Semiconductor chip aging detection system

Abstract

The present application relates to the technical field of semiconductor chip detection equipment, and in particular to a semiconductor chip aging detection system, including a chip fixing mechanism, a chip constant temperature mechanism, a dehumidification mechanism, and a control device; the chip constant temperature mechanism includes a plurality of temperature control tubes arranged above and below the chip aging test seat, and the temperature control tubes are provided with a temperature control tube walkway on the aging test seat; the control device is used to control the speed of the water pump motor of the temperature control water pump according to the temperature difference detected by the outlet temperature sensor and the inlet temperature sensor on both sides of the chip fixing mechanism to ensure constant temperature. The design of the chip fixing mechanism increases the number of semiconductor chip aging tests at the same time, but does not reduce the constant temperature effect during the semiconductor chip aging test, and is highly practical.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor chip detection equipment, and in particular to a semiconductor chip aging detection system. Background Art

[0002] The statements in this section merely provide background technical information related to the present application and do not necessarily constitute prior art.

[0003] Semiconductor chip aging test is a key link to ensure chip quality. Temperature control is generally required during chip aging test. During chip aging test, the test temperature must be kept stable. If the test temperature fluctuates greatly, the test data will be unstable, affecting the accuracy of the test results.

[0004] In the prior art, the test temperature is maintained during chip testing by providing a constant temperature environment for the chip. However, the chip itself is relatively small in size. When there are many chips for aging test and a large constant temperature environment, it is difficult to ensure that the temperature is constant at every location in the environment through conventional temperature control methods. At the same time, when the number of chips produced is large, a large number of chips need to be aged. If the number of chips aged at the same time is large, it is very difficult to ensure the constant temperature effect for each chip.

[0005] In view of this, it is necessary to provide a semiconductor chip aging detection system to solve the above technical problems. Summary of the invention

[0006] Based on this, in order to solve the above technical problems, the present application provides a semiconductor chip aging detection system.

[0007] The technical solution adopted by this application to solve the problems existing in the prior art is:

[0008] This application proposes a semiconductor chip aging detection system, including:

[0009] The chip fixing mechanism is fixedly arranged in the heat preservation box, and comprises a bottom supporting plate, an upper pressing plate and at least one middle supporting plate arranged therebetween; a plurality of aging test seats for accommodating semiconductor chips are fixedly arranged above the bottom supporting plate and the middle supporting plate;

[0010] The chip constant temperature mechanism comprises a plurality of temperature control tubes fixedly arranged below the upper pressure plate and below the middle support plate, wherein the inlet end of the temperature control tube is connected to the constant temperature water tank pipeline through a temperature control water pump, and the outlet end of the temperature control tube is connected to the constant temperature water tank pipeline; the inlet end and the outlet end of the temperature control tube are respectively fixedly provided with an inlet temperature sensor and an outlet temperature sensor; an electric heater is arranged in the constant temperature water tank;

[0011] The dehumidification mechanism comprises air outlets and a drying mechanism respectively arranged on both sides of the heat preservation box, wherein the drying mechanism comprises a drying box and a drying fan; a desiccant is fixedly arranged in the drying box, one end of the drying box is connected to the heat preservation box, and the other end is connected to the drying fan;

[0012] The control device is electrically connected to the semiconductor chip, the temperature-controlled water pump, the inlet temperature sensor, the outlet temperature sensor, the electric heater, the drying fan and the visual display screen respectively; it is used to analyze the aging test data of the semiconductor chip and display it through the visual display screen; it is used to control the water temperature of the constant temperature water tank through the electric heater according to the temperature of the inlet temperature sensor; it is used to control the speed of the water pump motor of the temperature-controlled water pump according to the temperature difference detected by the outlet temperature sensor and the inlet temperature sensor.

[0013] Preferably,

[0014] The bottom support plate is fixedly arranged at the bottom of the heat preservation box; the bottom support plate, the middle support plate and the upper pressure plate are fixedly arranged in parallel with each other through the support members;

[0015] A temperature control pipe walkway which matches the temperature control pipes one by one is formed on the top of the aging test seat.

[0016] Preferably,

[0017] An inlet upper temperature sensor and an outlet upper temperature sensor are respectively fixed to the outer side of the tube wall at both ends of the temperature control tube below the upper pressure plate;

[0018] An inlet temperature sensor and an outlet temperature sensor are respectively fixed to the outside of the tube wall at both ends of the temperature control tube below the middle support plate;

[0019] The temperature control water pump includes an upper pressure plate temperature control water pump and a middle bearing plate temperature control water pump; the temperature control pipe under the upper pressure plate is connected to the constant temperature water tank pipeline through the upper pressure plate temperature control water pump; the temperature control pipe under the middle bearing plate is connected to the constant temperature water tank pipeline through the middle bearing plate temperature control water pump;

[0020] When the temperature difference M1 between the outlet temperature sensor and the inlet temperature sensor exceeds the set threshold value K, the control device controls the water pump motor of the upper pressure plate temperature control water pump to increase the speed setting value;

[0021] When the temperature difference M2 between the outlet temperature sensor and the inlet temperature sensor exceeds a set threshold value K, the control device controls the water pump motor of the middle bearing plate temperature control water pump to increase the speed setting value.

[0022] Preferably,

[0023] The outlet end of the temperature control tube is connected to one end of the heat dissipation tube through a straight joint, and the other end of the heat dissipation tube is connected to the constant temperature water tank;

[0024] A cooling box is fixedly arranged on one side of the heat preservation box at the outlet end of the temperature control pipe, and the heat dissipation pipe passes through the cooling box and then passes through the cooling box, and the end of the heat dissipation pipe enters the constant temperature water tank;

[0025] A heat dissipation fan is fixedly arranged on one side of the cooling box, and a plurality of heat dissipation holes are opened on the side of the cooling box opposite to the heat dissipation fan;

[0026] The heat dissipation fan is electrically connected to the control device.

[0027] Preferably,

[0028] The temperature control pipe includes an upper temperature control pipe and a middle temperature control pipe;

[0029] The inlet ends of the temperature control pipes fixed below the upper pressure plate are connected to the upper water inlet pipe through straight joints; the upper water inlet pipe is connected to the thermostatic water tank pipeline through the upper temperature control main pipe, and the upper pressure plate temperature control water pump is provided on the upper temperature control main pipe;

[0030] The inlet ends of the temperature control pipes fixed below the middle bearing plate are connected to the middle water inlet pipe through straight joints; the middle water inlet pipe is connected to the constant temperature water tank pipeline through the middle temperature control main pipe, and the middle bearing plate temperature control water pump is provided on the middle temperature control main pipe.

[0031] Preferably,

[0032] When the temperature value of the outlet temperature sensor or the outlet temperature sensor exceeds the chip aging temperature setting value T, the control device controls the cooling fan to rotate.

[0033] Preferably,

[0034] When the temperature value of the inlet upper temperature sensor or the inlet middle temperature sensor is lower than the chip aging temperature setting value T, the control device controls the electric heater to be powered on for heating.

[0035] Preferably,

[0036] The aging test seat comprises a lower fixing member and an upper fixing member; a semiconductor chip is arranged between the lower fixing member and the upper fixing member;

[0037] The lower fixing member includes a support plate, support blocks are fixedly provided on both sides of the support plate, and a fixing block is fixedly provided on the outer side of the support block, and a plurality of needle grooves matching with the pins of the semiconductor chip are opened on the support block; an electrical connecting piece is provided in the needle groove, and the electrical connecting piece includes a horizontal connecting piece, and one end of the horizontal connecting piece is electrically connected with the control device after passing through the fixing block; the other end of the horizontal connecting piece is connected with the elastic connecting piece and the elastic abutting piece in sequence to form an elastic connecting head matching with the pins of the semiconductor chip; the elastic connecting piece is bent downward and rearward to form an acute angle with the horizontal connecting piece; the end of the elastic connecting piece is slidably connected with the bottom of the needle groove and then bent back to be connected with one end of the elastic abutting piece, and the other end of the elastic abutting piece is slidably connected with the bottom of the horizontal connecting piece;

[0038] A socket is fixedly provided on the top of each fixing block, a notch is provided in the middle of the socket, and two arc-shaped spring pieces cooperating with each other are fixedly provided on both sides of the notch;

[0039] The upper fixing member includes a fixing cover, a receiving space is provided at the lower middle part of the fixing cover, and the receiving space matches with the top of the semiconductor chip; a plurality of needle strips matching with the needle grooves are fixedly provided at the lower part of the fixing cover on both sides of the receiving space; a temperature control pipe walkway matching with the temperature control pipe is provided above the fixing cover;

[0040] Insertion strips matching the socket are fixedly arranged at the lower sides of the upper fixing piece.

[0041] Preferably,

[0042] The support member comprises a fixing plate fixed on the bottom support plate, a supporting rod fixedly arranged above the fixing plate, and a plurality of sleeves slidingly sleeved in the middle of the supporting rod;

[0043] A mounting head is provided on the top of the support rod, and a nut is connected to the external thread of the mounting head.

[0044] Preferably,

[0045] The constant temperature water tank is arranged below the heat preservation box body, a control box is provided in the middle of the heat preservation box body, a control device is provided in the control box, an openable middle cabinet door is provided outside the control box, and a visual display screen is provided on the middle cabinet door;

[0046] A heat insulation board is fixedly arranged above the control box, a bottom plate is fixedly arranged above the heat insulation board, and a chip fixing mechanism is arranged above the bottom plate.

[0047] Compared with the prior art, the beneficial effects of this application are:

[0048] 1. By designing a temperature control pipe walkway above the semiconductor chip test seat and using the temperature control pipe above the semiconductor chip test seat to press the semiconductor chip itself, on the one hand, the semiconductor chip itself is better fixed, and on the other hand, the semiconductor chip can maintain a constant temperature.

[0049] 2. By detecting the temperature at both ends of the temperature control tube, the speed of the temperature control water pump is increased when the temperature difference is large. If the temperature at the outlet is large, the speed of the temperature control water pump is increased to speed up the water flow in the temperature control tube to achieve cooling of the semiconductor chip; if the temperature at the outlet is low, the speed of the temperature control water pump is increased to speed up the water flow in the temperature control tube to achieve heating of the semiconductor chip. That is, by increasing the speed of the temperature control water pump, the semiconductor chip can be kept at a constant temperature regardless of whether the temperature at the outlet of the temperature control tube is high or low.

[0050] 3. The design of the chip fixing mechanism increases the number of semiconductor chip aging tests at the same time, but does not reduce the constant temperature effect during the semiconductor chip aging test, and is highly practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The drawings in the specification, which constitute a part of the present application, are used to provide further understanding of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute improper limitations on the present application.

[0052] Figure 1 This is a schematic diagram of the overall structure of an embodiment of a semiconductor chip aging detection system of the present application;

[0053] Figure 2 for Figure 1 Schematic diagram of the overall structure after removing the buckle cover;

[0054] Figure 3 for Figure 2 A partial enlarged view of the middle A area;

[0055] Figure 4 for Figure 2 Another angle diagram of the overall structure;

[0056] Figure 5 This is a schematic diagram of the overall structure of a buckle cover in another embodiment of the semiconductor chip aging detection system of the present application;

[0057] Figure 6 for Figure 1 Schematic diagram of the overall structure of the chip fixing mechanism;

[0058] Figure 7 for Figure 6 Schematic diagram of the overall structure of the support member of the middle chip fixing mechanism;

[0059] Figure 8 for Figure 1 Schematic diagram of the overall structure of the middle chip fixing mechanism after removing the upper pressure plate;

[0060] Fig. 9 for Figure 8 Schematic diagram of the overall structure of the test seat;

[0061] Fig.10 for Fig. 9 Schematic diagram of the explosion of the internal structure of the test seat;

[0062] Fig.11 for Fig.10 Schematic diagram of the overall structure of the middle and lower fixing parts;

[0063] Fig.12 for Fig.11 A schematic diagram of a partial cross-sectional structure of the middle and lower fixing parts;

[0064] Fig.13 for Fig.12 A partial enlarged view of the middle B area;

[0065] Fig.14 for Fig.11 Schematic diagram of the overall structure of the middle and upper fixings.

[0066] In the figure:

[0067] 1. Buckle cover, 100. Installation slot, 1000. Top plate, 1001. Handle, 1002. Limit plate, 1003. Side plate, 1004. Air outlet, 1005. Installation strip, 1006. Drying box, 1007. Drying fan,

[0068] 2. Control box,

[0069] 3. Cooling box, 30. Cooling fan, 31. Cooling hole,

[0070] 4. Constant temperature water tank, 5. Middle cabinet door,

[0071] 6. Chip fixing mechanism, 60. Upper pressure plate, 61. Middle support plate, 62. Bottom support plate,

[0072] 63, support member, 630, fixing plate, 631, support rod, 632, sleeve, 633, mounting head, 634, nut,

[0073] 64, temperature control tube, 640, outlet temperature sensor, 641, first outlet temperature sensor, 642, second outlet temperature sensor,

[0074] 65. Aging test socket, 650. Semiconductor chip,

[0075] 651, lower fixing part, 6510, supporting plate, 6512, supporting block, 6513, needle groove, 6514, slot, 6515, connecting piece, 6516, horizontal connecting piece, 6517, socket, 6518, arc-shaped spring piece, 6519, elastic connecting piece, 6520, elastic abutting piece, 6521, fixing block,

[0076] 652, upper fixing part, 6522, accommodation space, 6523, needle strip, 6524, fixing cover, 6525, heat dissipation seam, 6526, insert strip, 6527, temperature control pipe walkway,

[0077] 7. Temperature controlled water pump,

[0078] 8. Temperature control pipe, 80. Upper water inlet pipe, 81. Middle water inlet pipe, 82. Lower water inlet pipe,

[0079] 9. heat dissipation pipe, 10. heat preservation box, 11. bottom plate, 12. heat insulation board, 13. straight-through joint. DETAILED DESCRIPTION

[0080] The present application is further described below in conjunction with the accompanying drawings and embodiments.

[0081] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present disclosure. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0082] In the present disclosure, terms such as "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "side", "bottom" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. They are relational words determined only for the convenience of describing the structural relationships of the various parts or elements of the present disclosure, and do not specifically refer to any part or element in the present disclosure and should not be understood as limitations on the present disclosure.

[0083] The present application provides a semiconductor chip aging detection system, including a chip fixing mechanism 6, a chip constant temperature mechanism, a dehumidification mechanism and a control device;

[0084] The chip fixing mechanism 6 is fixedly arranged in the heat preservation box 10, and includes a bottom support plate 62 and an upper pressure plate 60 and at least one middle support plate 61 arranged therebetween; a plurality of aging test seats 65 are fixedly arranged above the bottom support plate 62 and the middle support plate 61, and a semiconductor chip 650 is arranged in the aging test seat 65; Figure 6 The number of the middle carrier plates 61 may be one or more, depending on the number of semiconductor chips 650 that need to be tested for aging. When the number of semiconductor chips 650 that need to be tested is large, the number of the middle carrier plates 61 can be increased;

[0085] Also refer to Figure 1 , Figure 2 as well as Figure 6The chip constant temperature mechanism includes a plurality of temperature control tubes 64 fixedly arranged below the upper pressure plate 60 and below the middle support plate 61. The inlet end of the temperature control tube 64 is connected to the constant temperature water tank 4 pipeline through the temperature control water pump 7, and the outlet end of the temperature control tube 64 is connected to the constant temperature water tank 4 pipeline; the inlet end and the outlet end of the temperature control tube 64 are respectively fixedly provided with an inlet temperature sensor and an outlet temperature sensor; the constant temperature water tank 4 is provided with an electric heater;

[0086] refer to Figure 5 The dehumidification mechanism includes air outlet holes 1004 and a drying mechanism respectively arranged on both sides of the heat preservation box 10, and the drying mechanism includes a drying box 1006 and a drying fan 1007; a desiccant is fixedly arranged in the drying box 1006, one end of the drying box 1006 is connected to the heat preservation box 10, and the other end is connected to the drying fan 1007. The function of the dehumidification mechanism is to dehumidify the environment of the aging test of the semiconductor chip 650; the purpose of the dehumidification mechanism: during the chip aging test, when the chip is subjected to a high-temperature aging test, the temperature of the high-temperature aging test is generally greater than 85°C. If the ambient temperature is high, a large amount of water vapor will be generated, and the dehumidifier can discharge the water vapor generated in the aging test. In some embodiments, there are also requirements for the humidity of the aging test, and the dehumidification mechanism can also be used to adjust the humidity in the aging environment. This is a common technical means used by people in this field and will not be elaborated. In some embodiments, the air outlet holes 1004 and the drying mechanism are respectively arranged on both sides of the buckle cover 1, refer to Figure 5 as well as Figure 3 The two sides of the buckle cover 1 are fixedly connected to the two side panels 1003 respectively, and the air outlet 1004 and the drying mechanism are respectively arranged on the two side panels 1003; a handle 1001 is fixedly provided on the top of the buckle cover 1, and the buckle cover 1 together with the drying mechanism can be lifted up by lifting the handle 1001 to facilitate the replacement of the desiccant in the drying mechanism; installation strips 1005 are fixedly provided on both sides of the side panels 1003, and an installation groove 100 cooperating with the installation strip 1005 is opened on the insulation box body 10, so that when the buckle cover 1 is installed, the sealing effect of the buckle cover 1 and the insulation box body 10 is good.

[0087] The control device is electrically connected to the semiconductor chip 650, the temperature control water pump 7, the inlet temperature sensor, the outlet temperature sensor, the electric heater, the drying fan 1007 and the visual display screen respectively; it is used to analyze the aging test data of the semiconductor chip and display it on the visual display screen; it is used to control the water temperature of the constant temperature water tank 4 through the electric heater according to the temperature of the inlet temperature sensor; it is used to control the speed of the water pump motor of the temperature control water pump 7 according to the temperature difference detected by the outlet temperature sensor and the inlet temperature sensor. The bottom support plate 62 is fixedly arranged at the bottom of the heat preservation box 10; the bottom support plate 62, the middle support plate 61 and the upper pressure plate 60 are fixedly arranged in parallel with each other through the support member 63; refer to Fig.10A temperature control pipe walkway 6527 that matches the temperature control pipe 64 one by one is formed on the top of the aging test seat 65.

[0088] refer to Figure 6 , the tube walls at both ends of the temperature control tube 64 under the upper platen 60 are respectively fixed with an inlet upper temperature sensor and an outlet upper temperature sensor 640; the tube walls at both ends of the temperature control tube 64 under the middle support plate 61 are respectively fixed with an inlet middle temperature sensor and an outlet middle temperature sensor; the temperature control water pump 7 includes an upper platen temperature control water pump and a middle support plate temperature control water pump; the temperature control tube 64 under the upper platen 60 is connected to the thermostatic water tank 4 pipeline through the upper platen temperature control water pump; the temperature control tube 64 under the middle support plate 61 is connected to the thermostatic water tank 4 pipeline through the middle support plate temperature control water pump;

[0089] When the temperature difference M1 between the outlet temperature sensor and the inlet temperature sensor exceeds the set threshold K, the control device controls the water pump motor of the upper pressure plate temperature control water pump to increase the speed setting value; when the temperature difference M2 between the outlet temperature sensor and the inlet temperature sensor exceeds the set threshold K, the control device controls the water pump motor of the middle plate temperature control water pump to increase the speed setting value.

[0090] exist Figure 6 In the embodiment, the number of the middle bearing plates 61 is 2, and the outlet temperature sensor includes a first outlet temperature sensor 641 and a second outlet temperature sensor 642 corresponding to each middle bearing plate 61. The first outlet temperature sensor 641 corresponds to the first inlet temperature sensor on the inlet side of the middle bearing plate 61, and the second outlet temperature sensor 642 corresponds to the second inlet temperature sensor on the inlet side of the middle bearing plate 61. Accordingly, each group of middle bearing plates 61 corresponds to a middle bearing plate temperature control water pump. The purpose of this design is to detect the temperature of the temperature control pipes 64 at both ends of each group of middle bearing plates 61. When the temperature difference between the two ends is too large, the temperature is controlled by the corresponding middle bearing plate temperature control water pump.

[0091] refer to Figure 2 as well as Figure 4 The outlet end of the temperature control tube 64 is connected to one end of the heat dissipation tube 9 through a straight-through joint 13, and the other end of the heat dissipation tube 9 is connected to the constant temperature water tank 4; the heat preservation box 10 is fixedly provided with a cooling box 3 on one side of the outlet end of the temperature control tube 64, and the end of the heat dissipation tube 9 passes through the cooling box 3 and then passes through the cooling box 3, and the end of the heat dissipation tube 9 enters the constant temperature water tank 4; a heat dissipation fan 30 is fixedly provided on one side of the cooling box 3, and a plurality of heat dissipation holes 31 are provided on the side of the cooling box 3 opposite to the heat dissipation fan 30; the heat dissipation fan 30 is electrically connected to the control device. When the temperature value of the outlet temperature sensor or the outlet temperature sensor exceeds the chip aging temperature setting value T, the control device controls the heat dissipation fan 30 to rotate and remove the heat through the heat dissipation tube 9.

[0092] The temperature control main pipe 8 includes an upper temperature control main pipe and a middle temperature control main pipe; the inlet ends of the temperature control pipe 64 fixed below the upper pressure plate 60 are connected to the upper water inlet pipe 80 through a straight joint 13; the upper water inlet pipe 80 is connected to the thermostatic water tank 4 through the upper temperature control main pipe, and the upper pressure plate temperature control water pump is provided on the upper temperature control main pipe;

[0093] The inlet ends of the temperature control pipes 64 fixed below the middle support plate 61 are connected to the middle water inlet pipe 81 through straight joints 13; the middle water inlet pipe 81 is connected to the thermostatic water tank 4 through the middle temperature control main pipe, and the middle support plate temperature control water pump is provided on the middle temperature control main pipe.

[0094] When the temperature value of the inlet temperature sensor or the inlet temperature sensor is lower than the chip aging temperature setting value T, the control device controls the electric heater to power on for heating. When the temperature value of the outlet temperature sensor or the outlet temperature sensor exceeds the chip aging temperature setting value T, the control device controls the cooling fan 30 to rotate, and removes the heat through the heat pipe 9 to ensure that the water temperature in the constant temperature water tank 4 does not exceed T. In some embodiments, the inlet temperature sensor and the inlet temperature sensor both use LM3911, which is a high-precision temperature detection and output control integrated circuit. Its output voltage is proportional to the temperature, with a sensitivity of 10mV / K and good temperature control effect.

[0095] refer to Figures 8 to 14The aging test seat 65 includes a lower fixing member 651 and an upper fixing member 652; a semiconductor chip 650 is arranged between the lower fixing member 651 and the upper fixing member 652; the lower fixing member 651 includes a support plate 6510, support blocks 6512 are fixedly arranged on both sides of the support plate 6510, and a fixing block 6521 is fixedly arranged on the outer side of the support block 6512, and a plurality of pin grooves 6513 matching with the pins of the semiconductor chip 650 are opened on the support block 6512; an electrical connecting piece is arranged in the pin groove 6513, and the electrical connecting piece includes a horizontal connecting piece 6516, and one end of the horizontal connecting piece 6516 passes through the fixing block 6521 and is electrically connected to the control device; the horizontal connecting piece 6516 The other end of 516 is connected with the elastic connecting piece 6519 and the elastic contact piece 6520 in sequence to form an elastic connector that matches the pins of the semiconductor chip 650; the elastic connecting piece 6519 is bent downward and backward to form an acute angle with the horizontal connecting piece 6516; the end of the elastic connecting piece 6519 is slidably connected to the bottom of the needle groove 6513 and then bent back to connect with one end of the elastic contact piece 6520, and the other end of the elastic contact piece 6520 is slidably connected to the bottom of the horizontal connecting piece 6516; the purpose of this design is to ensure the reliability of the electrical connection between the pins of the semiconductor chip 650 and the elastic connector and to prevent the pins of the semiconductor chip 650 from being damaged. This is because in this application, due to the design of the elastic connector, it is ensured that the pins of the semiconductor chip 650 are elastically connected to the elastic connector instead of rigidly connected, so as to prevent them from being crushed; on the other hand, even if there is a slight height difference between the pins of the semiconductor chip 650 in the vertical direction, the elastic connection design of the elastic connector can also ensure its stable electrical connection. A socket 6517 is fixedly disposed on the top of each fixing block 6521. A notch is provided in the middle of the socket 6517. Two arc-shaped spring pieces 6518 that cooperate with each other are fixedly disposed on both sides of the notch.

[0096] The upper fixing member 652 includes a fixing cover 6524, and a receiving space 6522 is provided at the lower middle part of the fixing cover 6524, and the receiving space 6522 is matched with the top of the semiconductor chip 650; a plurality of heat dissipation slots 6525 are provided on the fixing cover 6524 above the receiving space 6522, and a plurality of temperature control pipe walkways 6527 are provided on the fixing cover 6524 above the heat dissipation slots 6525. A plurality of needle strips 6523 matched with the needle grooves 6513 are fixedly provided at the lower sides of the fixing cover 6524 on both sides of the receiving space 6522; and a plug strip 6526 matched with the socket 6517 is fixedly provided at the lower sides of the upper fixing member 652. The design of the temperature control pipe walkway 6527 fits the semiconductor chip 650 from top to bottom, which ensures that the semiconductor chip 650 is firm and also ensures its constant temperature effect.

[0097] refer to Figure 7The support member 63 includes a fixing plate 630 fixed on the bottom support plate 62, a support rod 631 is fixed on the fixing plate 630, and a plurality of sleeves 632 are slidably sleeved in the middle of the support rod 631; a mounting head 633 is provided on the top of the support rod 631, and a nut 634 is externally threadedly connected to the mounting head 633. The number of the sleeves 632 is one more than the number of the middle support plate 61; the middle support plate 61 is provided with a plurality of supporting holes that match the support rod 631 of the support member 63. When in use, first fix the aging test seat 65 on the middle support plate 61, then sleeve a sleeve 632 on the support rod 631, and then sleeve the support holes of the middle support plate 61 on the support rod 631 one by one; then sleeve another sleeve 632 on the support rod 631, and so on, and finally screw the nut 634 on the mounting head 633.

[0098] In this embodiment, the constant temperature water tank 4 is arranged below the insulation box body 10, and a control box 2 is opened in the middle of the insulation box body 10. A control device is arranged inside the control box 2, and an openable middle cabinet door 5 is arranged outside the control box 2, and a visual display screen is arranged on the middle cabinet door 5; an insulation board 12 is fixedly arranged above the control box 2, a bottom plate 11 is fixedly arranged above the insulation board 12, and a chip fixing mechanism 6 is arranged above the bottom plate 11.

[0099] The semiconductor chip aging test system of the present application designs a temperature control pipe walkway 6527 above the aging test seat 65, and uses the temperature control pipe 64 above the aging test seat 65 to press the semiconductor chip 650 itself, so that on the one hand, the semiconductor chip 650 itself is better fixed, and on the other hand, the upper and lower sides of the semiconductor chip 650 are in contact with the temperature control pipe 64, so that the temperature can be kept constant. By detecting the temperature at both ends of the temperature control pipe 64, the speed of the temperature control water pump 7 is increased when the temperature difference is large; if the temperature at the outlet is large, the water flow in the temperature control pipe 64 is accelerated by increasing the speed of the temperature control water pump 7 to achieve cooling of the semiconductor chip 650; if the temperature at the outlet is low, the water flow in the temperature control pipe 64 is accelerated by increasing the speed of the temperature control water pump 7 to achieve heating of the semiconductor chip 650. That is, by increasing the speed of the temperature control water pump 7, whether the temperature at the outlet of the temperature control pipe 64 is high or low, the semiconductor chip 650 can be kept constant. The design of the chip fixing mechanism 6 increases the number of aging tests on the semiconductor chips 650 at the same time, but does not reduce the constant temperature effect during the aging test of the semiconductor chips 650, and has strong practicality.

[0100] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0101] Although the above describes the specific implementation methods of the present application in conjunction with the accompanying drawings, it is not intended to limit the scope of protection of the present application. Technical personnel in the relevant field should understand that on the basis of the technical solution of the present application, various modifications or deformations that can be made by technical personnel in this field without creative work are still within the scope of protection of the present application.

Claims

1. Semiconductor chip aging detection system, characterized by: include: A chip fixing mechanism (6) is fixedly arranged in the heat preservation box (10), comprising a bottom supporting plate (62) and an upper pressing plate (60) and at least one middle supporting plate (61) arranged therebetween; a plurality of aging test seats (65) for accommodating semiconductor chips (650) are fixedly arranged above the bottom supporting plate (62) and the middle supporting plate (61); The chip constant temperature mechanism comprises a plurality of temperature control tubes (64) fixedly arranged below the upper pressure plate (60) and below the middle support plate (61); the inlet end of the temperature control tube (64) is connected to the pipeline of the constant temperature water tank (4) through a temperature control water pump (7); the outlet end of the temperature control tube (64) is connected to the pipeline of the constant temperature water tank (4); the inlet end and the outlet end of the temperature control tube (64) are respectively fixedly provided with an inlet temperature sensor and an outlet temperature sensor; the constant temperature water tank (4) is provided with an electric heater; The dehumidification mechanism comprises air outlet holes and a drying mechanism respectively arranged on both sides of the heat preservation box (10), wherein the drying mechanism comprises a drying box (1006) and a drying fan (1007); a desiccant is fixedly arranged in the drying box (1006); one end of the drying box (1006) is connected to the heat preservation box (10), and the other end is connected to the drying fan (1007); The control device is electrically connected to the semiconductor chip (650), the temperature-controlled water pump (7), the inlet temperature sensor, the outlet temperature sensor, the electric heater, the drying fan (1007) and the visual display screen respectively; used to analyze the aging test data of the semiconductor chip and display it on the visual display screen; used to control the water temperature of the constant temperature water tank (4) through the electric heater according to the temperature of the inlet temperature sensor; and used to control the speed of the water pump motor of the temperature-controlled water pump (7) according to the temperature difference detected by the outlet temperature sensor and the inlet temperature sensor; An inlet upper temperature sensor and an outlet upper temperature sensor (640) are respectively fixedly provided on the outside of the tube wall at both ends of the temperature control tube (64) below the upper pressure plate (60); An inlet temperature sensor and an outlet temperature sensor are respectively fixedly provided on the outside of the tube wall at both ends of the temperature control tube (64) below the middle support plate (61); The temperature control water pump (7) comprises an upper pressure plate temperature control water pump and a middle support plate temperature control water pump; the temperature control pipe (64) below the upper pressure plate (60) is connected to the constant temperature water tank (4) pipeline via the upper pressure plate temperature control water pump; the temperature control pipe (64) below the middle support plate (61) is connected to the constant temperature water tank (4) pipeline via the middle support plate temperature control water pump; When the temperature difference M1 between the outlet temperature sensor and the inlet temperature sensor exceeds the set threshold value K, the control device controls the water pump motor of the upper pressure plate temperature control water pump to increase the speed setting value; When the temperature difference M2 between the outlet temperature sensor and the inlet temperature sensor exceeds the set threshold value K, the control device controls the water pump motor of the middle bearing plate temperature control water pump to increase the speed setting value; The outlet end of the temperature control tube (64) is connected to one end of the heat dissipation tube (9) via a straight joint (13), and the other end of the heat dissipation tube (9) is connected to the constant temperature water tank (4); A cooling box (3) is fixedly provided on one side of the heat preservation box body (10) located at the outlet end of the temperature control tube (64); the heat dissipation tube (9) passes through the cooling box (3) and then the end thereof passes through the cooling box (3); the end of the heat dissipation tube (9) enters the constant temperature water tank (4); A heat dissipation fan (30) is fixedly provided on one side of the cooling box (3), and a plurality of heat dissipation holes (31) are provided on a side of the cooling box (3) opposite to the heat dissipation fan (30); The heat dissipation fan (30) is electrically connected to the control device.

2. The semiconductor chip aging detection system according to claim 1, characterized in that: The bottom support plate (62) is fixedly arranged at the bottom of the heat preservation box (10); the bottom support plate (62), the middle support plate (61) and the upper pressure plate (60) are fixedly arranged in parallel with each other through support members (63); A temperature control tube walkway (6527) that matches the temperature control tube (64) one-to-one is formed on the top of the aging test seat (65).

3. The semiconductor chip aging detection system according to claim 1, characterized in that: The temperature control main pipe (8) includes an upper temperature control main pipe and a middle temperature control main pipe; The inlet ends of the temperature control pipes (64) fixed below the upper pressure plate (60) are connected to the upper water inlet pipe (80) through straight joints (13); the upper water inlet pipe (80) is connected to the constant temperature water tank (4) through the upper temperature control main pipe, and the upper pressure plate temperature control water pump is provided on the upper temperature control main pipe; The inlet ends of the temperature control pipes (64) fixed below the middle support plate (61) are connected to the middle water inlet pipe (81) through straight joints (13); the middle water inlet pipe (81) is connected to the constant temperature water tank (4) through a middle temperature control main pipe, and a middle support plate temperature control water pump is provided on the middle temperature control main pipe.

4. The semiconductor chip aging detection system according to claim 1, characterized in that: When the temperature value of the outlet upper temperature sensor or the outlet middle temperature sensor exceeds the chip aging temperature setting value T, the control device controls the heat dissipation fan (30) to rotate.

5. The semiconductor chip aging detection system according to claim 1, characterized in that: When the temperature value of the inlet upper temperature sensor or the inlet middle temperature sensor is lower than the chip aging temperature setting value T, the control device controls the electric heater to be powered on for heating.

6. The semiconductor chip aging detection system according to claim 1 or 2, characterized in that: The aging test socket (65) comprises a lower fixing member (651) and an upper fixing member (652); a semiconductor chip (650) is provided between the lower fixing member (651) and the upper fixing member (652); The lower fixing member (651) comprises a support plate (6510), support blocks (6512) are fixedly provided on both sides of the support plate (6510), a fixing block (6521) is fixedly provided on the outer side of the support block (6512), and a plurality of pin grooves (6513) cooperating with the pins of the semiconductor chip (650) are provided on the support block (6512); an electrical connecting piece is provided in the pin groove (6513), and the electrical connecting piece comprises a horizontal connecting piece (6516), and one end of the horizontal connecting piece (6516) passes through the fixing block (6521) and is electrically connected to the control device; the horizontal connecting piece The other end of (6516) is connected to the elastic connecting piece (6519) and the elastic contact piece (6520) in sequence to form an elastic connector that matches the pin of the semiconductor chip (650); the elastic connecting piece (6519) is bent downward and rearward to form an acute angle with the horizontal connecting piece (6516); the end of the elastic connecting piece (6519) is slidably connected to the bottom of the needle groove (6513) and then bent back to connect to one end of the elastic contact piece (6520), and the other end of the elastic contact piece (6520) is slidably connected to the bottom of the horizontal connecting piece (6516); A socket (6517) is fixedly provided on the top of each fixing block (6521), a notch is provided in the middle of the socket (6517), and two arc-shaped spring pieces (6518) that cooperate with each other are fixedly provided on both sides of the notch; The upper fixing member (652) comprises a fixing cover (6524), a receiving space (6522) is provided at the lower middle portion of the fixing cover (6524), the receiving space (6522) being matched with the top of the semiconductor chip (650); a plurality of needle strips (6523) matching with the needle grooves (6513) are fixedly provided at both sides of the receiving space (6522) and located below the fixing cover (6524); a temperature control pipe walkway (6527) matching with the temperature control pipe (64) is provided above the fixing cover (6524); Insertion strips (6526) that cooperate with the socket (6517) are fixedly provided below both sides of the upper fixing member (652).

7. The semiconductor chip aging detection system according to claim 2, characterized in that: The support member (63) comprises a fixing plate (630) fixedly mounted on the bottom support plate (62), a supporting rod (631) fixedly mounted above the fixing plate (630), and a plurality of sleeves (632) slidingly mounted in the middle of the supporting rod (631); The top of the support rod (631) is provided with a mounting head (633), and the mounting head (633) is externally threadedly connected to a nut (634).

8. The semiconductor chip aging detection system according to claim 1, characterized in that: The constant temperature water tank (4) is arranged below the heat preservation box (10); a control box (2) is provided in the middle of the heat preservation box (10); a control device is provided in the control box (2); an openable middle cabinet door (5) is provided outside the control box (2); and a visual display screen is provided on the middle cabinet door (5); A heat insulation board (12) is fixedly provided above the control box (2), a bottom plate (11) is fixedly provided above the heat insulation board (12), and a chip fixing mechanism (6) is provided above the bottom plate (11).

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