High-speed laser scanning processing equipment
By introducing reflective imaging devices, 4f systems and two-dimensional galvanometers into three-dimensional laser scanning equipment, the Daman grating and Powell prism are used to generate multi-line parallel spots, which solves the problems of imaging distortion and low efficiency of existing equipment and achieves high efficiency , low-cost multi-line parallel processing and image controllability.
Patent Information
- Application Number
- CN202411744807.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-02
- Publication Date
- 2024-12-31
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Existing three-dimensional laser scanning equipment is prone to distortion during imaging, with low accuracy, low processing efficiency and high cost, and multi-line parallel processing cannot be achieved.
A high-speed laser scanning processing equipment was designed, including a reflective imaging device, a 4f system, a polarizer set, a two-dimensional galvanometer, a laser, a Daman grating and a Powell prism. By setting up two 4f systems and a two-dimensional galvanometer, it is used to use Daman grating and Powell prism produce non-orthogonal multi-dimensional array spots and realize multi-line parallel processing through computer control.
Multi-line parallel processing is realized, processing efficiency is improved, cost is reduced, and the variability and diversity of images are improved by real-time detection of dynamic processing processes, ensuring image integrity and reduction.
Smart Images

Figure CN119225003A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of laser scanning, and in particular to high-speed laser scanning processing equipment. Background Art
[0002] According to the different scanning imaging methods, three-dimensional laser scanners can be divided into one-dimensional (single-point) scanners, two-dimensional (line array) scanners and three-dimensional (surface array) scanners.
[0003] 3D laser scanning technology is a new technology that has emerged in recent years and has attracted more and more attention in the research field. It uses the principle of laser ranging to record the 3D coordinates, reflectivity, texture and other information of a large number of dense points on the surface of the measured object, and can quickly reconstruct the 3D model of the measured target and various drawing data such as lines, surfaces, and volumes.
[0004] The most widely used scanning equipment can only produce a single line scan, with low precision, low processing efficiency and high cost. The galvanometer system is a two-dimensional galvanometer composed of two identical one-dimensional galvanometers. Because the two galvanometers are not in the same position, their image distance and object distance are not equal, so it is easy to produce distortion during imaging and cannot be accurately projected.
[0005] Therefore, there is a need for a scanning device that can produce multi-line parallel processing, has high efficiency and low cost. Summary of the invention
[0006] In view of the above deficiencies in the prior art, an object of the present invention is to provide a high-speed laser scanning processing equipment.
[0007] The present invention achieves the above-mentioned purpose through the following technical solutions: A high-speed laser scanning processing equipment comprises a reflective imaging device, a first 4f system, a second 4f system, a polarizing plate group, a two-dimensional galvanometer, a laser, a Dammann grating, a Powell prism, and a control system, wherein the laser is directly facing the center of the Dammann grating and the Powell prism, the first 4f system is arranged on the exit light path of the Dammann grating and the Powell prism, the first 4f system is provided with a two-dimensional galvanometer on the rear side away from the Dammann grating and the Powell prism, the second 4f system is arranged on the exit light path of the two-dimensional galvanometer, the second 4f system is provided with the reflective imaging device on the rear side away from the two-dimensional galvanometer, the reflective imaging device is electrically connected to the control system, the control system comprises a computer, imaging is performed on the computer through the reflective imaging device, the polarizing plate group is arranged on the laser and is located on the incident light path of the two-dimensional galvanometer.
[0008] Preferably, the reflective imaging device includes a CCD camera, a semi-transparent and semi-reflective mirror, a convex lens, a dichroic mirror, an objective stage, an objective lens, and an illumination light source; the CCD camera is bidirectionally connected to the control system; the semi-transparent and semi-reflective mirror is arranged below the CCD camera, the convex lens is arranged on the projection light path below the semi-transparent and semi-reflective mirror, the dichroic mirror is arranged below the convex lens, the objective lens is arranged on the projection light path below the dichroic mirror, the objective stage is arranged below the objective lens, the illumination light source is arranged on the reflection light path of the semi-transparent and semi-reflective mirror, and the second 4f system is arranged on the reflection light path of the dichroic mirror.
[0009] Preferably, the first 4f system includes a first lens and a second lens, the first lens is arranged on the output light path of the Dammann grating and the Powell prism, the second lens is arranged on the other side of the first lens and is located at the double focus of the first lens, and the two-dimensional galvanometer is arranged on the other side of the second lens away from the first lens.
[0010] Preferably, the second 4f system includes lens No. 3 and lens No. 4, the lens No. 3 is arranged on the output light path of the two-dimensional galvanometer, the lens No. 4 is arranged on the other side of the lens No. 3 away from the two-dimensional galvanometer and located at the double focus of the lens No. 3, and the reflective imaging device is located on the other side of the lens No. 4 away from the lens No. 3.
[0011] Preferably, the semi-transparent and semi-reflective mirrors and the dichroic mirrors are both at an angle of 45° to the reflected light path.
[0012] Preferably, the two-dimensional galvanometer includes an X-axis one-dimensional galvanometer and a Y-axis one-dimensional galvanometer, the laser is opposite to the incident light path of the X-axis one-dimensional galvanometer, the Y-axis one-dimensional galvanometer is arranged on the exit light path of the X-axis one-dimensional galvanometer, and the Y-axis one-dimensional galvanometer exit light path is arranged opposite to the No. 1 lens.
[0013] More preferably, the Dammann grating is located between the laser and the Powell prism.
[0014] Preferably, the control system is electrically connected to the two-dimensional galvanometer and the laser respectively.
[0015] Preferably, the control system is a computer.
[0016] Preferably, the Dammann grating is a tilted Dammann grating.
[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: the high-speed laser scanning processing equipment of the present invention is provided with a reflective imaging device, two 4f systems, a two-dimensional galvanometer, a laser, a Dammann grating, a Powell prism and a control system; the laser is directly facing the center of the Dammann grating and the Powell prism, a 4f system is arranged on the exit light path of the Dammann grating and the Powell prism, followed by a two-dimensional galvanometer, and another 4f system is arranged on the exit light path of the two-dimensional galvanometer, and an image is formed on a computer through a reflective imaging device, which can produce multi-line parallel processing, high efficiency and low cost.
[0018] The additional technical features and advantages of the present invention will be more clearly explained in the following description, or can be understood through the specific practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention but do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 It is a schematic diagram of the optical path trend of a high-speed laser scanning processing equipment described in the present invention; Figure 2 It is a structural schematic diagram of a reflective imaging device of a high-speed laser scanning processing equipment according to the present invention; Figure 3 It is a schematic diagram of the front structure of a two-dimensional galvanometer of a high-speed laser scanning processing device according to the present invention; Figure 4 It is a schematic diagram of the external interface structure of a two-dimensional galvanometer of a high-speed laser scanning processing device according to the present invention; Figure 5 It is a schematic diagram of the 4f system structure of a high-speed laser scanning processing equipment according to the present invention; Figure 6 It is a schematic diagram of the optical path of a two-dimensional galvanometer of a high-speed laser scanning processing device described in the present invention; Figure 7 The present invention is a schematic diagram of the positions of a Dammann grating and a Powell prism of a high-speed laser scanning processing device.
[0020] The reference numerals in the accompanying drawings are as follows: 1. CCD camera; 2. semi-transparent and semi-reflective mirror; 3. convex lens; 4. dichroic mirror; 5. stage; 6. objective lens; 7. illumination light source; 8. laser; 9. Dammann grating; 10. Powell prism; 11. lens No. 1; 12. lens No. 2; 13. two-dimensional galvanometer; 131. one-dimensional galvanometer on the X-axis; 132. one-dimensional galvanometer on the Y-axis; 14. lens No. 3; 15. lens No. 4. DETAILED DESCRIPTION
[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0022] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0023] The present invention will be further described below in conjunction with the accompanying drawings: like Figure 1-Figure 7 As shown, a high-speed laser scanning processing equipment includes a reflective imaging device, a first 4f system, a second 4f system, a polarizer group, a two-dimensional galvanometer 13, a laser 8, a Dammann grating 9, a Powell prism 10, and a control system. The laser 8 is directly facing the center of the Dammann grating 9 and the Powell prism 10. The first 4f system is arranged on the exit light path of the Dammann grating 9 and the Powell prism 10. The first 4f system is provided with a two-dimensional galvanometer 13 on the rear side away from the Dammann grating 9 and the Powell prism 10. The second 4f system is arranged on the exit light path of the two-dimensional galvanometer 13. The second 4f system is provided with the reflective imaging device on the rear side away from the two-dimensional galvanometer 13. The reflective imaging device is electrically connected to the control system. The control system includes a computer. The image formed on the computer by the reflective imaging device is formed. The polarizer group is arranged on the laser 8 and is located on the incident light path of the two-dimensional galvanometer 13. The purpose of such arrangement is that the laser 8 and the two-dimensional galvanometer 13 are on a horizontal line, and the heights of the laser 8 and the two-dimensional galvanometer 13 are adjustable. The Dammann grating 9 and the Powell prism 10 are integrated in the high-speed laser scanning processing equipment. Two different tilt angles can be arbitrarily adjusted during programming. The Dammann grating 9 generates a new array multi-focus, so that a laser beam generates a non-orthogonal multi-dimensional array spot, divides a beam of light into multiple beams, and then generates a new multi-line parallel through the Powell prism 10, divides a line into multiple lines, and adjusts the period of the presented lines by changing the period of the Dammann grating 9 without changing the length and width of the presented lines. On this basis, the controllable pattern period is achieved, which increases the variability and diversity of the final image.
[0024] In a preferred embodiment, the control system is electrically connected to the two-dimensional galvanometer 13 and the laser 8 respectively.
[0025] In this embodiment, the control system is a computer.
[0026] In this embodiment, the reflective imaging device includes a CCD camera 1, a semi-transparent mirror 2, a convex lens 3, a dichroic mirror 4, a stage 5, an objective lens 6, and an illumination light source 7. The CCD camera 1 is bidirectionally connected to the computer, the semi-transparent mirror 2 is arranged below the CCD camera 1, the convex lens 3 is arranged on the projection light path below the semi-transparent mirror 2, the dichroic mirror 4 is arranged below the convex lens 3, the objective lens 6 is arranged on the projection light path below the dichroic mirror 4, the stage 5 is arranged below the objective lens 6, the illumination light source 7 is arranged on the reflection light path of the semi-transparent mirror 2, and the second 4f system is arranged on the reflection light path of the dichroic mirror 4. The purpose of such arrangement is: a set of reflective imaging devices is fixed on the rear side of the second 4f system. The imaging device can detect the dynamic processing process in real time. The reflective imaging device places an objective lens 6 under a middle dichroic mirror 4, and a stage 5 is placed under the objective lens 6. A convex lens 3 is placed on the middle dichroic mirror 4 to focus the light of the illumination light source 7. A semi-transparent and semi-reflective mirror 2 is placed on the convex lens 3 to allow the light to be captured by the CCD camera 1 above. The illumination light source 7 passes through the dichroic mirror 4, and its transmitted light passes through the reflective imaging system constructed by the objective lens 6, the convex lens 3, and the semi-transparent and semi-reflective mirror 2 in turn, and then is imaged on the CCD camera 1. The CCD camera 1 is connected to a computer, and finally the image is formed on the computer screen, and the computer is used to control the switching operation of the laser 8 and the two-dimensional galvanometer 13.
[0027] In this embodiment, if Figure 5 As shown, L1 represents the front lens, such as lens No. 11 or lens No. 3 14, and L2 represents the rear lens, such as lens No. 2 12 or lens No. 4 15. The first 4f system includes lens No. 11 and lens No. 2 12, lens No. 11 is arranged on the outgoing light path of Dammann grating 9 and Powell prism 10, lens No. 2 12 is arranged on the other side of lens No. 1 11 and is located at the double focus of lens No. 1 11, and the two-dimensional galvanometer 13 is arranged on the other side of lens No. 2 12 away from the lens No. 1 11, and the second 4f system includes lens No. 3 14 and lens No. 4 15, lens No. 3 14 is arranged on the outgoing light path of the two-dimensional galvanometer 13, and lens No. 4 15 is arranged on the other side of lens No. 3 14 away from the two-dimensional galvanometer 13 and is located at the second focus of lens No. 3 14. At the focal point, the reflective imaging device is located on the other side of the lens No. 4 15 away from the lens No. 3. The purpose of this arrangement is: to add the lens No. 3 14 and the lens No. 4 15 in the emission direction of the two-dimensional galvanometer 13 to form a second 4f system, and the lens No. 1 11 and the lens No. 2 12 of the first 4f system are respectively fixed at the first f position and the third f position, and the laser just passes through the center focus of the lens. Using such a 4f system, the laser just passes through the focus of each lens, so that the predetermined patterns are imaged one after another in the same plane without distortion, thereby ensuring the integrity and restoration of the image.
[0028] In this embodiment, the semi-transparent and semi-reflective mirror 2 and the dichroic mirror 4 are both at an angle of 45° to the reflected light path. The purpose of such arrangement is: the reflective imaging device is placed in the middle of the dichroic mirror 4 and fixes it at an angle of 45°, an objective lens 6 is placed below, and a stage 5 is placed below the light outlet of the objective lens 6. A convex lens 3 is placed on the dichroic mirror 4 to focus the light from the illumination light source 7. A semi-transparent and semi-reflective mirror 2 is placed on the convex lens 3 and fixed at an angle of 45° to allow the light to be captured by the CCD camera 1 above. The CCD camera 1 is bidirectionally connected to the computer, so that the scanning status of the laser can be observed on the computer.
[0029] In a preferred embodiment, the two-dimensional galvanometer 13 includes an X-axis one-dimensional galvanometer 131 and a Y-axis one-dimensional galvanometer 132. The laser 8 is opposite to the incident light path of the X-axis one-dimensional galvanometer 131. The Y-axis one-dimensional galvanometer 132 is arranged on the exit light path of the X-axis one-dimensional galvanometer 131. The exit light path of the Y-axis one-dimensional galvanometer 132 is arranged opposite to the first lens 11, so that the laser can enter the center position of the X-axis one-dimensional galvanometer 131 and the Y-axis one-dimensional galvanometer 132.
[0030] In this embodiment, the Dammann grating 9 is located between the laser 8 and the Powell prism 10 .
[0031] In this embodiment, the Dammann grating 9 is a tilted Dammann grating.
[0032] Working principle: The Dammann grating 9 and the Powell prism 10 are integrated into the scanning and processing equipment. The Dammann grating 9 can be used to make the original laser beam produce non-orthogonal multi-dimensional array spots with various beam splitting ratios and tilt angles. The Powell prism 10 can be used to change the original point laser into a line laser, so that the laser scanning equipment can realize multi-line parallel scanning at the same time when working. By changing the number of lines from one to multiple, the scanning range is also changed from one area to multiple areas. The processing efficiency is increased several times in the same time, which greatly improves the processing efficiency of the product, thereby generating multiple lines of non-orthogonal arrays with high diffraction efficiency and high uniformity. By changing the period of the Dammann grating 9 to control the period of the printed pattern without changing the size of the printed pattern, the controllable marking pattern period is achieved on the basis of multi-focus marking, which increases the variability and diversity of the final image; using the first 4f system and the second 4f system, so that the predetermined pattern can be imaged in the same plane one after another without distortion; the computer is used to control the switching operation of the two-dimensional galvanometer 13 and the laser 8, so that they can keep the same working pace, and the computer simultaneously gives the laser 8 and the two-dimensional galvanometer 13 an on or off signal, so as to realize the synchronous start and end of the laser 8 and the two-dimensional galvanometer 13, realize their synchronous real-time processing, make the laser 8 and the two-dimensional galvanometer 13 work at the same time, and improve the accuracy of marking; in the real-time microscopic observation of the processing dynamic process, the reflective imaging device can be used to dynamically detect the processing process in real time, and the light of the illumination light source 7 passes through the convex lens 3 and the semi-transparent and semi-reflective mirror 2, and is imaged on the CCD camera 1. The CCD camera 1 is connected to the computer, and the CCD camera 1 is used to allow the final image to be detected on the computer in real time. The processing process and the laser marking situation make the result clearer and more intuitive.
[0033] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of the present invention to be protected is defined by the attached claims and their equivalents.
Claims
1. A high-speed laser scanning processing equipment, comprising a reflective imaging device, a first 4f system, a second 4f system, a polarizing plate group, a two-dimensional galvanometer (13), a laser (8), a Dammann grating (9), a Powell prism (10), and a control system, characterized in that: The laser (8) is directly opposite to the center of the Dammann grating (9) and the Powell prism (10); the first 4f system is arranged on the exit light path of the Dammann grating (9) and the Powell prism (10); a two-dimensional galvanometer (13) is provided on the rear side of the first 4f system away from the Dammann grating (9) and the Powell prism (10); the second 4f system is arranged on the exit light path of the two-dimensional galvanometer (13); a reflective imaging device is provided on the rear side of the second 4f system away from the two-dimensional galvanometer (13); the reflective imaging device is electrically connected to the control system; the control system includes a computer; imaging is performed on the computer through the reflective imaging device; the polarizer group is arranged on the laser (8) and is located on the incident light path of the two-dimensional galvanometer (13).
2. The high-speed laser scanning processing equipment according to claim 1, characterized in that: The reflective imaging device comprises a CCD camera (1), a semi-transparent and semi-reflective mirror (2), a convex lens (3), a dichroic mirror (4), a stage (5), an objective lens (6), and an illumination light source (7). The CCD camera (1) is bidirectionally connected to the control system. The semi-transparent and semi-reflective mirror (2) is arranged below the CCD camera (1). The convex lens (3) is arranged on a projection light path below the semi-transparent and semi-reflective mirror (2). The dichroic mirror (4) is arranged below the convex lens (3). The objective lens (6) is arranged on a projection light path below the dichroic mirror (4). The stage (5) is arranged below the objective lens (6). The illumination light source (7) is arranged on a reflection light path of the semi-transparent and semi-reflective mirror (2). The second 4f system is arranged on a reflection light path of the dichroic mirror (4).
3. The high-speed laser scanning processing equipment according to claim 1, characterized in that: The first 4f system comprises a first lens (11) and a second lens (12), wherein the first lens (11) is arranged on an output light path of the Dammann grating (9) and the Powell prism (10), the second lens (12) is arranged on the other side of the first lens (11) and is located at the double focus of the first lens (11), and the two-dimensional galvanometer (13) is arranged on the other side of the second lens (12) away from the first lens (11).
4. The high-speed laser scanning processing equipment according to claim 1, characterized in that: The second 4f system comprises a third lens (14) and a fourth lens (15), wherein the third lens (14) is arranged on the output light path of the two-dimensional galvanometer (13), the fourth lens (15) is arranged on the other side of the third lens (14) away from the two-dimensional galvanometer (13) and is located at the double focus of the third lens (14), and the reflective imaging device is located on the other side of the fourth lens (15) away from the third lens (14).
5. The high-speed laser scanning processing equipment according to claim 2, characterized in that: The semi-transparent and semi-reflective mirror (2) and the dichroic mirror (4) both form an angle of 45° with the reflected light path.
6. The high-speed laser scanning processing equipment according to claim 3, characterized in that: The two-dimensional galvanometer (13) comprises an X-axis one-dimensional galvanometer (131) and a Y-axis one-dimensional galvanometer (132); the laser (8) is arranged opposite to the incident light path of the X-axis one-dimensional galvanometer (131); the Y-axis one-dimensional galvanometer (132) is arranged on the exit light path of the X-axis one-dimensional galvanometer (131); and the exit light path of the Y-axis one-dimensional galvanometer (132) is arranged opposite to the first lens (11).
7. The high-speed laser scanning processing equipment according to claim 6, characterized in that: The Dammann grating (9) is located between the laser (8) and the Powell prism (10).
8. The high-speed laser scanning processing equipment according to claim 6, characterized in that: The control system is electrically connected to the two-dimensional galvanometer (13) and the laser (8).
Citation Information
Patent Citations
Optical system generating multi-line structure light
CN106705887A
Multi-focus parallel marking machine
CN112605526A
Scanning microscopic ultrafast laser machining system based on dynamic field butting
CN113146031A
Natural splitting device and method for fragile material
CN116329781A
Light beam scanning device and imaging system based on two-dimensional galvanometer-special parabolic mirror
CN117452628A
Cited By
Laser track scanning system
CN120143441A
A laser track scanning system
CN120143441B
