Pneumatic on-off and back-suction integrated valve for semiconductor quantitative glue coating and working method thereof

Abstract

The present invention belongs to the field of valve technology, and specifically relates to a pneumatic on-off and back-suction integrated valve for semiconductor quantitative glue coating and a working method thereof. The pneumatic on-off and back-suction integrated valve for semiconductor quantitative glue coating comprises: a valve body, in which a flow channel is opened, and a back-suction diaphragm and an on-off diaphragm are respectively arranged above and below the flow channel; a lower cavity bottom plate, which is connected to the lower end of the valve body, and a lower piston connected to the on-off diaphragm is arranged inside, and the lower piston drives the on-off diaphragm to rise through elastic force to cut off the flow channel; a cylinder body, which is connected to the upper end of the valve body, and an upper piston connected to the back-suction diaphragm is arranged inside. The pneumatic on-off and back-suction integrated valve for semiconductor quantitative glue coating is provided with a chamber below the lower piston. When the on-off diaphragm descends to open the flow channel, the lower piston descends to squeeze the gas in the chamber below the lower piston into the annular chamber below the on-off diaphragm, thereby buffering the on-off diaphragm to reduce the impact force.

Description

Technical Field

[0001] The present invention belongs to the field of valve technology, and specifically relates to a lifting valve, and more particularly to a pneumatic on-off and back-suction integrated valve for quantitative gluing of semiconductors and a working method thereof. Background Art

[0002] Wet cleaning refers to cleaning wafers with chemical solutions to remove some metal impurities to prevent these impurities from causing problems during high-temperature processes, affecting the operation of process equipment and the yield rate after production.

[0003] After the wet cleaning of the wafer is completed, in order to prevent excess chemical solution from dripping, a suck-back valve is needed to suck back the chemical solution to prevent contamination.

[0004] In the related art, when the existing back-suction valve is opened, the delivered liquid will instantly enter the flow channel and impact on the on-off diaphragm, so that the on-off diaphragm will be subjected to a large impact force and easily damaged.

[0005] Therefore, how to solve the technical problem that the on-off diaphragm is easily damaged by the impact force at the moment of opening is urgently needed to be solved by those skilled in the art. Summary of the invention

[0006] The embodiments of the present disclosure at least provide a pneumatic on-off and back-suction integrated valve for semiconductor quantitative glue coating and a working method thereof.

[0007] In a first aspect, an embodiment of the present disclosure provides a pneumatic on-off and back-suction integrated valve for quantitative coating of semiconductors, comprising: a valve body, in which a flow channel is opened, and a back-suction diaphragm and an on-off diaphragm are respectively arranged above and below the flow channel; a lower cavity bottom plate, connected to the lower end of the valve body, and provided with a lower piston connected to the on-off diaphragm inside, the lower piston drives the on-off diaphragm to rise by elastic force to cut off the flow channel; a cylinder body, connected to the upper end of the valve body, and provided with an upper piston connected to the back-suction diaphragm inside, the upper piston drives the back-suction diaphragm to descend by increasing the air pressure, and after resisting with the on-off diaphragm, it causes it to follow and descend to open the flow channel; wherein at the moment the flow channel opens, the on-off diaphragm drives the lower piston to descend, and squeezes the gas below the lower piston into the annular chamber below the on-off diaphragm to buffer the impact force of the liquid on the on-off diaphragm at the moment the flow channel opens.

[0008] In an optional embodiment, a guide cylinder is provided in the bottom plate of the lower cavity; the lower end of the lower piston is inserted in the guide cylinder, and the outer periphery of the guide cylinder is sleeved with a first spring for resisting the lower piston, so that an extrusion chamber is left between the lower end of the lower piston and the bottom of the guide cylinder; wherein an air passage connecting the annular chamber and the extrusion chamber is opened in the lower piston, and at the moment the flow passage is opened, the lower piston descends to squeeze the gas in the extrusion chamber into the annular chamber.

[0009] In an optional embodiment, a sliding block is provided in the airway; a pressure chamber is formed in the sliding block, an air inlet connected to the extrusion chamber is formed on one side of the pressure chamber, and an air outlet is formed on the top of the pressure chamber; at the moment when the flow channel opens, the lower piston descends to pressurize the gas in the extrusion chamber, and the increase in pressure pushes the sliding block back to the first threshold value, so that the air outlet is connected to the annular chamber, that is, the annular chamber is inflated.

[0010] In an optional embodiment, the air channel is provided with a first exhaust port, and the bottom of the pressurized chamber is provided with a second exhaust port; during the process of opening the flow channel, the lower piston continuously pressurizes the gas in the extrusion chamber, and pushes the sliding block back to a second threshold value due to the increase in pressure, so that the second exhaust port is connected to the first exhaust port to relieve pressure; during the process of opening the flow channel, when the on-off diaphragm is damaged, the lower piston continuously pressurizes the gas in the extrusion chamber, and pushes the sliding block back to maintain the first threshold value due to the increase in pressure, so as to prevent the lower piston from descending.

[0011] In an optional embodiment, a stopper is provided on the lower surface of the sliding block and follows the sliding block to retreat, and the stopper extends out of the lower piston from the first exhaust port; when the sliding block retreats to a first threshold value, the stopper is located directly above the guide cylinder; when the sliding block retreats to a second threshold value, the stopper is misaligned with the guide cylinder.

[0012] In an optional embodiment, the width of the first exhaust port is greater than that of the second exhaust port; during the retreat of the sliding block, the block moves synchronously with the sliding block in the first exhaust port; a second spring is provided in the airway to push the sliding block to return to its original position; a limiting protrusion is provided on the upper surface of the sliding block, and a limiting groove matching the limiting protrusion is provided on the inner wall of the airway.

[0013] In an optional embodiment, the lower piston and the guide cylinder are clearance-matched so that after the lower piston drives the on-off diaphragm to rise and cut off the flow channel, the extrusion chamber returns to normal pressure.

[0014] In an optional embodiment, the return suction diaphragm 12 is located between the cylinder body 2 and the valve body 1, and is hard-sealed by the side groove barb; between the lower cavity bottom plate 3 of the on-off diaphragm 13 and the valve body 1, a press-fit seal is achieved by the cooperation of the "Z"-shaped side and the sealing ring; the return suction diaphragm 12 and the on-off diaphragm 13 both adopt a double-cone coupling structure.

[0015] In an optional embodiment, an annular retaining ring is provided in the cylinder body, and the annular retaining ring is located above the return suction diaphragm; wherein the annular retaining ring is provided with an inclined surface toward the return suction diaphragm side, and when the return suction diaphragm rises, the return suction diaphragm and the inclined surface are abutted; the middle part of the return suction diaphragm is arc-shaped, and is bent toward the annular retaining ring side; the middle part of the return suction diaphragm includes: a first arc segment, a second arc segment and a third arc segment connected in sequence; the outer end portion of the first arc segment is connected to the lifting column of the return suction diaphragm, and the outer end portion of the third arc segment is connected to the barb of the card slot on the side of the return suction diaphragm.

[0016] In a second aspect, the disclosed embodiment also provides a working method of a pneumatic on-off and back-suction integrated valve for semiconductor quantitative glue coating, which includes: driving the on-off diaphragm to rise by the lower piston to cut off the flow channel; driving the back-suction diaphragm to descend by the upper piston to push the on-off diaphragm to open and cut off the flow channel; squeezing the gas below the lower piston into the annular chamber below the on-off diaphragm by descending the on-off diaphragm to buffer the impact force of the liquid on the on-off diaphragm at the moment of flow channel opening; at the moment of flow channel opening, the lower piston descends to pressurize the gas in the extrusion chamber, and pushes the sliding block back to a first threshold value by the increase in pressure, so that the air outlet is connected to the annular chamber, that is, inflating the annular chamber; in the process of opening the flow channel, the lower piston continuously pressurizes the gas in the extrusion chamber, and pushes the sliding block back to a second threshold value by the increase in pressure, so that the second exhaust port is connected to the first exhaust port to relieve pressure; in the process of opening the flow channel, when the on-off diaphragm is damaged, the lower piston continuously pressurizes the gas in the extrusion chamber, and pushes the sliding block back to the first threshold value by the increase in pressure to prevent the lower piston from descending.

[0017] The beneficial effect of the present invention is that the pneumatic on-off and back-suction integrated valve for semiconductor quantitative glue coating and its working method are provided with a chamber below the lower piston. When the on-off diaphragm descends to open the flow channel, the lower piston descends to squeeze the gas in the chamber below the lower piston into the annular chamber below the on-off diaphragm, thereby buffering the on-off diaphragm and reducing the impact force it receives.

[0018] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0019] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, this article specifically cites preferred embodiments and provides detailed descriptions as follows in conjunction with the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 A schematic diagram of the structure of a pneumatic on-off and back-suction integrated valve for semiconductor quantitative glue coating provided by an embodiment of the present disclosure in a flow channel closed state;

[0022] Figure 2 A schematic diagram of the structure of a pneumatic on-off and back-suction integrated valve for semiconductor quantitative glue coating provided by an embodiment of the present disclosure in a flow channel open state;

[0023] Figure 3 A schematic diagram of the structure of a bottom plate of a lower cavity provided in an embodiment of the present disclosure;

[0024] Figure 4 A schematic diagram of the structure of a lower piston provided in an embodiment of the present disclosure;

[0025] Figure 5 A schematic diagram of the structure of a stopper and a guide cylinder provided in an embodiment of the present disclosure;

[0026] Figure 6 A schematic structural diagram of an annular retaining ring provided in an embodiment of the present disclosure.

[0027] In the figure:

[0028] Valve body 1, flow channel 11, back-suction diaphragm 12, first arc segment 121, second arc segment 122, third arc segment 123, slot barb 124, lifting column 125, on-off diaphragm 13, annular chamber 131, "Z"-shaped side 132, sealing ring 133;

[0029] Cylinder body 2, upper piston 21, upper space 211, third spring 212, annular retaining ring 22;

[0030] The lower cavity bottom plate 3, the lower piston 31, the air passage 311, the first exhaust port 312, the limiting groove 313, the second spring 314, the guide cylinder 32, the extrusion chamber 321, and the first spring 33;

[0031] The sliding block 4 , the pressure chamber 41 , the air inlet 42 , the air outlet 43 , the second air outlet 44 , the stopper 45 , and the limiting protrusion 46 . DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, in the drawings, the thickness of the components may be exaggerated or reduced in order to effectively describe the technical content.

[0034] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0035] like Figure 1 , Figure 2 As shown, at least one embodiment provides a pneumatic on-off back-suction integrated valve for semiconductor quantitative glue coating, which includes: a valve body 1, in which a flow channel 11 is opened, and a back-suction diaphragm 12 and an on-off diaphragm 13 are respectively arranged above and below the flow channel 11; a lower cavity bottom plate 3, which is connected to the lower end of the valve body 1, and a lower piston 31 connected to the on-off diaphragm 13 is arranged inside, and the lower piston 31 drives the on-off diaphragm 13 to rise through elastic force to cut off the flow channel 11; a cylinder body 2, which is connected to the upper end of the valve body 1, and an upper piston 21 connected to the back-suction diaphragm 12 is arranged inside, and the upper piston 21 drives the back-suction diaphragm 12 to descend through the increase of air pressure, and after resisting with the on-off diaphragm 13, it makes it follow the decline to open the flow channel 11.

[0036] Specifically, the back-suction diaphragm 12 is pressed between the valve body 1 and the cylinder body 2, and the on-off diaphragm 13 is pressed between the valve body 1 and the bottom plate 3 of the lower cavity. When the flow channel 11 needs to be opened, the space 211 above the upper piston 21 in the cylinder body 2 is inflated and pressurized, so that the upper piston 21 descends and drives the back-suction diaphragm 12 to push the on-off diaphragm 13 to descend to open the flow channel 11; when the flow channel 11 needs to be closed, the upper piston 21 is driven to rise by the third spring 212 under the upper piston 21, thereby driving the back-suction diaphragm 12 to reset, that is, the on-off diaphragm 13 closes the flow channel 11, and at the same time, the back-suction diaphragm 12 continues to rise for a distance after being separated from the on-off diaphragm 13, so that the flow channel 11 below the on-off diaphragm 13 generates negative pressure to prevent backflow.

[0037] The inventors have found that at the moment when the on-off diaphragm 13 opens the flow channel 11 , the transported liquid will instantly enter the flow channel 11 and impact the on-off diaphragm 13 , causing the on-off diaphragm 13 to be subjected to a large impact force.

[0038] Therefore, in order to solve the technical problems found by the inventors in the process of testing the pneumatic on-off and back-suction integrated valve, Figure 3 As shown, this embodiment provides a solution specifically for the above-mentioned problem, which is as follows: a chamber is provided below the lower piston 31, and when the on-off diaphragm 13 descends to open the flow channel 11, the lower piston 31 descends to squeeze the gas in the chamber below the lower piston 31 into the annular chamber 131 below the on-off diaphragm 13, thereby buffering the on-off diaphragm 13 to reduce the impact force.

[0039] Specifically, a guide cylinder 32 is provided in the bottom plate 3 of the lower cavity; the lower end of the lower piston 31 is inserted in the guide cylinder 32, and the outer periphery of the guide cylinder 32 is sleeved with a first spring 33 for resisting the lower piston 31, so that an extrusion chamber 321 is left between the lower end of the lower piston 31 and the bottom of the guide cylinder 32; wherein an air passage 311 connecting the annular chamber 131 and the extrusion chamber 321 is opened in the lower piston 31, and at the moment when the flow channel 11 is opened, the lower piston 31 descends to squeeze the gas in the extrusion chamber 321 into the annular chamber 131.

[0040] Furthermore, after solving the above-mentioned problems, the inventors further tested the above-mentioned pneumatic on-off and back-suction integrated valve and found that when the lower piston 31 continues to descend, the gas in the extrusion chamber 321 will continue to fill into the annular chamber 131, causing the pressure therein to continue to increase. However, when the pressure in the annular chamber 131 is very high, the on-off diaphragm 13 will be pulled by the gas below and the liquid above, thereby accelerating the damage to the on-off diaphragm 13.

[0041] Therefore, in order to solve the above problems, Figure 4 As shown, in this embodiment, a sliding block 4 is provided in the airway 311, and the airway 311 is opened by the sliding block 4 so that the extrusion chamber 321 can inflate the annular chamber 131. At the same time, when the air pressure in the annular chamber 131 exceeds a threshold value, the pressure relief port of the airway 311 is opened by the sliding block 4 to prevent the annular chamber 131 from overpressure.

[0042] Specifically, the sliding block 4 is provided with a pressure chamber 41, and an air inlet 42 is provided on one side of the pressure chamber 41. The air inlet 42 is connected with the extrusion chamber 321 through the air channel 311, and an air outlet 43 is provided on the top of the pressure chamber 41. When the flow channel 11 is not opened, the air outlet 43 is blocked; at the moment when the flow channel 11 is opened, the lower piston 31 descends to pressurize the gas in the extrusion chamber 321, and the sliding block 4 is pushed back to the first threshold value through the increase in pressure. At this time, the air outlet 43 is connected with the annular chamber 131, that is, the annular chamber 131 is inflated.

[0043] Specifically, the air channel 311 is provided with a first exhaust port 312, and the bottom of the pressurized chamber 41 is provided with a second exhaust port 44. When the air pressure in the annular chamber 131 does not exceed a threshold value, the second exhaust port 44 is blocked; during the opening of the flow channel 11, the lower piston 31 continuously pressurizes and squeezes the gas in the chamber 321, and pushes the sliding block 4 backward by increasing the pressure. When the air pressure in the annular chamber 131 exceeds a threshold value, the sliding block 4 retreats to a second threshold value. At this time, the second exhaust port 44 is connected to the first exhaust port 312 to relieve pressure.

[0044] After solving the above technical problems, the inventors discovered a third technical problem through further testing, namely, the on-off diaphragm 13 may be damaged, and this damage will not cause liquid leakage when the valve is not opened, making it difficult to detect in advance.

[0045] Therefore, in order to solve the above problems, Figure 4 , Figure 5 As shown, in this embodiment, by providing a stopper 45 that moves with the sliding block 4, the stopper 45 will release the limit only when the pressure in the extrusion chamber 321 approaches the threshold value, so that the lower piston 31 can descend to the maximum depth.

[0046] Specifically, during the opening process of the flow channel 11, when the on-off diaphragm 13 is damaged, the air pressure in the annular chamber 131 will not exceed the threshold due to air leakage, so the sliding block 4 will only retreat to the first threshold at most, and cannot retreat to the second threshold (the first threshold is less than the second threshold). At this time, the stopper 45 will not release the limit, and the lower piston 31 cannot descend to the maximum depth.

[0047] Specifically, a stopper 45 is provided on the lower surface of the sliding block 4 and follows the sliding block 4 to retreat, and the stopper 45 extends out of the lower piston 31 from the first exhaust port 312; when the sliding block 4 retreats to the first threshold, the stopper 45 is located directly above the guide cylinder 32; when the sliding block 4 retreats to the second threshold, the stopper 45 is misaligned with the guide cylinder 32.

[0048] In some embodiments, the width of the first exhaust port 312 is greater than the width of the second exhaust port 44 ; during the retreat of the sliding block 4 , the stopper 45 moves synchronously with the sliding block 4 in the first exhaust port 312 .

[0049] In some embodiments, a second spring 314 is provided in the airway 311 for pushing the sliding block 4 to return to its original position; a limiting protrusion 46 is provided on the upper surface of the sliding block 4 , and a limiting groove 313 adapted to the limiting protrusion 46 is provided on the inner wall of the airway 311 .

[0050] In some embodiments, the lower piston 31 and the guide cylinder 32 are clearance-matched so that after the lower piston 31 drives the on-off diaphragm 13 to rise and cut off the flow channel 11 , the extrusion chamber 321 returns to normal pressure.

[0051] like Figure 1 As shown, in some embodiments, the suction diaphragm 12 is located between the cylinder body 2 and the valve body 1 and is hard-sealed by the side groove barbs 124 .

[0052] like Figure 3 As shown, in some embodiments, a press-fit seal is achieved between the bottom plate 3 of the lower cavity of the on-off diaphragm 13 and the valve body 1 by the cooperation of the "Z"-shaped side 132 and the sealing ring 133; the back suction diaphragm 12 and the on-off diaphragm 13 both adopt a double-cone coupling structure.

[0053] In this embodiment, the "Z"-shaped side 132 of the on-off diaphragm 13, plus the pre-pressure of the sealing ring 133, can ensure the compression sealing of the three directions, thereby achieving the effect of multi-pass sealing; the return suction diaphragm 12 and the on-off diaphragm 13 both adopt a double-cone coupling structure, which not only ensures the life of the center coaxiality, but also ensures the separation and independence of the stroke difference.

[0054] like Figure 6 As shown, in some embodiments, an annular retaining ring 22 is provided in the cylinder body 2, and the annular retaining ring 22 is located above the return suction diaphragm 12; wherein the annular retaining ring 22 is provided with an inclined surface 221 facing the return suction diaphragm 12 side; when the return suction diaphragm 12 rises, the return suction diaphragm 12 and the inclined surface 221 are against each other.

[0055] In this embodiment, when the return suction diaphragm 12 rises, in order to prevent the liquid from pulling the return suction diaphragm 12 , the return suction diaphragm 12 is supported by the annular retaining ring 22 during the rising process, thereby reducing the pulling force of the liquid on the return suction diaphragm 12 .

[0056] In some embodiments, the sealing structure of the on-off diaphragm 13 and the valve body 1 adopts a bevel + sharp angle design to ensure that when the flow channel 11 is cut off, the pressure in the inlet direction cannot cause the on-off diaphragm 13 to shift, thereby ensuring the sealing performance and life.

[0057] In some embodiments, both the cylinder body 2 and the lower cavity bottom plate 3 are provided with negative pressure prevention holes, which can adjust the internal pressure when the cavity volume changes, and can effectively ensure the back-suction accuracy.

[0058] In some embodiments, the middle portion of the return suction diaphragm 12 is arc-shaped and is bent toward the side of the annular retaining ring 22; the middle portion of the return suction diaphragm 12 includes: a first arc segment 121, a second arc segment 122 and a third arc segment 123 connected in sequence; the outer end portion of the first arc segment 121 is connected to the lifting column 125 of the return suction diaphragm 12, and the outer end portion of the third arc segment 123 is connected to the card slot hook 124 on the side of the return suction diaphragm 12.

[0059] In this embodiment, when the flow channel 11 is closed, the lifting column 125 rises, and at this time the lifting column 125 drives the first arc segment 121 and the second arc segment 122 to extend upward. After the flow channel 11 is closed, the lifting column 125 continues to rise, driving the first arc segment 121 and the second arc segment 122 to continue to extend, so that a siphon negative pressure is formed in the area where the flow channel 11 is connected to the outlet; at the same time, the first arc segment 121, the second arc segment 122 and the third arc segment 123 form a triangular support, and when the siphon negative pressure is formed, the arc will not deform in the reverse direction, thereby effectively ensuring the space of the negative pressure chamber.

[0060] At least one embodiment also provides a working method of a pneumatic on-off and back-suction integrated valve for semiconductor quantitative glue coating, which includes: driving the on-off diaphragm 13 to rise by the lower piston 31 to cut off the flow channel 11; driving the back-suction diaphragm 12 to descend by the upper piston 21 to push the on-off diaphragm 13 to open and cut off the flow channel 11; squeezing the gas under the lower piston 31 into the annular chamber 131 under the on-off diaphragm 13 by descending the on-off diaphragm 13 to buffer the impact force of the liquid on the on-off diaphragm 13 at the moment the flow channel 11 opens; at the moment the flow channel 11 opens, the lower piston 31 descends to pressurize the gas in the extrusion chamber 321, and through the pressure The increase in pressure pushes the sliding block 4 back to the first threshold value, so that the air outlet 43 is connected with the annular chamber 131, that is, the annular chamber 131 is inflated; during the opening process of the flow channel 11, the lower piston 31 continuously pressurizes the gas in the extrusion chamber 321, and pushes the sliding block 4 back to the second threshold value through the increase in pressure, so that the second exhaust port 44 is connected with the first exhaust port 312 to relieve pressure; during the opening process of the flow channel 11, when the on-off diaphragm 13 is damaged, the lower piston 31 continuously pressurizes the gas in the extrusion chamber 321, and pushes the sliding block 4 back to maintain the first threshold value through the increase in pressure to prevent the lower piston 31 from descending.

[0061] Regarding the specific structure and implementation process of the pneumatic on-off and back-suction integrated valve used for semiconductor quantitative glue coating, please refer to the relevant discussion in the above embodiments, which will not be repeated here.

[0062] In summary, the pneumatic on-off and back-suction integrated valve for semiconductor quantitative glue coating and its working method are provided with a chamber below the lower piston 31. When the on-off diaphragm 13 descends to open the flow channel 11, the lower piston 31 descends to squeeze the gas in the chamber below the lower piston 31 into the annular chamber 131 below the on-off diaphragm 13, thereby buffering the on-off diaphragm 13 and reducing the impact force.

[0063] Herein, when it is mentioned that a first component is located on a second component, this may mean that the first component may be directly formed on the second component, or a third component may be interposed between the first component and the second component.

[0064] In this article, when an element or layer is referred to as being "located on," "engaged to," "connected to," "attached to," or "coupled to" another element or layer, it may be directly located on, engaged, connected, attached to, or coupled to another element or layer, or there may be intermediate elements or layers. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," "directly attached to," or "directly coupled to" another element or layer, there may be no intermediate elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0065] Herein, example embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of..." modify the entire list of elements when following a list of elements, rather than modifying individual elements in the list. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0066] The terms used herein are only used to describe specific exemplary configurations and are not intended to be limited. As used herein, the singular articles "one", "an" and "the" may also be intended to include plural forms, unless it is clearly indicated above that this is not the case. The terms "comprise", "include" and "have" are inclusive, and therefore specify the presence of features, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components and / or combinations thereof. The method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the specific order discussed or shown, unless specifically identified as an execution order. Additional or alternative steps may be adopted.

[0067] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Therefore, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, so that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. On the contrary, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0068] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0069] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply an order or sequence when used in this document unless explicitly indicated above. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.

[0070] Spatially relative terms, such as "inside", "outside", "below", "below", "down", "above", "on", etc., may be used herein to facilitate description of the relationship of one element or feature to another element or feature as illustrated in the figure. In addition to the orientation depicted in the figure, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is turned over, the elements described as "below" or "below" other elements or features will be oriented to be "above" other elements or features. Therefore, the example term "below" can cover the orientation above and below. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0071] In the above discussion, unless otherwise stated, the terms "about," "approximately," "substantially," etc., when used to describe a numerical value, mean a variation of + / - 10% of the value.

[0072] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A pneumatic on-off and back-suction integrated valve for semiconductor quantitative glue coating, characterized in that: include: A valve body (1) is provided with a flow channel (11) therein, and a suction diaphragm (12) and a stop diaphragm (13) are respectively provided above and below the flow channel (11); The bottom plate (3) of the lower cavity is connected to the lower end of the valve body (1) and is provided with a lower piston (31) connected to the on-off diaphragm (13) inside, wherein the lower piston (31) drives the on-off diaphragm (13) to rise by elastic force to cut off the flow channel (11); The cylinder body (2) is connected to the upper end of the valve body (1) and is provided with an upper piston (21) connected to the suction diaphragm (12) inside. The upper piston (21) drives the suction diaphragm (12) downward by increasing the air pressure, and abuts against the on-off diaphragm (13) to cause it to follow the downward movement to open the flow channel (11); wherein At the moment when the flow channel (11) is opened, the on-off diaphragm (13) drives the lower piston (31) to descend, and squeezes the gas below the lower piston (31) into the annular chamber (131) below the on-off diaphragm (13), so as to buffer the impact force of the liquid on the on-off diaphragm (13) at the moment when the flow channel (11) is opened; A guide cylinder (32) is provided in the bottom plate (3) of the lower cavity; The lower end of the lower piston (31) is inserted into the guide cylinder (32), and the outer periphery of the guide cylinder (32) is sleeved with a first spring (33) for resisting the lower piston (31), so that an extrusion chamber (321) is left between the lower end of the lower piston (31) and the bottom of the guide cylinder (32); wherein The lower piston (31) is provided with an air passage (311) connecting the annular chamber (131) and the extrusion chamber (321); when the flow passage (11) is opened, the lower piston (31) descends to squeeze the gas in the extrusion chamber (321) into the annular chamber (131); A sliding block (4) is provided in the airway (311); The sliding block (4) is provided with a pressure chamber (41), one side of the pressure chamber (41) is provided with an air inlet (42) communicating with the extrusion chamber (321), and the top of the pressure chamber (41) is provided with an air outlet (43); At the moment when the flow channel (11) opens, the lower piston (31) descends to pressurize the gas in the extrusion chamber (321), and the increase in pressure pushes the sliding block (4) back to the first threshold value, so that the gas outlet (43) is connected to the annular chamber (131), that is, the annular chamber (131) is inflated.

2. The pneumatic on-off and back-suction integrated valve for semiconductor quantitative glue coating according to claim 1 is characterized in that: The air passage (311) is provided with a first exhaust port (312), and the bottom of the pressure chamber (41) is provided with a second exhaust port (44); During the process of opening the flow channel (11), the lower piston (31) continuously pressurizes the gas in the extrusion chamber (321), and pushes the sliding block (4) back to a second threshold value through the increase in pressure, so that the second exhaust port (44) is connected to the first exhaust port (312) to release the pressure; During the process of opening the flow channel (11), when the on-off diaphragm (13) is damaged, the lower piston (31) continues to pressurize the gas in the extrusion chamber (321), and the sliding block (4) is pushed back by the increase in pressure to maintain the first threshold value, so as to prevent the lower piston (31) from descending.

3. The pneumatic on-off and back-suction integrated valve for semiconductor quantitative glue coating as claimed in claim 2, characterized in that: A stopper (45) is provided on the lower surface of the sliding block (4) and moves backwards following the sliding block (4), and the stopper (45) extends out of the lower piston (31) through the first exhaust port (312); in When the sliding block (4) retreats to a first threshold, the stop block (45) is located directly above the guide cylinder (32); When the sliding block (4) retreats to the second threshold, the stop block (45) is misaligned with the guide cylinder (32).

4. The pneumatic on-off and back-suction integrated valve for semiconductor quantitative glue coating as claimed in claim 3, characterized in that: The width of the first exhaust port (312) is greater than the width of the second exhaust port (44); in During the backward movement of the sliding block (4), the stopper (45) moves synchronously with the sliding block (4) in the first exhaust port (312); A second spring (314) is arranged in the air passage (311) and is used to push the sliding block (4) to return to its original position. A limiting protrusion (46) is provided on the upper surface of the sliding block (4), and a limiting groove (313) adapted to the limiting protrusion (46) is provided on the inner wall of the airway (311).

5. The pneumatic on-off and back-suction integrated valve for semiconductor quantitative glue coating as claimed in claim 4, characterized in that: The lower piston (31) and the guide cylinder (32) are clearance-matched so that after the lower piston (31) drives the on-off diaphragm (13) to rise and cut off the flow channel (11), the extrusion chamber (321) is restored to normal pressure.

6. The pneumatic on-off and back-suction integrated valve for semiconductor quantitative glue coating according to claim 1, characterized in that: The suction back diaphragm (12) is located between the cylinder body (2) and the valve body (1), and is hard-sealed by a side groove barb (124); The on-off diaphragm (13) is located between the bottom plate (3) of the lower cavity and the valve body (1), and is pressed and sealed by the cooperation of the "Z"-shaped side edge (132) and the sealing ring (133); The return suction diaphragm (12) and the on-off diaphragm (13) both adopt a double-cone coupling structure.

7. The pneumatic on-off and back-suction integrated valve for semiconductor quantitative glue coating according to claim 1, characterized in that: An annular retaining ring (22) is arranged in the cylinder body (2), and the annular retaining ring (22) is located above the back-suction diaphragm (12); wherein The annular retaining ring (22) is provided with an inclined surface (221) on the side facing the return suction diaphragm (12), and when the return suction diaphragm (12) rises, the return suction diaphragm (12) abuts against the inclined surface (221); The middle portion of the re-absorption membrane (12) is arc-shaped and is bent toward the annular retaining ring (22); The middle portion of the re-absorption membrane (12) comprises: a first arc segment (121), a second arc segment (122), and a third arc segment (123) which are connected in sequence; The outer end of the first arc segment (121) is connected to the lifting column (125) of the return suction membrane (12), and the outer end of the third arc segment (123) is connected to the clamping groove barb (124) on the side of the return suction membrane (12).

8. A method for operating the pneumatic on-off and back-suction integrated valve for semiconductor quantitative glue coating as claimed in claim 2, characterized in that: include: The on-off diaphragm (13) is driven to rise by the lower piston (31) to cut off the flow channel (11); The upper piston (21) drives the suction diaphragm (12) to descend so as to push the on-off diaphragm (13) to open the shutoff flow channel (11); By lowering the on-off diaphragm (13), the gas below the lower piston (31) is squeezed into the annular chamber (131) below the on-off diaphragm (13), so as to buffer the impact force of the liquid on the on-off diaphragm (13) when the flow channel (11) is opened; At the moment when the flow channel (11) is opened, the lower piston (31) descends to pressurize the gas in the extrusion chamber (321), and the increase in pressure pushes the sliding block (4) back to the first threshold value, so that the gas outlet (43) is connected to the annular chamber (131), that is, the annular chamber (131) is inflated; During the process of opening the flow channel (11), the lower piston (31) continuously pressurizes the gas in the extrusion chamber (321), and pushes the sliding block (4) back to a second threshold value through the increase in pressure, so that the second exhaust port (44) is connected to the first exhaust port (312) to release the pressure; During the process of opening the flow channel (11), when the on-off diaphragm (13) is damaged, the lower piston (31) continues to pressurize the gas in the extrusion chamber (321), and the sliding block (4) is pushed back by the increase in pressure to maintain the first threshold value, so as to prevent the lower piston (31) from descending.

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