Ultrasonic vibration joining device

Abstract

The problem addressed by the present invention is to obtain an ultrasonic vibration joining device that at least achieves a reduction in device size. A lifting cylinder (39) is disposed below an ultrasonic bonding execution group including three ultrasonic bonding units (1), three pressurizing cylinders (33), and a position adjustment mechanism, and performs a lifting operation with respect to the ultrasonic bonding execution group by a telescopic operation of a piston rod (392). The position adjustment mechanism includes three position adjustment cams (37) corresponding to the three ultrasonic engagement units (1), and performs a position adjustment operation including a rotation operation of the three position adjustment cams (37). On the basis of the attitude of each of the three position adjustment cams (37), the height-direction position of the ultrasonic bonding part (81) of the corresponding ultrasonic bonding unit (1) among the three ultrasonic bonding units (1) is determined.

Description

Technical Field

[0001] The present disclosure relates to a pressurized ultrasonic vibration bonding device, and for example, to an ultrasonic vibration bonding device used as an electrode bonding device for ultrasonically bonding a conductive electrode to a thin substrate. Background Art

[0002] Conventionally, after arranging the electrode wires for current collection on the upper surface of the substrate for thin-film solar cells, in the process of joining the electrode wires to the substrate, an ultrasonic vibration bonding device is used that performs an ultrasonic bonding process by applying pressure to the electrode wires arranged on the substrate while applying ultrasonic waves. As such an ultrasonic vibration bonding device, there is a pressurized ultrasonic vibration bonding device disclosed in Patent Documents 1 and 2, for example.

[0003] Fig.18 1 is a perspective view schematically showing the overall structure of an electrode bonding device 70 as a conventional ultrasonic vibration bonding device. Fig.18 The XYZ orthogonal coordinate system is described in.

[0004] As shown in the figure, the electrode bonding device 70 includes three ultrasonic bonding units 1, three pressurizing slides 77, three pressurizing cylinders 74, a lifting frame 73, a ball screw 72, a lifting AC servo motor 71, a mounting fixture 75 and a mechanical frame 76 as main components.

[0005] A mounting fixture 75 is fixed to a mechanical frame 76, and on the side of the mounting fixture 75, there are provided, from the top, an AC servo motor 71 for lifting, a ball screw 72, a lifting frame 73, three pressurizing cylinders 74, three pressurizing slide blocks 77, and three ultrasonic bonding units 1.

[0006] The machine frame 76 is movable in the horizontal direction (X direction) by a driving mechanism (not shown), and the AC servo motor 71 for raising and lowering is fixed to the side surface having the XZ plane of the mounting jig 75 that moves in the horizontal direction together with the machine frame 76 .

[0007] The upper end (+Z direction) of the ball screw 72 is attached to the lift AC servo motor 71 , and the lower end of the ball screw 72 is attached to the lift frame 73 in a state connected to the lift frame 73 via a nut (not shown).

[0008] In such a configuration, when the ball screw 72 is rotated in the first rotation direction by driving the lift AC servo motor 71 , a lowering operation of moving the lift frame 73 downward (in the −Z direction) can be performed.

[0009] On the other hand, when the ball screw 72 is rotated in the second rotation direction (the rotation direction opposite to the first rotation direction) by the AC servo motor 71 for lifting, a lifting operation of moving the lifting frame 73 upward (in the +Z direction) can be performed.

[0010] In this way, the AC servomotor 71 for raising and lowering functions as a raising and lowering mechanism that serves as both a lowering mechanism for performing the above-mentioned lowering operation and a raising mechanism for performing the above-mentioned raising operation.

[0011] Three pressurizing cylinders 74 are mounted on the bottom surface of the lifting frame 73 having an XY plane.

[0012] Three ultrasonic bonding units 1 are provided corresponding to the three pressurizing air cylinders 74 , and the corresponding pressurizing air cylinders 74 and ultrasonic bonding units 1 are connected via a pressurizing slider 77 .

[0013] Fig.19 1 is a perspective view schematically showing the overall structure of the ultrasonic bonding unit 1. As shown in the figure, the ultrasonic bonding unit 1 includes an ultrasonic bonding horn 8 and a converter 9 as main components.

[0014] exist Fig.19 In the embodiment, the electrode member 91 disposed on the surface of the substrate 90 is the object to be joined. After the ultrasonic joining unit 1 is moved in the horizontal moving direction M1, the ultrasonic joining portion 81 of the ultrasonic joining horn 8 is moved in the vertical moving direction V1, and the joining position P91 of the electrode member 91 is in contact with the ultrasonic joining portion 81, which is a state in which the joining position P91 of the electrode member 91 is in contact with the ultrasonic joining portion 81.

[0015] The above-mentioned movement in the horizontal movement direction M1 is performed by movement of the mechanical frame 76 by a driving mechanism (not shown), and the movement in the vertical movement direction V1 is performed by a lifting operation by the lifting AC servo motor 71 .

[0016] In the bondable state, the ultrasonic bonding unit 1 including the ultrasonic bonding horn 8 is caused to perform ultrasonic vibration operation. During the execution of the above-mentioned ultrasonic vibration operation, the pressurizing operation by the three pressurizing air cylinders 74 is also performed in parallel.

[0017] The three pressurizing air cylinders 74 respectively perform a pressurizing operation of pressurizing the ultrasonic bonding portions 81 of the ultrasonic bonding horns 8 of the corresponding ultrasonic bonding units 1 among the three ultrasonic bonding units 1 toward the substrate 90 .

[0018] As a result, the conventional electrode bonding apparatus 70 can bond the electrode member 91 to the surface of the substrate 90 at the bonding position P91 by causing the ultrasonic bonding unit 1 to perform the above-mentioned ultrasonic vibration operation and the pressurizing cylinder 74 to perform the above-mentioned pressurizing operation. Since the electrode bonding apparatus 70 has three ultrasonic bonding units 1 and three pressurizing cylinders 74, it can bond the electrode member 91 to the substrate 90 at three application portions (three bonding locations).

[0019] Prior art literature

[0020] Patent Literature

[0021] Patent Document 1: International Publication No. 2020 / 059061

[0022] Patent Document 2: International Publication No. 2020 / 183641 Summary of the invention

[0023] Problems to be solved by the invention

[0024] The previous ultrasonic vibration bonding device represented by the above-mentioned electrode bonding device 70 is constructed as described above. In order to realize the lifting function of lifting and lowering the three ultrasonic bonding units 1, it is necessary to install a relatively large number of components such as a clamp 75, a lifting AC servo motor 71, a ball screw 72 and a lifting frame 73.

[0025] Therefore, the conventional ultrasonic vibration bonding device has a problem that the device size becomes relatively large.

[0026] In addition, the conventional ultrasonic vibration bonding device adopts a lower surface mounting method in which the ultrasonic bonding unit 1 is mounted below the pressurizing slider 77. Therefore, the working space for mounting and dismounting the ultrasonic bonding unit 1 is narrow, and the ultrasonic bonding unit 1 needs to be accessed from the rear (+Y direction side) of the machine frame 76 through the opening of the machine frame 76 from below.

[0027] Therefore, in the conventional electrode bonding device 70, there is a problem that the operability of the ultrasonic bonding unit 1 installed by the lower surface mounting method is poor, resulting in a prolonged operation time and a prolonged maintenance time of the ultrasonic bonding unit 1. In addition, in the electrode bonding device 70 using the lower surface mounting method, there is also a problem that the installation parts such as the ultrasonic bonding unit 1 may fall off.

[0028] The present disclosure is made to solve the above-mentioned problems, and an object of the present disclosure is to obtain an ultrasonic vibration bonding device that can at least reduce the size of the device. A more desirable object is to obtain an ultrasonic vibration bonding device that can improve the workability of the ultrasonic bonding unit.

[0029] Means used to solve problems

[0030] The ultrasonic vibration bonding device disclosed in the present invention is provided with a plurality of ultrasonic bonding units that respectively perform ultrasonic vibration actions, and the ultrasonic vibration actions are performed by applying ultrasonic vibrations from an ultrasonic bonding portion; the ultrasonic vibration bonding device also comprises: a plurality of pressurizing mechanisms, which are arranged corresponding to the plurality of ultrasonic bonding units and respectively perform pressurizing actions on corresponding ultrasonic bonding units among the plurality of ultrasonic bonding units; a position adjustment mechanism, which performs a position adjustment action for adjusting the position in the height direction of the ultrasonic bonding portion of each of the plurality of ultrasonic bonding units; and a lifting mechanism, which is arranged below an ultrasonic bonding execution group including the plurality of ultrasonic bonding units, the plurality of pressurizing mechanisms and the position adjustment mechanism and performs a lifting action on the ultrasonic bonding execution group ; and a control unit, which executes a control action, which controls the ultrasonic vibration action performed by the above-mentioned multiple ultrasonic bonding units, the above-mentioned pressurizing action performed by the above-mentioned multiple pressurizing mechanisms, the above-mentioned position adjustment action performed by the above-mentioned position adjustment mechanism, and the above-mentioned lifting and lowering action performed by the above-mentioned lifting and lowering mechanism; the above-mentioned position adjustment mechanism includes a plurality of position adjustment cams corresponding to the above-mentioned multiple ultrasonic bonding units, and the above-mentioned multiple position adjustment cams are arranged below the above-mentioned multiple ultrasonic bonding units, and the above-mentioned position adjustment action includes a rotation action of the above-mentioned multiple position adjustment cams, and the height direction position of the above-mentioned ultrasonic bonding part of the corresponding ultrasonic bonding unit among the above-mentioned multiple ultrasonic bonding units is determined according to the respective postures of the above-mentioned multiple position adjustment cams.

[0031] Effects of the Invention

[0032] The ultrasonic vibration bonding device disclosed in the present invention has a lifting mechanism for performing lifting and lowering actions on the ultrasonic bonding execution group. Therefore, by making the lifting mechanism perform lifting and lowering actions under the control of the control unit, it is possible to perform lifting and lowering actions on multiple ultrasonic bonding units together, and perform bonding preparation processing to configure multiple ultrasonic bonding units at bonding preparation positions close to the bonding object.

[0033] After the above-mentioned joining preparation treatment, the ultrasonic vibration joining device disclosed in the present invention, under the control of the control unit, causes the position adjustment mechanism to perform a position adjustment action, causes multiple pressurizing mechanisms to perform a pressurizing action, and causes multiple ultrasonic joining units to perform an ultrasonic vibration action, thereby being able to perform ultrasonic joining processing at multiple locations of the joining object.

[0034] Since the lifting mechanism is arranged below the ultrasonic bonding execution group, the device structure can be simplified and miniaturized by utilizing the relatively spare space below the ultrasonic bonding execution group. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a perspective view schematically showing the overall structure of an electrode bonding device as an ultrasonic vibration bonding device according to the first embodiment.

[0036] Figure 2 It will be Figure 1 Explanatory diagram (part 1) showing the electrode bonding device viewed from various directions.

[0037] Figure 3 It will be Figure 1 Explanatory diagram (part 2) showing the electrode bonding device viewed from various directions.

[0038] Figure 4 It will be Figure 1 Explanatory diagram (part 3) showing the electrode bonding device viewed from various directions.

[0039] Figure 5 It will be Figure 1 The electrode bonding device shown is an explanatory diagram when viewed from various directions (part 4).

[0040] Figure 6 It will be Figure 1 The diagram (part 5) shows the electrode bonding device viewed from various directions.

[0041] Figure 7 It will be Figure 1 The diagram (part 6) shows an explanatory diagram of the electrode bonding device viewed from various directions.

[0042] Figure 8 It is a schematic representation of Figure 1 to Figure 7 A three-dimensional diagram showing the overall structure of the lifting cylinder.

[0043] Fig. 9 It is a schematic representation of Figure 1 to Figure 7 A three-dimensional diagram showing the overall structure of the bracket.

[0044] Fig.10 This is an explanatory diagram (part 1) showing the operating principle of the position adjustment mechanism according to the first embodiment.

[0045] Fig.11 This is an explanatory diagram (part 2) showing the operating principle of the position adjustment mechanism according to the first embodiment.

[0046] Fig.12 This is an explanatory diagram (part 3) showing the operating principle of the position adjustment mechanism according to the first embodiment.

[0047] Fig.13 This is an explanatory diagram (part 4) showing the operating principle of the position adjustment mechanism of the first embodiment.

[0048] Fig.14 This is a block diagram schematically showing a control system of the ultrasonic vibration bonding device according to the first embodiment.

[0049] Fig.15 This is an explanatory diagram comparing the dimensions of the electrode bonding apparatus according to the first embodiment and a conventional electrode bonding apparatus.

[0050] Fig.16 It is an explanatory diagram schematically showing a position adjustment cam in the electrode bonding apparatus according to the second embodiment.

[0051] Fig.17 This is a graph showing the phase change of the follower bearing heights of the three position adjusting cams according to the second embodiment.

[0052] Fig.18 It is a perspective view schematically showing the overall structure of a conventional ultrasonic vibration bonding device.

[0053] Fig.19 It is a perspective view schematically showing the overall structure of the ultrasonic bonding unit. DETAILED DESCRIPTION

[0054] <Implementation Method 1>

[0055] (Overall structure)

[0056] Figure 1 It is a perspective view schematically showing the overall structure of an electrode bonding device 50 which is an ultrasonic vibration bonding device according to Embodiment 1 of the present disclosure. Figure 2 to Figure 7 It will be Figure 1 1 is an explanatory diagram showing the electrode bonding device 50 viewed from various directions. Figure 1 to Figure 7 An XYZ orthogonal coordinate system is depicted in each.

[0057] Figure 2 2 is an explanatory diagram schematically showing the structure of the electrode bonding device 50 as viewed from the front (−Y direction side). Figure 3 It is an explanatory diagram schematically showing the structure of the electrode bonding apparatus 50 as viewed from the right side (+X direction side). Figure 4 1 is an explanatory diagram schematically showing the structure of the electrode bonding device 50 as viewed from the back side (+Y direction side). Figure 5 It is an explanatory diagram schematically showing the structure of the electrode bonding apparatus 50 as viewed from above (+Z direction side). Figure 6 2 is an explanatory diagram schematically showing the structure of the electrode bonding device 50 as viewed from the left side (−X direction side). Figure 7 Schematically shows the structure of the electrode bonding device 50 when viewed from the right. Figure 7 Some components are intentionally omitted in the illustration.

[0058] As shown in these figures, the electrode bonding apparatus 50 of the first embodiment includes three ultrasonic bonding units 1 as a plurality of ultrasonic bonding units. Three brackets 6 are provided corresponding to the three ultrasonic bonding units 1, and the three ultrasonic bonding units 1 are attached to the corresponding brackets 6, respectively.

[0059] The three ultrasonic bonding units 1 as a plurality of ultrasonic bonding units are respectively as follows Fig.19 As shown, the ultrasonic bonding horn 8 and a converter 9 are provided, and an ultrasonic bonding portion 81 is provided below the front end portion of the ultrasonic bonding horn 8 .

[0060] The three ultrasonic joining units 1 can perform an ultrasonic vibration operation of applying ultrasonic vibration from the ultrasonic joining section 81 to an application portion of the joining object by transmitting ultrasonic vibration to the ultrasonic joining section 81 via the ultrasonic joining horns 8 .

[0061] Three pressurizing cylinders 33 are provided, which are arranged corresponding to the three ultrasonic bonding units 1, and perform pressurizing operations on the corresponding ultrasonic bonding units 1 among the three ultrasonic bonding units 1. The three pressurizing cylinders 33 as a plurality of pressurizing mechanisms are mounted on the mounting surface having the XZ plane of the pressurizing cylinder mounting stand 43. The pressurizing cylinder mounting stand 43 is fixed on the mounting surface 20F of the lifting frame 20, and the mounting surface of the pressurizing cylinder mounting stand 43 exists above the mounting surface 20F. Therefore, the three pressurizing cylinders 33 as a plurality of pressurizing mechanisms are fixedly installed above the mounting surface 20F.

[0062] The three pressurizing cylinders 33 as the plurality of pressurizing mechanisms, the three ultrasonic bonding units 1 as the plurality of ultrasonic bonding units, and the three brackets 6 as the plurality of brackets 6 correspond to each other on a one-to-one basis.

[0063] The pressurizing cylinder 33 performs a pressurizing operation between the corresponding pressurizing cylinder 33 , the ultrasonic bonding unit 1 , and the bracket 6 to pressurize the ultrasonic bonding portion 81 of the ultrasonic bonding horn 8 of the ultrasonic bonding unit 1 downward (in the −Z direction) via the bracket 6 .

[0064] Next, the lifting cylinder 39 and four lifting guide posts 42 constituting the lifting mechanism are described. The lifting cylinder 39 is provided at the center of the surface of the traveling frame 41 as the base of the lifting mechanism, and four lifting guide posts 42 are provided on the surface of the traveling frame 41 at discrete intervals around the lifting cylinder 39.

[0065] Figure 8 1 is a perspective view schematically showing the overall structure of the lift cylinder 39. In this figure, an XYZ orthogonal coordinate system is drawn.

[0066] The lifting cylinder 39 has a plate 391 at the top. The plate 391 has a rectangular shape when viewed in the XY plane, and a piston rod 392 is connected to the bottom surface of the plate 391.

[0067] Therefore, the lifting cylinder 39 can lift the plate 391 by extending and retracting the piston rod 392. For example, in the figure, by extending the piston rod 392, it is possible to move from the plate 391 indicated by the dotted line to the plate 391 indicated by the solid line along the ascending direction D39 as the +Z direction.

[0068] The extension and retraction operation of the piston rod 392 is performed by injecting air A39 into the main body 390 serving as a compressed air port.

[0069] The lifting cylinder 39 supports the lower surface of the lifting frame 20 through the plate 391, and the four lifting guide posts 42 move up and down in conjunction with the height of the plate 391. Therefore, the lifting frame 20 can be lifted and lowered by the extension and retraction of the piston rod 392.

[0070] In this way, the lifting mechanism including the lifting cylinder 39 and the four lifting guide columns 42 as main components is arranged below the ultrasonic bonding execution group including the three ultrasonic bonding units 1, the three pressurizing cylinders 33 and the position adjustment mechanism described later. By executing the above-mentioned frame lifting action, the lifting action of the ultrasonic bonding execution group can be performed.

[0071] The lifting frame 20 has a lower surface that is a flat quadrilateral shape when viewed in the XY plane and an upper surface that is a U-shape when viewed in the XY plane. Figure 5 As shown, the placement surface 20F as the U-shaped upper surface has an opening region 200. That is, the placement surface 20F is in a U-shape with the −Y direction upward when viewed in the XY plane, and the opening portion of the U is the opening region 200.

[0072] In the lifting frame 20, the cam rotating shaft 26, three position adjustment cams 37, and three position adjustment driven bearings 38 are accommodated in the accommodation space S20 between the mounting surface 20F and the lower surface. The three position adjustment cams 37 as a plurality of position adjustment cams correspond one to one to the three ultrasonic bonding units 1. In addition, the accommodation space S20 is a space surrounded by the mounting surface 20F, the lower surface, the side surface 20P described later, etc. of the lifting frame 20.

[0073] The rotation drive device 34 and a swing support bearing mechanism 44 as a bracket support mechanism are mounted on the mounting surface 20F of the lifting frame 20 .

[0074] like Figure 1 , Figure 3 and Figure 6As shown, the rotation drive device 34 is fixedly installed on the mounting surface 20F, and performs a rotation drive operation of rotationally driving the driving pulley 35 via the driving rotating shaft 25. The driving pulley 35 is mounted on the front end of the driving rotating shaft 25, and is installed at a position higher than the mounting surface 20F and at a position slightly protruding from the side surface 20P on the +X direction side of the lifting frame 20 when viewed in the XY plane.

[0075] On the other hand, the cam rotating shaft 26 provided in the storage space S20 of the lifting frame 20 protrudes from the side surface 20P of the lifting frame 20, and the driven pulley 36 is installed at the front end of the cam rotating shaft 26 protruding from the side surface 20P. That is, the driven pulley 36 is connected to the cam rotating shaft 26 outside the lifting frame 20.

[0076] like Figure 2 and Figure 3 As shown in FIG. 1 , a timing belt 46 as a power transmission belt is installed between the driving pulley 35 and the driven pulley 36. Therefore, the rotational driving force of the driven pulley 36 is transmitted to the driven pulley 36 via the timing belt 46. That is, by interposing the timing belt 46 as a power transmission belt, the driven pulley 36 can rotate in conjunction with the rotation of the driving pulley 35. As the driven pulley 36 rotates, the cam rotating shaft 26 also rotates.

[0077] In this way, the cam rotating shaft 26 can be rotated via the timing belt 46 and the driven pulley 36 by the rotational driving operation of the driving pulley 35 by the rotational driving device 34 .

[0078] Hereinafter, the assembly including the above-mentioned rotation drive device 34, the driving pulley 35, the timing belt 46 and the driven pulley 36 is defined as a "rotation drive component group". The rotation drive component group is an assembly of components for rotationally driving the cam rotating shaft 26. In addition, the position adjustment mechanism described in detail later also includes the above-mentioned rotation drive component group in addition to the cam rotating shaft 26 and the three position adjustment cams 37.

[0079] Next, the swing support bearing mechanism 44 and the three brackets 6 are described. The swing support bearing mechanism 44 as a bracket support mechanism has a pair of support members 441 at both ends. The pair of support members 441 is fixed to the mounting surface 20F and is installed in a state where the unit shaft 24 is fixed between the pair of support members 441, 441.

[0080] The three ultrasonic bonding units 1 are respectively attached to corresponding brackets 6 among the three brackets 6. Hereinafter, the ultrasonic bonding unit 1 and the bracket 6 in a corresponding relationship as one unit will be described as a representative.

[0081] Fig. 92 is a perspective view schematically showing the overall structure of the bracket 6. Fig. 9 As shown in the figure, the bracket 6 includes an upper surface member 61, a pair of side members 62, a lower surface member 63, a bearing fixing member 64, and a rotating shaft holding member 65 as main components.

[0082] A pair of side members 62, 62 are provided on one end side (-Y direction side) of the upper surface of the lower surface member 63 as the unit installation member. The pair of side members 62, 62 are inclined toward the -Y direction side along the height direction (+Z direction) and are formed into a parallelogram shape in plan view in the YZ plane.

[0083] The upper surface member 61 is fixed to the upper portions of the pair of side surface members 62, 62. Therefore, the upper surface member 61 is arranged to protrude to the -Y direction side from the lower surface member 63 in plan view in the XY plane.

[0084] The rotation axis holding member 65 is provided on the other end side (+Y direction side) of the upper surface of the lower surface member 63. The rotation axis holding member 65 has a through hole 650 in the center of the upper portion.

[0085] A bearing fixing member 64 is provided at the center of the lower surface of the lower surface member 63 as the unit installation member. The bearing fixing member 64 is formed in an inverted triangle shape with the bottom as the vertex when viewed in the YZ plane. A through hole 640 is provided at the center near the vertex of the bearing fixing member 64.

[0086] like Figure 3 , Figure 6 and Figure 7 As shown, the ultrasonic bonding unit 1 is fixed to the lower surface part 63 of the bracket 6. As a method of mounting the lower surface part 63 of the ultrasonic bonding unit 1, screw fastening or the like can be considered. In this way, the three brackets 6 as a plurality of brackets respectively fix the corresponding ultrasonic bonding units 1 among the three ultrasonic bonding units 1 to the lower surface part 63 as the unit setting part.

[0087] In addition, if Figure 1 and Figure 7 As shown, the three ultrasonic bonding units 1 are arranged above the mounting surface 20F of the lifting frame 20. In addition, the ultrasonic bonding portion 81 of the ultrasonic bonding unit 1 mounted on the lower surface member 63 of the bracket 6 is located below the front end portion on the -Y direction side of the upper surface member 61. That is, the ultrasonic bonding portion 81 of the three ultrasonic bonding units 1 is arranged on one end side (-Y direction side) of the three brackets 6.

[0088] like Figure 7As shown, the unit shaft 24 is inserted into the through hole 650 of the rotating shaft holding member 65, and the bracket 6 is swingably mounted on the unit shaft 24. That is, a bearing not shown is assembled between the through hole 650 and the unit shaft 24. In this way, the swing support bearing mechanism 44 as a bracket support mechanism is provided on the mounting surface 20F of the lifting frame 20, and the three brackets 6 are rotatably supported with the unit shaft 24 fixed to the other end side (+Y direction side) of the three brackets 6 as the rotation center.

[0089] Therefore, the bracket 6 and the ultrasonic bonding unit 1 attached to the bracket 6 can rotate and move about the unit shaft 24 as the rotation center.

[0090] In addition, if Figure 5 As shown, when viewed in plan view in the XY plane, the three brackets 6 and most of the unit shaft 24 are arranged in the opening area 200, so the rotation movement of the bracket 6 around the unit shaft 24 as the rotation center is not hindered.

[0091] Next, the three pressurizing cylinders 33 are described. Figure 1 to Figure 3 , Figure 6 and Figure 7 As shown, a floating joint 32 is connected to the front end of the piston rod 332 of each pressurizing air cylinder 33, and the floating joint 32 is fixed to the upper surface member 61 of the bracket 6. Therefore, the pressurizing air cylinder 33 can apply pressure to the ultrasonic bonding portion 81 of the ultrasonic bonding horn 8 of the ultrasonic bonding unit 1 via the floating joint 32 and the bracket 6.

[0092] In this way, the three pressurizing air cylinders 33 as the plurality of pressurizing mechanisms are provided corresponding to the three ultrasonic bonding units 1 , and can perform pressurizing operations on the corresponding ultrasonic bonding units 1 among the three ultrasonic bonding units 1 .

[0093] (Position adjustment mechanism)

[0094] In addition to the above-mentioned rotation drive component group, cam rotating shaft 26 and three position adjustment cams 37, the position adjustment mechanism of the first embodiment is composed of three position adjustment driven bearings 38, three brackets 6 and a swing support bearing mechanism 44 as components.

[0095] Since all components of the above-mentioned position adjustment mechanism are arranged on the loading surface 20F of the lifting frame 20 or in the storage space S20, the lifting mechanism including the lifting cylinder 39 and four lifting guide columns 42 arranged below the lower surface of the lifting frame 20 is located below the position adjustment mechanism.

[0096] like Figure 2 and Figure 4As shown, the three position adjustment cams 37, the three position adjustment driven bearings 38, the three ultrasonic bonding units 1, and the three brackets 6 correspond to each other one by one.

[0097] Figure 10 to Figure 13 Each of them is an explanatory diagram showing the operating principle of the position adjustment mechanism. Fig.10 and Fig.12 They are diagrams showing details of the relationship between the position adjustment cam 37 and the position adjustment driven bearing 38, Fig.11 and Fig.13 They are diagrams showing the position adjustment action. Figure 11 to Figure 13 The XYZ orthogonal coordinate systems are depicted in FIG.

[0098] Hereinafter, among the three position-adjusting cams 37 , the three position-adjusting driven bearings 38 , and the three brackets 6 , one unit of the position-adjusting cams 37 , the position-adjusting driven bearings 38 , and the bracket 6 in a corresponding relationship with each other will be described as a representative.

[0099] The position adjustment driven bearing 38 that functions as a cam follower is fixed to the bearing fixing member 64 of the bracket 6 by a nut 381 and a grease nipple 382. That is, the position adjustment driven bearing 38, the nut 381 and the grease nipple 382 are integrally formed. In addition, the grease nipple 382 is threadedly fastened to the end face of one end side of the shaft (hereinafter referred to as "rotation support shaft") that supports the position adjustment driven bearing 38 rotatably. A thread is formed on the other end side of the rotation support shaft, which functions as a bolt portion. The rotation support shaft including the bolt portion is arranged in a form that penetrates the through-hole 640 of the bearing fixing member 64 and the through-hole of the position adjustment driven bearing 38.

[0100] In this way, corresponding position-adjusting driven bearings 38 among the three position-adjusting driven bearings 38 are fixed to the bearing fixing members 64 under the lower surface members 63 of the three brackets 6 .

[0101] like Fig.12 As shown, the position adjustment cam 37 has a deformed structure including a convex portion 371, a concave portion 370, and an intermediate portion 372 when viewed in a plan view in the YZ plane. A total of four concave portions 370, convex portions 371, and intermediate portions 372 are formed at 90° intervals. With respect to the rotation center C37 of the position adjustment cam 37, the deepest portion of the concave portion 370 is located at the closest position, the top of the convex portion 371 is located at the farthest position, and the intermediate portion 372 is located at the intermediate position between the concave portion 370 and the convex portion 371.

[0102] like Fig.12 and Fig.13As shown in (b), when the deepest part of the recess 370 is located in the +Z direction, the position adjustment driven bearing 38 is at the lowest position. This is because the position adjustment driven bearing 38 is supported by the entire recess 370 including the deepest part. Fig.13 The state shown in (b) becomes the engageable state S1.

[0103] On the other hand, Fig.13 As shown in (a), when the top of the convex portion 371 is located in the +Z direction, the position adjustment driven bearing 38 is at the highest position. This is because the position adjustment driven bearing 38 is supported by the top of the convex portion 371. Fig.13 The state shown in (a) is included in the engagement preparation state S0.

[0104] Thus, the three position-adjusting driven bearings 38 change their height positions in conjunction with the postures of the corresponding position-adjusting cams 37. The difference between the highest height and the lowest height of the position-adjusting driven bearings 38 is set to about 4 mm.

[0105] As mentioned above, Fig.13 The state shown in (b) is defined as the "engageable state S1", and the state other than the engageable state S1 is defined as the "engagement preparation state S0". Fig.13 The state shown in (a) becomes the engagement preparation state S0.

[0106] Furthermore, as the postures of the position adjusting cam 37 with respect to the cam rotating shaft 26 , the following first to third postures are defined.

[0107] First posture: a posture when the deepest portion of the concave portion 370 is located in the +Z direction

[0108] Second posture: a posture when the top of the convex portion 371 is located in the +Z direction

[0109] Third posture: posture when the middle portion 372 is located in the +Z direction

[0110] Therefore, in the engageable state S1 , the position adjusting cam 37 is in the first posture, and in the engageable state S0 , the position adjusting cam 37 is in the second posture or the third posture.

[0111] like Fig.13 As shown in (b) of FIG. 1 , in the engageable state S1 , since the position adjusting cam 37 is in the first posture, the formation height of the position adjusting driven bearing 38 is the minimum height, which is slightly lower than that in the engagement preparation state S0 .

[0112] In the electrode bonding device 50 of the first embodiment, as Fig.13 As shown in (b), in the bondable state S1, the absolute horizontal line LH parallel to the Y direction is set to coincide with the center line CL of the ultrasonic bonding unit 1. That is, in the bondable state S1, the ultrasonic bonding unit 1 is configured horizontally, and the center line CL is set to coincide with the Y direction. Specifically, the flatness of the XY plane of the ultrasonic bonding portion 81 of the ultrasonic bonding unit 1 is adjusted to be less than 10 μm.

[0113] Furthermore, in the electrode bonding apparatus 50 of the first embodiment, the ultrasonic bonding section 81 is set not to be in contact with the bonding object in the bonding preparation state S0 , and is set to be in contact with the bonding object only in the bondable state S1 .

[0114] Therefore, by rotating the position adjustment cam 37 by the rotation drive member group, the engagement preparation state S0 and the engageable state S1 are repeatedly established, and the position adjustment operation by the position adjustment mechanism can be performed.

[0115] The following describes the details of the position adjustment operation. First, the operation of changing from the engageable state S1 to the engagement preparation state S0 is described. Fig.13 As shown in (a), in the engagement preparation state S0, since the position adjustment cam 37 is in the second posture or the third posture, the formation height of the position adjustment driven bearing 38 is slightly higher than that in the engageable state S1.

[0116] On the other hand, the rotating shaft holding member 65 of the bracket 6 is mounted on the swing support bearing mechanism 44 so as to be rotatable about the unit shaft 24 as the rotation center. Therefore, the bracket 6 and the ultrasonic bonding unit 1 mounted on the bracket 6 are linked to the rise of the position adjustment driven bearing 38 and perform a rotation movement about the unit shaft 24 as the rotation center.

[0117] As described above, due to the rotational movement of the ultrasonic bonding unit 1 in conjunction with the elevation of the position adjusting driven bearing 38 , the height of one end side (−Y direction side) of the ultrasonic bonding unit 1 slightly rises from the bonding possible state S1 .

[0118] As a result, since the end of one end side (-Y direction side) of the ultrasonic bonding unit 1 rises along the unit vertical movement direction D1 (+Z direction), the end of the center line CL of the ultrasonic bonding unit 1 rises. Fig.13 As shown in (a), the absolute horizontal line LH is inconsistent with the center line CL of the ultrasonic bonding unit 1. Thus, in the bonding preparation state S0, the ultrasonic bonding portion 81 side of the ultrasonic bonding unit 1 is slightly higher than the converter 9 side, and the center line CL has an inclination toward the -Y direction and the height in the +Z direction increases.

[0119] In the above-mentioned joining preparation state S0, the ultrasonic joining portion 81 of the ultrasonic joining unit 1 is set to have no contact relationship with the joining object.

[0120] Next, the operation of changing from the engagement preparation state S0 to the engagement ready state S1 will be described. Fig.13 As shown in (b) of FIG. 1 , in the engageable state S1 , since the position adjusting cam 37 is in the first posture, the formation height of the position adjusting driven bearing 38 is the minimum height, which is slightly lower than that in the engagement preparation state S0 .

[0121] Therefore, due to the rotational movement of the bracket 6 and the ultrasonic bonding unit 1 in conjunction with the lowering of the position adjustment driven bearing 38 , the height of one end of the ultrasonic bonding unit 1 is slightly lowered from the bonding preparation state S0 .

[0122] As a result, the end of one end side (-Y direction side) of the ultrasonic bonding unit 1 drops down, so the end of the center line CL of the ultrasonic bonding unit 1 drops down. Fig.13 As shown in (b) , the absolute horizontal line LH coincides with the center line CL of the ultrasonic bonding unit 1 .

[0123] In the above-mentioned bondable state S1, the ultrasonic bonding portion 81 of the ultrasonic bonding unit 1 is set to be in contact with the bonding object.

[0124] In this way, the position adjustment mechanism can repeatedly perform the position adjustment operation of setting the engagement preparation state S0 and the engageable state S1 by rotating the cam rotating shaft 26 with the rotation drive member group to perform the rotation operation of the three position adjustment cams 37 as a plurality of position adjustment cams.

[0125] That is, the position adjustment mechanism of the electrode bonding apparatus 50 according to the first embodiment can perform a position adjustment operation for adjusting the position in the height direction of the ultrasonic bonding portion 81 of each of the three ultrasonic bonding units 1 .

[0126] The position adjustment mechanism of the electrode bonding device 50 of the first embodiment includes three position adjustment cams 37 arranged below the three ultrasonic bonding units 1 and corresponding to the three ultrasonic bonding units 1. In addition, the position adjustment action performed by the position adjustment mechanism includes the rotation action of the three position adjustment cams 37, and the height direction position of the ultrasonic bonding portion 81 of the corresponding ultrasonic bonding unit 1 among the three ultrasonic bonding units 1 can be determined according to the respective postures (first to third postures) of the plurality of position adjustment cams.

[0127] like Figure 1As shown, in the electrode bonding apparatus 50 according to the first embodiment, the three position adjusting cams 37 of the plurality of position adjusting cams 37 are set to have the same posture relative to the cam rotating shaft 26 .

[0128] That is, the three position adjusting cams 37 simultaneously take any of the first posture, the second posture, and the third posture.

[0129] (Control Department)

[0130] Fig.14 It indicates schematically Figures 1 to 13 FIG. 1 is a block diagram of a control system of the electrode bonding device 50 according to the first embodiment. Fig.14 As shown, the control unit 15 performs control actions for controlling the driving of each of the lifting cylinder 39, the three pressurizing cylinders 33, the three ultrasonic bonding units 1, and the rotation drive device 34. That is, the control actions performed by the control unit 15 include execution control of the lifting action performed by the lifting cylinder 39, the pressurizing action performed by the three pressurizing cylinders 33, the ultrasonic vibration action performed by the three ultrasonic bonding units 1, and the rotation drive action performed by the rotation drive device 34.

[0131] The control unit 15 also controls the movement of the traveling frame 41 by a moving mechanism (not shown), but since the relevance to the features of the first embodiment is low, the control unit 15 controls the movement of the traveling frame 41 by a moving mechanism (not shown). Fig.14 Illustration omitted.

[0132] As described above, each ultrasonic bonding unit 1 performs the ultrasonic vibration operation of applying ultrasonic vibration to the ultrasonic bonding portion 81 via the ultrasonic bonding horn 8 .

[0133] The control unit 15 controls the lifting and lowering of the lifting cylinder 39 to raise the plate 391 to the highest position. Since the lifting frame 20 is mounted on the plate 391, the ultrasonic bonding execution group including the above-mentioned position adjustment mechanism, the three pressurizing cylinders 33 and the three ultrasonic bonding units 1 can be raised together in conjunction with the lifting of the lifting frame 20.

[0134] This is because the three pressurizing cylinders 33 , the three ultrasonic bonding units 1 , the three position adjustment cams 37 , and the position adjustment mechanism are provided on the mounting surface 20F and in the storage space S20 so as to be movable together with the lifting frame 20 .

[0135] In this way, the control unit 15 can perform a pre-joining process for joining the objects to be joined by the ultrasonic vibration operation of the ultrasonic joining unit 1 by causing the lifting mechanism including the lifting cylinder 39 to perform a lifting operation. The pre-joining process is a process for placing the three ultrasonic joining units 1 at respective joining preparation positions near the application portion of the ultrasonic joining section 81 to the objects to be joined.

[0136] Since each ultrasonic bonding unit 1 is connected to the corresponding pressurizing cylinder 33 via the piston rod 332 , the pressing force from the pressurizing cylinder 33 becomes the pressurizing force applied to the ultrasonic bonding portion 81 of the ultrasonic bonding unit 1 via the bracket 6 .

[0137] Therefore, the control unit 15 can apply a pressurizing force to the ultrasonic bonding portions 81 of the three ultrasonic bonding units 1 by controlling the pressurizing operations of the three pressurizing air cylinders 33 .

[0138] Furthermore, the control unit 15 controls the execution of the ultrasonic vibration operation of the three ultrasonic bonding units 1. In addition, the control unit 15 can control the execution of the position adjustment operation by the position adjustment mechanism by controlling the rotational drive operation of the rotational drive device 34.

[0139] The electrode bonding apparatus 50 of the first embodiment having such a configuration can execute the ultrasonic bonding process consisting of the following steps ST11 to ST14 under the control of the control unit 15. That is, the control unit 15 executes the control operation consisting of steps ST11 to ST14.

[0140] Step ST11: The lifting and lowering action of the lifting mechanism including the lifting cylinder 39 is controlled to perform the lifting and lowering action of the ultrasonic bonding execution group by the lifting and lowering mechanism, and the ultrasonic bonding parts 81 of the three ultrasonic bonding units 1 are arranged at the bonding preparation position above the three application parts of the bonding object. At this time, the ultrasonic bonding parts 81 of the three ultrasonic bonding units 1 are in the above-mentioned bonding preparation state S0.

[0141] That is, by executing step ST11, it is possible to perform a pre-joining process of arranging the ultrasonic joining portions 81 of each of the three ultrasonic joining units 1 at a joining preparation position close to the objects to be joined.

[0142] Step ST12: The three pressurizing air cylinders 33 are respectively caused to perform pressurizing operation with the pressurizing pushing force. The processing of step ST12 is subsequently continuously performed during the operations of step ST13 and step ST14.

[0143] Step ST13: The rotational drive operation of the rotational drive device 34 is controlled to rotate the three position adjustment cams 37, and all the three position adjustment cams 37 are set to the first posture, so that the ultrasonic bonding part 81 contacts the bonding object and sets the bonding state S1.

[0144] In addition, the presence or absence of the engageable state S1 can be detected, for example, by determining by the control unit 15 whether the position adjustment cam 37 has reached the first posture based on the rotation angle of the cam rotation shaft 26 from the initial position. In addition, by providing the three pressurizing cylinders 33 with an existing detection function for detecting the presence or absence of contact between the ultrasonic joining portion 81 and the joining object, the presence or absence of the engageable state S1 can be monitored.

[0145] Step ST14: The three ultrasonic bonding units 1 are respectively made to perform ultrasonic vibration operations. At this time, the execution time of the ultrasonic vibration operations of the three ultrasonic bonding units 1 is the same. This is because, in the electrode bonding device 50 of the first embodiment, the postures of the three position adjustment cams 37 relative to the cam rotation shaft 26 are set to be the same. On the other hand, when the postures of the position adjustment cams 37 relative to the cam rotation shaft 26 are different as in the electrode bonding device 50B of the second embodiment described later, a time difference occurs in the ultrasonic vibration operations of the three ultrasonic bonding units 1.

[0146] In addition, in theory, it is also possible to perform a change such that the execution of step ST12 is omitted and the processing of step ST12 is simultaneously executed when step ST14 is executed.

[0147] (Effect)

[0148] The electrode bonding device 50 as the first embodiment of the ultrasonic vibration bonding device disclosed herein has a lifting mechanism including a lifting cylinder 39 for performing lifting and lowering operations on an ultrasonic bonding execution group including three ultrasonic bonding units 1, three pressurizing cylinders 33 and a position adjustment mechanism.

[0149] Therefore, by making the lifting mechanism perform lifting action under the control of the control unit 15, the lifting action of the three ultrasonic bonding units 1 as a plurality of ultrasonic bonding units can be performed together, and the three ultrasonic bonding units can be arranged in the bonding preparation position close to the bonding object before bonding.

[0150] After the above-mentioned pre-joining treatment, the electrode joining device 50 of embodiment 1 can, under the control of the control unit 15, cause the three pressurizing cylinders 33 serving as multiple pressurizing mechanisms to perform a pressurizing action in step ST12, cause the position adjustment mechanism to perform a position adjustment action in step ST13, and then cause the three ultrasonic joining units 1 to perform an ultrasonic vibration action in step ST14.

[0151] As a result, by executing the above steps ST11 to ST14 once, the ultrasonic bonding process can be performed by three application parts of the bonding object. Fig.19 In the case of the electrode member 91 shown, the ultrasonic bonding process for bonding the electrode member 91 to the substrate 90 can be performed at three application portions (bonding locations) of the electrode member 91 .

[0152] Since the lifting cylinder 39 is disposed below the ultrasonic bonding execution group, the electrode bonding apparatus 50 according to the first embodiment can achieve a simplified and miniaturized apparatus structure by utilizing the relatively spare space below the ultrasonic bonding execution group.

[0153] Fig.15 This is an explanatory diagram for comparing the dimensions of the electrode bonding apparatus 50 according to the first embodiment and the conventional electrode bonding apparatus 70. The numerical values ​​in parentheses shown in this diagram are dimension values, and the unit is mm (millimeter).

[0154] As shown in the figure, the conventional electrode bonding device 70 needs to be equipped with three pressurizing slides 77, three pressurizing cylinders 74, a lifting frame 73, a ball screw 72 and a lifting AC servo motor 71 above the ultrasonic bonding unit 1, so the device height is

[990] (mm).

[0155] On the other hand, in the electrode bonding apparatus 50 of the first embodiment, it is sufficient to provide only the pressurizing cylinder 33 and the like above the ultrasonic bonding unit 1, and the lifting cylinder 39, which is the main component of the lifting mechanism, is provided below the ultrasonic bonding unit 1. Therefore, the apparatus height of the electrode bonding apparatus 50 can be suppressed to

[460] (mm).

[0156] In addition, the electrode bonding apparatus 70 and the electrode bonding apparatus 50 both have an apparatus width along the X direction of

[500] (mm), and an apparatus depth along the Y direction of

[530] (mm).

[0157] Thus, the overall volume of the electrode bonding apparatus 50 according to the first embodiment can be reduced to less than half that of the conventional electrode bonding apparatus 70 .

[0158] In addition, the main component of the lifting mechanism of the electrode bonding device 50 is only the lifting cylinder 39, while the electrode bonding device 70 requires a lifting frame 73, a ball screw 72, and a lifting AC servo motor 71 as a lifting mechanism. Furthermore, the lifting mechanism needs to be arranged above the pressurizing cylinder 74. In this way, the electrode bonding device 50 of the first embodiment can achieve a simpler device structure than the conventional electrode bonding device 70.

[0159] In the electrode bonding apparatus 50 of the first embodiment, the three ultrasonic bonding units 1 are arranged above the mounting surface 20F of the lifting frame 20 in a state where the three ultrasonic bonding units 1 are fixed to the lower surface member 63 as the unit mounting member of the three brackets 6 .

[0160] Therefore, the user of the electrode bonding apparatus 50 can access the three ultrasonic bonding units 1 from above and can relatively easily perform operations such as attachment and detachment on the three ultrasonic bonding units 1 .

[0161] In addition, since the lifting mechanism is mainly composed of a lifting cylinder 39 and four lifting guide columns 42 that support the lifting frame 20 from below and lift the lifting frame 20 to perform the lifting action of the ultrasonic bonding execution group, the volume of the space below the lifting frame 20 can be suppressed to the required minimum.

[0162] The position adjustment mechanism of the electrode bonding apparatus 50 according to the first embodiment can rotate three position adjustment cams 37 as a plurality of position adjustment cams simultaneously by rotating one cam rotation shaft 26 , so that the position adjustment operation of each of the three ultrasonic bonding units 1 can be performed relatively easily.

[0163] The electrode bonding device 50 of embodiment 1 is capable of suppressing the volume of the storage space S20 of the lifting frame 20 to the minimum required limit by setting a rotation drive device 34 on the loading surface 20F of the lifting frame 20 to rotate the driving pulley 35, and rotating the cam rotating shaft 26 set in the storage space S20 by rotating the driven pulley 36.

[0164] In the electrode bonding apparatus 50 of the first embodiment, the three position-adjusting driven bearings 38 are linked to the posture of the corresponding position-adjusting cams 37 among the three position-adjusting cams 37, and the position in the height direction changes. In addition, the corresponding bracket 6 and the ultrasonic bonding unit 1 are linked to the change in the height direction position of the position-adjusting driven bearings 38, and perform a rotational movement operation with the unit shaft 24 as the rotation center.

[0165] Therefore, the position adjustment mechanism of the electrode bonding device 50 of embodiment 1 can accurately set the height direction position of the ultrasonic bonding part 81 of each of the three ultrasonic bonding units 1 by performing a position adjustment action including the rotation action of the three position adjustment cams 37 and the rotational movement action of the above-mentioned bracket 6 and the ultrasonic bonding unit 1.

[0166] <Implementation Method 2>

[0167] Fig.16 FIG. 2 is an explanatory diagram schematically showing the structure of three position adjustment cams 37 of an electrode bonding apparatus 50B according to the second embodiment. Fig.16 The XYZ orthogonal coordinate system is depicted in FIG. The overall structure of the electrode bonding apparatus 50B is similar to the following except for the posture of the three position adjustment cams 37 relative to the cam rotation shaft 26. Figure 1 to Figure 14 The electrode bonding device 50 of the first embodiment shown in FIG. 1 is the same. Fig.14 ) in which control unit 15B is used instead of control unit 15.

[0168] Below, refer to Fig.16 The characteristic parts of the electrode bonding device 50B of the second embodiment are described. Hereinafter, for the convenience of description, the three position adjustment cams 37 are classified as position adjustment cams 37a to 37c from the left side (-X direction side) in the figure toward the right side (+X direction side) in the figure. Similarly, the three position adjustment driven bearings 38 are classified as position adjustment driven bearings 38a to 38c, the three ultrasonic bonding units 1 are classified as ultrasonic bonding units 1a to 1c, and the three ultrasonic bonding parts 81 are classified as ultrasonic bonding parts 81a to 81c.

[0169] Therefore, the position adjustment cam 37a, the position adjustment driven bearing 38a, the ultrasonic joining unit 1a and the ultrasonic joining part 81a correspond to each other, the position adjustment cam 37b, the position adjustment driven bearing 38b, the ultrasonic joining unit 1b and the ultrasonic joining part 81b correspond to each other, and the position adjustment cam 37c, the position adjustment driven bearing 38c, the ultrasonic joining unit 1c and the ultrasonic joining part 81c correspond to each other.

[0170] like Fig.16 As shown in FIG. 1 , the position adjusting cams 37 a to 37 c as the plurality of position adjusting cams 37 are set to different postures with respect to the cam rotating shaft 26 .

[0171] exist Fig.16 In the illustrated structure, the position-adjusting cam 37 a is in the second posture, the position-adjusting cam 37 b is in the third posture, and the position-adjusting cam 37 c is in the first posture.

[0172] Fig.17 This is a graph showing the phase change of the follower bearing heights of the three position adjusting cams 37 in the electrode bonding apparatus 50B according to the second embodiment. Fig.17 Indicates the phase change of the driven bearing height 17a~17c. Fig.17 The phase (degree) represented by the horizontal axis of is represented in the range of 0 to 360 degrees, with the initial position of the cam rotating shaft 26 being 0 degrees and the angle change caused by the rotation of the cam rotating shaft 26 being represented in the range of 0 to 360 degrees. Fig.17The unit of the driven bearing heights 17a to 17c represented by the vertical axis is mm.

[0173] Hereinafter, the position adjusting cams 37 a to 37 c may be collectively referred to as “position adjusting cams 37 ”, and the driven bearing heights 17 a to 17 c may be collectively referred to as “driven bearing heights 17 ”.

[0174] Fig.17 The heights of the driven bearings 17a to 17c shown are shown Fig.16 The heights of the position adjustment cams 37a to 37c are shown in FIG. That is, the driven bearing heights 17a to 17c correspond to the position adjustment cams 37a to 37c. However, due to Fig.16 It is a schematic diagram, so Fig.16 The posture of the position adjustment cam 37 shown in FIG. Fig.17 The values ​​shown for the output bearing height 17 are not strictly consistent.

[0175] like Fig.17 As shown, the phase difference between the driven bearing heights 17a and 17b is set to be 10 degrees. The phase difference between the driven bearing heights 17b and 17c is set to be 10 degrees. Therefore, the phase difference between the driven bearing heights 17c and 17a is 20 degrees.

[0176] When the position adjusting cam 37 is in the first posture, the driven bearing height 17 is approximately 17.00 mm, when the position adjusting cam 37 is in the second posture, the driven bearing height 17 is approximately 23.00 mm, and when the position adjusting cam 37 is in the third posture, the driven bearing height 17 is a value in between.

[0177] The electrode bonding apparatus 50B of the second embodiment having such a configuration can execute the ultrasonic bonding process consisting of the following steps ST21 to ST24 under the control of the control unit 15B. That is, the control unit 15B of the electrode bonding apparatus 50B of the second embodiment executes the control operation consisting of steps ST21 to ST24.

[0178] Step ST21: Control the lifting action of the lifting mechanism including the lifting cylinder 39, and execute the lifting action of the ultrasonic bonding execution group performed by the lifting mechanism, so that the ultrasonic bonding parts 81a~81c of the ultrasonic bonding units 1a~1c are located above the three application parts of the bonding object.

[0179] That is, by executing step ST21, it is possible to perform a pre-joining process of arranging the ultrasonic joining units 1a to 1c at the joining preparation positions close to the objects to be joined.

[0180] Step ST22: The three pressurizing air cylinders 33 are respectively caused to perform pressurizing operation with the pressurizing pushing force. The processing of step ST22 is subsequently continuously performed during the operations of step ST23 and step ST24.

[0181] Step ST23: The rotation driving action of the rotation driving device 34 is controlled to rotate the position adjusting cams 37a to 37c, and only one of the position adjusting cams 37a to 37c is set to the first posture, so that only one of the ultrasonic bonding parts 81a to 81c contacts the bonding object. At this time, the postures of the other two position adjusting cams 37 are the second posture or the third posture.

[0182] Hereinafter, a case where the position adjusting cam 37 c among the position adjusting cams 37 a to 37 c is set to the first posture and the ultrasonic joining portion 81 c of the ultrasonic joining unit 1 c is brought into contact with the object to be joined will be described as an example.

[0183] Step ST24: Only the ultrasonic joining unit 1c among the ultrasonic joining units 1a to 1c is made to perform ultrasonic vibration operation. That is, the ultrasonic joining unit 81c applies ultrasonic vibration to the applying portion of the joining object. At this time, neither the ultrasonic joining units 1a nor 1b performs ultrasonic vibration operation.

[0184] Alternatively, the execution of step ST22 may be omitted, and when step ST24 is executed, only the pressurizing cylinder 33 corresponding to the ultrasonic bonding unit 1c that performs the ultrasonic vibration operation is selectively caused to perform the pressurizing operation among the three pressurizing cylinders 33 .

[0185] The electrode bonding apparatus 50B according to the second embodiment can perform the ultrasonic bonding process on only one application portion of the bonding target objects by executing the above-mentioned steps ST21 to ST24 once.

[0186] Then, at least steps ST23 and ST24 of the above steps ST21 to ST24 are repeatedly performed. Specifically, the electrode bonding device 50B of the second embodiment, under the control of the control unit 15B, can, for example, only make the ultrasonic bonding unit 1b perform ultrasonic vibration when the second step ST24 is executed, and only make the ultrasonic bonding unit 1a perform ultrasonic vibration when the third step ST24 is executed.

[0187] Therefore, the electrode bonding apparatus 50B according to the second embodiment can perform ultrasonic bonding processing at three different application sections of the bonding objects by the ultrasonic bonding sections 81 a to 81 c by repeating steps ST23 and ST24 three times under the control of the control section 15B.

[0188] The electrode bonding apparatus 50B according to the second embodiment has the same effects as those of the electrode bonding apparatus 50 according to the first embodiment, and also has the following effects unique to the second embodiment.

[0189] Since the position adjusting cams 37a to 37c have different postures with respect to the cam rotating shaft 26, the driven bearing heights 17a to 17c can be set to different heights at the same time during the rotational operation of the position adjusting cams 37a to 37c.

[0190] As a result, the electrode bonding device 50B of embodiment 2 can be set so that the contact timing between the ultrasonic bonding parts 81a~81c and the bonding object does not overlap in time between the ultrasonic bonding units 1a~1c, so that ultrasonic bonding of multiple bonding locations (application parts) of the bonding object can be performed efficiently and with high precision.

[0191] This is because, since only one ultrasonic bonding unit 1 among the ultrasonic bonding units 1a to 1c performs the ultrasonic vibration operation, the ultrasonic fluctuation generated when one of the three ultrasonic vibration operations is performed does not have an adverse effect on the other two ultrasonic vibration operations. Therefore, the electrode bonding device 50B of the second embodiment can perform ultrasonic bonding at three bonding locations (plural bonding locations) of the connection object with high accuracy.

[0192] In addition, the present disclosure can freely combine the various embodiments within the scope of the disclosure, or can appropriately modify or omit the various embodiments.

[0193] For example, the electrode bonding apparatus 50 of the first embodiment sets the postures of the three position adjustment cams 37 relative to the cam rotating shaft 26 to be the same, and the electrode bonding apparatus 50B of the second embodiment sets the postures of the three position adjustment cams 37 relative to the cam rotating shaft 26 to be different. As another form, a modified example in which the postures of two of the three position adjustment cams 37 relative to the cam rotating shaft 26 are set to be the same can also be adopted.

[0194] In the above embodiment, “3” is shown as an example of “the number of the plurality” of the ultrasonic bonding unit 1 , the pressurizing cylinder 33 , the position adjusting cam 37 , etc. However, any number greater than 2 may be used as the number of the plurality.

[0195] Description of symbols

[0196] 1. 1a~1c Ultrasonic bonding unit

[0197] 6 Bracket

[0198] 8 Ultrasonic bonding horn

[0199] 15.15B Control Unit

[0200] 20 Lifting frame

[0201] 24 Unit Shaft

[0202] 25 Driving rotating shaft

[0203] 26 Cam rotating shaft

[0204] 33 Pressurized cylinder

[0205] 34 Rotary drive device

[0206] 35 Drive pulley

[0207] 36 Driven pulley

[0208] 37, 37a~37c Cam for position adjustment

[0209] 38, 38a~38c Follower bearing for position adjustment

[0210] 39 Lifting Cylinder

[0211] 42 Lifting guide column

[0212] 44 Swing support bearing mechanism

[0213] 46 Timing belt

[0214] 50, 50B, 70 Electrode bonding device

[0215] 63 Lower surface parts

[0216] 81, 81a~81c Ultrasonic bonding part

[0217] S20 Containment Space

Claims

1. An ultrasonic vibration bonding device, characterized in that: A plurality of ultrasonic bonding units are provided for respectively performing ultrasonic vibration operations, wherein the ultrasonic vibration operations are performed by applying ultrasonic vibrations from the ultrasonic bonding portion; The ultrasonic vibration bonding device also includes: A plurality of pressurizing mechanisms are provided corresponding to the plurality of ultrasonic bonding units, and respectively perform pressurizing actions on corresponding ultrasonic bonding units among the plurality of ultrasonic bonding units; A position adjustment mechanism for performing a position adjustment operation for adjusting the height direction position of the ultrasonic bonding portion of each of the plurality of ultrasonic bonding units; A lifting mechanism is disposed below the ultrasonic bonding execution group including the plurality of ultrasonic bonding units, the plurality of pressurizing mechanisms, and the position adjustment mechanism, and performs a lifting action on the ultrasonic bonding execution group; and a control unit that performs a control operation for controlling the ultrasonic vibration operation performed by the plurality of ultrasonic bonding units, the pressurizing operation performed by the plurality of pressurizing mechanisms, the position adjustment operation performed by the position adjustment mechanism, and the lifting and lowering operation performed by the lifting and lowering mechanism; The above-mentioned position adjustment mechanism includes a plurality of position adjustment cams corresponding to the above-mentioned plurality of ultrasonic bonding units, and the above-mentioned plurality of position adjustment cams are arranged below the above-mentioned plurality of ultrasonic bonding units. The above-mentioned position adjustment action includes a rotation action of the above-mentioned plurality of position adjustment cams, and the height direction position of the above-mentioned ultrasonic bonding part of the corresponding ultrasonic bonding unit among the above-mentioned plurality of ultrasonic bonding units is determined according to the respective postures of the above-mentioned plurality of position adjustment cams.

2. The ultrasonic vibration bonding device according to claim 1, wherein: It also includes a lifting frame having a loading surface, the plurality of pressurizing mechanisms are fixedly arranged above the loading surface, and the plurality of ultrasonic bonding units are arranged above the loading surface; The lifting frame has a receiving space for receiving the plurality of position adjustment cams; The lifting mechanism includes a lifting cylinder that supports the lifting frame from below and lifts the lifting frame to perform the lifting action on the ultrasonic bonding execution group; The plurality of pressurizing mechanisms, the plurality of ultrasonic bonding units, and the plurality of position adjustment cams are provided so as to be movable together with the lifting frame.

3. The ultrasonic vibration bonding device according to claim 2, characterized in that: The plurality of pressurizing mechanisms respectively include a pressurizing cylinder; The above-mentioned position adjustment mechanism also includes: a cam rotation shaft, serving as a rotation shaft for the plurality of position adjustment cams; and A rotation drive component group, which rotationally drives the cam using a rotation shaft; The rotation operation of the plurality of position adjustment cams is performed as the cam rotation shaft rotates.

4. The ultrasonic vibration bonding device according to claim 3, wherein: The plurality of position-adjusting cams have different postures with respect to the cam rotating shaft.

5. The ultrasonic vibration bonding device according to claim 3 or 4, characterized in that: The lifting frame further accommodates the cam rotating shaft in the accommodation space; The above-mentioned rotation drive component group includes: A rotation driving device is arranged on the loading surface of the lifting frame to rotationally drive the driving pulley; A driven pulley connected to the cam by a rotating shaft; and A power transmission belt, transmitting the rotational driving force of the driving pulley to the driven pulley; The cam rotating shaft is rotated via the power transmission belt and the driven pulley by the rotation drive device.

6. The ultrasonic vibration bonding device according to any one of claims 2 to 4, characterized in that: Also available: a plurality of brackets provided corresponding to the plurality of ultrasonic bonding units and the plurality of position adjustment cams; and A plurality of position adjustment driven bearings are provided corresponding to the plurality of ultrasonic bonding units, the plurality of position adjustment cams and the plurality of brackets; The plurality of brackets respectively fix corresponding ultrasonic bonding units among the plurality of ultrasonic bonding units to the unit setting component, and the ultrasonic bonding parts of the plurality of ultrasonic bonding units are arranged on one end side of the plurality of brackets; The plurality of brackets fix corresponding position-adjusting driven bearings among the plurality of position-adjusting driven bearings under the respective unit-setting components of the plurality of brackets; The plurality of position-adjusting driven bearings are linked to the postures of corresponding position-adjusting cams among the plurality of position-adjusting cams to change the positions in the height direction; The ultrasonic vibration bonding device further comprises a bracket support mechanism, which is disposed on the mounting surface of the lifting frame and supports the plurality of brackets so as to be rotatable about a unit shaft disposed on the other end side of the plurality of brackets; The position adjustment mechanism further includes the plurality of brackets, the plurality of position adjustment driven bearings, and the bracket support mechanism.

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