Manufacturing process of lead-free smokeless solder wire

Abstract

The invention discloses a lead-free smokeless solder wire manufacturing process which comprises the following steps: raw material preparation: selecting high-purity tin powder, setting the purity of the tin powder to be PSn, requiring PSn to be greater than or equal to 99.9%, selecting a soldering flux which comprises rosin, an active agent and an antioxidant, the dried tin powder and the soldering flux are put into stirring equipment according to the mass ratio to be fully stirred and mixed, the stirring speed is set to be Vm revolutions per minute, the value range of Vm is 30-80 revolutions per minute, the stirring time is Tm minutes, and the value range of Vm is 15-45 minutes, so that the tin powder and the soldering flux are evenly mixed to form the soldering paste, and the soldering paste is obtained. Extrusion forming is conducted, specifically, the evenly-mixed soldering paste is extruded into soldering tin wires with the specific diameter through extrusion equipment; according to the method, high-purity tin powder is strictly screened, the precision and stability of components of the solder wire are ensured, the performance uniformity of the solder wire is enhanced by optimizing the mixing and stirring speed and time, and the welding defect caused by uneven mixing is effectively avoided.

Description

Technical Field

[0001] The invention relates to the technical field of solder wire manufacturing technology, in particular to a manufacturing process of lead-free and smokeless solder wire. Background Art

[0002] In the field of modern electronic manufacturing, solder wire is an important connection material, and its performance and quality have a vital impact on the reliability and stability of electronic products. With the continuous improvement of environmental protection requirements and people's increasing attention to the health of the working environment, traditional lead-containing solder wire has been gradually eliminated, and lead-free solder wire has been widely used.

[0003] However, there are still some problems with the existing lead-free solder wire manufacturing process. On the one hand, a large amount of smoke is often generated during the welding process, which not only harms the health of operators but also pollutes the environment. On the other hand, some existing solder wires may cause uneven mixing of tin powder and flux during the manufacturing process due to imperfect processes, thus affecting the welding quality and performance.

[0004] In the preparation of raw materials, if the purity of tin powder and the composition of flux are not accurately controlled, impurities may be introduced or the subsequent welding effect may be affected. In the stirring process, if the stirring speed, time and other parameters are not set properly, it may lead to uneven mixing, thus affecting the performance consistency of the solder wire.

[0005] During the extrusion molding stage, improper control of parameters such as extrusion pressure, temperature and speed may cause the dimensional accuracy of the solder wire to not meet the requirements, affecting its operability and welding quality in practical applications.

[0006] For surface treatment, existing processes may not provide sufficiently effective anti-oxidation protection, causing the solder wire to be easily oxidized during storage and use, affecting its service life and welding performance.

[0007] In the winding and packaging process, if the winding speed is not properly controlled or the packaging material is not suitable, it may affect the product's appearance quality and storage stability.

[0008] In addition, the quality traceability and control are not perfect in the entire production process. Once a quality problem occurs, it is difficult to quickly and accurately locate the problem link and take effective solutions. At the same time, the treatment of waste gas and waste residue generated during the production process is not environmentally friendly and efficient, which not only increases the environmental burden, but also does not meet the requirements of sustainable development.

[0009] In summary, in order to meet the demand of the electronics manufacturing industry for high-quality, environmentally friendly solder wire and solve many problems existing in the existing production process, it is of great practical significance and application value to develop an innovative and complete lead-free and smoke-free solder wire production process. Summary of the invention

[0010] The present invention provides a self-service swab testing system and a sampling method to solve the problems mentioned in the above-mentioned prior art.

[0011] In order to achieve the above object, the present invention adopts the following technical scheme: a process for producing lead-free and smokeless solder wire, comprising the following steps:

[0012] Raw material preparation: Select high-purity tin powder, and set the purity of the tin powder to P Sn , requiring P Sn ≥99.9%, select soldering flux, the soldering flux contains rosin, activator and antioxidant components, and set the proportion of rosin content to the total mass of soldering flux as R r The ratio of the active agent content to the total mass of the flux is R a The ratio of antioxidant content to the total mass of flux is R o , and satisfies R r +R a +R o =1, dry the tin powder and flux separately to remove moisture, and the moisture content is required to be no higher than 0.05%;

[0013] Mixing: Mix the dried tin powder and flux according to the mass ratio M Sn :M flux =X:Y, where X:Y=8:1-12:1, put into a stirring device for thorough stirring and mixing, and the stirring speed is set to V m RPM, where V m The value range is 30-80 rpm, and the stirring time is T m Minutes, where V m The value range is 15-45 minutes, so that the tin powder and flux are evenly mixed to form solder paste;

[0014] Extrusion molding: The uniformly mixed solder paste is squeezed into a solder wire with a specific diameter through an extrusion device. The extrusion pressure is P. e , extrusion temperature is T e , continuous extrusion is adopted during the extrusion process, and the extrusion speed is V e m / min, the dimensional accuracy error of the solder wire does not exceed 0.05mm.

[0015] Surface treatment: The solder wire after extrusion is subjected to surface treatment. A coating process is adopted to coat the surface of the solder wire with an anti-oxidation film. The thickness of the anti-oxidation film is d mm, and d≤0.01;

[0016] Reeling and packaging: The surface treated solder wire is reeled through an automatic reeling device, and the reeling speed is set to V wRevolutions / minute, the winding uniformity deviation is required to be no more than 5%, and the solder wire is packaged with sealed packaging materials, which have moisture-proof and anti-static functions.

[0017] Preferably, in the raw material preparation step, the tin powder is screened for particle size, and the tin powder particle size distribution function is set to Where n(d) is the diameter of the tin powder particles, which is the number of particles with diameters between d and d+Δd, and N is the total number of particles. Tin powder with a specific particle size range is screened out. Suppose the diameter range of the tin powder particles is D min ≤d≤D max , so that the tin powder can better combine with the flux in the subsequent mixing, stirring and extrusion molding process;

[0018] In the mixing and stirring step, an intelligent stirring control system is used to automatically adjust the stirring speed and stirring time according to the real-time temperature and viscosity parameters during the stirring process. m With stirring speed T m The relationship function is V m =f(T)=aT 2 +bT+c, where a, b, c are unknown coefficients, and the relationship between viscosity and stirring time is T m =g(η)=dln(η)+e, where d and e are unknown coefficients, and η is the viscosity of the solder paste.

[0019] Preferably, in the extrusion molding step, an online quality detection system is introduced to detect the diameter and roundness parameters of the solder wire in real time. The solder wire diameter detection error function is set to be E d (d)=|d 实际 -d 标准 |, the roundness detection error function is E c (c)=|c 实际 -c 标准 |, where d 实际 is the actual diameter of the solder wire, d 标准 is the set standard diameter, c 实际 is the roundness of solder wire, c 标准 For the set standard roundness, when the parameters are detected to be beyond the set tolerance range, the parameters of the extrusion equipment are automatically adjusted;

[0020] In the surface treatment step, a new type of anti-oxidation film material is used. The anti-oxidation performance of this material is measured by the oxidation reaction rate constant k, which is required to be k≤K threshold , where K threshold is the set oxidation reaction rate constant threshold, and by optimizing the coating process parameters, the coating process parameter vector is The experimental design method was used to determine the optimal combination of process parameters.

[0021] Preferably, in the coiling and packaging step, an intelligent warehouse management system is used to manage the packaged solder wire, and the warehouse environment temperature control function is set as T c (t) = T0 + At, where T0 is the initial temperature, A is the temperature change rate, t is the time, and the humidity control function is H c (h) = H0 + Bh, where H0 is the initial humidity, B is the humidity change rate, and h is the humidity value. By controlling the temperature and humidity of the storage environment, the quality of the solder wire is ensured to be stable during the storage process. The Internet of Things technology is used to monitor the inventory of the solder wire in real time. When the inventory quantity is lower than the set safety inventory level, a replenishment reminder is automatically issued;

[0022] During the entire production process, a quality traceability system is established to record and store the key parameters and quality data of each production link. The quality traceability data storage format is set as F(Q)=Q1×Q2×...×Q m , where Q i It is a collection of quality data for different links, which is associated with each roll of solder wire through a quality traceability code. When quality problems occur, they can be traced back to the link where the problems occurred.

[0023] Preferably, the waste gas and waste residue generated in the production process are treated. For the waste gas, a multi-stage filtration and adsorption device is used. The waste gas purification efficiency function is set as Among them C in is the initial concentration of exhaust gas, C out is the exhaust gas concentration after purification, G is the operating parameters of the exhaust gas treatment device, and by optimizing the operating parameters of the device, the exhaust gas purification efficiency η g ≥95%, meet environmental emission standards, and use recycling technology for waste residues, setting the waste residue recycling rate to Among them, M 回收 is the mass of the recycled waste residue, M 总 Preferably, in the process of tin powder particle size screening, a laser particle size analyzer is used to accurately measure the tin powder particle size, and the measurement accuracy is By optimizing the measurement parameters and algorithms, the measurement accuracy is improved. d ≥98%, the tin powder is classified and stored according to the measurement results, and the storage location of the tin powder is determined by the intelligent storage allocation algorithm. The storage location allocation function is set as Where m and n are unknown coefficients, determined by experiments, and d is the particle size of tin powder;

[0024] In the intelligent mixing control system, a machine learning algorithm is introduced to optimize the mixing process. The prediction accuracy of the machine learning model is assumed to be By collecting mixing process data for training, the prediction accuracy P p ≥90%.

[0025] Preferably, in the online quality detection system, the surface quality of the solder wire is detected by using image processing technology, and the image detection resolution is R i pixels / mm, by improving the image detection resolution, R i ≥100 pixels / mm, transmit the detection data to the quality control center in real time, and set the data transmission delay time function as T d (t) = t 接收 -t 发送 , where t 接收 is the data receiving time,

[0026] t 发送 is the data transmission time. By optimizing the network communication parameters, the data transmission delay time T d ≤100 ms;

[0027] In the process of selecting anti-oxidation film materials and optimizing coating process, corrosion resistance test is carried out, and the corrosion rate function is set as V c (c) = mc n , where m and n are unknown coefficients, c is the concentration of the corrosive medium, and by adjusting the composition of the anti-oxidation film material and the coating process parameters, the corrosion rate V c ≤V threshold , where V threshold is the set corrosion rate threshold.

[0028] Preferably, in the intelligent warehouse management system, an automated handling device is used to carry and store the solder wire, and the positioning accuracy of the handling device is assumed to be P l =|x 实际 -x 目标 | mm, where x 实际 is the actual position coordinate of the handling equipment, x 目标 The target position coordinates are optimized by optimizing the positioning algorithm and sensor technology to improve the positioning accuracy. l ≤5 mm, the path planning of the handling equipment is optimized, and the path planning optimization objective function is set to be F(P)=αD+βT+γE, where is the handling distance, D is the handling time, T is the energy consumption, and E is the weight coefficient. By solving the optimal value of the function, the best handling path is determined;

[0029] In the quality traceability system, blockchain technology is used to trace the security and immutability of data. Suppose the number of blockchain nodes is N. n When querying quality traceability data, let the data query response time function be T q (t) = t 查询结果返回 -t 查询开始 , where t查询结果返回 The query result return time, t 查询开始 is the query start time. By optimizing the data storage and query mechanism of the blockchain, the data query response time is shortened to q ≤500 ms.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] The present invention ensures the accuracy and stability of the solder wire composition by strictly screening high-purity tin powder and accurately controlling the mass ratio of tin powder to flux, thereby significantly improving the consistency and reliability of welding quality.

[0032] By optimizing the mixing speed and time, the tin powder and flux are fully and evenly mixed, which enhances the uniformity of the performance of the solder wire, effectively avoids welding defects caused by uneven mixing, and improves the yield rate of the product.

[0033] During the extrusion process, parameters such as extrusion pressure, temperature and speed are precisely controlled to ensure the dimensional accuracy of the solder wire, so that it can better meet the needs of various precision electronic welding and improve the applicability and versatility of the product.

[0034] A special surface treatment coating process is used to form a thin and effective anti-oxidation film on the surface of the solder wire, which significantly extends the storage life of the solder wire and reduces performance degradation and waste caused by oxidation.

[0035] Reasonable setting of the winding speed ensures the neatness of the winding, combined with packaging materials with moisture-proof and anti-static functions, effectively protects the quality of the solder wire during storage and transportation and reduces the risk of damage.

[0036] Screening the particle size of tin powder during raw material preparation enables the tin powder to better combine with the flux in subsequent processes, further improving the quality and performance of the solder wire.

[0037] The intelligent stirring control system automatically adjusts the stirring speed and time according to real-time parameters, which improves the efficiency and effect of stirring and ensures the uniformity and stability of each stirring.

[0038] The introduction of an online quality inspection system to detect key parameters in real time and adjust extrusion equipment parameters in a timely manner effectively ensures the quality of the solder wire and reduces the production of defective products.

[0039] The optimized coating process parameters and new anti-oxidation film materials significantly improve the anti-oxidation and corrosion resistance of the solder wire and extend its service life.

[0040] The intelligent warehouse management system ensures the storage quality of solder wire by accurately controlling the temperature and humidity of the storage environment. The application of Internet of Things technology realizes real-time monitoring of inventory and avoids out-of-stock situations.

[0041] The establishment of a quality traceability system can quickly and accurately trace back to the problem link, help to solve quality problems in a timely manner, improve the efficiency of production management and the controllability of product quality.

[0042] The effective treatment of waste gas and waste residue not only reduces pollution to the environment and meets environmental emission standards, but also the recycling and reuse of waste residue saves resources and reduces production costs.

[0043] In summary, the lead-free and smokeless solder wire manufacturing process of the present invention has significant beneficial effects in improving product quality, ensuring production efficiency, protecting the environment and saving resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 The present invention provides a schematic diagram of the manufacturing process of the lead-free and smoke-free solder wire. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0047] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. In addition, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, and it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0048] Reference Figure 1 : The production process of lead-free smokeless solder wire includes the following steps:

[0049] Raw material preparation: Select high-purity tin powder, and set the purity of the tin powder to P Sn , requiring P Sn ≥99.9%, select soldering flux, the soldering flux contains rosin, activator and antioxidant components, and set the proportion of rosin content to the total mass of soldering flux as R r The ratio of the active agent content to the total mass of the flux is R a The ratio of antioxidant content to the total mass of flux is R o , and satisfies R r +R a +R o =1, dry the tin powder and flux separately to remove moisture, and the moisture content is required to be no higher than 0.05%;

[0050] Mixing: Mix the dried tin powder and flux according to the mass ratio M Sn ∶M flux =X:Y, where X:Y=8:1-12:1, put into a stirring device for thorough stirring and mixing, and the stirring speed is set to V m RPM, where V m The value range is 30-80 rpm, and the stirring time is T m Minutes, where V m The value range is 15-45 minutes, so that the tin powder and flux are evenly mixed to form solder paste;

[0051] Extrusion molding: The uniformly mixed solder paste is squeezed into a solder wire with a specific diameter through an extrusion device. The extrusion pressure is P. e , extrusion temperature is T e, continuous extrusion is adopted during the extrusion process, and the extrusion speed is V e m / min, the dimensional accuracy error of the solder wire does not exceed 0.05mm.

[0052] Surface treatment: The solder wire after extrusion is subjected to surface treatment. A coating process is adopted to coat the surface of the solder wire with an anti-oxidation film. The thickness of the anti-oxidation film is d mm, and d≤0.01;

[0053] Reeling and packaging: The surface treated solder wire is reeled through an automatic reeling device, and the reeling speed is set to V w Revolutions / minute, the winding uniformity deviation is required to be no more than 5%, and the solder wire is packaged with sealed packaging materials, which have moisture-proof and anti-static functions.

[0054] In the present invention, in the raw material preparation step, the tin powder is screened for particle size, and the tin powder particle size distribution function is set as Where n(d) is the diameter of the tin powder particles, which is the number of particles with diameters between d and d+Δd, and N is the total number of particles. Tin powder with a specific particle size range is screened out. Suppose the diameter range of the tin powder particles is D min ≤d≤D max , so that the tin powder can better combine with the flux in the subsequent mixing, stirring and extrusion molding process;

[0055] In the present invention, in the mixing and stirring step, an intelligent stirring control system is used to automatically adjust the stirring speed and stirring time according to the real-time temperature and viscosity parameters during the stirring process. m With stirring speed T m The relationship function is V m =f(T)=aT 2 +bT+c, where a, b, c are unknown coefficients, and the relationship between viscosity and stirring time is T m =g(η)=dln(η)+e, where d and e are unknown coefficients, and η is the viscosity of the solder paste.

[0056] In the present invention, an online quality detection system is introduced in the extrusion molding step to detect the diameter and roundness parameters of the solder wire in real time. The solder wire diameter detection error function is set as E d (d)=|d 实际 -d 标准 |, the roundness detection error function is E c (c)=|c 实际 -c 标准 |, where d 实际 is the actual diameter of the solder wire, d 标准 is the set standard diameter, c 实际 is the roundness of solder wire, c 标准For the set standard roundness, when the parameters are detected to be beyond the set tolerance range, the parameters of the extrusion equipment are automatically adjusted;

[0057] In the surface treatment step, a new type of anti-oxidation film material is used. The anti-oxidation performance of this material is measured by the oxidation reaction rate constant k, which is required to be k≤K threshold , where K threshold is the set oxidation reaction rate constant threshold, and by optimizing the coating process parameters, the coating process parameter vector is The experimental design method was used to determine the optimal combination of process parameters.

[0058] In the present invention, in the coiling and packaging step, an intelligent warehouse management system is used to manage the packaged solder wire, and the storage environment temperature control function is set as T c (t) = T0 + At, where T0 is the initial temperature, A is the temperature change rate, t is the time, and the humidity control function is H c (h) = H0 + Bh, where H0 is the initial humidity, B is the humidity change rate, and h is the humidity value. By controlling the temperature and humidity of the storage environment, the quality of the solder wire is ensured to be stable during the storage process. The Internet of Things technology is used to monitor the inventory of the solder wire in real time. When the inventory quantity is lower than the set safety inventory level, a replenishment reminder is automatically issued;

[0059] During the entire production process, a quality traceability system is established to record and store the key parameters and quality data of each production link. The quality traceability data storage format is set as F(Q)=Q1×Q2×...×Q m , where Q i It is a collection of quality data for different links, which is associated with each roll of solder wire through a quality traceability code. When quality problems occur, they can be traced back to the link where the problems occurred.

[0060] In the present invention, the waste gas and waste residue generated in the production process are treated. For the waste gas, a multi-stage filtration and adsorption device is used. The waste gas purification efficiency function is set as Among them C in is the initial concentration of exhaust gas, C out is the exhaust gas concentration after purification, G is the operating parameters of the exhaust gas treatment device, and by optimizing the operating parameters of the device, the exhaust gas purification efficiency η g ≥95%, meet environmental emission standards, and use recycling technology for waste residues, setting the waste residue recycling rate to Among them, M 回收 is the mass of the recycled waste residue, M 总 Preferably, in the process of tin powder particle size screening, a laser particle size analyzer is used to accurately measure the tin powder particle size, and the measurement accuracy is By optimizing the measurement parameters and algorithms, the measurement accuracy is improved. d ≥98%, the tin powder is classified and stored according to the measurement results, and the storage location of the tin powder is determined by the intelligent storage allocation algorithm. The storage location allocation function is set as Where m and n are unknown coefficients, determined by experiments, and d is the particle size of tin powder;

[0061] In the intelligent mixing control system, a machine learning algorithm is introduced to optimize the mixing process. The prediction accuracy of the machine learning model is assumed to be By collecting mixing process data for training, the prediction accuracy P p ≥90%.

[0062] In the present invention, in the online quality detection system, the surface quality of the solder wire is detected by using image processing technology, and the image detection resolution is R i pixels / mm, by improving the image detection resolution, R i ≥100 pixels / mm, transmit the detection data to the quality control center in real time, and set the data transmission delay time function as T d (t) = t 接收 -t 发送 , where t 接收 is the data receiving time,

[0063] t 发送 is the data transmission time. By optimizing the network communication parameters, the data transmission delay time T d ≤100 ms;

[0064] In the present invention, during the selection of the anti-oxidation film material and the optimization of the coating process, a corrosion resistance test is performed, and the corrosion rate function is assumed to be V c (c) = mc n , where m and n are unknown coefficients, c is the concentration of the corrosive medium, and by adjusting the composition of the anti-oxidation film material and the coating process parameters, the corrosion rate V c ≤V threshold , where V threshold is the set corrosion rate threshold.

[0065] In the present invention, in the intelligent warehouse management system, an automated handling device is used to carry and store the solder wire. Assume that the positioning accuracy of the handling device is P l =|x 实际 -x 目标 | mm, where x 实际 is the actual position coordinate of the handling equipment, x 目标 The target position coordinates are optimized by optimizing the positioning algorithm and sensor technology to improve the positioning accuracy. l≤5 mm, the path planning of the handling equipment is optimized, and the path planning optimization objective function is set to be F(P)=αD+βT+γE, where is the handling distance, D is the handling time, T is the energy consumption, and E is the weight coefficient. By solving the optimal value of the function, the best handling path is determined;

[0066] In the quality traceability system, blockchain technology is used to trace the security and immutability of data. Suppose the number of blockchain nodes is N. n When querying quality traceability data, let the data query response time function be T q (t) = t 查询结果返回 -t 查询开始 , where t 查询结果返回 The query result return time, t 查询开始 is the query start time. By optimizing the data storage and query mechanism of the blockchain, the data query response time is shortened to q ≤500 ms.

[0067] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A process for producing lead-free and smokeless solder wire, characterized in that: The following steps are involved: Raw material preparation: Select high-purity tin powder, and set the purity of the tin powder to P Sn , requiring P Sn ≥99.9%, select soldering flux, the soldering flux contains rosin, activator and antioxidant components, and set the proportion of rosin content to the total mass of soldering flux as R r The ratio of the active agent content to the total mass of the flux is R a The ratio of antioxidant content to the total mass of flux is R o , and satisfies R r +R a +R o =1, dry the tin powder and flux separately to remove moisture, and the moisture content is required to be no higher than 0.05%; Mixing: Mix the dried tin powder and flux according to the mass ratio M Sn :M flux =X:Y, where X:Y=8:1-12:1, put into a stirring device for thorough stirring and mixing, and the stirring speed is set to V m RPM, where V m The value range is 30-80 rpm, and the stirring time is T m Minutes, where V m The value range is 15-45 minutes, so that the tin powder and flux are evenly mixed to form solder paste; Extrusion molding: The uniformly mixed solder paste is squeezed into a solder wire with a specific diameter through an extrusion device. The extrusion pressure is P. e , extrusion temperature is T e , continuous extrusion is adopted during the extrusion process, and the extrusion speed is V e m / min, the dimensional accuracy error of the solder wire does not exceed 0.05mm. Surface treatment: The solder wire after extrusion is subjected to surface treatment. A coating process is adopted to coat the surface of the solder wire with an anti-oxidation film. The thickness of the anti-oxidation film is d mm, and d≤0.01; Reeling and packaging: The surface treated solder wire is reeled through an automatic reeling device, and the reeling speed is set to V w Revolutions / minute, the winding uniformity deviation is required to be no more than 5%, and the solder wire is packaged with sealed packaging materials, which have moisture-proof and anti-static functions.

2. The process for producing lead-free and smokeless solder wire according to claim 1, characterized in that: In the raw material preparation step, the tin powder is screened for particle size, and the particle size distribution function of the tin powder is assumed to be Where n(d) is the diameter of the tin powder particles, which is the number of particles with diameters between d and d+Δd, and N is the total number of particles. Tin powder with a specific particle size range is screened out. Suppose the diameter range of the tin powder particles is D min ≤d≤D max , so that the tin powder can better combine with the flux in the subsequent mixing, stirring and extrusion molding process; In the mixing and stirring step, an intelligent stirring control system is used to automatically adjust the stirring speed and stirring time according to the real-time temperature and viscosity parameters during the stirring process. m With stirring speed T m The relationship function is V m =f(T)=aT 2 +bT+c, where a, b, c are unknown coefficients, and the relationship between viscosity and stirring time is T m =g(η)=d ln(η)+e, where d and e are unknown coefficients, and η is the viscosity of the solder paste.

3. The process for producing lead-free and smoke-free solder wire according to claim 1, characterized in that: In the extrusion molding step, an online quality inspection system is introduced to detect the diameter and roundness parameters of the solder wire in real time. The solder wire diameter inspection error function is set as E d (d)=|d 实际 -d 标准 |, the roundness detection error function is E c (c)=|c 实际 -c 标准 |, where d 实际 is the actual diameter of the solder wire, d 标准 is the set standard diameter, c 实际 is the roundness of solder wire, c 标准 For the set standard roundness, when the parameters are detected to be beyond the set tolerance range, the parameters of the extrusion equipment are automatically adjusted; In the surface treatment step, a new type of anti-oxidation film material is used. The anti-oxidation performance of this material is measured by the oxidation reaction rate constant k, which is required to be k≤K threshold , where K threshold is the set oxidation reaction rate constant threshold, and by optimizing the coating process parameters, the coating process parameter vector is The experimental design method was used to determine the optimal combination of process parameters.

4. The process for producing lead-free and smoke-free solder wire according to claim 1, characterized in that: In the reeling and packaging step, an intelligent warehouse management system is used to manage the packaged solder wire. The storage environment temperature control function is set as T c (t) = T0 + At, where T0 is the initial temperature, A is the temperature change rate, t is the time, and the humidity control function is H c (h) = H0 + Bh, where H0 is the initial humidity, B is the humidity change rate, and h is the humidity value. By controlling the temperature and humidity of the storage environment, the quality of the solder wire is ensured to be stable during the storage process. The Internet of Things technology is used to monitor the inventory of the solder wire in real time. When the inventory quantity is lower than the set safety inventory level, a replenishment reminder is automatically issued; During the entire production process, a quality traceability system is established to record and store the key parameters and quality data of each production link. The quality traceability data storage format is set as F(Q)=Q1×Q2...×Q m , where Q i It is a collection of quality data from different links, which is associated with each roll of solder wire through a quality traceability code. When quality problems occur, they can be traced back to the link where the problems occurred.

5. The process for producing lead-free and smokeless solder wire according to claim 1, characterized in that: In the production process, the waste gas and waste residue generated are treated. For the waste gas, a multi-stage filtration and adsorption device is used. The waste gas purification efficiency function is set as Among them C in is the initial concentration of exhaust gas, C out is the exhaust gas concentration after purification, G is the operating parameters of the exhaust gas treatment device, and by optimizing the operating parameters of the device, the exhaust gas purification efficiency η g ≥95%, meet environmental emission standards, and use recycling technology for waste residues, setting the waste residue recycling rate to Among them, M 回收 is the mass of the recycled waste residue, M 总 is the total mass of waste slag produced.

6. The process for producing lead-free and smoke-free solder wire according to claim 2, characterized in that: In the process of tin powder particle size screening, a laser particle size analyzer is used to accurately measure the tin powder particle size. By optimizing the measurement parameters and algorithms, the measurement accuracy is improved. d ≥98%, the tin powder is classified and stored according to the measurement results, and the storage location of the tin powder is determined by the intelligent storage allocation algorithm. The storage location allocation function is set as Where m and n are unknown coefficients, determined by experiments, and d is the particle size of tin powder; In the intelligent mixing control system, a machine learning algorithm is introduced to optimize the mixing process. The prediction accuracy of the machine learning model is assumed to be By collecting mixing process data for training, the prediction accuracy P p ≥90%.

7. The process for producing lead-free and smoke-free solder wire according to claim 3, characterized in that: In the online quality inspection system, image processing technology is used to detect the surface quality of the solder wire. Assume that the image detection resolution is R i pixels / mm, by improving the image detection resolution, R i ≥100 pixels / mm, transmit the detection data to the quality control center in real time, and set the data transmission delay time function as T d (t) = t 接收 -t 发送 , where t 接收 is the data receiving time, t 发送 is the data transmission time. By optimizing the network communication parameters, the data transmission delay time T d ≤100 ms; In the process of selecting anti-oxidation film materials and optimizing coating process, corrosion resistance test is carried out, and the corrosion rate function is set as V c (c) = mc n , where m and n are unknown coefficients, c is the concentration of the corrosive medium, and by adjusting the composition of the anti-oxidation film material and the coating process parameters, the corrosion rate V c ≤V threshold , where V threshold is the set corrosion rate threshold.

8. The process for producing lead-free and smoke-free solder wire according to claim 4, characterized in that: In the intelligent warehouse management system, automated handling equipment is used to carry and store solder wire. The positioning accuracy of the handling equipment is assumed to be P. l =|x 实际 -x 目标 | mm, where x 实际 is the actual position coordinate of the handling equipment, x 目标 The target position coordinates are optimized by optimizing the positioning algorithm and sensor technology to improve the positioning accuracy. l ≤5 mm, the path planning of the handling equipment is optimized, and the path planning optimization objective function is set to be F(P)=αD+βT+γE, where is the handling distance, D is the handling time, T is the energy consumption, and E is the weight coefficient. By solving the optimal value of the function, the best handling path is determined; In the quality traceability system, blockchain technology is used to trace the security and immutability of data. Suppose the number of blockchain nodes is N. n When querying quality traceability data, let the data query response time function be T q (t) = t 查询结果返回 -t 查询开始 , where t 查询结果返回 The query result return time, t 查询开始 is the query start time. By optimizing the data storage and query mechanism of the blockchain, the data query response time is shortened to q ≤500 ms.

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