A wafer positioning and cutting device

Abstract

The present invention discloses a wafer positioning and cutting device, comprising a base plate, support plate 1 and support plate 2 are mounted on the base plate, a protective frame is mounted on the upper end of support plate 1, a limit frame is mounted on support plate 2, a driving component and a connecting component are mounted on the base plate, the upper ends of the driving component and the connecting component are both movably clamped in the limit frame, a toggle component is also mounted on support plate 2, a clamping and fixing component 1, a clamping and fixing component 2 and a clamping and fixing component 3 are movably clamped in the limit frame, and the clamping and fixing component 1, the clamping and fixing component 2 and the clamping and fixing component 3 are all movably disposed in the protective frame. The present invention belongs to the technical field of wafer cutting equipment, and the squeezing and fixing bag bulges to fix wafers of different sizes, and the gas in the ventilation cavity is discharged from the blowing hole to blow the wafer during cutting to reduce dust falling on the wafer, and the setting of the push bag facilitates the removal of the cut wafer.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer cutting equipment, and in particular relates to a wafer positioning and cutting device. Background Art

[0002] Wafer refers to the silicon wafer used in the manufacture of silicon semiconductor integrated circuits. Various circuit element structures can be processed on the silicon wafer to become IC products with specific electrical functions. Wafer processing requires the entire wafer to be divided into single chips according to chip size. It is found that the existing wafer cutting equipment has poor cleaning effect of the powder generated during cutting, so that the fine powder generated during the cutting process is adsorbed on the surface of the wafer, affecting the cleanliness of the wafer. At the same time, the positioning and fixing structure of the wafer in the existing equipment is simple, and it is impossible to maintain the stability and position accuracy of the wafer during the cutting process. Once the wafer is offset during the cutting process, the entire wafer board will be scrapped. In addition, there will be wafers of different diameters in the actual processing process, and the existing fixing equipment is not convenient for fixing wafers of different diameters. Summary of the invention

[0003] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides a wafer positioning and cutting device.

[0004] The technical solution adopted by the present invention is as follows: A wafer positioning and cutting device comprises a base plate for supporting and fixing, a support plate one and a support plate two are installed on the base plate, a protective frame is installed on the upper end of the support plate one, a limit frame is installed on the support plate two, the limit frame is arranged at the lower end of the protective frame, the protective frame and the limit frame are both hollow structures that pass through from top to bottom, a driving assembly and a connecting assembly are also installed on the base plate, the upper ends of the driving assembly and the connecting assembly are both movably clamped in the limit frame, a toggle assembly is also installed on the support plate two, the toggle assembly is arranged at the lower end of the limit frame and between the connecting assembly and the driving assembly, a clamping and fixing assembly one, a clamping and fixing assembly two and a clamping and fixing assembly three are movably clamped in the limit frame, and the upper ends of the clamping and fixing assembly one, the clamping and fixing assembly two and the clamping and fixing assembly three are all movably arranged in the protective frame.

[0005] Preferably, a slide is provided on the upper wall of the protective frame, and the upper ends of the clamping and fixing component one, the clamping and fixing component two and the clamping and fixing component three are all movably connected to the slide. When the clamping and fixing component one, the clamping and fixing component two and the clamping and fixing component three move along the upper wall of the slide, they can move up and down along the trajectory of the slide.

[0006] Furthermore, the driving assembly includes a connecting plate 1, a motor and a driving shaft 1, the motor is arranged on the upper wall of the base plate, the lower end of the connecting plate 1 is arranged on the upper wall of the base plate, the driving shaft 1 is movably arranged on the upper end of the connecting plate 1, and the connecting plate 1 supports and fixes the driving shaft 1, the output shaft end of the motor is connected to the lower end of the driving shaft 1, a gear 1 is installed on the driving shaft 1, the gear 1 is arranged on the upper end of the connecting plate 1, and a driving disk 1 is installed on the upper end of the driving shaft 1, and the driving disk 1 is movably clamped in a limit frame.

[0007] As a preferred embodiment of the present invention, the connecting assembly includes a connecting plate 2 and a driving shaft 2, the lower end of the connecting plate 2 is arranged on the upper wall of the base plate, the driving shaft 2 is movably arranged on the upper end of the connecting plate 2, the lower end of the driving shaft 2 is movably arranged on the base plate, the upper end of the driving shaft 2 is arranged in a limiting frame, the connecting plate 2 and the base plate support and fix the driving shaft 2, a gear 2 is installed on the driving shaft 2, the gear 2 is arranged at the upper end of the connecting plate 2, the gear 1 and the gear 2 are meshed and connected, a driving disk 2 is installed on the upper end of the driving shaft 2, and the driving disk 2 is movably clamped in the limiting frame.

[0008] Among them, the driving disk 1 is provided with multiple groups of card slots 1, and the multiple groups of card slots 1 are evenly arranged on the driving disk 1 in a ring shape and at equal intervals. The driving disk 2 is provided with multiple groups of card slots 2, and the multiple groups of card slots 2 are evenly arranged on the driving disk 2 in a ring shape and at equal intervals. The number of card slots 1 and card slots 2 is the same. The driving disk 1 and the driving disk 2 respectively drive the card slots 1 and the card slots 2 to rotate. When the card slots 1 and the card slots 2 rotate to a position close to each other, the card slots 1 and the card slots 2 gradually merge into a circular slot hole. The clamping and fixing component 1, the clamping and fixing component 2 and the clamping and fixing component 3 are respectively movably clamped in the card slots 1 and the card slots 2.

[0009] Furthermore, the toggle assembly is arranged between gear one and drive disk one and between gear two and drive disk two, and the toggle assembly includes a mounting seat, and the mounting seat is arranged on the side wall of support plate two, and support plate two supports and fixes the mounting seat, and a toggle piece is movably installed on one side wall of the mounting seat, and a plug rod one is installed on the other side wall of the mounting seat, a baffle is connected to the center position of the toggle piece, and a plug rod two is installed on the baffle, and a spring two is movably installed on the plug rod one and the plug rod two.

[0010] Among them, the clamping and fixing assemblies one, two, and three have the same structure, and only one of the groups will be introduced here. The clamping and fixing assembly three includes a lower limit plate, an upper limit plate, a connecting rod one, and a connecting rod two. The connecting rod one is matched with the clamping groove one and the clamping groove two respectively, and the connecting rod one can be movably clamped in the clamping groove one and the clamping groove two respectively. The upper end of the connecting rod one extends out of the upper wall of the limit frame, and the lower end of the connecting rod one extends out of the bottom wall of the limit frame. The lower limit plate is installed at the lower end of the connecting rod one, and the lower limit plate is movably arranged on the bottom wall of the limit frame. The upper limit plate is installed on the connecting rod one, and the upper limit plate is movably arranged on the upper wall of the limit frame. The connecting rod two is a cavity structure with an open lower end. The connecting rod two is movably sleeved on the upper end of the connecting rod one, and the connecting rod two is arranged above the upper limit plate.

[0011] Further, a placement plate for receiving a wafer is installed on the upper wall of the connecting rod two. A first spring is installed between the placement plate and the upper limit plate. The first spring is sleeved outside the connecting rod one and the connecting rod two. A folding bladder is also installed on the upper wall of the upper limit plate. An elastic bladder is connected to the upper wall of the folding bladder. The upper end of the elastic bladder is connected to the bottom wall of the placement plate. Both the folding bladder and the elastic bladder are cavity structures. A sealed space is formed among the folding bladder, the elastic bladder, the upper limit plate, and the placement plate. The first spring is arranged in the folding bladder and the elastic bladder. A placement groove is provided in the placement plate. An annular retaining member is installed on the upper wall of the placement plate. A pushing bladder is installed on the bottom wall of the placement groove. A sealed space is formed between the pushing bladder and the bottom wall of the placement groove. An extrusion and fixing bladder is provided on the inner side wall of the placement groove.

[0012] Preferably, a plurality of air blowing holes for gas circulation are provided on the inner side wall of the retaining member. The plurality of air blowing holes are arranged on the retaining member in an annular and equally spaced manner. The air blowing holes are placed in an inclined downward state. An air vent ring is installed in the side wall of the retaining member. A plurality of first air pipes for gas circulation are installed in the placement plate. An air vent cavity is also provided in the placement plate. The air blowing holes are connected to the air vent ring in a through manner. The upper ends of the first air pipes are connected to the air vent ring in a through manner. The lower ends of the first air pipes are connected to the air vent cavity in a through manner. Second, third, and fourth air pipes are also provided in the placement plate. The upper end of the second air pipe is connected to the air vent cavity in a through manner. The lower end of the second air pipe is connected to the sealed space in the elastic bladder in a through manner. The lower end of the third air pipe is connected to the air vent cavity in a through manner. The upper end of the third air pipe is connected to the sealed space in the pushing bladder in a through manner. The lower end of the fourth air pipe is connected to the air vent cavity in a through manner. The upper end of the fourth air pipe is connected to the extrusion and fixing bladder in a through manner. Control valves are provided in the first, third, and fourth air pipes to control the gas circulation.

[0013] Among them, a support plate three is installed on the upper end of the support plate two, and a cutting assembly is installed on the upper end of the support plate three. The cutting assembly is arranged just above the position where the drive disk one and the drive disk two are connected, so as to facilitate wafer cutting. A support plate four is installed on the support plate one, and a wafer temporary storage device is installed on the support plate four for storing wafers to be cut. The wafer temporary storage device is placed just above the drive disk one, so as to facilitate the placement of wafers.

[0014] After adopting the above structure, the beneficial effects of the present invention are as follows:

[0015] (1) When the clamping and fixing assembly is located at the lower end of the wafer temporary storage unit, the folding bag, elastic bag and spring therein are in a stretched state, and the squeezing and fixing bag is in a deflated state, which is convenient for wafer placement.

[0016] (2) During the movement of the clamping and fixing assembly, the placement plate moves along the slide. Under the action of spring one, the placement plate moves down in accordance with the slide, the folding bag is squeezed, and the internal gas enters the elastic bag. The gas in the elastic bag enters the extrusion and fixing bag through ventilation tube two, the ventilation cavity, and ventilation tube four. The extrusion and fixing bag bulges to achieve the technical effect of self-fixing for wafers of different sizes.

[0017] (3) During cutting, the gas in the ventilation cavity enters the ventilation ring through the ventilation pipe and is discharged from the blowing hole, blowing the wafer during cutting to reduce dust falling on the wafer.

[0018] (4) The gas in the ventilation cavity enters the pushing bag, causing the pushing bag to swell and push the cut wafer upward, making it easier to take the cut wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0020] Figure 1 A schematic diagram of the structure of a wafer positioning and cutting device proposed by the present invention;

[0021] Figure 2 A three-dimensional diagram of a wafer positioning and cutting device proposed by the present invention;

[0022] Figure 3 A diagram showing the positional relationship between the driving assembly and the connecting assembly proposed by the present invention;

[0023] Figure 4 A partial perspective view of a wafer positioning and cutting device proposed by the present invention;

[0024] Figure 5 It is a structural schematic diagram of the toggle assembly proposed by the present invention;

[0025] Figure 6 A top cross-sectional view of a wafer positioning and cutting device proposed by the present invention;

[0026] Figure 7 This is a front cross-sectional view of a wafer positioning and cutting device proposed by the present invention;

[0027] Figure 8 for Figure 7 A partial enlarged view of point A.

[0028] In the accompanying drawings: 1, bottom plate, 2, support plate 1, 3, support plate 2, 4, protection frame, 5, limit frame, 6, drive assembly, 7, connecting assembly, 8, toggle assembly, 9, clamping and fixing assembly 1, 10, clamping and fixing assembly 2, 11, clamping and fixing assembly 3, 12, slideway, 13, connecting plate 1, 14, motor, 15, drive shaft 1, 16, gear 1, 17, drive disk 1, 18, connecting plate 2, 19, drive shaft 2, 20, gear 2, 21, drive disk 2, 22, slot 1, 23, slot 2, 24, mounting seat, 25, toggle member, 26, plug rod 1 , 27. baffle, 28. rod two, 29. spring two, 30. lower limit plate, 31. upper limit plate, 32. connecting rod one, 33. connecting rod two, 34. placement plate, 35. spring one, 36. folding bag, 37. elastic bag, 38. placement groove, 39. enclosure, 40. push bag, 41. extrusion fixing bag, 42. blowing hole, 43. ventilation ring, 44. ventilation tube one, 45. ventilation cavity, 46. ventilation tube two, 47. ventilation tube three, 48. ventilation tube four, 49. support plate three, 50. cutting assembly, 51. support plate four, 52. wafer temporary storage. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0030] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0031] like Figures 1-8 As shown, a wafer positioning and cutting device comprises a base plate 1 for supporting and fixing, a support plate 1 2 and a support plate 2 3 are installed on the base plate 1, a protective frame 4 is installed on the upper end of the support plate 1 2, a limit frame 5 is installed on the support plate 2 3, the limit frame 5 is arranged at the lower end of the protective frame 4, the protective frame 4 and the limit frame 5 are both hollow structures that are through from top to bottom, a driving component 6 and a connecting component 7 are also installed on the base plate 1, the upper ends of the driving component 6 and the upper ends of the connecting component 7 are both movably connected in the limit frame 5, and a toggle assembly 6 is also installed on the support plate 2 3. Part 8, the toggle component 8 is arranged at the lower end of the limit frame 5, and is arranged between the connecting component 7 and the driving component 6, and the limit frame 5 is movably connected with a clamping and fixing component 1 9, a clamping and fixing component 2 10 and a clamping and fixing component 3 11, and the upper end of the clamping and fixing component 1 9, the upper end of the clamping and fixing component 2 10 and the upper end of the clamping and fixing component 3 11 are all movably arranged in the protective frame 4; the driving component 6 drives the connecting component 7 to rotate when it works, and the driving component 6 and the connecting component 7 respectively drive the clamping and fixing component 1 9, the clamping and fixing component 2 10 and the clamping and fixing component 3 11 to move.

[0032] The upper wall of the protective frame 4 is provided with a slideway 12, and the upper ends of the clamping and fixing components 1 9, 10 and 11 are movably connected to the slideway 12. When the clamping and fixing components 1 9, 10 and 11 move along the upper wall of the slideway 12, they can move up and down along the track of the slideway 12.

[0033] The driving assembly 6 includes a connecting plate 13, a motor 14 and a driving shaft 15, wherein the motor 14 is arranged on the upper wall of the base plate 1, the lower end of the connecting plate 13 is arranged on the upper wall of the base plate 1, the driving shaft 15 is movably arranged on the upper end of the connecting plate 13, the connecting plate 13 supports and fixes the driving shaft 15, the output shaft end of the motor 14 is connected to the lower end of the driving shaft 15, a gear 16 is installed on the driving shaft 15, the gear 16 is arranged on the upper end of the connecting plate 13, a driving disk 17 is installed on the upper end of the driving shaft 15, and the driving disk 17 is movably connected and arranged in the limit frame 5; the motor 14 drives the driving shaft 15 to rotate when it works, and the driving shaft 15 drives the gear 16 and the driving disk 17 to rotate.

[0034] The connecting component 7 includes a second connecting plate 18 and a second drive shaft 19. The lower end of the second connecting plate 18 is arranged on the upper wall of the bottom plate 1. The second drive shaft 19 is movably arranged at the upper end of the second connecting plate 18. The lower end of the second drive shaft 19 is movably arranged on the bottom plate 1. The upper end of the second drive shaft 19 is arranged in the limiting frame 5. The second connecting plate 18 and the bottom plate 1 support and fix the second drive shaft 19. A second gear 20 is installed on the second drive shaft 19. The second gear 20 is arranged at the upper end of the second connecting plate 18. The first gear 16 and the second gear 20 are meshed and connected. A second drive disk 21 is installed at the upper end of the second drive shaft 19. The second drive disk 21 is movably clamped in the limiting frame 5. The rotation of the first gear 16 drives the meshed second gear 20 to rotate. The second gear 20 drives the second drive shaft 19 to rotate. The second drive shaft 19 drives the second drive disk 21 to rotate.

[0035] Multiple groups of first slots 22 are arranged on the first drive disk 17. The multiple groups of first slots 22 are evenly arranged on the first drive disk 17 at equal intervals in a ring shape. Multiple groups of second slots 23 are arranged on the second drive disk 21. The multiple groups of second slots 23 are evenly arranged on the second drive disk 21 at equal intervals in a ring shape. The number of the first slots 22 is the same as that of the second slots 23. The first drive disk 17 and the second drive disk 21 drive the first slots 22 and the second slots 23 to rotate respectively. When the first slots 22 and the second slots 23 rotate to positions close to each other, the first slots 22 and the second slots 23 gradually merge into a circular slot hole. The first clamping and fixing component 9, the second clamping and fixing component 10 and the third clamping and fixing component 11 are respectively movably clamped in the first slots 22 and the second slots 23.

[0036] In this embodiment, when the clamping and fixing component 1 9 is movably connected to one of the slots 1 22 of the driving disk 1 17, the clamping and fixing component 2 10 is movably connected to the circular slot hole formed by the adjacent slots 1 22 and the slots 2 23, and the clamping and fixing component 3 11 is movably connected to one of the slots 2 23 of the driving disk 2 21. At this time, the wafer to be cut is placed in the clamping and fixing component 1 9, the wafer being cut is placed in the clamping and fixing component 2 10, and the wafer to be taken away after cutting is placed in the clamping and fixing component 3 11. , take out the cut wafer in the clamping and fixing component three 11, and the upper end of the toggle component 8 is set at a position close to the driving disk one 17. As shown in the figure, the motor 14 drives the driving disk one 17 to rotate counterclockwise, and the driving disk two 21 to rotate clockwise. The driving disk one 17 and the driving disk two 21 drive the clamping and fixing component two 10 to move to the position of the toggle component 8. Under the action of the toggle component 8, the clamping and fixing component two 10 rotates with the driving disk two 21 through the card slot two 23. During the movement, the clamping and fixing component two 10 performs The upper end of the toggle assembly 8 is squeezed and rotated to a position close to the driving disk 21. At the same time, the driving disk 21 first drives the clamping and fixing assembly 3 11 to rotate clockwise to the initial position of the clamping and fixing assembly 2 10. The clamping and fixing assembly 1 9 moves to the upper end of the driving disk 1 17. As the driving disk 1 17 and the driving disk 2 21 continue to rotate, under the action of the toggle assembly 8, the clamping and fixing assembly 3 11 rotates with the driving disk 1 17 through the card slot 1 22. During the movement, the clamping and fixing assembly 3 11 squeezes the toggle assembly 8, and the toggle assembly 8 The upper end of the clamping component 19 rotates to a position close to the driving disk 17, and the driving disk 17 drives the clamping and fixing component 19 to rotate counterclockwise to the initial position of the clamping and fixing component 2 10. The cutting component 50 cuts the wafer in the clamping and fixing component 19, and the clamping and fixing component 3 11 moves to the position of the original clamping and fixing component 9, and the wafer to be cut is placed in the clamping and fixing component 3 11. The cut wafer in the clamping and fixing component 2 10 is taken away, and the movement is carried out in sequence according to this motion trajectory to achieve the technical effect of placing, cutting and taking the wafer.

[0037] The toggle assembly 8 is arranged between the gear 16 and the driving disk 17 and between the gear 20 and the driving disk 21. The toggle assembly 8 includes a mounting seat 24, which is arranged on the side wall of the support plate 23. The support plate 23 supports and fixes the mounting seat 24. A toggle member 25 is movably installed on one side wall of the mounting seat 24, and a plug rod 1 26 is installed on the other side wall of the mounting seat 24. A baffle plate 27 is connected to the center position of the toggle member 25, and a plug rod 28 is installed on the baffle plate 27. A spring 29 is movably installed on the plug rod 1 26 and the plug rod 28;

[0038] In this embodiment, when the clamping and fixing component 2 10 is movably clamped in the circular slot formed by the combination of the mutually adjacent clamping slot 1 22 and the clamping slot 23, as the driving disk 1 17 and the driving disk 21 rotate, the clamping and fixing component 2 10 moves to the position of the baffle 27. Since the baffle 27 is arranged at the lower end of the driving disk 17, the clamping and fixing component 2 10 is blocked by the baffle 27. As the driving disk 21 moves to the raised end of the toggle member 25, the toggle member 25 is pressed down, and the toggle member 25 rotates. The originally drooping end is in a raised state, and the spring 29 rotates to the side close to the driving disk 21.

[0039] The clamping and fixing components 19, 10 and 11 have the same structure. Only one group is introduced here. The clamping and fixing components 11 include a lower limit plate 30, an upper limit plate 31, a connecting rod 1 32 and a connecting rod 2 33. The connecting rod 1 32 matches the card slot 1 22 and the card slot 2 23. The connecting rod 1 32 can be movably connected in the card slot 1 22 and the card slot 2 23 respectively. The upper end of the connecting rod 1 32 extends out of the upper wall of the limit frame 5. The lower end of the connecting rod 1 32 extends out of the bottom wall of the limit frame 5, the lower limit plate 30 is installed at the lower end of the connecting rod 1 32, and the lower limit plate 30 is movably arranged on the bottom wall of the limit frame 5, the upper limit plate 31 is installed on the connecting rod 1 32, and the upper limit plate 31 is movably arranged on the upper wall of the limit frame 5, the connecting rod 2 33 is a cavity structure with an opening at the lower end, the connecting rod 2 33 is movably sleeved on the upper end of the connecting rod 1 32, and the connecting rod 2 33 is arranged on the upper end of the upper limit plate 31.

[0040] A placement plate 34 for receiving wafers is installed on the upper wall of the connecting rod 2 33, and a spring 1 35 is installed between the placement plate 34 and the upper limit plate 31. The spring 1 35 is sleeved on the outer sides of the connecting rod 1 32 and the connecting rod 2 33. A folding capsule 36 is also installed on the upper wall of the upper limit plate 31, and an elastic capsule 37 is connected to the upper wall of the folding capsule 36. The upper end of the elastic capsule 37 is connected to the bottom wall of the placement plate 34. The folding capsule 36 and the elastic capsule 37 are both cavity structures. There is a sealed space between the folding capsule 36, the elastic capsule 37, the upper limit plate 31 and the placement plate 34. The spring 1 35 is arranged in the folding capsule 36 and the elastic capsule 37. A placement groove 38 is provided in the placement plate 34, and an annular enclosure 39 is installed on the upper wall of the placement plate 34. A pushing capsule 40 is installed on the bottom wall of the placement groove 38. There is a sealed space between the pushing capsule 40 and the bottom wall of the placement groove 38, and an extrusion fixing capsule 41 is provided on the inner wall of the placement groove 38.

[0041] On the inner sidewall of the enclosure member 39, there are multiple groups of air blowing holes 42 for gas circulation. The multiple groups of air blowing holes 42 are evenly arranged on the enclosure member 39 at equal intervals in a circular shape. The air blowing holes 42 are placed in an inclined downward state. An air vent ring 43 is installed inside the sidewall of the enclosure member 39. Inside the placement disk 34, multiple groups of air pipes one 44 for gas circulation are installed. An air vent cavity 45 is also provided inside the placement disk 34. The air blowing holes 42 are connected to the air vent ring 43 in a through manner. The upper end of the air pipe one 44 is connected to the air vent ring 43 in a through manner. The lower end of the air pipe one 44 is connected to the air vent cavity 45 in a through manner. Inside the placement disk 34, there are also an air pipe two 46, an air pipe three 47, and an air pipe four 48. The upper end of the air pipe two 46 is connected to the air vent cavity 45 in a through manner. The lower end of the air pipe two 46 is connected to the sealed space inside the elastic bladder 37 in a through manner. The lower end of the air pipe three 47 is connected to the air vent cavity 45 in a through manner. The upper end of the air pipe three 47 is connected to the sealed space inside the push bladder 40 in a through manner. The lower end of the air pipe four 48 is connected to the air vent cavity 45 in a through manner. The upper end of the air pipe four 48 is connected to the extrusion fixing bladder 41 in a through manner. Control valves are provided in the air pipe one 44, the air pipe three 47, and the air pipe four 48 to control the gas circulation;

[0042] It should be noted that when the control valve in the air pipe four 48 is opened and the other control valves are closed, the gas in the elastic bladder 37 enters the air vent cavity 45 through the air pipe two 46 and enters the extrusion fixing bladder 41 through the air pipe four 48. The extrusion fixing bladder 41 bulges to fix the wafer. Then the control valve in the air pipe four 48 is closed. Then the control valve in the air pipe one 44 is opened, and the control valve in the air pipe three 47 remains closed. The gas in the air vent cavity 45 enters the air vent ring 43 through the air pipe one 44 and is discharged from the air blowing holes 42 to blow the wafer during cutting, reducing dust from falling on the wafer. After cutting, the control valve in the air pipe one 44 is closed, and the control valve in the air pipe three 47 is opened. The gas in the air vent cavity 45 enters the push bladder 40, and the push bladder 40 bulges to push the cut wafer upward for easy taking.

[0043] In this embodiment, a support plate three 49 is installed at the upper end of the support plate two 3. A cutting assembly 50 is installed at the upper end of the support plate three 49. The cutting assembly 50 is located directly above the position where the driving disk one 17 and the driving disk two 21 are connected, facilitating wafer cutting. A support plate four 51 is installed on the support plate one 2. A wafer temporary storage member 52 is installed on the support plate four 51 for storing the wafers to be cut. The wafer temporary storage member 52 is placed directly above the driving disk one 17, facilitating wafer placement.

[0044] The specific use is as follows:

[0045] Initially, when the clamping and fixing component 1 9 is movably connected in one group of slots 1 22 of the driving disk 1 17, the clamping and fixing component 2 10 is movably connected in a circular slot hole formed by the combination of the slots 1 22 and the slots 2 23 that are close to each other, and the clamping and fixing component 3 11 is movably connected in one group of slots 23 of the driving disk 2 21. At this time, the wafers to be cut are placed in the clamping and fixing component 1 9, the wafers being cut are placed in the clamping and fixing component 2 10, and the wafers to be taken away after cutting are placed in the clamping and fixing component 3 11. The cut wafers in the clamping and fixing component 3 11 are taken away, and the upper end of the toggle component 8 is set at a position close to the driving disk 17;

[0046] As shown in the figure, the motor 14 drives the driving shaft 15 to rotate, and the driving shaft 15 drives the gear 16 and the driving disk 17 to rotate. The rotation of the gear 16 drives the gear 20 meshing therewith to rotate, and the gear 20 drives the driving shaft 2 19 to rotate, and the driving shaft 2 19 drives the driving disk 2 21 to rotate. The driving disk 17 rotates counterclockwise, and the driving disk 21 rotates clockwise. The driving disk 17 and the driving disk 2 21 drive the clamping and fixing component 2 10 to move to the position of the toggle component 8. Under the action of the toggle component 8, the clamping and fixing component 2 10 rotates with the driving disk 2 21 through the slot 23. During the movement, the clamping and fixing component 2 10 squeezes the toggle component 8, and the upper end of the toggle component 8 rotates to a position close to the driving disk 2 21. At the same time, the driving disk 2 21 first drives the clamping and fixing component 3 11 to rotate clockwise to the initial position of the clamping and fixing component 2 10. The clamping and fixing component 9 moves to the upper end of the driving disk 17. As the driving disk 17 and the driving disk 21 continue to rotate, under the action of the toggle component 8, the clamping and fixing component 3 11 rotates with the driving disk 17 through the slot 1 22. During the movement, the clamping and fixing component 3 11 squeezes the toggle component 8, and the upper end of the toggle component 8 rotates to a position close to the driving disk 17. At the same time, the driving disk 17 drives the clamping and fixing component 9 to rotate counterclockwise to the initial position of the clamping and fixing component 2 10. The cutting component 50 cuts the wafer in the clamping and fixing component 9. The clamping and fixing component 3 11 moves to the original position of the clamping and fixing component 9, and the wafer to be cut is placed in the clamping and fixing component 3 11. The cut wafer in the clamping and fixing component 2 10 is taken away, and moves in sequence according to this motion trajectory to achieve the technical effects of placing, cutting and taking wafers.

[0047] When the first clamping and fixing component 9 is arranged directly below the wafer temporary storage component 52, the wafer in the wafer temporary storage component 52 is placed in the placement groove 38 in the first clamping and fixing component 9. At this time, the folding bladder 36, the elastic bladder 37 and the first spring 35 in the first clamping and fixing component 9 are in a stretched state, and the extrusion and fixing bladder 41 in the first clamping and fixing component 9 is in a deflated state, which is convenient for placing the wafer. As the first clamping and fixing component 9 rotates and moves, the first clamping and fixing component 9 moves to the position of the original second clamping and fixing component 10. During the movement, the placement disk 34 on the first clamping and fixing component 9 moves along the slideway 12. Under the action of the first spring 35, the placement disk 34 fits the slideway 12 and moves downward, and the folding bladder 36 is squeezed, and the internal gas enters the elastic bladder 37. At this time, the control valve in the fourth air pipe 48 is opened, and when the other control valves are closed, the gas in the elastic bladder 37 enters the air cavity 45 through the second air pipe 46 and enters the extrusion and fixing bladder 41 through the fourth air pipe 48. The extrusion and fixing bladder 41 bulges to fix the wafer. The control valve in the fourth air pipe 48 is closed, and the cutting component 50 cuts the wafer. Then the control valve in the first air pipe 44 is opened, and the control valve in the third air pipe 47 remains closed. The gas in the air cavity 45 enters the air ring 43 through the first air pipe 44 and is discharged from the air blowing holes 42 to blow the wafer during cutting, reducing dust from falling on the wafer. After cutting, the control valve in the fourth air pipe 48 is opened, and the gas in the extrusion and fixing bladder 41 enters the first air pipe 44 and is discharged from the air blowing holes 42. The extrusion and fixing bladder 41 is in a deflated state. The control valves in the first air pipe 44 and the fourth air pipe 48 are closed, and the control valve in the third air pipe 47 is opened. The gas in the air cavity 45 enters the pushing bladder 40, and the pushing bladder 40 bulges to push the cut wafer upward. The control valve in the third air pipe 47 is closed, and the control valve in the first air pipe 44 is opened. Then the first clamping and fixing component 9 rotates into the second driving disk 21, and the folding bladder 36 and the elastic bladder 37 change from the compressed state to the stretched state. External gas sequentially enters the folding bladder 36 and the elastic bladder 37 through the air blowing holes 42, the air ring 43, the first air pipe 44, the air cavity 45, and the second air pipe 46. Then the bulging wafer can be taken manually.

[0048] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents. Generally speaking, if those of ordinary skill in the art are inspired by it and design similar structural methods and embodiments without creative efforts without departing from the purpose of the present invention, they should all fall within the protection scope of the present invention.

Claims

1. A wafer positioning and cutting device, comprising a bottom plate for supporting and fixing, wherein a first support plate and a second support plate are installed on the bottom plate, a protective frame is installed at the upper end of the first support plate, a limiting frame is installed on the second support plate, and the limiting frame is located directly below the protective frame, and is characterized in that, A driving assembly and a connecting assembly are also installed on the bottom plate, and the upper ends of the driving assembly and the connecting assembly are both movably connected in the limit frame. A toggle assembly is also installed on the support plate 2, and the toggle assembly is arranged at the lower end of the limit frame and between the connecting assembly and the driving assembly. A clamping and fixing assembly 1, a clamping and fixing assembly 2 and a clamping and fixing assembly 3 are movably connected in the limit frame, and the upper ends of the clamping and fixing assembly 1, the clamping and fixing assembly 2 and the clamping and fixing assembly 3 are all movably arranged in the protective frame. The toggle assembly includes a mounting seat, the mounting seat is arranged on the second side wall of the support plate, a toggle piece is movably mounted on one side wall of the mounting seat, a first plug rod is mounted on the other side wall of the mounting seat, a baffle is connected to the center of the toggle piece, a second plug rod is mounted on the baffle, and a second spring is movably mounted on the first plug rod and the second plug rod; The clamping and fixing component three includes a lower limit plate, an upper limit plate, a connecting rod 1 and a connecting rod 2. A placement plate for receiving wafers is installed on the upper wall of the connecting rod 2. A spring 1 is installed between the placement plate and the upper limit plate. The spring is sleeved on the outer sides of the connecting rod 1 and the connecting rod 2. A folding bag is also installed on the upper wall of the upper limit plate. The upper wall of the folding bag is connected to an elastic bag. The upper end of the elastic bag is connected to the bottom wall of the placement plate. The spring 1 is arranged in the folding bag and the elastic bag. A placement groove is provided in the placement plate. An annular enclosure is installed on the upper wall of the placement plate. A pushing bag is installed on the bottom wall of the placement groove. An extrusion and fixing bag is provided on the inner wall of the placement groove.

2. The wafer positioning and cutting device according to claim 1, characterized in that, The upper wall of the protection frame is provided with a slideway, and the upper ends of the clamping and fixing component one, the clamping and fixing component two and the clamping and fixing component three are all movably clamped on the slideway.

3. The wafer positioning and cutting device according to claim 2, wherein, The driving assembly includes a connecting plate 1, a motor and a driving shaft 1, the motor is arranged on the upper wall of the base plate, the lower end of the connecting plate 1 is arranged on the upper wall of the base plate, the driving shaft 1 is movably arranged on the upper end of the connecting plate 1, the output shaft end of the motor is connected to the lower end of the driving shaft 1, a gear 1 is installed on the driving shaft 1, the gear 1 is arranged on the upper end of the connecting plate 1, a driving disk 1 is installed on the upper end of the driving shaft 1, and the driving disk 1 is movably clamped in a limit frame.

4. A wafer positioning and cutting device according to claim 3, characterized in that, The connecting component includes a connecting plate 2 and a driving shaft 2, the lower end of the connecting plate 2 is arranged on the upper wall of the base plate, the driving shaft 2 is movably arranged on the upper end of the connecting plate 2, the lower end of the driving shaft 2 is movably arranged on the base plate, the upper end of the driving shaft 2 is arranged in a limiting frame, a gear 2 is installed on the driving shaft 2, the gear 2 is arranged at the upper end of the connecting plate 2, the gear 1 and the gear 2 are meshed and connected, and a driving disk 2 is installed on the upper end of the driving shaft 2, and the driving disk 2 is movably clamped in the limiting frame.

5. The wafer positioning and cutting device according to claim 4, characterized in that, The driving disk 1 is provided with a plurality of groups of card slots 1, which are evenly arranged on the driving disk 1 in a ring-shaped manner. The driving disk 2 is provided with a plurality of groups of card slots 2, which are evenly arranged on the driving disk 2 in a ring-shaped manner. The number of card slots 1 and card slots 2 is the same. The clamping and fixing component 1, the clamping and fixing component 2 and the clamping and fixing component 3 are movably clamped in the card slot 1 and the card slot 2 respectively.

6. A wafer positioning and cutting device according to claim 5, characterized in that, The shifting assembly is arranged between the first gear and the first driving disk and between the second gear and the second driving disk.

7. A wafer positioning and cutting device according to claim 6, wherein, The connecting rod 1 is matched with the card slot 1 and the card slot 2, the upper end of the connecting rod 1 extends out of the upper wall of the limit frame, and the lower end of the connecting rod 1 extends out of the bottom wall of the limit frame. The lower limit plate is installed at the lower end of the connecting rod 1, and the lower limit plate is movably arranged on the bottom wall of the limit frame. The upper limit plate is installed on the connecting rod 1, and the upper limit plate is movably arranged on the upper wall of the limit frame. The connecting rod 2 is movably sleeved on the upper end of the connecting rod 1, and the connecting rod 2 is arranged on the upper end of the upper limit plate. The connecting rod 2 is a cavity structure with an opening at the lower end; the folding capsule and the elastic capsule are both cavity structures, and there is a sealed space between the folding capsule, the elastic capsule, the upper limit plate and the placement plate, and there is a sealed space between the pushing capsule and the bottom wall of the placement groove.

8. A wafer positioning and cutting device according to claim 7, characterized in that, The inner side wall of the enclosure is provided with a plurality of blowing holes for gas circulation, and the plurality of blowing holes are evenly arranged on the enclosure in a ring shape and at equal intervals, and the blowing holes are placed in a tilted downward state, a ventilation ring is installed in the side wall of the enclosure, and a plurality of ventilation tubes 1 for gas circulation are installed in the placement plate, and a ventilation cavity is also provided in the placement plate, the blowing holes are connected with the ventilation ring, the upper end of the ventilation tube 1 is connected with the ventilation ring, and the lower end of the ventilation tube 1 is connected with the ventilation cavity, and the release Ventilation tube 2, ventilating tube 3 and ventilating tube 4 are also provided in the plate. The upper end of ventilating tube 2 is connected with the ventilation cavity, the lower end of ventilating tube 2 is connected with the sealed space in the elastic bag, the lower end of ventilating tube 3 is connected with the ventilation cavity, the upper end of ventilating tube 3 is connected with the sealed space in the pushing bag, the lower end of ventilating tube 4 is connected with the ventilation cavity, the upper end of ventilating tube 4 is connected with the extrusion fixing bag, and control valves are provided in ventilating tube 1, ventilating tube 3 and ventilating tube 4.

9. A wafer positioning and cutting device according to claim 8, wherein A support plate three is installed on the upper end of the support plate two, and a cutting assembly is installed on the upper end of the support plate three. The cutting assembly is arranged directly above the position where the driving disk one and the driving disk two are connected. A support plate four is installed on the support plate one, and a wafer temporary storage device is installed on the support plate four. The wafer temporary storage device is placed directly above the driving disk one.

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