Production equipment and process for die cutting and back line of double-sided combined flexible circuit board

Abstract

The invention relates to the field of flexible circuit board production, in particular to double-sided combined flexible circuit board die cutting and back line production equipment and process, and the equipment comprises a rack and a die cutting head which is arranged on the rack and is used for carrying out die cutting treatment on a flexible board needing to be processed. One side, far away from the die-cutting head, of the rack is provided with a back wire unit used for covering a wire on the flexible circuit board, and the die-cutting head and the back wire unit are matched with each other to form the effects that die cutting is carried out on the flexible circuit board from the front side and the wire is covered on the back side of the flexible circuit board; the working procedures of die cutting and back line processing on the flexible circuit board are achieved on one machine, the situation that materials need to be moved for multiple times in the using process is effectively avoided, and after the materials are moved for multiple times, the relative positions of the materials and the machine and the relative positions of the materials need to be adjusted for multiple times so that the materials can be aligned with one another, and the working efficiency is improved. And the precision and the consistency of the final circuit board are influenced.

Description

Technical Field

[0001] The invention relates to the field of flexible circuit board production, and in particular to a production device and process for die-cutting and back-line production of a double-sided combined flexible circuit board. Background Art

[0002] Flexible circuit board, commonly known as FPC in the industry, is a printed circuit board made of a flexible insulating substrate (mainly polyimide or polyester film). This material has high heat resistance and good dimensional stability. It can be freely bent, wound and folded, and can be moved and stretched at will in three-dimensional space. It is widely used in lighting products such as LED light strips, light tubes, and panel lights.

[0003] At present, in the production and processing of flexible circuit boards, die-cutting and back-line deposition generally use multiple processes and are completed independently. Die-cutting of flexible circuit boards usually uses CNC punching machines, and back-line deposition uses steam cleaning followed by spraying or scraping coating. After completing one process, the processed flexible circuit board needs to be transported to the next equipment for the next process. After multiple processes and multiple transports, the efficiency of flexible circuit board production is reduced, and the accumulated errors of each process will affect the accuracy and consistency of the final circuit board.

[0004] Therefore, based on the above-stated viewpoint, there is still room for optimization in the existing technical means for producing and processing flexible circuit boards. Summary of the invention

[0005] In order to solve the above problems, the present invention provides a production equipment for double-sided combined flexible circuit board die-cutting and back-line, including a frame and a die-cutting head on the frame for die-cutting the flexible board to be processed, a conveying channel is formed between the die-cutting head and the frame for conveying the flexible circuit board, and a back-line unit for laminating the wire on the flexible circuit board is arranged on the side of the frame away from the die-cutting head. The die-cutting head and the back-line unit cooperate with each other to form an effect of die-cutting the flexible circuit board on the front side and laminating the wire on the back side of the flexible circuit board.

[0006] The back line unit includes a mounting base plate for connecting a plurality of wire reels, a mounting side plate for connecting an insulating film, and a laminator for laminating the insulating film on a plurality of wires and then laminating the laminated insulating film and the wires on a flexible circuit board. The mounting base plate, the mounting side plate, and the laminator are all connected to the frame, and the insulating film and the plurality of wires are respectively connected to the mounting side plate and the mounting base plate in a winding shape.

[0007] Preferably, the laminator comprises electric telescopic rods symmetrically connected to one side of the frame away from the die-cutting head, a guide roller is commonly provided between the telescopic sections of the two electric telescopic rods, a rotating roller corresponding to the guide roller is provided on the side of the frame close to the guide roller, and the relative position between the guide roller and the rotating roller is adjusted by the electric telescopic rod to allow the laminated insulating film and wire to pass through.

[0008] Preferably, the frame is also provided with auxiliary parts for assisting the conductor and the insulating film to be laminated together, the auxiliary parts include a horizontal pressing plate arranged on the frame corresponding to the mounting base plate, the horizontal pressing plate is threadedly connected with a driving screw, and the driving screw is connected with a driving end connected to the frame to drive the horizontal pressing plate to slide in the vertical direction to assist the conductor and the rubber side of the insulating film to be laminated together.

[0009] Preferably, a rotating shaft connected to the frame is passed through the fixed section of the electric telescopic rod, a transmission shaft corresponding to the rotating shaft is symmetrically connected to the frame, and the transmission shaft and the rotating shaft are connected by bevel gear meshing transmission.

[0010] Preferably, the end of the transmission shaft away from the bevel gear is also connected to the driving screw through the bevel gear meshing transmission connection.

[0011] Preferably, a limiting roller for limiting the position of the wires is commonly connected between the mounting substrate and the mounting side plate, so that all the wires connected to the mounting substrate are on the same plane.

[0012] Preferably, the mounting substrate is arranged in a bent shape, a plurality of wires are connected to the inner side of the bent section of the mounting substrate, a plurality of guide grooves are provided on the side of the mounting substrate away from the wire reel, and the plurality of guide grooves correspond one-to-one to the positions of the wires to guide and limit the sliding path of the wires.

[0013] Preferably, the lower end of the mounting substrate is also connected to a wire-manipulating roller for further guiding the guide position, and the wire-manipulating roller is also provided with a plurality of guide grooves corresponding to the wires, and the plurality of wires are transitionally attached to the mounting substrate via the guide grooves on the wire-manipulating roller.

[0014] Preferably, the outer side surface of the rotating roller is coaxially provided with a connecting ring sleeve, and the connecting ring sleeve is provided with an opening for partially exposing the rotating roller so as to fit on the insulating film.

[0015] In addition, the present invention also provides a production process for die-cutting and back-line of a double-sided combined flexible circuit board, comprising the following steps:

[0016] S1: The coiled flexible circuit board is attached to the frame for transportation, and is die-cut by a die-cutting head during transportation. At the same time, an insulating film and a plurality of wires are wound and connected to the side of the frame away from the die-cutting head, and the insulating film and the wires are connected to the frame at a distance.

[0017] S2: Pulling the plurality of wires and the insulating film connected to the frame in sequence, so that the plurality of wires are evenly arranged and distributed on the same plane along the outer side of the mounting substrate, and then laminating the adhesive side of the wires on all the wires to complete the lamination of the insulating film and the wires.

[0018] S3: After the lamination of the insulating film and the wire is completed, the laminated insulating film and the wire are pulled again and driven through the laminator, and then the insulating film and the wire are laminated on the back of the flexible circuit board through the guidance of the laminator, forming a double-sided combination to process the flexible circuit board.

[0019] In summary, the present application includes at least one of the following beneficial technical effects:

[0020] 1. The present invention realizes the die-cutting and back-line processing processes of the flexible circuit board on one machine, thereby effectively avoiding the need to move the material multiple times during use. After moving the material multiple times, it is also necessary to adjust the relative positions of the material and the machine and between the materials multiple times to align them with each other, which affects the accuracy and consistency of the final circuit board.

[0021] 2. The present invention draws one end of the flexible circuit board wound into a coil and adheres it to the frame, so that when the flexible circuit board passes between the frame and the die-cutting head, the die-cutting head performs die-cutting and punching processing on the flexible circuit board passing through, and then the flexible circuit board continues to be adhered to the frame and moves forward. At the same time, through the back line unit arranged on the side of the frame away from the die-cutting head, the required wires are laminated on the back of the die-cut flexible circuit board, so as to complete the effect of die-cutting the front side of the flexible circuit board and laminating the wires on the back side of the flexible circuit board, thereby effectively improving the efficiency of the production and processing of the flexible circuit board.

[0022] 3. The present invention controls the extension and contraction of the telescopic section of the electric telescopic rod to drive the connected guide roller to slide synchronously, thereby adjusting the relative position between the guide roller and the rotating roller on the frame, so that the position of the insulating film and the wire passed through and laminated between the guide roller and the rotating roller is adjusted to a state flush with the back of the flexible circuit board, and at the same time controls the rotation of the rotating roller and the connecting ring sleeve to tear off the protective film on the side of the insulating film away from the wire, so that the rubber surface of the insulating film leaks out to be laminated on the back of the flexible circuit board, thereby completing the effect of back-line processing of the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0024] Figure 1 It is a structural schematic diagram of the present invention.

[0025] Figure 2 It is a structural schematic diagram of the backline unit of the present invention.

[0026] Figure 3 It is a schematic structural diagram of the laminating device of the present invention.

[0027] Figure 4 It is a structural schematic diagram of the rotating roller of the present invention.

[0028] Figure 5 It is a structural schematic diagram of the auxiliary part of the present invention.

[0029] Figure 6 The present invention Figure 5 A is an enlarged view of the middle image.

[0030] Figure 7 It is a schematic structural diagram of the wire straightening roller of the present invention.

[0031] Figure 8 The present invention Figure 7 Enlarged view of B.

[0032] Fig. 9 It is a schematic structural diagram of the mounting substrate of the present invention.

[0033] In the figure, 1, frame; 10, die-cutting head; 11, flexible circuit board; 12, wire; 13, insulating film; 2, back line unit; 20, mounting base plate; 21, mounting side plate; 22, laminator; 220, electric telescopic rod; 221, guide roller; 222, rotating roller; 23, auxiliary part; 230, horizontal pressing plate; 231, driving screw; 232, driving end; 233, rotating shaft; 234, transmission shaft; 24, limiting roller; 25, connecting side plate; 250, guide groove; 26, wire management roller; 27, connecting ring sleeve. DETAILED DESCRIPTION

[0034] The following is combined with Figure 1 To Attachment Fig. 9 While embodiments of the invention have been described in detail, the invention can be implemented in many different ways as defined and covered by the claims.

[0035] The embodiment of the present application discloses a production equipment and process for die-cutting and back-line processing of a double-sided combined flexible circuit board. It is explained that the production equipment and process for die-cutting and back-line processing of a double-sided combined flexible circuit board are mainly used in the process of producing and processing flexible circuit boards, and can achieve the effect of die-cutting and back-line processing of the flexible circuit boards to be processed in terms of technical effect; in particular, the process of die-cutting and back-line processing of the flexible circuit boards is realized on one machine, which effectively avoids the need to move materials multiple times, affecting the accuracy and consistency of the final circuit boards; and, the production equipment for die-cutting and back-line processing of the double-sided combined flexible circuit board can also synchronously laminate the required wires on the back side of the die-cut flexible circuit board during the die-cutting process of the flexible circuit board, thereby forming an effect of die-cutting the flexible circuit board on the front side and back-line processing on the back side.

[0036] Example 1: Reference Figure 1 and Figure 2 As shown, a production equipment for double-sided combined flexible circuit board die-cutting and back-line, including a frame 1, a die-cutting head 10 and a back-line unit 2, the frame 1 is provided with a die-cutting head 10 for die-cutting the flexible board to be processed, a conveying channel is formed between the die-cutting head 10 and the frame 1 for conveying the flexible circuit board 11, and a back-line unit 2 for laminating the wire 12 on the flexible circuit board 11 is provided on the side of the frame 1 away from the die-cutting head 10, through the mutual cooperation of the die-cutting head 10 and the back-line unit 2, the effect of die-cutting the front side of the flexible circuit board 11 and laminating the wire 12 on the back side of the flexible circuit board 11 is formed.

[0037] When in use, one end of the flexible circuit board 11 wound into a coil is pulled and attached to the frame 1, so that when the flexible circuit board 11 passes between the frame 1 and the die-cutting head 10, the die-cutting and punching processing is performed on the passing flexible circuit board 11, and then the flexible circuit board 11 continues to be attached to the frame 1 and moves forward while passing through the back line unit 2 set on the side of the frame 1 away from the die-cutting head 10, so that the required wire 12 is laminated on the back side of the die-cut flexible circuit board 11, so as to complete the die-cutting of the front side of the flexible circuit board 11 and laminate the wire 12 on the back side of the flexible circuit board 11, thereby effectively improving the efficiency of the production and processing of the flexible circuit board.

[0038] It should be noted that the die-cutting head 10 is a conventional existing technical means, which mainly places the flexible circuit board 11 material on the frame 1 for transportation. When it reaches the bottom of the die-cutting head 10, the control system of the die-cutting machine will start to control the die-cutting head 10 to descend, so that the tool on the die-cutting head 10 cuts according to a preset path and pressure, so as to die-cut the required conductive holes and other shapes on the flexible circuit board 11.

[0039] Reference Figure 2 and Figure 3As shown, the back line unit 2 is used to laminate the wire 12 on the flexible circuit board 11; specifically, the back line unit 2 includes a mounting substrate 20 for connecting a plurality of wire 12 reels, a mounting side plate 21 for connecting the insulating film 13, and a laminate 22 for laminating the insulating film 13 on the plurality of wires 12 and then laminating the laminated insulating film 13 and the wires 12 on the flexible circuit board 11. The mounting substrate 20, the mounting side plate 21 and the laminate 22 are all connected to the frame 1, and the insulating film 13 and the plurality of wires 12 are wound by a winding shaft, and are rotated through the winding shaft to pass through the mounting side plate 21 and the mounting substrate 20.

[0040] When in use, the winding shaft with the insulating film 13 wound thereon is installed on the mounting side plate 21, and then the plurality of winding shafts with the conductive wires 12 wound thereon are rotated and passed through the mounting substrate 20, and then the installed insulating film 13 and the plurality of conductive wires 12 are pulled and stretched, so that the flexible circuit board 11 to be processed, the insulating film 13 and the plurality of conductive wires 12 are stretched to form a positional relationship of stacking up and down in sequence, and the adhesive surface of the insulating film 13 after stretching is opposite to the plurality of conductive wires 12 after stretching, so that the insulating film 13 is attached to the outer side of the conductive wires 12.

[0041] After the insulating film 13 and the wire 12 are pulled and stretched, the sliding path of the stretched insulating film 13 and the wire 12 is limited and guided by the laminator 22, so that all the wires 12 are attached to one side of the rubber surface of the insulating film 13 during the sliding process and are at the same horizontal height. Then, the laminator 22 is used to laminate the laminated insulating film 13 and the wire 12 on the back side of the flexible circuit board 11 after die-cutting. It should be noted that at this time, the rubber surface of the insulating film 13 is laminated on the wire 12, and on the contrary, the other side of the insulating film 13 with the protective film adhered is facing the flexible circuit board 11.

[0042] Reference Figure 3 and Figure 4 As shown, a laminator 22 is used to laminate the insulating film 13 onto a plurality of conductive wires 12, and then laminate the laminated insulating film 13 and conductive wires 12 onto the flexible circuit board 11; specifically, the laminator 22 includes an electric telescopic rod 220, a guide roller 221 and a rotating roller 222. The electric telescopic rod 220 is symmetrically connected to the side of the frame 1 away from the die-cutting head 10, and a guide roller 221 is rotatably penetrated between the telescopic sections of the two electric telescopic rods 220. A rotating roller 222 corresponding to the guide roller 221 is rotatably penetrated on the side of the frame 1 close to the guide roller 221. The relative position between the guide roller 221 and the rotating roller 222 is adjusted by the electric telescopic rod 220 so that the laminated insulating film 13 and conductive wires 12 can pass through.

[0043] When in use, the telescopic section of the electric telescopic rod 220 is controlled to extend and retract. When the telescopic section of the electric telescopic rod 220 is extended and retracted, it will drive the connected guide roller 221 to slide synchronously, thereby adjusting the relative position between the guide roller 221 and the rotating roller 222 on the frame 1, so that the laminated plurality of conductors 12 and the insulating film 13 can be laminated on the back of the flexible circuit board 11, thereby completing the effect of processing the flexible circuit board 11 on both sides.

[0044] Reference Figures 5 to 8 As shown, the frame 1 is also provided with an auxiliary part 23 for assisting the conductor 12 and the insulating film 13 to be laminated together. The auxiliary part 23 includes a horizontal pressing plate 230, a driving screw 231 and a driving end 232. The frame 1 is provided with a horizontal pressing plate 230 corresponding to the mounting base plate 20. The horizontal pressing plate 230 is symmetrically threaded with two driving screws 231 in the length direction, wherein any one of the driving screws 231 is connected with a driving end 232 connected to the frame 1 to drive the horizontal pressing plate 230 to slide in the vertical direction to assist the conductor 12 and the rubber side of the insulating film 13 to be laminated. It should be noted that the driving end 232 is a conventional existing motor technology, which can drive the connected driving screw 231 to rotate forward and reverse, and will not be elaborated here; the horizontal pressure plate 230 needs to correspond to the position of the mounting substrate 20 when installed, so that there is space between the horizontal pressure plate 230 and the frame 1 to allow the extended wire 12 and the insulating film 13 to pass through, that is, the horizontal pressure plate 230 is also located on the lower side of the extended wire 12 and the insulating film 13, and at least the relative position of the horizontal pressure plate 230, the wire 12, the insulating film 13 and the flexible circuit board 11 is formed from the bottom.

[0045] When in use, the connected driving screw 231 is driven to rotate through the driving end 232. After the driving screw 231 rotates, the horizontal pressing plate 230 slides in the vertical direction through the thread of the driving screw 231. When the driving screw 231 rotates forward, the horizontal pressing plate 230 is driven to slide in the direction close to the frame 1. When the driving screw 231 rotates reversely, the horizontal pressing plate 230 is moved away from the frame 1 and disengaged from the wire 12, so that the wire 12 can continue to pass, thereby adjusting the position of the horizontal pressing plate 230, the wire 12 and the insulating film 13, so that the horizontal pressing plate 230 fits under the wire 12, and compresses the extended wire 12 and the insulating film 13, so that the rubber surface of the wire 12 and the insulating film 13 further fits.

[0046] Furthermore, in order to make the rotation steps of the two driving screws 231 consistent, so that the horizontal pressure plate 230 can always maintain a horizontal state parallel to the frame 1 and slide along the driving screw 231 through the thread on the driving screw 231, as an optional implementation, a synchronous pulley is also provided on the two driving screws 231, and the two synchronous pulleys are connected together through a synchronous belt transmission. When the driving end 232 drives the connected driving screw 231 to rotate, the driving screw 231 rotates to drive the connected synchronous pulley to rotate, and drives the other synchronous pulley and the driving screw 231 to rotate through the synchronous belt, thereby achieving a synchronous rotation effect between the two driving screws 231, so that the horizontal pressure plate 230 always maintains a horizontal state and is parallel to the frame 1.

[0047] Reference Figures 5 to 8 As shown, a rotating shaft 233 rotatably connected to the frame 1 is provided on the fixed section of the electric telescopic rod 220, and a transmission shaft 234 corresponding to the rotating shaft 233 is symmetrically connected to the frame 1, and the transmission shaft 234 is connected to the rotating shaft 233 through bevel gear meshing transmission connection. When in use, after the transmission shaft 234 rotates, the rotating shaft 233 is driven to rotate synchronously through the connected bevel gear, so that the electric telescopic rod 220 drives the connected guide roller 221 to rotate an angle, so as to further adjust the relative position between the guide roller 221 and the rotating roller 222, so as to facilitate the passing of the laminated wire 12 and the insulating film 13 and to fit with the back of the flexible circuit board 11.

[0048] Reference Figures 5 to 8 As shown, the end of the transmission shaft 234 away from the bevel gear is also connected to the driving screw 231 through the bevel gear meshing transmission connection.

[0049] It should be noted that bevel gear meshing transmission is an existing conventional technical means, which mainly realizes the synchronous rotation effect between the driving screw 231 and the transmission shaft 234 and between the other end of the transmission shaft 234 and the rotating shaft 233 through the meshing transmission between the two-phase meshing bevel gears between the driving screw 231 and the transmission shaft 234 and between the other end of the transmission shaft 234 and the rotating shaft 233.

[0050] Reference Figures 5 to 8As shown, a limiting roller 24 for limiting the position of the wire 12 is also commonly connected between the mounting substrate 20 and the mounting side plate 21, so that all the wires 12 connected to the mounting substrate 20 are on the same plane. When in use, the wire 12 on the mounting substrate 20 is pulled to slide along the surface of the mounting substrate 20 and then passes between the mounting substrate 20 and the limiting roller 24. When the wire 12 passes through the limiting roller 24, the surface of the limiting roller 24 contacts and generates friction, driving the limiting roller 24 to rotate, so that the wire 12 continues to slide along the surface of the mounting substrate 20. At the same time, the limiting roller 24 abuts against all the contacting wires 12, so that the wire 12 is attached to the surface of the mounting substrate 20, so that all the wires 12 are kept at the same level and attached to the adhesive surface of the insulating film 13, thereby improving the accuracy and consistency of the back line of the flexible circuit board 11.

[0051] Further, refer to Figures 7 to 9 As shown, the mounting substrate 20 is arranged in a bent shape, and a connecting side plate 25 connected to the frame 1 is connected to the horizontal section of the mounting substrate 20 so as to install the mounting substrate 20. A certain gap is spaced between the mounting substrate 20 and the frame 1 so that the insulating film 13 and the wire 12 can pass through. Several wires 12 are connected to the inner side of the bent section of the mounting substrate 20. A plurality of guide grooves 250 are provided on the side of the mounting substrate 20 away from the wire 12 coil. The plurality of guide grooves 250 correspond to the positions of the wires 12 one by one to guide and limit the sliding path of the wires 12. When in use, the plurality of wires 12 are embedded one by one in the corresponding guide grooves 250 on the mounting substrate 20. When extending along the guide grooves 250, the limiting rollers 24 abut against each other to keep all the wires 12 at the same level by keeping them close to the guide grooves 250. It should be noted that the wires 12 selected in this embodiment are preferably flat wires 12, so that the wires 12 can be more easily kept at the same level and covered by the insulating film 13.

[0052] Reference Figures 7 to 9 As shown, the lower end of the mounting substrate 20 is also connected to a wire-straightening roller 26 for further guiding the guide position. The wire-straightening roller 26 is also provided with a plurality of guide grooves 250 corresponding to the wires 12. The plurality of wires 12 are transitionally attached to the mounting substrate 20 via the guide grooves 250 on the wire-straightening roller 26. When in use, the wires 12 are pulled through the guide grooves 250 at the wire-straightening roller 26 so that the wires 12 can be more easily attached to the guide grooves 250 on the side of the mounting substrate 20 close to the frame 1. When the wires 12 are pulled through the wire-straightening roller 26, the wire-straightening roller 26 is driven to rotate by the friction stress between the wires 12 and the wire-straightening roller 26, so as to reduce the friction between the wires 12 and the mounting substrate 20 when the wires 12 slide along the outer side surface of the mounting substrate 20, thereby avoiding the problem of surface damage of the wires 12 due to excessive friction.

[0053] At the same time, the guide grooves 250 arranged on the wire-arranging roller 26 corresponding to the plurality of wires 12 can effectively guide and smooth the sliding paths of the plurality of wires 12, so that the wires 12 slide along the guide grooves 250 on the wire-arranging roller 26 and are neatly combed through the gap between the mounting substrate 20 and the limiting roller 24, so that all the wires 12 are in the same plane and then overlapped with the rubber side of the insulating film 13.

[0054] Reference Figure 3 and Figure 4 As shown, the outer side surface of the rotating roller 222 is also coaxially sleeved with a connecting ring sleeve 27, and an opening is provided on the connecting ring sleeve 27 for partially exposing the rotating roller 222 to fit on the insulating film 13. Since the connecting ring sleeve 27 is sleeved on the outer side surface of the rotating roller 222, a step difference is formed between the opening section of the connecting ring sleeve 27 and the outer side surface of the rotating roller 222. When in use, when the insulating film 13 is pulled through between the guide roller 221 and the rotating roller 222, the rotating roller 222 on the frame 1 is driven to rotate through the existing motor technology (not shown in the figure), and the rotating roller 222 rotates to drive the connected connecting ring sleeve 27 to rotate. After the rotating roller 222 drives the connecting ring sleeve 27 to rotate, due to the step difference formed between the notch of the connecting ring sleeve 27 and the rotating roller 222, the notch position of the connecting ring sleeve 27 continuously scrapes the protective film on the upper side of the insulating film 13 as the connecting ring sleeve 27 rotates, so as to apply a reaction force in the opposite direction to the insulating film 13 passing through the rotating roller 222 and the guide roller 221 to the insulating film 13 attached to the outer side of the rotating roller 222 and the connecting sleeve, so that the protective film on the upper side of the insulating film 13 can be torn off by the rotation of the connecting ring sleeve 27, so that the rubber surface of the insulating film 13 away from the coated wire 12 also leaks out.

[0055] After the protective film on the insulating film 13 is torn off, the electric telescopic rod 220 is retracted to drive the guide roller 221 to move closer to the rotating roller 222 to adjust the position and angle of the insulating film 13 with the upper protective film torn off, so that the glue surface on the upper side of the insulating film 13 can be laminated on the back side of the flexible circuit board 11. After the insulating film 13 is laminated on the flexible circuit board 11, the insulating film 13 is continued to extend by conveying the flexible circuit board 11 and adhering between the flexible circuit board 11 and the glue surface of the insulating film 13.

[0056] Furthermore, in order to facilitate tearing off the protective film on the upper side of the insulating film 13 so that the rubber surface on the other side of the insulating film 13 can leak out, the rotating roller 222 is preferably a hot roller with a certain heating function. The insulating film 13 is limited and attached to the hot roller through the guide roller 221. The hot roller conducts heat to the protective film on the insulating film 13 to soften the adhesive between the protective film and the rubber surface on the insulating film 13, thereby reducing the adhesion between the protective film and the rubber surface. At this time, the protective film on the insulating film 13 can be torn off by applying a reaction force to the protective film through the connecting ring sleeve 27.

[0057] At the same time, the connecting ring 27 sleeved on the outer side of the rotating roller 222 effectively reduces the contact area between the rotating roller 222 and the flexible circuit board 11, thereby avoiding heat conduction of the rotating roller 222 to the flexible circuit board 11. After the protective film on the insulating film 13 is torn off, due to the temperature difference between the outer side of the flexible circuit board 11 and the insulating film 13, the adhesive on the glue surface of the insulating film 13 quickly dissipates heat and adheres to the back side of the flexible circuit board 11 after contacting the flexible circuit board 11, so that the insulating film 13 and the wire 12 after lamination are driven to continue to extend through the adhesion force between the flexible circuit board 11 and the glue surface of the insulating film 13, and the effect of laminating the wire 12 on the back side of the flexible circuit board 11 is completed.

[0058] Example 2: Reference Figures 5 to 9 As shown, on the basis of the first embodiment, although the required flat conductor 12 can be purchased directly on the market, the required flat conductor 12 has many models, which will greatly increase the difficulty and cost of procurement. In order to effectively reduce the difficulty and cost of procurement, the horizontal pressing plate 230 is configured to be directly connected to the horizontal section of the mounting substrate 20. Similarly, the connecting side plate 25 on the mounting substrate 20 connected to the frame 1 is configured as an up and down telescopic structure, and the mounting substrate 20 is connected to the telescopic section of the connecting side plate 25.

[0059] When in use, a conventional round conductor 12 is purchased from the market, wound and connected to the inner side of the mounting substrate 20, and then the round conductor 12 is pulled through the wire-straightening roller 26 and the limiting roller 24 in sequence. At this time, the connected driving screw 231 is driven to rotate forwardly through the driving end 232, and the driving screw 231 rotates to drive the horizontal pressure plate 230 to drive the mounting substrate 20 to slide in the direction close to the frame 1. After the mounting substrate 20 moves, it drives the connected connecting side plate 25 to shrink, and after the mounting substrate 20 moves, the relative position distance between it and the limiting roller 24 is also reduced, and then the mounting substrate 20 is driven to slide in the direction close to the frame 1, and the passing round conductor 12 can be flattened by the mounting substrate 20 and the limiting roller 24, so that the flattened round conductor 12 is embedded in the guide groove 250 of the mounting substrate 20.

[0060] After the round conductor 12 is flattened, the round conductor 12 is further pulled forward so that the flattened round conductor 12 contacts the rubber surface of the insulating film 13 , so that the flattened round conductor 12 is covered on the rubber surface side of the insulating film 13 .

[0061] It should be noted that, in this embodiment, the insulating film 13 needs to be pulled a little further in advance so as to be laminated on the back of the flexible circuit board 11. At this time, the insulating film 13 is extended by the laminated flexible circuit board 11. After the round wire 12 is flattened and contacts the rubber surface of the insulating film 13, it is driven forward by the insulating film 13 to continue to extend, so as to complete the effect of laminating the wire 12 on the back of the flexible circuit board 11.

[0062] In addition, the present invention also provides a production process for die-cutting and back-line of a double-sided combined flexible circuit board, comprising the following steps:

[0063] S1: The rolled flexible circuit board 11 is attached to the frame 1 for transportation, and is die-cut by the die-cutting head 10 during the transportation process. At the same time, the insulating film 13 and a plurality of wires 12 are wound and connected to the side of the frame 1 away from the die-cutting head 10, and the insulating film 13 and the wires 12 are connected to the frame 1 at a distance.

[0064] S2: Pull the plurality of wires 12 and the insulating film 13 connected to the frame 1 in sequence, so that the plurality of wires 12 are evenly arranged and distributed on the same plane along the outer side surface of the mounting substrate 20, and then overlap the adhesive side of the wire 12 on all the wires 12 to complete the lamination of the insulating film 13 and the wire 12.

[0065] S3: After the insulating film 13 and the wire 12 are laminated, the laminated insulating film 13 and the wire 12 are pulled again and driven through the laminator 22. Then, the insulating film 13 and the wire 12 are laminated on the back of the flexible circuit board 11 through the guidance of the laminator 22, so as to form a double-sided combination to process the flexible circuit board 11.

[0066] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0067] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A production device for double-sided combined flexible circuit board die-cutting and back-line processing, comprising a frame (1) and a die-cutting head (10) on the frame (1) for die-cutting a flexible circuit board (11) to be processed, characterized in that: A conveying channel is formed between the die-cutting head (10) and the frame (1) for conveying the flexible circuit board (11), and a back line unit (2) for laminating the wire (12) on the flexible circuit board (11) is provided on a side of the frame (1) away from the die-cutting head (10). The die-cutting head (10) and the back line unit (2) cooperate with each other to form an effect of die-cutting the front side of the flexible circuit board (11) and laminating the wire (12) on the back side of the flexible circuit board (11), wherein: The back line unit (2) comprises a mounting base plate (20) for connecting a plurality of wire (12) reels, a mounting side plate (21) for connecting an insulating film (13), and a laminator (22) for laminating the insulating film (13) on the plurality of wires (12) and then laminating the laminated insulating film (13) and the wires (12) on a flexible circuit board (11); the mounting base plate (20), the mounting side plate (21) and the laminator (22) are all connected to a frame (1), and the insulating film (13) and the plurality of wires (12) are respectively connected to the mounting side plate (21) and the mounting base plate (20) in a winding state.

2. The double-sided combined flexible circuit board die-cutting and back-line production equipment according to claim 1, characterized in that: The laminator (22) comprises an electric telescopic rod (220) symmetrically connected to a side of the frame (1) away from the die-cutting head (10); a guide roller (221) is provided between the telescopic sections of the two electric telescopic rods (220); a rotating roller (222) corresponding to the guide roller (221) is provided on the side of the frame (1) close to the guide roller (221); the relative position between the guide roller (221) and the rotating roller (222) is adjusted by the electric telescopic rod (220) so that the laminated insulating film (13) and the wire (12) can pass through.

3. The double-sided combined flexible circuit board die-cutting and back-line production equipment according to claim 1, characterized in that: The frame (1) is also provided with an auxiliary part (23) for assisting the conductor (12) and the insulating film (13) to be laminated together. The auxiliary part (23) includes a horizontal pressing plate (230) arranged on the frame (1) corresponding to the mounting base plate (20). A driving screw (231) is threadedly connected to the horizontal pressing plate (230). The driving screw (231) is connected to a driving end (232) connected to the frame (1) to drive the horizontal pressing plate (230) to slide in the vertical direction, thereby assisting the conductor (12) and the rubber side of the insulating film (13) to be laminated together.

4. The double-sided combined flexible circuit board die-cutting and back-line production equipment according to claim 2, characterized in that: A rotating shaft (233) connected to the frame (1) is provided on the fixed section of the electric telescopic rod (220), and a transmission shaft (234) corresponding to the rotating shaft (233) is symmetrically connected to the frame (1), and the transmission shaft (234) and the rotating shaft (233) are connected to each other through a bevel gear meshing transmission connection.

5. The double-sided combined flexible circuit board die-cutting and back-line production equipment according to claim 4, characterized in that: The end of the transmission shaft (234) away from the bevel gear is also connected to the driving screw (231) through the meshing transmission of the bevel gear.

6. The double-sided combined flexible circuit board die-cutting and back-line production equipment according to claim 1, characterized in that: A limiting roller (24) for limiting the position of the wire (12) is also commonly connected between the mounting substrate (20) and the mounting side plate (21), so that all the wires (12) connected to the mounting substrate (20) are located on the same plane.

7. The double-sided combined flexible circuit board die-cutting and back-line production equipment according to claim 1, characterized in that: The mounting substrate (20) is arranged in a bent shape, a plurality of conductors (12) are connected to the inner side of the bent section of the mounting substrate (20), a plurality of guide grooves (250) are provided on a side of the mounting substrate (20) away from the conductor (12) coil, and the plurality of guide grooves (250) correspond to the positions of the conductors (12) one by one so as to guide and limit the sliding path of the conductors (12).

8. The double-sided combined flexible circuit board die-cutting and back-line production equipment according to claim 7, characterized in that: The lower end of the mounting substrate (20) is also connected to a wire-straightening roller (26) for further guiding the guide position. The wire-straightening roller (26) is also provided with a plurality of guide grooves (250) arranged corresponding to the wires (12). The plurality of wires (12) are transitionally attached to the mounting substrate (20) via the guide grooves (250) on the wire-straightening roller (26).

9. The double-sided combined flexible circuit board die-cutting and back-line production equipment according to claim 2, characterized in that: The outer side surface of the rotating roller (222) is also coaxially sleeved with a connecting ring sleeve (27), and the connecting ring sleeve (27) is provided with an opening for partially exposing the rotating roller (222) so as to fit onto the insulating film (13).

10. A production process for double-sided combined flexible circuit board die-cutting and backing, using the double-sided combined flexible circuit board die-cutting and backing production equipment as claimed in any one of claims 1 to 9, characterized in that: The production process includes the following steps: S1: a rolled flexible circuit board (11) is attached to a frame (1) for transportation, and is die-cut by a die-cutting head (10) during transportation, while an insulating film (13) and a plurality of conductive wires (12) are wound and connected to a side of the frame (1) away from the die-cutting head (10), and the insulating film (13) and the conductive wires (12) are connected to the frame (1) at a distance from each other; S2: sequentially pulling a plurality of wires (12) and an insulating film (13) connected to the frame (1) so that the plurality of wires (12) are evenly arranged and distributed on the same plane along the outer side surface of the mounting substrate (20), and then laminating the adhesive side of the wires (12) on all the wires (12) to complete the lamination of the insulating film (13) and the wires (12); S3: After the insulating film (13) and the conductive wire (12) are laminated, the laminated insulating film (13) and the conductive wire (12) are pulled again and driven to pass through the laminator (22). Then, the insulating film (13) and the conductive wire (12) are laminated on the back side of the flexible circuit board (11) under the guidance of the laminator (22), so as to form a double-sided combination to process the flexible circuit board (11).

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