Laser soldering process for low-voltage connectors, low-voltage connectors and laser equipment

Abstract

The present invention relates to the technical field of laser welding, and particularly relates to a laser soldering process for a low-voltage connector, a low-voltage connector, and a laser device. The laser soldering process includes fixing the low-voltage connector to be welded on a laser welding device. Among them, a solder bar is sleeved on the solder column of the low-voltage connector to be welded, and the solder bar is arranged along the radial direction of the solder column; heating the low-voltage connector to be welded by using the laser welding device, at least part of the welding laser of the laser welding device irradiates on the pad of the low-voltage connector to be welded, and the remaining part of the welding laser of the laser welding device irradiates on the solder column of the low-voltage connector to be welded. The main purpose of the present invention is to provide a laser soldering process, aiming to improve the uniform distribution between the pad and the solder column after the welding rod is melted and formed.

Description

Technical Field

[0001] The present invention relates to the technical field of laser welding, and particularly relates to a laser soldering process for a low-voltage connector, a low-voltage connector, and a laser device. Background Art

[0002] A low-voltage connector is a coupling device used to connect wires, cables, printed circuit boards, and electronic components. Its main function is to form a circuit to transmit data, power, and signals. It is usually used in BMS (Battery Management System), air conditioning systems, vehicle lights, etc., and its operating voltage is generally 14V.

[0003] In the related art, in order to ensure that there is no gap between the pads and posts of the low-voltage connector, the current conventional process is to use a soldering iron to heat the solder wire and solder paste for a long time to fuse them. In this way, after the tin is formed, it is unevenly distributed between the pads and posts, which easily causes problems such as unstable electrical connection and decreased mechanical strength. Summary of the Invention

[0004] The main purpose of the present invention is to provide a laser soldering process, aiming to improve the even distribution of the welding rod after hot melting between the pads and posts.

[0005] To achieve the above purpose, the laser soldering process proposed by the present invention includes:

[0006] Fix the low-voltage connector to be welded on a laser welding device. Among them, a solder strip is sleeved on the post of the low-voltage connector to be welded, and the solder strip is arranged along the radial direction of the post.

[0007] Use the laser welding device to heat the low-voltage connector to be welded. At least part of the welding laser of the laser welding device irradiates on the pads of the low-voltage connector to be welded, and the remaining part of the welding laser of the laser welding device irradiates on the posts of the low-voltage connector to be welded.

[0008] In an embodiment of the present invention, define the laser energy of the laser welding device irradiating on the pads as J1, and the laser energy of the laser welding device irradiating on the posts as J2. The ratio of J1 to J2 is 7:3.

[0009] In an embodiment of the present invention, the laser shape of the welding laser is an annular laser.

[0010] In an embodiment of the present invention, the two ends of the solder strip are connected to each other so that the solder strip is an annular solder strip.

[0011] In an embodiment of the present invention, the welding duration of the laser welding device is 15 seconds.

[0012] In an embodiment of the present invention, after the step of sleeving a tin ring on the welding post of the low-voltage connector to be welded, when fixing the low-voltage connector to be welded on a laser welding device, the following steps are further included:

[0013] Use a heat-insulating cover plate to cover a part of the structure of the pad of the low-voltage connector to be welded. The welding post of the low-voltage connector penetrates through the heat-insulating cover plate, and there is a certain gap between the outer peripheral surface of the welding post and the heat-insulating cover plate.

[0014] The present invention provides a low-voltage connector obtained by the laser soldering process.

[0015] The present invention provides a laser device for implementing the laser soldering process. The laser device includes a base frame, a linear movement module, and a laser head. The linear movement module is fixedly arranged on the base frame, and the laser head is slidably connected to the linear movement module.

[0016] In an embodiment of the present invention, the linear movement module includes a horizontal linear module and a vertical linear module. The horizontal linear module is fixedly arranged on the base frame, the vertical linear module is slidably connected to the horizontal linear module, and the laser head is movably arranged on the vertical linear module.

[0017] In an embodiment of the present invention, the base frame is provided with a positioning fixture. The positioning fixture is movably arranged on the side of the base frame facing the laser head and can move closer to or away from the horizontal linear module.

[0018] In this technical solution, the pad and the welding post of the low-voltage connector are heated simultaneously by a laser welding device, so as to melt the tin ring sleeved on the welding post. During this process, the tin ring can uniformly absorb the heat of the welding post and flow in a hot melt state into the gap between the pad and the welding post. In this way, after the tin is formed, it can be evenly between the pad and the welding post. Moreover, by using the continuous heat after welding of the laser, the pad and the welding post can dry the rosin acid in the formed solder ring and remove the excess rosin. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for describing the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0020] Figure 1 It is a schematic flow chart of an embodiment of the laser soldering process provided by the present invention;

[0021] Figure 2Schematic structural diagram of an embodiment of the laser device provided by the present invention.

[0022] Explanation of the reference numerals in the drawings:

[0023] 10. Base frame; 20. Linear movement module; 21. Horizontal linear module; 22. Vertical linear module; 30. Laser head; 40. Positioning fixture.

[0024] The realization of the object of the present invention, functional features and advantages will be further described with reference to the embodiments and the accompanying drawings. Specific embodiments

[0025] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0026] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative position relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0027] In addition, the descriptions involving "first", "second", etc. in the present invention are only for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the meaning of "and / or" appearing throughout the text includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, or solution B, or the solution where A and B are satisfied simultaneously. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention.

[0028] Please refer to Figure 1 , the laser soldering process proposed by the present invention includes:

[0029] Step S100: Fix the low-voltage connector to be welded on the laser welding device. Among them, a solder bar is sleeved on the solder column of the low-voltage connector to be welded, and the solder bar is arranged along the radial direction of the solder column;

[0030] Step S300: using laser welding equipment to heat and weld the low-voltage connector, at least part of the welding laser of the laser welding equipment is irradiated on the welding pad of the low-voltage connector to be welded, and the rest of the welding laser of the laser welding equipment is irradiated on the welding column of the low-voltage connector to be welded.

[0031] In this technical solution, the solder pad and solder column of the low-voltage connector are heated simultaneously by laser welding equipment, thereby melting the tin ring mounted on the solder column. During this process, the tin ring can evenly absorb the heat of the solder column and melt into the gap between the solder pad and the solder column. In this way, the tin can be evenly distributed between the solder pad and the solder column after forming. In addition, by utilizing the continuous heat of the laser after welding, the solder pad and the solder column can dry out the rosin acid in the formed solder ring and remove excess rosin.

[0032] Among them, it needs to be explained that the laser welding equipment is provided with a corresponding workpiece fixing station, and the low-voltage connector to be welded can be fixed on the laser welding equipment by means of snap-in, plug-in, etc. At the same time, the workpiece fixing station has a welding state and a retreated state. In the welding state, the workpiece fixing station is close to the laser head 30 of the laser welding equipment; in the retreated state, the workpiece fixing station is away from the laser head 30 of the laser welding equipment, so that it is convenient to heat and pick up the low-voltage connector.

[0033] Among them, the tin bar is arranged along the radial direction of the solder column, which means that after the tin bar is sleeved on the solder column, the plane where the tin bar is located is parallel to the horizontal plane. In this way, the tin bar can ensure consistency when flowing to the gap between the solder pad and the solder column during hot melting.

[0034] After the low-voltage connector to be welded is fixed, the laser welding equipment is started to perform laser welding on the low-voltage connector. Specifically, at least a portion of the welding laser of the laser welding equipment is irradiated on the soldering pad of the low-voltage connector to be welded, and the rest of the welding laser of the laser welding equipment is irradiated on the soldering column of the low-voltage connector to be welded. In this way, the heat on the soldering column is first absorbed by the tin bar and melted, and flows to the gap between the soldering pad and the soldering column; at the same time, the soldering pad is also in a heat release state. In this way, after the laser welding equipment stops working, the heat released by the soldering pad can continuously heat the tin between the soldering pad and the soldering column, thereby removing excess rosin.

[0035] Furthermore, the laser energy irradiated by the laser welding equipment on the solder pad is defined as J1, and the laser energy irradiated by the laser welding equipment on the solder column is defined as J2. Experiments show that when the ratio of J1 to J2 is 7:3, the hot melting effect of the tin bar is at its best. Under this laser energy distribution, it can ensure that after the tin bar is hot-melted, it fills the gap between the solder pad and the solder column and covers the entire surface of the solder pad, thereby ensuring the electrical performance of the low-voltage connector.

[0036] In an embodiment of the present invention, the laser shape of the welding laser is an annular laser. In this way, the annular laser can be adapted to the welding posts and pads, thereby ensuring the accuracy of energy distribution, so that 30% of the laser energy irradiates the welding posts and 70% of the laser energy irradiates the pads.

[0037] In an embodiment of the present invention, the two ends of the solder bar are connected to each other so that the solder bar is a ring-shaped solder bar. The ring-shaped solder bar can completely surround the welding posts, ensuring that the solder can be evenly distributed around the welding posts, thereby improving the welding reliability; at the same time, since the two ends of the solder bar are connected to form a ring, this simplifies the process of placing the solder bar, reduces the operation steps, and improves the production efficiency.

[0038] In an embodiment of the present invention, the welding duration of the laser welding equipment is 15 seconds. It can be understood that for different models of low-voltage connectors, only the output power of the equipment needs to be changed, and the time is 15 seconds; the welding duration of 15 seconds refers to the duration of laser irradiation and action on one pad and welding post. Since the time for the laser to irradiate on the pad and welding post can be ignored, it can be considered that the action duration is 15 seconds, thereby ensuring the welding effect; for a low-voltage connector, there are two pads and welding posts. Therefore, the welding duration of one low-voltage connector is 30 seconds.

[0039] In an embodiment of the present invention, after step S100, it further includes:

[0040] Step S200: Use a heat-insulating cover plate to cover a part of the structure of the pad of the low-voltage connector to be welded. The welding posts of the low-voltage connector pass through the heat-insulating cover plate, and there is a certain gap between the outer peripheral surface of the welding posts and the heat-insulating cover plate.

[0041] It can be understood that the pad is a part of the area on the circuit board of the low-voltage connector, and electronic components such as capacitors, resistors, and diodes are arranged around it. In order to prevent the welding laser from burning these electronic components, heat insulation treatment needs to be carried out before the solder ring is melted; specifically, the heat-insulating cover plate has two through holes, each welding post passes through a through hole, and a certain gap is formed between the inner peripheral wall of the through hole. This gap is larger than the gap between the pad and the welding post, and a part of the surface of the pad is exposed through the through hole, so that the welding laser can irradiate on the pad.

[0042] The present invention provides a low-voltage connector obtained by the laser soldering process described above. In this way, the gap between the pad and the welding post of the low-voltage connector can be evenly filled with the melted solder, and the surface of the pad can be covered with solder.

[0043] The present invention proposes a laser device for realizing the laser soldering process. The laser device includes a base frame 10, a linear motion module 20 and a laser head 30. The linear motion module 20 is fixed to the base frame 10, and the laser head 30 is slidably connected to the linear motion module 20. The base frame 10 can be directly placed on the bottom surface or the processing surface through the foot pad structure to realize laser welding. The linear motion module 20 includes a translation module 11 including a frame structure, moving parts, a transmission system, etc., wherein the frame structure is usually made of aluminum alloy material, has sufficient strength and rigidity to support the laser head 30, and provides a structural basis for fixing and supporting the moving parts. The moving parts can be a guide rail structure or a linear guide rail structure or a slider structure for the movement of the laser head 30, which is a part or workpiece used to support and guide the movement of the laser head 30, and is not limited here. The transmission system can be a drive motor or a cylinder drive, which is not limited here. Furthermore, under the control of a control system composed of a PLC, a touch screen and a host computer, parameters are set to control the time and position of feeding and retreating of the laser head 30, so as to realize automated welding, which is not limited here.

[0044] Specifically, the linear moving module 20 includes a transverse linear module 21 and a longitudinal linear module 22. The transverse linear module 21 is fixed to the base frame 10, and the longitudinal linear module 22 is slidably connected to the transverse linear module 21. The laser head 30 is movably provided on the longitudinal linear module 22. The longitudinal linear module 22 moves along the direction defined by the transverse linear module 21, so that after one soldering pad and soldering column in the low-voltage connector to be welded is hot-melted, it can be directed to move to another soldering pad and soldering column; during the hot-melting of one soldering pad and soldering column, the laser head 30 can move along the direction defined by the longitudinal linear module 22 to approach or move away from the low-voltage connector.

[0045] In one embodiment of the present invention, the base frame 10 is provided with a positioning jig 40, which is movably arranged on the side of the base frame 10 facing the laser head 30 and can move close to or away from the transverse linear module 21. Specifically, a directional guide rail is provided on the side of the base frame 10 facing the laser head 30, and the base of the positioning jig 40 is provided with a slider structure adapted to the directional guide rail. The real-time control of the control system can ensure that the positioning jig 40 is aligned with the laser head 30 each time in the welding state, and in the retreated state, the positioning jig 40 can be away from the laser head 30, thereby forming sufficient avoidance space between the laser head 30 and the laser head 30 to pick up the low-voltage connector.

[0046] The above are only preferred embodiments of the present invention and are not intended to limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention's description and drawings, or direct / indirect applications in other related technical fields, within the scope of the present invention are included in the patent protection scope of the present invention.

Claims

1. A laser soldering process method for a low-voltage connector, characterized in that, The laser soldering process method includes: Fixing the low-voltage connector to be welded on a laser welding device, wherein a solder bar is sleeved on the solder column of the low-voltage connector to be welded, and the solder bar is arranged along the radial direction of the solder column; Heating the low-voltage connector to be welded by using the laser welding device, at least part of the welding laser of the laser welding device irradiates on the pad of the low-voltage connector to be welded, and the remaining part of the welding laser of the laser welding device irradiates on the solder column of the low-voltage connector to be welded; Defining the laser energy of the laser welding device irradiating on the pad as J1, the laser energy of the laser welding device irradiating on the solder column as J2, and the ratio of J1 to J2 is 7:3; The laser shape of the welding laser is an annular laser; Both ends of the solder bar are connected to each other so that the solder bar is an annular solder bar.

2. The laser soldering process method according to claim 1, characterized in that, The welding duration of the laser welding device is 15 seconds.

3. The laser soldering process method according to any one of claims 1 to 2, characterized in that, After the step of fixing the low-voltage connector to be welded on the laser welding device, wherein a solder ring is sleeved on the solder column of the low-voltage connector to be welded, it further includes: Covering part of the structure of the pad of the low-voltage connector to be welded with a heat insulation cover plate, the solder column of the low-voltage connector penetrates through the heat insulation cover plate, and there is a gap between the outer peripheral surface of the solder column and the heat insulation cover plate.

4. A low-voltage connector, characterized in that, Obtained by the laser soldering process method according to any one of claims 1-3.

5. A laser device for implementing the laser soldering process method as described in claim 1, characterized in that, The laser device includes a base frame, a linear moving module and a laser head, the linear moving module is fixedly arranged on the base frame, and the laser head is slidably connected to the linear moving module.

6. The laser device according to claim 5, characterized in that, The linear moving module includes a transverse linear module and a longitudinal linear module, the transverse linear module is fixedly arranged on the base frame, the longitudinal linear module is slidably connected to the transverse linear module, and the laser head is movably arranged on the longitudinal linear module.

7. The laser device according to claim 6, characterized in that, The base frame is provided with a positioning fixture, the positioning fixture is movably arranged on one side of the base frame facing the laser head, and can move closer to or away from the transverse linear module.

Images