnace. The intelligence level is low, resulting in low calibration efficiency. Some diffusion furnaces in the prior art also use automatic calibration to calibrate the wafer position, but this type of automatic calibration is based on the preset wafer boat tooth spacing calibration data to automatically calibrate the wafer position. However, after the high-temperature process of the diffusion furnace tube and the deformation of the diffusion furnace, the automatic calibration method cannot take the deformation into account. It still blindly calibrates the wafer position according to the preset parameters, which may cause deviations in the wafer position calibration, and there is a risk of wafer scratches, collisions, and wafer drops, resulting in a waste of resources. Summary of the invention

[0005] In order to solve the above problems existing in the prior art, the present invention provides a diffusion furnace sensor position calibration method, a diffusion furnace, a storage medium and a program product, which specifically include:

[0006] In a first aspect, the present invention provides a diffusion furnace sensor position calibration method, which is applied to a diffusion furnace, wherein the diffusion furnace comprises:

[0007] A control module, a robot, a wafer boat, and a plurality of wafers. The wafer boat is provided with multiple layers of wafer boat teeth for supporting the wafers. Each layer of wafer boat teeth includes equal lengths and are arranged 90 degrees in sequence. o A first crystal boat tooth, a second crystal boat tooth and a third crystal boat tooth having an included angle;

[0008] The diffusion furnace sensor position calibration method includes:

[0009] The control module obtains a first distance threshold, a second distance threshold and a third distance threshold; the first distance threshold and the second distance threshold are respectively the minimum distance and the maximum distance between a first edge point on the edge of the target wafer and the first end of the second wafer boat tooth when the target wafer has not fallen and has not collided with the wafer boat of the diffusion furnace, the first end is the end point on the wafer boat tooth away from the target wafer, the target wafer is a wafer transported by the robot, and the third distance threshold is the maximum moving distance of the robot in the direction of the line connecting the second wafer boat tooth and the third wafer boat tooth when the target wafer has not fallen and has not collided with the wafer boat;

[0010] The control module obtains the distance between a first edge point on the edge of the target wafer and the first end of the second wafer boat tooth, the distance between the second edge point on the edge of the target wafer and the first end of the first wafer boat tooth, and the distance between a third edge point on the edge of the target wafer and the first end of the third wafer boat tooth at the current moment, wherein the first edge point, the second edge point, and the third edge point are points located on the edge of the target wafer and opposite to the second wafer boat tooth, the first wafer boat tooth, and the third wafer boat tooth, respectively;

[0011] The control module determines whether it is necessary to calibrate the position of the target wafer based on the distance between the first edge point and the first end of the second crystal boat tooth, the distance between the second edge point and the first end of the first crystal boat tooth, the distance between the third edge point and the first end of the third crystal boat tooth, the first distance threshold, the second distance threshold and the third distance threshold. If it is necessary to calibrate the position of the target wafer, the control module determines whether it is necessary to calibrate the position of the target wafer based on the distance between the first edge point and the first end of the second crystal boat tooth, the distance between the second edge point and the first end of the first crystal boat tooth, the distance between the third edge point and the first end of the third crystal boat tooth, the first distance threshold, the second distance threshold and the third distance threshold. If it is not necessary to calibrate the position of the target wafer, a first notification message is sent to notify the user to replace the equipment.

[0012] In a second aspect, the present invention further provides a diffusion furnace, comprising:

[0013] Control module, robot, wafer boat, multiple wafers, the wafer boat is provided with multiple layers of wafer boat teeth for supporting wafers, each layer of wafer boat teeth includes 90 o A first crystal boat tooth, a second crystal boat tooth and a third crystal boat tooth having an included angle;

[0014] A control module is used to obtain a first distance threshold, a second distance threshold and a third distance threshold; the first distance threshold and the second distance threshold are respectively the minimum distance and the maximum distance between a first edge point on the edge of the target wafer and the first end of the second wafer boat tooth when the target wafer has not fallen and has not collided with the wafer boat of the diffusion furnace, the first end is the end point on the wafer boat tooth away from the target wafer, the target wafer is a wafer transferred by a robot, and the maximum moving distance of the robot in the direction of the line connecting the second wafer boat tooth and the third wafer boat tooth;

[0015] The control module is further used to obtain the distance between a first edge point on the edge of the target wafer and the first end of the second wafer boat tooth, the distance between the second edge point on the edge of the target wafer and the first end of the first wafer boat tooth, and the distance between a third edge point on the edge of the target wafer and the first end of the third wafer boat tooth at the current moment, wherein the first edge point, the second edge point, and the third edge point are points located on the edge of the target wafer and opposite to the second wafer boat tooth, the first wafer boat tooth, and the third wafer boat tooth, respectively;

[0016] The control module is also used to determine whether it is necessary to calibrate the position of the target wafer based on the distance between the first edge point and the first end of the second crystal boat tooth, the distance between the second edge point and the first end of the first crystal boat tooth, the distance between the third edge point and the first end of the third crystal boat tooth, the first distance threshold, the second distance threshold and the third distance threshold; if it is necessary to calibrate the position of the target wafer, determine whether it is necessary to calibrate the position of the target wafer based on the distance between the first edge point and the first end of the second crystal boat tooth, the distance between the second edge point and the first end of the first crystal boat tooth, the distance between the third edge point and the first end of the third crystal boat tooth, the first distance threshold, the second distance threshold and the third distance threshold; if it is not necessary to calibrate the position of the target wafer, send a first notification message to notify the user to replace the equipment.

[0017] In a third aspect, the present invention provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, any one of the methods provided in the first aspect is implemented.

[0018] In a fourth aspect, the present invention provides a program product, the program product comprising computer program instructions, which can implement any of the methods provided in the first aspect when the computer program instructions are executed.

[0019] Beneficial effects of the present invention:

[0020] The diffusion furnace wafer position calibration method, diffusion furnace, storage medium and program product provided by the present invention obtain a first distance threshold, a second distance threshold and a third distance threshold, as well as the distance between a first edge point on the edge of a target wafer and the first end of a second wafer boat tooth, the distance between a second edge point on the edge of the target wafer and the first end of the first wafer boat tooth, and the distance between a third edge point on the edge of the target wafer and the first end of the third wafer boat tooth at the current moment; according to the distance between the first edge point and the first end of the second wafer boat tooth, the distance between the second edge point and the first end of the first wafer boat tooth, the distance between the third edge point and the first end of the third wafer boat tooth, the first distance threshold, the second distance threshold and the third distance threshold, determine Determine whether it is necessary to calibrate the position of the target wafer. If it is necessary to calibrate the position of the target wafer, determine whether it is necessary to calibrate the position of the target wafer according to the distance between the first edge point and the first end of the second wafer boat tooth, the distance between the second edge point and the first end of the first wafer boat tooth, the distance between the third edge point and the first end of the third wafer boat tooth, the first distance threshold, the second distance threshold and the third distance threshold. If it is not necessary to calibrate the position of the target wafer, send a first notification message to notify the user to replace the equipment, thereby optimizing the wafer transfer calibration process of the diffusion furnace. It can reasonably set the wafer transfer position calibration process in combination with the deformation of the diffusion furnace, thereby improving the safety of the wafer, reducing resource waste, and improving the reliability of the equipment.

[0021] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A structural schematic diagram of a diffusion furnace provided by the present invention;

[0023] Figure 2 A schematic diagram of a flow chart of a diffusion furnace transmission position calibration method provided by the present invention;

[0024] Figure 3 A schematic diagram of the relative positions of a wafer and wafer boat teeth provided by the present invention;

[0025] Figure 4 A schematic diagram of the relative positions of another wafer and wafer boat teeth provided by the present invention;

[0026] Figure 5 A schematic diagram of the relative positions of another wafer and wafer boat teeth provided by the present invention;

[0027] Figure 6 A schematic diagram of the relative positions of another wafer and wafer boat teeth provided by the present invention;

[0028] Figure 7 A schematic diagram of the relative positions of another wafer and wafer boat teeth provided by the present invention;

[0029] Figure 8 A schematic diagram of the relative positions of another wafer and wafer boat teeth provided by the present invention. DETAILED DESCRIPTION

[0030] The present invention is further described in detail below with reference to specific embodiments, but the embodiments of the present invention are not limited thereto.

[0031] Figure 1 A structural schematic diagram of a diffusion furnace provided by the present invention, such as Figure 1 As shown, a wafer boat is arranged in the diffusion furnace, and the wafer boat is arranged on the heat preservation barrel, and multiple layers of wafer boat teeth are arranged inside the wafer boat. When the diffusion furnace is working, the wafer is placed on a layer of wafer boat teeth by a manipulator, and the wafer and the wafer boat teeth are movably connected. Since the wafer boat is arranged on the heat preservation barrel, when the heat preservation barrel is deformed, the wafer boat may be deformed as well. The wafer boat teeth are fixed inside the wafer boat, and when the wafer boat is deformed, the position of the wafer boat teeth will also change. Since there is a movably connected connection between the wafer and the wafer boat teeth, when the wafer boat is concave and causes the wafer boat teeth to move inward, the wafer may be scratched or collided with the inner wall; when the wafer boat is convex and causes the wafer boat teeth to move outward, the wafer boat may slip off the wafer boat teeth, resulting in falling wafers and fragments. Therefore, in order to ensure the safe operation of the diffusion furnace, the position of the wafer needs to be adjusted in time. Existing automatic calibrations all automatically calibrate the wafer position based on preset wafer boat tooth spacing calibration data, and only use whether the edge of the wafer is in the middle of the wafer boat teeth as a calibration prerequisite, and calibrate the wafer position for the purpose of adjusting the edge of the wafer to the middle of the wafer boat teeth. This method cannot take deformation conditions into account and will not make adjustments based on deformation conditions. It has a low level of intelligence and poor adaptability, and may still lead to deviations in wafer position calibration, with the risk of wafer scratches, collisions, and wafer drops.

[0032] If the position calibration progress can be adjusted in time according to the deformation of the diffusion furnace, and the wafer position can be calibrated under relatively safe conditions, the safety of the wafer can be effectively guaranteed and waste of resources can be avoided.

[0033] Figure 2 A schematic flow chart of a diffusion furnace position calibration method provided by the present invention, the method is applied to a diffusion furnace, the diffusion furnace comprising:

[0034] A control module, a robot, a wafer boat, and a plurality of wafers. The wafer boat is provided with multiple layers of wafer boat teeth for supporting the wafers. Each layer of wafer boat teeth includes equal lengths and are arranged 90 degrees in sequence. o The first crystal boat tooth, the second crystal boat tooth and the third crystal boat tooth are provided with an included angle.

[0035] The diffusion furnace sensor position calibration method comprises:

[0036] S201. A control module obtains a first distance threshold, a second distance threshold, and a third distance threshold.

[0037] The first distance threshold and the second distance threshold are respectively the minimum distance and the maximum distance between the first edge point on the edge of the target wafer and the first end of the second wafer boat tooth when the target wafer does not fall and does not collide with the wafer boat of the diffusion furnace.

[0038] The first end is an end point on the wafer boat tooth that is away from the target wafer.

[0039] The target wafer is the wafer transferred by the robot.

[0040] The third distance threshold is the maximum moving distance of the robot arm in the direction of the line connecting the second wafer boat tooth and the third wafer boat tooth when the target wafer does not fall and does not collide with the wafer boat.

[0041] The first edge point is a point located on the edge of the target wafer and opposite to the second wafer boat tooth.

[0042] like Figure 3 As shown, it is assumed that the first edge point on the edge of the target wafer is point R, the second wafer boat tooth is tooth 2, and the length of tooth 2 is SL. When the robot controls the target wafer to move along the straight line where the second wafer boat tooth is located in the diffusion furnace without deformation (at Figure 3 The target wafer moves along tooth 2), such as Figure 3 As shown in Figure a, in an ideal state, the control point R is located at the center of tooth 2. However, the crystal boat and the heat preservation barrel are deformed due to high temperature, which causes the position of the crystal boat tooth to move. When the crystal boat and the heat preservation barrel are deformed and cause tooth 3 to move to the outside of the crystal boat, as shown in Figure a, the control point R is located at the center of tooth 2 in an ideal state. However, the position of the crystal boat tooth is inevitably moved due to the deformation of the crystal boat and the heat preservation barrel. Figure 3 As shown in Figure b, the distance between the center of tooth 3 and point R of the wafer increases. At this time, if you blindly pursue calibrating point R to the center of tooth 3, you need to move the wafer up, which may cause the center of gravity of the wafer to be unstable or detach from other crystal teeth and cause it to fall. When the crystal boat and the insulation barrel are deformed and cause tooth 3 to move inside the crystal boat, as shown in Figure 2, the distance between the center of tooth 3 and point R of the wafer increases. At this time, if you blindly pursue calibrating point R to the center of tooth 3, you need to move the wafer up, which may cause the center of gravity of the wafer to be unstable or detach from other crystal teeth and cause it to fall. Figure 3 As shown in Figure c, the distance between the center of tooth 3 and point R of the wafer is reduced. At this time, if you blindly pursue calibrating point R to the center of tooth 3, you need to move the wafer down, which may cause the wafer to scratch or collide with the inner wall of the wafer boat, or fall due to unstable center of gravity, causing the wafer to be damaged or scrapped.

[0043] like Figure 4 As shown, assuming that the first crystal boat tooth is tooth 1 and the third crystal boat tooth is tooth 3, in an ideal state, as Figure 4As shown in Figure a, the wafers are evenly loaded on teeth 1 and 3. When the wafer boat and the heat preservation barrel are deformed, teeth 1 and 3 generally move to both sides in the horizontal direction. When the wafer boat gradually deforms to both sides in the horizontal direction, the wafers transferred to the wafer boat are less and less loaded on teeth 1 and 3 of the wafer boat. When the wafer boat is severely deformed to both sides, such as Figure 4 As shown in Figure b, the wafer may fall off the teeth on both sides of the wafer boat, resulting in damage and scrap, and even affecting other components under the wafer boat. Figure 5 As shown, the robot can adjust the distance between the wafer and the teeth 1 and 3 by moving in the direction of the line connecting the teeth 1 and 3. T represents the moving distance of the robot in the direction of the line connecting the teeth 1 and 3.

[0044] In one possible implementation, the control module obtains a first distance threshold, a second distance threshold and a third distance threshold, including: the control module controls the target wafer to move along the straight line where the second wafer boat tooth is located in a diffusion furnace where no deformation occurs through a robot, and determines the first distance threshold and the second distance threshold; the control module controls the target wafer to move along the line direction of the first wafer boat tooth and the third wafer boat tooth in the diffusion furnace where no deformation occurs through a robot, and determines the third distance threshold.

[0045] This method can be used to determine a suitable distance threshold based on the actual conditions of the wafer, thereby improving the adaptability of the method and the accuracy of the final position calibration.

[0046] In another possible implementation, the control module obtains the first distance threshold, the second distance threshold, and the third distance threshold through its interactive interface or interactive port, where the first distance threshold is , the second distance threshold is , the third distance threshold is ,in, Indicates the length of the crystal boat teeth.

[0047] like Figure 6 As shown in Figures a and b, the lengths of teeth 1, 2, and 3 are all SL. When the distance between point R and the first end of tooth 1 is When the distance between point R and the first end of tooth 1 is It can ensure that the wafer is just stable on the wafer boat teeth and does not slip.

[0048] S202, the control module obtains the distance between the first edge point on the edge of the target wafer and the first end of the second wafer boat tooth, the distance between the second edge point on the edge of the target wafer and the first end of the first wafer boat tooth, and the distance between the third edge point on the edge of the target wafer and the first end of the third wafer boat tooth at the current moment.

[0049] The second edge point and the third edge point are points located on the edge of the target wafer and are respectively opposite to the first wafer boat tooth and the third wafer boat tooth.

[0050] S203, the control module determines whether it is necessary to calibrate the position of the target wafer based on the distance between the first edge point and the first end of the second crystal boat tooth, the distance between the second edge point and the first end of the first crystal boat tooth, the distance between the third edge point and the first end of the third crystal boat tooth, the first distance threshold, the second distance threshold and the third distance threshold. If so, execute S204, if not, execute S205.

[0051] In a possible implementation, the control module determines whether it is necessary to calibrate the position of the target wafer based on the distance between the first edge point and the first end of the second crystal boat tooth, the distance between the second edge point and the first end of the first crystal boat tooth, the distance between the third edge point and the first end of the third crystal boat tooth, the first distance threshold, the second distance threshold and the third distance threshold, including: the control module determines whether the distance between the first edge point and the first end of the second crystal boat tooth is less than the first distance threshold, if so, determines that it is not necessary to calibrate the position of the target wafer, if not, determines whether the distance between the first edge point and the first end of the second crystal boat tooth is greater than the second distance threshold, if so, determines that it is not necessary to calibrate the position of the target wafer, if not, determines the sum of the distance between the second edge point and the first end of the first crystal boat tooth and the distance between the third edge point and the first end of the third crystal boat tooth; the control module determines whether the sum is greater than the third distance threshold, if so, determines that it is not necessary to calibrate the position of the target wafer, if not, determines that it is necessary to calibrate the position of the target wafer.

[0052] It should be noted that the order of the multiple judgments in the above implementation can be adjusted according to actual conditions to meet different requirements.

[0053] This method can be used to determine whether the current position of the wafer is within the safe control range, and also reflects the degree of deformation of the diffusion furnace. If it is determined that it is necessary to calibrate the position of the target wafer, it means that the current degree of deformation of the diffusion furnace is low, and the current position of the wafer is within the safe control range. The wafer position can be calibrated to improve the operating performance of the diffusion furnace; if it is determined that it is not necessary to calibrate the position of the target wafer, it means that the current degree of deformation of the diffusion furnace is serious and it can no longer operate normally. There are safety hazards in the wafer position, and it is not appropriate to calibrate the wafer position. The diffusion furnace's wafer boat, insulation barrel and other accessories should be replaced to provide a safe and reliable environment for the wafer.

[0054] S204, calibrate the position of the target wafer according to the distance between the first edge point and the first end of the second wafer boat tooth, the distance between the second edge point and the first end of the first wafer boat tooth, the distance between the third edge point and the first end of the third wafer boat tooth, the first distance threshold, the second distance threshold and the third distance threshold.

[0055] In a possible implementation, the control module calibrates the target wafer in a front-to-back direction according to the distance between the first edge point and the first end of the second crystal boat tooth, the distance between the second edge point and the first end of the first crystal boat tooth, the distance between the third edge point and the first end of the third crystal boat tooth, the first distance threshold, the second distance threshold and the third distance threshold, including: the control module calibrates the target wafer in a front-to-back direction according to the distance between the first edge point and the first end of the second crystal boat tooth, the first distance threshold and the second distance threshold; the control module calibrates the target wafer in a left-to-right direction according to the distance between the second edge point and the first end of the first crystal boat tooth, the distance between the third edge point and the first end of the third crystal boat tooth, and the third distance threshold.

[0056] Optionally, the control module performs forward and backward position calibration on the target wafer based on the distance between the first edge point and the first end of the second wafer boat tooth, the first distance threshold and the second distance threshold, including: the control module controls the robot to move the target wafer so that the first edge point moves to the center of the second wafer boat tooth.

[0057] like Figure 7 As shown, this method can be used to convert the wafer into Figure 7 Calibrate the position shown in Figure a or Figure b to Figure 7 The position shown in Figure c in , where the dotted line corresponds to an unreasonable position and the solid line corresponds to a reasonable position.

[0058] Optionally, the control module performs left-right position calibration on the target wafer according to the distance between the second edge point and the first end of the first crystal boat tooth, the distance between the third edge point and the first end of the third crystal boat tooth, and a third distance threshold, including: the control module determines the difference between the distance between the second edge point and the first end of the first crystal boat tooth and the distance between the third edge point on the edge of the target wafer and the first end of the third crystal boat tooth; the control module controls the robot to move the target wafer according to the difference so that the distance between the second edge point and the first end of the first crystal boat tooth is equal to the distance between the third edge point and the first end of the third crystal boat tooth.

[0059] like Figure 8 As shown, this method can be used to convert the wafer into Figure 8 Calibrate the position shown in Figure a or Figure b to Figure 8 The position shown in Figure c in , where the dotted line corresponds to an unreasonable position and the solid line corresponds to a reasonable position.

[0060] S205: Send a first notification message to notify the user to change the device.

[0061] Optionally, the control module may send the first notification message to a user device, such as a mobile phone, etc.; may also pop up the first notification message through an interactive interface; may also output the first notification message through components such as an indicator light and a buzzer; may also send the first notification message in audio form through a voice device. The specific implementation method is not limited.

[0062] The diffusion furnace wafer position calibration method provided by the present invention obtains a first distance threshold, a second distance threshold and a third distance threshold, as well as the distance between a first edge point on the edge of a target wafer and the first end of a second wafer boat tooth, the distance between a second edge point on the edge of the target wafer and the first end of the first wafer boat tooth, and the distance between a third edge point on the edge of the target wafer and the first end of the third wafer boat tooth at the current moment; and determines whether there is a wafer that has a first edge point on the edge of the target wafer and the first end of the second wafer boat tooth, the distance between the second edge point and the first end of the first wafer boat tooth, the distance between the third edge point and the first end of the third wafer boat tooth, the first distance threshold, the second distance threshold and the third distance threshold. It is necessary to calibrate the position of the target wafer. If it is necessary to calibrate the position of the target wafer, the position of the target wafer is calibrated according to the distance between the first edge point and the first end of the second wafer boat tooth, the distance between the second edge point and the first end of the first wafer boat tooth, the distance between the third edge point and the first end of the third wafer boat tooth, the first distance threshold, the second distance threshold and the third distance threshold. If it is not necessary to calibrate the position of the target wafer, a first notification message is sent to notify the user to replace the equipment, thereby optimizing the wafer transfer calibration process of the diffusion furnace. It can reasonably set the wafer transfer position calibration process in combination with the deformation of the diffusion furnace, thereby improving the safety of the wafer, reducing resource waste, and improving the reliability of the equipment.

[0063] The present invention also provides a diffusion furnace, comprising: a control module, a manipulator, a wafer boat, and a plurality of wafers. The wafer boat is provided with multiple layers of wafer boat teeth for supporting the wafers, and each layer of wafer boat teeth comprises 90 o The first crystal boat tooth, the second crystal boat tooth and the third crystal boat tooth are provided with an included angle.

[0064] A control module is used to obtain a first distance threshold, a second distance threshold and a third distance threshold; the first distance threshold and the second distance threshold are respectively the minimum distance and the maximum distance between the first edge point on the edge of the target wafer and the first end of the second wafer boat tooth when the target wafer has not fallen and has not collided with the wafer boat of the diffusion furnace, the first end is the end point on the wafer boat tooth away from the target wafer, the target wafer is a wafer transported by a robot, and the third distance threshold is the maximum moving distance of the robot in the direction of the line connecting the second wafer boat tooth and the third wafer boat tooth when the target wafer has not fallen and has not collided with the wafer boat.

[0065] The control module is also used to obtain the distance between the first edge point on the edge of the target wafer and the first end of the second crystal boat tooth, the distance between the second edge point on the edge of the target wafer and the first end of the first crystal boat tooth, and the distance between the third edge point on the edge of the target wafer and the first end of the third crystal boat tooth at the current moment. The first edge point, the second edge point and the third edge point are points located on the edge of the target wafer and opposite to the second crystal boat tooth, the first crystal boat tooth and the third crystal boat tooth respectively.

[0066] The control module is also used to determine whether it is necessary to calibrate the position of the target wafer based on the distance between the first edge point and the first end of the second crystal boat tooth, the distance between the second edge point and the first end of the first crystal boat tooth, the distance between the third edge point and the first end of the third crystal boat tooth, the first distance threshold, the second distance threshold and the third distance threshold; if it is necessary to calibrate the position of the target wafer, calibrate the position of the target wafer based on the distance between the first edge point and the first end of the second crystal boat tooth, the distance between the second edge point and the first end of the first crystal boat tooth, the distance between the third edge point and the first end of the third crystal boat tooth, the first distance threshold, the second distance threshold and the third distance threshold; if it is not necessary to calibrate the position of the target wafer, send a first notification message to notify the user to replace the equipment.

[0067] The present invention also provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the steps provided in the above method embodiment are implemented.

[0068] The present invention provides a program product, which includes computer program instructions. When the computer program instructions are executed, the steps provided in the above method embodiment can be implemented.

[0069] As for the diffusion furnace / storage medium / program product embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the specific content and beneficial effects and other related matters can be referred to the partial description of the method embodiment.

[0070] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0071] The above contents are further detailed descriptions of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A diffusion furnace transmission position calibration method, characterized in that: Applicable to a diffusion furnace, the diffusion furnace comprising: A control module, a manipulator, a wafer boat, and a plurality of wafers. The wafer boat is provided with a plurality of wafer boat teeth for supporting the wafers, and each layer of wafer boat teeth includes equal lengths and are arranged 90 degrees in sequence. o A first crystal boat tooth, a second crystal boat tooth and a third crystal boat tooth having an included angle; The method comprises: The control module acquires a first distance threshold, a second distance threshold and a third distance threshold; the first distance threshold and the second distance threshold are respectively the minimum distance and the maximum distance between a first edge point on the edge of the target wafer and a first end of a second wafer boat tooth when the target wafer has not fallen and has not collided with the wafer boat of the diffusion furnace, the first end being an end point on the wafer boat tooth away from the target wafer, the target wafer being a wafer transported by the robot, and the third distance threshold being a maximum moving distance of the robot in the direction of a line connecting the first wafer boat tooth and the third wafer boat tooth when the target wafer has not fallen and has not collided with the wafer boat; The control module obtains the distance between a first edge point on the edge of the target wafer and the first end of the second wafer boat tooth, the distance between a second edge point on the edge of the target wafer and the first end of the first wafer boat tooth, and the distance between a third edge point on the edge of the target wafer and the first end of the third wafer boat tooth at the current moment, wherein the first edge point, the second edge point, and the third edge point are points located on the edge of the target wafer and opposite to the second wafer boat tooth, the first wafer boat tooth, and the third wafer boat tooth, respectively; The control module determines whether it is necessary to calibrate the position of the target wafer based on the distance between the first edge point and the first end of the second crystal boat tooth, the distance between the second edge point and the first end of the first crystal boat tooth, the distance between the third edge point and the first end of the third crystal boat tooth, the first distance threshold, the second distance threshold and the third distance threshold. If it is necessary to calibrate the position of the target wafer, the position of the target wafer is calibrated based on the distance between the first edge point and the first end of the second crystal boat tooth, the distance between the second edge point and the first end of the first crystal boat tooth, the distance between the third edge point and the first end of the third crystal boat tooth, the first distance threshold, the second distance threshold and the third distance threshold. If it is not necessary to calibrate the position of the target wafer, a first notification message is sent to notify the user to replace the equipment.

2. The method according to claim 1, characterized in that The control module determines whether it is necessary to calibrate the position of the target wafer according to the distance between the first edge point and the first end of the second wafer boat tooth, the distance between the second edge point and the first end of the first wafer boat tooth, the distance between the third edge point and the first end of the third wafer boat tooth, the first distance threshold, the second distance threshold, and the third distance threshold, including: The control module determines whether the distance between the first edge point and the first end of the second wafer boat tooth is less than a first distance threshold, and if so, determines that it is not necessary to calibrate the position of the target wafer, and if not, determines whether the distance between the first edge point and the first end of the second wafer boat tooth is greater than the second distance threshold, and if so, determines that it is not necessary to calibrate the position of the target wafer, and if not, determines the sum of the distance between the second edge point and the first end of the first wafer boat tooth and the distance between the third edge point and the first end of the third wafer boat tooth; The control module determines whether the sum is greater than the third distance threshold, and if so, determines that it is not necessary to calibrate the position of the target wafer, and if not, determines that it is necessary to calibrate the position of the target wafer.

3. The method according to claim 1, characterized in that The control module acquires a first distance threshold, a second distance threshold, and a third distance threshold, including: The control module controls the target wafer to move along the straight line where the second wafer boat teeth are located in the diffusion furnace where no deformation occurs through the manipulator, and determines a first distance threshold and a second distance threshold; The control module controls the target wafer to move along a line connecting the first wafer boat tooth and the third wafer boat tooth in a diffusion furnace where no deformation occurs through the robot, and determines a third distance threshold.

4. The method according to claim 1, characterized in that: The first distance threshold is , the second distance threshold is , the third distance threshold is ,in, Indicates the length of the crystal boat teeth.

5. The method according to any one of claims 1 to 4, characterized in that: The control module calibrates the position of the target wafer according to the distance between the first edge point and the first end of the second wafer boat tooth, the distance between the second edge point and the first end of the first wafer boat tooth, the distance between the third edge point and the first end of the third wafer boat tooth, the first distance threshold, the second distance threshold, and the third distance threshold, including: The control module performs a forward and backward position calibration on the target wafer according to the distance between the first edge point and the first end of the second wafer boat tooth, the first distance threshold and the second distance threshold; The control module calibrates the left-right position of the target wafer according to the distance between the second edge point and the first end of the first wafer boat tooth, the distance between the third edge point and the first end of the third wafer boat tooth, and the third distance threshold.

6. The method according to claim 5, characterized in that The control module calibrates the front-to-back position of the target wafer according to the distance between the first edge point and the first end of the second wafer boat tooth, the first distance threshold, and the second distance threshold, including: The control module controls the robot to move the target wafer so that the first edge point moves to the center of the second wafer boat tooth.

7. The method according to claim 6, characterized in that The control module calibrates the left-right position of the target wafer according to the distance between the second edge point and the first end of the first wafer boat tooth, the distance between the third edge point and the first end of the third wafer boat tooth, and the third distance threshold, including: The control module determines a difference between a distance between the second edge point and a first end of a first wafer boat tooth and a distance between a third edge point on an edge of the target wafer and a first end of a third wafer boat tooth; The control module controls the robot to move the target wafer according to the difference so that the distance between the second edge point and the first end of the first wafer boat tooth is equal to the distance between the third edge point and the first end of the third wafer boat tooth.

8. A diffusion furnace, characterized in that: include: A control module, a robot, a wafer boat, and a plurality of wafers. The wafer boat is provided with multiple layers of wafer boat teeth for supporting the wafers, and each layer of wafer boat teeth includes 90 o A first crystal boat tooth, a second crystal boat tooth and a third crystal boat tooth having an included angle; The control module is used to obtain a first distance threshold, a second distance threshold and a third distance threshold; the first distance threshold and the second distance threshold are respectively the minimum distance and the maximum distance between a first edge point on the edge of the target wafer and the first end of the second wafer boat tooth when the target wafer has not fallen and has not collided with the wafer boat of the diffusion furnace, the first end is the end point on the wafer boat tooth away from the target wafer, the target wafer is the wafer transported by the robot, and the third distance threshold is the maximum moving distance of the robot in the direction of the line connecting the first wafer boat tooth and the third wafer boat tooth when the target wafer has not fallen and has not collided with the wafer boat; The control module is further used to obtain the distance between a first edge point on the edge of the target wafer and the first end of the second wafer boat tooth, the distance between the second edge point on the edge of the target wafer and the first end of the first wafer boat tooth, and the distance between a third edge point on the edge of the target wafer and the first end of the third wafer boat tooth at the current moment, wherein the first edge point, the second edge point, and the third edge point are points located on the edge of the target wafer and opposite to the second wafer boat tooth, the first wafer boat tooth, and the third wafer boat tooth, respectively; The control module is also used to determine whether it is necessary to calibrate the position of the target wafer based on the distance between the first edge point and the first end of the second crystal boat tooth, the distance between the second edge point and the first end of the first crystal boat tooth, the distance between the third edge point and the first end of the third crystal boat tooth, the first distance threshold, the second distance threshold and the third distance threshold; if it is necessary to calibrate the position of the target wafer, calibrate the position of the target wafer based on the distance between the first edge point and the first end of the second crystal boat tooth, the first distance threshold and the second distance threshold, the distance between the second edge point and the first end of the first crystal boat tooth, the distance between the third edge point and the first end of the third crystal boat tooth, and the third distance threshold; if it is not necessary to calibrate the position of the target wafer, send a first notification message to notify the user to replace the equipment.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method according to any one of claims 1 to 7 is implemented.

10. A program product, characterized in that The program product comprises computer program instructions, and when the computer program instructions are executed, the method according to any one of claims 1 to 7 can be implemented.

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