A motor controller PCBA temperature rise test device

Abstract

The present invention relates to a motor controller PCBA temperature rise test device, which includes a mold temperature controller and a water-cooled heat sink. The mold temperature controller is provided with a water outlet pipe and a water return pipe connected to the water-cooled heat sink at the bottom, and the water return pipe is arranged above the water outlet pipe. A bottom shell tooling is arranged on the top of the water-cooled heat sink. A PCBA is arranged above the bottom shell tooling, and a thermal conductive adhesive is filled between the bottom shell tooling and the PCBA. A thermal resistance plate is arranged between the PCBA and the water-cooled heat sink. Coolant is stored in the mold temperature controller. The coolant flows into the water-cooled heat sink through the water outlet pipe and completes heat exchange with the water-cooled heat sink, and then returns to the mold temperature controller through the water return pipe to complete the circulation of the water circuit. The present invention saves the temperature rise test under various heat exchange coefficients simulated under the premise of shell and cover production, shortens the controller development time and saves costs.

Description

Technical Field

[0001] The invention relates to the technical field of motor temperature rise testing, in particular to a motor controller PCBA temperature rise testing device. Background Art

[0002] The motor controller is an integrated circuit that actively controls the motor to run in the set direction, speed, protection strategy, etc. When the motor controller is working, some components generate heat and the temperature rises due to power consumption issues. The existence of this temperature rise will cause the performance and life of the components to decrease, and even directly cause irreversible damage to the components, ultimately resulting in a reduction in the service life of the controller.

[0003] The motor controller in the prior art is composed of a bottom shell, a PCBA, a cover and other components, wherein the PCBA is the main heat dissipation component, the bottom shell is the main heat dissipation component, and the cover has the function of sealing and protection.

[0004] Temperature rise testing is a necessary task in the design and verification process of the motor controller. Through temperature rise testing, we can verify and improve the heating design of the PCBA, and also calibrate the over-temperature protection point of the motor controller.

[0005] When doing a temperature rise test, we usually need all the components such as PCBA, bottom shell, and cover, and assemble them into an assembly. In some projects, due to mold progress, structural parts such as bottom shell and cover cannot be provided in time. In some pre-research projects, due to cost reasons, structural parts such as bottom shell and cover will not even be developed. At this time, we cannot complete the temperature rise test in time and accurately, so a motor controller PCBA temperature rise test device of the present invention is proposed. Summary of the invention

[0006] In view of the above problems, the present invention provides a motor controller PCBA temperature rise test device which can simulate temperature rise test without manufacturing a shell and a cover, shorten development time and save costs.

[0007] The technical solution adopted by the present invention to solve the above technical problems is: a motor controller PCBA temperature rise test device, including a mold temperature controller and a water-cooled heat sink, the lower part of the mold temperature controller is provided with a water outlet pipe and a water return pipe connected to the water-cooled heat sink, and the water return pipe is arranged above the water outlet pipe, the top of the water-cooled heat sink is provided with a bottom shell tooling, the top of the bottom shell tooling is provided with a PCBA, and the bottom shell tooling and the PCBA are filled with thermal conductive glue, and a thermal resistance plate is provided between the PCBA and the water-cooled heat sink, and the mold temperature controller stores coolant, the coolant flows into the water-cooled heat sink through the water outlet pipe and completes heat exchange with the water-cooled heat sink, and then returns to the mold temperature controller through the water return pipe to complete the circulation of the water circuit.

[0008] Preferably, the PCBA includes a PCB board and a MOS tube, an MCU, an electrolytic capacitor and an inductor which are all soldered on the PCB board.

[0009] Preferably, the water-cooled heat sink includes a heat sink and a water channel sealing plate, and the water channel sealing plate is sealed with the heat sink by setting a sealing ring, and two ends of one side of the heat sink are respectively provided with a water inlet connected to a water outlet pipe and a water outlet connected to a return pipe, and water pipe joints are provided at the water inlet and the water outlet, and four rubber foot pads are provided at the bottom of the water channel sealing plate.

[0010] Preferably, the heat sink comprises a sealing ring mounting groove, a flow channel wall and a plurality of cover plate mounting threaded holes, the flow channel wall forms an annular flow channel, and a plurality of flow columns are evenly distributed in the flow channel.

[0011] Preferably, there are several thermal resistance plates, each of which is made of 1060 aluminum plate or copper plate and has a thickness of 2 to 4 mm.

[0012] Preferably, an acrylic cover is provided outside the water-cooled heat sink.

[0013] Preferably, the bottom shell tooling is fixedly connected to the water-cooled heat sink by screws.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] The present invention can set aside the bottom shell and the cover of the motor controller and other structural parts during the development and verification stage of the motor controller, and perform temperature rise test on the PCBA alone without waiting for the structural parts to be molded, thereby greatly shortening the controller development time; at the same time, in some pre-research projects, the temperature rise test device of the present invention can be used to save the design and sample production of the shell and the cover, simulate the temperature rise test under various heat exchange coefficients, shorten the development time and save sample costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of the present invention;

[0017] Figure 2 This is a schematic diagram of the connection between the water-cooling heat sink and the PCBA in the present invention;

[0018] Figure 3 It is a schematic diagram of the PCBA structure in the present invention;

[0019] Figure 4 It is a schematic diagram of the decomposition of the water-cooling heat sink structure in the present invention;

[0020] Figure 5 It is a schematic diagram of the heat dissipation plate structure in the present invention;

[0021] Figure 6 It is a schematic diagram of the decomposition of multiple thermal resistance plates stacked in the present invention. DETAILED DESCRIPTION

[0022] The following will be combined Figure 1-6 The present invention is described in detail. The exemplary embodiments and descriptions of the present invention are used to explain the present invention but are not intended to limit the present invention.

[0023] A motor controller PCBA temperature rise test device comprises a mold temperature controller 11 and a water-cooled heat sink 15. A water outlet pipe 13 and a water return pipe 12 connected to the water-cooled heat sink are arranged at the bottom of the mold temperature controller, and the water return pipe is arranged above the water outlet pipe. An acrylic cover 14 is arranged outside the water-cooled heat sink. A bottom shell tooling 16 is arranged on the top of the water-cooled heat sink and fixed by screws 18. A PCBA 17 is arranged above the bottom shell tooling, and thermal conductive glue is filled between the bottom shell tooling and the PCBA. Meanwhile, a thermal resistance plate is arranged between the PCBA and the water-cooled heat sink. Coolant is stored in the mold temperature controller. The coolant flows into the water-cooled heat sink through the water outlet pipe and completes heat exchange with the water-cooled heat sink, and then returns to the mold temperature controller through the water return pipe to complete the circulation of the water circuit.

[0024] Specifically, the PCBA includes a PCB board 401 and a MOS tube 402, an MCU 403, an electrolytic capacitor 404, and an inductor 405 all welded on the PCB board; the water-cooled heat sink includes a heat sink 504 and a water channel sealing plate 502, and the water channel sealing plate is sealed and connected to the heat sink by setting a sealing ring 503. The two ends of one side of the heat sink are respectively provided with a water inlet 605 connected to the water outlet pipe and a water outlet 606 connected to the return pipe, and water pipe joints 505 are provided at the water inlet and the water outlet, and four rubber foot pads 501 are provided at the bottom of the water channel sealing plate; the heat sink includes a sealing ring mounting groove 601, a flow channel wall 603 and several cover plate mounting threaded holes 604, the flow channel wall forms an annular flow channel, and several flow columns 602 are evenly distributed in the flow channel.

[0025] During implementation, Figure 1 , Figure 2 As shown, the mold temperature controller 11 outputs a coolant of a fixed temperature through the outlet pipe 13 to the water cooling radiator 15. The temperature of the coolant can simulate the ambient temperature in the actual environment. The coolant flows through the water cooling radiator, completes the heat exchange with the water cooling radiator, and finally returns to the mold temperature controller through the return pipe 12 to complete the water circulation. Figure 3 As shown, the heat generated by the heat generating components MOS tube 402, MCU 403, electrolytic capacitor 404, inductor 405, etc. on the PCBA during operation is heat exchanged through the bottom shell tooling 16, thermal resistance plate 19 and water cooling heat sink 15, and finally brought back to the mold temperature controller by the coolant to form a heat cycle. Figure 2As shown, the thermal resistance plate 19 plays a role in adjusting the heat exchange coefficient. During assembly, the heat exchange coefficient from the PCBA to the coolant can be changed by changing the number of thermal resistance plates, thereby simulating the heat exchange coefficient of the controller bottom shell. Figure 1 The acrylic cover 14 in the middle makes the entire PCBA in a relatively sealed environment, playing the role of sealing the cover of the simulated controller. Figure 2 The function of the bottom shell fixture 16 is to support the PCBA and conduct heat between the PCBA and the thermal resistance plate. In the PCBA tests of different projects and structures, this part needs to be designed and processed separately to match the external dimensions of different PCBAs. All other components in this device are universal components and can be applied to the tests of all projects.

[0026] like Figure 4 As shown, the water cooling heat sink is composed of heat sink 504, water channel sealing plate 502, sealing ring 503, rubber foot pad 501, water pipe joint 505 and other parts. The heat sink and water channel sealing plate are machined from 6061 aluminum. The main functions of the heat sink are as follows: Figure 5 As shown, the coolant enters from the water channel inlet, flows along the water channel through the flow column, fully contacts the flow column and completes heat exchange, and finally flows out from the water channel outlet. The sealing ring is made of EPDM rubber, which can effectively prevent corrosion by the coolant while playing a sealing role.

[0027] like Figure 6 As shown, the thermal resistance plate is processed from 1060 aluminum plate or copper plate, and is a flat plate with a thickness of 2 to 4 mm. In the temperature rise test device, different numbers of thermal resistance plates can be installed and superimposed according to the data obtained by simulating the bottom shell of the controller or according to empirical calculations, so as to obtain the required equivalent heat exchange coefficient and simulate the heat dissipation conditions of the bottom shell of the actual controller.

[0028] This device can set aside the bottom shell and cover of the motor controller and other structural parts during the motor controller development and verification stage, and perform temperature rise test on the PCBA alone, without waiting for the structural parts to be molded, thereby greatly shortening the controller development time. At the same time, in some pre-research projects, the use of the temperature rise test device of the present invention can save the design and sample production of the shell and the cover, simulate the temperature rise test under various heat exchange coefficients, shorten the development time and save sample costs.

[0029] The technical solutions provided by the embodiments of the present invention are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the embodiments of the present invention. The description of the above embodiments is only applicable to help understand the principles of the embodiments of the present invention. At the same time, for those skilled in the art, according to the embodiments of the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A motor controller PCBA temperature rise test device, characterized in that: The invention comprises a mold temperature controller (11) and a water-cooled heat sink (15); a water outlet pipe (13) and a water return pipe (12) which are connected to the water-cooled heat sink are provided at the bottom of the mold temperature controller, and the water return pipe is provided above the water outlet pipe; a bottom shell tooling (16) is provided at the top of the water-cooled heat sink; a PCBA (17) is provided above the bottom shell tooling, and a thermal conductive adhesive is filled between the bottom shell tooling and the PCBA; a thermal resistance plate (19) is provided between the bottom shell tooling and the water-cooled heat sink; a coolant is stored in the mold temperature controller; the coolant flows into the water-cooled heat sink through the water outlet pipe and completes heat exchange with the water-cooled heat sink, and then returns to the mold temperature controller through the water return pipe to complete the circulation of the water circuit; and the heat exchange coefficient of the bottom shell of the controller is simulated by changing the number of thermal resistance plates.

2. According to claim 1, the motor controller PCBA temperature rise test device is characterized in that: The PCBA comprises a PCB board (401) and a MOS tube (402), an MCU (403), an electrolytic capacitor (404), and an inductor (405) all of which are welded on the PCB board.

3. The motor controller PCBA temperature rise test device according to claim 1, characterized in that: The water-cooled heat sink comprises a heat sink (504) and a water channel sealing plate (502); the water channel sealing plate is sealedly connected to the heat sink by providing a sealing ring (503); a water inlet (605) connected to a water outlet pipe and a water outlet (606) connected to a water return pipe are respectively provided at two ends of one side of the heat sink; a water pipe joint (505) is provided at the water inlet and the water outlet; and four rubber pads (501) are provided at the bottom of the water channel sealing plate.

4. The motor controller PCBA temperature rise test device according to claim 1, characterized in that: The heat sink comprises a sealing ring mounting groove (601), a flow channel wall (603) and a plurality of cover plate mounting threaded holes (604); the flow channel wall forms an annular flow channel, and a plurality of flow columns (602) are evenly distributed in the flow channel.

5. The motor controller PCBA temperature rise test device according to claim 1, characterized in that: There are several thermal resistance plates, each of which is made of 1060 aluminum plate or copper plate and has a thickness of 2 to 4 mm.

6. The motor controller PCBA temperature rise test device according to claim 1, characterized in that: An acrylic cover (14) is provided outside the water-cooling heat sink.

7. The motor controller PCBA temperature rise test device according to claim 1, characterized in that: The bottom shell tooling (16) is fixedly connected to the water-cooling heat sink via screws (18).

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