Full-automatic plate disassembling machine and plate disassembling method

Abstract

The invention discloses a full-automatic board disassembling machine and a board disassembling method. Comprising a machine tool, a lifting mechanism, a plate disassembling mechanism and a portal frame installed on the machine tool through a linear guide rail, the plate disassembling mechanism comprises an installation plate, a cross beam and a pair of bases, the bases are installed through first linear modules respectively, a pair of lug bases are arranged on the bases, a round rod is arranged between the lug bases in a penetrating mode, and a connecting rod is hinged to the round rod; the other end of the connecting rod is hinged to a connecting plate, the connecting plate is installed on the cross beam, and grabbing pieces are evenly distributed on the installing plate. The connecting rod and the connecting plate are designed to be in hinged connection, and the sliding design of the connecting plate and the cross beam is combined, so that the driving mode of the first linear module and the second linear module on the two sides is met, a grabbed base plate can be subjected to angle inclination and horizontal translation, the cutting space is effectively enlarged, and the cutting effect is better; a brand-new plate disassembling method is integrally provided, and automatic plate disassembling work is effectively completed.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board manufacturing equipment, in particular to a full-automatic circuit board disassembly machine and a circuit board disassembly method. Background Art

[0002] As we all know, in the manufacture of circuit boards, the substrate and copper foil need to be gravity pressed by a hydraulic press so that one end of the substrate and the copper foil are pressed together. In order to improve the efficiency of pressing between the substrate and the copper foil, the substrates are stacked one by one, and the copper foil is folded for each substrate so that the bonding surface of the substrate contacts the copper foil, and the copper foil presents an "S" shape. After the stacking is completed, they are put into the hydraulic press for pressing. Although this can efficiently complete the pressing of the substrate and the copper foil, it is necessary to disassemble the board after pressing, that is, remove the pressed substrates one by one and cut them at the bending position of the copper foil.

[0003] At present, there are generally two ways to carry out the board removal work. One is to directly lift a single substrate manually and then use a cutter to cut the copper foil. Although the board removal work can be completed intact, the efficiency is low and it is not conducive to the development of efficient production. The other is to rely on the existing cutting equipment. The positions where the copper foil needs to be cut are all on the side, and then cut uniformly. Although relying on machinery can effectively improve efficiency, because the length of the copper foil folding is small, and after hydraulic pressing, the gap opened at the bending of the copper foil is also very small, whether it is longitudinal cutting or transverse cutting, it is easy to cut the copper foil on the substrate, thereby increasing the probability of defective products.

[0004] Therefore, in view of the deficiencies in the prior art, it is necessary to provide a device that can meet the requirements of panel removal. Summary of the invention

[0005] In view of the deficiencies in the above-mentioned prior art, an object of the present invention is to provide a fully automatic panel dismantling machine and a panel dismantling method which can effectively complete the panel dismantling work.

[0006] In order to achieve the above object, the present invention adopts the following technical solution:

[0007] The lifting mechanism is a lifting mechanism that can lift and lower the lifting power of the lifting mechanism, and the lifting mechanism is a lifting mechanism that can lift and lower the lifting power of the lifting mechanism, and the lifting mechanism is a lifting mechanism that can lift and lower the lifting power of the lifting mechanism.

[0008] Preferably, the cutting knife has a double-sided blade.

[0009] Preferably, a slide groove is provided on the crossbeam, a slider is fixedly provided on the connecting plate, the slider is placed in the slide groove so that the connecting plate can move along the slide groove, a pusher is provided on the mounting plate, and the telescopic head of the pusher rests on the base or the gantry.

[0010] Preferably, the thruster is a cylinder.

[0011] Preferably, distance sensors are provided at the four corners of the mounting plate.

[0012] Preferably, the material grabbing member is a vacuum suction cup.

[0013] Preferably, the lifting mechanism is a hydraulic lift.

[0014] A method for disassembling a board using a fully automatic board disassembling machine comprises the following steps:

[0015] Step 1: Place the pressed substrate assembly on the lifting mechanism and then start working;

[0016] Step 2: The lifting mechanism rises to the set height, and then the first linear modules on both sides of the gantry are driven synchronously to move the mounting plate downward to the top of the substrate group as a whole, and the uppermost substrate is grabbed by the grabbing piece;

[0017] Step 3, the first linear modules move up a distance at the same time, and then the first linear module on one side is no longer driven, and the other first linear module continues to drive upward, and the connecting rods and connecting plates at both ends rotate along the hinge points to tilt the mounting plate to meet the need for one of the first linear modules to continue to move, and finally make the topmost substrate and the other substrate present an angle of 10°. At the same time, the pusher at the end of the mounting plate that is raised is active, and the pusher at the other end remains stationary, so that the telescopic head of the active pusher is pushed outward, and then reacts on the mounting plate, so that the mounting plate is translated in another direction relative to the crossbeam. In this way, combined with the formation of the angle and the translation of the mounting plate, the part to be cut off of the copper foil is rubbed open, providing a larger cutting space;

[0018] Step 4: drive the corresponding second linear module to move the cutter from one side of the copper foil to the other side of the copper foil, thereby cutting the copper foil;

[0019] Step 5: After the copper foil is cut off, the pusher is reset, and the other first linear module is driven upward to make the inclined mounting plate horizontal. Then the gantry is driven by the linear guide rail to move the gantry to the discharge area, and then the first linear module is used to place the removed substrate in the discharge area. The gripper releases the grip of the substrate, and the gantry is reset to complete the removal of a substrate.

[0020] Step 6. Similarly, the method of steps 2 to 5 is used again. However, because the position of the copper foil connected between the substrate and another substrate is different, the orientation of the copper foil to be cut is changed. When splitting the next substrate, the movement mode of the first linear module and the pusher needs to be changed alternately to meet the requirements of the "S"-shaped copper foil cutting.

[0021] Step 7: When all the substrates on the substrate group are removed, the lifting mechanism is restored and waits for the next substrate group to be put in, and the automatic board removal work is completed.

[0022] Due to the adoption of the above scheme, the present invention designs the connecting rod and the connecting plate to be hingedly connected, combined with the sliding design of the connecting plate and the crossbeam, to meet the driving mode of the first linear module and the second linear module on both sides, so that the grasped substrate can be tilted at an angle and translated horizontally, effectively increasing the cutting space and achieving better cutting effect. An overall new method of panel removal is provided, which effectively completes the automated panel removal work. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic structural diagram of an embodiment of the present invention.

[0024] Figure 2 It is a structural schematic diagram of a plate removal mechanism according to an embodiment of the present invention.

[0025] Figure 3Embodiment of the present invention Figure 2 A magnified view of the structure at center.

[0026] Figure 4 It is a schematic diagram of the structural state of the substrate assembly of an embodiment of the present invention when the substrate is disassembled. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0028] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0029] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] like Figures 1 to 4As shown, the present embodiment provides a fully automatic panel disassembly machine and panel disassembly method, comprising a machine tool 1, a lifting mechanism 2, a panel disassembly mechanism 3 and a gantry 5 installed on the machine tool 1 through a linear guide rail 4, wherein the lifting mechanism 2 is located below the panel disassembly mechanism 3 and is used to lift a substrate group 100 that needs to be disassembled, wherein the panel disassembly mechanism 3 comprises a mounting plate 31, a crossbeam 32 and a pair of bases 33, wherein the pair of bases 33 are respectively installed on the inner side walls of the gantry 5 through a first linear module 34, and the first linear module 34 is used to make the base 33 move up and down in a vertical direction, wherein a pair of ear seats 35 are provided on the base 33, and the ear seats 35 are provided on the base 33, wherein the ear seats 35 are provided on the base 33, and ... A round rod 36 is passed through the seats 35, and a connecting rod 37 is hinged on the round rod 36. The other end of the connecting rod 37 is hinged with a connecting plate 38, and the connecting plate 38 is installed on the crossbeam 32. The mounting plate 31 is installed on the lower end surface of the crossbeam 32. The mounting plate 31 is located above the lifting mechanism 2. The mounting plate 31 is evenly provided with grabbing pieces 39 for grabbing a single substrate 101. The second linear module 301 is fixedly installed on the base 33, and a cutter 302 for cutting copper foil is fixedly installed on the movable seat of the second linear module 301. The blade of the cutter 302 is placed at the grabbing piece 39. In addition, the control work of this embodiment is the responsibility of the host. Therefore, a host can be set up on the machine tool 1, and the host controls the orderly progress of the overall work. Of course, the host can also be set outside, such as a central console. Therefore, this embodiment does not limit this, and the host is not shown on the machine tool 1.

[0031] Furthermore, in order to eliminate the resetting process of the cutter 302 in this embodiment, the cutter 302 is a double-sided blade, so after completing a cut, there is no need to reset it. During the next cutting operation, the second linear module 301 is directly driven to complete the cutting.

[0032] Furthermore, when the copper foil is pressed by the hydraulic press, although no force is applied to the bent portion 102 of the copper foil, the bent portion 102 of the copper foil will be very tightly attached during the pressing process. Even if the substrate 101 is tilted 10° with another substrate 101, the space presented is still too small. However, if the tilt angle is too large, on the one hand, the height of the gantry 5 is limited, and when it is continuously lifted, it is easy to cause damage between the pressed copper foil and the substrate 101. Therefore, a slide groove 303 is specially provided on the crossbeam 32, and a slider 304 is fixedly provided on the connecting plate 38. The slider 304 is placed in the slide groove 303 so that the connecting plate 38 can move along the slide groove 303. A pusher 305 is provided on the mounting plate 31, and the telescopic head of the pusher 305 is against the base 33 or the gantry 5. Therefore, when removing the plate, it can also be pushed in one direction to rub open the part of the copper foil to be cut.

[0033] Furthermore, with respect to the device used in this embodiment, the pusher 305 is a cylinder; the material grabbing member 39 is a vacuum suction cup; and the lifting mechanism 2 is a hydraulic lift.

[0034] Further, in order to facilitate the accurate movement of the position, the four corners of the mounting plate 31 of this embodiment are provided with distance sensors 306. The distance sensors 306 can detect whether the height of the up and down movement is correct, so as to better control the accuracy of the movement. In this embodiment, other sensors can also be used as long as they meet the distance detection.

[0035] This embodiment is directed to a method for removing panels by a fully automatic panel removal machine, and specifically includes the following steps:

[0036] Step 1: Place the pressed substrate assembly 100 on the lifting mechanism 2 and then start working;

[0037] Step 2: The lifting mechanism 2 rises to a set height, and then the first linear modules 34 on both sides of the gantry 5 are driven synchronously to move the mounting plate 31 downward to the top of the substrate group 100 as a whole, and the uppermost substrate 101 is grabbed by the grabbing member 39;

[0038] Step 3, the first linear modules 34 move up a distance at the same time, and then the first linear modules 34 on one side are no longer driven, and the other first linear module 34 continues to drive upward, and the connecting rods 37 and the connecting plates 38 at both ends rotate along the hinge points, so that the mounting plate 31 is tilted to meet the need for one of the first linear modules 34 to continue to move, and finally a 10° angle is formed between the topmost substrate 101 and the other substrate 101. At the same time, the pusher 305 at the end of the mounting plate 31 that is raised is active, and the pusher 305 at the other end remains stationary, so that the telescopic head of the active pusher 305 is pushed outward, and then reacts on the mounting plate 31, so that the mounting plate 31 is translated in another direction relative to the crossbeam 32. In this way, combined with the formation of the angle and the translation of the mounting plate 31, the part to be cut off of the copper foil is rubbed open, providing a larger cutting space;

[0039] Step 4: driving the corresponding second linear module 301 to allow the cutter 302 to move from one side of the copper foil to the other side of the copper foil, thereby cutting the copper foil;

[0040] Step 5: After the copper foil is cut, the pusher 305 is reset, and the other first linear module 34 is driven upward to make the inclined mounting plate 31 horizontal. Then, the gantry 5 is driven by the linear guide 4 to move the gantry 5 to the discharge area, and then the first linear module 34 is used to place the removed substrate in the discharge area. The gripping member 39 releases the gripping of the substrate 101, and the gantry 5 is reset, completing the removal of one substrate 101.

[0041] Step 6. Similarly, the method of step 2 to step 5 is used again. However, because the positions of the copper foils connected between the substrate 101 and another substrate 101 are different, that is, the orientation of the copper foil to be cut is changed. When splitting the next substrate 101, the moving modes of the first linear module 34 and the pusher 305 need to be changed alternately (that is, the first linear module 34 on one side moves upward for a distance last time, and the first linear module 34 on the other side moves upward for a distance next time; and the pusher 305 on one side pushes last time, and the pusher 305 on the other side pushes next time) to meet the requirements of the "S"-shaped copper foil cutting.

[0042] Step 7: After all the substrates 101 on the substrate set 100 are removed, the lifting mechanism 2 is restored and waits for the next substrate set 101 to be put in. Then, the automatic board removal work is completed.

[0043] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A fully automatic board disassembly machine, characterized by: The lifting mechanism is a bottom surface of the lifting mechanism, and the ...

2. A fully automatic panel disassembling machine as claimed in claim 1, characterized in that: The cutting knife has a double-sided blade.

3. A fully automatic panel disassembling machine as claimed in claim 2, characterized in that: A slide groove is arranged on the crossbeam, a slider is fixedly arranged on the connecting plate, the slider is placed in the slide groove so that the connecting plate can move along the slide groove, a pusher is arranged on the mounting plate, and the telescopic head of the pusher rests on a base or a gantry.

4. The fully automatic panel disassembling machine according to claim 1, characterized in that: The thruster is a cylinder.

5. The fully automatic panel disassembling machine according to claim 1, characterized in that: Distance sensors are arranged at the four corners of the mounting plate.

6. The fully automatic panel disassembling machine according to claim 1, characterized in that: The material grabbing member is a vacuum suction cup.

7. The fully automatic panel disassembling machine according to claim 1, characterized in that: The lifting mechanism is a hydraulic lift.

8. A method for disassembling panels using a fully automatic panel disassembling machine as claimed in claim 3, characterized in that: The following steps are involved: Step 1: Place the pressed substrate assembly on the lifting mechanism and then start working; Step 2: The lifting mechanism rises to the set height, and then the first linear modules on both sides of the gantry are driven synchronously to move the mounting plate downward to the top of the substrate group as a whole, and the uppermost substrate is grabbed by the grabbing piece; Step 3, the first linear modules move up a distance at the same time, and then the first linear module on one side is no longer driven, and the other first linear module continues to drive upward, and the connecting rods and connecting plates at both ends rotate along the hinge points to tilt the mounting plate to meet the need for one of the first linear modules to continue to move, and finally make the topmost substrate and the other substrate present an angle of 10°. At the same time, the pusher at the end of the mounting plate that is raised is active, and the pusher at the other end remains stationary, so that the telescopic head of the active pusher is pushed outward, and then reacts on the mounting plate, so that the mounting plate is translated in another direction relative to the crossbeam. In this way, combined with the formation of the angle and the translation of the mounting plate, the part to be cut off of the copper foil is rubbed open, providing a larger cutting space; Step 4: drive the corresponding second linear module to move the cutter from one side of the copper foil to the other side of the copper foil, thereby cutting the copper foil; Step 5: After the copper foil is cut off, the pusher is reset, and the other first linear module is driven upward to make the inclined mounting plate horizontal. Then the gantry is driven by the linear guide rail to move the gantry to the discharge area, and then the first linear module is used to place the removed substrate in the discharge area. The gripper releases the grip of the substrate, and the gantry is reset to complete the removal of a substrate. Step 6. Similarly, the method of steps 2 to 5 is used again. However, because the position of the copper foil connected between the substrate and another substrate is different, the orientation of the copper foil to be cut is changed. When splitting the next substrate, the movement mode of the first linear module and the pusher needs to be changed alternately to meet the "S"-shaped copper foil cutting. Step 7: When all the substrates on the substrate group are removed, the lifting mechanism is restored and waits for the next substrate group to be put in, and the automatic board removal work is completed.

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