Circuit structure for air conditioner and air conditioner

Abstract

The invention provides a circuit structure for an air conditioner and the air conditioner, wherein the reliability is improved while the manufacturing cost is reduced. A circuit structure (10) for an air conditioner is provided with: a semiconductor element (11); a heat dissipation fin (12) provided on one side of the semiconductor element (11) in a state of being in contact with the semiconductor element (11); and a substrate (13) that is provided on the other side of the semiconductor element (11) and that is provided with: connection pins (14a, 14b) that electrically connect the semiconductor element (11) and the substrate (13); a resin holding member (16) that holds the heat dissipation fins (12) and the substrate (13); and a metal plate (15) that is electrically grounded, and the holding member (16) is interposed between the metal plate (15) and the heat dissipation fins (12).

Description

Technical Field

[0001] The present disclosure relates to a circuit structure for an air conditioner, etc. Background Art

[0002] Regarding the insulating mounting structure of a power transistor, for example, there is known a technique described in Patent Document 1. That is, Patent Document 1 describes that "the metal plate member and the metal plate base are connected to each other via a resin insulating member that ensures a constant spatial distance between the two and is mounted on one of the two as a solid insulating portion."

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2014-053468 Summary of the invention

[0006] Problems to be solved by the invention

[0007] In the technology described in Patent Document 1, in order to provide a predetermined gap between the metal plate component and the metal plate base for electrical insulation while fixing the relative position of the two, it is necessary to process the resin insulating component into a special shape, which increases the manufacturing cost. It is expected that the reliability can be improved while the manufacturing cost can be reduced, but such a technology is not described in Patent Document 1.

[0008] Therefore, an object of the present disclosure is to provide a circuit structure for an air conditioner and the like that achieves improved reliability while reducing manufacturing costs.

[0009] Solutions to Solve Problems

[0010] In order to solve the above-mentioned problems, the circuit structure for air conditioner disclosed in the present invention comprises: a semiconductor element; a heat dissipation fin, which is provided on one side of the semiconductor element in a state of contact with the semiconductor element; and a substrate, which is provided on the other side of the semiconductor element and comprises: a connection pin, which electrically connects the semiconductor element and the substrate; a resin holding member, which holds the heat dissipation fin and the substrate; and a metal plate, which is electrically grounded, the holding member having: a plate-shaped base portion, which is provided with a second hole; a frame-shaped side wall, which extends from the vicinity of the edge of the base portion to the other side; a protruding portion, which extends from the vicinity of the edge of the second hole on the base portion to the one side; and a contact portion, which extends inwardly from the edge of the second hole in the surface direction of the base portion, the heat dissipation fin is provided inside the second hole when viewed from the one side, and is fixed to the contact portion in a state of contacting with the contact portion from the one side, the substrate is fixed to the inner side of the frame-shaped side wall, and the protruding portion of the holding member is interposed between the metal plate and the heat dissipation fin.

[0011] Effects of the Invention

[0012] According to the present disclosure, it is possible to provide a circuit structure for an air conditioner or the like that can achieve improved reliability while reducing manufacturing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic cross-sectional view of the circuit structure for an air conditioner according to the first embodiment.

[0014] Figure 2 It is a schematic bottom view of the circuit structure for an air conditioner according to the first embodiment.

[0015] Figure 3 This is a perspective view of a state where the holding member of the circuit structure for an air conditioner according to the first embodiment is looked down from obliquely right front.

[0016] Figure 4 This is a perspective view of a state where the holding member of the circuit structure for an air conditioner according to the first embodiment is viewed from the oblique front left upward.

[0017] Figure 5 It is a structural diagram of an air conditioner according to a second embodiment.

[0018] Figure 6 This is a perspective view of a state where a side panel and a top panel are removed from a casing of an outdoor unit of an air conditioner according to a second embodiment.

[0019] Figure 7 This is a perspective view of a state where a holding member of a circuit structure for an air conditioner according to a modified example is viewed from the oblique front left upward.

[0020] In the figure:

[0021] 10—circuit structure for air conditioner, 11—semiconductor element, 12—heat dissipation fin, 13—substrate, 14a, 14b—connecting pin, 15—metal plate, 16, 16A—holding member, 16a—base portion, 16b—flange portion, 16c—side wall, 16d—abutment portion, 16e, 16Ae—extending portion, 16f—rib, 20—compressor, 30—outdoor heat exchanger, 40—outdoor fan, 50—expansion valve, 60—indoor heat exchanger, 70—indoor fan, 80—four-way valve, 90—accumulator, 100—air conditioner, 161c—claw portion, B1—electrical component box, H1—first hole, H2—second hole, J1, J2—solder joint portion, U1—outdoor unit, U2—indoor unit, W1, W3, W5—screws. DETAILED DESCRIPTION

[0022] 《First Implementation Mode》

[0023] Figure 1 It is a schematic cross-sectional view of the circuit structure 10 for air conditioners according to the first embodiment.

[0024] also, Figure 1 The “one side” shown corresponds to the inside of an electric component box (not shown) formed of the metal plate 15 , and the “other side” corresponds to the outside of the electric component box. Figure 1 The circuit structure 10 for an air conditioner shown is a circuit structure for driving a compressor of an air conditioner (not shown) or an outdoor fan. Figure 1 As shown, the circuit structure 10 for an air conditioner includes a semiconductor element 11 , heat dissipation fins 12 , a substrate 13 , connection pins 14 a and 14 b , a metal plate 15 , and a holding member 16 .

[0025] The semiconductor element 11 is a power module including a plurality of power transistors (not shown). In addition, a "power module" is an electric circuit structured in which a plurality of power transistors are packaged together with other electronic components. As the power transistor of the semiconductor element 11, for example, a power MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor), an IGBT (Insulated Gate Bipolar Transistor), or a bipolar transistor is used. The semiconductor element 11 is used as a switching element such as an inverter.

[0026] When a predetermined current flows due to the switching operation of the power transistor (not shown), the semiconductor element 11 generates heat. Heat dissipation fins 12 (also called heat sinks) are provided to dissipate the heat of the semiconductor element 11 to the outside and maintain the temperature of the semiconductor element 11 within an allowable range.

[0027] The heat sink 12 is a metal component for dissipating the heat of the semiconductor element 11 to the outside. As a constituent material of such a heat sink 12, aluminum is used, for example, but other types of metals such as copper and iron may also be used. Figure 1 As shown, the heat dissipation fin 12 includes a base 12 a and a plurality of fins 12 b.

[0028] The base 12a is a plate-shaped portion on which a plurality of fins 12b are provided. The base 12a is provided with threaded holes (symbols not shown) corresponding to a plurality of screws W1. These screws W1 are used when fixing the semiconductor element 11 to the heat dissipation fins 12. In addition, the base 12a is provided with other threaded holes (symbols not shown) corresponding to a plurality of screws W5. These screws W5 are used when fixing the heat dissipation fins 12 to the holding member 16. Figure 1 As shown, the base 12 a of the heat dissipation fin 12 is in surface contact with the semiconductor element 11 .

[0029] The plurality of fins 12b are each in the shape of a thin plate, and extend from the base 12a to one side. A predetermined gap is provided between adjacent fins 12b in the plurality of fins 12b. In addition, the plate surfaces of the plurality of fins 12b are substantially parallel.

[0030] like Figure 1 As shown in FIG. 1 , the heat sink 12 is provided on one side of the semiconductor element 11 in a state of contacting the semiconductor element 11. The semiconductor element 11 is fixed to the heat sink 12 by a metal screw W1. In addition, even when a heat conductive grease (lubricating oil) is applied to the contact surface of the semiconductor element 11 with the heat sink 12, the heat sink 12 and the semiconductor element 11 are included in the matter of "contacting".

[0031] Figure 1 The substrate 13 shown is a printed circuit board on which an inverter (not shown) and a control circuit (not shown) are mounted. A predetermined control signal is output from the control circuit to a power transistor (not shown) of the semiconductor element 11 via connecting pins 14a and 14b. Figure 1 As shown, the substrate 13 is provided on the other side of the semiconductor element 11. The substrate 13 and the semiconductor element 11 are separated in the thickness direction of the substrate 13. In addition, the plate surface of the substrate 13, the plate surface of the semiconductor element 11, and the plate surface of the base 12a of the heat dissipation fin 12 are substantially parallel.

[0032] The pair of connecting pins 14a and 14b are conductors for electrically connecting the semiconductor element 11 and the substrate 13. One end of the connecting pin 14a is connected to the semiconductor element 11, and the other end is connected to the substrate 13. For example, the connecting pin 14a is inserted through a hole (not shown) provided in the substrate 13, and the connecting pin 14a is soldered to the substrate 13. Figure 1 In the example of FIG. 1 , a solder joint J1 is formed at a position corresponding to the insertion portion of the connection pin 14a on the other side surface of the substrate 13. The same is true for the other connection pin 14b.

[0033] The metal plate 15 is a metal plate on which the holding member 16 is provided. The metal plate 15 constitutes a part of an electrical component box (not shown) for accommodating various components such as the semiconductor element 11, the substrate 13, and the holding member 16. Figure 1 As shown, the metal plate 15 is electrically grounded (earth). For example, the metal plate 15 may be electrically connected to a ground plate (not shown) buried in the earth via a grounding wire (not shown). By grounding the metal plate 15 in this way, even if leakage current occurs, the leakage current can be discharged to the earth.

[0034] like Figure 1 As shown, the metal plate 15 is provided with an extension portion 16e (also see Figure 4 ) corresponding to the first hole H1 of the shape. For example, when the extension portion 16e is viewed from one side and has a quadrilateral shape (see also Figure 4 ), so that the extension 16e is inserted into the first hole H1 from the other side, and a quadrilateral first hole H1 (window) is formed. In addition, the heat dissipation fin 12 is provided inside the first hole H1 when viewed from one side. In addition, the metal plate 15 is provided with threaded holes (symbols not shown) corresponding to a plurality of screws W3. These screws W3 are used when fixing the holding member 16 to the metal plate 15.

[0035] The holding member 16 is a resin member for holding the heat dissipation fins 12 and the base plate 13. The holding member 16 also has a function of electrically insulating the heat dissipation fins 12 and the metal plate 15 by interposing (i.e., inserting) the extension portion 16e between the heat dissipation fins 12 and the metal plate 15. As a constituent material of such a holding member 16, for example, a non-conductive resin such as polycarbonate or polystyrene is used.

[0036] like Figure 1 As shown in FIG. 1 , the holding member 16 includes a base portion 16a, a flange portion 16b, a side wall 16c, a contact portion 16d, and an extension portion 16e. The base portion 16a is plate-shaped, and one side of the base portion 16a contacts the metal plate 15. Figure 1In the example, substantially the entire surface of one side of the base portion 16a contacts the surface of the other side of the metal plate 15. In addition, if the positional relationship between the substrate 13 and the base portion 16a is described, in the thickness direction of the substrate 13, the substrate 13 is separated from the base portion 16a to the other side.

[0037] like Figure 1 As shown, the base portion 16a is provided with a second hole H2 (see also Figure 3 ). Moreover, the heat dissipation fin 12 is inserted into the second hole H2 from one side. For example, when the heat dissipation fin 12 is quadrilateral when viewed from one side, the quadrilateral second hole H2 is provided in such a manner that the heat dissipation fin 12 is inserted into the second hole H2 (see also Figure 3 ).like Figure 1 As shown, when viewed from one side, the heat dissipation fins 12 are provided inside the second hole H2.

[0038] Flange portion 16b (see also Figure 3 ) is a portion for fixing the holding member 16 to the metal plate 15, and extends outward from the base portion 16a in the surface direction of the base portion 16a. The surface of one side of the flange portion 16b is flush with the surface of one side of the base portion 16a. Figure 1 2 shows a structure in which one flange portion 16 b is provided on each of the lateral sides of the holding member 16 , but the number of the flange portions 16 b may be three or more.

[0039] In addition, the flange portion 16b is provided with threaded holes (symbols not shown) corresponding to a plurality of screws W3. These screws W3 are used when fixing the retaining member 16 to the metal plate 15. In a state where the screws W3 are threadedly coupled to the flange portion 16b and the threaded holes of the metal plate 15 in sequence, the surface of one side of the flange portion 16b contacts the surface of the other side of the metal plate 15. And, in a state where the flange portion 16b overlaps with the metal plate 15, the metal screws W3 are fixed to the metal plate 15. In addition, for the screws W3, nuts (not shown) can also be threadedly coupled from the other side of the metal plate 15.

[0040] The side wall 16c is a portion extending from the vicinity of the edge of the base portion 16a toward the other side (see also Figure 3 ). For example, when the base portion 16a is quadrilateral in a plan view, the side wall 16c extends from the four sides of the edge of the quadrilateral of the base portion 16a to the other side. In addition, the shape of the inner surface of the side wall 16c in a plan view corresponds to the shape of the edge of the substrate 13. And the substrate 13 is embedded in the area surrounded by the side wall 16c.

[0041] like Figure 1 As shown, the side wall 16c has a plurality of claws 161c (see also Figure 3). These claws 161c have the function of limiting the movement of the substrate 13 to the other side. Figure 1 FIG. 1 shows a structure in which one claw portion 161c is provided on each of the lateral sides of the holding member 16, but the number of the claw portions 161c may be more than three. Figure 1 Although not shown in the figure, the holding member 16 has a plurality of ribs 16f (see Figure 3 ). These ribs 16f have the function of supporting the substrate 13, and extend from the base portion 16a to the other side on the inner side of the side wall 16c. Figure 3 ), the substrate 13 is fixed.

[0042] Figure 1 The abutment portion 16d shown is used when fixing the heat dissipation fin 12 to the holding member 16. The abutment portion 16d extends inward from the edge of the second hole H2 in the surface direction of the base portion 16a. Figure 3 ) is a quadrilateral, the contact portion 16d extends inwardly from the four sides of the edge of the quadrilateral of the second hole H2. In addition, the surface of the other side of the contact portion 16d is flush with the surface of the other side of the base portion 16a.

[0043] The contact portion 16d is provided with threaded holes (symbols not shown) corresponding to a plurality of screws W5. In addition, when the heat dissipation fin 12 is in contact with the contact portion 16d from one side, the heat dissipation fin 12 is fixed to the contact portion 16d by the metal screw W5. In addition, when the semiconductor element 11 is provided on the heat dissipation fin 12 and the heat dissipation fin 12 is provided on the holding member 16, the side surface of the semiconductor element 11 is surrounded by the contact portion 16d.

[0044] The extension portion 16e has a function of electrically insulating the heat dissipation fins 12 and the metal plate 15, and extends from the base portion 16a to one side. Figure 1 In the example, the inner side surface of the extension portion 16e is flush with the wall surface of the second hole H2 of the base portion 16a. For example, when the heat dissipation fin 12 is a quadrilateral when viewed from above, the quadrilateral-shaped extension portion 16e (also refer to Figure 4 ) is provided so as to surround the heat dissipation fin 12. Moreover, the extension portion 16e is interposed between the metal plate 15 and the heat dissipation fin 12.

[0045] exist Figure 1In the example of , the holding member 16 is interposed between the wall surface of the first hole H1 of the metal plate 15 and the heat dissipation fin 12. In short, the resin holding member 16 is interposed between the metal plate 15 and the heat dissipation fin 12. Therefore, even when the heat dissipation fin 12 electrically connected to the semiconductor element 11 is at a high potential relative to the metal plate 15 (electrically grounded), it is possible to prevent leakage current from flowing to the metal plate 15 via the heat dissipation fin 12.

[0046] In addition, Figure 1 In the example of Figure 1 In the vertical direction of the paper), the height position of the front end of the extension 16e is approximately the same as the height position of the surface of one side of the metal plate 15, but is not limited to this. For example, the extension 16e may extend further to one side than the surface of one side of the metal plate 15. That is, the length of the extension 16e extending from the base portion 16a to one side may be longer than the thickness of the metal plate 15. In addition, a predetermined dimensional error may be taken into consideration, and a small gap may be provided in the lateral direction between the edge of the first hole H1 of the metal plate 15 and the extension 16e. Similarly, a predetermined dimensional error may be taken into consideration, and a small gap may be provided in the lateral direction between the heat dissipation fin 12 and the extension 16e.

[0047] Figure 2 It is a schematic bottom view of the circuit structure 10 for air conditioners.

[0048] also, Figure 2 Observed from one side Figure 1 FIG. 10 is a diagram of a circuit structure 10 for an air conditioner. Figure 2 In the example of FIG. 1 , the semiconductor element 11 is fixed to the heat sink 12 by screwing a pair of screws W1 on both sides of the semiconductor element 11 which is quadrilateral when viewed from above. In addition, the heat sink 12 is fixed to the holding member 16 by screwing a screw W5 on each of the four corners of the heat sink 12 which is quadrilateral when viewed from above. In addition, the extension 16e which is quadrilateral when viewed from above is interposed between the heat sink 12 and the metal plate 15.

[0049] Figure 3 This is a perspective view of the holding member 16 as viewed from the right front obliquely in plan.

[0050] In addition, Figure 3 In the front-back, left-right, up-down directions shown, the upper side corresponds to Figure 1 The "other side" (the inside of the electrical box), and the lower side corresponds to Figure 1 The "one side" (outside of the electrical box). Figure 3In the example, the resin holding member 16 is roughly box-shaped with an upper opening. That is, the side wall 16c is provided to extend upward from the edge of the thin rectangular base portion 16a. A plurality of claws 161c are provided on the side wall 16c. In addition, a plurality of holes H7 are provided on the side wall 16c. These holes H7 are used to contact the substrate 13 (see Figure 1 ) and the wiring (not shown) connected thereto.

[0051] exist Figure 3 In the example of FIG. 1 , the flange portion 16b of the holding member 16 extends forward from the base portion 16a. Figure 4 ), flange portions 16b may also be provided on the lateral side of the base portion 16a. Each flange portion 16b is provided with a screw W3 (see Figure 1 ) of the threaded hole H3.

[0052] In addition, a portion for fixing the heat dissipation fin 12 (see FIG. Figure 1 ) of the threaded hole H5. The screw W5 (see Figure 1 ) are inserted through these screw holes H5. In addition, four ribs 16f extend upward from the base portion 16a. As described above, these ribs 16f have a function of fixing the substrate 13 together with the claws 161c (see Figure 1 ) function. Figure 3 In the example shown in FIG. 1 , four ribs 16f are provided so as to surround the second hole H2, but the number and arrangement of the ribs 16f may be changed appropriately.

[0053] Figure 4 This is a perspective view of the holding member 16 as viewed from the oblique front left.

[0054] like Figure 4 As shown in FIG. 1 , a quadrilateral extension 16e extends downward from the lower surface of the base 16a. In addition, an extension 16e is provided around the second hole H2 of the base 16a. Figure 1 ) is surrounded by a four-frame-shaped extension portion 16e. As described above, the extension portion 16e has the function of electrically insulating the heat dissipation fins 12 and the metal plate 15.

[0055] <Effect>

[0056] According to the first embodiment, the resin holding member 16 is interposed between the metal heat dissipation fins 12 and the grounded metal plate 15. This prevents the heat dissipation fins 12 from becoming equal to the ground potential (that is, the heat dissipation fins 12 can be electrically floated), thereby suppressing leakage current from flowing to the metal plate 15. In addition, there is no need to perform complicated processing on the heat dissipation fins 12 for electrical insulation, so the manufacturing cost can be reduced.

[0057] In addition, according to the first embodiment, when fixing the heat dissipation fin 12 to the holding member 16, a metal screw W5 based on a predetermined standard specification can be used. In addition, the heat dissipation fin 12 is not in an electrically grounded state, but is floated as described above and becomes the same potential as the semiconductor element 11. Therefore, when fixing the heat dissipation fin 12, it is not necessary to use a resin insulating member of a special shape as in the above-mentioned patent document 1, and ordinary screws can be used, so that cost reduction can be achieved.

[0058] In addition, according to the first embodiment, even when the circuit structure 10 for the air conditioner vibrates with the driving of the device, the semiconductor element 11, the heat dissipation fins 12, the substrate 13, the connecting pins 14a, 14b, the metal plate 15, and the holding member 16 vibrate substantially in an integrated manner. That is, the force that attempts to move the position of the substrate 13 in the vertical direction hardly acts on the semiconductor element 11. Thus, it is possible to suppress the stress from acting on the solder joints J1 and J2 of the connecting pins 14a and 14b (see Figure 1 ). Therefore, in addition to improving the reliability of the circuit structure 10 for air conditioners, shortening of the life can be suppressed. Thus, according to the first embodiment, a circuit structure 10 for air conditioners can be provided that reduces manufacturing costs while improving reliability.

[0059] Second Implementation Method

[0060] In the second embodiment, a circuit structure 10 for an air conditioner (see Figure 1 ) of the air conditioner 100 (refer to Figure 5 ) is described. In addition, the circuit structure 10 for air conditioner (refer to Figure 1 ) is the same as that of the first embodiment, so the description is omitted.

[0061] <Structure of air conditioner>

[0062] Figure 5 It is a configuration diagram of an air conditioner 100 according to the second embodiment.

[0063] also, Figure 5 The solid arrows indicate the flow of the refrigerant in the heating cycle.

[0064] in addition, Figure 5 The dashed arrows indicate the flow of the refrigerant in the refrigeration cycle.

[0065] The air conditioner 100 is a device that performs air conditioning such as cooling operation and heating operation, and includes an outdoor unit U1 and an indoor unit U2. The outdoor unit U1 and the indoor unit U2 are connected via a refrigerant pipe.

[0066] The air conditioner 100 includes a compressor 20, an outdoor heat exchanger 30, an outdoor fan 40, an expansion valve 50, and a four-way valve 80 as components provided in the outdoor unit U1. In addition, the air conditioner 100 includes an indoor heat exchanger 60 and an indoor fan 70 as components provided in the indoor unit U2.

[0067] The compressor 20 is a device that compresses a low-temperature, low-pressure gas refrigerant and discharges it as a high-temperature, high-pressure gas refrigerant, and includes a compressor motor 21 as a driving source. Figure 5 Although not shown in the figure, the accumulator 90 for separating the gas and liquid of the refrigerant (see Figure 6 ) is arranged on the suction side of the compressor 20.

[0068] The outdoor heat exchanger 30 is a heat exchanger in which the heat transfer pipe 32 (refer to Figure 6 ) and the outside air sent in from the outdoor fan 40. The outdoor fan 40 is a fan that sends the outside air to the outdoor heat exchanger 30. The outdoor fan 40 has an outdoor fan motor 41 as a driving source and is arranged near the outdoor heat exchanger 30.

[0069] The expansion valve 50 is a valve that decompresses the refrigerant condensed by the "condenser" (one of the outdoor heat exchanger 30 and the indoor heat exchanger 60). The refrigerant decompressed by the expansion valve 50 is guided to the "evaporator" (the other of the outdoor heat exchanger 30 and the indoor heat exchanger 60).

[0070] The indoor heat exchanger 60 is a heat exchanger that performs heat exchange between the refrigerant flowing through the heat transfer tube (not shown) and the indoor air (air in the air-conditioning room) sent in from the indoor fan 70. The indoor fan 70 is a fan that sends indoor air to the indoor heat exchanger 60, and is installed near the indoor heat exchanger 60.

[0071] The four-way valve 80 is a valve that switches the flow path of the refrigerant according to the operation mode of the air conditioner 100. For example, in the cooling operation (see Figure 5 In the refrigerant circuit Q1, the refrigerant circulates sequentially through the compressor 20, the outdoor heat exchanger 30 (condenser), the expansion valve 50, and the indoor heat exchanger 60 (evaporator). Figure 5 In the refrigerant circuit Q1, the refrigerant circulates sequentially through the compressor 20, the indoor heat exchanger 60 (condenser), the expansion valve 50, and the outdoor heat exchanger 30 (evaporator).

[0072] Figure 6 This is a perspective view of a state where the side panels and the top panel are removed from the casing U11 of the outdoor unit U1.

[0073] like Figure 6 As shown, the outdoor unit U1 is provided with an air conditioner circuit structure 10 in addition to the compressor 20, the accumulator 90, the outdoor heat exchanger 30, and the outdoor fan 40. Figure 6 In the example of FIG. 1 , an L-shaped outdoor heat exchanger 30 is provided on the bottom plate U11a of the housing U11 in a plan view. The outdoor heat exchanger 30 includes a plurality of fins 31 arranged at predetermined intervals and a plurality of heat transfer tubes 32 penetrating the fins 31. Heat exchange is performed between the outside air sent in by the outdoor fan 40 and the refrigerant flowing through the heat transfer tubes 32.

[0074] The circuit structure 10 for an air conditioner includes a metal electric component box B1. The electric component box B1 is a box for storing semiconductor elements 11 (see Figure 1 ), substrate 13 (refer to Figure 1 As described above, the electrical parts box B1 is made of a metal plate 15 (see Figure 1 ) is formed and electrically grounded. In addition, the electrical component box B1 (i.e., the metal plate 15: see Figure 1 ) and heat sink fins 12 (refer to Figure 1 ) by holding member 16 (refer to Figure 1 ) are electrically insulated.

[0075] <Effect>

[0076] According to the second embodiment, the outdoor unit U1 of the air conditioner 100 includes a circuit structure 10 for an air conditioner (see Figure 1 ). Therefore, it is possible to reduce the manufacturing cost of the air conditioner 100 while improving its reliability.

[0077] 《Variation Example》

[0078] As described above, in each embodiment, the circuit structure 10 for an air conditioner of the present disclosure (see Figure 1 )、Air conditioner 100 (refer to Figure 5 ) are described, but the present disclosure is not limited to these descriptions, and various changes can be made. For example, in the first embodiment, the retaining member 16 (refer to Figure 4 ) of the extension portion 16e (see Figure 4 ) is described as a quadrilateral, but is not limited thereto and may also be Figure 7 The structure shown.

[0079] Figure 7 This is a perspective view of a holding member 16A of a circuit structure for an air conditioner according to a modified example, as seen from the oblique front left side upward.

[0080] Figure 7 The holding member 16A shown is a quadrilateral extending portion 16e (see Figure 4 ) The structure in which the four corners are omitted. Specifically, the extension portion 16Ae includes a first extension portion 161, a second extension portion 162, a third extension portion 163 and a fourth extension portion 164. The first extension portion 161 is provided on the front side of the quadrilateral second hole H2 and extends in the left-right direction (the same applies to the second extension portion 162 on the rear side of the second hole H2). In addition, the third extension portion 163 is provided on the left side of the quadrilateral second hole H2 and extends in the front-back direction (the same applies to the fourth extension portion 164 on the right side of the second hole H2). Among the first extension portion 161 to the fourth extension portion 164, the adjacent extension portions (for example, the first extension portion 161 and the third extension portion 163) around the second hole H2 are separated from each other.

[0081] In addition, using Figure 7 In the case where the circuit structure for an air conditioner is cut by a plane (not shown) perpendicular to the plate surface of the base portion 16a and a straight line L1 extending in the front-back direction, the first extension portion 161 and the second extension portion 162 (i.e., the holding member 16A) are interposed between the heat dissipation fins 12 (see Figure 1 ) and the metal plate 15 (refer to Figure 1 ). In addition, Figure 7 The same is true for the case where the circuit structure for the air conditioner is cut by another plane (not shown) perpendicular to the plate surface of the base portion 16a and the straight line L2 in the left-right direction of the single-point chain line. Figure 1 ) and the metal plate 15 (refer to Figure 1 ) in the gap between the two parts, the distance between the heat dissipating fins 12 and the metal plate 15 can be made longer than the wall thickness of the holding member 16A, thereby improving the insulation. Figure 7 In the holding member 16A of the structure shown in FIG. 1 , the heat dissipation fins 12 (see FIG. 1 ) can also be placed on the heat dissipation fins 12 (see FIG. 1 ). Figure 1 ) and metal plate 15 (refer to Figure 1 )Electrical insulation.

[0082] In the first embodiment, the circuit structure 10 for an air conditioner (see Figure 1 ) is described with reference to the case where the heat dissipation fin 12 has a base 12a and a plurality of fins 12b, but the invention is not limited thereto. For example, other types of heat dissipation fins such as a pin-type heat sink may also be used as the heat dissipation fin.

[0083] In the first embodiment, the connecting pins 14a and 14b (see Figure 1 ) is described as having two roots, but the number of connecting pins can also be three or more.

[0084] In the first embodiment, the extension portion 16e (see Figure 1 ) is flush with the wall surface of the second hole H2 of the base portion 16a, but the invention is not limited thereto. Figure 1 ) is provided with a predetermined step between the inner side surface of the base portion 16a and the wall surface of the second hole H2. That is, the extension portion 16e may extend toward one side from the vicinity of the edge of the second hole H2 at the base portion 16a.

[0085] In the first embodiment, the case where the extension portion 16e is in a quadrilateral shape when viewed from below has been described (see Figure 4 ), but the "frame-shaped" is not limited to a quadrilateral. For example, the extension portion 16e may also be a polygonal or elliptical frame when viewed from above. In this case, the heat dissipation fin 12 is surrounded by the "frame-shaped" extension portion 16e.

[0086] In the first embodiment, the metal plate 15 (see Figure 1 ) and the retaining member 16 (refer to Figure 1 ) contact is described, but it is not limited to this. For example, a predetermined plate-shaped member (not shown) may be sandwiched between the metal plate 15 and the holding member 16. Such a structure is also included in the matter that the holding member 16 is "set" on the metal plate 15.

[0087] In the second embodiment, the circuit structure 10 for an air conditioner (see Figure 6 ) is installed in outdoor unit U1 (refer to Figure 6 ) is described above, but is not limited thereto. For example, the circuit structure 10 for an air conditioner may also be provided in the indoor unit U2 (see Figure 5 ), and may also be provided in the outdoor unit U1 and the indoor unit U2, respectively. That is, the circuit structure 10 for the air conditioner may be provided in at least one of the outdoor unit U1 and the indoor unit U2.

[0088] In the second embodiment, the air conditioner 100 (see Figure 5 ) is equipped with a four-way valve 80 (refer to Figure 5 That is, the four-way valve 80 may be omitted from the air conditioner 100 to make it a cooling-only or heating-only structure.

[0089] In the second embodiment, the indoor unit U2 (see Figure 5 ) and outdoor unit U1 (refer to Figure 5 ) are described above, but are not limited to this. That is, multiple indoor units connected in parallel may be provided, and multiple outdoor units connected in parallel may also be provided.

[0090] In the second embodiment, the case where the air conditioner 100 is a room air conditioner is described. However, the second embodiment can also be applied to various air conditioners such as a package air conditioner and a multi-split air conditioner for a building.

[0091] In addition, each embodiment is an example described in detail to explain the present disclosure in an easy-to-understand manner, and is not limited to having all the structures described. In addition, for a part of the structure of the embodiment, other structures can be added, deleted, or replaced.

[0092] In addition, the above-mentioned mechanisms and structures show the parts considered necessary for explanation, and it is not limited to that all mechanisms and structures must be shown on the product.

Claims

1. A circuit structure for an air conditioner, characterized in that: have: Semiconductor components; a heat dissipation fin provided on one side of the semiconductor element in a state of contacting the semiconductor element; and a substrate disposed on the other side of the semiconductor element, and have: a connecting pin that electrically connects the semiconductor element and the substrate; a resin holding member that holds the heat dissipation fins and the substrate; and A metal plate, which is electrically grounded, The holding component has: a plate-shaped base portion having a second hole; a frame-shaped side wall extending from the vicinity of the edge of the base portion toward the other side; An extension portion extending from the vicinity of an edge of the second hole on the base portion toward the one side; as well as an abutment portion extending inward from an edge of the second hole in a surface direction of the base portion, The heat dissipation fin is provided inside the second hole when viewed from the one side, and is fixed to the abutting portion in a state of abutting against the abutting portion from the one side. The substrate is fixed to the inner side of the frame-shaped side wall. The extending portion of the holding member is interposed between the metal plate and the heat dissipating fins.

2. The circuit structure for air conditioner according to claim 1, characterized in that: The metal plate is provided with a first hole, When viewed from the one side, the heat dissipation fin is disposed inside the first hole. The holding member is interposed between a wall surface of the first hole and the heat dissipation fin.

3. The circuit structure for air conditioner according to claim 1, characterized in that: When viewed from the one side, the extension portion is frame-shaped. The heat dissipation fins are surrounded by the frame-shaped extension portion.

4. The circuit structure for air conditioner according to claim 1, characterized in that: The holding member has a rib extending from the base portion toward the other side on the inner side of the side wall, The substrate is fixed by the claws of the side wall and the ribs, The substrate is separated from the base portion toward the other side.

5. The circuit structure for air conditioner according to claim 1, characterized in that: The holding member includes a flange portion extending outward from the base portion in a surface direction of the base portion, The flange portion is fixed to the metal plate by metal screws in a state of overlapping with the metal plate.

6. The circuit structure for air conditioner according to claim 1, characterized in that: The heat dissipation fin is fixed to the abutment portion by a metal screw in a state where the heat dissipation fin abuts against the abutment portion from the one side.

7. An air conditioner, characterized in that: An air conditioner circuit structure according to any one of claims 1 to 6, comprising an outdoor unit and an indoor unit, The outdoor unit and the indoor unit are connected via a refrigerant pipe. The air conditioner circuit structure is provided in at least one of the outdoor unit and the indoor unit.

Images