Automotive surface-mounted diode packaging structure and method

Abstract

The invention relates to the technical field of diode packaging, and discloses a vehicle surface-mounted diode packaging structure and method.The vehicle surface-mounted diode packaging structure comprises a workbench, the bottom of the workbench is fixedly connected with a supporting frame, the surface of the workbench is provided with a limiting groove, and the inner wall of the limiting groove is fixedly connected with a limiting elastic rod; the surface of the workbench is fixedly connected with a sliding rail. By arranging the fixing mechanism, half of a shell of a diode is firstly placed into the packaging groove, then a motor is started to drive a threaded rod to rotate, when the threaded rod rotates, a threaded ring moves upwards, when the threaded ring moves, a lifting frame is driven to move upwards, and the lifting frame pushes the lifting frame to move upwards; when the lifting frame moves, the pulling frame is driven to move upwards, the pulling frame pulls the pulling rod to move upwards, and when the pulling rod moves upwards, the sliding block is pulled to move on the inner wall of the limiting groove in the direction close to each other and extrudes the limiting elastic rod.

Description

Technical Field

[0001] The present invention relates to the technical field of diode packaging equipment, and in particular to a vehicle-use surface mount diode packaging structure and method. Background Art

[0002] The chip diode, also known as the crystal diode, is an electronic device with unidirectional current conduction. There is a PN junction and two lead terminals inside the semiconductor diode. This diode has unidirectional current conduction according to the direction of the applied voltage. Generally speaking, the chip crystal diode is a PN junction interface formed by sintering a P-type semiconductor and an N-type semiconductor. A space charge layer is formed on both sides of the interface to form a self-built electric field.

[0003] In the prior art, when packaging a chip diode, half of the shell of the chip diode needs to be placed in a packaging slot, injected with glue, and then packaged. The existing packaging slots are all packaging slots that are only for packaging one size of chip diode shell. There are limitations for shells of other sizes, and tooling needs to be replaced, which affects the packaging efficiency. Summary of the invention

[0004] The object of the present invention is to provide a vehicle surface mount diode packaging structure and method to solve the problems raised in the above background technology.

[0005] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0006] The present invention is a vehicle-use surface-mount diode packaging structure and method, comprising a workbench, the bottom of the workbench is fixedly connected to a support frame, the surface of the workbench is provided with a limiting groove, the inner wall of the limiting groove is fixedly connected to a limiting elastic rod, the surface of the workbench is fixedly connected to a slide rail, the surface of the workbench is fixedly connected to a support frame, the bottom of the workbench is fixedly connected to a motor, the output end of the motor is fixedly connected to a threaded rod, and further comprising;

[0007] A fixing mechanism, the fixing mechanism comprising a fixing frame, a surface of the fixing frame is fixedly connected with an extrusion plate, a surface of the fixing frame is fixedly connected with a force-bearing plate, and an inner wall of the fixing frame is slidably connected with a contraction right-angle plate;

[0008] A glue injection mechanism, the glue injection mechanism comprising a shrink ring, an end of the shrink ring is fixedly connected to a spring sheet, and a surface of the spring sheet is fixedly connected to a glue squeezing disk;

[0009] The packaging mechanism comprises a packaging plate, a surface of the packaging plate is fixedly connected with a rising column, and a surface of the rising column is fixedly connected with a driven frame.

[0010] Furthermore, a packaging groove is opened on the surface of the workbench, the end of the threaded rod is rotatably connected to the bottom of the workbench, the number of the limiting elastic rods is two, the two limiting elastic rods are symmetrically arranged with the packaging groove as the center, and a downward pressure groove is opened on the inner surface of the support frame.

[0011] Further, the fixing mechanism includes a threaded ring, a lifting frame is fixedly connected to the surface of the threaded ring, an end of the lifting frame away from the threaded ring is fixedly connected to the lifting frame, a pulling frame is fixedly connected to the surface of the lifting frame, an end of the pulling frame away from the lifting frame is rotatably connected to a pulling rod, an end of the pulling rod away from the pulling frame is rotatably connected to a sliding block, a U-shaped frame is fixedly connected to the surface of the sliding block, an elastic plate is fixedly connected to the surface of the U-shaped frame, an end of the U-shaped frame away from the sliding block is fixedly connected to a pushing column, and an end of the pushing column is fixedly connected to a fixed frame.

[0012] Furthermore, the end of the limiting elastic rod is fixedly connected to the end of the sliding block, the surface of the pushing column is slidably connected to the inner wall of the packaging groove, the inner wall of the threaded ring is threadedly connected to the surface of the threaded rod, and the number of the rising frames is two, and the two rising frames are symmetrically arranged with the threaded ring as the center, and the end of the extrusion plate is in contact with the surface of the force-bearing plate.

[0013] Furthermore, the glue injection mechanism includes a slide plate, the surface of the slide plate is fixedly connected to a vertical plate, both sides of the vertical plate are fixedly connected to push plates, the surface is fixedly connected to an elastic frame, the surface of the vertical plate is fixedly connected to an extrusion column, the surface of the vertical plate is rotatably connected to a hydraulic rod, the end of the vertical plate is rotatably connected to an inclined plate, a sliding groove is provided on the surface of the inclined plate, a sliding rod is slidably connected to the inner wall of the sliding groove, the surface of the sliding rod is fixedly connected to a squeezed plate, and the end of the sliding rod away from the sliding groove is fixedly connected to a shrinkage ring.

[0014] Furthermore, the inner wall of the slide plate is slidably connected to the surface of the slide rail, the surface of the vertical plate is fixedly connected to the surface of the elastic plate, the end of the hydraulic rod away from the vertical plate is rotationally connected to the bottom of the inclined plate, the surface of the extrusion column is in contact with the surface of the squeezed plate, and the end of the lifting frame is fixedly connected to the bottom of the inclined plate.

[0015] Furthermore, the packaging mechanism includes a slide groove plate, the inner wall of the slide groove plate is slidably connected to a sliding frame, the bottom of the sliding frame is rotatably connected to a lower push rod, the end of the lower push rod away from the sliding frame is rotatably connected to a passive rod, the end of the passive rod is fixedly connected to a lower pressure plate, the bottom of the lower pressure plate is fixedly connected to a guide rail, the surface of the guide rail is slidably connected to a packaging rod, the surface of the packaging rod is fixedly connected to a driven plate, the end of the packaging rod away from the guide rail is fixedly connected to a clamping plate, the bottom of the lower pressure plate is fixedly connected to a buffer elastic rod, and the end of the buffer elastic rod away from the lower pressure plate is fixedly connected to the packaging plate.

[0016] Furthermore, the surface of the elastic frame is fixedly connected to the surface of the sliding frame, the end of the passive rod is slidably connected to the inner wall of the lower pressure groove, the surface of the driven plate contacts the surface of the driven frame, the surface of the rising column is slidably connected to the inner wall of the lower pressure plate, and the number of the driven frames is four, and the four driven frames are symmetrically arranged with the rising column as the center.

[0017] Furthermore, the method for packaging a chip-type diode structure for a vehicle comprises the following steps:

[0018] S1: First, put half of the diode shell into the packaging slot, and then start the motor to drive the threaded rod to rotate. When the threaded rod rotates, the threaded ring moves upward, and when the threaded ring moves, it drives the rising frame to move upward;

[0019] S2: The rising frame pushes the lifting frame to move upward, and when the lifting frame moves, it drives the pulling frame to move upward, and the pulling frame pulls the pulling rod to move upward. When the pulling rod moves upward, it pulls the sliding block to move in the direction of approaching each other on the inner wall of the limiting groove and squeezes the limiting elastic rod;

[0020] S3: When the middle part of the elastic plate bends, it pushes the vertical plate to move towards each other on the surface of the slide rail, and when the vertical plate moves, it drives the push plate to move towards each other;

[0021] S4: First, place the other half of the SMD diode on the surface of the packaging board and push the packaging board upward. When the packaging board is pushed, the rising column is pushed upward to move upward. When the rising column moves upward, it also drives the driven frame to move upward.

[0022] The present invention has the following beneficial effects:

[0023] The present invention sets a fixing mechanism, firstly puts half of the diode shell into the packaging groove, then starts the motor to drive the threaded rod to rotate, when the threaded rod rotates, the threaded ring moves upward, when the threaded ring moves, the rising frame is driven to move upward, the rising frame pushes the lifting frame to move upward, when the lifting frame moves, the pulling frame is driven to move upward, the pulling frame pulls the pulling rod to move upward, when the pulling rod moves upward, the sliding block is pulled to move in the direction of approaching each other on the inner wall of the limiting groove, and the limiting elastic rod is squeezed, when the sliding block moves, the U-shaped frame is driven to move in the direction of approaching each other, when the U-shaped frame moves When the U-shaped frame moves, the elastic plate is squeezed, and the middle part of the elastic plate is bent when the squeezing force is applied. When the U-shaped frame moves, the pushing column is driven to move in the direction of approaching each other, and the pushing column drives the fixed frame to move in the direction of approaching each other. When the fixed frame moves, the squeezing plate is driven to move in the direction of approaching each other. When the squeezing plate moves, the force-bearing plate is squeezed, and when the fixed frame moves, the shrinking right-angle plate is driven to move and shrink the shrinking right-angle plate. The SMD diode can be fixed effectively, and the shells of different sizes can be fixed more effectively, thereby increasing the practicability of the SMD diode and improving the packaging efficiency.

[0024] The invention provides a glue injection mechanism, wherein the glue hose is placed inside the shrinking ring, and when the middle part of the elastic plate is bent, the vertical plate is pushed to move in the direction of approaching each other on the surface of the slide rail, and when the vertical plate moves, the pushing plate is driven to move in the direction of approaching each other, and when the pushing plate moves, the elastic frame is pushed and the elastic frame is squeezed, and the vertical plate is driven to move in the direction of approaching each other, and when the lifting frame is lifted upward, one end of the inclined plate is lifted upward, and when the end of the inclined plate is lifted, the other end of the inclined plate is tilted downward, and when the other end of the inclined plate is tilted downward, the hydraulic rod is squeezed downward to shrink, and when the inclined plate is tilted downward, the squeezing column squeezes the squeezed plate, and when the squeezed plate is subjected to the squeezing force, the shrinking ring is pushed to shrink, and the glue hose is fixed, and when the shrinking ring is shrunk, the spring sheet is squeezed, and when the spring sheet is squeezed, the middle part is bent, and the glue squeezing disk is pushed to move, and the inside of the glue hose is squeezed to make it glue out, so that automatic glue injection can be effectively performed, labor is saved for the staff, and the glue injection efficiency is improved.

[0025] The present invention provides a packaging mechanism, firstly, the other half of the SMD diode is placed on the surface of the packaging plate and the packaging plate is pushed upward, when the packaging plate is subjected to a thrust, the rising column is pushed upward to move upward, when the rising column moves upward, the driven frame is driven to move upward, when the driven frame moves upward, the surface of the driven plate is squeezed, when the driven plate is subjected to the squeezing force, the packaging rod is pushed to move in the direction of approaching each other on the surface of the guide rail, when the packaging rod moves, the clamping plate is pushed to move in the direction of approaching each other, and the shell of the diode is clamped, when the elastic frame is subjected to the squeezing force, the middle part is bent and the sliding frame is pushed to move in the direction of approaching each other on the inner wall of the slide groove plate, when the sliding frame moves, the lower push rod is pushed to move in the direction of approaching each other, when the sliding frame moves, the passive rod is pushed downward when the lower push rod moves, when the passive rod moves downward, the lower pressing plate is driven to move downward, when the lower pressing plate moves downward, the buffer elastic rod is pushed downward, when the buffer elastic rod moves downward, the packaging plate is pushed downward, the SMD diode is effectively packaged, the labor of the staff is saved, the efficiency of packaging is improved, and the deviation during packaging is avoided, which leads to the situation of secondary rework.

[0026] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0028] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0029] Figure 2 It is a schematic diagram of the overall cross-sectional structure of the present invention;

[0030] Figure 3 It is a schematic diagram of the overall structure of the fixing mechanism of the present invention;

[0031] Figure 4 It is a schematic diagram of the structure of the threaded ring of the present invention;

[0032] Figure 5 It is a schematic diagram of the overall structure of the glue injection mechanism of the present invention;

[0033] Figure 6 For the present invention Figure 5 Schematic diagram of the structure of part A in FIG.

[0034] Figure 7 It is a schematic diagram of the overall structure of the packaging mechanism of the present invention;

[0035] Figure 8 For the present invention Figure 7 Schematic diagram of the structure of part B in FIG.

[0036] Fig. 9 This is a schematic diagram of the structure of the slide plate of the present invention;

[0037] Fig.10 The present invention is a schematic diagram of the method flow of a vehicle surface mount diode packaging structure.

[0038] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0039] In the figure: 1, workbench; 2, support frame; 3, limit elastic rod; 4, slide rail; 5, support frame; 6, motor; 7, threaded rod; 10, fixing mechanism; 11, threaded ring; 12, rising frame; 13, lifting frame; 14, pulling frame; 15, pulling rod; 16, sliding block; 17, U-shaped frame; 18, elastic plate; 19, pushing column; 20, fixing frame; 21, extrusion plate; 22, force plate; 23, contraction right angle plate; 30, glue injection mechanism; 31, slide plate; 32, vertical plate; 33. Push plate; 34. Elastic frame; 35. Extrusion column; 36. Hydraulic rod; 37. Inclined plate; 38. Sliding rod; 39. Extruded plate; 40. Shrink ring; 41. Shrapnel; 42. Extrusion disk; 50. Packaging mechanism; 51. Slide plate; 52. Sliding frame; 53. Lower push rod; 54. Passive rod; 55. Lower pressure plate; 56. Guide rail; 57. Packaging rod; 58. Driven plate; 59. Clamping plate; 60. Buffer elastic rod; 61. Packaging plate; 62. Rising column; 63. Driven frame. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] See also Figure 1-Figure 10 As shown, the present invention is a vehicle-use surface mount diode packaging structure and method, comprising a workbench 1, a support frame 2 is fixedly connected to the bottom of the workbench 1, a limiting groove is provided on the surface of the workbench 1, a limiting elastic rod 3 is fixedly connected to the inner wall of the limiting groove, a slide rail 4 is fixedly connected to the surface of the workbench 1, a support frame 5 is fixedly connected to the surface of the workbench 1, a motor 6 is fixedly connected to the bottom of the workbench 1, and a threaded rod 7 is fixedly connected to the output end of the motor 6, firstly, half of the diode shell is placed in the packaging groove, and then the motor 6 is started to drive the threaded rod 7 to rotate, and also includes;

[0042] The fixing mechanism 10 includes a fixing frame 20. The pushing column 19 pushes the fixing frame 20 to move in a direction close to each other. The surface of the fixing frame 20 is fixedly connected with an extrusion plate 21. When the fixing frame 20 moves, the extrusion plate 21 is driven to move in a direction close to each other. The surface of the fixing frame 20 is fixedly connected with a force plate 22. When the extrusion plate 21 moves, it squeezes the force plate 22. The inner wall of the fixing frame 20 is slidably connected with a contraction right-angle plate 23. When the fixing frame 20 moves, the contraction right-angle plate 23 is driven to move and contract the contraction right-angle plate 23.

[0043] The glue injection mechanism 30 includes a shrink ring 40. When the squeezed plate 39 is subjected to the squeezing force, the shrink ring 40 is pushed to shrink and fix the rubber tube. The end of the shrink ring 40 is fixedly connected with a spring sheet 41. When the shrink ring 40 shrinks, the spring sheet 41 is squeezed. The surface of the spring sheet 41 is fixedly connected with a glue squeezing disk 42. When the spring sheet 41 is squeezed, the middle part is bent, and the glue squeezing disk 42 is pushed to move, and the inside of the rubber tube is squeezed to make glue come out.

[0044] The packaging mechanism 50 includes a packaging plate 61. First, the other half of the SMD diode is placed on the surface of the packaging plate 61 and the packaging plate 61 is pushed upward. The surface of the packaging plate 61 is fixedly connected with a rising column 62. When the packaging plate 61 is subjected to a thrust, the rising column 62 is pushed upward to move upward. The surface of the rising column 62 is fixedly connected with a driven frame 63. When the rising column 62 moves upward, it also drives the driven frame 63 to move upward.

[0045] A packaging groove is opened on the surface of the workbench 1, the end of the threaded rod 7 is rotatably connected to the bottom of the workbench 1, there are two limiting elastic rods 3, and the two limiting elastic rods 3 are symmetrically arranged with the packaging groove as the center, and a downward pressing groove is opened on the inner surface of the support frame 5.

[0046] The fixing mechanism 10 includes a threaded ring 11, a rising frame 12 is fixedly connected to the surface of the threaded ring 11, and a lifting frame 13 is fixedly connected to the end of the rising frame 12 away from the threaded ring 11, and the rising frame 12 pushes the lifting frame 13 to move upward, and a pulling frame 14 is fixedly connected to the surface of the rising frame 12, and when the lifting frame 13 moves, the pulling frame 14 is driven to move upward, and the end of the pulling frame 14 away from the rising frame 12 is rotatably connected to a pulling rod 15, and the pulling frame 14 pulls the pulling rod 15 to move upward, and the end of the pulling rod 15 away from the pulling frame 14 is rotatably connected to a sliding block 16, and the surface of the sliding block 16 is fixedly connected to a U-shaped frame 17 When the sliding block 16 moves, the U-shaped frame 17 is driven to move in a direction approaching each other. An elastic plate 18 is fixedly connected to the surface of the U-shaped frame 17. When the U-shaped frame 17 moves, the elastic plate 18 is squeezed. One end of the U-shaped frame 17 away from the sliding block 16 is fixedly connected to a push column 19. When the U-shaped frame 17 moves, the push column 19 is driven to move in a direction approaching each other. The end of the push column 19 is fixedly connected to a fixing frame 20, which can effectively fix the SMD diode and more effectively fix the shells of different sizes, thereby increasing the practicality of the SMD diode and improving the packaging efficiency.

[0047] The end of the limiting elastic rod 3 is fixedly connected to the end of the sliding block 16. When the pull rod 15 moves upward, the sliding block 16 is pulled to move in the direction of approaching each other on the inner wall of the limiting groove, and squeezes the limiting elastic rod 3, pushing the surface of the column 19 to slide with the inner wall of the packaging groove. When the elastic plate 18 is subjected to the squeezing force, the middle part bends, and the inner wall of the threaded ring 11 is threadedly connected to the surface of the threaded rod 7. When the threaded rod 7 rotates, the threaded ring 11 moves upward. There are two rising frames 12, and the two rising frames 12 are symmetrically arranged with the threaded ring 11 as the center. When the threaded ring 11 moves, it drives the rising frame 12 to move upward, and the end of the squeezing plate 21 contacts the surface of the force-bearing plate 22.

[0048] The glue injection mechanism 30 includes a slide plate 31, the surface of the slide plate 31 is fixedly connected to a vertical plate 32, and push plates 33 are fixedly connected to both sides of the vertical plate 32. When the vertical plate 32 moves, the push plates 33 are driven to move in a direction close to each other. The surface of the slide plate 31 is fixedly connected to an elastic frame 34, and when the push plates 33 move, the elastic frame 34 is pushed and squeezed. The surface of the vertical plate 32 is fixedly connected to an extrusion column 35, and the surface of the vertical plate 32 is rotatably connected to a hydraulic rod 36. When the other end of the inclined plate 37 tilts downward and squeezes the hydraulic rod 36 downward to shrink, the end of the vertical plate 32 is rotatably connected to the inclined plate 37. When the lifting frame 13 is lifted upward, it pushes one end of the inclined plate 37 upward. When the end of the inclined plate 37 is lifted, the other end of the inclined plate 37 tilts downward. A sliding groove is provided on the surface of the inclined plate 37. A sliding rod 38 is slidably connected to the inner wall of the sliding groove. A squeezed plate 39 is fixedly connected to the surface of the sliding rod 38. When the inclined plate 37 tilts downward, the extrusion column 35 squeezes the squeezed plate 39. The end of the sliding rod 38 away from the sliding groove is fixedly connected to a shrinking ring 40. The rubber hose is placed inside the shrinking ring 40, which can effectively perform automatic glue injection, save labor for the staff, and improve the glue injection efficiency.

[0049] The inner wall of the slide plate 31 is slidably connected to the surface of the slide rail 4, the surface of the vertical plate 32 is fixedly connected to the surface of the elastic plate 18, and the end of the hydraulic rod 36 away from the vertical plate 32 is rotatably connected to the bottom of the inclined plate 37. When the middle part of the elastic plate 18 is bent, it pushes the vertical plate 32 to move in the direction of approaching each other on the surface of the slide rail 4, the surface of the extrusion column 35 contacts the surface of the squeezed plate 39, and the end of the lifting frame 13 is fixedly connected to the bottom of the inclined plate 37. When the vertical plate 32 moves, it drives the inclined plate 37 to move in the direction of approaching each other.

[0050] The packaging mechanism 50 includes a slide plate 51, the inner wall of the slide plate 51 is slidably connected to a sliding frame 52, when the elastic frame 34 is subjected to extrusion force, the middle part bends and pushes the sliding frame 52 to move in the direction of approaching each other on the inner wall of the slide plate 51, the bottom of the sliding frame 52 is rotatably connected to a lower push rod 53, when the sliding frame 52 moves, the lower push rod 53 is pushed to move in the direction of approaching each other, the end of the lower push rod 53 away from the sliding frame 52 is rotatably connected to a passive rod 54, the end of the passive rod 54 is fixedly connected to a lower pressure plate 55, when the passive rod 54 moves downward, it drives the lower pressure plate 55 to move downward, the bottom of the lower pressure plate 55 is fixedly connected to a guide rail 56, the surface of the guide rail 56 is slidably connected to a packaging rod 57, when the driven plate 58 is subjected to extrusion force, it pushes the packaging rod 57 to the guide rail 56 The surfaces move in a direction approaching each other, a follower plate 58 is fixedly connected to the surface of the packaging rod 57, and a clamping plate 59 is fixedly connected to one end of the packaging rod 57 away from the guide rail 56. When the packaging rod 57 moves, it pushes the clamping plate 59 to move in a direction approaching each other and clamps the diode shell. A buffer elastic rod 60 is fixedly connected to the bottom of the lower pressure plate 55. When the lower pressure plate 55 moves downward, it pushes the buffer elastic rod 60 to move downward. The end of the buffer elastic rod 60 away from the lower pressure plate 55 is fixedly connected to a packaging plate 61. When the buffer elastic rod 60 moves downward, it pushes the packaging plate 61 to move downward, effectively packaging the chip diode, saving labor for the staff, improving the packaging efficiency, and avoiding deviations during packaging, which leads to secondary rework.

[0051] The surface of the elastic frame 34 is fixedly connected to the surface of the sliding frame 52, and the end of the passive rod 54 is slidably connected to the inner wall of the lower pressure groove. When the lower push rod 53 moves, it pushes the passive rod 54 to move downward, and the surface of the driven plate 58 contacts the surface of the driven frame 63. When the driven frame 63 moves upward, it squeezes the surface of the driven plate 58, and the surface of the rising column 62 is slidably connected to the inner wall of the lower pressure plate 55. There are four driven frames 63, and the four driven frames 63 are symmetrically arranged with the rising column 62 as the center.

[0052] A method for packaging a chip diode structure for a vehicle, comprising the following steps:

[0053] S1: First, put half of the diode shell into the packaging groove, and then start the motor 6 to drive the threaded rod 7 to rotate. When the threaded rod 7 rotates, the threaded ring 11 moves upward. When the threaded ring 11 moves, it drives the rising frame 12 to move upward;

[0054] S2: The rising frame 12 pushes the lifting frame 13 to move upward, and when the lifting frame 13 moves, it drives the pulling frame 14 to move upward, and the pulling frame 14 pulls the pulling rod 15 to move upward, and when the pulling rod 15 moves upward, it pulls the sliding block 16 to move in the direction of approaching each other on the inner wall of the limiting groove, and squeezes the limiting elastic rod 3;

[0055] S3: When the middle part of the elastic plate 18 bends, it pushes the vertical plate 32 to move toward each other on the surface of the slide rail 4, and when the vertical plate 32 moves, it drives the push plate 33 to move toward each other;

[0056] S4: First, place the other half of the SMD diode on the surface of the packaging board 61 and push the packaging board 61 upward. When the packaging board 61 is pushed, it pushes the rising column 62 upward. When the rising column 62 moves upward, it also drives the driven frame 63 to move upward.

[0057] When in use, first put half of the diode shell into the packaging groove, and then start the motor 6 to drive the threaded rod 7 to rotate. When the threaded rod 7 rotates, the threaded ring 11 moves upward. When the threaded ring 11 moves, it drives the rising frame 12 to move upward. The rising frame 12 pushes the lifting frame 13 to move upward. When the lifting frame 13 moves, it drives the pulling frame 14 to move upward. The pulling frame 14 pulls the pulling rod 15 to move upward. When the pulling rod 15 moves upward, it pulls the sliding block 16 to move in the direction of approaching each other on the inner wall of the limiting groove and squeezes the limiting elastic rod 3. When the sliding block 16 moves, it drives the U-shaped frame 17 to move in the direction of approaching each other. When the U-shaped frame 17 moves, it squeezes the elastic plate 18. When the elastic plate 18 is pressed When the squeezing force is applied, the middle part of the elastic plate 18 is bent, and the push column 19 is driven to move in the direction of approaching each other when the U-shaped frame 17 moves, and the push column 19 drives the fixed frame 20 to move in the direction of approaching each other. When the fixed frame 20 moves, the squeezing plate 21 is driven to move in the direction of approaching each other. When the squeezing plate 21 moves, it squeezes the force-bearing plate 22. When the fixed frame 20 moves, the shrinking right-angle plate 23 is driven to move, and the shrinking right-angle plate 23 is shrunk, and the rubber hose is placed in the shrinking ring 40. When the middle part of the elastic plate 18 is bent, the vertical plate 32 is driven to move on the surface of the slide rail 4 in the direction of approaching each other. When the vertical plate 32 moves, the push plate 33 is driven to move in the direction of approaching each other. When the push plate 33 moves, the elastic frame 34 is pushed. The elastic frame 34 is squeezed, and the vertical plate 32 moves while driving the inclined plate 37 to move in a direction close to each other. When the lifting frame 13 is lifted upward, one end of the inclined plate 37 is pushed upward. When the end of the inclined plate 37 is lifted, the other end of the inclined plate 37 is tilted downward. When the other end of the inclined plate 37 is tilted downward, the hydraulic rod 36 is squeezed downward to shrink. When the inclined plate 37 tilts downward, the squeezing column 35 squeezes the squeezed plate 39. When the squeezed plate 39 is subjected to the squeezing force, the shrinking ring 40 is pushed to shrink and fix the hose. When the shrinking ring 40 shrinks, the spring sheet 41 is squeezed. When the spring sheet 41 is squeezed, the middle part bends, and the squeeze plate 42 is pushed to move, and the inside of the hose is squeezed. Press to make it glue out, first put the other half of the SMD diode into the surface of the packaging board 61 and push the packaging board 61 upward, when the packaging board 61 is pushed, it pushes the rising column 62 upward to move upward, when the rising column 62 moves upward, it drives the driven frame 63 to move upward, when the driven frame 63 moves upward, it squeezes the surface of the driven plate 58, when the driven plate 58 is squeezed, it pushes the packaging rod 57 to move in the direction of approaching each other on the surface of the guide rail 56, when the packaging rod 57 moves, it pushes the clamping plate 59 to move in the direction of approaching each other, and clamps the outer shell of the diode, when the elastic frame 34 is squeezed, the middle part is bent and pushes the sliding frame 52 to move in the direction of approaching each other on the inner wall of the slide plate 51,When the sliding frame 52 moves, it pushes the lower push rod 53 to move in the direction of approaching each other. When the lower push rod 53 moves, it pushes the passive rod 54 to move downward. When the passive rod 54 moves downward, it drives the lower pressing plate 55 to move downward. When the lower pressing plate 55 moves downward, it pushes the buffer elastic rod 60 to move downward. When the buffer elastic rod 60 moves downward, it pushes the packaging plate 61 to move downward.

[0058] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A method for packaging a chip diode structure for a vehicle, comprising a workbench (1), the bottom of the workbench (1) is fixedly connected to a support frame (2), the surface of the workbench (1) is provided with a limiting groove, the inner wall of the limiting groove is fixedly connected to a limiting elastic rod (3), the surface of the workbench (1) is fixedly connected to a slide rail (4), the surface of the workbench (1) is fixedly connected to a support frame (5), the bottom of the workbench (1) is fixedly connected to a motor (6), and the output end of the motor (6) is fixedly connected to a threaded rod (7), characterized in that: Also includes; A fixing mechanism (10), the fixing mechanism (10) comprising a fixing frame (20), a surface of the fixing frame (20) being fixedly connected to a pressing plate (21), a surface of the fixing frame (20) being fixedly connected to a force-bearing plate (22), and an inner wall of the fixing frame (20) being slidably connected to a contraction right-angle plate (23); A glue injection mechanism (30), the glue injection mechanism (30) comprising a shrink ring (40), an end of the shrink ring (40) being fixedly connected to a spring sheet (41), and a surface of the spring sheet (41) being fixedly connected to a glue squeezing disk (42); A packaging mechanism (50) comprises a packaging plate (61), a surface of the packaging plate (61) being fixedly connected to a rising column (62), and a surface of the rising column (62) being fixedly connected to a driven frame (63).

2. The method for packaging a chip diode structure for a vehicle according to claim 1, characterized in that: The surface of the workbench (1) is provided with a packaging groove, the end of the threaded rod (7) is rotatably connected to the bottom of the workbench (1), the number of the limiting elastic rods (3) is two, and the two limiting elastic rods (3) are symmetrically arranged with the packaging groove as the center, and the inner surface of the support frame (5) is provided with a downward pressing groove.

3. The method for packaging a chip diode structure for a vehicle according to claim 2, characterized in that: The fixing mechanism (10) comprises a threaded ring (11), a lifting frame (12) is fixedly connected to the surface of the threaded ring (11), an end of the lifting frame (12) away from the threaded ring (11) is fixedly connected to a lifting frame (13), a surface of the lifting frame (12) is fixedly connected to a pulling frame (14), an end of the pulling frame (14) away from the lifting frame (12) is rotatably connected to a pulling rod (15), an end of the pulling rod (15) away from the pulling frame (14) is rotatably connected to a sliding block (16), a surface of the sliding block (16) is fixedly connected to a U-shaped frame (17), a surface of the U-shaped frame (17) is fixedly connected to an elastic plate (18), an end of the U-shaped frame (17) away from the sliding block (16) is fixedly connected to a pushing column (19), and an end of the pushing column (19) is fixedly connected to a fixing frame (20).

4. The method for packaging a chip diode structure for a vehicle according to claim 3, characterized in that: The end of the limiting elastic rod (3) is fixedly connected to the end of the sliding block (16), the surface of the pushing column (19) is slidably connected to the inner wall of the packaging groove, the inner wall of the threaded ring (11) is threadedly connected to the surface of the threaded rod (7), the number of the rising frames (12) is two, and the two rising frames (12) are symmetrically arranged with the threaded ring (11) as the center, and the end of the extrusion plate (21) is in contact with the surface of the force-bearing plate (22).

5. The method for packaging a chip diode structure for a vehicle according to claim 4, characterized in that: The glue injection mechanism (30) comprises a slide plate (31), the surface of the slide plate (31) is fixedly connected to a vertical plate (32), both sides of the vertical plate (32) are fixedly connected to push plates (33), the surface is fixedly connected to an elastic frame (34), the surface of the vertical plate (32) is fixedly connected to an extrusion column (35), the surface of the vertical plate (32) is rotatably connected to a hydraulic rod (36), the end of the vertical plate (32) is rotatably connected to an inclined plate (37), a sliding groove is provided on the surface of the inclined plate (37), the inner wall of the sliding groove is slidably connected to a sliding rod (38), the surface of the sliding rod (38) is fixedly connected to a squeezed plate (39), and the end of the sliding rod (38) away from the sliding groove is fixedly connected to a shrink ring (40).

6. The method for packaging a chip diode structure for a vehicle according to claim 5, characterized in that: The inner wall of the slide plate (31) is slidably connected to the surface of the slide rail (4), the surface of the vertical plate (32) is fixedly connected to the surface of the elastic plate (18), the end of the hydraulic rod (36) away from the vertical plate (32) is rotationally connected to the bottom of the inclined plate (37), the surface of the extrusion column (35) is in contact with the surface of the squeezed plate (39), and the end of the lifting frame (13) is fixedly connected to the bottom of the inclined plate (37).

7. The method for packaging a chip diode structure for a vehicle according to claim 6, characterized in that: The packaging mechanism (50) comprises a slide plate (51), the inner wall of the slide plate (51) is slidably connected to a sliding frame (52), the bottom of the sliding frame (52) is rotatably connected to a lower push rod (53), the end of the lower push rod (53) away from the sliding frame (52) is rotatably connected to a passive rod (54), the end of the passive rod (54) is fixedly connected to a lower pressing plate (55), the bottom of the lower pressing plate (55) is fixedly connected to a guide rail (56), the surface of the guide rail (56) is slidably connected to a packaging rod (57), the surface of the packaging rod (57) is fixedly connected to a driven plate (58), the end of the packaging rod (57) away from the guide rail (56) is fixedly connected to a clamping plate (59), the bottom of the lower pressing plate (55) is fixedly connected to a buffer elastic rod (60), and the end of the buffer elastic rod (60) away from the lower pressing plate (55) is fixedly connected to a packaging plate (61).

8. The method for packaging a chip diode structure for a vehicle according to claim 7, characterized in that: The surface of the elastic frame (34) is fixedly connected to the surface of the sliding frame (52), the end of the passive rod (54) is slidably connected to the inner wall of the lower pressure groove, the surface of the driven plate (58) contacts the surface of the driven frame (63), the surface of the rising column (62) is slidably connected to the inner wall of the lower pressure plate (55), and the number of the driven frames (63) is four, and the four driven frames (63) are symmetrically arranged with the rising column (62) as the center.

9. The method for packaging a chip diode structure for a vehicle according to claim 8, characterized in that: The following steps are involved: S1: First, half of the diode housing is placed into the packaging slot, and then the motor (6) is started to drive the threaded rod (7) to rotate. When the threaded rod (7) rotates, the threaded ring (11) moves upward, and when the threaded ring (11) moves, the lifting frame (12) is driven to move upward; S2: The rising frame (12) pushes the lifting frame (13) to move upwards. When the lifting frame (13) moves, it drives the pulling frame (14) to move upwards. The pulling frame (14) pulls the pulling rod (15) to move upwards. When the pulling rod (15) moves upwards, it pulls the sliding block (16) to move in a direction of approaching each other on the inner wall of the limiting groove, and squeezes the limiting elastic rod (3); S3: When the middle portion of the elastic plate (18) bends, it pushes the vertical plate (32) to move toward each other on the surface of the slide rail (4), and when the vertical plate (32) moves, it drives the push plate (33) to move toward each other; S4: First, place the other half of the SMD diode on the surface of the packaging board (61) and push the packaging board (61) upward. When the packaging board (61) is pushed, the rising column (62) is pushed upward to move upward. When the rising column (62) moves upward, it drives the driven frame (63) to move upward.

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