Horizontal electroplating production line

Abstract

The invention discloses a horizontal electroplating production line and relates to the technical field of circuit board electroplating, the horizontal electroplating production line comprises horizontal electroplating equipment and a circuit board feeding device, the horizontal electroplating equipment comprises a first rack, an electroplating cylinder and a horizontal electroplating conveying device, the electroplating cylinder and the horizontal electroplating conveying device are arranged on the first rack, and the electroplating cylinder extends in the first direction; the horizontal electroplating conveying device is used for clamping the circuit board to move in the electroplating cylinder and carrying out electroplating, the circuit board feeding device comprises a second rack and a feeding conveying mechanism arranged on the second rack, and the feeding conveying mechanism is a conveying line with a certain length; the feeding conveying mechanism is used for allowing the circuit board to be horizontally placed and conveying the circuit board to the horizontal electroplating conveying device of the electroplating equipment in the horizontal direction, in the whole conveying process, the circuit board is kept horizontal and does not need to be operated through a mechanical arm, the occupied space of the equipment is smaller than that of traditional electroplating equipment, and the manufacturing cost is lower; and the high-precision electroplating requirement is met.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board electroplating, and in particular to a horizontal electroplating production line. Background Art

[0002] Whether it is a gantry line or VCP, the electroplating of traditional circuit boards adopts the vertical electroplating method. During the electroplating process, the circuit board is vertically clamped by a fixture and immersed in the solution. The circuit board is shaken by a mechanism with a shaking function, so that the solution flows in the interconnection holes of the circuit board, and electroplating is formed under the action of the conductive solution. The horizontal electroplating equipment of this structure occupies a large space, and both loading and unloading need to be operated by a robot. The manufacturing cost is high, and the board making precision is low, which cannot meet the high-precision electroplating requirements. Summary of the invention

[0003] The main purpose of the present invention is to propose a horizontal electroplating production line, aiming to solve the problems of high manufacturing cost and poor electroplating precision of traditional electroplating equipment.

[0004] To achieve the above object, the horizontal electroplating production line proposed by the present invention comprises:

[0005] A horizontal electroplating device, comprising a first frame, an electroplating cylinder and a horizontal electroplating conveying device arranged on the first frame, wherein the two ends of the electroplating cylinder are respectively provided with an inlet and an outlet, and the horizontal electroplating conveying device is used to drive the circuit board entering the electroplating cylinder from the inlet to move toward the outlet;

[0006] A circuit board loading device is arranged at one end of the electroplating cylinder close to the entrance. The circuit board loading device includes a second frame and a loading and conveying mechanism arranged on the second frame. The loading and conveying mechanism has a first horizontal conveying surface for placing the circuit board horizontally and conveying the circuit board along a first direction so that the circuit board entering the electroplating cylinder remains horizontal and moves to the horizontal electroplating conveying device.

[0007] In one embodiment, the circuit board loading device also includes a first positioning mechanism and a first pushing mechanism, wherein the first positioning mechanism is used to position the circuit board on the loading and conveying mechanism to a preset position, and the first pushing mechanism is used to drive the circuit board on the loading and conveying mechanism to move along a first direction to adjust the distance between two adjacent circuit boards positioned by the first positioning mechanism and arranged along the first direction.

[0008] In one embodiment, the first pushing mechanism is used to push the circuit board positioned by the first positioning mechanism to move along the first direction, so that the distance between the pushed circuit board and the previous circuit board positioned by the first positioning mechanism is a preset value L, and the actual distance value between the two circuit boards is D, and L and D satisfy: L-1.5mm≤D≤L+1.5mm.

[0009] In one embodiment, the horizontal electroplating production line includes a flipping device and two horizontal electroplating equipment. The flipping device is arranged between the two horizontal electroplating equipment to flip the circuit board after electroplating by one of the horizontal electroplating equipment and convey it to the other horizontal electroplating equipment, so that the horizontal electroplating conveying devices of the two horizontal electroplating equipment can respectively clamp the opposite sides of the circuit board.

[0010] In one embodiment, the flipping device includes a third frame and a feeding mechanism and a flipping mechanism arranged on the third frame, the feeding mechanism has a second horizontal conveying surface for horizontally placing the circuit board, and the flipping mechanism is used to flip the circuit board on the second horizontal conveying surface.

[0011] In one embodiment, the flipping mechanism includes a driving assembly, a rotating shaft and a clamping assembly, wherein the clamping assembly is disposed on the rotating shaft, the rotating shaft is drivingly connected to the driving assembly, the clamping assembly is provided with a slot for inserting a circuit board, and the driving assembly is used to drive the rotating shaft to rotate so that the clamping assembly drives the circuit board to flip.

[0012] In one embodiment, the feeding mechanism includes a first conveyor line, a second conveyor line, a third conveyor line and a fourth conveyor line, the first conveyor line and the second conveyor line transport circuit boards along a first direction, the flipping mechanism is arranged between the first conveyor line and the second conveyor line for flipping the circuit boards on the first conveyor line to the second conveyor line, the fourth conveyor line extends along the conveying direction of the first conveyor line, the third conveyor line is arranged along the second direction for transporting the circuit boards on the second conveyor line to the fourth conveyor line, and the first direction forms an angle with the second direction.

[0013] In one embodiment, the flipping device also includes a second pushing mechanism and a second positioning mechanism. The second positioning mechanism is arranged on the fourth conveyor line to position the circuit board to a preset position. The second pushing mechanism is used to push the circuit board along the first conveyor line, the second conveyor line, the third conveyor line and the fourth conveyor line in sequence, and push the circuit board positioned by the second positioning mechanism to the horizontal electroplating equipment, and adjust the distance between two adjacent circuit boards positioned by the second positioning mechanism and arranged along the first direction.

[0014] In one embodiment, the horizontal electroplating conveying device also includes a clamping mechanism and an electroplating conveying mechanism. A guide rail is arranged on the first frame in a horizontal direction. The clamping mechanism includes a sliding member and a clamping member connected to each other. The clamping member is arranged on the electroplating conveying mechanism for clamping the circuit board. The sliding member is slidably connected to the guide rail. The electroplating conveying mechanism is used to drive the clamping mechanism to move along the guide rail for transmitting the circuit board.

[0015] In one embodiment, the clamping member comprises:

[0016] Fixing clip;

[0017] A movable clip, which is movably mounted on the fixed clip via a connecting assembly, and is used to cooperate with the fixed clip to clamp the circuit board; and

[0018] The lifting support wheel is arranged on a side of the movable clamp away from the fixed clamp. When the clamping mechanism moves through the electroplating conveying mechanism, the lifting support wheel rises or falls to open or close the movable clamp and the fixed clamp.

[0019] In one embodiment, the horizontal electroplating conveying device further comprises a guide assembly disposed on the first frame, the guide assembly comprising a first guide member and a second guide member, the first guide member being located on a material loading path of the clamping mechanism, the second guide member being located on a material unloading path of the clamping mechanism, and the first guide member and the second guide member both having a guide slope;

[0020] On the feeding path of the clamping mechanism, when the guide slope is used to guide the movement of the clamping mechanism, it abuts against the lifting support wheel, so that the distance between the first clamping assembly and the second clamping assembly is increased, so as to clamp the circuit board;

[0021] On the unloading path of the clamping mechanism, the lifting support wheel abuts when the guide slope is used to guide the movement of the clamping mechanism, so that the distance between the first clamping component and the second clamping component is increased to facilitate the circuit board to fall off.

[0022] In one embodiment, the electroplating conveying mechanism further comprises:

[0023] A conveyor steel belt, wherein the conveyor steel belt is slidably arranged on the first frame, and the clamping mechanism is arranged on the conveyor steel belt;

[0024] A driving mechanism, wherein the driving mechanism comprises a conveying driving wheel and a conveying driven wheel, wherein the conveying driving wheel and the conveying driven wheel are respectively arranged at two ends of the first frame, and the conveying driving wheel and the conveying driven wheel are connected by the conveying steel belt to form a closed-loop transmission to achieve continuous conveying;

[0025] A tensioning mechanism is elastically connected to the conveyor steel belt and the first frame. When the conveyor steel belt slides on the first frame, the tensioning mechanism undergoes elastic deformation to change the horizontal distance between the first frame and the conveyor steel belt to tension the conveyor steel belt.

[0026] In one embodiment, the horizontal electroplating equipment also includes a cathode conductive clamp reverse stripping device, which includes a deplating cylinder and a stripping assembly. The deplating cylinder is arranged on the first frame, and the conveyor steel belt is used to convey the clamping mechanism into the deplating cylinder so that the clamping mechanism and the stripping assembly form a conductive loop to strip the electroplating material on the clamping mechanism.

[0027] In one embodiment, the horizontal electroplating apparatus further comprises a conductive device, wherein the conductive device comprises:

[0028] A conductive oil tank assembly, wherein the conductive oil tank assembly is provided with conductive oil;

[0029] A cathode assembly, the cathode assembly being used to be connected to an anode member of a power source to generate current;

[0030] A conductive slider assembly is arranged in the clamping mechanism, the conductive slider assembly is arranged in the conductive oil tank assembly and immersed in the conductive oil, the conductive slider assembly is electrically connected to the cathode assembly, and is used to transmit current to the horizontal electroplating fixture, so that the circuit board on the horizontal electroplating fixture is charged;

[0031] A reflux mechanism, wherein the reflux mechanism comprises an oil collecting trough and a reflux component, wherein the oil collecting trough is used to store conductive oil, and the conductive oil trough component is connected to the oil collecting trough through the reflux component to form a circulation passage for mutually circulating the conductive oil in the oil collecting trough and the conductive oil in the conductive oil trough component.

[0032] In one embodiment, the conductive device further includes an oil supply mechanism, and the reflux mechanism further includes an overflow assembly, the oil supply mechanism is connected to the conductive oil tank assembly to provide conductive oil to the oil guide tank assembly, the overflow assembly has an overflow port, the overflow assembly is connected to the oil guide tank assembly through the overflow port, the conductive oil tank assembly is connected to the oil collecting tank through the overflow assembly, the conductive oil tank assembly has a preset volume, and when the liquid volume in the conductive oil tank assembly exceeds the preset volume, the conductive oil in the conductive oil tank assembly can flow into the oil collecting tank through the overflow assembly.

[0033] In one embodiment, the horizontal electroplating equipment further comprises an anode spray device disposed in the electroplating tank, the anode spray device comprising:

[0034] Anode mesh plate;

[0035] An anode mesh, detachably mounted on the anode mesh plate;

[0036] A spray assembly is installed on a side of the anode mesh away from the anode mesh plate;

[0037] A conductive component, through which the anode grid is connected to a rectifier.

[0038] In one embodiment, at least two groups of the anode spray devices are installed at intervals in the electroplating cylinder, and the spray sides of the two groups of the anode spray devices are arranged opposite to each other, and a plating cavity for accommodating circuit board electroplating is formed between any two groups of the anode spray devices arranged opposite to each other.

[0039] In one embodiment, the anode mesh plate comprises:

[0040] An orifice plate body is provided with a plurality of meshes and a plurality of first spray holes, each of the meshes is arranged in a hexagonal shape, a plurality of the meshes are arranged in a honeycomb array on the body, a plurality of the first spray holes are arranged at intervals on the orifice plate body, and the orifice plate body has a spray side facing the workpiece to be plated and spraying the workpiece to be plated; and

[0041] A guide wheel is installed on the spray side of the orifice plate body and is used for abutting against the workpiece to be plated.

[0042] In one embodiment, the horizontal electroplating production line further comprises a copper dissolving device, and the copper dissolving device comprises:

[0043] A copper dissolving tank, wherein a partition plate is provided in the copper dissolving tank, wherein the partition plate divides the tank body into a first tank body and a second tank body, wherein the first tank body has a liquid inlet for a reaction stock solution to enter, and a copper particle basket for placing pure copper; an overflow portion for connecting the first tank body with the second tank body is provided on the upper portion of the partition plate; and an overflow port for allowing the electroplating solution to flow out is provided in the second tank body;

[0044] a delivery pipeline, connecting the second cylinder body with the first cylinder body, so that the first cylinder body, the overflow portion, the second cylinder body and the delivery pipeline are connected to form an internal circulation loop; and

[0045] An overflow mechanism is installed at the overflow port, and the overflow mechanism is used to send the liquid in the second cylinder body to the electroplating cylinder.

[0046] In one embodiment, the horizontal electroplating production line further comprises a plate washing device and a plate drying device, wherein the plate washing device is arranged at the entrance of the electroplating cylinder and between the circuit board feeding device and the electroplating cylinder, and / or the plate washing device is arranged at the exit of the electroplating cylinder;

[0047] The plate drying device is arranged at the outlet of the electroplating cylinder and is located at a side of the plate washing device away from the electroplating cylinder, so as to remove water from the circuit board after electroplating and cleaning by the plate washing device.

[0048] The technical solution of the present invention adopts a circuit board loading device in a horizontal electroplating production line to cooperate with the horizontal electroplating equipment for electroplating, so as to reduce the manufacturing cost of the equipment. Specifically, the horizontal electroplating production line includes horizontal electroplating equipment and a circuit board loading device. The horizontal electroplating equipment includes a first frame, a plating cylinder arranged on the first frame, and a horizontal electroplating conveying device. The plating cylinder extends along a first direction. The horizontal electroplating conveying device is used to clamp the circuit board and move it in the plating cylinder for electroplating. The circuit board loading device includes a second frame and a loading and conveying mechanism arranged on the second frame. The loading and conveying mechanism is a conveying line with a certain length and forms a first horizontal conveying surface for horizontal placement of the circuit board. The loading and conveying mechanism conveys the circuit board in a horizontal direction to the horizontal electroplating conveying device of the electroplating equipment. It can be understood that during the entire conveying process, the circuit board maintains a horizontal posture and does not need to be operated by a robot. Therefore, the equipment occupies less space than traditional electroplating equipment, has lower manufacturing costs, and the horizontal board can meet the high-precision electroplating requirements and has higher product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0050] Figure 1 A schematic structural diagram of an embodiment of a horizontal electroplating production line provided by the present invention;

[0051] Figure 2 A top view of an embodiment of a horizontal electroplating production line provided by the present invention;

[0052] Figure 3 A schematic diagram of the connection structure between a circuit board feeding device and a horizontal electroplating device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0053] Figure 4 A schematic structural diagram of a circuit board feeding device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0054] Figure 5 A partial structural schematic diagram of a circuit board feeding device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0055] Figure 6 A schematic diagram of the connection structure between a plate turning device and two horizontal electroplating equipments in an embodiment of a horizontal electroplating production line provided by the present invention;

[0056] Figure 7 A schematic diagram of the structure of a plate turning device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0057] Figure 8 A partial structural schematic diagram of a plate turning device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0058] Fig. 9 A schematic diagram of a conveying line for a circuit board by a plate turning device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0059] Fig.10 A schematic diagram of the structure of a turning mechanism of a plate turning device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0060] Fig.11 A schematic diagram of the internal structure of a horizontal electroplating device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0061] Fig.12 A schematic structural diagram of a horizontal electroplating conveying device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0062] Fig.13 A schematic diagram of the structure of the clamping mechanism and the conveying steel plate in the horizontal electroplating conveying device in one embodiment of the horizontal electroplating production line provided by the present invention;

[0063] Fig.14 A schematic diagram of the structure of the clamping mechanism and the conveying steel plate in an embodiment of the horizontal electroplating production line provided by the present invention;

[0064] Fig.15 A schematic diagram of the assembly structure of the clamping mechanism and the guide rail in an embodiment of the horizontal electroplating production line provided by the present invention;

[0065] Fig.16 A schematic diagram of the matching structure of a clamping member and a guide assembly in an embodiment of a horizontal electroplating production line provided by the present invention;

[0066] Fig.17 A schematic diagram of the structure of an electroplating conveying mechanism in an embodiment of a horizontal electroplating production line provided by the present invention;

[0067] Fig.18 A schematic diagram of the structure of a conveying steel belt, a conveying driving wheel, and a conveying driven wheel in an embodiment of a horizontal electroplating production line provided by the present invention;

[0068] Fig.19A schematic diagram of the structure of a clamping member, a stripping cylinder and a cathode conductive clamp reverse stripping device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0069] Fig. 20 A schematic diagram of the structure of a conductive device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0070] Fig.21 for Fig. 20 The enlarged view of point A in the middle;

[0071] Fig. 22 A schematic diagram of the structure of a clamping mechanism, a circuit board and an anode spraying device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0072] Fig.23 A schematic diagram of the structure of an anode spray device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0073] Fig.24 A schematic diagram of the bottom structure of an anode spray device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0074] Fig.25 A schematic diagram of the structure of an anode mesh plate in an embodiment of a horizontal electroplating production line provided by the present invention;

[0075] Fig.26 A schematic structural diagram of a copper dissolving device in an embodiment of a horizontal electroplating production line provided by the present invention;

[0076] Fig. 27 A side cross-sectional view of a copper dissolving device in an embodiment of a horizontal electroplating production line provided by the present invention.

[0077] Description of Figure Numbers:

[0078] 10. Horizontal electroplating production line; 20. Circuit board; 30. Channel;

[0079] 100, horizontal electroplating equipment; 110, first frame; 111, guide rail; 112, first guide member; 113, second guide member; 120, electroplating cylinder; 130, horizontal electroplating conveying device; 131, clamping mechanism; 1311, sliding member; 1312, clamping member; 13121, fixed clamp; 13122, movable clamp; 13123, lifting support wheel; 1313, conductive slider assembly; 13131, first conductive slider; 13132, second conductive slider; 132, electroplating conveying mechanism; 1321, conveying steel belt; 1322, conveying driving wheel; 1323, conveying driven wheel; 1324, tensioning mechanism; 13241, tensioning seat; 13242, compression spring; 1325, slide rail assembly ;140, cathode conductive clip reverse stripping device;141, stripping cylinder;142, stripping assembly;143, power supply system;150, conductive device;151, conductive oil tank assembly;1511, first conductive oil tank;1512, second conductive oil tank;152, cathode assembly;1521, first cathode component;1522, second cathode component;153, reflux mechanism;1531, oil collecting tank;1532, reflux assembly;154, oil supply mechanism;155, overflow assembly;160, anode spray device;161, anode mesh plate;1611, orifice plate body;1612, mesh;1613, first spray hole;1614, guide wheel;162, spray assembly;1621, nozzle;163, conductive assembly;

[0080] 200, circuit board feeding device; 210, second frame; 220, feeding conveying mechanism; 221, roller; 222, friction wheel; 230, first positioning mechanism; 231, first positioning baffle; 232, second linear motor; 233, second pushing member; 240, first pushing mechanism; 241, first linear motor; 242, first pushing member; 250, transfer track; 251, first lifting mechanism;

[0081] 300, flap device; 310, third frame; 320, feeding mechanism; 321, first conveyor line; 322, second conveyor line; 323, third conveyor line; 3231, second lifting mechanism; 324, fourth conveyor line; 330, flip mechanism; 331, driving assembly; 3311, driving motor; 3312, transmission belt; 3313, transmission wheel; 332, rotating shaft; 333, clamping assembly; 333a, slot; 340, second pushing mechanism; 341, third linear motor; 342, third pushing member; 350, second positioning mechanism; 351, second positioning baffle; 352, fourth linear motor;

[0082] 400, copper dissolving device; 410, copper dissolving cylinder; 410a, first cylinder body; 410b, second cylinder body; 411, partition plate; 412, copper particle basket; 413, conveying pipeline; 414, overflow mechanism; 415, overflow hole; 416, guide assembly; 4161, first guide plate; 4162, second guide plate; 420, material lifting mechanism;

[0083] 500, plate washing device;

[0084] 600. Dry plate device.

[0085] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0086] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0087] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0088] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0089] Whether it is a gantry line or VCP, the electroplating of traditional circuit boards adopts the vertical electroplating method. During the electroplating process, the circuit board is vertically clamped by a fixture and immersed in the solution. The circuit board is shaken by a mechanism with a shaking function, so that the solution flows in the interconnection holes of the circuit board, and electroplating is formed under the action of the conductive solution. The horizontal electroplating equipment of this structure occupies a large space, and both loading and unloading need to be operated by a robot. The manufacturing cost is high, and the board making precision is low, which cannot meet the high-precision electroplating requirements.

[0090] The invention provides a horizontal electroplating production line.

[0091] See also Figures 1 to 3 In one embodiment of the present invention, the horizontal electroplating production line 10 includes a horizontal electroplating device 100 and a circuit board 20 feeding device. The horizontal electroplating device 100 includes a first frame 110 and a plating cylinder 120 disposed on the first frame 110 and a horizontal electroplating conveying device 130. The plating cylinder 120 extends along a first direction and contains a plating solution. The horizontal electroplating conveying device 130 is used to clamp the circuit board 20 and move it in the plating cylinder 120 for electroplating. The circuit board 20 feeding device includes a second frame 210 and a feeding device disposed on the second frame 210. The conveying mechanism 220 is a conveying line with a certain length and forms a first horizontal conveying surface for placing the circuit board 20 horizontally. The loading conveying mechanism 220 conveys the circuit board 20 in a horizontal direction to the horizontal electroplating conveying device 130 of the electroplating equipment. It can be understood that during the entire conveying process, the circuit board 20 maintains a horizontal posture and does not need to be operated by a robot. Therefore, the equipment of this production line occupies less space and has lower manufacturing costs than traditional electroplating equipment. The horizontal board movement can meet the high-precision electroplating requirements and the product quality is higher.

[0092] It should be noted that the loading and conveying mechanism 220 includes a plurality of rollers 221. Specifically, the plurality of rollers 221 are arranged side by side along the first direction on the second frame 210 to form a conveying line. A plurality of friction wheels 222 are arranged on each roller 221 to form a first horizontal conveying surface. A driving motor 3311 is also provided on the frame. Meshing gears are provided at the ends of any two adjacent rollers 221. The driving motor 3311 drives the plurality of rollers 221 to rotate at the same speed through the gears. The friction wheel 222 contacts the bottom of the board surface to drive the circuit board 20 to move. The position where the friction wheel 222 contacts the circuit board 20 can adopt a structure such as soft rubber to prevent scratches.

[0093] Further, such as Figure 4 and Figure 5As shown, the circuit board 20 feeding device further includes a first positioning mechanism 230 and a first pushing mechanism 240 arranged on the second frame 210. The first positioning mechanism 230 is used to position the circuit board 20 on the feeding conveying mechanism 220 to a predetermined position so that the board edge of the circuit board 20 is aligned with the horizontal electroplating conveying device 130. After the positioning is completed, the circuit board 20 moves along the first direction into the electroplating cylinder 120. The first pushing mechanism 240 includes a group of first linear motors 241 and first pushing members 242 arranged along the first direction. The first pushing member 242 is drivingly connected to the first linear motor 241. The first linear motor 241 is used to drive the first pushing member 242 to move back and forth along the first direction and drive the circuit board 20 to move. The first positioning mechanism 230 includes a second linear motor 232 and a second pushing member 233 arranged along the second direction. A first positioning baffle 231 is also arranged on the feeding conveying mechanism 220. The second linear motor 232 drives the second pushing member 233 to push the circuit board 20 to the first positioning baffle 231 for positioning. During production loading, the operator generally places multiple circuit boards 20 on the loading conveying mechanism 220 in sequence. The first pushing mechanism 240 is used to adjust the distance between two adjacent circuit boards 20 positioned by the first positioning mechanism 230 and arranged along the first direction.

[0094] During positioning, the first positioning mechanism 230 pushes the circuit board 20 laterally, which may cause the friction wheel 222 to scrape against the surface of the circuit board 20. Therefore, a transfer track 250 can be set along the second direction below the loading and conveying mechanism 220. A plurality of driven wheels are arranged at intervals along the second direction on the upper end of the transfer track 250, and a first lifting mechanism 251 is arranged at the lower end for lifting. When the circuit board 20 enters the positioning position, the first lifting mechanism 251 drives the transfer track 250 to rise and lift up the circuit board 20. The first positioning mechanism 230 pushes the circuit board 20 to move in the second direction, and the surface of the circuit board 20 slides and abuts against the driven wheel to avoid scratches. When the positioning is completed, the first lifting mechanism 251 drives the transfer track 250 to descend and puts the circuit board 20 back to the first conveying level to complete the subsequent transmission steps.

[0095] Since multiple circuit boards 20 need to enter the electroplating tank 120 in sequence, the uneven spacing of the circuit boards 20 may cause uneven flow of the electroplating solution, resulting in excessively thick or thin coating in some areas, affecting the overall performance. However, the existing equipment uses a roller conveying structure, and the spacing control accuracy is not high. Figure 5As shown, in one embodiment of the present invention, a first pusher 242 is provided on the first linear motor 241 of the first pusher mechanism 240, and the first pusher 242 is used to push the circuit board 20 positioned by the first positioning mechanism 230 toward the electroplating cylinder 120 and catch up with the previous circuit board 20. The operation gap and the transportation distance are calculated by the controller, and the first positioning mechanism 230 and the first pusher mechanism 240 are controlled to cooperate with each other so that the spacing value between two adjacent circuit boards 20 is greater than or equal to 1 mm and less than or equal to 3 mm, that is, the spacing value between two adjacent circuit boards 20 is controlled within a preset value L. For example, the preset value L of the board spacing can be set to 5 mm. , 10mm or 15mm, etc. However, due to the influence of the control accuracy of the mechanical equipment, the actual spacing value D is different from the preset value L. By controlling the linear motor, the error between the spacing value D and the preset value L can be further reduced compared with the conventional roller conveyor. Specifically, L and D satisfy: L-1.5mm≤D≤L+1.5mm, that is, the error can be controlled within the range of 1.5mm. For example, if the preset value L of the plate spacing is set to 10mm, then the minimum value of the actual spacing value D can be 8.5mm, the maximum value can be 11.5mm, and the spacing value D can also be 9.5mm, or any value within the aforementioned range. Compared with the traditional roller conveyor structure, the control is more precise, and the electroplating effect is better.

[0096] The effect of one-time electroplating of existing PCB boards is not very ideal, and usually two or three electroplatings are required. The first and second electroplatings will be plated relatively thinly, but the surface of the board is required to be plated very evenly, so the first and second electroplatings adopt horizontal electroplating methods. In order to achieve the best electroplating effect, the board will be turned over and the clamping points will be replaced. Therefore, in the horizontal electroplating production line 10, in order to improve the electroplating efficiency, at least two horizontal electroplating equipment 100 are usually set up to be connected front and back, and a flip device 300 is set in the middle to flip the circuit board 20 and transport it. The flip device 300 receives the circuit board 20 after the electroplating of the previous horizontal electroplating equipment 100, and flips the circuit board 20, replaces the clamping points, and then transports it to the next horizontal electroplating equipment 100 to improve the plating uniformity of the circuit board 20.

[0097] like Figures 6 to 10As shown, the flipping device 300 includes a third frame 310 and a feeding mechanism 320 and a turning mechanism 330 arranged on the third frame 310. The feeding mechanism 320 has a conveying track, and the conveying track has a second horizontal conveying surface for the circuit board 20 to be placed horizontally. The second horizontal conveying surface can be arranged flush with the first horizontal conveying surface. The circuit board 20 after electroplating by one horizontal electroplating equipment 100 enters the horizontal conveying surface, and the feeding mechanism 320 conveys it to the other horizontal electroplating equipment 100 in the horizontal direction. During the conveying process, the turning mechanism 330 turns over the circuit board 20 on the horizontal conveying surface, and exchanges the positions of the two side edges on the opposite sides of the circuit board 20, so that the horizontal electroplating conveying devices 130 of the two horizontal electroplating equipments 100 respectively clamp the opposite sides of the circuit board 20.

[0098] It should be noted that the horizontal electroplating equipment 100 generally energizes the clamps of the horizontal electroplating conveyor 130 to electroplate the circuit board 20. The current on the clamping point edge of the circuit board 20 close to the horizontal electroplating conveyor 130 is large, so the coating is relatively thicker. The farther the position of the circuit board 20 is from the horizontal electroplating conveyor 130, the smaller the current is, and the coating is relatively thinner. Obviously, a single electroplating cannot achieve a uniform coating effect, and the upper and lower surfaces of the circuit board 20 in the electroplating cylinder 120 are in different chemical solution environments, so the electroplating effects on both sides are also different. This solution sets a flip device 300 to flip the upper and lower surfaces of the circuit board 20 and switch the clamping point edge to the opposite side, so that the circuit board 20 is more evenly coated after being electroplated twice by two horizontal electroplating equipment 100, thereby effectively improving the production quality of the circuit board 20.

[0099] The second horizontal conveying surface of the feeding mechanism 320 can be formed by structures such as a belt conveyor line, a roller conveyor line, a roller 221 friction wheel 222 conveyor line, etc. The circuit board 20 moves horizontally from the previous horizontal electroplating equipment 100 to the electroplating cylinder 120 of the next horizontal electroplating equipment 100 on the second horizontal conveying surface, so that the horizontal electroplating conveying device 130 can accurately clamp the circuit board 20 to ensure the stability of the docking and transportation process.

[0100] Please refer to Fig. 9 and Fig.10In one embodiment of the present invention, the flip mechanism 330 includes a driving component 331, a rotating shaft 332 and a clamping component 333. The feeding mechanism 320 transports the circuit board 20 along the first direction. The rotating shaft 332 is also extended along the first direction. The clamping component 333 is arranged on the rotating shaft 332. The driving component 331 is used to drive the rotating shaft 332 and the clamping component 333 to rotate. The clamping component 333 is provided with a slot 333a, which extends along the axis direction of the rotating shaft 332 and can be aligned with the horizontal conveying surface of the feeding mechanism 320. When the feeding mechanism 320 transports the circuit board 20 to the flipping mechanism 330, the side of the circuit board 20 is inserted into the slot 333a, the driving component 331 drives the rotating shaft 332 to rotate, and the clamping component 333 flips the circuit board 20 180° and puts it back on the second horizontal conveying surface of the feeding mechanism 320. At this time, the circuit board 20 is flipped over, and the two side edges of the circuit board 20 along the first direction are swapped so that the sides of the circuit board 20 clamped by the electroplating conveying mechanism 132 in the two horizontal electroplating equipment 100 are located on opposite sides to ensure uniform plating.

[0101] Further, the driving assembly 331 includes a driving motor 3311, a transmission belt 3312 and a transmission wheel 3313. Specifically, one end of the rotating shaft 332 is connected to the transmission wheel 3313. The driving motor 3311 is arranged on the bracket and connected to the transmission wheel 3313 through the transmission belt 3312. The driving motor 3311 drives the transmission wheel 3313 to rotate through the transmission belt 3312, so that the transmission wheel 3313 drives the rotating shaft 332 to rotate around the first direction and drives the clamping assembly 333 to flip the circuit board 20. The cost of the driving motor 3311 and the transmission belt 3312 is lower than that of the gear, and the transmission belt 3312 structure can absorb vibration, reduce noise, is quieter than the gear, and is more convenient and simple to maintain. Of course, in some other embodiments of the present invention, the driving assembly 331 can also adopt a structure such as a worm gear set, without specific limitation.

[0102] Furthermore, the feeding mechanism 320 includes a first conveyor line 321, a second conveyor line 322, a third conveyor line 323 and a fourth conveyor line 324. The first conveyor line 321, the second conveyor line 322 and the fourth conveyor line 324 all adopt a friction wheel 222 set on the roller 221 to form a horizontal conveying surface. The rotation of the roller 221 drives the friction wheel 222 to rotate, and the friction wheel 222 drives the circuit board 20 to move along the first direction. The first conveyor line 321, the second conveyor line 322 and the fourth conveyor line 324 are arranged at intervals and extend along the first direction. The flip mechanism 330 is arranged between the first conveyor line 321 and the second conveyor line 322. The third conveyor line 323 is arranged along the second direction and its two ends are respectively connected to the second conveyor line 322 and the fourth conveyor line 324. The line 323 is raised and lowered by a cylinder mechanism to lift up the circuit board 20 located on the second conveyor line 322. Specifically, when the circuit board 20 moves from the first conveyor line 321 to the slot 333a of the clamping assembly 333, the flip device 300 flips the circuit board 20 180° to the second conveyor line 322, and the circuit board 20 continues to move along the first direction on the second conveyor line 322 to above the third conveyor line 323. The second lifting mechanism 3231 raises the third conveyor line 323 to lift up the circuit board 20, and the circuit board 20 moves on the third conveyor line 323 in the opposite direction of the second direction to above the fourth conveyor line 324. The cylinder lowers the third conveyor line 323, and then the circuit board 20 falls on the fourth conveyor line 324 and moves toward the electroplating cylinder 120 along the first direction.

[0103] The flipping device 300 also includes a second pushing mechanism 340 and a second positioning mechanism 350. The second pushing mechanism 340 includes four third linear motors 341, each of which is provided with a third pushing piece 342. The four third linear motors 341 and the four third pushing pieces 342 are respectively arranged on four conveyor lines to push the circuit boards 20 on the corresponding conveyor lines to move along the conveying direction of the conveyor lines. Furthermore, a second positioning mechanism 350 is also arranged on the fourth conveyor line 324, including a second positioning baffle 351. When the third pushing piece 342 on the third conveyor line 323 pushes the circuit board 20 along the second direction to the fourth conveyor line 324, the circuit board 20 abuts against the second positioning baffle 351 of the second positioning mechanism 350, so that the side of the circuit board 20 is aligned with the horizontal electroplating conveying device 130 of the next horizontal electroplating equipment 100 to ensure that the clamping point position is consistent. In this embodiment, the second positioning baffle 351 is further connected to a fourth linear motor 352 for adjusting the position of the second positioning baffle 351 on the fourth conveying line 324 to accommodate circuit boards 20 of different specifications.

[0104] In addition, the third linear motor 341 and the third pusher 342 on the fourth conveyor line 324 push the positioned circuit board 20 toward the electroplating cylinder 120. During the pushing process, the control mechanism calculates the distance moved by the previous positioned circuit board 20, and pushes the circuit board 20 on the second positioning mechanism 350 to catch up with the previous circuit board 20 to control the spacing. It should be noted that, in order to unify the electroplating quality, the second pusher mechanism 340 of the flipping device 300 also uses a linear motor, which can control the spacing error between the two adjacent circuit boards 20 after positioning within 1.5mm, that is, the actual spacing value D of the circuit board and the preset value L meet: L-1.5mm≤D≤L+1.5mm, for example, the preset value L of the board spacing is set to 10mm, then the minimum value of the actual spacing value D can be 8.5mm, the maximum value can be 11.5mm, the spacing value D can also be 9.5mm, or any value within the aforementioned range, to ensure that the spacing of the circuit boards 20 entering the front and rear two horizontal electroplating equipment 100 is kept in the same range, reducing the impact of the spacing on the secondary electroplating.

[0105] like Figures 11 to 15 As shown, in one embodiment of the present invention, the horizontal electroplating conveying device 130 also includes a clamping mechanism 131 and an electroplating conveying mechanism 132. The first frame 110 provides an overall structural support for the horizontal electroplating equipment 100. The first frame 110 is provided with a guide rail 111 to guide the sliding member 1311 to perform linear motion. Among them, the main purpose of arranging the guide rail 111 on the first frame 110 is to ensure that the clamping mechanism 131 can move smoothly and accurately along the predetermined path, which is very important for ensuring that the circuit board 20 is not damaged and positionally offset during the electroplating process. The guide rail 111 can help the clamping mechanism 131 stay on the correct track to prevent processing errors caused by offset. Reduce the vibration or shaking of the sliding member 1311 during movement to ensure that the circuit board 20 is stable during transmission. The guide rail 111 can reduce the friction between the clamping mechanism 131 and other components and extend the life of the equipment.

[0106] The clamping mechanism 131 includes a plurality of sliding members 1311 and a clamping member 1312. The sliding member 1311 is slidably connected to the guide rail 111 on the first frame 110, and the clamping member 1312 is responsible for fixing the circuit board 20. The electroplating conveying mechanism 132 is used to drive the clamping mechanism 131 so that the sliding member 1311 moves along the guide rail 111, thereby realizing the conveying of the circuit board 20 on the production line. Specifically, the clamping mechanism 131 first clamps the circuit board 20 to be processed by the clamping member 1312. After the electroplating conveying mechanism 132 is started, the sliding member 1311 will be driven to move along the direction of the guide rail 111. The movement of the sliding member 1311 causes the clamping member 1312 and the circuit board 20 thereon to move accordingly, completing the transmission process of the circuit board 20 between the electroplating tanks. The main purpose of this design is to realize the automatic transmission of the circuit board 20 in the electroplating production line, reduce manual operation, and improve production efficiency and safety. At the same time, such a design also enables the equipment to adapt to different sizes and shapes of circuit boards 20, and has good versatility and flexibility.

[0107] It is understood that the guide rail 111 is usually a long strip structure made of metal, which can be an open T-slot or a closed V-slot, etc., and the sliding member 1311 has a corresponding slider to match it. Or it can be a roller or ball to reduce friction, which is suitable for application scenarios that require frequent reciprocating motion. Or it can be composed of a guide rail 111 and a slider, and there are balls or needles inside the slider, which can move smoothly on the guide rail 111. It is understood that the structural design of the slider 1311 usually needs to take into account the matching method between it and the guide rail 111. It can be a metal or plastic slider used in conjunction with the guide rail 111 or the guide groove, and the slider may contain balls or needles to reduce friction. Or it can be a roller, a sliding member 1311 with a wheel, which can roll on the surface of the guide rail 111, reduce friction and provide smooth movement. Or it can be a suspension type, and the sliding member 1311 is connected to the upper guide rail 111 by suspension, which is suitable for movement in a vertical or inclined direction. This solution can better achieve accurate and stable transmission of the circuit board 20 during the electroplating process. The slide 1311, as part of the guide system, cooperates with the guide rail 111 to ensure that the circuit board 20 will not deviate or vibrate during the movement, thereby ensuring the electroplating quality and production efficiency. Stable mechanical transmission reduces product damage or uneven electroplating caused by improper manual operation. And through automated transmission, the time of manual handling is reduced, the production speed is increased, the production efficiency and product quality are improved, and the production cost and safety risks are reduced.

[0108] Further references Fig.16The clamping member 1312 includes a fixed clamp 13121, a movable clamp 13122 and a lifting support wheel 13123; the movable clamp 13122 can be movably installed on the fixed clamp 13121 through a connecting assembly, and the movable clamp 13122 is used to cooperate with the fixed clamp 13121 to clamp the circuit board 20; the lifting support wheel 13123 is arranged on the side of the movable clamp 13122 away from the fixed clamp 13121, and is used to drive the movable clamp 13122 to rise or fall. The first frame 110 is provided with a guide assembly along the first direction, and the guide assembly includes a first guide member 112 and a second guide member 113. The upper surfaces of the first guide member 112 and the second guide member 113 respectively form slopes and extend obliquely upward along the conveying direction. When the lifting support wheel 13123 reaches the slope, the lifting support wheel 13123 moves upward along the slope. The fixed clamp 13121 is fixedly installed on the electroplating conveying device, so that the electroplating conveying device drives the entire device to move in the horizontal direction through the fixed clamp 13121. When the lifting support wheel 13123 moves to the lowest point of the slope, it begins to climb upward along the slope. Since the fixed clamp 13121 is fixedly connected to the conveying device and always maintains the same horizontal height, the movable clamp 13122 moves upward under the drive of the lifting support wheel 13123, thereby causing the movable clamp 13122 and the fixed clamp 13121 to slide relative to each other, and the movable clamp 13122 and the fixed clamp 13121 are therefore opened.

[0109] like Fig.16As shown, when the clamping mechanism 131 moves along the guide slope of the first guide member 112 in the upward feeding direction, the lifting support wheel 13123 rises, and the distance between the fixed clamp 13121 and the movable clamp 13122 becomes larger, so that the circuit board 20 can be clamped smoothly. When the clamping mechanism 131 moves along the guide slope of the second guide member 113 in the opposite direction (i.e., the unloading direction), the distance between the fixed clamp 13121 and the movable clamp 13122 will also become larger, this time to release the circuit board 20 from the clamping state. Specifically, the clamping mechanism 131 is in the initial position, and the distance between the fixed clamp 13121 and the movable clamp 13122 is suitable for clamping the circuit board 20. In the feeding stage, the circuit board 20 is placed at the position of the clamping mechanism 131. The clamping mechanism 131 starts to move and slides along the guide rail 111 to the first guide member 112. Under the action of the guide slope of the first guide member 112, the distance between the fixed clamp 13121 and the movable clamp 13122 gradually increases. The increased distance allows the circuit board 20 to smoothly enter between the two clamping components 333. After the clamping mechanism 131 completely passes through the first guide member 112, the distance between the fixed clamp 13121 and the movable clamp 13122 is restored, and the circuit board 20 is firmly clamped. The clamping mechanism 131 continues to move along the guide rail 111 and enters the electroplating tank or other processing area. At this stage, the circuit board 20 undergoes electroplating or other surface treatment. In the unloading stage, after the treatment is completed, the clamping mechanism 131 begins to return and slides along the guide rail 111 to the second guide member 113. Under the action of the guide slope of the second guide member 113, the distance between the fixed clamp 13121 and the movable clamp 13122 gradually increases again. The increased distance allows the circuit board 20 to be released from the clamping state. When the clamping mechanism 131 completely passes through the second guide 113, the circuit board 20 is put down or transferred to the next process. The clamping mechanism 131 returns to the initial position and prepares for the next cycle. This process ensures that the circuit board 20 can be safely clamped and released during the electroplating process, while also ensuring the continuity and automation of the entire process.

[0110] like Fig.17 and Fig.18As shown, the electroplating conveying mechanism 132 also includes a conveying steel belt 1321, a driving mechanism and a tensioning mechanism 1324. The conveying steel belt 1321 is installed on the first frame 110 and can slide on the first frame 110. The driving mechanism is composed of a conveying driving wheel 1322 and a conveying driven wheel 1323, which are respectively located at the two ends of the first frame 110. A closed-loop transmission is formed by the conveying steel belt 1321. The outer surface of the conveying steel belt 1321 is provided with a clamping mechanism 131 to achieve continuous conveying. The tensioning mechanism 1324 is elastically connected to the conveying steel belt 1321 and the first frame 110, and the horizontal spacing between the first frame 110 and the conveying steel belt 1321 is adjusted by elastic deformation, thereby ensuring the tension state of the steel belt. Specifically, before the device is started, the conveying steel belt 1321 is in the initial position, and the tensioning mechanism 1324 maintains a certain pre-tension to ensure that the conveying steel belt 1321 is in a properly tensioned state on the first frame 110. When the system is started, the conveying driving wheel 1322 in the driving mechanism starts to rotate. Since the conveying driving wheel 1322 and the conveying driven wheel 1323 form a closed-loop transmission through the conveying steel belt 1321, the conveying driven wheel 1323 will also rotate accordingly. Driven by the driving mechanism, the conveying steel belt 1321 slides along the first frame 110, clamps the circuit board 20 to be electroplated through the clamping mechanism 131 and pulls it into the next process. The circuit board 20 moves forward with the movement of the conveying steel belt 1321.

[0111] Furthermore, the tensioning mechanism 1324 includes a tensioning seat 13241 and a compression spring 13242. The compression spring 13242 is sleeved on the tensioning seat 13241. The tensioning seat 13241 is slidably mounted on the first frame 110 through the slide rail assembly 1325. One end of the compression spring 13242 abuts against the tensioning seat 13241, and the other end abuts against the first frame 110, thereby playing a tensioning role. This design can automatically adjust the position of the conveying driven wheel 1323 relative to the first frame 110 through the elasticity of the compression spring 13242, thereby maintaining the tension of the conveying steel belt 1321, so as to ensure that the multiple clamping members 1312 on the outer side of the steel belt are conveyed smoothly and avoid falling and deviation.

[0112] The existing clamp copper stripping process usually uses nitric acid or sulfuric acid combined with chemical agents such as hydrogen peroxide to strip the copper layer, and the clamp uses a closed clamping part to strip the copper. The contact area of ​​the chemical solution is small, the copper stripping effect is not very good, and copper residue is easily left.

[0113] like Fig.19As shown, the present invention proposes a cathode conductive clamp reverse stripping device 140, comprising a stripping cylinder 141 and a stripping assembly 142 arranged on a first frame 110. The first frame 110 has a stripping station and a conveying station, as well as a conveying track connecting the stripping station and the conveying station. The stripping cylinder 141 and the electroplating cylinder 120 are arranged on opposite sides of a conveying steel belt 1321 along a first direction. The stripping station is arranged in the stripping cylinder 141, and the conveying station is arranged in the electroplating cylinder 120. The conveying track is formed by the conveying steel belt 1321. The clamping member 1312 is movably arranged on the conveying track. When the clamping member 1312 is transferred from the conveying station to the stripping station, the lifting support wheel 13123 of the clamping member 1312 passes through the first After the second guide member 113 rises, the movable clamp 13122 is clamped by the clamping block on the fixed clamp 13121, so that the fixed clamp 13121 and the movable clamp 13122 remain in an open state, and the stripping assembly 142 is inserted into the deplating cylinder 141, and the deplating cylinder 141 is added with stripping liquid, and the clamping member 1312 and the stripping assembly 142 are respectively electrically connected to the power supply system 143, so that the stripping assembly 142 forms a negative electrode, and the clamping member 1312 forms a positive electrode, and the two form a conductive loop through the stripping liquid to strip the electroplated material on the clamping member 1312. The stripping liquid can be set as an iron-based copper plating liquid, thereby replacing the existing stripping using nitric acid or sulfuric acid plus hydrogen peroxide and other liquids.

[0114] When the clamp 1312 and the stripping assembly 142 are powered on simultaneously, the iron-based copper plating solution forms a conductive loop with the charged clamp 1312 and the stripping assembly 142, so that the copper on the clamp 1312 undergoes an electrolytic reaction, and the copper ions stripped from the clamp 1312 enter the solution, some of which are deposited on the surface of the stripping assembly 142 to form a copper layer, and some of which remain in the solution. The stripping process achieves the stripping of the copper on the clamp 1312 and transfers it to the stripping assembly 142, and also promotes the balance of the ion components inside the stripping solution, so that when the clamp 1312 accidentally carries the stripping solution into the next electroplating process, the stripping solution will not corrode the electroplating tank 120, or the stripping solution carried by the clamp 1312 will contaminate the electroplating solution in the electroplating tank 120.

[0115] like Fig. 20 and Fig.21As shown, in one embodiment of the present invention, the horizontal electroplating equipment 100 also includes a cathode conductive conductive device 150, the main components of which include a conductive oil tank component 151, a cathode component 152, a conductive slider component 1313 and a reflux mechanism 153. The conductive oil tank component 151 is filled with conductive oil to form a conductive medium environment. The cathode component 152 is connected to the anode component of the power supply to form a part of the current loop. The conductive slider component 1313 is installed on the clamping mechanism 131 and immersed in the conductive oil in the conductive oil tank component 151. Among them, the conductive slider component 1313 is electrically connected to the cathode component 152, and is responsible for conducting the current from the cathode component 152 to the clamping mechanism 131, so that the circuit board 20 is charged. The reflux mechanism 153 includes an oil collecting tank 1531 and a reflux component 1532, and the oil collecting tank 1531 is used to store conductive oil. The conductive oil tank component 151 is connected to the oil collecting tank 1531 through the reflux component 1532 to form a circulation path for the conductive oil. Specifically, the anode of the power source forms a current loop with the cathode assembly 152. The conductive slider assembly 1313 is immersed in the conductive oil in the conductive oil tank assembly 151 and is electrically connected to the cathode assembly 152. The current is transmitted to the clamping mechanism 131 through the conductive slider assembly 1313, so that the circuit board 20 is charged.

[0116] During operation, the conductive oil in the conductive oil tank assembly 151 may need to be replaced or supplemented due to temperature changes or other factors. The reflux assembly 1532 forms a circulation path between the conductive oil tank assembly 151 and the oil collecting tank 1531. When the conductive oil needs to be replaced or supplemented, the conductive oil in the oil collecting tank 1531 flows into the conductive oil tank assembly 151 through the reflux assembly 1532, and vice versa, thereby realizing the recycling of the conductive oil. This solution uses conductive oil as a medium to transmit current, and uses the reflux mechanism 153 to realize the recycling of conductive oil, ensuring the stable transmission of current and effective management of conductive oil during horizontal electroplating. This method can not only improve the efficiency of electroplating, but also reduce resource waste, improve the reliability and maintenance efficiency of equipment. The core of the whole solution is to use conductive oil as a medium during the electroplating process and realize the recycling of conductive oil through the reflux mechanism 153. This helps to maintain the current stability and conductivity during the electroplating process, while reducing resource consumption and costs by recycling the conductive oil. In addition, this design can also reduce mechanical wear and improve the reliability and service life of the system.

[0117] In addition to the conductive oil tank assembly 151, the cathode assembly 152, the conductive slider assembly 1313 and the reflux mechanism 153, the conductive device 150 also has an oil supply mechanism 154. The main function of the oil supply mechanism 154 is to provide new conductive oil from the outside to the conductive oil tank assembly 151 to ensure the continuous supply of conductive oil and the normal operation of the system. When the conductive oil in the conductive oil tank assembly 151 needs to be replenished or replaced, the oil supply mechanism 154 provides new conductive oil to the conductive oil tank assembly 151. The existence of the oil supply mechanism 154 ensures that the conductive oil tank assembly 151 always has a sufficient supply of conductive oil, and the normal operation of the system can be maintained even in the case of long-term operation or large consumption. The replenishment of conductive oil can maintain the purity of the conductive oil, thereby improving the quality and efficiency of electroplating. The conductive oil is automatically replenished by the oil supply mechanism 154, which reduces the frequency of manual addition of conductive oil, simplifies maintenance work, and improves the reliability and convenience of operation of the equipment.

[0118] The reflux mechanism 153 includes an oil collecting tank 1531, a reflux component 1532, and an overflow component 155. The overflow component 155 has an overflow port. The overflow component 155 is connected to the oil guide tank component through the overflow port. The conductive oil tank component 151 is connected to the oil collecting tank 1531 through the overflow component 155. The conductive oil tank component 151 has a preset volume. When the liquid volume in the conductive oil tank component 151 exceeds the preset volume, the conductive oil in the conductive oil tank component 151 can flow into the oil collecting tank 1531 through the overflow component 155. The overflow component 155 realizes the automatic overflow and circulation of the conductive oil, ensuring that the liquid volume in the conductive oil tank component 151 does not exceed the preset volume limit. It can be understood that the overflow component 155 can be connected to the conductive oil tank component 151 and the oil collecting tank 1531 through a pipeline. The pipeline between the overflow port and the conductive oil tank component 151 ensures that the conductive oil can flow smoothly into the overflow component 155. The pipe between the overflow assembly 155 and the oil collecting tank 1531 ensures that the conductive oil can flow into the oil collecting tank 1531.

[0119] like Figures 22 to 25 As shown, the horizontal electroplating equipment 100 also includes an anode spray device 160 disposed in the electroplating cylinder 120, including an anode mesh plate 161, a spray assembly 162 and a conductive assembly 163. The anode mesh is used to be immersed in an electrolyte containing plating metal ions together with the circuit board 20. The anode mesh forms a potential difference with the circuit board 20 by connecting to a power source, thereby inducing an electrolytic reaction, so that a metal coating is plated on the outer surface of the circuit board 20. The spray assembly 162 is used to spray the reaction solution toward the circuit board 20. The spray assembly 162 has a plurality of spray pipes, and a plurality of nozzles 1621 are provided on the spray pipes. The spray pipes are connected to the reaction solution and the reaction solution is sprayed out through the nozzles 1621. One end of the conductive assembly 163 is connected to the rectifier, and the other end is connected to the anode mesh to supply power to the anode mesh so that it can be electroplated.

[0120] In the embodiment of the present invention, at least two groups of anode spray devices 160 are arranged at intervals along the height direction in the electroplating cylinder 120, and each two groups of anode spray devices 160 form an anode spray device 160 group, and the spray sides in each anode spray device 160 group are arranged oppositely so that the upper and lower sides of the circuit board 20 arranged therein can be electroplated uniformly. In this embodiment, a plurality of anode spray device 160 groups are arranged at intervals along the horizontal direction, and each anode spray device 160 group is closely arranged at the same height to reduce the gap between the device groups, so that the circuit board 20 can be continuously electroplated uninterruptedly during the movement until the electroplating is completed.

[0121] It should be noted that the anode spray device 160 belongs to the anode conductive part of the equipment. After assembly, it is fixed in the electroplating cylinder 120 body, and then the reaction solution is added to the electroplating cylinder 120 body, the anode spray device 160 is immersed in the reaction solution, and the circuit board 20 is set between the anode spray devices 160 through the horizontal electroplating fixture, and then powered on to conduct electricity to electroplate the circuit board 20. Among them, the anode mesh plate 161 is an auxiliary device used in the horizontal electroplating equipment 100 to assist the electroplating process. Its function is to provide a uniform current density distribution for the workpiece during the electroplating process, and to decompose the element particles in the reaction solution and attach them to the circuit board 20.

[0122] See also Fig.25 In one embodiment of the present invention, the anode mesh plate 161 includes: a plate body 1611 and a roller; the plate body 1611 is provided with a plurality of meshes 1612 and a plurality of first spray holes 1613, each mesh 1612 is arranged in a hexagonal shape, and a plurality of meshes 1612 are arranged in a honeycomb array on the plate body 1611, and a plurality of first spray holes 1613 are arranged at intervals on the plate body 1611, and the plate body 1611 has a spray side facing the circuit board 20 and spraying the circuit board 20; the roller is installed on the spray side of the plate body 1611 for contacting the circuit board 20.

[0123] In this embodiment, the plate body 1611 of the anode mesh plate 161 is arranged in a horizontal direction to be parallel to the circuit board 20, so that the circuit board 20 can slide between the plurality of anode mesh plates 161 in a preset direction. The mesh 1612 is used to increase the light transmittance when the circuit board 20 is electroplated. The electroplating anode with good light transmittance can improve the efficiency and quality of the electroplating process. The electroplating anode plays a catalytic role in the electroplating process, and a thin layer of metal or alloy is plated on the metal surface through electrolysis. The light transmittance provided by the mesh 1612 on the anode mesh plate 161 can help the uniform deposition of the metal during the electroplating process. A regular hexagonal mesh 1612 is set on the anode mesh plate 161, and the angular characteristics of the regular hexagon are utilized to allow three adjacent meshes 1612 to be closely arranged, so that the meshes 1612 can be closely arranged in a honeycomb array on the orifice plate body 1611, so as to reduce the obstruction area between adjacent meshes 1612, which helps to evenly irradiate light to the electroplating surface, ensure uniform deposition of the coating, and avoid the problem of local excessive thickness or thinness.

[0124] In addition, compared with other shapes that can be closely arranged, the hexagonal shape has more sides, is closer to a circle, and has greater light transmittance. Compared with an equilateral triangle or a square, it is easier to ensure the light transmittance of each section. The good light transmittance of the mesh 1612 can also reduce the shadow area during the electroplating process, avoid the generation of rough or uneven surfaces, and improve the quality of electroplating. The first spray hole 1613 is used to spray the reaction solution. During electroplating, the outlet of the pipeline through which the reaction solution flows is connected to the first spray hole 1613 to spray the reaction solution through the first spray hole 1613 onto the surface of the circuit board 20. The setting of the first spray hole 1613 can make the spraying range of the reaction solution wider, thereby spraying the solution more evenly on the surface of the circuit board 20, so that the metal ions can be more evenly attached to the surface of the circuit board 20, and then react to generate a more uniform coating. In addition, a plurality of guide wheels 1614 are provided at intervals on the anode mesh plate 161 to prevent the circuit board 20 from rubbing against the surface of the anode mesh plate 161 when the circuit board 20 falls due to factors such as gravity, thereby causing scratches on the circuit board 20 .

[0125] See also Fig.26 and Fig. 27In one embodiment of the present invention, the horizontal electroplating production line 10 further includes a copper dissolving device 400, which is used to dissolve pure copper through a reaction solution and react to generate an electroplating solution. The copper dissolving device 400 includes: a copper dissolving tank 410, a delivery pipeline 413, and an overflow mechanism 414; a partition plate 411 is provided in the copper dissolving tank 410, and the partition plate 411 divides the copper dissolving tank 410 into a first cylinder body 410a and a second cylinder body 410b. The first cylinder body 410a has a liquid inlet for the reaction solution to enter, and a liquid inlet for placing pure copper. The copper particle basket 412 is provided with an overflow portion connecting the first cylinder 410a and the second cylinder 410b; the second cylinder 410b is provided with an overflow port for allowing the electroplating solution to flow out; the delivery pipeline 413 connects the second cylinder 410b with the first cylinder 410a, so that the first cylinder 410a, the overflow portion, the second cylinder 410b and the delivery pipeline 413 are connected to form an internal circulation loop; the overflow mechanism 414 is installed at the overflow port, and the overflow mechanism 414 is used to deliver the liquid in the second cylinder 410b to the electroplating cylinder 120.

[0126] In this embodiment, the copper dissolving tank 410 is used to hold the reaction solution and perform a chemical reaction. The reaction solution and pure copper react in the copper dissolving tank 410 to produce an electroplating solution that can be used for electroplating. The delivery pipeline 413 is used to extract the liquid in the second cylinder 410b to the first cylinder 410a. The liquid in the first cylinder 410a flows into the second cylinder 410b through the overflow portion provided at the top of the partition plate 411. The delivery pipeline 413 cooperates with the overflow portion at the top of the partition plate 411 to realize the internal circulation of the liquid in the copper dissolving tank 410. The reaction stock solution enters the first cylinder 410a through the liquid inlet of the first cylinder 410a. When the solution height in the first cylinder 410a reaches the overflow part, it flows to the second cylinder 410b through the overflow part. The delivery pipe is connected to the bottom of the second cylinder 410b. The liquid overflowing from the first cylinder 410a to the second cylinder 410b flows back to the first cylinder 410a through the delivery pipe, thereby forming an internal circulation inside the copper dissolving cylinder 410. The overflow mechanism 414 is used to circulate the electroplating solution formed by the reaction into the electroplating cylinder 120 by overflow.

[0127] In this embodiment, the entire electroplating circulation system includes a copper dissolving device 400 and an electroplating cylinder 120. The copper dissolving device 400 consumes the reaction solution containing Fe+ from the main tank into the first cylinder body 410a. The reaction solution dissolves pure copper to generate Fe+ and Cu+. An internal circulation system is set in the copper dissolving cylinder 410 body to keep the ion concentration of the liquid in the copper dissolving cylinder 410 body balanced, thereby controlling the ion concentration of the reaction solution transported to the electroplating cylinder 120 to reach a preset standard; the copper dissolving device 400 and the electroplating cylinder 120 continuously transport the reaction solution containing a large amount of Fe+ and the electroplating solution containing a large amount of Cu+ and Fe+ through the back and forth transport of liquid, so that the electroplating cylinder 120 obtains the copper ions required for electroplating.

[0128] The copper dissolving device 400 has a copper particle basket 412. Pure copper is added to the copper particle basket 412. The reaction solution containing Fe+ reacts with the pure copper in the first cylinder 410a to form an electroplating solution containing Fe+ and Cu+, and then flows from the first cylinder 410a into the copper dissolving particle cylinder second cylinder 410b. The first cylinder 410a and the second cylinder 410b realize internal circulation through the internal circulation mechanism. In this embodiment, pure copper is placed in the copper particle basket 412, and then the liquid inlet of the first cylinder 410a draws the Fe+ solution through the power device and injects it into the first cylinder 410a. The pure copper in the first cylinder 410a reacts with the Fe+ in the reaction solution, and the Fe+ continuously corrodes the pure copper to form a large amount of solution containing Fe+ and Cu+ that can be used for electroplating. Then, the overflow mechanism 414 in the second cylinder 410b overflows and transports the electroplating solution containing Fe+ and Cu+ to the electroplating cylinder 120, and the reaction solution flows out in an overflow manner. The liquid can reduce the copper mud from entering the electroplating cylinder 120 and polluting the electroplating cylinder 120. The internal circulation system realized by the internal circulation mechanism of the copper-dissolving cylinder 410 can make the reaction more complete, thereby saving costs, and can balance the ion concentrations in the first cylinder 410a and the second cylinder 410b. The electroplating solution containing Fe+ and Cu+ in the second cylinder 410b is then transported to the electroplating cylinder 120 in an overflow manner. The Cu+ contained in the electroplating solution formed in the copper-dissolving cylinder 410 is the medium required for electroplating the workpiece to be plated. This cycle is set until the copper plating of the workpiece to be plated is completed.

[0129] The technical solution of the present invention is to separate the copper-melting cylinder 410 into a first cylinder 410a and a second cylinder 410b by setting a partition plate 411 in the copper-melting cylinder 410. The partition plate 411 is provided with an overflow portion, so that the liquid in the first cylinder 410a can flow into the second cylinder 410b through the overflow portion. A delivery pipeline 413 is further provided to connect the first cylinder 410a and the second cylinder 410b, so that the liquid in the second cylinder 410b can flow into the first cylinder 410a through the delivery pipeline 413, so that the liquid in the first cylinder 410a and the second cylinder 410b can realize internal circulation flow, so that the liquid in the copper-melting cylinder 410 reacts more fully with the pure copper. It is only necessary to set a copper particle basket 412 in the first cylinder 410a to place the pure copper, without the need to widely arrange a large number of titanium baskets, thereby improving production efficiency and reducing maintenance costs.

[0130] In one embodiment, the copper dissolving device 400 further includes a material lifting mechanism 420, which is installed outside the cylinder body and is used to transport pure copper. Since the copper dissolving device 400 has a relatively high equipment height and the cylinder body has a relatively high liquid level of the reaction solution, in order to avoid leakage, some relatively large nozzles or openings are usually arranged at the top of the device, and pure copper is usually added to the first cylinder body 410a from the top opening of the device. The material lifting mechanism 420 can mechanically lift a relatively large mass of pure copper blocks or pure copper balls to the opening. When pure copper needs to be added, the operator at a high position can directly move the copper blocks on the lifting mechanism to the opening to add them, so that the copper blocks can be added to the copper particle basket 412.

[0131] like Figure 1 and Figure 2 As shown, the horizontal electroplating production line 10 also includes a plate washing device 500 and a plate drying device 600. The number of the plate washing devices 500 can be set to multiple, and can be arranged between the horizontal electroplating equipment 100 and the circuit board 20 feeding device, for removing impurities on the circuit board 20 to avoid the influence of impurities during electroplating, and the plate washing device 500 also needs to be set at the board output end of the horizontal electroplating equipment 100. After the circuit board 20 is electroplated and output, it is necessary to pickle the circuit board 20 to prevent oxidation of the circuit board 20, clean the acid solution remaining on the board surface, and remove the residual light agent on the circuit board 20.

[0132] The dry plate device 600 is disposed on one side of the plate washing device 500 away from the outlet of the electroplating cylinder 120, and is used to dry the circuit board 20 after electroplating and pickling, and remove water from the circuit board 20. At this time, the circuit board 20 needs to be cooled and slowly cooled to prevent excessive temperature differences from affecting the copper surface and even causing stress changes. It is understandable that the dry plate device 600 can be connected to the flipping device 300. If secondary electroplating is required, the cooled circuit board 20 can be directly transported from the dry plate device 600 to the flipping device 300. After the circuit board 20 is turned over, it can be transported to the next horizontal electroplating equipment 100 for secondary electroplating. Further, if Figure 1 As shown, the copper dissolving device 400 is spaced apart from the horizontal electroplating equipment 100, and a passage 30 is provided in the middle for operators to pass through, so as to facilitate the inspection or operation of the equipment on both sides. In addition, conventional equipment such as a photoadditive cylinder, a fire cow and an oil tank cooling cylinder, and a pump device are also provided on the side of the passage 30 away from the horizontal electroplating equipment 100, which will not be elaborated in detail here.

[0133] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A horizontal electroplating production line, characterized in that: include: A horizontal electroplating device, comprising a first frame, an electroplating cylinder and a horizontal electroplating conveying device arranged on the first frame, wherein the two ends of the electroplating cylinder are respectively provided with an inlet and an outlet, and the horizontal electroplating conveying device is used to drive the circuit board entering the electroplating cylinder from the inlet to move toward the outlet; A circuit board loading device is arranged at one end of the electroplating cylinder close to the entrance. The circuit board loading device includes a second frame and a loading and conveying mechanism arranged on the second frame. The loading and conveying mechanism is used for horizontally placing the circuit board and conveying the circuit board along a first direction so that the circuit board entering the electroplating cylinder remains horizontal and moves to the horizontal electroplating conveying device.

2. The horizontal electroplating production line according to claim 1, characterized in that: The circuit board loading device also includes a first positioning mechanism and a first pushing mechanism. The first positioning mechanism is used to position the circuit board on the loading and conveying mechanism to a preset position. The first pushing mechanism is used to drive the circuit board on the loading and conveying mechanism to move along a first direction to adjust the distance between two adjacent circuit boards that are positioned by the first positioning mechanism and arranged along the first direction.

3. The horizontal electroplating production line as claimed in claim 2, characterized in that: The first pushing mechanism is used to push the circuit board positioned by the first positioning mechanism to move along the first direction, so that the distance between the pushed circuit board and the previous circuit board positioned by the first positioning mechanism is a preset value L, and the actual distance value between the two circuit boards is D, and L and D satisfy: L-1.5mm≤D≤L+1.5mm.

4. The horizontal electroplating production line according to any one of claims 1 to 3, characterized in that: The horizontal electroplating production line includes a flipping device and two horizontal electroplating equipment. The flipping device is arranged between the two horizontal electroplating equipment to flip the circuit board after electroplating by one of the horizontal electroplating equipment and convey it to the other horizontal electroplating equipment, so that the horizontal electroplating conveying devices of the two horizontal electroplating equipment can respectively clamp the opposite sides of the circuit board.

5. The horizontal electroplating production line as claimed in claim 4, characterized in that: The plate turning device comprises a third frame, and a feeding mechanism and a turning mechanism arranged on the third frame. The feeding mechanism is used for horizontally placing the circuit board, and the turning mechanism is used for turning over the circuit board on the second horizontal conveying surface.

6. The horizontal electroplating production line as claimed in claim 5, characterized in that: The flipping mechanism includes a driving assembly, a rotating shaft and a clamping assembly. The clamping assembly is arranged on the rotating shaft, and the rotating shaft is drivingly connected to the driving assembly. The clamping assembly is provided with a slot for inserting a circuit board. The driving assembly is used to drive the rotating shaft to rotate so that the clamping assembly drives the circuit board to flip.

7. The horizontal electroplating production line according to claim 6, characterized in that: The feeding mechanism includes a first conveyor line, a second conveyor line, a third conveyor line and a fourth conveyor line. The first conveyor line and the second conveyor line transport circuit boards along a first direction. The flipping mechanism is arranged between the first conveyor line and the second conveyor line to flip the circuit boards on the first conveyor line to the second conveyor line. The fourth conveyor line extends along the conveying direction of the first conveyor line. The third conveyor line is arranged along the second direction to transport the circuit boards on the second conveyor line to the fourth conveyor line. The first direction forms an angle with the second direction.

8. The horizontal electroplating production line according to claim 7, characterized in that: The flipping device also includes a second pushing mechanism and a second positioning mechanism. The second positioning mechanism is arranged on the fourth conveyor line to position the circuit board to a preset position. The second pushing mechanism is used to push the circuit board along the first conveyor line, the second conveyor line, the third conveyor line and the fourth conveyor line in sequence, and push the circuit board positioned by the second positioning mechanism to the horizontal electroplating equipment, and adjust the distance between two adjacent circuit boards positioned by the second positioning mechanism and arranged along the first direction.

9. The horizontal electroplating production line according to claim 1, characterized in that: The horizontal electroplating conveying device also includes a clamping mechanism and an electroplating conveying mechanism. A guide rail is arranged on the first frame in the horizontal direction. The clamping mechanism includes a sliding member and a clamping member connected to each other. The clamping member is arranged on the electroplating conveying mechanism for clamping the circuit board. The sliding member is slidably connected to the guide rail. The electroplating conveying mechanism is used to drive the clamping mechanism to move along the guide rail for transmitting the circuit board.

10. The horizontal electroplating production line according to claim 9, characterized in that: The clamping member comprises: Fixing clip; A movable clip, which is movably mounted on the fixed clip via a connecting assembly, and is used to cooperate with the fixed clip to clamp the circuit board; and The lifting support wheel is arranged on a side of the movable clamp away from the fixed clamp. When the clamping mechanism moves through the electroplating conveying mechanism, the lifting support wheel rises or falls to open or close the movable clamp and the fixed clamp.

11. The horizontal electroplating production line according to claim 10, characterized in that: The horizontal electroplating conveying device further comprises a guide assembly arranged on the first frame, the guide assembly comprises a first guide member and a second guide member, the first guide member is located on a material loading path of the clamping mechanism, the second guide member is located on a material unloading path of the clamping mechanism, and the first guide member and the second guide member both have a guide slope; On the feeding path of the clamping mechanism, when the guide slope is used to guide the movement of the clamping mechanism, it abuts against the lifting support wheel, so that the distance between the first clamping assembly and the second clamping assembly is increased, so as to clamp the circuit board; On the unloading path of the clamping mechanism, the lifting support wheel abuts when the guide slope is used to guide the movement of the clamping mechanism, so that the distance between the first clamping component and the second clamping component is increased to facilitate the circuit board to fall off.

12. The horizontal electroplating production line according to claim 9, characterized in that: The electroplating conveying mechanism comprises: A conveyor steel belt, wherein the conveyor steel belt is slidably arranged on the first frame, and the clamping mechanism is arranged on the conveyor steel belt; A driving mechanism, wherein the driving mechanism comprises a conveying driving wheel and a conveying driven wheel, wherein the conveying driving wheel and the conveying driven wheel are respectively arranged at two ends of the first frame, and the conveying driving wheel and the conveying driven wheel are connected by the conveying steel belt to form a closed-loop transmission to achieve continuous conveying; A tensioning mechanism is elastically connected to the conveyor steel belt and the first frame. When the conveyor steel belt slides on the first frame, the tensioning mechanism undergoes elastic deformation to change the horizontal distance between the first frame and the conveyor steel belt to tension the conveyor steel belt.

13. The horizontal electroplating production line according to claim 12, characterized in that: The horizontal electroplating equipment also includes a cathode conductive clamp reverse stripping device, which includes a deplating cylinder and a stripping assembly. The deplating cylinder is arranged on the first frame, and the conveyor steel belt is used to convey the clamping mechanism into the deplating cylinder so that the clamping mechanism and the stripping assembly form a conductive loop to strip the electroplating material on the clamping mechanism.

14. The horizontal electroplating production line according to claim 9, characterized in that: The horizontal electroplating equipment further comprises a conductive device, wherein the conductive device comprises: A conductive oil tank assembly, wherein the conductive oil tank assembly is provided with conductive oil; A cathode assembly, the cathode assembly being used to be connected to an anode member of a power source to generate current; A conductive slider assembly is arranged in the clamping mechanism, the conductive slider assembly is arranged in the conductive oil tank assembly and immersed in the conductive oil, the conductive slider assembly is electrically connected to the cathode assembly, and is used to transmit current to the horizontal electroplating fixture, so that the circuit board on the horizontal electroplating fixture is charged; A reflux mechanism, wherein the reflux mechanism comprises an oil collecting trough and a reflux component, wherein the oil collecting trough is used to store conductive oil, and the conductive oil trough component is connected to the oil collecting trough through the reflux component to form a circulation passage for mutually circulating the conductive oil in the oil collecting trough and the conductive oil in the conductive oil trough component.

15. The horizontal electroplating production line according to claim 14, characterized in that: The conductive device also includes an oil supply mechanism, and the reflux mechanism also includes an overflow assembly. The oil supply mechanism is connected to the conductive oil tank assembly to provide conductive oil to the oil guide tank assembly. The overflow assembly has an overflow port. The overflow assembly is connected to the oil guide tank assembly through the overflow port. The conductive oil tank assembly is connected to the oil collecting tank through the overflow assembly. The conductive oil tank assembly has a preset volume. When the liquid volume in the conductive oil tank assembly exceeds the preset volume, the conductive oil in the conductive oil tank assembly can flow into the oil collecting tank through the overflow assembly.

16. The horizontal electroplating production line according to claim 1, characterized in that: The horizontal electroplating equipment also includes an anode spray device disposed in the electroplating cylinder, and the anode spray device includes: Anode mesh plate; An anode mesh, detachably mounted on the anode mesh plate; A spray assembly is installed on a side of the anode mesh away from the anode mesh plate; A conductive component, through which the anode grid is connected to a rectifier.

17. The horizontal electroplating production line according to claim 16, characterized in that: At least two groups of the anode spray devices are installed at intervals in the electroplating cylinder, and the spray sides of the two groups of the anode spray devices are arranged opposite to each other. A plating cavity for accommodating circuit board electroplating is formed between any two groups of the anode spray devices arranged opposite to each other.

18. The horizontal electroplating production line according to claim 17, characterized in that: The anode mesh plate comprises: An orifice plate body is provided with a plurality of meshes and a plurality of first spray holes, each of the meshes is arranged in a hexagonal shape, a plurality of the meshes are arranged in a honeycomb array on the body, a plurality of the first spray holes are arranged at intervals on the orifice plate body, and the orifice plate body has a spray side facing the workpiece to be plated and spraying the workpiece to be plated; and A guide wheel is installed on the spray side of the orifice plate body and is used for abutting against the workpiece to be plated.

19. The horizontal electroplating production line according to claim 1, characterized in that: The horizontal electroplating production line also includes a copper dissolving device, and the copper dissolving device includes: A copper dissolving tank, wherein a partition plate is provided in the copper dissolving tank, wherein the partition plate divides the tank body into a first tank body and a second tank body, wherein the first tank body has a liquid inlet for a reaction stock solution to enter, and a copper particle basket for placing pure copper; an overflow portion for connecting the first tank body with the second tank body is provided on the upper portion of the partition plate; and an overflow port for allowing the electroplating solution to flow out is provided in the second tank body; a delivery pipeline, connecting the second cylinder body with the first cylinder body, so that the first cylinder body, the overflow portion, the second cylinder body and the delivery pipeline are connected to form an internal circulation loop; and An overflow mechanism is installed at the overflow port, and the overflow mechanism is used to send the liquid in the second cylinder body to the electroplating cylinder.

20. The horizontal electroplating production line according to claim 1, characterized in that: The horizontal electroplating production line also includes a plate washing device and a plate drying device, wherein the plate washing device is arranged at the entrance of the electroplating cylinder and between the circuit board feeding device and the electroplating cylinder, and / or the plate washing device is arranged at the exit of the electroplating cylinder; The plate drying device is arranged at the outlet of the electroplating cylinder and is located at a side of the plate washing device away from the electroplating cylinder, so as to remove water from the circuit board after electroplating and cleaning by the plate washing device.

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