Edge grinding method and device and wafer grinding equipment

Abstract

The invention provides an edge grinding method and device and wafer grinding equipment, and belongs to the technical field of semiconductor manufacturing. The edge grinding device comprises a bearing assembly used for bearing a to-be-ground wafer and driving the to-be-ground wafer to rotate; the grinding assembly is used for grinding the edge of the to-be-ground wafer when the to-be-ground wafer rotates; the first image sensor is arranged above and / or below the to-be-ground wafer and is used for acquiring an edge image of the to-be-ground wafer when the bearing assembly drives the to-be-ground wafer to rotate; and the control unit is used for judging whether the to-be-ground wafer has poor edges or not according to the edge image acquired by the first image sensor, and sending a control signal to the grinding assembly according to a judgment result. The grinding wheel can be prevented from being scratched by the wafer with the notch in the edge.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to an edge grinding method and device, and wafer grinding equipment. Background Art

[0002] In the related art, a grinding wheel is used to grind the edge of a wafer. If the wafer has a chip, the wafer will scratch the grinding wheel after entering the wafer grinding equipment. The scratched grinding wheel will cause more chips to appear on the wafer after edge grinding of the wafer, thereby reducing the product yield. In addition, after the grinding wheel is scratched, the machine needs to be shut down and the grinding wheel needs to be replaced, which affects production capacity and causes waste of manpower and material resources. Summary of the invention

[0003] The invention provides an edge grinding method and device, and wafer grinding equipment, which can prevent a wafer with a notch on the edge from scratching a grinding wheel.

[0004] In order to achieve the above object, the technical solution adopted by the embodiment of the present invention is:

[0005] An edge grinding device, comprising:

[0006] A carrying assembly, used for carrying the wafer to be ground and driving the wafer to be ground to rotate;

[0007] A grinding assembly, used for grinding the edge of the wafer to be ground when the wafer to be ground rotates;

[0008] A first image sensor disposed above and / or below the wafer to be ground, used to obtain an edge image of the wafer to be ground when the carrier assembly drives the wafer to be ground to rotate;

[0009] A control unit is used to determine whether the wafer to be ground has an edge defect according to the edge image acquired by the first image sensor, and send a control signal to the grinding component according to the determination result.

[0010] In some embodiments, the control unit is specifically used to send a first control signal to the grinding component to control the grinding component to grind the wafer to be ground when it is determined that the wafer to be ground has no edge defects; and send a second control signal to the grinding component to control the grinding component to pause grinding the wafer to be ground when it is determined that the wafer to be ground has edge defects.

[0011] In some embodiments, the control unit is specifically used to compare the edge image of the wafer to be ground with the edge image of a standard wafer. If the edge image of the wafer to be ground does not match the edge image of the standard wafer, it is judged that the wafer to be ground has a bad edge; if the edge image of the wafer to be ground matches the edge image of the standard wafer, it is judged that the wafer to be ground does not have a bad edge.

[0012] In some embodiments, the edge grinding device further comprises an alarm unit;

[0013] The control unit is also used to send an alarm signal to the alarm unit when the edge of the wafer to be ground is defective;

[0014] The alarm unit is also used to issue an alarm after receiving the alarm signal.

[0015] In some embodiments, the edge grinding device further comprises:

[0016] A second image sensor disposed at one side of the grinding assembly, used for acquiring a groove image of the grinding assembly after the grinding assembly grinds the wafer to be ground;

[0017] A control unit is used to determine whether the grinding component has groove scratches based on the groove image obtained by the second image sensor, and to generate a control signal to the grinding component based on the determination result.

[0018] In some embodiments, the control unit is specifically used to send a third control signal to the grinding component to control the grinding component to suspend operation when it is determined that the grinding component has groove scratches; and send a fourth control signal to the grinding component to control the grinding component to work normally when it is determined that the grinding component has no groove scratches.

[0019] In some embodiments, the control unit is specifically used to compare the groove image of the grinding component with the groove image of a standard grinding component. If the groove image of the grinding component does not match the groove image of the standard grinding component, it is determined that the grinding component has groove scratches; if the groove image of the grinding component matches the groove image of the standard grinding component, it is determined that the grinding component has no groove scratches.

[0020] In some embodiments, the edge grinding device further comprises a shaping unit;

[0021] The control unit is also used to send a shaping signal to the shaping unit when it is determined that the grinding component has groove scratches;

[0022] The shaping unit is further used to shape the grinding component after receiving the shaping signal.

[0023] An embodiment of the present invention further provides a wafer grinding device, comprising the edge grinding device as described above.

[0024] An embodiment of the present invention further provides an edge grinding method, which is applied to the edge grinding device as described above, and the method comprises:

[0025] Controlling the carrying assembly to carry the wafer to be ground and to drive the wafer to be ground to rotate;

[0026] When the carrying component drives the wafer to be ground to rotate, controlling the first image sensor to acquire an edge image of the wafer to be ground;

[0027] The control unit determines whether the wafer to be ground has edge defects based on the edge image acquired by the first image sensor, and sends a control signal to the grinding component based on the judgment result to control the grinding component whether to grind the edge of the wafer to be ground.

[0028] The beneficial effects of the present invention are:

[0029] In this embodiment, a first image sensor is arranged above and below the wafer to be ground, and can obtain an edge image of the wafer to be ground when the supporting component drives the wafer to be ground to rotate. It is judged whether the wafer to be ground has edge defects based on the edge image obtained by the first image sensor. The technical solution of this embodiment can effectively detect the edge status of each wafer before and after grinding, and timely detect chip defects on the wafer. Then, the operation of the equipment can be stopped in time after the chip defects on the wafer are detected, so as to avoid the wafer with chip defects scratching the grinding wheel and the wafer with chip defects after processing entering the next process, thereby minimizing chip defects and the negative impact caused by chip defects as much as possible. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram showing the structure of an edge grinding device in the related art;

[0031] Figure 2 A schematic diagram showing the structure of an edge grinding device according to an embodiment of the present invention;

[0032] Figure 3 A schematic diagram showing the use of a second image sensor to detect a grinding component according to an embodiment of the present invention;

[0033] Figure 4 A schematic diagram showing cleaning of a bearing assembly according to an embodiment of the present invention.

[0034] Reference numerals

[0035] 11 Load bearing components

[0036] 12 Wafers to be ground

[0037] 13 Grinding components

[0038] 14 First Image Sensor

[0039] 15. Second image sensor

[0040] 16. Clean the nozzle DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0042] Figure 1 A schematic diagram showing the structure of an edge grinding device in the related art is shown in FIG. Figure 1 As shown, in the related art, a carrying component 11 is used to carry a wafer 12 to be ground and drive the wafer 12 to be ground to rotate. While the wafer 12 to be ground is rotating, a grinding component 13 is used to grind the wafer. Specifically, the grinding component 13 can be a grinding wheel. Since the edge of the wafer is not detected before grinding, it is easy for a wafer with a chip to scratch the grinding wheel after entering the wafer grinding equipment, and the scratched grinding wheel will cause more gaps on the wafer after grinding the edge of the wafer.

[0043] The invention provides an edge grinding method and device, and wafer grinding equipment, which can prevent a wafer with a notch on the edge from scratching a grinding wheel.

[0044] An embodiment of the present invention provides an edge grinding device, such as Figure 2-Figure 3 As shown, including:

[0045] The carrying assembly 11 is used to carry the wafer 12 to be ground and drive the wafer 12 to be ground to rotate;

[0046] A grinding assembly 13, used for grinding the edge of the wafer 12 to be ground when the wafer 12 to be ground rotates;

[0047] A first image sensor 14 disposed above and / or below the wafer to be ground 12, for acquiring an edge image of the wafer to be ground 12 when the carrier assembly 11 drives the wafer to be ground 12 to rotate;

[0048] The control unit is used to determine whether the wafer to be ground 12 has an edge defect according to the edge image acquired by the first image sensor 14, and send a control signal to the grinding component 13 according to the determination result.

[0049] In this embodiment, a first image sensor 14 is arranged above and below the wafer 12 to be ground, and can obtain an edge image of the wafer 12 to be ground when the supporting component 11 drives the wafer 12 to be ground to rotate. According to the edge image obtained by the first image sensor 14, it is judged whether the wafer 12 to be ground has edge defects. The technical solution of this embodiment can effectively detect the edge state of each wafer before and after grinding, and timely detect chip defects of the wafer. Then, the operation of the equipment can be stopped in time after the chip defects of the wafer are found, so as to avoid the wafer with chip defects scratching the grinding wheel and the wafer with chip defects after processing entering the next process, thereby minimizing chip defects and the negative impact caused by chip defects as much as possible.

[0050] In this embodiment, the first image sensor 14 can be set only above the wafer to be ground 12, or only below the wafer to be ground 12. In order to improve the accuracy of detection, the first image sensor 14 can also be set both above and below the wafer to be ground 12. When the supporting component 11 drives the wafer to be ground 12 to rotate, the first image sensor 14 can obtain the edge image of the wafer to be ground 12 according to a preset shooting interval, and send the obtained edge image of the wafer to be ground 12 to the control unit. The edge image of each model of standard wafer is stored in the control unit. The control unit can compare the edge image of the wafer to be ground 12 with the edge image of the standard wafer to determine whether the wafer to be ground 12 has a bad edge.

[0051] In some embodiments, the control unit is specifically configured to compare the edge image of the wafer to be ground 12 with the edge image of a standard wafer. If the edge image of the wafer to be ground 12 does not match the edge image of the standard wafer, it is determined that the wafer to be ground 12 has a bad edge; if the edge image of the wafer to be ground 12 matches the edge image of the standard wafer, it is determined that the wafer to be ground 12 does not have a bad edge. In this embodiment, by comparing the edge image of the wafer to be ground 12 with the edge image of the standard wafer, it is possible to quickly and conveniently determine whether the wafer to be ground 12 has a bad edge.

[0052] In some embodiments, the control unit is specifically used to send a first control signal to the grinding component 13 to control the grinding component 13 to grind the wafer to be ground 12 when it is determined that the wafer to be ground 12 has no edge defects; and send a second control signal to the grinding component 13 to control the grinding component 13 to pause grinding the wafer to be ground 12 when it is determined that the wafer to be ground 12 has edge defects.

[0053] In this embodiment, when it is determined that the wafer 12 to be ground has a defective edge, the operation of the equipment can be stopped in time to prevent the wafer with a defective chip from scratching the grinding component and the wafer with a defective chip from entering the next process after processing, thereby minimizing the chip defect and the negative impact caused by the chip defect.

[0054] In some embodiments, the edge grinding device further comprises an alarm unit;

[0055] The control unit is also used to send an alarm signal to the alarm unit when the edge of the wafer 12 to be ground is defective;

[0056] The alarm unit is also used to give an alarm after receiving the alarm signal. The alarm unit can notify the operator by sounding a horn, flashing a light, sending an alarm code by email, etc. After receiving the alarm information, the operator can manually intervene to check the wafer grinding equipment, remove the wafer with defective chips, avoid the wafer with defective chips from scratching the grinding components, and allow the wafer with defective chips to enter the next process after processing.

[0057] In some embodiments, Figure 3 As shown, the edge grinding device also includes:

[0058] A second image sensor 15 disposed at one side of the grinding assembly 13, used for acquiring a groove image of the grinding assembly 13 after the grinding assembly 13 grinds the wafer 12 to be ground;

[0059] The control unit is used to determine whether the grinding component 13 has groove scratches according to the groove image obtained by the second image sensor 15, and generate a control signal to the grinding component 13 according to the determination result.

[0060] In this embodiment, during the idle period after the grinding assembly 13 grinds the wafer, the grinding assembly 13 can be controlled to rotate slowly, and the second image sensor 15 can be used to detect the grinding assembly 13 to obtain the groove image of the grinding assembly 13 to detect the grinding wheel scratch. The second image sensor 15 can obtain the groove image of the grinding assembly 13 according to the preset shooting interval, and send the obtained groove image of the grinding assembly 13 to the control unit, which stores the groove image of each model of the standard grinding assembly. The groove image of the grinding assembly 13 can be compared with the groove image of the standard grinding assembly to determine whether the grinding assembly 13 has groove scratches.

[0061] In some embodiments, the control unit is specifically used to compare the groove image of the grinding component 13 with the groove image of the standard grinding component 13. If the groove image of the grinding component 13 does not match the groove image of the standard grinding component 13, it is determined that the grinding component 13 has groove scratches; if the groove image of the grinding component 13 matches the groove image of the standard grinding component 13, it is determined that the grinding component 13 has no groove scratches. In this embodiment, by comparing the groove image of the grinding component 13 with the groove image of the standard grinding component, it can be conveniently and quickly determined whether the grinding component 13 has scratches.

[0062] In some embodiments, the control unit is specifically used to send a third control signal to the grinding component 13 to control the grinding component 13 to suspend operation when it is determined that the grinding component 13 has groove scratches; and send a fourth control signal to the grinding component 13 to control the grinding component 13 to work normally when it is determined that the grinding component 13 has no groove scratches. In this embodiment, the abnormality can be detected in time when the grinding component 13 has an abnormality, so as to avoid more defects and minimize chip defects and the negative impact caused by chip defects.

[0063] In some embodiments, the edge grinding device further comprises a shaping unit;

[0064] The control unit is also used to send a shaping signal to the shaping unit when it is determined that the grinding assembly 13 has groove scratches;

[0065] The shaping unit is further configured to shape the grinding assembly 13 after receiving the shaping signal.

[0066] In this embodiment, when the groove scratches of the grinding component 13 are detected, the shaping unit can be notified in time to shape the grinding component 13 to avoid more defects.

[0067] An embodiment of the present invention further provides a wafer grinding device, comprising the edge grinding device as described above.

[0068] The wafer grinding equipment of this embodiment can effectively detect the edge status of each wafer before and after grinding, and promptly detect chip defects on the wafer. After detecting chip defects on the wafer, the equipment can be stopped in time to avoid wafers with chip defects scratching the grinding wheel and wafers with chip defects entering the next process after processing, thereby minimizing chip defects and the negative impact caused by chip defects.

[0069] An embodiment of the present invention further provides an edge grinding method, which is applied to the edge grinding device as described above, and the method comprises:

[0070] Controlling the carrying assembly 11 to carry the wafer 12 to be ground and to drive the wafer 12 to be ground to rotate;

[0071] When the carrier assembly 11 drives the wafer to be ground 12 to rotate, the first image sensor 14 is controlled to acquire an edge image of the wafer to be ground 12;

[0072] The control unit determines whether the wafer 12 to be ground has a defective edge based on the edge image acquired by the first image sensor 14 , and sends a control signal to the grinding component 13 based on the judgment result to control the grinding component 13 whether to grind the edge of the wafer 12 to be ground.

[0073] In this embodiment, a first image sensor 14 is arranged above and below the wafer 12 to be ground, and can obtain an edge image of the wafer 12 to be ground when the supporting component 11 drives the wafer 12 to be ground to rotate. According to the edge image obtained by the first image sensor 14, it is judged whether the wafer 12 to be ground has edge defects. The technical solution of this embodiment can effectively detect the edge state of each wafer before and after grinding, and timely detect chip defects of the wafer. Then, the operation of the equipment can be stopped in time after the chip defects of the wafer are found, so as to avoid the wafer with chip defects scratching the grinding wheel and the wafer with chip defects after processing entering the next process, thereby minimizing chip defects and the negative impact caused by chip defects as much as possible.

[0074] In this embodiment, a first image sensor 14 is arranged above and below the wafer 12 to be ground, and can obtain an edge image of the wafer 12 to be ground when the supporting component 11 drives the wafer 12 to be ground to rotate. According to the edge image obtained by the first image sensor 14, it is judged whether the wafer 12 to be ground has edge defects. The technical solution of this embodiment can effectively detect the edge state of each wafer before and after grinding, and timely detect chip defects of the wafer. Then, the operation of the equipment can be stopped in time after the chip defects of the wafer are found, so as to avoid the wafer with chip defects scratching the grinding wheel and the wafer with chip defects after processing entering the next process, thereby minimizing chip defects and the negative impact caused by chip defects as much as possible.

[0075] In this embodiment, a second image sensor 15 can also be set on one side of the grinding component 13. After the grinding component 13 grinds the wafer 12 to be ground, the second image sensor 15 obtains the groove image of the grinding component 13; the control unit can judge whether the grinding component 13 has groove scratches based on the groove image obtained by the second image sensor 15, and send a control signal to the grinding component 13 based on the judgment result.

[0076] In one specific embodiment, the edge grinding method comprises the following steps:

[0077] Step 1: Before edge grinding of the wafer, the carrier assembly 11 is controlled to drive the wafer 12 to be ground to rotate, and while detecting the thickness and notch data of the wafer, the first image sensor 14 is used to detect edge defects;

[0078] Step 2, the control unit determines whether the wafer has a chip defect according to the edge image of the wafer to be ground 12 obtained by the first image sensor 14, and if so, turns to step 3; if not, turns to step 5; specifically, the control unit compares the edge image of the wafer to be ground 12 with the edge image of the standard wafer, and if the edge image of the wafer to be ground 12 does not match the edge image of the standard wafer, it is determined that the wafer to be ground 12 has an edge defect; if the edge image of the wafer to be ground 12 matches the edge image of the standard wafer, it is determined that the wafer to be ground 12 does not have an edge defect;

[0079] Step 3: The control unit sends an alarm signal to the alarm unit, which can notify the operator by honking, flashing lights, sending an alarm code via email, etc.

[0080] Step 4, the grinding assembly 13 suspends grinding, and the operator can confirm whether the wafer has a chip defect. If so, the wafer is scrapped; if not, go to step 5;

[0081] Step 5: The wafer grinding equipment operates normally and performs edge grinding on the wafer;

[0082] Step 6: After the wafer is ground, the grinding assembly 13 rotates slowly;

[0083] Step 7, use the second image sensor 15 to detect the grooves of the grinding component 13, and determine whether the grooves of the grinding component 13 are scratched. If yes, go to step 8; if not, go to step 11; specifically, the control unit can compare the groove image of the grinding component 13 with the groove image of the standard grinding component 13. If the groove image of the grinding component 13 does not match the groove image of the standard grinding component 13, it is determined that the grinding component 13 has groove scratches; if the groove image of the grinding component 13 matches the groove image of the standard grinding component 13, it is determined that the grinding component 13 has no groove scratches.

[0084] Step 8: The control unit sends an alarm signal to the alarm unit, which can notify the operator by honking, flashing lights, sending an alarm code via email, etc.

[0085] Step 9, the wafer grinding equipment is suspended, and the operator can confirm whether the grinding assembly 13 has groove scratches. If yes, go to step 10, if not, go to step 11;

[0086] Step 10: shaping the grooves of the grinding assembly 13 using a shaping unit;

[0087] Step 11: The wafer grinding equipment operates normally.

[0088] like Figure 4 As shown, after the wafer grinding equipment operation is completed, the cleaning nozzle 16 can also be used to clean the carrier component 11.

[0089] In this embodiment, defective chips of wafers and defective grooves of grinding components can be discovered in time, so as to avoid wafers with defective chips from scratching the grinding wheel and grinding components with scratched grooves from continuing to work, thereby minimizing the negative impact of defective chips and the negative impact caused by defective chips.

[0090] It should be noted that each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the embodiments, since they are basically similar to the product embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the product embodiments.

[0091] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0092] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0093] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0094] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. An edge grinding device, characterized in that: include: A carrying assembly, used for carrying the wafer to be ground and driving the wafer to be ground to rotate; A grinding assembly, used for grinding the edge of the wafer to be ground when the wafer to be ground rotates; A first image sensor disposed above and / or below the wafer to be ground, used to obtain an edge image of the wafer to be ground when the carrier assembly drives the wafer to be ground to rotate; A control unit is used to determine whether the wafer to be ground has an edge defect according to the edge image acquired by the first image sensor, and send a control signal to the grinding component according to the determination result.

2. The edge grinding device according to claim 1, characterized in that: The control unit is specifically used to send a first control signal to the grinding component to control the grinding component to grind the wafer to be ground when it is determined that the wafer to be ground has no edge defects; and send a second control signal to the grinding component to control the grinding component to suspend grinding the wafer to be ground when it is determined that the wafer to be ground has edge defects.

3. The edge grinding device according to claim 1, characterized in that: The control unit is specifically used to compare the edge image of the wafer to be ground with the edge image of the standard wafer. If the edge image of the wafer to be ground does not match the edge image of the standard wafer, it is judged that the wafer to be ground has a bad edge; if the edge image of the wafer to be ground matches the edge image of the standard wafer, it is judged that the wafer to be ground does not have a bad edge.

4. The edge grinding device according to claim 1, characterized in that: The edge grinding device also includes an alarm unit; The control unit is also used to send an alarm signal to the alarm unit when the edge of the wafer to be ground is defective; The alarm unit is also used to issue an alarm after receiving the alarm signal.

5. The edge grinding device according to claim 1, characterized in that: The edge grinding device also includes: A second image sensor disposed at one side of the grinding assembly, used for acquiring a groove image of the grinding assembly after the grinding assembly grinds the wafer to be ground; A control unit is used to determine whether the grinding component has groove scratches based on the groove image obtained by the second image sensor, and to generate a control signal to the grinding component based on the determination result.

6. The edge grinding device according to claim 5, characterized in that: The control unit is specifically used to send a third control signal to the grinding component to control the grinding component to suspend operation when it is determined that the grinding component has groove scratches; and send a fourth control signal to the grinding component to control the grinding component to work normally when it is determined that the grinding component has no groove scratches.

7. The edge grinding device according to claim 5, characterized in that: The control unit is specifically used to compare the groove image of the grinding component with the groove image of the standard grinding component, and if the groove image of the grinding component does not match the groove image of the standard grinding component, it is determined that the grinding component has groove scratches; If the groove image of the grinding component matches the groove image of the standard grinding component, it is determined that the grinding component has no groove scratches.

8. The edge grinding device according to claim 5, characterized in that: The edge grinding device also includes a shaping unit; The control unit is also used to send a shaping signal to the shaping unit when it is determined that the grinding component has groove scratches; The shaping unit is further used to shape the grinding component after receiving the shaping signal.

9. A wafer grinding device, characterized in that: The invention comprises an edge grinding device as claimed in any one of claims 1 to 8.

10. An edge grinding method, characterized in that: Applied to the edge grinding device according to any one of claims 1 to 8, the method comprising: Controlling the carrying assembly to carry the wafer to be ground and to drive the wafer to be ground to rotate; When the carrying component drives the wafer to be ground to rotate, controlling the first image sensor to acquire an edge image of the wafer to be ground; The control unit determines whether the wafer to be ground has edge defects based on the edge image acquired by the first image sensor, and sends a control signal to the grinding component based on the judgment result to control the grinding component whether to grind the edge of the wafer to be ground.

Images